DATASHEET

EL5226, EL5326
®
Data Sheet
May 9, 2005
10- and 12-Channel TFT-LCD Reference
Voltage Generators
The EL5226 and EL5326 are designed to produce the
reference voltages required in TFT-LCD applications. Each
output is programmed to the required voltage with 10 bits of
resolution. Reference pins determine the high and low
voltages of the output range, which are capable of swinging
to either supply rail. Programming of each output is
performed using the I2C serial interface.
A number of the EL5226 and EL5326 can be stacked for
applications requiring more than 12 outputs. The reference
inputs can be tied to the rails, enabling each part to output
the full voltage range, or alternatively, they can be connected
to external resistors to split the output range and enable finer
resolutions of the outputs.
The EL5226 has 10 outputs and the EL5326 has 12 outputs
and both are available in a 28-pin TSSOP package. They
are specified for operation over the full -40°C to +85°C
temperature range.
FN7118.3
Features
• 10- to 12-channel reference outputs
• Accuracy of ±1%
• Supply voltage of 5V to 16.5V
• Digital supply 3.3V to 5V
• Low supply current of 10mA
• Rail-to-rail capability
• Pb-Free available (RoHS compliant)
Applications
• TFT-LCD drive circuits
• Reference voltage generators
Ordering Information
PART
NUMBER
PACKAGE
TAPE & REEL PKG. DWG. #
EL5226IR
28-Pin TSSOP
-
MDP0044
EL5226IR-T7
28-Pin TSSOP
7”
MDP0044
EL5226IR-T13
28-Pin TSSOP
13”
MDP0044
EL5226IRZ
(See Note)
28-Pin TSSOP
(Pb-free)
-
MDP0044
EL5226IRZ-T7
(See Note)
28-Pin TSSOP
(Pb-free)
7”
MDP0044
EL5226IRZ-T13
(See Note)
28-Pin TSSOP
(Pb-free)
13”
MDP0044
EL5326IR
28-Pin TSSOP
-
MDP0044
EL5326IR-T7
28-Pin TSSOP
7”
MDP0044
EL5326IR-T13
28-Pin TSSOP
13”
MDP0044
EL5326IRZ
(See Note)
28-Pin TSSOP
(Pb-free)
-
MDP0044
EL5326IRZ-T7
(See Note)
28-Pin TSSOP
(Pb-free)
7”
MDP0044
EL5326IRZ-T13
(See Note)
28-Pin TSSOP
(Pb-free)
13”
MDP0044
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003, 2004, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL5226, EL5326
Pinouts
EL5226
(28-PIN TSSOP)
TOP VIEW
STD_REG 1
28 NC
EL5326
(28-PIN TSSOP)
TOP VIEW
STD_REG 1
28 OUTA
SCL 2
27 OUTB
SCL 2
27 OUTA
SDA 3
26 OUTB
SDA 3
26 OUTC
25 OUTC
OSC 4
25 GND
OSC 4
OSC_SELECT 5
24 GND
OSC_SELECT 5
24 OUTD
VS 6
23 OUTD
VS 6
23 OUTE
NC 7
22 OUTE
NC 7
22 OUTF
VSD 8
21 OUTF
VSD 8
21 OUTG
REFH 9
20 OUTG
REFH 9
20 OUTH
19 GND
REFL 10
19 OUTI
VS 11
18 GND
REFL 10
VS 11
18 OUTH
GND 12
17 OUTI
GND 12
17 OUTJ
CAP 13
16 OUTJ
CAP 13
16 OUTK
A0 14
15 OUTL
DEV_ADDRO 14
15 NC
2
EL5226, EL5326
Absolute Maximum Ratings (TA = 25°C)
Supply Voltage between VS and GND. . . . . . . . . . . . . . . . . . . .+18V
Supply Voltage between VSD and GND . . . . . . . VS and +7V (max)
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 30mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are
at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS = 15V, VSD = 5V, VREFH = 13V, VREFL = 2V, RL = 1.5kΩ and CL = 200pF to 0V, TA = 25°C, unless otherwise
specified.
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
EL5226
9
11
mA
EL5326
10
12
mA
0.9
3.2
mA
50
150
mV
SUPPLY
IS
ISD
Supply Current
Digital Supply Current
ANALOG
VOL
Output Swing Low
Sinking 5mA (VREFH = 15V, VREFL = 0)
VOH
Output Swing High
Sourcing 5mA (VREFH = 15V, VREFL = 0)
ISC
Short Circuit Current
PSRR
Power Supply Rejection Ratio
tD
14.85
14.95
V
RL = 10Ω
150
240
mA
VS+ is moved from 14V to 16V
45
65
dB
Program to Out Delay
4
ms
VAC
Accuracy
20
mV
VDROOP
Droop Voltage
1
RINH
Input Resistance @ VREFH, VREFL
34
REG
Load Regulation
IOUT = 5mA step
0.5
2
mV/ms
kΩ
1.5
mV/mA
DIGITAL
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
FCLK
Clock Frequency
3
VSD20%
V
20%*
VSD
V
400
kHz
EL5226, EL5326
Pin Descriptions
EL5226
EL5326
PIN NAME
PIN TYPE
1
1
STD_REG
Logic Input
Selects mode, high = standard, low = register mode
2
2
SCL
Logic Input
I2C clock
3
3
SDA
Logic Input
I2C data
4
4
OSC
Input/Output
Oscillator pin for synchronizing multiple chips
5
5
OSC_SELECT
Logic Input
Selects internal / external OSC source, high = external,
low = internal
6, 11
6, 11
VS
Analog Power
7, 15, 28
7
NC
8
8
VSD
9
9
REFH
Analog Reference Input High reference voltage
10
10
REFL
Analog Reference Input Low reference voltage
12, 19, 24
12, 18, 25
GND
Ground
13
13
CAP
Analog Bypass Pin
14
14
DEV_ADDR0
Logic Input
16
17
OUTJ
Analog Output
Channel J programmable output
17
19
OUTI
Analog Output
Channel I programmable output
18
20
OUTH
Analog Output
Channel H programmable output
20
21
OUTG
Analog Output
Channel G programmable output
21
22
OUTF
Analog Output
Channel F programmable output
22
23
OUTE
Analog Output
Channel E programmable output
23
24
OUTD
Analog Output
Channel D programmable output
25
26
OUTC
Analog Output
Channel C programmable output
26
27
OUTB
Analog Output
Channel B programmable output
27
28
OUTA
Analog Output
Channel A programmable output
15
OUTL
Analog Output
Channel L programmable output
16
OUTK
Analog Output
Channel K programmable output
4
PIN FUNTION
Power supply for analog circuit
not connected
Digital Power
Power supply for digital circuit
Ground
Decoupling capacitor for internal reference generator
I2C device address input, bit 0
EL5226, EL5326
Typical Performance Curves
VS=VREFH=15V
VREFL=0V
0.3
1.2
0.2
1.0
0.1
0.8
ISD (mA)
DIFFERENTIAL NONLINEARITY (LSB)
VS=15V, VSD=5V, VREFH=13V, VREFL=2V
0
0.6
-0.1
0.4
-0.2
0.2
-0.3
10
210
410
610
810
1010
0
3
3.2
3.4
3.5
3.8
4.2
4
4.4
4.5
4.8
5
VSD (V)
INPUT CODE
FIGURE 1. DIFFERENTIAL NONLINEARITY vs CODE
FIGURE 2. DIGITAL SUPPLY VOLTAGE vs DIGITAL SUPPLY
CURRENT
VS=VREFH=15V
M=400ns/DIV
VS=VREFH=15V
M=400ns/DIV
0mA
5mA/DIV
5mA
0mA
5mA
CL=1nF
RS=20Ω
CL=4.7nF
RS=20Ω
5V
200mV/DIV
CL=1nF
RS=20Ω
CL=4.7nF
RS=20Ω
CL=180pF
CL=180pF
FIGURE 3. TRANSIENT LOAD REGULATION (SOURCING)
M=400µs/DIV
FIGURE 4. TRANSIENT LOAD REGULATION (SINKING)
M=400µs/DIV
SCLK
SCLK
SDA
SDA
5V
0V
5V
0V
10V
5V
0V
OUTPUT
OUTPUT
FIGURE 5. LARGE SIGNAL RESPONSE (RISING FROM 0V
TO 8V)
5
FIGURE 6. LARGE SIGNAL RESPONSE (FALLING FROM 8V
TO 0V)
EL5226, EL5326
Typical Performance Curves (Continued)
M=400µs/DIV
M=400µs/DIV
SCLK
SCLK
5V
0V
SDA
SDA
5V
0V
OUTPUT
OUTPUT
200mV
0V
FIGURE 7. SMALL SIGNAL RESPONSE (RISING FROM 0V
TO 200mV)
FIGURE 8. SMALL SIGNAL RESPONSE (FALLING FROM
200mV TO 0V)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD
JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD
0.9
1.4
833mW
1.333W
1.2
0.7
θ
0.6
POWER DISSIPATION (W)
POWER DISSIPATION (W)
0.8
TS
SO
P2
12
8
0°
C/
W
JA
=
0.5
0.4
0.3
0.2
1
θ
JA
=
0.8
TS
S
O
P2
8
75
°C
/W
0.6
0.4
0.2
0.1
0
0
25
50
75
85
100
AMBIENT TEMPERATURE (°C)
FIGURE 9. POWER DISSIPATION vs AMBIENT
TEMPERATURE
6
125
0
0
25
50
75 85
100
125
AMBIENT TEMPERATURE (°C)
FIGURE 10. POWER DISSIPATION vs AMBIENT
TEMPERATURE
EL5226, EL5326
General Description
The EL5226 and EL5326 provide a versatile method of
providing the reference voltages that are used in setting the
transfer characteristics of LCD display panels. The V/T
(Voltage/Transmission) curve of the LCD panel requires that
a correction is applied to make it linear; however, if the panel
is to be used in more than one application, the final curve
may differ for different applications. By using the EL5226
and EL5326, the V/T curve can be changed to optimize its
characteristics according to the required application of the
display product. Each of the eight reference voltage outputs
can be set with a 10-bit resolution. These outputs can be
driven to within 50mV of the power rails of the EL5226 and
EL5326. As all of the output buffers are identical, it is also
possible to use the EL5226 and EL5326 for applications
other than LCDs where multiple voltage references are
required that can be set to 10 bit accuracy.
the Device Address and write/read bit. This address is a 7bit long device address and only two device addresses (74H
and 75H) are allowed for the EL5226 and EL5326. The first
6 bits (A6 to A1, MSBs) of the device address have been
factory programmed and are always 111010. Only the least
significant bit A0 is allowed to change the logic state, which
can be tied to VSD or DGND. A maximum of two EL5226
and EL5326 may be used on the same bus at one time. The
EL5226 and EL5326 monitor the bus continuously and
waiting for the start condition followed by the device address.
When a device recognizes its device address, it will start to
accept data. An eighth bit is followed by the device address,
which is a data direction bit (W/R). A "0" indicates a Write
transmission and a "1" indicates a Read transmission.
The EL5226 and EL5326 can be operated as Standard
mode and Register mode. See the I2C Timing Diagram 1 for
detail formats.
Digital Interface
STANDARD MODE
The EL5226 and EL5326 use a simple two-wire I2C digital
interface to program the outputs. The bus line SCLK is the
clock signal line and bus SDA is the data information signal
line. The EL5226 and EL5326 can support the clock rate up
to 400kHz. External pull up resistor is required for each bus
line. The typical value for these two pull up resistor is about
1kΩ.
The part operates at Standard Mode if pin 1 (STD/REG) is
held high. The Standard Mode allows the user to program all
outputs at one time. Two data bytes are required for 10-bit
data for each channel output and there are a total of 20/24
data bytes for 10/12 channels. Data in data byte 1 and 2 is
for channel A. Data in data byte 15 and 16 is for channel H.
D9 to D0 are the 10-bit data for each channel. The unused
bits in the data byte are "don't care" and can be set to either
one or zero. See Table 1 for program sample for one
channel setting:
START AND STOP CONDITION
The Start condition is a high to low transition on the SDA line
while SCLK is high. The Stop condition is a low to high
transition on the SDA line while SCLK is high. The start and
stop conditions are always generated by the master. The
bus is considered to be busy after the start condition and to
be free again a certain time after the stop condition. The two
bus lines must be high when the buses are not in use. The
I2C Timing Diagram 2 shows the format.
TABLE 1.
DATA
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
CONDITION
0
0
0
0
0
0
0
0
0
0
Data value = 0
1
0
0
0
0
0
0
0
0
0
Data value = 512
DATA VALIDITY
0
0
0
0
0
1
1
1
1
1
Data value = 31
The data on the SDA line must be stable during the high
period of the clock. The high or low state of the data line can
only change when the clock signal on the SCLK line is low.
1
1
1
1
1
1
1
1
1
1
Data value = 1023
BYTE FORMAT AND ACKNOWLEDGE
Every byte put on the SDA line must be eight bits long. The
number of bytes that can be transmitted per transfer is
unrestricted. Each byte has to be followed by an
acknowledge bit. Data is transferred with the most significant
bit first (MSB).
The master puts a resistive high level on the SDA line during
the acknowledge clock pulse. The peripheral that
acknowledges has to pull down the SDA line during the
acknowledge clock pulse.
DEVICES ADDRESS AND W/R BIT
Data transfers follow the format shown in Timing Diagram 1.
After the Start condition, a first byte is sent which contains
7
When the W/R bit is high, the master can read the data from
the EL5226 and EL5326. See Timing Diagram 1 for detail
formats.
REGISTER MODE
The part operates at Register Mode if pin 1 (STD/REG) is
held low. The Register Mode allows the user to program
each output individually. Followed by the first byte, the
second byte sets the register address for the programmed
output channel. Bits R0 to R3 set the output channel
address. For the unused bits in the R4 to R7 are "don't care".
See Table 2 for program sample.
The EL5226 and EL5326 also allows the user to read the
data at Register Mode. See Timing Diagram 1 for detail
formats.
I2C Timing Diagram 1
STANDARD MODE (STD/REG = HIGH) WRITE MODE
I2C
Data
Start
I2C
Data In
Device Address
W
A
A6 A5 A4 A3 A2 A1 A0
I2C
CLK In
1
2
3
4
5
6
7
= don’t care
Data 1
A
D7 D6 D5 D4 D3 D2 D9 D8
8
1
2
3
4
5
6
7
Data 2
A
D7 D6 D5 D4 D3 D2 D1 D0
8
1
2
3
4
5
6
7
Data 3
Data 16
D7 D6 D5
A
Stop
D2 D1 D0
8
6
7
8
8
STANDARD MODE (STD/REG = HIGH) READ MODE
I2C
Data
Start
I2C
Data In
Device Address
R
A
Data 1
A
Data 2
A
Data 3
Data 16
NA
Stop
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D9 D8
I2C
CLK In
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
D7 D6 D5 D4 D3 D2 D1 D0
8
1
2
3
4
5
6
7
D7 D6 D5
D2 D1 D0
8
6
7
EL5226, EL5326
I2C
Data Out
8
REGISTER MODE (STD/REG = LOW) WRITE MODE
I2C
Data
Start
I2C
Data In
Device Address
W
A
A6 A5 A4 A3 A2 A1 A0
I2C
CLK In
1
2
3
4
5
6
7
Register Address
A
D7 D6 D5 D4 R3 R2 R1 R0
8
1
2
3
4
5
6
7
Data 1
A
D7 D6 D5 D4 D3 D2 D9 D8
8
1
2
3
4
5
6
7
Data 2
A
Stop
D7 D6 D5 D4 D3 D2 D1 D0
8
1
2
Device Address
R
A
3
4
5
6
7
8
REGISTER MODE (STD/REG = LOW) READ MODE
I2C
Data
I2C
Data In
Start
Device Address
W
A6 A5 A4 A3 A2 A1 A0
A
Register Address
A
D7 D6 D5 D4 R3 R2 R1 R0
Start
Data 1
A
Data 2
NA
A6 A5 A4 A3 A2 A1 A0
I2C
Data Out
D7 D6 D5 D4 D3 D2 D9 D8
I2C
CLK In
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
D7 D6 D5 D4 D3 D2 D1 D0
1
2
3
4
5
6
7
8
Stop
EL5226, EL5326
REGISTER ADDRESS
DATA
R3
R2
R1
R0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Channel A, Value = 0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
Channel B, Value = 512
0
0
1
0
0
0
0
0
0
1
1
1
1
1
Channel C, Value = 31
0
1
1
1
1
1
1
1
1
1
1
1
1
1
Channel H, Value = 1023
I2C Timing Diagram 2
START
CONDITION
STOP CONDITION
tF
tR
DATA
CLOCK
tS
tH
tS
tR
tH
tF
FIGURE 11. START, STOP & TIMING DETAILS OF I2C
INTERFACE
Analog Section
TRANSFER FUNCTION
The transfer function is:
data
V OUT ( IDEAL ) = V REFL + ------------- × ( V REFH - V REFL )
1024
where data is the decimal value of the 10-bit data binary
input code.
The output voltages from the EL5226 and EL5326 will be
derived from the reference voltages present at the VREFL
and VREFH pins. The impedance between those two pins is
about 32kΩ.
Care should be taken that the system design holds these two
reference voltages within the limits of the power rails of the
EL5226 and EL5326. GND < VREFH ≤ VS and GND ≤ VREFL ≤
VREFH.
In some LCD applications that require more than 12
channels, the system can be designed such that one
EL5226 or EL5326 will provide the Gamma correction
voltages that are more positive than the VCOM potential. The
second EL5226 or EL5326 can provide the Gamma
correction voltage more negative than the VCOM potential.
The Application Drawing shows a system connected in this
way.
CLOCK OSCILLATOR
The EL5226 and EL5326 require an internal clock or external
clock to refresh its outputs. The outputs are refreshed at the
9
CONDITION
falling OSC clock edges. The output refreshed switches open
at the rising edges of the OSC clock. The driving load shouldn’t
be changed at the rising edges of the OSC clock. Otherwise, it
will generate a voltage error at the outputs. This clock may be
input or output via the clock pin labeled OSC. The internal clock
is provided by an internal oscillator running at approximately
21kHz and can be output to the OSC pin. In a 2 chip system, if
the driving loads are stable, one chip may be programmed to
use the internal oscillator; then the OSC pin will output the clock
from the internal oscillator. The second chip may have the OSC
pin connected to this clock source.
For transient load application, the external clock Mode
should be used to ensure all functions are synchronized
together. The positive edge of the external clock to the OSC
pin should be timed to avoid the transient load effect. The
Application Drawing shows the LCD H rate signal used, here
the positive clock edge is timed to avoid the transient load of
the column driver circuits.
After power on, the chip will start with the internal oscillator
mode. At this time, the OSC pin will be in a high impedance
condition to prevent contention. By setting pin 32 to high, the
chip is on external clock mode. Setting pin 32 to low, the chip
is on internal clock mode.
EL5226, EL5326
Block Diagram
REFERENCE HIGH
OUTA
OUTB
OUTJ
EIGHT
CHANNEL
MEMORY
VOLTAGE
SOURCES
OUTK
OUTL
REFERENCE LOW
REFERENCE DECOUPLE
I2C DATA IN
CONTROL IF
I2C CLOCK IN
FILTER
STD/REG
CHANNEL OUTPUTS
Each of the channel outputs has a rail-to-rail buffer. This
enables all channels to have the capability to drive to within
50mV of the power rails, (see Electrical Characteristics for
details).
When driving large capacitive loads, a series resistor should
be placed in series with the output. (Usually between 5Ω and
50Ω).
Each of the channels is updated on a continuous cycle, the
time for the new data to appear at a specific output will
depend on the exact timing relationship of the incoming data
to this cycle.
The best-case scenario is when the data has just been
captured and then passed on to the output stage
immediately; this can be as short as 48µs. In the worst-case
scenario this will be 480µs for EL5226 and 576µs for
EL5236, when the data has just missed the cycle.
When a large change in output voltage is required, the
change will occur in 2V steps, thus the requisite number of
timing cycles will be added to the overall update time. This
means that a large change of 16V can take between 4.8ms
A0
OSCILLATOR
SELECT
OSCILLATOR
INPUT/OUTPUT
and 5.3ms for EL5226 and between 6.9ms to 7.48ms for
EL5236 depending on the absolute timing relative to the
update cycle.
POWER DISSIPATION
With the 30mA maximum continues output drive capability
for each channel, it is possible to exceed the 125°C absolute
maximum junction temperature. Therefore, it is important to
calculate the maximum junction temperature for the
application to determine if load conditions need to be
modified for the part to remain in the safe operation.
The maximum power dissipation allowed in a package is
determined according to:
T JMAX - T AMAX
P DMAX = -------------------------------------------Θ JA
where:
• TJMAX = Maximum junction temperature
• TAMAX = Maximum ambient temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation in the package
10
EL5226, EL5326
The maximum power dissipation actually produced by the IC
is the total quiescent supply current times the total power
supply voltage and plus the power in the IC due to the loads.
P DMAX = V S × I S + Σ [ ( V S - V OUT i ) × I LOAD i ]
when sourcing, and:
P DMAX = V S × I S + Σ ( V OUT i × I LOAD i )
when sinking.
Where:
• i = 1 to total 12
• VS = Supply voltage
• IS = Quiescent current
• VOUTi = Output voltage of the i channel
• ILOADi = Load current of the i channel
By setting the two PDMAX equations equal to each other, we
can solve for the RLOAD's to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5226 and EL5326. The
traces from the two ground pins to the ground plane must be
very short. The thermal pad of the EL5226 and EL5326
should be connected to the analog ground plane. Lead
length should be as short as possible and all power supply
pins must be well bypassed. A 0.1µF ceramic capacitor must
be place very close to the VS, VREFH, VREFL, and CAP
pins. A 4.7µF local bypass tantalum capacitor should be
placed to the VS, VREFH, and VREFL pins.
APPLICATION USING THE EL5226 AND EL5326
In the first application drawing, the schematic shows the
interconnect of a pair of EL5226 and EL5326 chips
connected to give 8 gamma corrected voltages above the
VCOM voltage, and 8 gamma corrected voltages below the
VCOM voltage.
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EL5226, EL5326
Application Drawing
HIGH REFERENCE
VOLTAGE
+10V
REFH
OUTA
VS
OUTB
COLUMN (SOURCE)
DRIVER
0.1µF
+12V
0.1µF
+5V
MICROCONTROLLER
VSD
LCD PANEL
OUTC
0.1µF
OUTD
AO
I2C DATA IN
SDA
OUTE
I2C CLOCK
LCD
TIMING
CONTROLLER
ADDRESS = H74
SCL
HORIZONTAL RATE
OSC
+5V
OSC_SEL
OUTF
CAP
0.1µF
OUTK
REFL
STD
GND
OUTL
EL5226,EL5326
MIDDLE REFERENCE VOLTAGE
+5.5V
REFH
OUTA
OSC
+5V
OSC_SEL
+12V
VS
OUTB
0.1µF
+5V
VSD
OUTC
0.1µF
AO
I2C DATA IN
OUTD
SDA
I2C CLOCK
SCL
OUTE
ADDRESS = H75
CAP
0.1µF
+1V
LOW REFERENCE
VOLTAGE
OUTF
REFL
0.1µF
OUTK
STD
GND
OUTL
EL5226,EL5326
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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