485AW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN16, 2.5x3.5, 0.5P
CASE 485AW−01
ISSUE O
1
SCALE 2:1
D
PIN ONE
REFERENCE
A
B
ÏÏÏ
ÏÏÏ
ÏÏÏ
2X
L1
DETAIL A
E
TOP VIEW
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
(A3)
0.10 C
GENERIC MARKING
DIAGRAM*
A1
0.08 C
NOTE 4
C
SIDE VIEW
XXXX
ALYWG
G
SEATING
PLANE
0.15 C A B
XXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
D2
16X
L
K
8
10
DETAIL A
0.15 C A B
E2
16X
2
15
e
1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.50 BSC
0.85
1.15
3.50 BSC
1.85
2.15
0.50 BSC
0.20
--0.35
0.45
--0.15
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÎÎÎ
ÎÎÎ
ÏÏÏ
DETAIL B
16X
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
0.15 C
2X
DATE 11 DEC 2008
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
b
0.10 C A B
0.05 C
NOTE 3
SOLDERING FOOTPRINT*
e/2
3.80
2.10
BOTTOM VIEW
0.50
PITCH
2.80 1.10
1
16X
0.60
16X
0.30
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON36347E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN16, 2.5X3.5
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON36347E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. LEPKOWSKI.
DATE
11 DEC 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 01O
Case Outline Number:
485AW