NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry’s first to offer solderable side pads. ` It measures only 1.0 x 0.6 x 0.37 mm and delivers very high mechanical stability. Key features `` Solderable side pads `` Low package height of 0.37 mm `` AEC-Q101 qualified Key benefits `` Supports ultra-flat PCB designs `` Side pads for easy visual soldering inspection `` High shear force robustness `` Full thermal, electrical, and mounting compatibility with SOD882 and competitor offerings `` Very high mechanical stability `` Minimized package tilting` More information `` http://www.nxp.com/infocus/topics/sod882d/ Key applications `` Highly space-constrained devices `` Mobile phones `` Handheld (consumer) appliances `` Tablet PCs Exposed solderable side pads NXP‘s new SOD882D package is the first leadless package in the market with tin-plated, solderable side pads. The innovative pad design provides the side pads with an exposed surface for solder wetting. The result is very high mechanical robustness and easy visual inspection of the soldering. SOD882D SOD882D (mounted on PCB) Tin-plated side pad Side pad after soldering; wetted with solder Reduced package height The package height is only 0.37 mm. This is up to 20% lower than comparable 1006/0402 packages in the market and is optimal for ultra-flat PCB designs. Standard 1006/0402 0.48 mm NXP SOD882D 0.37 mm > 20% height reduction Height comparison of competitor packages with form factor of 1.0 x 0.6 mm (0402 inch) NXP Package Height [mm] typ Competitor 1 Competitor 2 Competitor 3 Competitor 4 Competitor 5 SOD882D SOD882 SLP1006P2 DFN1006H4-2L TSLP-2L CST2 LLP1006-2L 0.37 0.47 0.48 0.40 0.38 0.38 0.36 Improved mechanical robustness Shear bit Maximum shear force Optimized for high shear forces for robust soldering Maximum board bending Very high board bending capability for designs with flexible PCBs 45 mm 45 mm 45 mm 45 mm 45 mm Minimum tilting angle Reduced tilting angle for ultra flat PCB designs 45 mm Shear force comparison of competitor packages with form factor of 1.0 x 0.6 mm (0402) Package Shear force [N] average NXP Competitor 1 Competitor 2 Competitor 3 Competitor 4 Competitor 5 Competitor 6 SOD882D SLP1006P2 TSLP-2L CST2 LLP1006-2L VMN2 sod923 19.11 18.91 14.72 13.01 14.18 12.23 7.98 SOD882D – portfolio ESD protection diodes VRWM (V) Cd typ (pF) Cd max (pF) ESD rating max (kV) IR typ@ VRWM (nA) Ipp (8/20 µs pulse) (A) VCL @ Ipp (8/20 µs pulse) (V) PESD5V0S1ULD 5 152 200 30 100 15 20 PESD5V0L1ULD 5 25 30 26 10 3.5 12 5.5 1.55 1.75 15 1 2 9 5 0.95 1.1 8 1 3 10 SOD882D Type PESD5V0X1UALD PESD5V0X1ULD Configuration 2 1 006aac643 PESD12VS1ULD 12 38 75 30 <1 5 35 PESD15VS1ULD 15 32 70 30 <1 5 40 PESD24VS1ULD 24 23 50 23 <1 3 70 PESD5V0S1BLD 5 35 45 30 5 12 14 PESD5V0V1BLD 5 11 13 30 1 4.8 12.5 PESD5V0U1BLD 5 2.9 3.5 10 5 - - 1 2 006aab041 Low VF MEGA Schottky diodes VR max (V) IF max (mA) VF max @ IF max (mV) VF max @ 10 mA (mV) IR max (µA) @ VR (V) trr typ (ns) PMEG2005ELD 20 500 500 290 30 10 7 PMEG2005AELD 20 500 440 190 600 10 6 PMEG3002AELD 30 200 480 300 10 10 6 SOD882D Type Configuration 2 1 006aac642 PMEG3005ELD 30 500 500 270 200 10 6 PMEG4002ELD 40 200 600 360 0,5 25 4 High speed switching diode SOD882D Type BAS16LD VR max (V) VF max @ 50 mA (V) IR max @ 80 V (µA) IF max (mA) Trrmax (ns) P tot (mW) 100 1 0.5 215 4 250 Configuration 1 2 006aab040 SOD882D package characteristics Footprint options for SOD882D package SOD882D footprint `` Standard footprint for SOD882D `` Full utilization of all features SOD882D footprint `` Minimized SOD882D footprint (reduced side pads wetting) `` Optimal for ultra compact PCB` layouts SOD882 footprint `` Full compatibility to SOD882 footprint `` Optimal for existing PCB layouts with standard 1006/0402 devices Dimensions and soldering recommendation www.nxp.com © 2011 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: June 2011 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and Document order number: 9397 750 17130 may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof Printed in the Netherlands does not convey nor imply any license under patent- or other industrial or intellectual property rights.