fmu-g26s ds en

SANKEN ELECTRIC CO., LTD.
FMU-G26S
1 Scope
The present specifications shall apply to a FMU-G26S.
2 Outline
High Frequency Rectification
Type
Silicon Diode
Structure
Resin Molded
Applications
High Frequency Rectification
3 Flammability
UL94V-0(Equivalent)
‘080723
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61426-01
SANKEN ELECTRIC CO., LTD.
FMU-G26S
4 Absolute maximum ratings
No.
Item
Symbol
Unit
Rating
1
Transient Peak Reverse Voltage
VRSM
V
600
2
Peak Reverse Voltage
VRM
V
600
3
Average Forward Current
IF(AV)
A
10
4
Peak Surge Forward Current
IFSM
A
40
5
I2t Limiting Value
I2 t
A2s
8
6
Junction Temperature
Tj
°C
-40 to +150
7
Storage Temperature
Tstg
°C
-40 to +150
8
Dielectric Strength
kV
A.C.1.0
5 Electrical characteristics
No.
Conditions
Refer to Derating of 7
10ms.
Half sinewave, one shot
1ms ≤ t ≤ 10ms
Lead and Case(1min.)
(Ta=25℃ ,unless otherwise specified)
Item
Symbol
Unit
Value
Conditions
1
Forward Voltage Drop
VF
V
1.35 max.
IF=10A
2
Reverse Leakage Current
IR
uA
50 max.
VR=VRM
3
Reverse Leakage Current Under
High Temperature
H・IR
uA
500 max.
VR=VRM, Tj=150°C
trr1
ns
400 max.
IF=IR=100mA,
90% Recovery point
trr2
ns
200 max.
IF=100mA,IR=200mA,
75% Recovery point
Rth(j-c)
°C /W
4.0 max.
Between Junction and case
4
5
Reverse Recovery Time
Thermal Resistance
‘080723
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61426-01
SANKEN ELECTRIC CO., LTD.
FMU-G26S
6 Characteristics
Forward Power Dissipation (W)
IF(AV) - PF
Average Forward Current (A)
7 Derating
Average Forward Current (A)
Tc - IF(AV)
Case Temperature (°C)
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61426-01
SANKEN ELECTRIC CO., LTD.
FMU-G26S
8 Package information
8-1 Package type, physical dimensions and material
②
①
③
①
③
単位:mm
注 記 :A ・ 図 中 ゲ ー ト バ リ 部 は 高 さ 0 . 3 m a x の ゲ ー ト バ リ 発 生 箇 所 を 示 し ま す 。
Dimensions in ㎜
8-2 Appearance
The body shall be clean and shall not bear any stain, rust or flaw.
8-3 Marking
Marking
Type Name
FMU-G26S
‘080723
*1
*2
Type Name
Polarity
FMUG26
S
*3
Lot number
1st letter: Last digit of year
2nd letter: Month From 1 to 9 for Jan. to Sep.,
O for Oct., N for Nov., D for Dec.
3rd & 4th letter: Day
ex. 8723 (July 23, 2008)
4/5
61426-01
SANKEN ELECTRIC CO., LTD.
FMU-G26S
9 Internal structure diagram
①
No.
Name of part
Materials
②
①
Frame: Heat Sink
Nickel Plated Copper
③
②
Chip
Silicon
③
Disc
Nickel plated copper
④
Inner Leads
Nickel plated copper Wire
⑤
Resin body
Epoxy Resin
⑥
Frame: Pin
Nickel Plated Copper + Solder Dipped
④
⑤
⑥
Weight of products: Approx. 2.1g
‘080723
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61426-01