Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 ◆General description ◆Package The STR-W6750F is power IC for quasi-resonant type switching power supply, incorporating a power MOSFET and a controller IC. The product achieves high efficiency and low noise power supply systems by the quasi-resonant operation. Package name: TO-220F-6L (FM207) ◆Features Quasi-resonant operation mode Achieves the optimal high efficiency and low noise power supply systems. Current mode control Built-in PWM oscillator The PWM operates with the minimum frequency of around 22kHz, until the quasi-resonant signal becomes valid, reduces the stress on components at startup and load-shorted. Built-in soft start function Step-drive function, reducing switching noise Input compensation at overcurrent The function reduces the distortion of overcurrent operation point to AC input voltage change by adding three components. Avalanche energy guaranteed by two chips structure (Simplification of surge absorbing circuit) Protection functions Overcurrent protection (OCP); Pulse-by-pulse Overload protection (OLP); latched shutdown Overvoltage protection (OVP); latched shutdown ◆Specification MOSFET 650V(MIN), 0.73Ω(MAX) ◆Applications Switching power supplies for LCD-TVs, PDP-TVs, CRT-TVs and Digital consumer equipment Home appliances OA equipments Industry machines Communication devices ◆Typical application circuit +B ErrAmp P S1 GND D VCC 1 Standby ON/OFF D LowB 4 S2 Reg SI GND Cont STR-W6700 ErrAmp：SANKEN SE Series Reg: Sanken linear regulator IC etc. 6 SI：SANKEN Linear Regulator IC FB S/GND 3 7 OCP /BD Standby Out 5 SS /OLP RX CX ROCP Sanken Electric Co., Ltd. 1/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Absolute maximum ratings The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified, TA = 25 °C Item Pin Symbol Ratings Unit Remark Drain Current 1−3 IDpeak(1) 15 A Single pulse Maximum Switching Current 1−3 IDMAX(2) 15 A Ta=-20 to +125°C Avalanche Energy 1−3 EAS(3) 400 mJ Control Power Supply Voltage 4−3 VCC 35 V SS/OLP pin Voltage 5−3 VSSOLP −0.5～6.0 V FB pin Inflowing Current 6−3 IFB 10 mA FB pin Voltage 6−3 VFB −0.5～9.0 V OCP/BD pin Voltage 7−3 VOCPBD −1.5～5.0 V MOS FET Power Dissipation 1−3 PD1(4) 29 W By infinite radiator 1.3 W No radiator Control Power Dissipation (MIC) 4−3 PD2 0.8 W Defined by VCC×ICC Operating Inner Flame Temperature − TF −20～+115 °C Refer to recommended operating temperature Operating Ambient Temperature − TOP −20～+115 °C Storage Temperature − Tstg −40～+125 °C Channel Temperature − Tch +150 °C Single pulse (1) VDD= 99V,L=20mH ILpeak=6.05A Within IFB control Refer to MOS FET A.S.O. curve Regarding the maximum switching current The maximum switching current is drain current IC determined by inner drive voltage and MOS FET Vth. (3) Refer to MOS FET Tch-EAS curve (4) Refer to MOS FET Ta-PD1 curve (2) Sanken Electric Co., Ltd. 2/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Electrical characteristics Electrical characteristics for control part The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified, TA = 25 °C, VCC = 20V Item Power supply Start-up Operation Operation start power supply voltage Operation stop power supply voltage Circuit current in operation Circuit current in non-operation Oscillation frequency Soft start operating stop voltage Soft start operating charging current Normal Operation Overcurrent detection threshold voltage OCP/BD pin source current Quasi-resonant operation threshold voltage 1 Quasi-resonant operation threshold voltage 2 FB pin threshold voltage FB pin sink current (Normal operation) Stand-by Operation Stand-by operation start voltage Stand-by operation start voltage interval Stand-by non-operation circuit current FB pin sink current (stand-by operation) FB pin threshold voltage (stand-by operation) Minimum ON time Protection Operation Maximum ON time OLP operation threshold voltage Ratings TYP MAX Pin Symbol 4−3 4−3 4−3 4−3 1−3 5−3 5−3 VCC(ON) VCC(OFF) ICC(ON) ICC(OFF) FOSC VSSOLP(SS) ISSOLP(SS) 7−3 VOCPBD(LIM) 7−3 IOCPBD −250 −100 −40 µA 7−3 VOCPBD(TH1) 0.28 0.40 0.52 V 7−3 VOCPBD(TH2) 0.67 0.80 0.93 V 6−3 6−3 VFB(OFF) IFB(ON) 1.32 600 1.45 1000 1.58 1400 V µA 4−3 VCC(S) 10.3 11.1 12.1 V 4−3 VCC(SK) 1.10 1.35 1.65 V 4−3 ICC(S) − 20 56 µA 6−3 IFB(S) − 4 14 µA 6−3 VFB(S) 0.55 1.10 1.50 V 1−3 tON(MIN) 0.4 0.7 1.1 µs 1−3 5−3 tON(MAX) VSSOLP(OLP) 27.5 4.0 32.5 4.9 39.0 5.8 µs V ISSOLP(OLP) VCC(OVP) ICC(H) −16 25.5 − −11 27.7 45 −6 29.9 140 µA V µA VCC(La.OFF) 6.0 7.2 8.5 V Charge current in OLP operation 5−3 OVP operation power supply voltage 4−3 Latch circuit holding current* 4−3 Latch circuit releasing power supply 4−3 voltage* *Latch circuit refers to operation during OVP and OLP. MIN 16.3 8.8 − − 19 1.1 −710 19.9 10.6 6 100 25 1.4 −390 −0.995 −0.940 −0.895 Sanken Electric Co., Ltd. 3/11 18.2 9.7 − − 22 1.2 −550 Unit V V mA µA kHz V µA V Remark Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Electrical characteristics for MOSFET part Unless otherwise specified, TA = 25 °C, Item Pin Symbol Drain-to-Source voltage Drain leak current ON resistance Switching time 1−3 1−3 1−3 1−3 VDSS IDSS RDS(ON) tf MIN 650 − − − − θch-F − Thermal resistance Sanken Electric Co., Ltd. 4/11 Ratings TYP MAX − − − 300 − 0.73 − 400 − 1.5 Unit Remark V µA Ω ns °C/W ChanneltoInternal frame Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Sanken Electric Co., Ltd. 5/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Sanken Electric Co., Ltd. 6/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Block diagram Pin function description Pin number Symbol 1 D 3 S/GND 4 VCC 5 SS/OLP 6 FB 7 OCP/BD Description Function Drain pin MOSFET drain Source/ Ground pin MOSFET source and ground Power supply pin Input for power supply for control circuit Softstart/ overload protection pin Feedback pin OCP input/ Bottom detection pin Input for set delay for overload detection and softstart operation Input for constant voltage control and intermittent mode oscillation control signals Input for overcurrent detection and bottom detection signals Sanken Electric Co., Ltd. 7/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Typical application circuit +B ErrAmp P S1 GND D VCC 1 Standby ON/OFF D LowB 4 S2 Reg SI GND Cont ErrAmp：SANKEN SE Series Reg: Sanken linear regulator IC etc. SI：SANKEN Linear Regulator IC 6 FB S/GND 3 7 OCP /BD Standby Out 5 SS /OLP RX CX ROCP Sanken Electric Co., Ltd. 8/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Package Lead forming リードフォーミング No.2003 10.0±0.2 4.2±0.2 Gate burr ゲートバリ 16.9±0.3 φ3.2±0.2 7.9±0.2 4±0.2 0.5 2.8±0.2 STR a b 2.6±0.1 6-0.74±0.15 +0.2 10.4±0.5 5.0±0.5 2.8 （根元寸法） between roots R-end 1) (5.4) -R (2 6-0.65 -0.1 0.45 +0.2 -0.1 6×P1.27±0.15=7.62±0.15 （根元寸法） between roots 5.08±0.6 （先端寸法） between tips 0.5 1 2 3 4 5 6 7 0.5 第１文字 :約2.3ｇ Note 注記 Note ―-― part shows the point gate burr (height 0.3 max) occurred 部は高さ0.3maxのゲートバリ発生個所をしめす。 Dimensions in millimeters 単位：mm 西暦年号下一桁 1st letter：The Last digit製造月 of year 第２文字 2nd letter：Month １～９月 アラビア数字 Jan. to Sep. Arabic １０月number Ｏ Ｎ Oct. O １１月 Ｄ Nov. N１２月 製造日 Dec. 第３、４文字 D ０１～３１ 3rd & 4th letter：day 01-31 Arabic numbers Sanken Electric Co., Ltd. 9/11 0.5 側面状態図 Side view W6723N a.a．品名標示 Part number W6750F b.b．ロット番号 Lot number Pin material: Cu 端子の材質: Ｃｕ and solder dip Pin treatment: Ni plating Product weight (approximate): 2.3g 端子の処理：Ｎｉメッキ＋半田ディップ 製品質量 0.5 平面状態図 Planar state アラビア数字 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 OPERATING PRECAUTIONS In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. Avoid locations where dust or harmful gases are present and avoid direct sunlight. Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Remarks About Using Silicone Grease with a Heatsink When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials Inc. SC102 Dow Corning Toray Co., Ltd. Cautions for Mounting to a Heatsink When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For mounting the products, the mounting surface flatness should be 0.05mm or less. Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures. Recommended screw torque: 0.588 to 0.785 N･m (6 to 8 kgf･cm). For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended. When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory. Soldering When soldering the products, please be sure to minimize the working time, within the following limits: • 260 ± 5 °C 10 ± 1 s (Flow, 2 times) • 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time) Soldering should be at a distance of at least 1.5 mm from the body of the products. Sanken Electric Co., Ltd. 10/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-W6750F Sep. 2013 Electrostatic Discharge When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. When using measuring equipment such as a curve tracer, the equipment should be grounded. When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. IMPORTANT NOTES The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this document. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. Anti radioactive ray design is not considered for the products listed herein. Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. The contents in this document must not be transcribed or copied without Sanken’s written consent. Sanken Electric Co., Ltd. 11/11