Product Specification Product: Bluetooth 4.1 Module CB1010-8P Module Number: Doc Version: V2.0 tia l Customer: 7.28, 2015 C on fid en Date: Office Add.: Room 1302, Block A, Building 4, Tianan Cyber Park, Huangge Road, Longgang District, Shenzhen, Guangdong, China Tel: 0755-82079390/82079392 Fax: 86-755-82079390-8007 1 Content C on fid en tia l Section 1: Overview...........................................................................................................................3 1.1 Applications..........................................................................................................................3 1.2 Features................................................................................................................................ 3 1.3 Functional Block Diagram................................................................................................. 4 1.4 Physical Description............................................................................................................5 Section 2: Supporting Documentations...........................................................................................6 2.1 Reference Schematic........................................................................................................... 6 2.2 Layout Considerations........................................................................................................6 2.3 Recommended Operating Conditions............................................................................... 7 2.4 RF Specification...................................................................................................................7 Section 3: Application Examples..................................................................................................... 8 Section 4: Mechanical Specification................................................................................................ 9 Section 5: Information for Manufacture.........................................................................................9 Section 6: Packaging Specifications.................................................................................................9 2 CB1010-8P Bluetooth 4.1 Module Section 1: Overview The CB1010-8P module uses Bluetooth Smart to send messages to other devices in the network, which in turn relay them onward. The mesh protocol was optimized for lighting control. The Mesh technology can increase the network capacity of the equipment, and at the same time can be controlled by the intelligent mobile phone.The mesh Home Automation extends this capability to allow for control of a wide variety of sensors or actuators that you want to add to the mesh network. tia l The module includes EEPROM, crystal, and PCB antenna. ■ ■ ■ ■ ■ Lighting control Alarm sensors Window and door locks Temperature and smoke monitoring. Remote controls Other of Smart home C on 1.2 Features fid ■ en 1.1 Applications The CB1010-8P module offers the following features: ■ Bluetooth® v4.1 specification compliant ■ Bluetooth Smart ■ Security: 128bit UUID and 128bit AES encryption ■ Support for 4 PWM channels of 100Hz to 4 kHz ■ Each group can have 65,536 units and users can create up to 65,536 groups ■ Can be added to the network by scanning a QR code ■ Slim printed with 20mm*15mm*1.0mm ■ ROHS compliant BQB certification ■ 3 CB1010-8P Bluetooth 4.1 Module C on fid en tia l 1.3 Functional Block Diagram 4 CB1010-8P Bluetooth 4.1 Module Pin Number 1 8 2 C on fid en tia l 1.4 Pin Description Pin Name Default Direction Function Description VDD Power supply GND Ground PIO[3] I/O Programmable I/O line. 3 PIO[4] I/O Programmable I/O line. 4 PIO[5] I/O Programmable I/O line. 5 PIO[6] I/O Programmable I/O line. 6 PIO[7] I/O Programmable I/O line. 7 PIO[8] I/O Programmable I/O line. 5 CB1010-8P Bluetooth 4.1 Module Section 2: Supporting Documentations 2.1 Reference Schematic The most recent schematic , bill of material ,and layout file are available from the I TON Technology Corp. Contact your ITON representative for more details. 2.2 Layout Considerations C on fid en tia l The CB1010-8P module is located where the antenna is away from the power supply and any digital signal traces.The antenna keep-out area which is 5mm around the parameter of the module region. PCB material and signal traces should not be placed within the antenna keep-out area to assure optimum antenna performance. 6 CB1010-8P Bluetooth 4.1 Module 2.3 Recommended Operating Conditions Operating Condition Symbol Value Unit Dc supply voltage VDD 1.8(Min)--3.6(Max) V I/O supply voltage (VDD_PADS) VI/O 1.2 to 3.6 V Operating temperature range Topr -30 to +85 ℃ Storage temperature range Tstg -40 to +85 ℃ C on fid en tia l 2.4 RF Specification 7 CB1010-8P Bluetooth 4.1 Module Power consumption Vdd @1.8V Vdd @2.8V 1mA 0.4mA 5uA <2mA 0.4mA 5uA C on fid operating current(1 key is pressed) Standby current (average ) Deep sleep en Mesh LED tia l Section 3: Application Examples 8 CB1010-8P Bluetooth 4.1 Module C on fid en tia l Section 4: Mechanical Specification 9 CB1010-8P Bluetooth 4.1 Module C on fid en tia l Section 5: Information for Manufacture Section 6: Packaging Specifications 待定 10