REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 10-06-21 C. SAFFLE Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK C. OFFICER STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY CHARLES E. BESORE APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 93-01-26 REVISION LEVEL A MICROCIRCUIT, LINEAR, LOW NOISE, WIDEBAND, PRECISION, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-91634 1 OF 12 5962-E362-10 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 01 M P A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) 91634 / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 Circuit function HA-5221 HA-5222 Operational amplifier Dual, operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter P 2 Descriptive designator Terminals GDIP1-T8 or CDIP2-T8 CQCC1-N20 8 20 Package style Dual-in-line Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 2 1.3 Absolute maximum ratings. 1/ Voltage between V+ and V- terminals ........................................................................... Differential input voltage ............................................................................................... Voltage at either input terminal ..................................................................................... Peak output current ....................................................................................................... Continuous output current ............................................................................................. Power dissipation (PD) at +75C: Case P ....................................................................................................................... Case 2 ....................................................................................................................... Junction temperature (TJ) ............................................................................................. Lead temperature (soldering, 10 seconds) .................................................................... Storage temperature range ........................................................................................... Thermal resistance, junction-to-case (JC) ................................................................... Thermal resistance, junction-to-ambient (JA) : Device type 01: Case P ................................................................................................................... Case 2 ................................................................................................................... Device type 02: Case P ................................................................................................................... Case 2 ................................................................................................................... 36 V dc 5.0 V dc V+ to V100 mA 2/ Short circuit protected 0.9 W 3/ 1.2 W 4/ +175C +300C -65C to +150C See MIL-STD-1835 113.5C/W 82.7C/W 111.6C/W 81.9C/W 1.4 Recommended operating conditions. Supply voltage range (V) ............................................................................................. 10 V dc to 15 V dc Common mode input voltage (VCM) ............................................................................. 0.5 (V+ - V-) Load resistance (RL) ..................................................................................................... 1.0 k Ambient operating temperature range (TA) ................................................................... -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Pulsed at 1.0 ms, 10% duty cycle. 3/ Derate above +75C at 9.0 mW/C. 4/ Derate above +75C at 12.0 mW/C. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C Device type unless otherwise specified Input offset voltage VIO Min Max -0.75 0.75 -1.5 1.5 -80 80 2,3 -200 200 1 -80 80 2,3 -200 200 -50 50 -150 150 1 VCM = 0 V All 2,3 Input bias current +IB VCM = 0 V, +RS = 100.1 k, -RS = 100 +IB VCM = 0 V, +RS = 100 , -RS = 100.1 k Input offset current IIO VCM = 0 V, +RS = 100.1 k, Common mode range Large signal voltage gain +CMR V+ = +3.0 V, V- = -27 V -CMR V+ = +27 V, V- = -3.0 V +AVOL VOUT = 0 V to 10 V -AVOL Common mode rejection ratio +CMRR +VOUT All All All 12 Unit mV nA nA V -12 1 VOUT = 0 V to -10 V VCM = 10 V, V+ = +5.0 V, VCM = -10 V, V+ = +25 V, 1 106 2,3 100 All 86 1 88 2,3 86 All dB 88 2,3 2,3 -VOUT 106 100 1 RL = 1.0 k All 2,3 1 V- = -5.0 V, VOUT = 10 V Output voltage swing 1 1,2,3 V- = -25 V, VOUT = -10 V -CMRR 1 2,3 -RS = 100.1 k Limits 2/ dB 12.0 V 11.5 1 -12.0 2,3 -11.5 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C Device type unless otherwise specified Output current Quiescent power supply current +IOUT VOUT = +10 V, RL = 1.0 k -IOUT VOUT = -10 V, RL = 1.0 k +ICC VOUT = 0 V, IOUT = 0 mA Min 1,2,3 1 1 -ICC 2,3 +PSRR VSUP = 10 V, 1 V+ = +20 V, V- = -15 V, V+ = +10 V, V- = -15 V -PSRR VSUP = 10 V, V+ = +15 V, V- = -20 V, V+ = +15 V, V- = -10 V Offset voltage adjustment 3/ All +VIO 30 mA 10 02 20 01 11 02 22 01 -10 02 -20 01 -11 02 -22 All 90 2,3 86 1 90 2,3 86 1,2,3 01 mA dB VIO mV -1.0 -VIO VIO (adj) En Max 01 (adj) Input noise voltage density 4/ Unit -30 2,3 Power supply rejection ratio Limits 2/ +1.0 fO = 10 Hz, RS = 0 , 4 01 24.0 nV / CL = 50 pF, TA = +25C 02 16.0 Hz fO = 100 Hz, RS = 0 , 01 8.0 CL = 50 pF, TA = +25C 02 6.6 fO = 1.0 kHz, RS = 0 , 01 5.9 CL = 50 pF, TA = +25C 02 5.9 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C Device type unless otherwise specified Input noise current density 4/ Gain bandwidth product 4/ In GBWP UGBW Min 4 Unit Max 01 11.5 pA / CL = 50 pF, TA = +25C 02 24.0 Hz fO = 100 Hz, RS = 500 k, 01 6.0 CL = 50 pF, TA = +25C 02 6.6 fO = 1.0 kHz, RS = 500 k, 01 2.0 CL = 50 pF, TA = +25C 02 2.7 fO = 10 Hz, RS = 500 k, 4 VOUT = 200 mVp-p, All 5,6 fO = 100 kHz, CL = 50 pF Unity gain bandwidth 4/ Limits 2/ 4 VOUT = 200 mVp-p, MHz 88 All 5,6 CL = 50 pF 100 30 MHz 25 VOUT = -2.5 V to +2.5 V, Slew rate 4/ +SR 4,5,6 CL = 50 pF, measured from All 25 V/s 10 percent to 90 percent points VOUT = +2.5 V to -2.5 V, -SR 25 CL = 50 pF, measured from 90 percent to 10 percent points Full power bandwidth 4/ 5/ FPBW VPEAK = 10 V, CL = 50 pF 4,5,6 All 238 kHz Minimum closed loop stable gain CLSG CL = 50 pF 4,5,6 All 1.0 V/V tR VOUT = 100 mV, CL = 50 pF, 4 All 4/ Rise time 4/ measured at 10 percent and 90 percent points Fall time 4/ tF 5,6 VOUT = 100 mV, CL = 50 pF, measured at 10 percent and 90 percent points 4 20 ns 35 All 5,6 20 ns 35 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C Device type unless otherwise specified OS Overshoot 4/ VOUT = 100 mV, CL = 50 pF Min 4 All 5,6 Power consumption 4/ PC 1,2,3 VOUT = 0 V, IOUT = 0 mA, CL = 50 pF Limits 2/ Unit Max 25 % 30 01 330 02 660 mW 1/ Unless otherwise specified, V = 15 V, RL = 1.0 k, and VOUT = 0 V. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ Offset adjustment range is [ VIO (measured) 1.0 mV ] minimum referred to output. This test is for functionality only to assure adjustment through 0 V. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 5/ Full power bandwidth is guaranteed based on slew rate measurement using FPBW = slew rate / ( 2 x x VPEAK ). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 8 Device types 01 Case outlines P 02 2 Terminal number P 2 Terminal symbol 1 -BALANCE NC OUTPUT 1 NC 2 -INPUT -BALANCE -INPUT 1 OUTPUT 1 3 +INPUT NC +INPUT 1 NC 4 V- NC V- NC 5 NC -INPUT +INPUT 2 -INPUT 1 6 OUTPUT NC -INPUT 2 NC 7 V+ +INPUT OUTPUT 2 +INPUT 1 8 +BALANCE NC V+ NC 9 --- NC --- NC 10 --- V- --- V- 11 --- NC --- NC 12 --- NC --- +INPUT 2 13 --- NC --- NC 14 --- NC --- NC 15 --- OUTPUT --- -INPUT 2 16 --- NC --- NC 17 --- V+ --- OUTPUT 2 18 --- NC --- NC 19 --- NC --- NC 20 --- +BALANCE --- V+ NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 9 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 10 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M --- Device class Q 1,2,3 Device class V 1,2,3 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3, 1/ 4,5,6 1,2,3,4,5,6 1 1,2,3 1,2,3 1 1,2,3 1,2,3 --- --- --- 1/ PDA applies to subgroup 1. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 11 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91634 A REVISION LEVEL A SHEET 12 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 10-06-21 Approved sources of supply for SMD 5962-91634 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9163401MPA 3/ HA7-5221/883 5962-9163401M2A 3/ HA4-5221/883 5962-9163402MPA 3/ HA7-5222/883 5962-9163402M2A 3/ HA4-5222/883 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. The last known supplier is listed below. Vendor CAGE number 34371 Vendor name and address Intersil Corporation 1001 Murphy Ranch Road Milpitas, CA 95035-6803 Point of contact: 1650 Robert J. Conlan Blvd. Palm Bay, FL 32905 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.