NXP multi-channel ESD protection and EMI filter IP425xCZ8-4/CZ12-6/CZ16-8 IP4256CZ3-M/CZ5-W/CZ6-F 30 dB EMI filter with up to 30 kV IEC contact ESD protection in leadless packages These highly integrated, space-saving devices, housed in NXP’s Ultra Thin Leadless Plastic (ULTP) package, combine high-level ESD protection with EMI filtering of all relevant 2G and 3G mobilephone, WLAN and Bluetooth frequencies. The ESD protection exceeds the requirements of the IEC 61000-4-2 level 4 standard. NXP has 1.000 shot-proven ESD solutions that protect all kinds of portable applications over their full lifetimes, and provides a complete in-house production flow for added supply reliability. Key features of new family } Up to 30 dB insertion loss at mobile-phone frequencies (800 MHz to 3 GHz) } High ESD protection exceeding IEC 61000-4-2 level 4 } Available as 1-, 2-, 4-, 6- or 8-channel filter } Dark Green-compliant (RoHS-compliant and halogen-/ antimony-free) } Ultra-thin leadless package, less than 0.5 mm height } Terminal pitch of 0.4 mm Key applications EMI/RFI filtering and downstream ESD protection in mobile and portable applications } Camera interface } Display and LCD interface } Memory card interface (SD, MMC, etc.) } Touch or keypad interface } Bottom connector Key benefits } Reduced component count } Reduced board space } Easy routing 1.35 x 1.7 x 0.45 mm 4-channel 1.35 x 2.5 x 0.45 mm 6-channel 1.35 x 3.3 x 0.45 mm 8-channel NXP_00_0145_EMI_Filter_v5.indd 1 11/09/09 15:59:03 EMI filter family in plastic packages IP4251CZ16-8 /CZ12-6/CZ8-4 IP4252CZ16-8 /CZ12-6/CZ8-4 IP4253CZ16-8 /CZ12-6/CZ8-4 IP4254CZ16-8 /CZ12-6/CZ8-4 UTLP SOT983/984/985 UTLP SOT983/984/985 UTLP SOT983/984/985 UTLP SOT983/984/985 4, 6, 8 4, 6, 8 4, 6, 8 4, 6, 8 IP4256CZ3-M IP4256CZ5-W IP4256CZ6-F SOT883 SOT665 SOT886 1 2 2 BOTTOM VIEW Package No. of channels Width (mm) 1.35 1.35 1.35 1.35 0.6 1.2 1 Length (mm) 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1.7, 2.5, 3.3 1 1.6 1.45 Max. height (mm) 0.5 0.5 0.5 0.5 0.5 0.6 0.5 Channel resistance (Ω , typ) 100 40 200 100 100 100 100 Line capacitance (pF @ 0.0 V, typ.) 15 18 45 45 30 30 30 Line capacitance (pF @ 2.5 V, typ.) 10 12 30 30 19 19 19 ESD IEC61000-4-2 (kV contact, typ.) 15 15 30 30 25 25 25 Robustness at ESD level 4 (1000 shots, IEC61000-4-2) yes yes yes yes yes yes yes Clamping voltage of IP4254CZ16-8 at ±8 kV IEC 61000-4-2, level 4 pulse } Integrated π-filter (C-R-C) structure assures excellent ESD pulse transient response Why integrated silicon solutions? } No degradation – full ESD protection even after 1000 IEC level strikes } Predictable, reliable suppression of relevant 2G and 3G mobile-phone frequencies while minimizing signal loss } Very low clamping voltage due to optimized π-filter structures (C-R-C structure) • Prevent damage of ESD-sensitive circuits during an ESD event (IEC testing only ensures the device will survive) • Protect against soft errors caused by non-destructive transients • Protect sensitive system chips Application example 4-channel integrated EMI filter with ESD protection 1, 2, 3, 4 Rs(ch) Cch 2 GND 5, 6, 7, 8 Cch 2 001aaf978 www.nxp.com © 2009 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. Date of release: September 2009 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and Document order number: 9397 750 16798 reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Printed in the Netherlands Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. NXP_00_0145_EMI_Filter_v5.indd 2 11/09/09 15:59:05