Mod5 Series 0.50mm Pitch Flip-Top™ BGA Socket www.advanced.com The Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. Flip-Top™ BGA Socket provides a surface mount test solution for microBGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high TYPICAL APPLICATIONS reliability performance. ■ Test, validation, and debug of 0.50mm pitch BGA devices ■ System and wafer test ■ Failure analysis ■ Package and chip qualification ■ Production prototype How It Works Chip Support Plate Features ■ Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) – larger sizes available upon request ■ Precision machined spring probes offer high bandwidth with very low insertion loss ■ Compact size (small keepout zone) enables use on existing board layouts ■ Flip-Top BGA Socket’s easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction ■ SMT design eliminates the cost of hardware and mounting holes and their associated interference with traces on the PCB ■ Modular design of lower assembly enables simple reflow process and is compatible with lead-free reflow profiles ■ Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum) ■ Additional mounting options and custom designs available BGA Device Upper Assembly Lower Assembly Solder lower assembly to PC board Attach upper assembly using four supplied screws. Insert BGA device by hand or with the aid of a vacuum pen (recommended). Place device-specific chip support plate (supplied) over device, close lid, and screw down heat sink actuator for device engagement. © 2010-2016, Advanced Interconnections Corp. Specs. subject to change without notice. inch/(mm) 5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 E-mail: [email protected] | Web: www.advanced.com Item FLIPTOPMOD5-TECH10 (Rev. 3) Mod5 Series 0.50mm Pitch Flip-Top ™ BGA Socket www.advanced.com Performance Table of Models Durability Actuation cycles: 500 minimum MOUNTING OPTIONS SMT Standard Current Carrying Capacity 2.8 Amps Max. Terminal Type -860 Sn/Ag/Cu Solder Ball .170 (4.32) Note 1 Terminal Type -861 Sn/Pb Solder Ball ■ Probe Contact Force 18 g (per position) Note 1: See Application Spec. for recommended adhesive (epoxy) instructions* .012 Dia. (0.30) Bottom View Probe Contact Resistance 80 mOhms Return Loss* Differential -10db @ 2.6 GHz -15db @ 1.3 GHz MOUNTING/TERMINAL TYPE DESIGNATION SMT/Screw Mount Terminal Type -864 Sn/Ag/Cu Solder Ball .170 (4.32) Note 2 Single-Ended -10db @ 8.0 GHz -15db @ 3.5 GHz Terminal Type -865 Sn/Pb Solder Ball ■ Note 2: Screws provided for additional strain relief when needed; reflow still required* .012 Dia. (0.30) Bottom View Insertion Loss* Differential -0.6db @ 2.6 GHz -0.2db @ 1.3 GHz SMT Plus Terminal Type -862 Sn/Ag/Cu Solder Ball Single-Ended -2.1db @ 8.0 GHz -0.9db @ 3.5 GHz .170 (4.32) Note 3 Terminal Type -863 Sn/Pb Solder Ball ■ *Complete SI Simulation Report available online .012 Dia. (0.30) Bottom View Note 3: Additional solder balls provided for strain relief in low pin count SMT applications* *See product Application Specification for complete mounting details. Specifications How To Order For Device Packages up to 12mm Square Body Size 0.79/(20mm) W x 1.06/(27mm) L Height 0.68/(17.4mm)* approx. (*will vary based on 16 FR M 064 - 860 GG CS Footprint Dash # Turn-Screw Heat Sink If Applicable* CS - 1 Fin (standard) HS - 3 Fins Model Type FR - Flip-Top™ BGA Socket reflow profile, paste volume, etc.) Terminal Plating (Probe Termination) GG - Gold Pitch M = .0197/(0.50mm) Guide Box Number of Positions High Temp. Glass Filled Thermoplastic (PPS) Screws: 18-8 Stainless Steel *Footprints available online Terminal Type (Includes Mounting Option) See Lead-free (RoHS) and Tin/Lead options for each mounting style Base Socket FR-4 Glass Epoxy, U.L. Rated 94V-0 Lid, Latch, Heat Sink, and Support Plate Anodized Aluminum Spring Probe Terminals Crown-point Plunger: Tool Steel, Gold Plated Spring: Stainless Steel, Gold Plated Terminal: Brass (C36000), Gold Plated Solder Ball (Board Interface) Lead-free (RoHS Compliant): 96.5Sn/3.0Ag/0.5Cu (SAC305) ■ 4-point crown tip spring probes accurately align device solder balls, leaving only minimal witness marks to preserve the solder ball integrity ■ Visit www.advanced.com to select a footprint or submit your device mechanical specifications to [email protected] ■ Device mechanical specifications are required prior to ordering to ensure accuracy of device-specific chip support plate Tin/Lead: 63Sn/37Pb 5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 E-mail: [email protected] | Web: www.advanced.com © 2010-2016, Advanced Interconnections Corp. Specs. subject to change without notice. inch/(mm) For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents Item FLIPTOPMOD5-TECH10 (Rev. 3)