BDxxGA3W

Datasheet
300mA Variable / Fixed Output
LDO Regulators
BDxxGA3WEFJ / BDxxGA3WNUX
●General Description
BDxxGA3WEFJ / BDxxGA3WNUX series devices are LDO regulators with an output current of 300mA. The output
accuracy is ±1% of the output voltage. Both fixed and variable output voltage devices are available. The output voltage of
the variable output voltage device can be varied from 1.5V to 13V using external resistors. Various fixed output voltage
devices that do not use external resistors are also available. It can be used for a wide range of digital appliance applications.
It has small package types : HTSOP-J8 (4.90mm x 6.00mm x 1.00mm) / VSON008X2030 (2.00mm x 3.00mm x 0.60mm).
These devices have built-in over current protection to protect the device when output is shorted, 0μA shutdown mode, and
thermal shutdown circuit to protect the device during thermal over-load conditions. These LDO regulators are usable with
ceramic capacitors that enable a smaller layout and longer life.
●Package
HTSOP-J8 (EFJ)
VSON008X2030 (NUX)
●Features
„ +/-1% output voltage accuracy
„ Built-in Over Current Protection (OCP)
„ Built-in Thermal Shut Down circuit (TSD)
„ Zero µA shutdown mode
●Key Specifications
„ Input power supply voltage range:
4.5V to 14.0V
„ Output voltage range(Variable type):
1.5V to 13.0V
„ Output voltage(Fixed type): 1.5V/1.8V/2.5V/3.0V/3.3V
5.0V/6.0V/7.0V/8.0V/9.0V/10V/12V
„ Output current:
0.3A (Max.)
„ Shutdown current:
0μA(Typ.)
„ Operating temperature range:
-25℃ to +85℃
(Typ.)
(Typ.)
(Max.)
4.90mm x 6.00mm x 1.00mm
2.00mm x 3.00mm x 0.60mm
HTSOP-J8
(EFJ)
VSON008X2030
(NUX)
●Typical Application Circuit
VCC
VCC
VO
CIN
R1
COUT
CIN
FB
EN
GND
FIN
VO
VO_S
EN
R2
GND
FIN
CIN, COUT : Ceramic Capacitor
CIN, COUT : Ceramic Capacitor
Output voltage variable type
Output voltage fixed type
○Product structure：Silicon monolithic integrated circuit
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TSZ22111･14･001
COUT
○This product is not designed to have protection against radioactive rays.
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Ordering Information
B
D
x
x
Part
Output
Number voltage
00:Variable
15:1.5V
18:1.8V
25:2.5V
30:3.0V
33:3.3V
50:5.0V
60:6.0V
70:7.0V
80:8.0V
90:9.0V
J0:10.0V
J2:12.0V
G
A
3
W
y
Shutdown
mode
y
y
Package
-
zz
Input
voltage
range
Output
current
Packaging and forming specification
G:15V
A3:0.3A “W”:Included EFJ :HTSOP-J8
E2:Emboss tape reel
NUX:VSON008X2030
(HTSOP-J8)
TR:Emboss tape reel
(VSON008X2030)
●Line up
xx
Output
Voltage(V)
00
variable
BD00GA3WEFJ-E2
BD00GA3WNUX-TR
15
1.5
BD15GA3WEFJ-E2
BD15GA3WNUX-TR
18
1.8
BD18GA3WEFJ-E2
BD18GA3WNUX-TR
25
2.5
BD25GA3WEFJ-E2
BD25GA3WNUX-TR
30
3.0
BD30GA3WEFJ-E2
BD30GA3WNUX-TR
33
3.3
BD33GA3WEFJ-E2
BD33GA3WNUX-TR
50
5.0
BD50GA3WEFJ-E2
BD50GA3WNUX-TR
60
6.0
BD60GA3WEFJ-E2
BD60GA3WNUX-TR
70
7.0
BD70GA3WEFJ-E2
BD70GA3WNUX-TR
80
8.0
BD80GA3WEFJ-E2
BD80GA3WNUX-TR
90
9.0
BD90GA3WEFJ-E2
BD90GA3WNUX-TR
J0
10.0
BDJ0GA3WEFJ-E2
BDJ0GA3WNUX-TR
J2
12.0
BDJ2GA3WEFJ-E2
BDJ2GA3WNUX-TR
Product Name
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Block Diagram
BD00GA3WEFJ / BD00GA3WNUX (Variable output voltage type)
VCC
SOFT
START
VO
Figure 1. Block Diagram
●Pin Configuration (TOP VIEW)
VO
1
8
VCC
FB
2
7
N.C.
GND
3
6
N.C.
N.C.
4
5
EN
VO
1
8
VCC
FB
2
7
N.C.
GND
3
6
N.C.
N.C.
4
5
EN
(HTSOP-J8)
●Pin Description
Pin No.
Pin name
1
VO
2
FB
3
GND
4
N.C.
5
EN
6
N.C.
7
N.C.
8
VCC
Reverse
FIN
(VSON008X2030)
Pin Function
Output pin
Feedback pin
GND pin
No Connect (Connect to GND or leave OPEN)
Enable pin
No Connect (Connect to GND or leave OPEN)
No Connect (Connect to GND or leave OPEN)
Input pin
Substrate(Connect to GND)
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Block Diagram
BDxxGA3WEFJ / BDxxGA3WNUX (Fixed output voltage type)
VCC
OCP
SOFT
START
VO
EN
TSD
VO_S
GND
Figure 2. Block Diagram
●Pin Configuration (TOP VIEW)
VO
1
8
VCC
VO_S
2
7
N.C.
GND
3
6
N.C.
N.C.
4
5
EN
VO
1
8
VCC
VO_S
2
7
N.C.
GND
3
6
N.C.
N.C.
4
5
EN
(HTSOP-J8)
(VSON008X2030)
●Pin Description
Pin No.
1
2
3
4
5
6
7
8
Reverse
Pin name
VO
VO_S
GND
N.C.
EN
N.C.
N.C.
VCC
FIN
Pin Function
Output pin
Output voltage monitor pin
GND pin
No Connect (Connect to GND or leave OPEN)
Enable pin
No Connect (Connect to GND or leave OPEN)
No Connect (Connect to GND or leave OPEN)
Input pin
Substrate(Connect to GND)
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Power supply voltage
EN voltage
HTSOP-J8
Power dissipation
VSON008X2030
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Symbol
VCC
VEN
Pd*2
Pd*3
Topr
Tstg
Tjmax
Ratings
15.0 *1
15.0
2110 *2
1700*3
-25 to +85
-55 to +150
+150
Unit
V
V
mW
℃
℃
℃
*1 Not to exceed Pd
*2 Reduced by 16.9mW/℃ for temperature above 25℃. (When mounted on a two-layer glass epoxy board with 70mm×70mm×1.6mm dimension)
*3 Reduced by 13.6mW/℃ for temperature above 25℃. (When mounted on a four-layer glass epoxy board with 114.3mm×76.2mm×1.6mm dimension)
●Recommended Operating Range (Ta=25℃)
Parameter
Input power supply voltage
EN voltage
Output voltage setting range
Output current
Ratings
Symbol
Min.
4.5
0.0
1.5
0.0
VCC
VEN
VO
IO
Unit
Max.
14.0
14.0
13.0
0.3
V
V
V
A
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
Parameter
Circuit current at shutdown mode
Bias current
Line regulation
Load regulation
Minimum dropout voltage1
Minimum dropout voltage2
Minimum dropout voltage3
Output reference voltage(Variable type)
Output voltage(Fixed type)
EN Low voltage
EN High voltage
EN bias current
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Symbol
Min.
ISD
ICC
Reg.I
-1
Reg IO
-1.5
VCO1
VCO2
VCO3
VFB
0.792
VO
VO×0.99
VEN (Low)
0
VEN (High)
2.4
IEN
1
5/20
Limits
Typ.
Max.
0
600
0.15
0.30
0.45
0.800
VO
3
5
900
1
1.5
0.30
0.60
0.90
0.808
VO×1.01
0.8
14.0
9
Unit
μA
μA
%
%
V
V
V
V
V
V
V
µA
Conditions
VEN=0V, OFF mode
VCC=( VO+0.9V )→14.0V
IO=0→0.3A
VCC=5V, IO=100mA
VCC=5V, IO=200mA
VCC=5V, IO=300mA
IO=0A
IO=0A
TSZ02201-0R6R0A600180-1-2
17.May.2013.Rev.004
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Typical Performance Curves
(Unless otherwise specified, Ta=25℃, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
VO
VO
IO
IO
Figure 4.
Transient Response
(0.3→0A)
Co=1µF
Figure 3.
Transient Response
(0→0.3A)
Co=1µF
VEN
VEN
VCC
VCC
VO
VO
Figure 5.
Input sequence 1
Co=1µF
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Figure 6.
OFF sequence 1
Co=1µF
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
VEN
VEN
VCC
VCC
VO
VO
Figure 8.
OFF sequence 2
Co=1µF
VO[V]
ICC[µA]
Figure 7.
Input sequence 2
Co=1µF
Ta[℃]
Ta[℃]
Figure 10.
Ta-ICC
Figure 9.
Ta-VO (IO=0mA)
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Datasheet
IEN[µA]
ISD [µA]
BDxxGA3WEFJ / BDxxGA3WNUX
Ta[℃]
Ta[℃]
Figure 12.
Ta-IEN
ISD[µA]
VO[V]
Figure 11.
Ta-ISD
(VEN=0V)
IO[A]
VCC [V]
Figure 13.
IO-VO
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Figure 14.
VCC-ISD
(VEN=0V)
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Datasheet
VO[V]
VO[V]
BDxxGA3WEFJ / BDxxGA3WNUX
VCC [V]
Ta[℃]
Figure 15.
VCC-VO (IO=0mA)
VOVo[V]
[V]
Figure 16.
TSD (IO=0mA)
Ta[℃]
IO [A]
Figure 17.
OCP
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TSZ22111･15･001
Figure 18.
Minimum dropout Voltage1
（VCC=5V、IO=0.3A）
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Datasheet
ICC [µA]
BDxxGA3WEFJ / BDxxGA3WNUX
IO [A]
IO [A]
Figure 19.
ESR-Io characteristics
PSRR[dB]
Vdrop[V]
Figure 20.
IO-ICC
IO [A]
Figure 21.
PSRR (IO=0mA)
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TSZ22111･15･001
Figure 22.
Minimum dropout Voltage 2
（VCC=4.5V、Ta=25℃）
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Datasheet
Vdrop[V]
Vdrop[V]
BDxxGA3WEFJ / BDxxGA3WNUX
IO [A]
IO [A]
Figure 24.
Minimum dropout Voltage 4
（VCC=8V、Ta=25℃）
Vdrop[V]
Vdrop[V]
Figure 23.
Minimum dropout Voltage 3
（VCC=6V、Ta=25℃）
IO [A]
IO [A]
Figure 25.
Minimum dropout Voltage 5
（VCC=10V、Ta=25℃）
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Figure 26.
Minimum dropout Voltage 6
（VCC=12V、Ta=25℃）
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Power Dissipation
◎HTSOP-J8
4.0
Measurement condition: mounted on a ROHM board,
Power Dissipation :Pd [W]
⑤3.76W
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
3.0
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil are : 0mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil are : 15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil are : 70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil are : 70mm×70mm）
θj-a=33.3℃/W
④2.11W
2.0
③1.10W
1.0
②0.82W
①0.50W
0
0
25
50
75
100
125
150
周囲温度:Ta [℃]: Ta [℃]
Ambient Temperature
◎VSON008X2030
4.0
Measurement condition: mounted on a ROHM board,
Power Dissipation :Pd [W]
Substrate size: 114.3mm × 76.2mm × 1.6 mm
3.0
・Solder the thermal pad to Ground
2.0
① IC only
θj-a=480.8℃/W
2
② 1-layer（copper foil are : 0mm ）
θj-a=223.2℃/W
③ 4-layer（2nd, 3rd layer copper foil are : 5655mm2,
th
4 layer copper foil are : thermal land）
θj-a=73.5℃/W
④ 4-layer（2nd, 3rd, 4th layer copper foil are : 5655mm2）
θj-a=69.4℃/W
④1.80W
③1.70W
1.0
②0.56W
①0.26W
0
0
25
50
75
100
125
150
Ambient 周囲温度:Ta
Temperature
[℃] : Ta [℃]
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be not higher than 85℃.
2. Chip junction temperature (Tj) can be not higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×W
＜Reference values＞
θj-a: HTSOP-J8
153.2℃/W 1-layer substrate (copper foil density 0mm×0mm)
113.6℃/W 2-layer substrate (copper foil density 15mm×15mm)
59.2℃/W 2-layer substrate (copper foil density 70mm×70mm)
33.3℃/W 4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (Substrate with thermal via)
θj-a: VSON008X2030
223.2℃/W 1-layer substrate (copper foil density 0mm2)
nd
rd
2
th
73.5℃/W 4-layer substrate (2 , 3 layer copper foil density 5655mm , 4 layer copper foil : thermal land)
nd
rd
th
2
69.4℃/W 4-layer substrate (2 , 3 , 4 layer copper foil density 5655mm )
Substrate size: 114.3mm×76.2mm×1.6mm
Most of the heat loss that occurs in the BDxxGA3WEFJ / BDxxGA3WNUX series is generated from the output Pch FET.
Power loss is determined by the voltage drop across VCC-VO and the output current. Be sure to confirm the system’s input
and output voltages, as well as the output current conditions in relation to the power dissipation characteristics of the VCC
and VO in the design. Bearing in mind that the power dissipation may vary substantially depending on the PCB employed, it
is important to consider PCB size based on thermal design and power dissipation characteristics of the chip with the PCB.
Power consumption [W] =
Input voltage (VCC) - Output voltage (VO)
×IO(Ave)
Example: Where VCC=5.0V, VO=3.3V, IO (Ave) = 0.1A,
Power consumption [W] =
5.0V - 3.3V ×0.1A
=0.17W
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Input and Output Capacitor
It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin
and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the
actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.
For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.
10
Rated Voltage：10V
B characteristics
0
Rated Voltage：10V
B1 characteristics
Capacitance Change [%]
-10
Rated Voltage：6.3V
B characteristics
-20
-30
-40
-50
Rated Voltage:10V
F characteristics
-60
Rated Voltage：4V
X6S characteristics
-70
-80
-90
-100
0
1
2
3
4
DC Bias Voltage [V]
Ceramic capacitor capacity – DC bias characteristics
(Characteristics example)
●Equivalent Series Resistance ESR (Output Capacitor)
To prevent oscillations, please attach a capacitor between
VO and GND. Capacitors usually have ESR (Equivalent
Series Resistance). Operation will be stable in the ESR-IO
range shown to the right. Ceramic, tantalum and
electrolytic Capacitors have different ESR values, so
please ensure that you are using a capacitor that operates
in the stable operating region shown on the right. Finally,
please evaluate in the actual application.
CO=1μF
ESR – IO characteristics
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Evaluation Board Circuit
U1
C3
C7
1
VCC
VO
8
C2
C6
R1
C5
2
FB
N.C.
7
GND
N.C.
6
C1
R2
VCC
GND
3
SW1
VO
4
N.C.
EN
EN
5
FIN
●Evaluation Board Parts List
Designation
Value
Part No.
Company
Designation
Value
Part No.
Company
R1
R2
R3
R4
R5
R6
C1
43kΩ
8.2kΩ
‐
‐
‐
‐
1µF
MCR01PZPZF4302
MCR01PZPZF8201
‐
‐
‐
‐
CM105B105K16A
ROHM
ROHM
‐
‐
‐
‐
KYOCERA
C4
C5
C6
C7
C8
C9
C10
‐
1µF
‐
‐
‐
‐
‐
‐
KYOCERA
‐
‐
‐
‐
‐
C2
‐
‐
‐
U1
‐
C3
‐
‐
‐
U2
‐
‐
CM105B105K16A
‐
‐
‐
‐
‐
BDxxGA3WEFJ /
BDxxGA3WNUX
‐
●Board Layout
ROHM
‐
EN
GND
CIN
VCC ( VIN )
R1
R2
COUT
VO
PCB layout considerations:
・Input capacitor CIN connected to VCC (VIN) should be placed as close to VCC(VIN) pin as possible.
Output capacitor COUT also should be placed as close to IC pin as possible. In case the part is connected to inner layer
GND plane, please use several through holes.
・FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as
possible. Please take care of this during layout.
・Please make GND pattern wide enough to handle thermal dissipation.
・For output voltage setting (BD00GA3WEFJ / BD00GA3WNUX)
Output voltage can be set by FB pin voltage（0.800V typ.）and external resistance R1, R2.
R1+R2
R2
（The use of resistors with R1+R2=1k to 90kΩ is recommended）
VO = VFB×
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●I/O Equivalent Circuits (Variable type : BD00GA3WEFJ / BD00GA3WNUX)
8pin (VCC) / 1pin (VO)
8pin (VCC)
2pin (FB)
5pin (EN)
2pin (FB)
5pin (EN)
2MΩ
1MΩ
1pin (VO)
●I/O Equivalent Circuits (Fixed type : BDxxGA3WEFJ /BDxxGA3WNUX)
8pin (VCC) / 1pin (VO)
2pin (VO_S)
5pin (EN)
8pin (VCC)
5pin (EN)
2pin (VO_S)
2MΩ
1MΩ
1pin (VO)
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in
a circuit, note that capacitance values are reduced at low temperatures and over time.
(4) GND voltage
The potential of the GND pin must be minimum potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
(7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
BDxxGA3WEFJ / BDxxGA3WNUX
TSD ON Temperature[℃] (typ.)
175
Hysteresis Temperature [℃]
15
(typ.)
(10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
(11) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC.
The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage.
Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND(P
substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
N
E
Parasitic
element
N
P
+
GND
B
P+
P
C
N
E
P substrate
Parasitic element
N
P substrate
GND
Parasitic element
GND
Parasitic
GND element
Other adjacent elements
(12) Ground Wiring Pattern.
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
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Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Physical Dimension Tape and Reel Information
HTSOP-J8
<Tape and Reel information>
4°
(2.4)
3.9±0.1
6.0±0.2
8 7 6 5
+6°
−4°
0.65±0.15
(3.2)
1
1.05±0.2
4.9±0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2 3 4
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
0.545
S
+0.05
0.42 -0.04
0.08±0.08
0.85±0.05
1.27
0.08
M
0.08 S
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VSON008X2030
<Tape and Reel information>
3.0±0.1
2.0±0.1
0.6MAX
1PIN MARK
0.25
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(0.12)
+0.03
0.02 −0.02
1.5±0.1
4000pcs
0.5
1
4
8
5
1.4±0.1
0.3±0.1
C0.25
Embossed carrier tape
Quantity
Direction
of feed
S
0.08 S
Tape
Direction of feed
1pin
+0.05
0.25 −0.04
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
HTSOP-J8 (TOP VIEW)
VSON008X2030 (TOP VIEW)
Part Number Marking
Part Number Marking
x x G A 3 W
LOT Number
1PIN MARK
xx
00
15
18
25
30
33
50
60
70
80
90
J0
J2
x
x
G
A
3
LOT Number
1PIN MARK
Product Name
BD00GA3WEFJ
BD00GA3WNUX
BD15GA3WEFJ
BD15GA3WNUX
BD18GA3WEFJ
BD18GA3WNUX
BD25GA3WEFJ
BD25GA3WNUX
BD30GA3WEFJ
BD30GA3WNUX
BD33GA3WEFJ
BD33GA3WNUX
BD50GA3WEFJ
BD50GA3WNUX
BD60GA3WEFJ
BD60GA3WNUX
BD70GA3WEFJ
BD70GA3WNUX
BD80GA3WEFJ
BD80GA3WNUX
BD90GA3WEFJ
BD90GA3WNUX
BDJ0GA3WEFJ
BDJ0GA3WNUX
BDJ2GA3WEFJ
BDJ2GA3WNUX
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17.May.2013.Rev.004
Datasheet
BDxxGA3WEFJ / BDxxGA3WNUX
●Revision History
Date
Revision
20.July.2012
03.Dec.2012
17.Jan.2013
17.May.2013
001
002
003
004
Changes
New Release
Improvement English translation and added Package Lineup
The description was modified.
Added BDxxGA3WNUX series
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001