340AK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247
CASE 340AK
ISSUE O
SCALE 1:1
B
A
A
E
SEATING
PLANE
A2
D2
E1
Q
E2
DATE 24 APR 2013
S
4
D1
D
1
2
3
L1
L
2X
b2
c
b4
3X
e
b
0.25
DOCUMENT NUMBER:
M
B A
M
98AON88794E
A1
P
0.635
M
B A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.13 PER
SIDE. THESE DIMENSIONS ARE MEASURED AT THE
OUTERMOST EXTREME OF THE PLASTIC BODY.
4. SLOT REQUIRED, NOTCH MAY BE ROUNDED.
5. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMEN­
SIONS D1 AND E1.
6. LEAD FINISH UNCONTROLLED WITHIN L1.
7. ∅P TO HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO
THE TOP OF THE PART WITH A MAXIMUM DIAMETER
OF 3.91.
DIM
A
A1
A2
b
b2
b4
c
D
D1
D2
E
E1
E2
e
L
L1
P
Q
S
MILLIMETERS
MIN
MAX
4.70
5.31
2.21
2.59
1.50
2.49
1.00
1.40
1.65
2.39
2.59
3.43
0.38
0.89
20.80
21.46
13.08
--0.51
1.35
15.49
16.26
13.46
--4.32
5.49
5.46 BSC
19.81
20.32
--4.50
3.56
3.66
5.38
6.20
6.15 BSC
INCHES
MIN
MAX
0.185
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.065
0.094
0.102
0.135
0.015
0.035
0.819
0.845
0.515
--0.020
0.053
0.610
0.640
0.530
--0.170
0.216
0.215 BSC
0.780
0.800
--0.177
0.140
0.144
0.212
0.244
0.242 BSC
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
TO−247
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON88794E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
DATE
24 APR 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. O
Case Outline Number:
340AK