DTO25 www.vishay.com Vishay Sfernice Surface Mounted Power Resistor Thick Film Technology FEATURES • AEC-Q200 qualified • 25 W at 25 °C case temperature • Surface mounted resistor - TO-252 (DPAK) style package • Wide resistance range: 0.016 to 700 k • Non inductive • Resistor isolated from metal tab • Solder reflow secure at 270 °C / 10 s, MSL = 1 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DIMENSIONS in millimeters 8.2 2.8 6.35 0.8 ± 0.1 Footprint recommendation for solderable contact area: 10° 1.8 8.51 4.1 3.81 1.78 12.4 7.3 6.82 1 7.87 0.6 ± 0.1 1.4 +0.2 /-0 2.54 2.54 1.2 1.6 ± 0.1 5.08 1.65 1.65 0.8 ± 0.1 Tolerance unspecified: ± 0.3 Notes • For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C. • Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of copper, 39 mm x 30 mm x 1.6 mm, with thermal vias. • For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20, D2TO35, DTO25)”. STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RESISTANCE RANGE DTO25 TO-252 (DPAK) 0.016 to 700K RATED POWER LIMITING ELEMENT TOLERANCE P25 °C VOLTAGE UL ±% W V 25 MECHANICAL SPECIFICATIONS Mechanical Protection Resistive Element Substrate Connections Weight Climatic Category Thick film Tinned copper, Ni under layer 2 g max. -55 °C to +150 °C 55 / 150 / 56 2 applications 30 s separated by 60 s CRITICAL RESISTANCE 150 1.6K ELECTRICAL SPECIFICATIONS Tolerances Alumina IEC 60695-11-5 Flammability 1, 2, 5, 10 Molded ENVIRONMENTAL SPECIFICATIONS Temperature Range 200 TEMPERATURE COEFFICIENT ± ppm/°C Power Rating and Thermal Resistance Temperature Coefficient Dielectric Strength From 0.016 to 0.047 : ± 5 % and ± 10 % > 0.047 to 0.1 : ± 2 % to ± 10 % 0.11 : ± 1 % to ± 10 % 25 W at +25 °C case temperature RTH (j - c): 5 °C/W See Special Feature table ± 150 ppm/°C 1500 VRMS - 1 min - 15 mA max. (between terminals and board) Insulation Resistance 104 M Inductance 0.1 μH DIMENSIONS Standard Package Revision: 12-Feb-16 TO-252 style (DPAK) Document Number: 51054 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DTO25 www.vishay.com Vishay Sfernice SPECIAL FEATURES Resistance Values Requirement Temperature Coefficient (TCR) (-55 °C +150 °C) IEC 60115-1 0.016 0.1 0.5 ± 900 ppm/°C ± 350 ppm/°C ± 150 ppm/°C PERFORMANCE TESTS Momentary Overload Load Life High Temperature Exposure Temperature Cycling Biased Humidity Operational Life ESD Human Body Model Vibration Mechanical Shock Board Flex Terminal Strength CONDITIONS REQUIREMENTS IEC 60115-1 §4.13 1.6 Pr 5 s US < 1.5 UL IEC 60115-1 1000 h, 90/30 Pr at +25 °C AEC-Q200 REV D conditions: MIL-STD-202 method 108 1000 h, +175 °C, unpowered AEC-Q200 REV D conditions: pre-conditioning 3 reflows according JESTD020D JESD22 method JA-104 1000 cycles, (-55 °C to +125 °C) dwell time 15 min AEC-Q200 REV D conditions: MIL-STD-202 method 103 1000 h, 85°C, 85 % RH AEC-Q200 REV D conditions: pre-conditioning 3 reflows according JESTD020D MIL-STD-202 method 108 1000 h, 90/30, powered, +125 °C AEC-Q200 REV D conditions: AEC-Q200-002 25 kVAD AEC-Q200 REV D conditions: MIL-STD-202 method 204 20 g’s for 20 min, 12 cycles test from 10 Hz to 2000 Hz ± (0.25 % + 0.005 ) ± (1 % + 0.005 ) ± (1 % + 0.005 ) ± (0.5 % + 0.005 ) ± (0.5 % + 0.005 ) ± (1 % + 0.005 ) ± (0.5 % + 0.005 ) ± (0.5 % + 0.005 ) AEC-Q200 REV D conditions: MIL-STD-202 method 213 100 g’s, 6 ms, 3.75 m/s 3 shocks/direction ± (0.5 % + 0.005 ) AEC-Q200 REV D conditions: AEC-Q200-005 bending 2 mm, 60 s AEC-Q200 REV D conditions: AEC-Q200-006 1.8 kgf, 60 s ± (0.25 % + 0.01 ) ± (0.25 % + 0.01 ) ASSEMBLY SPECIFICATIONS For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C TESTS Resistance to Soldering Heat Moisture Sensitivity Level (MSL) Revision: 12-Feb-16 CONDITIONS REQUIREMENTS AEC-Q200 REV D MIL-STD-202 method 210 Solder Bath method: 270 °C / 10 s ± (0.5 % + 0.005 ) IPC / JEDEC® J-STD-020C 85 °C / 85 % RH / 168 h Level: 1 + pass requirements of TCR Overload and Dielectic Strength after MSL Document Number: 51054 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DTO25 www.vishay.com Vishay Sfernice POWER RATING The temperature of the case should be maintained within the limits specified. % OF RATED DISSIPATION 100 80 60 40 20 0 0 25 100 50 150 200 CASE TEMPERATURE IN °C CHOICE OF THE BOARD The user must choose the board according to the working conditions of the component (power, room temperature). Maximum working temperature must not exceed 150 °C. The dissipated power is simply calculated by the following ratio: 1 T P = ------------------------------------------------------------------------------------------R TH (j - c) + R TH (c - h) + R TH (h - a) P: Expressed in W T: Difference between maximum working temperature and room temperature RTH (j - c): Thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal resistance of the component: 5 °C/W. RTH (c - h): Thermal resistance value measured between outer side of the resistor and upper side of the board. This is the thermal resistance of the solder layer. RTH (h - a): Thermal resistance of the board. Example: RTH (c - h) + RTH (h - a) for DTO25 power rating 3 W at ambient temperature +25 °C. Thermal resistance RTH (j - c): 5 °C/W Considering equation (1) we have: T = 150 °C - 25 °C = 125 °C RTH (j - c) + RTH (c - h) + RTH (h - a) = T/P = 125/3 = 41.7 °C/W RTH (c - h) + RTH (h - a) = 41.7 °C/W - 5 °C/W = 36.7 °C/W ACCIDENTAL OVERLOAD In any case the applied voltage must be lower than the maximum overload voltage of Us = 300 V. The values indicated on the graph below are applicable to resistors onto a board. ENERGY CURVE at 25 °C POWER CURVE at 25 °C 100 000 10 10 000 POWER IN W ENERGY IN JOULES 100 1 0.1 100 0.01 0.001 10-7 1000 10 10-6 10-5 10-4 10-3 10-2 OVERLOAD DURATION IN s Revision: 12-Feb-16 10-1 10-7 10-6 10-5 10-4 10-3 10-2 10-1 OVERLOAD DURATION IN s Document Number: 51054 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DTO25 www.vishay.com Vishay Sfernice Single Pulse: These informations are for a single pulse on a cold resistor at 25 °C (not already used for a dissipation) and for pulses of 100 ms maximum duration. The formula used to calculate E is: 2 U- x t E = P x t = ------R with: E (J): Pulse energy P (W): Pulse power t (s): Pulse duration U (V): Pulse voltage R (): Resistor The energy calculated must be less than that allowed by the graph. Repetitive or Superimposed Pulses: The following formula is used to calculate the “equivalent“ energy of a repetitive pulse or the “equivalent energy“ of a pulse on a resistor that is already dissipating power. Pa E c = E x 1 + ------ Pr with: Ec (J): Equivalent pulse energy E (J): Known pulse energy Pr: Resistor power rating Pa: Mean power being dissipated The energy calculated must be less than that allowed by the graph and the average power dissipated (Pa) must not exceed the continuous power of resistor. PACKAGING • Tube: max. 50 units per tube • Reel: max. 500 units per reel 5.2 1.6 0.8 3 0.9 8.7 0.5 14.5 1 17° R 0.5 0.8 MARKING Model, style, resistance value (in ), tolerance (in %), manufacturing date, Vishay Sfernice trademark. Revision: 12-Feb-16 Document Number: 51054 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DTO25 www.vishay.com Vishay Sfernice ORDERING INFORMATION DTO 025 MODEL STYLE C 100 k ±1% CONNECTIONS RESISTANCE VALUE TOLERANCE XXX e3 CUSTOM DESIGN LEAD (Pb)-FREE Optional on request: shape, etc F=±1% G=±2% J=±5% K = ± 10 % SAP PART NUMBERING GUIDELINES D T O 0 2 5 C 1 0 0 0 2 F R E 3 GLOBAL MODEL SIZE LEADS OHMIC VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE DTO 025 C = surface mount The first four digits are significant figures and the last digit specifies the number of zeros to follow. R designates decimal point. F=1% G=2% J=5% K = 10 % R = reel 500 pieces T = tube 50 pieces E3 = pure tin 48R70 = 48.7 48701 = 48 700 10002 = 100 000 R0100 = 0.01 R6800 = 0.68 27000 = 2700 = 2.7 k Revision: 12-Feb-16 Document Number: 51054 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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