ITO220S

Package Outline Dimensions
ITO220S
A
E
Q
A1
+
7 Ref
H1
+
ØP
D
Ø1.5
Dp 0.1 max
D1
D2
1.7 Ref
5 Ref
E1
5 Ref
A2
L1
b2
L
e
5 Ref
b
c
e1
5 Ref
ITO220S
Dim
Min
Max
Typ
A
4.52
4.62
4.57
A1
1.17
1.39
A2
2.57
2.77
2.67
b
0.72
0.95
0.84
b2
1.15
1.34
1.26
c
0.356 0.61
D
14.22 16.51 15.00
D1
8.60
8.80
8.70
D2
13.68 14.08
e
2.49
2.59
2.54
e1
4.98
5.18
5.08
E
10.01 10.21 10.11
E1
6.86
8.89
H1
5.85
6.85
L
13.30 13.90 13.60
L1
4.00
P
3.54
4.08
Q
2.54
3.42
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-05
1 of 1
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated