Package Outline Dimensions MSOP-10 D MSOP-10 Dim Min Max Typ A -1.10 -A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.17 0.33 0.20 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e --0.50 L 0.40 0.80 0.60 X --0.750 Y --0.750 a 0° 8° 4° All Dimensions in mm 4X 10 ° E 0.25 X Seating Plane 4x1 0° L a Gauge Plane Y 1 e b E3 A3 A2 A A1 E1 D c Suggested Pad Layout MSOP-10 C X Y Dimensions Value (in mm) C 0.500 X 0.300 Y 1.350 Y1 5.300 Y1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-16 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated