TO263 5

Package Outline Dimensions
TO263-5
A
E
A1
L2
D
TO263-5
Dim
Min
Max
A
4.07
4.85
A1
1.14
1.40
b
0.66
1.02
c
0.36
0.64
D
8.65
9.65
E
9.78
10.54
e
1.57
1.85
L
14.61 15.88
L1
2.29
2.79
L2
-
2.92
All Dimensions in mm
L
L1
b
e
c
Suggested Pad Layout
TO263-5
X
Dimensions
Y1
X
X1
Y
Y1
Y2
C
Y
Y2
Value
(in mm)
10.9
1.05
15.7
9.1
2.5
1.7
X1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-11
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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