Package Outline Dimensions U-DFN3030-8 (Type D) A A3 A1 Seating Plane D D/2 e Dim A A1 A3 b D D1 D2 D3 D4 D5 e D3 E3 E4 D1 E E1 D4 E5 E7 E2 D2 E/2 E6 L Min 0.570 0 0.290 2.950 2.175 0.980 0.105 - U-DFN3030-8 Type D Max Typ Dim Min E 2.950 0.630 0.600 E1 1.800 0.050 0.020 E2 0.290 0.150 E3 0.175 0.390 0.340 E4 3.075 3.000 E5 2.375 2.275 E6 1.180 1.080 E7 0.305 0.205 L 0.925 0.300 Z 1.330 0.650 All Dimensions in mm Max 3.075 2.000 0.490 0.375 0.40 - Typ 3.000 1.900 0.390 0.275 0.550 0.815 0.150 0.135 0.350 0.355 D5 Z b(8X) Suggested Pad Layout U-DFN3030-8 (Type D) X C Dimensions X7 Y G Y1 X6 Y4 G1 Y2 Y5 Y6 G2 Y3 X5 X4 X3 G3 X2 X1 C G G1 G2 G3 X X1 X2 X3 X4 X5 X6 X7 Y Y1 Y2 Y3 Y4 Y5 Y6 Value (in mm) 0.650 0.150 0.270 0.135 0.210 0.440 0.220 0.375 0.150 1.350 0.925 1.080 1.350 0.550 0.150 0.390 0.815 0.950 1.900 2.600 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-01-27 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated