V QFN4040 23

Package Outline Dimensions
V-QFN4040-23
A
A3
A1
Seating Plane
e
L(18x)
(Pin #1 ID)
La
D2
E2b
E2
E
k
E2a
E2c
D2
b
z(8x)
k1(3x)
V-QFN4040-23
Dim Min Max
Typ
A
0.75 0.85
0.80
A1 0.00 0.05
0.02
A3
--0.152
b
0.19 0.29
0.24
D
3.95 4.05
4.00
D2 3.05 3.25
3.15
E
3.95 4.05
4.00
E2 1.18 1.38
1.28
E2a 1.02 1.22
1.12
E2b 0.64 0.84
0.74
E2c 1.14 1.34
1.24
e
0.65 BSC
k
--0.30
k1
--0.25
L
0.35 0.45
0.40
La 0.15 0.25
0.20
z
--0.63
All Dimensions in mm
D
Suggested Pad Layout
V-QFN4040-23
X6
X5
X3
Y6
Dimensions
X4
Y2
Y3
X2
Y7
Y4
X1
Y5
Y1
Y(14x)
C
X(14x)
C
X
X1
X2
X3
X4
X5
X6
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value
(in mm)
0.50
0.34
3.55
3.25
1.84
0.40
2.84
4.30
0.60
1.40
0.84
1.24
2.84
1.38
1.22
4.30
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-09-18
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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