厚度为 0.45mm 封装 Unit : mm USON8 (3×2mm) (3,000个/ 卷 ) ccc C A bbb C B D C SEATING PLANE M 1 PIN 1 CORNER E 2X aaa C 2X A1 M A2 aaa C A3 Top View A Side View dddM C A B 8XL 8xb 1 eee C A B 8 PIN 1 CORNER CO.1 e/2 E1 e 5 4 L1 D1 EXPDSED DIE ATTACH PAD eee C A B Bottom View VIEW M-M Dimensions Symbol Unit A A1 A2 A3 b D E e J K L mm Min Nom Max 0.40 0.45 0.50 0.00 0.05 0.25 0.30 0.35 0.150 REF 0.20 0.25 0.30 2.90 3.00 3.10 1.90 2.00 2.10 0.5 BSC 0.15 0.20 0.25 1.55 1.60 1.65 0.30 0.35 0.40 Inch Min Nom Max 0.015 0.018 0.019 0.00 0.001 0.009 0.012 0.013 0.005 REF 0.007 0.010 0.012 0.114 0.118 0.122 0.074 0.079 0.082 0.019 BSC 0.005 0.008 0.009 0.061 0.063 0.064 0.011 0.014 0.015 Note: 1. Both package length and width do not include mold flash. 2. The exposed metal pad area on the bottom of the package is connected to device ground (GND pin), so both Floating and connecting GND of exposed pad are also available.