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Datasheet
Sound Processor with Built-in 2-band Equalizer
BD37523FS
General Description
Key Specifications
 Power Supply Voltage Range:
 Circuit Current (No Signal):
 Total Harmonic Distortion 1:
(FRONT,REAR)
 Total Harmonic Distortion 2:
(SUBWOOFER)
 Maximum Input Voltage:
 Crosstalk Between Selectors:
 Volume Control Range:
 Output Noise Voltage1:
(FRONT,REAR)
 Output Noise Voltage2:
(SUBWOOFER)
 Residual Output Noise Voltage:
 Operating Temperature Range:
BD37523FS is a sound processor with built-in 2-band
equalizer for car audio. Other features are stereo 5ch
input selector, input-gain control, main volume,
loudness and a 5ch fader volume. It is equipped with
an “Advanced switch circuit”, which is an original
ROHM technology, that reduces various switching
noise (ex. No-signal, low frequency like 20Hz & large
signal inputs). The “Advanced switch” also makes
controlling of microcomputer easier and can be used
for designing high quality car audio systems.
Features










Reduced switching noise of input gain control,
mute, main volume, fader volume, bass, treble,
and loudness by using advanced switch circuit
Built-in 1 differential input selector and 4
single-ended input selectors
Built-in ground isolation amplifier inputs, ideal for
external stereo input.
Built-in input gain controller which reduces
switching noise for volume of a portable audio
input.
Lesser number of external components due to
built-in 2-band equalizer filter, subwoofer LPF and
loudness filter. This makes it possible to freely
control Q, Gv, and fo of 2-band equalizer and fc of
LPF, and Gv of loudness by I2C BUS
A gain adjustment quantity of ±20dB with a 1db
step gain adjustment is possible for the bass,
middle, and treble.
Built-in subwoofer output terminals.
Energy-saving design resulting in low current
consumption is achieved by utilizing the Bi-CMOS
process. It has the advantage in quality over
scaling down the power heat control of the
internal regulators
Input pins and output pins are organized and
separately laid out to keep the signal flow in one
direction which consequently, simplify pattern
layout of the set board and decrease the board
dimensions.
It is possible to be controlled by a 3.3V / 5V I2C
BUS.
○Product structure：Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Package
7.0V to 9.5V
38mA(Typ)
0.001%(Typ)
0.002%(Typ)
2.3Vrms(Typ)
-100dB(Typ)
+15dB to -79dB
3.8µVrms(Typ)
4.8µVrms(Typ)
1.8µVrms(Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
SSOP-A24
10.00mm x 7.80mm x 2.10mm
Applications
It is optimal for car audio systems. It can also be used
for audio equipment of mini Compo, micro Compo, TV
etc.
○This product has no designed protection against radioactive rays
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TSZ02201-0C2C0E100480-1-2
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BD37523FS
Typical Application Circuit
BD37523FS
Pin Configuration
TOP VIEW
FIL 1
24
A1
2
23 SDA
A2
3
22 SCL
B1
4
21 VCC
B2
5
20
OUTF1
CP1
6
19
OUTF2
CN
7
18
OUTR1
17
OUTR2
16
OUTS
CP2 8
D1
9
GND
10
15 TEST2
E1
11
14 TEST1
E2
12
13
D2
MUTE
Pin Description
Pin No.
Pin Name
Description
1
FIL
VCC/2 terminal
2
A1
A input terminal of 1ch
3
A2
4
5
6
Pin Name
Description
13
MUTE
External compulsory mute terminal
14
TEST1
Test Pin
A input terminal of 2ch
15
TEST2
Test Pin
B1
B input terminal of 1ch
16
OUTS
Subwoofer output terminal
B2
B input terminal of 2ch
17
OUTR2
Rear output terminal of 2ch
CP1
C positive input terminal of 1ch
18
OUTR1
Rear output terminal of 1ch
7
CN
C negative input terminal
19
OUTF2
Front output terminal of 2ch
8
CP2
C positive input terminal of 2ch
20
OUTF1
Front output terminal of 1ch
9
D1
D input terminal of 1ch
21
VCC
Power supply terminal
10
D2
D input terminal of 2ch
22
SCL
I2C Communication clock terminal
11
E1
E input terminal of 1ch
23
SDA
I2C Communication data terminal
12
E2
E input terminal of 2ch
24
GND
GND terminal
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TSZ22111・15・001
Pin No.
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TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Block Diagram
21
20
19
18
17
Fader★
22
Fader★
23
Fader★
24
16
15
14
13
VCC
GND
I2C BUS LOGIC
Fader★
Fader★
Fader
■Fader
Gain:15dB to -79dB/1dB stepstep
Gain:+15dB～-79ｄB/1dB
★no pop
pop noise
noise
★no
Loudness
■Loudness
20dB to 0dB/1dB step
20dB～0ｄB/1ｄB
step
★no pop noise
・ｆ0=800
・Hicut1/2/3/4
■2 Band P-EQ (Tone control)
Gain:
+20dB to -20dB/1dB
Gain：+20dB～-20dB/1dB
★no pop noise
・Bass：f0=60/80/100/120Hz,
Q=0.5/1.0/1.5/2.0
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain:
+15dB to -79dB/1dB step
Gain:+15dB～-79dB/1dB
step
★no pop noise
■Input Gain
Gain:
+20dB to 0dB/1dB step
Gain:+20dB～0dB/1dB
step
★no pop noise
LPF
★Loudness
★2 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (4 single-end and 1 stereo ISO)
GND
ISO amp
GND
ISO amp
VCC/2
100k
1
2
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TSZ22111・15・001
100k
3
100k
4
100k
5
250k
6
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250k
7
250k
8
250k
9
250k
10
250k
11
250k
12
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power supply Voltage
VCC
10.0
V
Input voltage
VIN
VCC+0.3 to GND-0.3
V
Power Dissipation
Pd
Storage Temperature
1
Tstg
(Note 1)
W
-55 to +150
°C
(Note 1) When mounted on standard board (70 x 70 x 1.6(mm3)), derate by 8mW/°C for Ta above25°C.
Thermal resistance θja = 125(°C/W)
Material: A FR4 grass epoxy board(3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VCC
7.0
－
9.5
V
Temperature
Topr
-40
－
+85
°C
Electrical Characteristics
BLOCK
(Unless otherwise noted, Ta=25°C, VCC=8.5V, f=1kHz, VIN =1Vrms, Rg=600Ω, RL=10kΩ, A1 input, Input gain 0dB,
Mute OFF, Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, Fader 0dB)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
Circuit Current (No Signal)
IQ
－
38
48
mA
No signal
Voltage Gain
GV
-1.5
0
+1.5
dB
GV=20log(VOUT/VIN)
Channel Balance
CB
-1.5
0
+1.5
dB
CB = GV1-GV2
THD+N1
－
0.001
0.05
％
VOUT=1Vrms
BW=400Hz-30KHz
THD+N2
－
0.002
0.05
％
VNO1
－
3.8
15
μVrms
VNO2
－
4.8
15
μVrms
VOUT=1Vrms
BW=400Hz-30KHz
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
BW = IHF-A
Residual Output Noise Voltage *
VNOR
－
1.8
10
μVrms
Crosstalk Between Channels *
CTC
－
-100
-90
dB
RR
－
-70
-40
dB
RIN_S
RIN_D
70
175
100
250
130
325
kΩ
kΩ
Maximum Input Voltage
VIM
2.1
2.3
－
Vrms
Crosstalk Between Selectors *
CTS
－
-100
-90
dB
CMRR
50
65
－
dB
GENERAL
Total Harmonic Distortion 1
(FRONT,REAR)
Total Harmonic Distortion 2
(SUBWOOFER)
Output Noise Voltage 1
(FRONT,REAR) *
Output Noise Voltage 2
(SUBWOOFER) *
Ripple Rejection
INPUT SELECTOR
Input Impedance(A, B)
Input Impedance (C,D,E)
Common Mode Rejection Ratio *
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TSZ22111・15・001
4/27
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
VIM at THD+N(VOUT)=1％
BW=400Hz-30KHz
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
CP1 and CN input
CP2 and CN input
CMRR=20log(VIN/VOUT)
BW = IHF-A
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
LOUDNESS
FADER / SUBWOOFER
TREBLE
BASS
VOLUME
MUTE
INPUT GAIN
BLOCK
Electrical Characteristics - continued
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Minimum Input Gain
GIN_MIN
-2
0
+2
dB
Maximum Input Gain
GIN_MAX
+18
+20
+22
dB
Gain Set Error
GIN_ERR
-2
0
+2
dB
Mute Attenuation *
GMUTE
－
-105
-85
dB
Maximum Gain
GV_MAX
+13
+15
+17
dB
Maximum Attenuation *
GV_MIN
－
-100
-85
dB
Attenuation Set Error 1
Attenuation Set Error 2
Attenuation Set Error 3
GV_ERR1
GV_ERR2
GV_ERR3
-2
-3
-4
0
0
0
+2
+3
+4
dB
dB
dB
Maximum Boost Gain
GB_BST
18
20
22
dB
Maximum Cut Gain
GB_CUT
-22
-20
-18
dB
Gain Set Error
GB_ERR
-2
0
+2
dB
Maximum Boost Gain
GT_BST
17
20
23
dB
Maximum Cut Gain
GT_CUT
-23
-20
-17
dB
Gain Set Error
GT_ERR
-2
0
+2
dB
Maximum Boost Gain
GF_BST
+13
+15
+17
dB
Maximum Attenuation *
GF_MIN
－
-100
-90
dB
Gain Set Error
Attenuation Set Error 1
Attenuation Set Error 2
Attenuation Set Error 3
GF_ERR
GF_ERR1
GF_ERR2
GF_ERR3
-2
-2
-3
-4
0
0
0
0
+2
+2
+3
+4
dB
dB
dB
dB
Input Gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Input gain +20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
GAIN=+20dB to +1dB
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
Volume = +15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Volume = -∞dB
GV=20log(VOUT/VIN)
BW = IHF-A
Gain & ATT=+15dB to -15dB
ATT=-16dB to -47dB
ATT=-48dB to -79dB
Gain=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain=+20dB to -20dB f=100Hz
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
Gain=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain=+20dB to -20dB f=10kHz
Fader=+15dB
VIN=100mVrms
GF=20log(VOUT/VIN)
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
Gain=+15dB to +1dB
ATT=-1dB to -15dB
ATT=-16dB to -47dB
ATT=-48dB to -79dB
Output Impedance
ROUT
-
－
50
Ω
VIN =100mVrms
Maximum Output Voltage
VOM
2
2.2
－
Vrms
Maximum Gain
GL_MAX
17
20
23
dB
Gain Set Error
GL_ERR
-2
0
+2
dB
THD+N=1％
BW=400Hz-30KHz
Gain 20dB
VIN=100mVrms
GL=20log(VOUT/VIN)
GAIN=+20dB to +1dB
VP-9690A (Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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TSZ22111・15・001
5/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Typical Performance Curves
10
10
40
10kHz
10
0
0
2
4
6
8
0.1
0.1
0.01
0.01
0.001
0.001
10
VCC[V]
Power Supply Voltage : VCC [V]
0.1
1
10
Vout vs
(V)
Figure 2. THD+N
Output Voltage
25
BASS GAIN : -20dB to +20dB
/1dB step
fo : 100Hz Q : 1.0
20
15
Bass Gain [dB]
Gain (dB)
0.01
Output Voltage : VOUT [Vrms]
Figure 1. Circuit Current (No Signal) vs Power Supply
Voltage
5
4
3
2
1
0
-1
-2
-3
-4
-5
0.001
Gain=0dB
10
5
0
-5
-10
-15
-20
10
100
1k
10k
-25
100k
10
100
1k
10k
100k
Frequency [Hz]
Frequency (Hz)
Figure 3. Gain vs Frequency
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TSZ22111・15・001
Figure 4. Bass Gain vs Frequency
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TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
Vout
20
1
1kHz
100Hz
VIN [Vrms]
30
1
THD+N [%]
THD+N (%)
Iq[mA]
Circuit Current (No Signal) : IQ [mA]
50
BD37523FS
Typical Performance Curves – continued
25
20
15
10
5
25
fo : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
Gain [dB]
Gain [dB]
20
15
10
5
0
-5
-10
-15
0
-5
-10
-15
-20
-25
-20
-25
10
100
1k
10k
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fo : 60Hz
10
100k
100
Frequency [Hz]
10k
100k
Figure 6. Bass Q vs Frequency
Figure 5. Bass fo vs Frequency
25
25
TREBLE GAIN:-20dB to +20dB
/1dB step
fo : 10kHz Q : 0.75
20
15
10
fo : 7.5k/10k/12.5k/15kHz
TREBLE GAIN : ±20dB
Q : 0.75
20
15
5
0
-5
-10
Gain [dB]
Gain
(dB)
Gain
[dB]
1k
Frequency [Hz]
10
5
0
-5
-10
-15
-15
-20
-25
-20
-25
10
100
1k
10k
100k
10
Frequency [Hz]
1k
10k
100k
Frequency [Hz]
Frequency
Figure 7. Treble
Gain (Hz)
vs Frequency
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TSZ22111・15・001
100
Figure 8. Treble fo vs Frequency
7/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Typical Performance Curves - continued
1000
25
20
15
Output Noise [µVrms]
出力雑音電圧[uVrms]
Q : 0.75/1.25
TREBLE GAIN : ±20dB
fo : 7.5kHz
Gain
(dB)
Gain
[dB]
10
5
0
-5
-10
-15
Din-Audio
IHF-A
100
10
-20
-25
1
10
100
1k
10k
-80 -70 -60 -50 -40 -30 -20 -10 0
Volume Gain[dB]
Volume
Gain [dB]
100k
Frequency (Hz)
10 20
Frequency (Hz)
Figure 10. Output Noise vs Volume Gain
Figure 9. Treble Q vs Frequency
1000
DIN-Audio
IHF-A
Output Noise [µVrms]
出力雑音電圧
[uVrms]
Output Noise [µVrms]
出力雑音電圧
[uVrms]
1000
100
10
DIN-Audio
IHF-A
100
10
1
1
Bass
BassGain
Gain[dB]
[dB]
-20 -15 -10 -5 0 5 10 15 20
Treble
TrebleGain
Gain[dB]
[dB]
Figure 11. Output Noise vs Bass Gain
Figure 12. Output Noise vs Treble Gain
-20 -15 -10 -5
0
5
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TSZ22111・15・001
10 15 20
8/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Typical Performance Curves - continued
2.5
Output
Voltage
: VOUT [Vrms]
Vo [Vrms]
最大出力[Vrms]
0
Gain [dB]
Gain (dB)
-10
-20
-30
-40
-50
-60
2.0
1.5
1.0
0.5
0.0
-70
10
100
1k
10k
100
100k
Frequency [Hz]
1000
10000
R
[ohm]
LOAD
出力負荷[ohm]
100000
Frequency (Hz)
Figure 14. Output Voltage vs RLOAD
Figure 13. CMRR vs Frequency
Figure 15. Advanced Switch 1
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TSZ22111・15・001
Figure 16. Advanced Switch 2
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TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Timing Chart
CONTROL SIGNAL SPECIFICATION
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
SDA
tBUF
tLOW
tHD;STAT
tF
tR
tSP
SCL
tHD;STA
P
tHD;DAT
tHIGH
tSU;DAT
tSU;STAT
tSU;STOT
Sr
S
P
Figure 17. Definition of Timing on the I2C-bus
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices
(Unless specified otherwise, Ta=25°C, VCC=8.5V)
Parameter
Symbol
Fast-mode I2C-bus
Min
Max
Unit
1
SCL clock frequency
fSCL
0
400
kHz
2
tBUF
1.3
－
μs
tHD;STA
0.6
－
μs
4
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period,
the first clock pulse is generated
LOW period of the SCL clock
tLOW
1.3
－
μs
5
HIGH period of the SCL clock
6
Set-up time for a repeated START condition
3
tHIGH
0.6
－
μs
tSU;STA
0.6
－
μs
tHD;DAT
0.06(Note)
－
μs
7
Data hold time:
8
Data set-up time
tSU;DAT
120
－
ns
9
Set-up time for STOP condition
tSU;STO
0.6
－
μs
All values referred to VIH min and VIL max Levels (see Table 2).
(Note) The device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) in order to bridge the
undefined region of the falling edge of SCL.
About 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is fully in.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
10
11
12
13
14
Symbol
LOW level input voltage:
HIGH level input voltage:
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage: at 3mA sink current
Input current each I/O pin with an input voltage between 0.4V and
4.5V.
tHD;STA
ｔHD;STA
：2us
:2µs
tHD;DAT
ｔHD;DAT
：1us
:1µs
Fast-mode devices
VIL
VIH
tSP
VOL1
Min
-0.3
2.3
0
0
Max
+1
5
50
0.4
II
-10
+10
tSU;DAT
ｔSU;DAT
：1us
:1µs
Unit
V
V
ns
V
μA
tSU;STO
ｔSU;STO
：2us
:2µs
SCL
SCL
ｔBUF
tBUF
：4us
:4µs
ｔLOW
tLOW
：3us
:3µs
ｔHIGH
tHIGH
：1us
:1µs
SDA
SDA
SCL
: 250kHz
SCL clock
clock frequency
frequency：250kHz
Figure 18. A Command Timing Example in the I2C Data Transmission
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TSZ22111・15・001
10/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
(2) I2C BUS FORMAT
S
1bit
MSB
LSB
Slave Address
8bit
S
Slave Address
MSB
LSB
MSB
LSB
A
Select Address
A
Data
A
P
1bit
8bit
1bit
8bit
1bit 1bit
= Start condition (Recognition of start bit)
= Recognition of slave address. 7 bits in upper order are voluntary.
The least significant bit is “L” due to writing.
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select every of volume, bass and treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
A
Select Address
Data
P
(3) I2C BUS Interface Protocol
(a) Basic Form
S
Slave Address
MSB
LSB
A
Select Address
A
Data
MSB
LSB
MSB
A
P
LSB
(b) Automatic Increment (Select Address increases (+1) according to the number of data.
S
Slave Address
A
Select Address
A
Data1
A
Data2
A ････
DataN
MSB
LSB
MSB
LSB
MSB
LSB
MSB
LSB
(Example) ①Data1 shall be set as data of address specified by Select Address.
②Data2 shall be set as data of address specified by Select Address +1.
③DataN shall be set as data of address specified by Select Address +N-1.
MSB
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.
S Slave Address A
Select Address1 A Data
A Select Address 2 A Data
A
MSB
LSB
MSB
LSB
MSB
LSB MSB
LSB MSB LSB
(Note) If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
A
P
LSB
P
(4) Slave Address
MSB
A6
1
A5
0
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
A4
0
A3
0
A2
0
11/27
A1
0
A0
0
LSB
R/W
0
80H
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
(5) Select Address & Data
Select
Address
(hex)
Items
Initial setup 1
01
Initial setup 2
02
Initial setup 3
Input Selector
03
05
Input gain
06
Volume gain
Fader 1ch Front
Fader 2ch Front
Fader 1ch Rear
Fader 2ch Rear
Fader Subwoofer
Bass setup
Test mode 1
Treble setup
20
28
29
2A
2B
2C
41
44
47
Bass gain
51
Test mode 2
54
Treble gain
57
Loudness Gain
System Reset
75
FE
MSB
Data
D7
D6
Advanced
switch
ON/OFF
0
LPF
Phase
0
0
Mute
ON/OFF
0
0
0
Bass
Boost/
Cut
0
Treble
Boost/
Cut
0
1
D5
D4
Advanced switch
time of Input
Gain/Volume
Tone/Fader/Loudnes
s
LSB
D3
D2
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
Volume Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Bass fo
0
0
0
0
Treble fo
0
0
0
0
0
0
0
Loudness HiCut
0
0
D1
D0
Advanced switch time
of Mute
Subwoofer LPF fc
0
Input selector
0
1
Input Gain
0
0
0
Bass Q
0
0
0
Treble Q
0
0
0
1
Bass Gain
0
0
0
Treble Gain
0
0
Loudness Gain
0
Advanced switch
Note
1.
The advance switch works in the latch part while changing from one function to another.
2.
Upon continuous data transfer, the Select Address rolls back to the first address on the automatic increment
function, as shown below.
→01→02→03→05→06→20→28→29→2A→2B→2C
→41→44→47→51→54→57→75
.
3.
Advanced switch is not used for the function of input selector etc. Therefore, please turn on MUTE when changing
the settings of this side of a set.
4.
When using Mute function when changing input selector, please switch Mute ON/OFF for waiting advanced-mute
time.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Select address 01 (hex)
Time
MSB
D7
0.6msec
1.0msec
1.4msec
3.2msec
Advanced
Switch
ON/OFF
Time
MSB
D7
4.7 msec
7.1 msec
11.2 msec
14.4 msec
Advanced
Switch
ON/OFF
Mode
MSB
D7
OFF
0
ON
1
Advanced switch time of Mute
D5
D4
D3
D2
D1
0
Advanced switch time
0
0
of Input gain/Volume
0
0
1
Tone/Fader/Loudness
1
D6
LSB
D0
0
1
0
1
Advanced switch time of
LSB
Input gain/Volume/Tone/Fader/Loudness
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
Advanced switch
0
0
0
Time of Mute
1
0
1
1
D6
0
Advanced switch ON/OFF
LSB
D5
D4
D3
D2
D1
D0
Advanced switch time
Advanced switch
of Input gain/Volume
0
0
Time of Mute
Tone/Fader/Loudness
Select address 02(hex)
fc
MSB
D7
D6
Subwoofer LPF fc
D5
D4
D3
D2
0
0
0
0
0
0
0
1
OFF
55Hz
85Hz
120Hz
160Hz
Prohibition
LPF Phase
0
Phase
MSB
D7
D6
D5
0°
0
180°
1
0
0
LPF Phase
D4
D3
0
0
D2
D1
0
0
1
1
0
Other setting
D1
LSB
D0
0
1
0
1
0
LSB
D0
Subwoofer LPF fc
Select address 05(hex)
MSB
Input Selector
OUT OUT
Mode
F1/R1 F2/R2
D7
D6
D5
D4
D3
D2
D1
Initial
0
0
0
A
A1
A2
0
0
0
B
B1
B2
0
0
1
C diff CP1
CP2
0
1
1
0
0
0
0
D
D1
D2
1
0
1
E
E1
E2
1
0
1
Input SHORT
1
0
0
Prohibition
Other setting
Input SHORT: The input impedance of each input terminal is lowered from 100kΩ(TYP) to 6 kΩ(TYP).
(For quick charge of coupling capacitor)
LSB
D0
0
1
0
0
0
1
1
: Initial condition
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TSZ22111・15・001
13/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Select address 06 (hex)
Gain
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
MSB
D7
Mute
ON/OFF
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
1
：
1
：
1
Mute ON/OFF
D4
D3
D2
D1
LSB
D0
Fader
D5
0
0
Gain / Attenuation
D4
D3
D2
D1
0
0
0
0
0
0
0
0
LSB
D0
0
1
：
1
1
1
1
：
1
1
1
1
：
0
0
0
0
：
0
0
0
0
：
0
0
1
1
：
0
1
0
1
D6
D5
0
0
Input Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
1
：
：
Prohibition
1
Mode
OFF
ON
MSB
D7
0
1
D6
D5
0
0
Select address 20, 28, 29, 2A, 2B, 2C (hex)
MSB
Vol,
Gain & ATT
D7
D6
0
0
0
0
Prohibition
：
：
0
1
15dB
0
1
14dB
0
1
13dB
0
1
：
：
：
1
Input Gain
-77dB
-78dB
-79dB
1
1
1
1
1
1
1
1
：
0
0
0
0
：
0
0
0
1
：
1
1
1
0
：
1
1
1
0
：
0
1
1
0
：
1
0
1
0
Prohibition
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
1
1
：
0
1
-∞dB
: Initial condition
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Select address 41(hex)
Q factor
MSB
D7
D6
0.5
1.0
1.5
2.0
0
0
fo
MSB
D7
D6
60Hz
80Hz
100Hz
120Hz
0
0
Q factor
MSB
D7
D6
0.75
1.25
0
0
fo
MSB
D7
D6
7.5kHz
10kHz
12.5kHz
15kHz
0
0
D5
Bass
D4
Q factor
D3
D2
Bass fo
0
Bass
D4
0
1
0
1
D5
0
0
1
1
0
fo
D3
D2
0
D1
0
0
1
1
LSB
D0
0
1
0
1
D1
LSB
D0
Bass
Q factor
0
Select address 47 (hex)
Select address 51, 57 (hex)
MSB
Gain
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
Bass/
11dB
Treble
12dB
Boost
13dB
/Cut
14dB
D6
0
15dB
16dB
17dB
18dB
19dB
20dB
D5
Treble
D4
Treble fo
D5
0
0
1
1
Boost
Cut
0
Treble
fo
D4
D3
0
1
0
0
1
：
1
1
MSB
D7
0
1
D6
0
：
1
1
0
D2
D1
0
0
：
1
1
Bass/ Treble Boost/Cut
D5
D4
D3
D2
0
D1
0
Bass/ Treble Gain
D5
D4
D3
D2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
1
0
0
1
1
0
1
1
0
1
1
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
1
0
1
Prohibition
Mode
Q factor
D3
D2
LSB
D0
0
1
LSB
D0
Treble
Q factor
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
1
1
：
0
1
D1
LSB
D0
Bass/Treble Gain
: Initial condition
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Select address 75 (hex)
Mode
MSB
D7
HiCut1
HiCut2
HiCut3
HiCut4
0
Gain
MSB
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
0
D1
LSB
D0
Loudness Gain
D4
D3
D2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
Loudness HiCut
0
1
1
0
1
1
0
1
1
0
1
1
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
1
0
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
：
1
：
1
：
1
D6
0
0
1
1
D5
0
1
0
1
D6
Loudness HiCut
D4
D3
D2
Loudness Gain
D5
Prohibition
：
1
：
1
: Initial condition
(6) About Power ON Reset
The IC has a built-in initialization circuit that triggers at power ON of supply voltage. Please send initial data to all
addresses at supply voltage ON. Also, please turn ON Mute at the set side until this initial data is sent.
Limit
Parameter
Symbol
Unit
Conditions
Typ
Min
Max
Rise Time of VCC
VCC Voltage of Release
Power ON Reset
tRISE
33
－
－
µsec
VPOR
－
4.1
－
V
VCC rise time from 0V to 5V
(7) About External Compulsory Mute Terminal
It is possible to forcibly set MUTE externally by setting the input voltage at the MUTE terminal.
Mute Voltage Condition
Mode
GND to 1.0V
MUTE ON
2.3V to VCC
MUTE OFF
Establish the voltage of MUTE in the condition to be defined.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
Application Information
1.
Function and Specifications
Function
Input selector
Input gain
Mute
Volume
Specifications
・4 Stereo input
・1 Differential input
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Bass
・Q=0.5, 1, 1.5, 2 variable
・fo=60, 80, 100, 120Hz
・Possible to use “Advanced switch” at changing gain
・+20dB to -20dB (1dB step)
Treble
・Q=0.75, 1.25 variable
・fo=7.5k, 10k, 12.5k, 15kHz
・Possible to use “Advanced switch” at changing gain
Fader
・+15dB to -79dB(1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・20dB to 0dB(1dB step)
Loudness
・fo=800Hz
・Possible to use “Advanced switch” for prevention of switching noise.
LPF
・fc=55/85/120/160Hz, pass
・Phase shift (0°/180°)
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/27
TSZ02201-0C2C0E100480-1-2
16.Dec.2015 Rev.001
BD37523FS
2.
Volume / Fader volume attenuation data
(dB)
+15
+14
+13
+12
+11
+10
+9
+8
+7
+6
+5
+4
+3
+2
+1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
-25
-26
-27
-28
-29
-30
-31
-32
D7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D6
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
D5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
D3
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
D2
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
(dB)
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
D7
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D3
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
D2
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
：Initial condition
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BD37523FS
3.
Application Circuit
GND
SDA
SCL
10μ
VCC
OUTF1 OUTF2 OUTR1 OUTR2
0.1μ
10μ
21
20
19
18
17
Fader★
22
10μ
Fader★
23
10μ
Fader★
24
10μ
OUTS
MUTE
10μ
TEST2
TEST1
15
14
16
13
VCC
GND
I2C BUS LOGIC
Fader★
Fader★
Fader
■Fader
Gain:15dB to -79dB/1dB step step
Gain:+15dB～-79ｄB/1dB
★no pop noise
Loudness
■Loudness
20dB to 0dB/1dB step
20dB～0ｄB/1ｄB
step
★no pop noise
・ｆ0=800
・Hicut1/2/3/4
■2 Band P-EQ (Tone control)
Gain：+20dB～-20dB/1dB
Gain:
+20dB to -20dB/1dB
★no pop noise
・Bass：f0=60/80/100/120Hz,
Q=0.5/1.0/1.5/2.0
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain: +15dB to -79dB/1dB step
Gain:+15dB～-79dB/1dB
step
★no pop noise
■Input Gain
Gain: +20dB to 0dB/1dB step
Gain:+20dB～0dB/1dB
step
★no pop noise
LPF
★Loudness
★2 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (4 single-end and 1 stereo ISO)
GND
ISO amp
GND
ISO amp
VCC/2
100k
1
2
10μ
100k
3
2.2μ
Single1
100k
4
2.2μ
100k
5
2.2μ
Single2
250k
6
2.2μ
250k
7
2.2μ
250k
8
10μ
GND Isolation
250k
10
9
2.2μ
250k
1μ
Single3
250k
11
1μ
250k
Unit
R : [Ω]
C : [F]
12
1μ
1μ
Single4
Notes on wiring
① Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
② GND lines should be one-point connected.
③ Wiring pattern of Digital should be away from that of analog unit and crosstalk should not be acceptable.
④ Lines of SCL and SDA of I2C BUS should not be in parallel if possible.
The lines should be shielded, if they are adjacent to each other.
⑤ Lines of analog input should not be parallel if possible. The lines should be shielded, if they are adjacent
to each other.
⑥ TEST pins(14,15), should be OPEN.
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BD37523FS
Power Dissipation
About the thermal design of the IC
Characteristics of an IC are greatly affected by the temperature at which it is used. Exceeding absolute maximum ratings
may degrade and destroy the device. Careful consideration must be given to the heat of the IC from the two standpoints of
immediate damage and long-term reliability of operation.
Reference data
SSOP-A24
Power Dissipation : Pd (W)
1.5
Measurement condition: ROHM Standard board
board Size : 70 x 70 x 1.6(mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
1.0W
1.0
θja = 125°C/W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature : Ta (°C)
Figure 19. Temperature Derating Curve
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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BD37523FS
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal
A terminal for signal input.
The input impedance is 100kΩ (typ).
VCC
2
A1
3
A2
4
B1
5
B2
Description
4.25
100k
GND
A terminal for signal input.
The input impedance is 250kΩ (typ).
VCC
6
CP1
7
CN
8
CP2
9
D1
10
D2
11
E1
12
E2
4.25
250k
GND
A terminal for external compulsory
mute. If terminal voltage is High level, the
mute is OFF. If the terminal voltage is Low
level, the mute is on.
VCC
Vcc
13
MUTE
－
1.65
V
1.65V
GND
GND
A terminal for fader and Subwoofer output.
VCC
16
OUTS
17
OUTR2
18
OUTR1
19
OUTF2
20
OUTF1
4.25
GND
Values in the pin explanation and input/output equivalent circuit are for reference purposes only. It is not a guaranteed value.
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BD37523FS
I/O Equivalence Circuits – continued
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal
Description
Power supply terminal.
21
VCC
8.5
A terminal for clock input of I2C BUS
communication.
VCC
22
SCL
－
1.65V
GND
A terminal for data input of I2C BUS
communication.
VCC
23
SDA
－
1.65V
GND
Ground terminal.
24
GND
0
Voltage for reference bias of analog signal
system. The simple pre-charge circuit and
simple discharge circuit for an external
capacitor are built in.
VCC
50k
1
FIL
4.25
50k
GND
TEST terminal
14
15
TEST
-
Values in the pin explanation and input/output equivalent circuit are for reference purposes only. It is not a guaranteed value.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD37523FS
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 20. Example of monolithic IC structure
13. About a Signal Input Part
(a) About Input Coupling Capacitor Constant Value
In the input signal terminal, please decide the constant value of the input coupling capacitor C(F) that would be
sufficient to form an RC characterized HPF with input impedance R IN(Ω) inside the IC.
G〔dB〕
C〔F〕
0
RIN
〔Ω〕
A(f)
SSH
f〔Hz〕
INPUT
A f  
2 fCRIN 2
2
1  2 fCRIN 
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
14. About Mute Terminal(Pin 13) when power supply is OFF
There should be no applied voltage across the Mute terminal (Pin 13) when power-supply is OFF.
A resistor (about 2.2kΩ) should be connected in series to Mute terminal in case a voltage is supplied to Mute terminal.
(Please refer Application Circuit Diagram.)
15. About TEST Pin
TEST Pin, should be OPEN.
Pin 14, 15 are TEST Pins.
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BD37523FS
Ordering Information
B
D
3
7
5
Part Number
2
3
F
S
Package
FS: SSOP-A24
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A24(TOP VIEW)
Part Number Marking
BD37523FS
LOT Number
1PIN MARK
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BD37523FS
Physical Dimension, Tape and Reel Information
Package Name
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BD37523FS
Revision History
Date
Revision
16.Dec.2015
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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