Solder Profile and Pattern 1) Dip Types (LA, LB ,LAP,LBP series) Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the internal temperature of the LED numeric display does not exceed 100°C. Solder Pattern Example Soldering Example 300 Temperature °C 250 LA-301 series A single wave is better than a double wave, while stationary flow method is the best. 3s or less φ1.5 +0.1 0 land shape φ0.8 +0.1 0 hole shape φ2.0 +0.1 0 land shape φ1.0 +0.1 0 hole shape 260°C or less After soldering, immediately lower the temperature of the substrate 200 150 Preheat 30s or less 100 Other series Conditions General flow conditions 50 0 0 20 40 60 80 Time (s) Item 100 120 140 Conditions Solder dip Solder Temperature At least 2mm from the base of the lead pin. At least 2mm from the base of the lead pin. Power: No more than 30W. Solder iron Process Duration Preheat temperature must be no greater than 80°C. 30 seconds or less No more than 260°C. 3 seconds or less No more than 300°C. 3 seconds or less Reflow cannot be used. (other than the LF-301 series) Reflow ∗Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion. 2) Surface Mount Type (LF-301 series) Please refer to the following reflow soldering profile and pattern examples for surface mount units. Solder Pattern Example LF-301 A/K series D: Peak Temperature 250 1.8 C: Heat Slope 2 200 150 E: 200°C + range 100 (10.4) B: Preheat 14 A: Heat Slope 1 50 0 0 50 100 150 Time (s) 200 250 1.8 Substrate Surface Temperature (°C) Reflow Soldering Example 300 10-0.6 Type A (Heat Slope 1) B (Preheat) C (Heat Slope 2) D (Peak temperature, peak time) E (200°C + range) LF-301A/K series 4°C/s max 140 to 160°C (1 min. or less) 4°C/s max. 250°C max, 5s max. 50s max. P=1.27