Small Signal Switching Diodes CDSL4148-G/4448-G Reverse Voltage: 75 Volts Power Dissipation: 500 mW RoHS Device Features MiniMELF (SOD-80) -Design for mounting on small surface. -High speed switching. -High mounting capability, strong surge withstand, high reliability. 0.020(0.50) 0.012(0.30) -Also available in other standard case: CDSF4148/4448 - SOD323F(1005) size CDSU4148/4448 - SOD523F(0603) size 0.063(1.60) 0.055(1.40) Mechanical data 0.146(3.70) 0.134(3.40) -Case: MiniMELF, glass case. -Terminals: solderable per MIL-STD-750, method 2026. -Polarity: indicated by cathode band. -Approx. weight: 0.05 grams Dimensions in inches and (millimeter) Maximum Ratings and Electrical Characteristics (at Ta=25°C unless otherwise noted) Parameter Repetitive peak reverse voltage Symbol Conditions CDSL4148-G CDSL4448-G Units VRRM 75 V Reverse voltage VR 75 V Forward current IFM Averaged forward current IO Peak surge forward current IFSM Power dissipation PD 300 T=1.0 μS @IF=5mA @IF=10mA @IF=100mA 500 mA 150 mA 2 A 500 mW 1 - 0.72 1 V Maximum forward voltage VF Maximum reverse current IR Maximum reverse recovery time Trr IF=10mA, RL=50Ω, VR=6V 4 nS Typical diode capacitance CJ VR=0V, f=1.0MHz 4 pF Maximum junction temperature TJ 175 °C TSTG -65 to +175 °C Storage temperature @VR=75V 2.5 @VR=25V 0.025 μA REV:B Page 1 QW-B0012 Comchip Technology CO., LTD. Small Signal Switching Diodes RATING AND CHARACTERISTIC CURVES (CDSL4148-G/4448-G) Fig.1 - Forward Characteristics Fig.2 - Reverse Characteristics 10μ 100 TA=150°C TA=-40°C TA=75°C 10 TA=25°C 100n TA=75°C 10n TA=25°C 1n 1 TA=-40°C 0.1n 0 0.5 1.0 1.5 20 0 40 80 60 Forward Voltage, (V) Reverse Voltage, (V) Fig.3 - Capacitance Between Terminals Characteristics Fig.4 - Power Derating Curve 2 100 600 Mounted on glass epoxy PCBs TJ=25°C f=1MHz Power Dissipation, (mW) Capacitance Between Terminals, (pF) TA=125°C 1μ Reverse Current, (A) Forward Current, (mA) 1000 1 500 400 300 200 100 0 0 0 10 20 30 40 50 0 25 50 75 100 125 150 175 Ambient Temperature, (°C) Reverse Voltage, (V) REV:B Page 2 QW-B0012 Comchip Technology CO., LTD. Small Signal Switching Diodes Reel Taping Specification d P0 T P1 E Index hole F W B C P A 12 o 0 D2 D1 D W1 Trailer ....... ....... End Device ....... ....... Leader ....... ....... 10 pitches (min) ....... ....... Start 10 pitches (min) Direction of Feed Mini-MELF Mini-MELF SYMBOL A B C d D (mm) 2.00 Max. 3.90 Max. 2.00 Max. 1.55 ± 0.10 178 ± 1 50.0 Min. 13.0 ± 0.20 (inch) 0.079 Max. 0.154 Max. 0.079 Max. 0.061 ± 0.004 7.008 ± 0.04 1.969 Min. 0.512 ± 0.008 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 8.00 ± 0.30 14.4 Max. (inch) 0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.315 ± 0.012 0.567 Max. D1 D2 REV:B Page 3 QW-B0012 Comchip Technology CO., LTD. Small Signal Switching Diodes Suggested PAD Layout Mini-MELF SIZE (mm) (inch) A 3.40 0.134 B 1.30 0.051 C 1.70 0.067 D 4.70 0.185 E 2.10 0.083 D A E C B Standard Packaging REEL PACK Case Type Mini-MELF REEL Reel Size ( pcs ) (inch) 2,500 7 REV:B Page 4 QW-B0012 Comchip Technology CO., LTD.