SMD Low Capacitance ESD Protection Diode CPDQC5V0USP-HF RoHS Device Halogen Free Features 0402C/SOD-923F - Uni-directional ESD protection. - IEC61000-4-2 Level 4 ESD protection. 0.041(1.05) 0.037(0.95) - Surface mount package. - Low capacitance. 0.026(0.65) 0.022(0.55) - Low Leakage current. - High component density. Mechanical data 0.022(0.55) 0.018(0.45) - Case: 0402C/SOD-923F standard package, molded plastic. 0.012(0.30) 0.008(0.20) - Terminals: Matte tin plated, solderable per MIL-STD-750, method 2026. 0.001(0.02) Max. - Marking Code: Cathode band & 5S - Mounting position: Any. - Weight: 0.001 gram(approx.). 0.022(0.55) 0.018(0.45) Circuit diagram Dimensions in inches and (millimeter) Maximum Rating (at TA=25°C unless otherwise noted) Parameter Conditions Symbol Value Unit Peak pulse power TP = 8/20us PPP 50 W Peak pulse current TP = 8/20us IPP 2.5 A ESD capability IEC 61000-4-2(air) IEC 61000-4-2(contact) ESD ±15 ±8 kV Tj -55~+150 °C TSTG -55~+150 °C Operation temperature range Storage temperature range Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Conditions Working peak reverse voltage Symbol Typ Max Unit VRWM 5 V 1.5 V Forward voltage IF = 10mA VF Diode breakdown voltage IT = 1mA VBR Reverse current VRWM = 5V IR Clamping voltage IPP = 1A, TP = 8/20us IPP = 2.5A, TP = 8/20us VC Junction capacitance VR = 0V, f = 1MHz CJ Min 5.4 V 0.1 0.6 1.0 uA 13 20 V 0.9 pF Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7063 Page 1 Comchip Technology CO., LTD. SMD Low Capacitance ESD Protection Diode RATING AND CHARACTERISTIC CURVES (CPDQC5V0USP-HF) Fig.1 - 8/20us Peak Pulse Current Waveform Acc. IEC 61000-4-5 120% Percentage of Ipp 100% 120 Test Waveform parameters tf=8us td=20us Peak Valur Ipp Mounting on glass epoxy PCBs 100 Power Rating, (%) Ta=25°C Fig. 2 - Power Rating Derating Curve e-t 80% 60% 40% td= t Ipp/2 80 60 40 20 20% 0 0% 0 5 10 15 20 25 0 30 25 50 75 100 125 150 Ambient Temperature, ( °C ) Time, (us) Fig. 4 - Forward Voltage vs. Forward Current Fig.3 - Clamping Voltage Vs. Peak Pulse Current 100 30 Reverse Current, (mA) Clamping Voltage, VC (V) 150°C 25 20 15 10 125°C 10 100°C 75°C 1 50°C 25°C 5 8/20us waveform 0 1.0 0 1.5 2.0 3.0 2.5 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Peak Pulse Current, IPP (A) 1.1 1.2 1.3 Forward Current,IF (mA) Fig.5 - Capacitance Between Terminals Characteristics Capacitance Between Terminals, (PF) 1.0 0.8 0.6 0.4 0.2 0 1 2 3 4 5 Reverse Voltage, (V) Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7063 Page 2 Comchip Technology CO., LTD. SMD Low Capacitance ESD Protection Diode Reel Taping Specification d P0 T P1 E Index hole F W B C P A 12 o 0 D2 D1 D W1 Trailer Device ....... ....... End ....... ....... Leader ....... ....... ....... ....... 160mm (min) Start 400mm (min) Direction of Feed 0402C (SOD-923F) 0402C (SOD-923F) SYMBOL A B C d D D1 D2 (mm) 0.75 ± 0.05 1.17 ± 0.05 0.65 ± 0.05 1.50 + 0.10 - 0 178.00 ± 1.00 60.00 ± 0.50 13.50 ± 0.20 (inch) 0.030 ± 0.002 0.046 ± 0.002 0.026 ± 0.002 0.059 + 0.004 - 0 7.008 ± 0.039 2.362 ± 0.020 0.531 ± 0.008 SYMBOL E F P P0 P1 T W W1 (mm) 1.75 ± 0.10 3.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 0.20 + 0.02 - 0.05 8.00 ± 0.20 12.00 + 0.50 - 0 (inch) 0.069 ± 0.004 0.138 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.008 + 0.001 - 0.002 0.315 ± 0.008 0.472 + 0.020 - 0 Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7063 Page 3 Comchip Technology CO., LTD. SMD Low Capacitance ESD Protection Diode Marking Code Part Number Marking Code CPDQC5V0USP-HF 5S 5S Suggested PAD Layout 0402C/SOD-923F SIZE (mm) (inch) A 0.70 0.028 B 0.40 0.016 C 0.70 0.028 D 1.10 0.043 E 0.30 0.012 D A E C B Standard Packaging REEL PACK Case Type 0402C/SOD-923F REEL Reel Size ( pcs ) (inch) 5,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7063 Page 4 Comchip Technology CO., LTD.