Low Capacitance SMD ESD Protection Diode CPDUR9V0LP-HF RoHS Device Halogen Free Features 0603/SOD-523F - Bi-directional ESD protection. 0.071(1.80) 0.063(1.60) - Surface mount package. - Low leakage current. 0.039(1.00) 0.031(0.80) - High component density. Mechanical data 0.033(0.85) 0.027(0.70) - Case: 0603/SOD-523F standard package, molded plastic. 0.020(0.50) 0.016(0.40) - Terminals: Gold plated, solderable per MIL-STD-750,method 2026. - Marking Code: E9P - Mounting position: Any. 0.030(0.75) 0.026(0.65) - Weight: 0.003 grams(approx.). Dimensions in inches and (millimeter) Circuit Diagram Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Conditions Reverse stand-off voltage Symbol Min Typ VRWM Max Unit 9.0 V 14.4 V Breakdown voltage IR = 5mA VBD Leakage current VR = 9V IR 100 nA Clamping voltage IPP=0.1A , tp=8/20us IPP=0.5A , tp=8/20us VC 16 19 V Peak pulse power tp= 8/20 PPK ESD capability IEC 61000-4-2(air) IEC 61000-4-2(contact) ESD Junction capacitance VR = 0V, f =1MHz Operation temperature range Storage temperature range 9.6 8.5 W 15 8 pF 1.0 CT kV Tj -55 150 °C TSTG -55 150 °C Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7061 Page 1 Comchip Technology CO., LTD. Low Capacitance SMD ESD Protection Diode RATING AND CHARACTERISTIC CURVES (CPDUR9V0LP-HF) Fig.2 - Power Rating Derating Curve Fig.1 - 8/20us Peak Pulse Current Wave Form Acc. IEC 61000-4-5 120% Percentage Of Ipp 100% Peak Valur Ipp e-t 80% 60% 40% Mounting on glass epoxy PCBs 100 Power Rating, (%) Ta=25°C 120 Test Waveform parameters tf=8us td=20us td= t Ipp/2 80 60 40 20 20% 0 0% 0 5 10 15 20 25 0 30 Capacitance Between Terminals, (PF) Clamping Voltage,VC (V) 21 18 15 12 8/20us waveform 9 0.4 0.6 0.8 75 100 125 150 Fig.4 - Capacitance Between Terminals Characteristics Fig.3 - Clamping Voltage Vs. Peak Pulse Current 0.2 50 Ambient Temperature, ( °C ) Time, (us) 0 25 1.0 1.2 2.0 f=1MHz TA=25°C 1.8 1.6 1.4 1.2 1.0 0.8 0 3 6 9 Reverse Voltage, (V) Peak Pulse Current,IPP (A) Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7061 Page 2 Comchip Technology CO., LTD. SMD ESD Protection Diode Reel Taping Specification d P0 P1 T E Index hole F W B P C A 12 o 0 D2 D1 D W1 Trailer Device ....... ....... End ....... ....... Leader ....... ....... ....... ....... 10 pitches (min) Start 10 pitches (min) Direction of Feed 0603 (SOD-523) 0603 (SOD-523) SYMBOL A B C d D D1 D2 (mm) 1.00 ± 0.10 1.85 ± 0.10 1.00 ± 0.10 1.55 ± 0.05 178 ± 1.00 60.0 MIN. 13.0 ± 0.20 (inch) 0.039 ± 0.004 0.073 ± 0.004 0.039 ± 0.004 0.061 ± 0.002 7.008 ± 0.04 2.362 MIN. 0.512 ± 0.008 SYMBOL E F P P0 P1 T W W1 (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 0.23 ± 0.05 8.00 ± 0.20 13.50 MAX. (inch) 0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.009 ± 0.002 0.315 ± 0.008 0.531 MAX. Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7061 Page 3 Comchip Technology CO., LTD. SMD ESD Protection Diode Marking Code Part Number Marking Code CPDUR9V0LP-HF E9P E9P Suggested PAD Layout 0603/SOD-523F SIZE (mm) (inch) A 1.25 0.049 B 0.60 0.024 C 1.00 0.039 D 1.85 0.073 E 0.65 0.026 D A E C B Standard Packaging Case Type 0603/SOD-523F Qty Per Reel Reel Size (Pcs) (inch) 4,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:B QW-G7061 Page 4 Comchip Technology CO., LTD.