SMD Schottky Barrier Diodes ARB751V-40-HF Reverse Voltage: 30V Forward Current: 30mA RoHS Device Halogen Free SOD-323 Features 0.108 (2.75) 0.100 (2.55) -Low current rectifier. 0.014 (0.35) 0.010 (0.25) -Low voltage, low inductance. 0.055 (1.40) 0.047 (1.20) -For power supply. 0.071 (1.80) 0.063 (1.60) -Comply with AEC-Q101 Marking Code: 5 0.006 (0.15) 0.003 (0.08) 0.039 (1.00) MAX. 0.004 (0.10) 0.000 (0.00) Circuit Diagram 0.019 (0.475)REF Dimensions in inches and (millimeter) Maximum Ratings (At Ta=25°C, unless otherwise noted) Symbol ARB751V-40-HF Unit Peak reverse voltage VRM 40 V DC reverse voltage VR 30 V Mean rectifying current IO 30 mA Non-repetitive peak forward surge current @ t=8.3ms IFSM 200 mA Power dissipation PD 200 mW RθJA 500 °C/W Junction temperature TJ 125 °C Storage temperature TSTG -40 ~ +150 °C Parameter Thermal resistance from junction to ambient Electrical Characteristics (At Ta=25°C, unless otherwise noted) Parameter Conditions Symbol Min Typ Max Unit Forward voltage IF = 1 mA VF 0.37 V Reverse current VR = 30 V IR 0.5 μA Capacitance between terminals VR = 1V , f=1MHz CT 2 Company reserves the right to improve product design , functions and reliability without notice. pF REV: A Page 1 AQW-JB008 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes RATING AND CHARACTERISTIC CURVES (ARB751V-40-HF) Fig.1 - Power Derating Curve Fig.2 - Capacitance Characteristics 4 Capacitance Between Terminals, (pF) Power Dissipation, (mW) 250 200 150 100 50 3 2 1 0 0 0 25 50 75 100 125 150 0 10 5 15 20 Ambient Temperature, (°C) Reverse Voltage, (V) Fig.3 - Forward Characteristics Fig.4 - Reverse Characteristics 100 100 10 Reverse Current, (μA) Forward Current, (mA) TJ=25°C f=1MHz TJ=100°C TJ=25°C 1.0 0.1 10 TJ=100°C 1.0 0.1 TJ=25°C 0.01 0.01 0.001 0.0 0.2 0.4 0.6 0.8 1.0 0 Forward Voltage, (V) 5 10 15 20 25 30 Reverse Voltage, (V) Company reserves the right to improve product design , functions and reliability without notice. REV: A Page 2 AQW-JB008 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes Reel Taping Specification 12 o 0 D2 D1 D W1 SOD-323 SOD-323 SYMBOL A B C d D D1 D2 (mm) 1.48 ± 0.05 3.30 ± 0.05 1.25 ± 0.05 1.50 ± 0.10 178 ± 2.00 54.40 ± 1.00 13.00 ± 1.00 (inch) 0.058 ± 0.002 0.130 ± 0.002 0.049 ± 0.002 0.059 ± 0.004 7.008 ± 0.079 2.142 ± 0.039 0.512 ± 0.039 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 + 0.30 /–0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.004 0.158 ± 0.004 0.158 ± 0.004 0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039 Company reserves the right to improve product design , functions and reliability without notice. REV: A Page 3 AQW-JB008 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes Marking Code Part Number Marking Code ARB751V-40-HF 5 5 ▎= The marking bar indicates the cathode. Solid dot “ ” = Halogen Free Suggested PAD Layout A SOD-323 SIZE (mm) (inch) A 2.15 0.085 B 0.70 0.028 C 0.70 0.028 C B Note: 1.General tolerance: ±0.05mm. 2.The pad layout is for reference purposes only. Standard Packaging REEL PACK Case Type SOD-323 REEL Reel Size ( pcs ) (inch) 3,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV: A Page 4 AQW-JB008 Comchip Technology CO., LTD.