DRD2050X34 Rectifier Diode DS6010 – 1 March 2011 (LN28197) FEATURES KEY PARAMETERS Double Side Cooling High Surge Capability VRRM IF(AV) IFSM 3400V 2050A 25800A VOLTAGE RATINGS Part and Ordering Number Repetitive Peak Voltages VRRM V DRD2050X34 DRD2050X32 DRD2050X30 DRD2050X28 DRD2050X26 DRD2050X24 3400 3200 3000 2800 2600 2400 Conditions VRSM = VRRM+100V (See Package Details for further information) ORDERING INFORMATION Fig. 1 Package outline When ordering, select the required part number shown in the Voltage Ratings selection table. For example: DRD2050X34 for a 3400V device 1/6 www.dynexsemi.com DRD2050X34 CURRENT RATINGS Tcase = 75°C unless stated otherwise Symbol Parameter Test Conditions Max. Units 2470 A Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value - 3880 A Continuous (direct) on-state current - 3490 A Test Conditions Max. Units 2050 A IF Half wave resistive load Tcase = 100°C unless stated otherwise Symbol Parameter Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value - 3220 A Continuous (direct) on-state current - 2900 A IF Half wave resistive load SURGE RATINGS Symbol IFSM 2 It Parameter Surge (non-repetitive) on-state current 2 I t for fusing Test Conditions Max. Units 10ms half sine, Tcase = 175°C 25.8 kA VR = 0 3.33 MA s 2 2/6 www.dynexsemi.com DRD2050X34 -3- THERMAL AND MECHANICAL RATINGS Symbol Parameter Test Conditions Min. Max. Units Rth(j-c) Thermal resistance – junction to case Double side cooled DC - 0.018 °C/W Rth(c-h) Thermal resistance – case to heatsink Double side cooled DC - 0.005 °C/W Tvj Virtual junction temperature Blocking VDRM / VRRM -40 175 °C Tstg Storage temperature range -40 175 °C Fm Clamping force 26 34 kN CHARACTERISTICS Symbol Parameter Test Conditions Min. Max. Units VFM Forward voltage At 3000A peak, Tcase = 25°C - 1.55 V IRM Peak reverse current At VDRM, Tcase = 175°C - 150 mA QS Total stored charge - 5000 µC IF = 2000A, dIRR/dt =10A/µs Tcase = 175°C, VR =100V VTO Threshold voltage At Tvj = 175°C - 0.86 V rT Slope resistance At Tvj = 175°C - 0.18 m 3/6 www.dynexsemi.com DRD2050X34 CURVES 10000 4000 3 phase 3500 6 phase 8000 7000 Mean power dissipation - (W) Instantaneous forward current, IF - (A) 9000 1/2 wave Tj=175°C 6000 5000 4000 3000 2000 3000 2500 2000 1500 1000 500 1000 0 0 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 Instantaneous forward voltage,VF - (V) Fig.2 Maximum forward characteristics 0.025 Conditons: Tcase=175°C VR=0 Pulse width = 10ms Double side cooled 0.02 Thermal Impedance Zth(j-c) (°C/W) Surge current, ITSM - (KA) 2500 Fig.3 Dissipation curves 29.0 24.0 500 1000 1500 2000 Mean on-state current, IT(AV) - (A) 0.015 19.0 14.0 0.01 0.005 9.0 0 4.0 1 10 Number of cycles 100 Fig.4 Surge (Non-Repetitive) Forward current vs time 0.001 0.01 0.1 Time ( s ) 1 10 100 Fig.5 Maximum (limit) transient thermal impedancejunction to case 4/6 www.dynexsemi.com DRD2050X34 -5- PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Package outline type code: X Note: Some packages may be supplied with gate and or tags. 5/6 www.dynexsemi.com DRD2050X34 IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:Target Information: Preliminary Information: No Annotation: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. The product design is complete and final characterisation for volume production is in progress.The datasheet represents the product as it is now understood but details may change. The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS CUSTOMER SERVICE DYNEX SEMICONDUCTOR LIMITED Doddington Road, Lincoln, Lincolnshire, LN6 3LF United Kingdom. Phone: +44 (0) 1522 500500 Fax: +44 (0) 1522 500550 Web: http://www.dynexsemi.com Phone: +44 (0) 1522 502753 / 502901 Fax: +44 (0) 1522 500020 e-mail: [email protected] Dynex Semiconductor Ltd. Technical Documentation – Not for resale. 6/6 www.dynexsemi.com