Type Y - Water Cooled Heatsink Type Y Water Cooled Heatsink Advance Information Replaces January 2000 version, DS4390-3.0 DS4390-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six phase bridges or AC controllers. Complete bridges of up to 6 devices can be constructed. Dynex Semiconductor have suitable clamps to build these assemblies and also a comprehensive range of devices to suit a variety of output requirements. See Outline Details for further information. Fig. 1: Heatsink outline APPLICATIONS The type Ywater cooled heatsink is designed to efficiently cool NOTE: Where connectors are screwed into the heatsink 50mm and smaller diameter thyristors, and diodes. It has a 'U' stainless steel is normally used principally for de-ionised water internal waterway system for heat extraction. unless otherwise requested. For brazed in connectors, copper or brass will be used. WATER CONNECTIONS S Plain tube with swaged end brazed into heatsink. Where brazing is used, the braze material is a silver/copper T Plain tube with swaged end screwed into heatsink. eutectic which is suitable for use with de-ionised water supplies P Fir Tree connector brazed into heatsink. with copper water connectors. F Fir Tree connector screwed into heatsink. G Screwed termination for hose screwed into heatsink. H Screw termination for hose brazed into heatsink. THERMAL RATINGS Water Flow Ltr/min 2 4 6 Thermal Resistance 2 Heatsinks for Double Side Cooling Heatsink - Water in ˚C/W 2 Devices and 3 Heatsink Assembly Junction - Water in ˚C/W Dynex Disc Outline Code Dynex Disc Outline Code T E D, F, G D F G 0.0420 0.0350 0.0320 0.0370 0.0295 0.0268 0.0300 0.0218 0.0195 0.0540 0.0432 0.0406 0.0550 0.0442 0.0416 0.0540 0.0432 0.0406 1/3 www.dynexsemi.com Type Y - Water Cooled Heatsink 0.06 G outline F outline P outline 0.07 0.06 0.05 0.04 0.03 0.02 DC thermal resistance (junction to water)- (˚C/W) DC thermal resistance (junction to water)- (˚C/W) 0.08 T outline E outline G, F outline 0.05 0.04 0.03 0.02 0.01 0.01 0 1.0 2.0 3.0 3.0 Water flow - (L/min) 5.0 6.0 Fig. 2: DC thermal resistance junction to water inlet with water flow - 2x devices and 3x heatsinks 0 1.0 2.0 3.0 3.0 Water flow - (L/min) 5.0 6.0 Fig. 3: Thermal resistance with water flow double side cooled - heatsink to water inlet OUTLINE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 12.5 50 32 OD 10 50 Fig. 3: Heatsink outline details 2/3 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com