SMDA05CN-5 Datasheet

SMDA05CN-5 THRU SMDA15CN-5
Bidirectional TVS Array
for Protection of Five Lines
PROTECTION PRODUCTS
Description
Features
‹ 300 watts peak pulse power (tp = 8/20µs)
‹ Transient protection for data lines to
The SMDAxxCN-5 series of transient voltage suppressors are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning.
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TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDAxxCN-5 is designed to provide
transient suppression on multiple data lines and I/O
ports. The low profile SO-8 design allows the user to
protect up to five data and I/O lines with one package.
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Protects up to 5 bidirectional lines
Low operating voltage
Low clamping voltage
Solid-state silicon avalanche technology
Mechanical Characteristics
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The SMDAxxCN-5 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Applications
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Circuit Diagram
RS-232 Data Lines
RS-423 Data Lines
LAN/WAN Equipment
Servers
Notebook and Desktop PC
Set Top Box
Peripherals
Schematic and PIN Configuration
SO-8 (Top View)
Revision 08/15/06
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Pp k
300
Watts
Peak Pulse Current (tp = 8/20µs)
IP P
20
A
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics (T=25oC)
SMDA05CN-5
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
10
µA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20µs
9.8
V
Clamp ing Voltage
VC
IPP = 10A, tp = 8/20µs
11
V
Maximum Peak Pulse Current
IP P
tp = 8/20µs
20
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
350
pF
Symbol
Conditions
Maximum
Units
15
V
6
V
SMDA15CN-5
Parameter
Minimum
Typical
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 15V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20µs
24
V
Clamp ing Voltage
VC
IPP = 10A, tp = 8/20µs
30
V
Maximum Peak Pulse Current
IP P
tp = 8/20µs
10
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
75
pF
 2005 Semtech Corp.
2
16.7
V
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - PPk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
0
1000
25
50
Pulse Waveform
100
125
150
175
Clamping Voltage vs. Peak Pulse Current
110
35
Waveform
Parameters:
tr = 8µs
td = 20µs
90
80
70
e
60
-t
50
40
Waveform
Parameters:
tr = 8µs
td = 20µs
30
Clamping Voltage - VC (V)
100
Percent of IPP
75
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
td = IPP/2
30
20
25
SMDA15CN-5
20
SMDA05CN-5
15
10
5
10
0
0
0
5
10
15
20
25
0
30
 2005 Semtech Corp.
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4
6
8
10
12
14
16
18
20
22
24
Peak Pulse Current - IPP (A)
Time (µs)
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Applications Information
Protection for Four Bidirectional Lines
Device Connection Options for Protection of Four or
Five Data Lines
From Connector
The SMDAxxCN-5 can be configured to protect either
four or five bidirectional data lines. The options for
connecting the devices are as follows:
1. Bidirectional protection of four I/O lines is achieved
by connecting pins 1, 2, 3, and 4 to the data lines.
Pins 5, 6, 7, and 8 are connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces. In this
configuration, the device can withstand the maximum specified transient impulse on four lines
simultaneously.
2. Bidirectional protection of five I/O lines is achieved
by connecting pins 1, 2, 3, 4, and 5 to the data
lines. Pins 6, 7, and 8 are connected to ground.
The ground connection should be made directly to
the circuit board ground plane for best results. In
this configuration, the device can withstand the
maximum rated transient impulse on any two lines
simultaneously.
To Protected IC
Protection for Five Bidirectional Lines
From Connector
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
z
z
Place the TVS near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
 2005 Semtech Corp.
To Protected IC
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Outline Drawing - SO-8
A
h
D
e
N
h
H
2X E/2
E1 E
1
0.25
L
(L1)
e/2
DETAIL
B
01
A
D
aaa C
SEATING
PLANE
A2 A
C
SEE DETAIL
A
.053
.069
.010
.004
.065
.049
.012
.020
.010
.007
.189 .193 .197
.150 .154 .157
.236 BSC
.050 BSC
.010
.020
.016 .028 .041
(.041)
8
8°
0°
.004
.010
.008
1.35
1.75
0.10
0.25
1.25
1.65
0.31
0.51
0.17
0.25
4.80 4.90 5.00
3.80 3.90 4.00
6.00 BSC
1.27 BSC
0.25
0.50
0.40 0.72 1.04
(1.04)
8
0°
8°
0.10
0.25
0.20
SIDE VIEW
A1
bxN
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
A
A1
A2
b
c
D
E1
E
e
h
L
L1
N
01
aaa
bbb
ccc
c
GAGE
PLANE
2
ccc C
2X N/2 TIPS
DIM
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AA.
Land Pattern - SO-8
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
INCHES
MILLIMETERS
(.205)
.118
.050
.024
.087
.291
(5.20)
3.00
1.27
0.60
2.20
7.40
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
 2005 Semtech Corp.
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Ordering Information
Part Number
Lead
Finish
Qty per Reel
Reel Size
SMDA05CN-5.TB
SnPb
500
7 Inch
SMDA15CN-5.TB
SnPb
500
7 Inch
SMDA05CN-5.TBT
Pb Free
500
7 Inch
SMDA15CN-5.TBT
Pb Free
500
7 Inch
SMDA05CN-5
SnPb
95/Tube
N/A
SMDA15CN-5
SnPb
95/Tube
N/A
SMDA05CN-5.T
Pb Free
95/Tube
N/A
SMDA15CN-5.T
Pb Free
95/Tube
N/A
Note: Lead-free devices are RoHS/WEEE Compliant
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2005 Semtech Corp.
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