SMDA05CN-5 THRU SMDA15CN-5 Bidirectional TVS Array for Protection of Five Lines PROTECTION PRODUCTS Description Features 300 watts peak pulse power (tp = 8/20µs) Transient protection for data lines to The SMDAxxCN-5 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxCN-5 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-8 design allows the user to protect up to five data and I/O lines with one package. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Protects up to 5 bidirectional lines Low operating voltage Low clamping voltage Solid-state silicon avalanche technology Mechanical Characteristics The SMDAxxCN-5 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications Circuit Diagram RS-232 Data Lines RS-423 Data Lines LAN/WAN Equipment Servers Notebook and Desktop PC Set Top Box Peripherals Schematic and PIN Configuration SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts Peak Pulse Current (tp = 8/20µs) IP P 20 A Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) SMDA05CN-5 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 10 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 10A, tp = 8/20µs 11 V Maximum Peak Pulse Current IP P tp = 8/20µs 20 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 350 pF Symbol Conditions Maximum Units 15 V 6 V SMDA15CN-5 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 10A, tp = 8/20µs 30 V Maximum Peak Pulse Current IP P tp = 8/20µs 10 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 75 pF 2005 Semtech Corp. 2 16.7 V www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - PPk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 0 1000 25 50 Pulse Waveform 100 125 150 175 Clamping Voltage vs. Peak Pulse Current 110 35 Waveform Parameters: tr = 8µs td = 20µs 90 80 70 e 60 -t 50 40 Waveform Parameters: tr = 8µs td = 20µs 30 Clamping Voltage - VC (V) 100 Percent of IPP 75 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) td = IPP/2 30 20 25 SMDA15CN-5 20 SMDA05CN-5 15 10 5 10 0 0 0 5 10 15 20 25 0 30 2005 Semtech Corp. 2 4 6 8 10 12 14 16 18 20 22 24 Peak Pulse Current - IPP (A) Time (µs) 3 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Applications Information Protection for Four Bidirectional Lines Device Connection Options for Protection of Four or Five Data Lines From Connector The SMDAxxCN-5 can be configured to protect either four or five bidirectional data lines. The options for connecting the devices are as follows: 1. Bidirectional protection of four I/O lines is achieved by connecting pins 1, 2, 3, and 4 to the data lines. Pins 5, 6, 7, and 8 are connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. In this configuration, the device can withstand the maximum specified transient impulse on four lines simultaneously. 2. Bidirectional protection of five I/O lines is achieved by connecting pins 1, 2, 3, 4, and 5 to the data lines. Pins 6, 7, and 8 are connected to ground. The ground connection should be made directly to the circuit board ground plane for best results. In this configuration, the device can withstand the maximum rated transient impulse on any two lines simultaneously. To Protected IC Protection for Five Bidirectional Lines From Connector Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 2005 Semtech Corp. To Protected IC Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 4 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Outline Drawing - SO-8 A h D e N h H 2X E/2 E1 E 1 0.25 L (L1) e/2 DETAIL B 01 A D aaa C SEATING PLANE A2 A C SEE DETAIL A .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 SIDE VIEW A1 bxN bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc c GAGE PLANE 2 ccc C 2X N/2 TIPS DIM C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G C G P X Y Z Z Y DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 2005 Semtech Corp. 5 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Ordering Information Part Number Lead Finish Qty per Reel Reel Size SMDA05CN-5.TB SnPb 500 7 Inch SMDA15CN-5.TB SnPb 500 7 Inch SMDA05CN-5.TBT Pb Free 500 7 Inch SMDA15CN-5.TBT Pb Free 500 7 Inch SMDA05CN-5 SnPb 95/Tube N/A SMDA15CN-5 SnPb 95/Tube N/A SMDA05CN-5.T Pb Free 95/Tube N/A SMDA15CN-5.T Pb Free 95/Tube N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 6 www.semtech.com