PANASONIC MAU2D30

This product complies with RoHS Directive (EU 2002/95/EC).
Schottky Barrier Diodes (SBD)
MAU2D30
Silicon epitaxial planar type
For high speed switching circuits
0.075±0.05
M
Di ain
sc te
on na
tin nc
ue e/
d
 Absolute Maximum Ratings Ta = 25°C
Repetitive peak reverse voltage
VRRM
Forward current (Average)
IF(AV)
Peak forward current
IFM
Non-repetitive peak forward surge current *
IFSM
Junction temperature
Tj
Storage temperature
Tstg
30
V
30
V
100
mA
200
mA
1
A
125
°C
–55 to +125
°C
5°
1: Anode
2: Cathode
Parameter
Symbol
VF1
Forward voltage
Conditions
Min
Typ
Max
Unit
IF = 10 mA
0.38
0.44
V
IF = 100 mA
0.51
0.58
V
VR = 10 V
0.3
µA
VR = 30 V
2
µA
ue
VF2
USSMini2-F1 Package
Marking Symbol: 1D
Note) *: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
 Electrical Characteristics Ta = 25°C±3°C
0.38+0.02
–0.03
VR
2
0.2+0.05
–0.02
Unit
0 to 0.02
Reverse voltage
Rating
on
tin
IR1
Reverse current
isc
IR2
ce
/D
Terminal capacitance
en
an
Reverse recovery time *
Ct
trr
0.15 max.
Symbol
di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
htt visit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
Parameter
5°
1
 Optimum for high-density mounting
 Extremely low reverse current IR
 Short reverse recovery time trr
Unit: mm
0.13+0.05
–0.02
1.0±0.05
 Features
0.85±0.05
0.60±0.05
VR = 0 V, f = 1 MHz
9
pF
IF = IR = 10 mA, Irr = 10 mA,
RL = 100 Ω
1
ns
Ma
int
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage
of current from the operating equipment.
3. Absolute frequency of input and output is 250 MHz
4. *: trr measurement circuit
Bias Application Unit (N-50BU)
Input Pulse
tp
tr
10%
A
Pulse Generator
(PG-10N)
Rs = 50 Ω
Publication date: September 2006
VR
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
SKH00158AED
90%
tp = 2 µs
tr = 0.35 ns
δ = 0.05
Output Pulse
t
IF
trr
t
Irr = 10 mA
IF = IR = 10 mA
RL = 100 Ω
1
2
an
en
ue
on
tin
isc
ce
/D
10
10−3
0
25°C
1
−25°C
10−2
10−2
10−3
0.2
0.4
Reverse current IR (µA)
Ta = 75°C
0.6
Forward voltage VF (V)
Reverse voltage VR (V)
di
p
Pl
lan nclu
ea
e
se
pla m d m des
ne ain ain foll
htt visit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
int
Ma
10−1
Forward current IF (mA)
M
Di ain
sc te
on na
tin nc
ue e/
d
MAU2D30_ IF - VF
IF  VF
103
102
1
10−4
0
Ta = 75°C
10−1
25°C
−25°C
10
20
SKH00158AED
Terminal capacitance Ct (pF)
This product complies with RoHS Directive (EU 2002/95/EC).
MAU2D30
MAU2D30_ IR - VR
IR  VR
30
MAU2D30_ Ct - VR
10
102
Ct  VR
40
1
0
Ta = 25°C
10
Reverse voltage VR (V)
10
20
30
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
M
Di ain
sc te
on na
tin nc
ue e/
d
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
d
pla inc
ne lud
se
pla m d m es
v
ne ain ain foll
htt isit
d te t o
p:/ fo
/w llo dis disc nan enan wing
ww wi co on ce c fo
.se ng ntin tin ty e ty ur
mi UR ue ued pe pe Pro
co L a d t ty
du
n.p bo yp pe
ct
life
an ut e
d
as lat
cy
on es
cle
ic. t in
sta
co fo
ge
.jp rm
.
/en at
i
o
/
n.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
Pl
ea
Ma
int
en
an
ce
/D
isc
on
tin
ue
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.