COPPER WIRE BONDING Data Sheet Copper Wire Benefits J-Devices has extensive experience in Cu wire products dating back to 2007, resulting in mature and capable Cu wire bonding capability. J-Devices' Cu wire products have excellent quality and reliability on par with Au wire. Customers receive the same or better quality, reliability and electrical performance at an attractive price. Wire Diameter (μm) 50 30 25 20 18 15 13 3D Electrical Parasitic Parameters Wire Length = 1 mm R11 (mΩ) @ 1 GHz Au wire Cu wire 78.7 67.2 116.7 99.3 136.8 116.1 166.9 141.4 184.0 155.8 218.6 184.9 250.9 212.0 C11 (pF) Au wire Cu wire 0.125 0.125 0.091 0.091 0.083 0.083 0.076 0.076 0.072 0.072 0.068 0.068 0.064 0.064 L11 (nH) Au wire Cu wire 0.523 0.523 0.632 0.632 0.668 0.668 0.716 0.716 0.736 0.736 0.773 0.773 0.802 0.802 Wire Diameter: 18 μm Minimum Bond Pad Size by Wire Diameter (T = Bond Pad Metal Thickness) Wire Diameter (μm) Recommended 13 15 18 20 1.0 ≤ T ≤ 1.5 μm BPO BPP > 33 > 40 > 38 > 45 > 38 > 45 > 53 > 60 1.6 ≤ T ≤ 2.0 μm BPO BPP > 38 > 45 > 38 > 45 > 43 > 50 > 64 > 80 2.1 ≤ T ≤ 3.0 μm BPO BPP > 38 > 45 > 43 > 50 > 53 > 60 > 64 > 80 TSJD404A Rev Date: 5/15 www.j-devices.co.jp COPPER WIRE BONDING Data Sheet Wafer Technology Node and Cu Wire Readiness Wafer Technology Node > 65 nm 65/55 nm 40/32 nm 28 nm Non-Low-K or Low-K Low-K Low-K Ultra Low-K Ultra Low-K Reliability Status Customer Qualified Customer Qualified Customer Qualified Customer Qualified Production Status HVM HVM HVM Package Family and Wire Diameter HVM Wire Diameter: 20 μm Package Family Wire Diameter QFN 18, 20, 25, 30 μm LQFP 18, 20, 23, 30 μm FBGA 15, 18, 20, 23 μm PBGA 18, 20, 23 μm HZIP 35, 50 μm Reliability Qualification Evaluation Category FBGA 121-pin/6 mm Pkg Pad Pitch: 45 μm Cu Wire (PCC) φ18 μm Conditions MSL TC -65/175°C 500 cycles 2000 hours 175°C 1000 hours HAST PCT THB # Failure Conditions JEDEC Level 3 150°C HTSL FBGA 177-pin/13 mm Pkg Pad Pitch: 45 μm Cu Wire (PCC) φ18 μm 110°C/85％/Bias 264 hours JEDEC Level 3 – -55/125°C 0/231 pcs (3 Lot) 500 cycles 150°C 0/45 pcs (1 Lot) 1000 hours 0/45 pcs (1 Lot) – 0/231 pcs (3 Lot) – 121°C/2.0 atm/100% 0/231 pcs (3 Lot) 96 hours – # Failure – – 110°C/1.2 atm/85% – 500 hours 85°C/85%/bias 1000 hours LQFP 100-pin/14 mm Pkg Pad Pitch: 60 μm Cu Wire (PCC) φ20 μm Conditions # Failure JEDEC Level 3 0/165 pcs (3 Lot) 0/100 pcs (3 Lot) – – -65/175°C 500 cycles 150°C 2000 hours 175°C 1000 hours 110°C/85％/Bias 264 hours 0/231 pcs (3 Lot) 0/45 pcs (1 Lot) 0/45 pcs (1 Lot) 0/231 pcs (3 Lot) 0/165 pcs 121°C/2.0 atm/100% 0/231 pcs (3 Lot) (3 Lot) 96 hours 0/100 pcs (3 Lot) – – – With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. TSJD404A Rev Date: 5/15 www.j-devices.co.jp