JD FBGA Data Sheet

LAMINATE
Data Sheet
FBGA
Features
Fine Pitch BGA Packages (FBGA)
J-Devices wide array of FBGA portfolio can provide
a solution for most any customer need.
• Body size line-up covers 3 mm up to 22 mm
• Minimum BGA pitch is 0.35 mm
• Multi die integration is available with both
side-by-side and stack-up type
Applications
• Cell phones, games, handheld devices, memory,
automotive, computer and industrial applications
• Applications where low profile, lightweight,
minimum space, low cost and high density
package is required
• Low cost option using J-Device standard FBGA bill
of materials selection
• 3-22 mm body size
• Square or rectangle packages available
• 25-900 ball counts
• 1.0-0.35 mm ball pitch
• 2 and 4 layers substrate available
• 0.5-1.7 mm total package thickness
• JEDEC MO-216 compliant for 0.8 mm & 1.0 mm
ball pitch
• JEDEC MO-195 compliant for 0.5 mm & 0.65 mm
ball pitch
• JEDEC MO-298 compliant for 0.4 mm ball pitch
• RoHS-6 (green) BOM options for 100% of
FBGA family
Thermal Performance
Process Highlights
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Die thickness: 0.05-0.25 mm
Marking: Laser mark
Wafer back grinding: Available
Encapsulated SMT components: Available
Micro Pb-free covered LGA Pads/LGAs: Available
θJA at 1.0W 0 Airflow (°C/W)
Body Size
(mm)
LFBGA
TFBGA
VFBGA
5x5
44.39
44.58
45.29
10 x 10
23.23
23.28
24.61
15 x 15
20.49
20.54
21.37
*Additional thermal data available
Reliability Qualification
• Moisture Sensitivity: Pre-condition of 30°C/60%
RH,192 hours, IR reflow 260°C 3X
• Temp/Humidity Bias: 85°C/85% RH, 1000 hours
• Temp/Humidity Unbiased: 110°C/85% RH,
500 hours
• Temp Cycle: -55°C/+125°C, 1000 cycles
• High Temp Storage: 150°C, 1000 hours
*Board level reliability available
DSJD405A
Rev Date: 5/15
www.j-devices.co.jp
LAMINATE
Data Sheet
FBGA
Standard Materials
Test Services
• Package substrate
– Conductor: Cu
– Dielectric: Epoxy resin glass reinforced
• Die attach: Adhesive low stress elastomer
• Mold compound: Epoxy mold compound
• Low alpha material: Available
• Solder ball: Pb-free
• Wire type: Au, Cu
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Program conversion
Product engineering
Wafer sort
256 pin x 20 MHz test system available
Burn-in capability
Tape and reel services
Shipping
• JEDEC outline trays, tape & reel
With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale.
J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved.
DSJD405A
Rev Date: 5/15
www.j-devices.co.jp