RClamp0524PQ Low Capacitance RailClamp® 4-Line Surge and ESD Protection PROTECTION PRODUCTS Description Features RailClamp® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). • Transient Protection to s IEC 61000-4-2 (ESD) 25kV (Air), 15kV (Contact) s IEC 61000-4-4 (EFT) 4kV (5/50ns) s IEC 61000-4-5 (Lightning) 5A (8/20µs) s ISO-10605 (ESD) 20kV (Air), 12kV (Contact) • Qualified to AEC-Q100, Grade 1 • Protects four High-Speed Data Lines • Working Voltage: 5V • Low Capacitance: 0.8 pF Maximum (I/O to GND) • Dynamic Resistance: 0.43 Ohms (Typ) • Solid-State Silicon-Avalanche Technology RClamp0524PQ has a typical capacitance of only 0.3 pF between I/O pins. This allows it to be used on circuits operating in excess of 3GHz with no significant signal attenuation. ESD characteristics are highlighted by high ESD withstand voltage (+/-15kV per IEC 61000-4-2) and low dynamic resistance (0.43 Ohms typical). Each device will protect four lines operating at 5 volts RClamp0524PQ is in a 10-pin SLP2510P8 package and is qualified to AEC-Q100, Grade 1 (-40 to +125 oC) for automotive applications. It measures 2.5 x 1.0 mm with a nominal height of only 0.58 mm. The leads are finished with lead-free NiPdAu. The flow- through package design simplifies PCB layout. Nominal Dimension Mechanical Characteristics • • • • • • • SLP2510P8 Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 2.5 x 1.0 x 0.58 mm Lead Finish: NiPdAu Molding Compound Flammability Rating: UL 94V-0 Marking : Marking Code + Date Code Packaging : Tape and Reel Applications • • • • • • Automotive Applications Industrial Equipment HDMI Digital Visual Interface MDDI Ports PCI Express Functional Schematic !,"$ #,$$ & $ + % $,"% %$+ @6&6 A *.0 !"#$ %.#. $ Device Schematic Nominal Dimensions in mm RClamp0524PQ Final Datasheet Revision date www.semtech.com Rev 2.0 June 22, 2015 1 of 10 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 75 W Peak Pulse Current (tp = 8/20µs) IPP 5 A VESD ±15 ±25 kV ESD per ISO-10605 (Contact)(2) ESD per ISO-10605 (Air)(2) VESD ±12 ±20 kV Operating Temperature TJ -40 to +125 O C Storage Temperature TSTG -55 to +150 O C ESD per IEC 61000-4-2 (Contact) ESD per IEC 61000-4-2 (Air)(1) (1) Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Reverse Stand-Off Voltage Reverse Breakdown Voltage VRWM -40OC to 125OC Any I/O pin to GND VBR It = 10mA, Any I/O pin to GND Min. -40OC to 125OC 6.5 Typ. 9 T = 25OC Max. Units 5 V 11 V 0.1 μA 0.25 μA Reverse Leakage Current IR Clamping Voltage(3) VC IPP = 1A, tp = 8/20µs, Any I/O pin to GND 12 V Clamping Voltage(3) VC IPP = 5A, tp = 8/20µs, Any I/O pin to GND 15 V ESD Clamping Voltage(4) VC IPP = 4A, tp = 0.2/100ns (TLP) Any I/O pin to GND 12 V ESD Clamping Voltage(4) VC IPP = 16A, tp = 0.2/100ns (TLP) Any I/O pin to GND 17 V Dynamic Resistance(4), (5) RDYN tp = 0.2/100ns (TLP) Any I/O pin to GND 0.43 Ohms Junction Capacitance CJ VRWM = 5V VR = 0V, f = 1MHz Any I/O pin to GND VR = 0V, f = 1MHz Between I/O pins O T = 125 C T = 25OC 0.4 0.8 T=125OC 1.2 1.5 T = 25 C 0.3 0.4 T = 125OC 0.5 0.7 O pF Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: 330pF, 330Ω. (3): Measured using an 8/20us constant current source. (4): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (5): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp0524PQ Final Datasheet Revision Date www.semtech.com Rev 2.0 June 22, 2015 2 of 10 Semtech Typical Characteristics Power Derating Curve Non-Repetitive Peak Pulse Power vs. Pulse Time 120 10 DR040412-75 TA = 25OC % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 80 60 40 20 DR040512:25:125:150 0.01 0.1 1 10 100 0 1000 0 Pulse Duration - tp (µs) 25 125 150 TLP IV Curve (Positive Pulse) 8/20us Surge Clamping Characteristic 30 20 TA = 25OC Waveform 8x20us Any Pin to GND TA = 25OC Any Pin L-G tP = 100ns, tR = 0.2ns tMEAS = 70-90ns RDYN = 0.43Ω (4A-16A Best Fit) 25 15 20 DUT Current (A) Peak Clamping Voltage - VC (V) 50 75 100 Ambient Temperature - TA (OC) 10 15 10 5 5 RC0524PQ_AR_TLP_POS RC0524PQ_AR_8_20 LG 0 0 0 1 2 3 4 5 6 7 8 0 9 5 10 Peak Pulse Current - IPP (A) ESD Clamping (+8kV Contact per IEC 61000-4-2) 20 25 ESD Clamping (-8kV Contact per IEC 61000-4-2) 0 160 TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. 120 -50 Clamping Voltage - VC (V) 140 Clamping Voltage - VC (V) 15 DUT Voltage (V) 100 80 60 40 -100 TA = 25OC. Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. -150 -200 20 RC0524PQ_AR_P8_ESD -20 RClamp0524PQ Final Datasheet Revision Date 0 20 40 Time (ns) 60 80 100 www.semtech.com Rev 2.0 June 22, 2015 RC0524PQ_AR_N8_ESD -250 0 -20 0 20 40 60 80 100 Time (ns) 3 of 10 Semtech Typical Characteristics (Continued) ESD Clamping (+12kV Contact per ISO-10605 330pF, 330Ω) ESD Clamping (-12kV Contact per ISO-10605 330pF, 330Ω) 200 0 Clamping Voltage - VC (V) Clamping Voltage - VC (V) -50 TA = 25OC. Waveform ISO10605 +12kV. R = 330Ω; C = 330pF Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. 150 100 50 -100 -150 TA = 25OC. Waveform ISO10605 -12kV. R = 330Ω; C = 330pF Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. -200 -250 RC0524PQ_AR_ISO330330_P12_ESD RC0524PQ_AR_ISO330330_N12_ESD 0 -300 -20 0 20 40 Time (ns) 60 80 100 -20 0 20 40 Time (ns) 60 80 100 Capacitance vs. Temperature Capacitance vs. Reverse Voltage 0.7 1.5 VR = 0V f = 1MHz 0.6 Capacitance - CJ (pF) Capacitance - CJ (pF) 0.5 0.4 0.3 L-G L-L 1.0 0.5 0.2 TA = 25OC. f = 1 MHz. Any Pin L-G 0.1 RC0524PQ_AR_CJvT RC0524PQ_AR_CAPvV 0.0 0.0 0 1 2 3 4 5 6 -50 0 50 Temperature (OC) Reverse Voltage - VR (V) Insertion Loss - S21 100 150 Breakdown Voltage (VBR) vs. Temperature 11.0 0 IBR = 10mA L-G IBR = 10mA L-L -2 Breakdown Voltage - VBR (V) Insertion Loss - IL (dB) 10.5 -4 -6 10.0 9.5 -8 RC0524PQ_AR_VBRvT RC0524PQ_AR_IL 9.0 -10 0 RClamp0524PQ Final Datasheet Revision Date 2 4 6 Frequency (GHz) 8 10 www.semtech.com Rev 2.0 June 22, 2015 -50 0 50 Temperature (OC) 100 150 4 of 10 Semtech Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 2. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. The area ratio of a rectangular aperture is given as: Recommended Stencil Design $,"$ $,!" $,!$ (1( * )1( * #,"" $,!$ $,5C" $,:$ !"#$ %.5. $ Table 2 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular Solder Stencil Thickness 0.100mm (0.004”) 0.125mm (0.005”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm - 0.125mm for this device. The stencil should be laser cut with electro-polished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. Due to the small aperture size, a solder paste with Type 4 or smaller particles is recommended. Assuming a 125um thick stencil, the aperture dimensions shown will yield an area ratio of 0.72 for the small pads and 1.25 for the large. RClamp0524PQ Final Datasheet Revision Date Design Recommendations for HDMI Protection Adding external ESD protection to HDMI ports can be challenging. First, ESD protection devices have an inherent junction capacitance and adding even a small amount of capacitance will cause the impedance of the differential pair to drop. Second, large packages and land pattern requirements cause discontinuities that adversely affect signal integrity. The RClamp0524PQ is specifically designed for protection of high-speed interfaces such as HDMI. It presents <0.4pF capacitance between the pairs while being rated to handle >±8kV ESD contact discharges (>±15kV air discharge) as outlined in IEC 61000-4-2. Each device is in a leadless SLP package that is less than 1.1mm wide. It is designed such that the traces flow straight through the device. The narrow package and flow-through design reduces discontinuities and minimizes impact on signal integrity. This becomes more critical as signal speeds increase. www.semtech.com Rev 2.0 June 22, 2015 5 of 10 Semtech Applications Information Pin Configuration Figure 1 is an example of how to route the high speed differential traces through the RClamp0524PQ. The solid line represents the PCB trace. The PCB traces are used to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example, line 1 enters at pin 1 and exits at Pin 10 and the PCB trace connects pin 1 and 10 together. This is true for lines connected at pins 2, 4, and 5 also. Ground is connected at pins 3 and 8. One large ground pad should be used in lieu of two separate pads. A 1 ,2 Figure 2 - TDR Measurement with 200ps risetime using Semtech Evaluation Board & &$ && & plenty of margin (98.3Ω at 1.79 ns). Figure 3 shows a typical HDMI 1.4 eye pattern at 1080p resolution. As shown there are no violations of the eye pattern with RClamp0524PQ in the circuit. The RClamp0524PQ may also be used to protect the remaining lines (I2C, CEC, and hot plug). A 4 0 / & # % + A A * $ & %$+ @606 Figure 1. Flow through Layout Using RClamp0524PQ TDR Measurements for HDMI The combination of low capacitance, small package, and flow-through design means it is possible to use these devices to meet the HDMI impedance requirements of 100 Ohms ±15% without any PCB board modification. Figure 3 shows a typical impedance test result for a TDR risetime of 200ps using a Semtech evaluation board with 100 Ohm traces throughout. Measurements were taken using a TDR method as outlined in the HDMI Compliance Test Specification (CTS). In each case, the device meets the HDMI CTS requirement of 100 Ohm ±15% with RClamp0524PQ Final Datasheet Revision Date Figure 3 - HDMI 1.4 Eye Pattern with RClamp0524PQ www.semtech.com Rev 2.0 June 22, 2015 6 of 10 Semtech Applications Information Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: • Place the device as close to the connector as possible. this practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. • The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. • Avoid running critical signals near board edges. , $E , $6 , &E , &6 A 1 ,2 A ! ! , E , 6 , D FE , D F6 A D A 1 %7 3 A A %$+ @646 Figure 4. HDMI 1.4 Application using RClamp0524PQ RClamp0524PQ Final Datasheet Revision Date www.semtech.com Rev 2.0 June 22, 2015 7 of 10 Semtech Outline Drawing - SLP2510P8 # ? 7 7 7 7 & 7 7 77 = $,"$ $,"%$ $,5" # $,$$ $,$9 $,$" ! ?$,#9A $,#" $,!$ $,!" # $,9" $,:$ $,:" !,:$ !,"$ !,5$ $,>$ #,$$ #,#$ $,"$ $,9$ $,9% $,:9 % $,$% $,#$ & @A & ; # !"#$ %.!. $ !B # 7 $,#!" # B ! 4! !B $,$C" C ) B 4! # & ' & ; 7 7 7 7 & 4 ; ; Land Pattern - SLP2510P8 G 7 7 7 ; ? A ; E = # = =# E G =# & ' #, & !, &< D &E D 7 D &D RClamp0524PQ Final Datasheet Revision Date ; 7 && 7 D ; ;D !"#$ %.9. $ 7 &D 7 & ? ; D E, ;; D & D E D 7 &, www.semtech.com Rev 2.0 June 22, 2015 7 & ?$,%C"A $,!$ $,"$ #,$$ $,!$ $,:$ $,5C" #,"" ; 7 A, EF 8 of 10 Semtech Marking Code %$+ BBCC %$+ @6%6 Notes: Dot indicates pin 1 location Tape and Reel Specification H$,#$ .$,$$ H$,9$ .$,#$ & . !"#$ %.". $ & ' #, 7 7 7 & D &< 1 < 5 %$+ BBCC %$+ BBCC &D 3 ) - 1 = ) %$+ @6#6 Ordering Information Part Number Qty per Reel Reel Size RClamp0524PQTCT 3,000 7” RClamp0524PQ Final Datasheet Revision Date www.semtech.com Rev 2.0 June 22, 2015 9 of 10 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp0524PQ Final Datasheet Revision date 2.0 June 22, 2015 10 of 10 Semtech