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Datasheet
6-Channel White LED Driver
for up to 72 LEDs
BD6583MUV-A
●General Description
BD6583MUV-A is white LED driver IC with PWM
step-up DC/DC converter that can boost max 42.5V
and current driver that can drive max 25mA. The wide
and precision brightness can be controlled by external
PWM pulse. BD6583MUV-A has very accurate current
drivers, and it has few current errors between each
strings. So, it will be helpful to reduce brightness spots
on the LCD. Small package type is suited for saving
space.
●Key Specifications
 Operating power supply voltage range: 2.7V to 22.0V
 LED Maximum Current:
25mA (Max.)
 Quiescent Current 1:
0.6μA (Typ.)
Quiescent Current 2:
4.6μA (Typ.)
 Operating temperature range:
-30℃ to +85℃
●Package W(Typ.) x T(Typ.) x H(Max.)
●Features
 High efficiency PWM step-up DC/DC converter
(fsw=1MHz), max efficiency 93%
 High accuracy & good matching (±3%) current
drivers 6ch
*
 Drive up to 12 in series, 6 strings in parallel =72
white LEDs (*white LED Vf=3.5Vmax)
 Rich safety functions
▪ Over-voltage protection (OVP)
▪ Over current limit
▪ External SBD open detect
▪ Thermal shutdown
VQFN024V4040
4.00mm x 4.00mm x 1.00mm
Figure 1. Package
●Applications
All middle size LCD equipments backlight of Notebook
PC, portable DVD player, car navigation systems, etc.
●Typical Application Circuit
Battery
4.7μH
10μF
10LED x 6parallel
2.2μF
RTR020N05
SW
FAILSEL VDET
SENSP
100mΩ
SENSN
Power
ON/OFF
RSTB
BD6583MUV-A
LED1
PWMPOW
LED2
PWMDRV
200Hz
PWM
LED3
VBAT
LED4
VREG
LED5
1μF
GND GNDGNDGNDTEST ISETH ISETLLED6
24kΩ
Each 20mA
Figure 2.Figure
Typical
Circuit Circuit
2.Application
Typical Application
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BD6583MUV-A
●Absolute Maximum Ratings (Ta=25 ℃)
Parameter
Symbol
Ratings
Unit
Terminal voltage 1
VMAX1
7
V
TEST,VREG,SENSP,SENSN,SW,RSTB,
PWMPOW,PWMDRV,FAILSEL,ISETH,ISETL
Terminal voltage 2
VMAX2
25
V
LED1, LED2, LED3, LED4, LED5, LED6, VBAT
Terminal voltage 3
VMAX3
50.5
V
VDET
Power dissipation 1
Pd1
500
mW
*1
Power dissipation 2
Pd2
780
mW
*2
Power dissipation 3
Pd3
1510
mW
*3
Operating temperature range
Topr
-30 to +85
℃
-
Storage temperature range
Tstg
-55 to +150
℃
-
(*1)
(*2)
(*3)
Condition
Reduced 4.0mW/ ℃ With Ta>25 ℃ when not mounted on a heat radiation Board.
1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm2, When it’s used by more than Ta=25 ℃, it’s reduced by 6.2mW/ ℃.
4 layer (JEDEC Compliant board) has been mounted.
Copper foil area 1layer 6.28mm2, Copper foil area 2 to 4layers 5655.04mm2, When it’s used by more than Ta=25 ℃, it’s reduced by 12.1mW/ ℃.
●Recommended Operating Rating (Ta=-30 ℃ to +85 ℃)
Ratings
Parameter
Symbol
Min.
Typ.
Max.
Power supply voltage
VBAT
2.7
12.0
22.0
Unit
Condition
V
●Electrical Characteristics (Unless otherwise specified, VBAT=12V, RSTB=2.5V, Ta = +25 ℃)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
[FAILSEL,PWMDRV Terminal]
Threshold voltage (Low)
VthL
0
-
0.2
V
Threshold voltage (High) 1
VthH1
1.4
-
5.0
V
VBAT>5.0V
Threshold voltage (High) 2
VthH2
1.4
-
VBAT
V
VBAT<5.0V
Iin
-
8.3
14.0
µA
Input=2.5V
PWML
0
-
0.2
V
High input voltage range1
PWMH1
1.4
-
5.0
V
VBAT>5.0V
High input voltage range2
PWMH2
1.4
-
VBAT
V
VBAT<5.0V
PWM pull down resistor
PWMR
300
500
700
kΩ
RSTBL
0
-
0.2
V
High input voltage range1
RSTBH1
2.25
2.5
5.0
V
VBAT>5.0V
High input voltage range2
RSTBH2
2.25
2.5
VBAT
V
VBAT<5.0V
IRSTB
-
89
134
µA
RSTB=2.5V, LED1-6=3V
VREG voltage
VREG
4.0
5.0
6.0
V
No load
Under voltage lock out
UVLO
2.05
2.25
2.65
V
Terminal input current
[PWMPOW Terminal]
Low input voltage range
[RSTB Terminal]
Low input voltage range
Current consumption
[Regulator]
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Datasheet
BD6583MUV-A
●Electrical Characteristics - continued
(Unless otherwise specified, VBAT=12V, RSTB=2.5V, Ta = +25 ℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
[Switching Regulator]
Quiescent current 1
Iq1
-
0.6
3.4
µA
RSTB=0V, VBAT=12V
Quiescent current 2
Iq2
-
4.6
Current consumption
Idd
-
3.4
10
µA
RSTB=0V, VBAT=22V
5.1
mA VDET=0V,ISETH=24kΩ
LED control voltage
VLED
0.4
0.5
0.6
Over current limit voltage
Ocp
70
100
130
SBD open protect
Sop
-
-
0.1
V
V
mV *1
Detect voltage of VDET pin
Switching frequency
fSW
0.8
1.0
1.2
MHz
Duty cycle limit
Duty
92.5
95.0
99.0
%
LED1-6=0.3V
Over voltage limit
Ovl
43.0
44.7
46.4
V
LED1-6=0.3V
LED maximum current
ILMAX
-
-
25
mA
LED current accuracy
ILACCU
-
-
±5
%
LED current matching
ILMAT
-
-
±3
%
Iset
0.5
0.6
0.7
V
ILOCP
35
60
90
mA
LEDOVP
10.0
11.5
13.0
V
[Current driver]
ISET voltage
LED current limiter
LED terminal Over voltage protect
ILED=16mA
▪Each LED current/Average (LED1- 6)
▪ILED=16mA
Current limit value at ISET resistor 4.7kΩ setting
LED1, 2, 3, 4, 5, 6=0.5V
RSTB=PWMDRV=2.5V
*1 This parameter is tested with dc measurement.
●Pin Descriptions
PIN Name
In/Out
PIN number
1
2
3
4
5
6
7
8
VDET
N.C.
GND
SW
SENSP
TEST
SENSN
GND
In
Out
In
In
In
-
9
ISETH
In
10
ISETL
In
11
12
13
14
15
16
17
18
19
20
21
22
23
24
PWMDRV
LED1
LED2
LED3
GND
LED4
LED5
LED6
FAILSEL
GND
RSTB
VREG
PWMPOW
VBAT
In
In
In
In
In
In
In
In
In
Out
In
In
Thermal PAD
-
-
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Function
Detect input for SBD open and OVP
No connect pin
GND
Switching Tr drive terminal
+ Side Current sense terminal
TEST input (Pull down 100kΩ to GND)
- Side Current sense terminal
GND
Resistor connection for
LED current setting at PWMDRV=H
Resistor connection for
LED current setting at PWMDRV=L
PWM input pin for power ON/OFF only driver
Current sink for LED1
Current sink for LED2
Current sink for LED3
GND
Current sink for LED4
Current sink for LED5
Current sink for LED6
Latch selectable pin of protect function
GND
Reset pin L :Reset H :Reset cancel
Regulator output / Internal power-supply
PWM input pin for power ON/OFF
Battery input
Heat radiation PAD of back side
Connect to GND
3/32
Terminal equivalent
circuit diagram
C
F
B
G
G
G
A
B
A
A
E
C
C
C
B
C
C
C
E
B
E
D
E
C
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Datasheet
BD6583MUV-A
●Pin ESD Type
VBAT
VREG
PIN
VBAT
PIN
PIN
GND
GND
A
C
B
VBAT
VBAT
PIN
PIN
PIN
5.5V
GND
D
GND
Clump
E
F
VBAT VREG
PIN
GND
G
Figure 3. I/O equivalent circuit diagram
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Datasheet
BD6583MUV-A
●Block Diagram
V BAT
VR EG
RS TB
V IN detector
300kΩ
UVLO
RE G
PW MP O W
Internal P ower sup lly
VDE T
500 kΩ
TS D
+
-
S BD O pen protect
FA ILS EL
over voltage protect
+
-
300 kΩ
S
SW
Q
PW Mcomp
C ontrol
se nce
R
+
1M Ω
SE NSP
10 0K Ω
S ENS N
ERRA MP
+
LED 1
LE D2
LED 3
LE D4
+
Curre nt
S en ce
LE D5
O SC
LE D6
LE D TERM INA L
Detect
LED TE RM INA L
Over Voltag e P ro tect
TES T
10 0kΩ
PW M DRV
30 0kΩ
ISE TH
IS E T H
Resisto r driver
+
PW MDRV=H
On
IS E T L
Resisto r driver
IS ETL
G ND
G ND
G ND
PW MDRV=L
On
-
Current Driver
GN D
Pin number 23pin
Figure 4. Block diagram
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Datasheet
BD6583MUV-A
●Typical Performance Curves
85℃
25℃
85℃
85℃
25℃
-30℃
-30℃
25℃
-30℃
Figure 6. Quiescent current vs VBAT
Figure 5. Current Consumption vs VBAT
2.3
25℃
25℃
2.28
-30℃
-30℃
VBAT [V]
2.26
85℃
2.24
85℃
2.22
2.2
-30
25
80
Ta [oC]
Figure 8. UVLO vs Temperature
Figure 7. Oscillation frequency vs VBAT
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Datasheet
BD6583MUV-A
●Typical Performance Curves - Continued
100%
95%
6V
12V
16V
Ef f iciency [％]
90%
85%
16V
12V
6V
80%
75%
70%
65%
60%
0
10 20 30 40 50 60 70 80 90 100
Duty [%]
Figure 10. Efficiency vs PWMDRV-HI
Duty
Figure 9. Efficiency vs PWMPOW-HI Duty
ISETH=24kΩ, PWM=200Hz
16V
16V
12V
12V
6V
6V
Figure 12. LED current vs PWMDRV-HI Duty
( Expansion) PWM = 200Hz
Figure 11. LED current vs PWMDRV-HI
Duty
PWM = 200Hz
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Datasheet
BD6583MUV-A
●Typical Performance Curves - Continued
20
18
16
1kHz
16V
14
LED current [mA]
200Hz
10kHz
12V
12
6V
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
Duty [%]
Figure 13. LED current vs PWMDRV-HI Duty
PWM = 200Hz, 1kHz,10kHz
Figure 15. LED current vs PWMPOW-HI Duty
TPWM = 200Hz
1.0
0.9
0.8
LED Current [mA]
0.7
16V
12V
0.6
6V
0.5
0.4
0.3
0.2
0.1
0.0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Duty (%)
Figure 15. LED current vs PWMPOW-HI Duty
( Expansion) PWM = 200Hz
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Figure 16. LED current vs PWMPOW-HI Duty
PWM = 200Hz, 1kHz,10kHz
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Datasheet
BD6583MUV-A
●Typical Performance Curves - Continued
Figure 18. LED current matching vs
PWMDRV-HI Duty
(Expansion)
PWM = 200Hz
Figure 17. LED current matching vs
PWMDRV-HI Duty
PWM = 200Hz
Figure 19. VOUT response
Driver Control PWM (PWMDRV)
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Figure 20. LED current matching vs
PWMPOW-HI Duty PWM = 200Hz
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Datasheet
BD6583MUV-A
●Typical Performance Curves - Continued
LEDCurrent [mA]
Figure 21. LED current matching vs
PWMPOW-HI Duty
(Expansion)
PWM = 200Hz
16.30
16.25
16.20
16.15
16.10
16.05
16.00
15.95
15.90
15.85
15.80
15.75
15.70
5V
Figure 22. VOUT response
Power Control PWM (PWMPOW)
7V
12V
22V
2.7V
-30
-10
10
30
50
70
temp [℃ ]
Figure 24. Line Transient (10V to 22V)
Figure 23. LED current vs Temperature
PWMDRV=H, ISETH=30kΩ
(16mA setting)
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Datasheet
BD6583MUV-A
●Typical Performance Curves - Continued
Figure 26. VOUT@OVP(LED OPEN)
Figure 25. Line Transient (22V to 10V)
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Datasheet
BD6583MUV-A
●Application example
Battery
Battery
4.7μH
10μF
10LED x 6parallel
4.7μH
10μF
2.2μF *
2.2μF *
RTR020N05
SW
RTR020N05
FAILSEL
SENSP
SW
VDET
VDET
SENSN
SENSN
Power
ON/OFF
RSTB
PWMPOW
PWMDRV
200Hz
PWM
FAILSEL
SENSP
150mΩ
100mΩ
Power
ON/OFF
10LED x 4aprallel
RSTB
LED1
PWMPOW
LED2
PWMDRV
200Hz
PWM
LED3
LED1
LED2
LED3
VBAT
VBAT
LED4
LED4
VREG
VREG
LED5
LED5
1μF
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 20mA
24kΩ
24kΩ
Figure 28. 10 series × 4parallel
Figure 27. 10 series × 6parallel
H current 20mA setting
H current 20mA setting
Current driver PWM application
Current driver PWM application
* Please select the capacitor which the little bias fluctuation.
Battery
Battery
4.7μH
10μF
10LED x 6parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
10LED x 6parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
100mΩ
VDET
100mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED1
LED2
PWMDRV
200Hz
PWM
RSTB
PWMPOW
200Hz
PWM
LED3
VBAT
LED3
VBAT
LED4
VREG
LED2
PWMDRV
LED4
2.7V to 5.5V
LED5
VREG
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 20mA
24kΩ
24kΩ
Figure 29. 10 series × 6parallel LED
Figure 30. Non-used Inside REG or operating
current 20mA setting Power control PWM application
under 5V application
* Please select the capacitor which the little bias fluctuation.
●Terminal processing
TEST pin= Connect to GND
N.C. = Nothing specified in particular. Open is recommended.
VREG= When IC is driving from the outside of 2.7 to 5.5V, short VBAT and VREG, and put the voltage to VREG
FAILSEL, PWMDRV= Connect to GND in case of fixing at L level. Connect to VREG of IC or the power supply of more
than 1.4V in case of fixing at H level .
LED1-6= When each LED driver are not used, connect to GND of IC
GND = Each GND is connecting inside IC, but, connect to GND of all board
RSTB= RSTB is used as a power supply of internal circuit.
So, you mustn’t input RSTB voltage with pull up resistor of several kΩ.
And, please care about the relation between VBAT and RSTB enough. (ref. P16)
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Datasheet
BD6583MUV-A
●Description of Functions
1) PWM current mode DC/DC converter
While BD6583MUV-A is power ON, the lowest voltage of LED1, 2, 3, 4, 5, 6 is detected, PWM duty is decided to be
0.5Vand output voltage is kept invariably. As for the inputs of the PWM comparator as the feature of the PWM current
mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense
signal that controls the inductor current into Slope waveform to prevent sub harmonic oscillation. This output controls
external Nch Tr via the RS latch. In the period where external Nch Tr gate is ON, energy is accumulated in the external
inductor, and in the period where external Nch Tr gate is OFF, energy is transferred to the output capacitor via external
SBD.BD6583MUV-A has many safety functions, and their detection signals stop switching operation at once.
2) Soft start
BD6583MUV-A has soft start function.
The soft start function prevents large coil current.
Rush current at turning on is prevented by the soft start function.
After RSTB is changed L H, when PWMPOW is changed L H, soft start becomes effective for within 1ms and soft
start doesn't become effective even if PWMPOW is changed L H after that.
And, when the H section of PWMPOW is within 1ms, soft start becomes invalid when PWMPOW is input to H more than
three times. The invalid of the soft start can be canceled by making RSTB  L.
3) FAILSEL pin
When the error condition occurs, boost operating is stopped by the protection function, and the error condition is avoided.
On that occasion, the way to stop of boost operating by the protection function can be selected with FAILSEL pin. Details
are as shown in Figure 31, 32.
After power ON, when the protection function is operating under about 1ms have passed, the stop state of the boost
operating can be held through FAILSEL is H, the stop state can reset through RSTB is L.
And, boost operating is stopped when the protection function is operating through FAILSEL is L, but when the protection
function becomes un-detect, boost operating is started again. It never keeps holding the stop state of boost operating.
In PWM control by PWMDRV can’t use this function.
When it is off over 10ms on PWM control by PWMPOW using this function, it may be stopped the boost
operating as over current protection work at off on PWMPOW=L.
Object of protect function is as shown below.
・ Over-voltage protection
・ External SBD open detect
・ Thermal shutdown
・ LED terminal over-voltage protection
・ Over current limit
< When it is off on PWMPOW>
<FAILSEL=H>
RSTB
RSTB
FAILSEL
“H”
about 1ms
PWMDRV
un-operating range
PWMPOW
Protection
function
Boost
operating
un-detection
Output
voltage
un-detection
detection
Coil current
off
normal operating
boost stop
off
normal operating
invalid
valid
< When it is off on RSTB>
<FAILSEL=L>
RSTB
RSTB
PWMDRV
about 1ms
FAILSEL
FAILSEL
function
“L”
Protection
function
PWMPOW
un-operating range
un-detectio
detection
Output
voltage
un-detection
Coil current
Boost
operating
off
normal operating
boost stop
normal
operating
off
normal
Figure 31. FAILSEL operating description
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FAILSEL
function
invalid
Figure 32. FAILSEL=H light off control
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Datasheet
BD6583MUV-A
4) External SBD open detect and over voltage protection
BD6583MUV-A has over boost protection by external SBD open and over voltage protection. It detects VDET voltage
and is stopped output Tr in abnormal condition. Details are as shown below.
▪ External SBD open detect
In the case of external SBD is not connected to IC, the coil or external Tr may be destructed. Therefore, at such an error
as VOUT becoming 0.1V or below, the Under Detector shown in the figure works, and turns off the output Tr, and
prevents the coil and the IC from being destructed.
And the IC changes from activation into non-activation, and current does not flow to the coil (0mA).
▪ Over voltage protection
At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC will boost too much
and the VDET terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VDET
becomes sensing voltage or higher, the over voltage limit works, and turns off the output Tr, and the pressure up made
stop.
At this moment, the IC changes from activation into non-activation, and the output voltage goes down slowly. And, when
the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage pressure up to sensing
voltage once again and unless the application error is recovered, this operation is repeated.
5) Thermal shut down
BD6583MUV-A has thermal shut down function.
The thermal shut down works at 175°C or higher, and the IC changes from activation into non-activation. Because
non-activation is different from RSTB=L, it doesn’t’ be reset inside IC. Moreover, even if thermal shut down function
works, soft start, FAILSEL, selection the number of LED lines of the current driver and starting current setting at
PWMDRV=L related RSTB are hold.
6) Over Current Limit
Over current flows the current detection resistor that is connected to switching transistor source and between GND,
SENSP pin voltage turns more than detection voltage, over current protection is operating and it is prevented from
flowing more than detection current by reducing ON duty of switching Tr without stopping boost.
As over current detector of BD6583MUV-A is detected peak current, current more than over current setting value does not flow.
And, over current value can decide freely by changing over current detection voltage.
<Derivation sequence of detection resistor>
Detection resistor =Over current detection voltage / Over current setting value
TYP value of over current detection voltage is 100mV, MIN = 70mV and MAX = 130mV and after the current value which
was necessary for the normal operation was decided, detection resistor is derived by using MIN value of over current
detection value.
For example, detection resistor when necessary current value was set at 1A is given as shown below.
Detection resistor =70mV / 1A = 70mΩ
MAX current dispersion of this detection resistor value is
MAX current = 130mV / 70mΩ = 1.86A
<The estimate of the current value which need for the normal operation>
As over current detector of BD6583MUV-A is detected the peak current, it have to estimate peak current to flow to the coil
by operating condition.
In case of, ○ Supply voltage of coil = VIN
○ Inductance value of coil = L
○ Switching frequency = fsw MIN=0.8MHz, Typ=1MHz, MAX=1.2MHz
○ Output voltage = VOUT
○ Total LED current = IOUT
○ Average current of coil = Iave
○ Peak current of coil = Ipeak
○ Efficiency = eff (Please set up having margin, it refers to data on P.7)
○ ON time of switching transistor = Ton
Ipeak = (VIN / L) × (1 / fsw) × (1-(VIN / VOUT))
Iave=(VOUT × IOUT / VIN) / eff
1/2
Ton=(Iave × (1-VIN/VOUT) × (1/fsw) × (L/VIN) × 2)
Each current is calculated.
As peak current varies according to whether there is the direct current superposed, the next is decided.
(1-VIN/VOUT) × (1/fsw) < Ton  peak current = Ipeak /2 + Iave
(1-VIN/VOUT) × (1/fsw) > Ton  peak current = Ipeak
(Example 1)
In case of, VIN=6.5V, L=4.7µH, fsw=1MHz, VOUT=39V, IOUT=80mA, Efficiency=85%
Ipeak = (6.0V / 4.7µH) × (1 / 1MHz) × (1-(6.0V / 39V)) =1.08A
Iave = (39V × 80mA / 6.0V) / 85% = 0.61A
1/2
Ton = (0.61A × (1-6.0V / 39V) × (1 / 1MHz) × ( 4.7µH /6.0V) × 2) = 0.90µs
(1-VIN/VOUT) × (1/fsw)=0.85µs < Ton
Peak current = 1.08A/2+0.61A = 1.15A
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BD6583MUV-A
(Example 2)
In case of, VIN=12.0V, L=4.7µH, fsw=1MHz, VOUT=39V, IOUT=80mA, Efficiency=85%
Ipeak = (12.0V / 4.7µH) × (1 / 1MHz) × (1-(12V / 39V)) =1.77A
Iave = (39V × 80mA / 12.0V) / 85% = 0.31A
Ton = (0.31A × (1-12 V / 39V) × (1 / 1MHz) × ( 4.7µH /12 V) × 2)1/2 = 0.41µs
(1-VIN/VOUT) × (1/fsw)=0.69µs > Ton
Peak current = 12V/4.7µH × 0.41µs = 1.05A
*When too large current is set, output overshoot is caused, be careful enough because it is led to break down of the IC in
case of the worst.
●Operating of the application deficiency
1) When 1 LED or 1parallel OPEN during the operating
In case of FAILSEL=L, the LED parallel which became OPEN isn't lighting, but other LED parallel is lighting.
At that time, output boosts up to the over voltage protection voltage 44.7V so that LED terminal may be 0V or it boost to
the output voltage that LED terminal voltage becomes LED terminal over voltage protection 11.5V or it becomes the
output voltage restricted by the over current limit.
In case of FAILSEL=H, boost stops when LED becomes OPEN and all LED turns off the lights.
2) When LED short-circuited in the plural
In case of FAILSEL=L, all LED is turned on unless LED terminal voltage is LED terminal over voltage protection of more
than 11.5V.
When it was more than 11.5V only the line which short-circuited is turned on normally and LED current of other lines fall
or turn off the lights. In case of FAILSEL=H, boost stops at more than 11.5V and all LED turns off the lights.
3) When Schottky diode came off
Regardless of FAILSEL, all LED isn't turned on. Also, IC and a switching transistor aren't destroyed because boost
operating stops by the Schottky diode coming off protected function.
4) When over current detection resistor came off
Regardless of FAILSEL, all LED isn't turned on. Because the resistance of 100kΩ is between SENSP and SENSN
terminal, over current protection works instantly and LED current can't be flow.
●Control signal input timing
2.7V 5V
VBAT
2
Min. 100µs
0V
5V
1
RSTB
VBAT
3
2 20Ω
PWMPOW
5V
PIN
Rin
PWMDRV
GND
VREG
DC/DC VOUT
Figure 33. Control signal timing
Figure 34. Voltage with a control sign higher than VBAT
Example corresponding to application of conditions
In case you input control signs, such as RSTB, PWMPOW, and PWMDRV, in the condition that the standup of supply
voltage (VBAT) is not completed, be careful of the following point.
①Input each control signal after VBAT exceeds 2.7V.
②Please do not input each control sign until VBAT exceeds H voltage of RSTB, PWMPOW, and PWMDRV.
③When you input RSTB during the standup of VBAT and H voltage is inputted into PWMPOW, please give the standup
time to stable voltage as Min.100µs 2.7V of VBAT.
There is no timing limitation at each input signal of RSTB, PWMPOW and PWMDRV.
If each control sign changes into a condition lower than VBAT in (1) and (2), it goes via the ESD custody diode by the side
of VBAT of each terminal. A power supply is supplied to VBAT and there is a possibility of malfunctioning. Moreover, when
the entrance current to the terminal exceeds 50mA, it has possibility to damage the LSI. In order to avoid this condition, as
shown in the above figure, please insert about 220Ω in a signal line, and apply current qualification. Please confirm an
internal pull down resistor in the block diagram and electrical property of P.5.
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BD6583MUV-A
●How to select the number of LED lines of the current driver
When the number of LED lines of the current driver is reduced, the un-select can be set the matter that the unnecessary
LED1 to 6 terminal is connected to GND. When it uses with 4 lines and so on, it can correspond to it by connecting 2
unnecessary lines to GND.
RSTB is used as a power supply of this decision circuit. The select of the terminal is judged, It has no relation to the logic of
PWMPOW and PWMDRV and it isn't judged an unnecessary LED line even if it is connected to GND when it is judged a
necessary terminal once. This information can be reset by setting RSTB at 0V.
●Start control and select LED current driver
BD6583MUV-A can control the IC system by RSTB, and IC can power off compulsory by setting 0.2V or below. Also, It
powers on PWMPOW is at more than 1.4V and RSTB is at more than 2.25V.
When RSTB=PWMPOW=H, ISETH current is selected at PWMDRV=H and ISETL current is selected at PWMDRV=L.
The starting current in PWMDRV=L sets OFF second time rise of PWMDRV and it becomes 0mA setting after that.
After RSTB sets L once, the starting current can be flowed again by changing it to H.
RSTB
PWMPOW
PWMDRV
IC
H
H
H
H
L
L
H
L
H
L, H
L
L
H
H
L, H
Off
On
Off
On
Off
LED current
OFF
Starting current decided with ISETL
OFF
Current decided with ISETH
OFF
●Attendance point of the restriction resistance input to RSTB
When the restriction resistance is input to RSTB, it is necessary to consider the input current of RSTB.
The input current of RSTB changes that depending on the power-supply voltage and the temperature reference to Figure
35.
Because the temperature characteristic of the input current is shown in Figure 35, please choose resistance for which the
voltage of the terminal can be guaranteed to 2.1V or more.
And, it has the margin in the decision of resistance, and please confirm and make sure it is no problem in a real application.
The decision example of restriction resistance
1.When use the current driver of 6 parallel
2.9V(to RSTB power-supply) - restriction resistance value × 124μA(100 ℃ input current) > 2.1V
restriction resistance value < (2.9-2.1)/124μA=6.45kΩ
2.When use the current driver of 3 parallel
2.9V(to RSTB power-supply) - restriction resistance value × 430μA(100 ℃ input current) > 2.1V
restriction resistance value < (2.9-2.1)/430μA=1.86kΩ
BD6583MUV-A
Power supply
for RSTB
Limit resistor
RSTB
terminal
RSTB　input current[uA]
250
RSTB input current
+100 ℃
+80 ℃
+25 ℃
200
-30 ℃
150
100
50
2.1
2.4
2.7
3
3.3
3.6
RSTB[V]
Figure 35. RSTB input current
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Figure 36. RSTB terminal voltage-RSTB input current
(At the time of the current driver 6 lines use)
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BD6583MUV-A
In addition, the selection number of parallel number of the current driver is changed, the power-supply current of RSTB will
be increased. Because the maximum value of the consumption current at the RSTB=2.1V is indicated in the following Table
1, be careful enough when you calculate the restriction resistance.
Table1. The use parallel number of current driver at RSTB=2.1V , 100℃ vs. RSTB input current
Parallel numbers used for current driver
RSTB input current
6
0.12mA
5
0.23mA
4
3
2
1
0.33mA
0.43mA
0.53mA
0.63mA
0
0.74mA
●Start to use PWMPOW terminal for the PWM control, PWM operating
After RSTB and PWMDRV is changing L  H, input PWM to PWMPOW terminal.
There is no constraint in turn of RSTB and PWMDRV.
And, because it corresponds to PWM drive of shorter ON time than soft start time (1ms), when PWMPOW is input H more
than three times, the soft start is invalidated and it enable to correspond the high-speed drive. Until RSTB is set L,
invalidation of the soft start isn't canceled.
In case of lighting  light off  lighting, when it turns off the lights with PWM=L and It starts without soft start when it sets
PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value,
as follows Figure 37. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil
can be suppressed, as follows Figure 38 and this process of light off is recommended.
RSTB
PWMDRV
PWMPOW
Output Voltage
Current coil
Figure 37. Light off control of PWMPOW pin at PWM control on PWM=L
RSTB
PWMDRV
PWMPOW
Output Voltage
Current coil
Figure 38. Light off control of PWMPOW pin at PWM control on RSTB=L
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Datasheet
BD6583MUV-A
●Start to use PWMDRV terminal for the PWM control, PWM operating
After RSTB and PWMPOW is changing L  H, input PWM to PWMDRV terminal.
There is no constraint in turn of RSTB and PWMPOW.
When resistance is set as ISET, after RSTB and PWMPOW is changing L  H as follows Figure 39, when it is not input
PWM to PWMDRV pin but input L, boost of DC/DC is unstable state because current driver doesn’t pass current.
The starting current is pulled from each LED terminal and pressure up operating is stabilized to escape from this state.
Also, the starting current can be set up by the resistance value connected to the ISETL terminal.
After starting, as the starting current in PWM brightness control become useless, the starting current is set up 0mA at the
second rise time of PWMDRV automatically as follows Figure 39.
In case of lighting  light off  lighting, when it turns off the lights with PWM=L and It starts without soft start because of
soft
start period was end when it sets PWM modulated light again.
But the peak current of the coil changes owing to discharge of output capacitor, It may flow to the over current limit value,
as follows Figure 40. Because soft start can be used when it turns off the lights with RSTB=L, The peak current of the coil
can be suppressed, as follows Figure 41 and this process of light off is recommended.
RSTB
PWMPOW
L
H
L
H
OFF
ON
OFF
L
H
L
PWMDRV
Output voltage
LED pin
ON
Current driver of
starting current
Figure 39. Off timing of starting current at PWMDRV=L
RSTB
PWMPOW
PWMDRV
Output Voltage
Current coil
Figure 40. Light off control of PWMDRV pin at PWM control on PWM=L
RSTB
PWMPOW
PWMDRV
Output Voltage
Current coil
Figure 41. Light off control of PWMDRV pin at PWM control on RSTB=L
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Datasheet
BD6583MUV-A
●Brightness control
There are two dimming method is available, first method is analog dimming that apply analog voltage to ISET terminal, and
second method is PWM control via digital dimming of PWMPOW or PWMDRV. Because each method has the different
merit, please choose a suitable method for the application of use.
Two techniques can be used as digital dimming by the PWM control One is PWM control of current driver, the other is PWM
control of power control.
As these two characteristics are shown in the below, selects to PWM control process comply with application.
•Efficiency emphasis in the low brightness which has an influence with the battery life
control
•LED current dispersion emphasis in the PWM brightness control
control

2)
Power
control
PWM

1)
Current
driver
PWM
(Reference)
PWM regulation process
Efficiency of LED current 0.5mA
(PWM Duty=2.5%)
PWM frequency 200Hz
Limit dispersion capability of low duty
Current driver
70%
0.2%
Power control
93%
0.5%
1) Current driver PWM control is controlled by providing PWM signal to PWMDRV, as it is shown Figure 42.
The current set up with ISETH is chosen as the H section of PWMDRV and the current is off as the L section. Therefore, the
average LED current is increasing in proportion to duty cycle of PWMDRV signal. This method that it lets internal circuit and
DC/DC to work, because it becomes to switch the driver, the current tolerance is a few when the PWM brightness is
adjusted, it makes it possible to brightness control until 20µs (MIN0.4% at 200Hz). And, don't use for the brightness control,
because effect of ON/OFF changeover is big under 20µs ON time and under 20µs OFF time. There is no effect of ON/OFF
changeover at 0% and 100%, so there is no problem on use. Typical PWM frequency is 100Hz to 10kHz. When resistance is
set as ISET, RSTB sets H  L, so the starting current may be effective, after RSTB sets L  H, it becomes PWM of the
starting current and PWM of ISETH setting current to PWM two times.
PWMDRV
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
ON
IC’s active current
Figure 42.
2) Power control PWM control is controlled by providing PWM signal to PWMPOW, as it is shown Figure 43. The current
setting set up with PWMDRV logic is chosen as the H section and the current is off as the L section. Therefore, the
average LED current is increasing in proportion to duty cycle of PWMPOW signal. This method is, because IC can be
power-off at off-time, the consumption current can be suppress, and the high efficiency can be available, so it makes it
possible to brightness control until 50µs (MIN1% at 200Hz). And, don't use for the brightness control, because effect of
power ON/OFF time changeover is big under 50µs ON time and under 50µs OFF time. There is no effect of ON/OFF
changeover at 0% and 100%, so there is no problem on use.
Typical PWM frequency is 100Hz to 1kHz. Also, PWM can't control RSTB and PWMPOW at the same time.
After RSTB sets H, control PWM only PWMPOW.
PWMPOW
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
IC’s active current
ON
OFF
Figure 43.
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BD6583MUV-A
●LED current setting range
LED current can set up Normal and Starting setting current.
LED current can set up Normal current by resistance value (RISETH) connecting to ISETH voltage and LED current can set
Starting current by resistance value (RISETL) connecting to ISETL voltage.
Setting of each LED current is given as shown below.
Normal current = 20mA (24kΩ/RISETH)
Starting constant current = 0.6/RISET L
Also, Normal current setting range is 10mA to 25mA, Starting current setting range is OFF setting or 1µA to 100µA.
LED current can set OFF setting by open setting ISETL pin.
LED current becomes a leak current MAX 1µA at OFF setting.
ISETH Normal current setting example
RISETH
LED current
24kΩ (E24)
20mA
25.5 kΩ (E96)
18.8mA
27 kΩ (E12)
17.8mA
28kΩ (E96)
17.1mA
30kΩ (E24)
16.0mA
33kΩ (E6)
14.5mA
ISETL Starting current setting example
RISETL
LED current
6.2kΩ (E24)
97µA
10kΩ (E6)
60µA
47kΩ (E6)
13µA
100 kΩ (E6)
6µA
560 kΩ (E12)
1.1µA
Connect to VREG pin
0mA
●The separations of the IC Power supply and coil Power supply
This IC can work in separating the power source in both IC power supply and coil power supply. With this application, it can
obtain that decrease of IC power consumption, and the applied voltage exceeds IC rating 22V.
That application is shown in below Fig 44. The higher voltage source is applied to the power source of coil that is connected
from an adapter etc. Next, the IC power supply is connected with a different coil power supply. Under the conditions for
inputting from 2.7V to 5.5V into IC VBAT, please follow the recommend design in Fig 40. It connects VBAT terminal and
VREG terminal together at IC outside.
When the coil power supply is applied, it is no any problem even though IC power supply is the state of 0V. Although IC
power supply is set to 0V, pull-down resistance is arranged for the power off which cuts off the leak route from coil power
supply in IC inside, the leak route is cut off. And, there is no power on-off sequence of coil power supply and IC power
supply.
Coil Power supply
7V to 28V
Battery
4.7μH
10μF
10LED x 6
2.2μF
RTR020N05
SW
FAILSEL
SENSP
VDET
100mΩ
SEN SN
Power
ON/OFF
RSTB
LED1
PWMDRV
LED2
PW MPOW
200Hz
PWM
LED3
VBAT
IC Power supply 2.7V to 5.5V
LED4
VREG
LED5
1μF
GND GND GND GN D T EST ISETH ISETL LED6
20mA each
24kΩ
Figure 44. Application at the time of power supply isolation
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Datasheet
BD6583MUV-A
●The coil selection
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened.
Please do not let L value to 3.3µH or below.
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you
increase L value.
Example)
4.7µH
=
output capacitor
2.2µF/50V
1pcs
6.8µH
=
output capacitor
2.2µF/50V
2pcs
10µH
=
output capacitor
2.2µF/50V
3pcs
This value is just examples, please made sure the final judgment is under an enough evaluation.
●Layout
In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as
efficiency and ripple and the likes change greatly with layout patterns, which please note carefully.
to Power Supply
PWM
Reset
CIN
CBAT
CREG
FAILSEL
GND
LED5
GND
LE D5
L ED 4
LE D3
LED4
LED 2
LED3
to Anode
of each LED
LED2
LED1
PWMDRV
SENSP
ISETL
GND
ISETH
SW
TEST
to GND
RSTB
N.C.
L ED 6
RSENSE
VREG
LED6
GND
Tr
COUT
VDET
SENSN
SBD
to Cathode
of LED
PWMPOW
VBAT
L
RISET
Figure 45. Layout
Connect the input bypath capacitor CIN(10µF) nearest to coil L, as shown in the upper diagram.
Wire the power supply line by the low resistance from CIN to VBAT pin. Thereby, the input voltage ripple of the IC can be
reduced. Connect smoothing capacitor CREG of the regulator nearest to between VREG and GND pin, as shown in the upper
diagram. Connect schottky barrier diode SBD of the regulator nearest to between coil L and switching transistor Tr.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
Connect switching transistor Tr nearest to SW pin. Wire coil L and switching transistor Tr, current sensing resistor RSENSE by the
low resistance. Wiring to the SENSP pin isn't Tr side, but connect it from RSENSE side. Over current value may become low
when wiring from Tr side. Connect RSENSE of GND side isolated to SENS pin. Don’t wire between RSENSE and SNESN pin wiring
from RSENSE pin to GND pin. And RSENSE GND line must be wired directly to GND pin of output capacitor. It has the
possibility that restricts the current drive performance by the influence of the noise when other GND is connected to this GND.
Connect LED current setting resistor RISET nearest to ISETH pin. There is possibility to oscillate when capacity is added
to ISETH terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND
pin.
When those pins are not connected directly near the chip, influence is given to the performance of BD6583MUV-A, and may
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce electric
power consumption and increase the entire efficiency.
The layout pattern in consideration of these is shown in next page.
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Datasheet
BD6583MUV-A
●Recommended layout pattern
BD6583MUV-A
CREG
RISET
CBAT
L
Tr
RSENSE
CIN
COUT
Figure 46. Frontal surface <Top view>
Figure 47. Rear surface <Top view>
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Datasheet
BD6583MUV-A
●Selection of external parts
Recommended external parts are as shown below.
When to use other parts than these, select the following equivalent parts.
▪Coil
Value
Manufacturer
Product number
4.7μH
4.7μH
4.7μH
4.7μH
4.7μH
10μH
TOKO
TOKO
TOKO
TDK
TDK
TDK
A915AY-4R7M
B1015AS-4R7M
A1101AS-4R7M
LTF5022T-4R7N2R0
VLP6810T-4R7M1R6
VLP6810T-100M1R1
Vertical
5.2
8.4
4.1
5.0
6.3
6.3
Size
Horizontal
5.2
8.3
4.1
5.2
6.8
6.8
Height (MAX)
3.0
4.0
1.2
2.2
1.0
1.0
DC current
(mA)
DCR
(Ω)
1870
3300
1400
2000
1600
1100
0.045
0.038
0.115
0.073
0.167
0.350
▪Capacitor
Value
Pressure
Manufacturer
Product number
[ Supply voltage capacitor ]
10μF
25V
MURATA
GRM31CB31E106K
10μF
10V
MURATA
GRM219R61A106K
4.7μF
25V
MURATA
GRM319R61E475K
4.7μF
25V
MURATA
GRM21BR61E475K
[ Smoothing capacitor for built-in regulator ]
1μF
10V
MURATA
GRM188B10J105K
[ Output capacitor ]
1μF
50V
MURATA
GRM31MB31H105K
1μF
50V
MURATA
GRM21BB31H105K
2.2μF
50V
MURATA
GRM31CB31H225K
0.33μF
50V
MURATA
GRM219B31H334K
Vertical
Size
Horizontal
Height
3.2
2.0
3.2
2.0
1.6
1.25
1.6
1.25
1.6
3.2
2.0
3.2
2.0
TC
Cap
Tolerance
1.6±0.2
0.85±0.15
0.85±0.1
1.25±0.1
B
X5R
X5R
X5R
+/-10%
+/-10%
+/-10%
+/-10%
0.8
0.8±0.1
B
+/-10%
1.6
1.25
1.6
1.25
1.15±0.1
1.25±0.1
1.6±0.2
0.85±0.1
B
B
B
B
+/-10%
+/-10%
+/-10%
+/-10%
▪Resistor
Value
Tolerance
Manufacturer
Product number
[ Resistor for LED current decision <ISETH pin> ]
30kΩ
±0.5%
ROHM
MCR006YZPD3002
[ Resistor for over current decision <SENSP pin> ]
100mΩ
±1%
ROHM
MCR10EZHFLR100
Vertical
Size
Horizontal
Height
0.6
0.3
0.23
2.0
1.25
0.55
Vertical
3.5
Size
Horizontal
1.6
Height
0.8
Vertical
2.8
6.0
Size
Horizontal
2.9
5.0
Height
1.0
1.75
▪SBD
Pressure
Manufacturer
Product number
60V
ROHM
RB160M-60
Pressure
Manufacturer
Product number
45V
60V
ROHM
ROHM
RTR020N05
RSH065N06
▪MOS FET Nch
Current
ability
Driving
voltage
2A
6.5A
2.5V
4.0V
The coil is the part that is most influential to efficiency. Select the coil whose direct current resistor (DCR) and current inductance characteristic is excellent. BD6583MUV-A is designed for the inductance value of 4.7µH. Don’t uses the
inductance value less than 2.2µH. Select a capacitor of ceramic type with excellent frequency and temperature
characteristics. Further, select Capacitor to be used with small direct current resistance, and pay sufficient attention to the
layout pattern shown in Page.21.
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Datasheet
BD6583MUV-A
●Attention point of board layout
In board pattern design, the wiring of power supply line should be low Impedance, and put the bypass capacitor if necessary.
Especially the wiring impedance must be lower around the DC/DC converter.
●About heat loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Periphery temperature Ta must be less than 85 ℃.
2. The loss of IC must be less than dissipation Pd.
●Application example
• LED current setting controlled ISETH resistor.
19.6kΩ: 24.5mA
24kΩ: 20mA
30kΩ: 16mA
33kΩ: 14.5mA
• Brightness control
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic p.3 and function (p.12).
15inch panel
Battery
4.7μH
10μF
10LED x 6 parallel
2.2μF *
RTR020N05
SW
FAILSEL
SENSP
VDET
47mΩ
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED2
PWMDRV
100Hz~10kHz
PWM
LED3
VBAT
LED4
VREG
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
24kΩ
Can be set up to each 10 ~25mA
Figure 48. 10 series×6 parallel, LED current 20mA setting
Current driver PWM application
13 to 14inch panel
Battery
Battery
4.7μH
10μF
8LED x 6 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
8LED x 6 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
51mΩ
VDET
51mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
100Hz~1kHz
PWM
LED2
PWMDRV
LED2
LED3
VBAT
LED4
VREG
LED1
PWMDRV
100Hz~10kHz
PWM
LED3
VBAT
RSTB
PWMPOW
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 20mA
24kΩ
24kΩ
Can be set up to each 10~25mA
Can be set up to each 10~25mA
Figure 49. 8 series× parallel, LED current 20mA setting
Power control PWM application;:n
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TSZ22111･15･001
Figure 50. 8 series×6 parallel, LED current 20mA setting
Current driver PWM application
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TSZ02201-0G3G0C400180-1-2
03.Dec.2012 Rev.001
Datasheet
BD6583MUV-A
• LED current setting controlled ISETH resistor.
19.6kΩ: 24.5mA
24kΩ: 20mA
30kΩ: 16mA
33kΩ: 14.5mA
• Brightness control
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.3 and function (page.12).
10 to 12inch panel
Battery
Battery
4.7μH
10μF
7LED x 6 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
10LED x4 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
56mΩ
VDET
56mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED3
VBAT
LED4
VREG
LED2
PWMDRV
100Hz~10kHz
PWM
LED3
VBAT
LED1
PWMPOW
LED2
PWMDRV
100Hz~10kHz
PWM
RSTB
LED1
PWMPOW
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 16mA
Each 20mA
30kΩ
24kΩ
Can be set up to each 10~25mA
Figure 51. 7 series×6 parallel, LED current 16mA setting
Current driver PWM application
Can be set up to each 10~25mA
Figure 52. 10 series×4 parallel, LED current 20mA setting
Current driver PWM application
7inch panel
Battery
Battery
4.7μH
10μF
8LED x 3 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
6LED x 4 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
68mΩ
VDET
68mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED2
PWMDRV
100Hz~10kHz
PWM
LED2
LED3
VBAT
LED4
VREG
LED1
PWMDRV
100Hz~10kHz
PWM
LED3
VBAT
RSTB
PWMPOW
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 20mA
24kΩ
24kΩ
Can be set up to each 10~25mA
Can be set up to each 10~25mA
Figure 53. 8 series×3 parallel, LED current 20mA setting
Current driver PWM application
Figure 54. 6 series×4 parallel, LED current 20mA setting
Current driver PWM application
* Please select the capacitor which the little bias fluctuation.
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TSZ02201-0G3G0C400180-1-2
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Datasheet
BD6583MUV-A
• LED current setting controlled ISETH resistor.
19.6kΩ: 24.5mA
24kΩ: 20mA
30kΩ: 16mA
33kΩ: 14.5mA
• Brightness control
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.3 and function (page.12).
7inch panel
Battery
Battery
4.7μH
10μF
4LED x 6 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
8LED x 3 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
68mΩ
VDET
68mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
100Hz~1kHz
PWM
LED2
PWMDRV
RSTB
LED1
PWMPOW
100Hz~1kHz
PWM
LED2
PWMDRV
LED3
VBAT
LED3
VBAT
LED4
VREG
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 40mA
24kΩ
24kΩ
Can be set up to each 10~25mA
Can be set up to each 20~50mA
Figure 55. 4 series×6 parallel, LED current 20mA setting
Power control PWM application
Figure 56. 8 series×3 parallel, LED current 40mA setting
Power control PWM application
5inch panel
Battery
Battery
4.7μH
10μF
8LED x 2 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
8LED x 2 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
82mΩ
VDET
82mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED2
PWMDRV
100Hz~10kHz
PWM
RSTB
LED1
PWMPOW
100Hz~1kHz
PWM
LED2
PWMDRV
LED3
VBAT
LED3
VBAT
LED4
VREG
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 40mA
24kΩ
24kΩ
Can be set up to each 10~25mA
Figure 57. 8 series×2 parallel, LED current 20mA setting
Current driver PWM application
Can be set up to each 20~50mA
Figure 58. 8 series×2 parallel, LED current 40mA setting
Power control PWM application
* Please select the capacitor which the little bias fluctuation.
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TSZ02201-0G3G0C400180-1-2
03.Dec.2012 Rev.001
Datasheet
BD6583MUV-A
• LED current setting controlled ISETH resistor.
19.6kΩ: 24.5mA
24kΩ: 20mA
30kΩ: 16mA
33kΩ: 14.5mA
• Brightness control
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.3 and function (page.12).
5inch panel
Battery
Battery
4.7μH
10μF
4LED x 4 parallel
4.7μH
10μF
2.2μF *
RTR020N05
SW
8LED x 2 parallel
2.2μF *
FAILSEL
SENSP
RTR020N05
SW
VDET
FAILSEL
SENSP
82mΩ
VDET
82mΩ
SENSN
Power
ON/OFF
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED2
PWMDRV
100Hz~10kHz
PWM
LED2
LED3
VBAT
LED4
VREG
LED1
PWMDRV
100Hz~10kHz
PWM
LED3
VBAT
RSTB
PWMPOW
LED4
VREG
LED5
1μF
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
Each 60mA
24kΩ
24kΩ
Can be set up to each 10~25mA
Can be set up to each 30~75mA
Figure 59. 4 series×4 parallel, LED current 20mA setting
Current driver PWM application
Figure 60. 8 series×2 parallel, LED current 60mA setting
Current driver PWM application
Battery
4.7μH
10μF
3LED x 5 parallel
2.2μF *
RTR020N05
SW
FAILSEL
SENSP
VDET
82mΩ
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
100Hz~1kHz
PWM
LED2
PWMDRV
LED3
VBAT
LED4
VREG
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
24kΩ
Can be set up to each 10~25mA
Figure 61. 3 series×5 parallel, LED current 20mA setting
Power control PWM application
* Please select the capacitor which the little bias fluctuation.
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TSZ02201-0G3G0C400180-1-2
03.Dec.2012 Rev.001
Datasheet
BD6583MUV-A
• LED current setting controlled ISETH resistor.
19.6kΩ: 24.5mA
24kΩ: 20mA
30kΩ: 16mA
33kΩ: 14.5mA
• Brightness control
Please input PWM pulse from PWMPOW or PWMDRV terminal.
Please refer electrical characteristic page.3 and function (page.12).
For the application of 22V and more
For big current LED
Coil power supply
6~30V
Battery
Battery
4.7μH
10μF
4.7μH
10μF
8LED x 1 parallel
8LED x 6 parallel
2.2μF *
2.2μF *
RTR020N05
RTR020N05
SW
FAILSEL
SENSP
SW
FAILSEL
SENSP
VDET
VDET
82mΩ
51mΩ
SENSN
SENSN
Power
ON/OFF
Power
ON/OFF
RSTB
PWMPOW
VBAT
LED1
LED2
PWMDRV
100Hz~10kHz
PWM
LED3
LED3
2.7~22V
IC
power
supply
LED2
PWMDRV
200Hz
PW M
RSTB
PWMPOW
LED1
VBAT
LED4
LED4
1μF
VREG
VREG
LED5
LED5
1μF
1μF
GND GND GND GND TEST ISETH ISETL LED6
GND GND GND GND TEST ISETH ISETL LED6
120mA
Each 20mA
24kΩ
24kΩ
Can be set up to 60~150mA
Can be set up to each 10~25mA
Figure 62.
Figure 63.
The separation of less than an IC power supply 5V and the coil power supply
Coil power supply
6~30V
Battery
4.7μH
10μF
10LED x 6 parallel
2.2μF *
RTR020N05
SW
FAILSEL
SENSP
VDET
51mΩ
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
200Hz
PW M
LED3
VBAT
2.7~5.5V
IC
power
supply
LED2
PWMDRV
LED4
1μF
VREG
LED5
1μF
GND GND GND GND TEST ISETH ISETL LED6
Each 20mA
24kΩ
Can be set up to each 10~25mA
Figure 64.
* Please select the capacitor which the little bias fluctuation.
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Datasheet
BD6583MUV-A
●Application example of Analog dimming
Control LED current to charged D/A voltage.
Show application example and typ control.
Please decide final value after you evaluated application, characteristic.
Battery
4 .7μH
10 μF
8 LED x 6 parallel
D/A
0.05V
0.2V
0.4V
0.5V
0.6V
0.7V
2.2μF *
RTR 020N0 5
SW
FAILSEL
VDET
SENSP
51mΩ
SENSN
Power
ON/OFF
RSTB
LED1
PWMPOW
LED2
PW MDRV
LED current
19.4mA
14.4mA
7.7mA
4.4mA
1.0mA
0mA
LED3
VBAT
LED4
VREG
1μF
LED current =
L ED5
GND GND GND GND TEST ISETH ISETL L ED6
Each 20m A
470kΩ
24kΩ
typ LED current =
ISET voltage ISET voltage -D/A
+
×800
470kΩ
24kΩ
0.6V
470kΩ
+
0.6V-D/A
24kΩ
×800
D/A
Figure 65. Analog style optical application
* Please select the capacitor which the little bias fluctuation.
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Datasheet
BD6583MUV-A
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
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Datasheet
BD6583MUV-A
●Ordering Information
B
D
6
5
8
3
Part Number
M
U
V
-
A
Package
MUV= VQFN024V4040
E2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VQFN024V4040 (TOP VIEW)
Part Number Marking
BD6583
LOT Number
1PIN MARK
Figure 66. Marking Diagram
●Physical Dimension Tape and Reel Information
VQFN024V4040
<Tape and Reel information>
4.0±0.1
4.0±0.1
1.0MAX
2.4±0.1
0.4±0.1
7
12
19
18
0.5
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
6
24
0.75
E2
2.4±0.1
1
2500pcs
(0.22)
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
13
+0.05
0.25 -0.04
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Figure 67. VQFN024V4040
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BD6583MUV-A
●Revision History
Date
Revision
21.Nov.2012
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001