MCP19114 DATA SHEET (03/02/2015) DOWNLOAD

MCP19114/5
Digitally Enhanced Power Analog Synchronous Low-Side PWM Controller
Features
Microcontroller Features
• Input Voltage: 4.5V to 42V
• Can be Configured with Multiple Topologies
Including but not Limited to:
- Flyback
- Ćuk
- Boost
- SEPIC (Single-Ended Primary-Inductor
Converter)
• Capable of Quasi-Resonant or Fixed-Frequency
Operation
• Low Quiescent Current: 5 mA Typical
• Low Sleep Current: 30 µA Typical
• Low-Side Gate Drivers:
- +5V gate drive
- 0.5A sink/source current
- +10V gate drive
- 1A sink/source current
• Peak Current Mode Control
• Differential Remote Output Sense
• Multiple Output Systems:
- Master or Slave
• AEC-Q100 Qualified
• Configurable Parameters:
- VREF, Precision IOUT/VOUT Set Point (DAC)
- Input Undervoltage Lockout (UVLO)
- Input Overvoltage Lockout (OVLO)
- Detection and protection
- Primary current leading edge blanking (0,
50 ns, 100 ns and 200 ns)
- Gate drive dead time (16 ns to 256 ns)
- Fixed switching frequency range: 31.25 kHz
to 2.0 MHz
- Slope compensation
- Quasi-resonant configuration with built-in
comparator and programmable offset voltage
adjustment
- Primary current offset adjustment
- Configurable GPIO pin options
• Integrated Low-Side Differential Current Sense
Amplifier
• ±5% Current Regulation
• Thermal Shutdown
• Precision 8 MHz Internal Oscillator Block:
- Factory-calibrated to ±1%, typical
• Interrupt-Capable
- Firmware
- Interrupt-on-change pins
• Only 35 Instructions to Learn
• 4096 Words On-Chip Program Memory
• High-Endurance Flash:
- 100,000 write Flash endurance
- Flash retention: >40 years
• Watchdog Timer (WDT) with Independent
Oscillator for Reliable Operation
• Programmable Code Protection
• In-Circuit Serial Programming™ (ICSP™) via Two
Pins
• Eight I/O Pins and One Input-Only Pin
- Two open-drain pins
• Analog-to-Digital Converter (ADC):
- 10-bit resolution
- Five external channels
• Timer0: 8-bit Timer/Counter with 8-bit Prescaler
• Enhanced Timer1:
- 16-bit timer with prescaler
- Two selectable clock sources
• Timer2: 8-Bit Timer with Prescaler
- 8-bit period register
• I2CTM Communication:
- 7-bit address masking
- Two dedicated address registers
 2014-2015 Microchip Technology Inc.
DS20005281B-page 1
MCP19114/5
GPB1/AN4/VREF2
ICOMP
IFB
VS
VIN
VDD
24
23
22
21
20
19
Pin Diagram – 24-Pin QFN (MCP19114)
GPA0/AN0/TEST_OUT 1
18
VDR
GPA1/AN1/CLKPIN
2
17
PDRV
GPA2/AN2/T0CKI/INT
3
16
SDRV
MCP19114
GPA3/AN3
4
15
PGND
GPA7/SCL/ICSPCLK
5
14
AGND
GPA6/CCD/ICSPDAT
6
13
IP
DS20005281B-page 2
12
11
ISP
ISN
10
DESATP/ISOUT
9
DESATN
8
GPB0/SDA
GPA5/MCLR/TEST_EN
7
EXP-25
 2014-2015 Microchip Technology Inc.
MCP19114/5
24-Pin QFN
ANSEL
A/D
Timers
MSSP
Interrupt
Pull-Up
24-PIN SUMMARY
I/O
TABLE 1:
Basic
GPA0
1
Y
AN0
—
—
IOC
Y
—
Analog/Digital Debug Output(1)
GPA1
2
Y
AN1
—
—
IOC
Y
—
Sync Signal In/Out(2)
GPA2
3
Y
AN2
T0CKI
—
IOC
INT
Y
—
—
GPA3
4
Y
AN3
—
—
IOC
Y
—
—
GPA5
7
N
—
—
—
IOC(4)
Y(5)
MCLR
Test Enable Input
GPA6
6
N
—
—
—
IOC
Y
ICSPDAT
Dual Capture/Compare Input
Additional
GPA7
5
N
—
—
SCL
IOC
N
ICSPCLK
—
GPB0
8
N
—
—
SDA
IOC
N
—
—
GPB1
24
Y
AN4
—
—
IOC
Y
—
VREF2(3)
DESATN
9
N
—
—
—
—
—
—
DESAT Negative Input
DESATP/
ISOUT
10
N
—
—
—
—
—
—
DESATP Input or ISOUT
Output(6)
ISP
11
N
—
—
—
—
Y
—
Current Sense Amplifier Positive
Input
ISN
12
N
—
—
—
—
—
—
Current Sense Amplifier
Negative Input
IP
13
N
—
—
—
—
—
—
Primary Input Current Sense
AGND
14
N
—
—
—
—
—
AGND
Small Signal Ground
PGND
15
N
—
—
—
—
—
PGND
Large Signal Ground
SDRV
16
N
—
—
—
—
—
—
Secondary LS Gate Drive
Output
PDRV
17
N
—
—
—
—
—
—
Primary LS Gate Drive
Output
VDR
18
N
—
—
—
—
—
VDR
Gate Drive Supply Voltage
VDD
19
N
—
—
—
—
—
VDD
VDD Output
VIN
20
N
—
—
—
—
—
VIN
Input Supply Voltage
VS
21
N
—
—
—
—
—
—
Output Voltage Sense
IFB
22
N
—
—
—
—
—
—
Error Amplifier Feedback Input
23
N
—
—
—
—
—
—
Error Amplifier Output
ICOMP
Note 1:
2:
3:
4:
5:
6:
The Analog/Digital Debug Output is selected through the control of the ABECON register.
Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the
MODECON register.
VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the
MODECON register.
The IOC is disabled when MCLR is enabled.
Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control.
When RFB of MODECON<5> = 0, the internal feedback resistor and DESATP input are enabled. When
RFB = 1, ISOUT is enabled.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 3
MCP19114/5
GPB6/AN7
GPB5/AN6/ICSPCLK
GPB1/AN4/VREF2
ICOMP
IFB
VS
VIN
28
27
26
25
24
23
22
Pin Diagram – 28-Pin QFN (MCP19115)
GPA0/AN0/TEST_OUT 1
21
VDD
GPA1/AN1/CLKPIN
2
20
VDR
GPA2/AN2/T0CKI/INT
3
19
PDRV
GPB4/AN5/ICSPDAT
4
18
SDRV
GPA3/AN3 5
17
PGND
6
16
AGND
15
IP
GPA7/SCL
MCP19115
EXP-29
DS20005281B-page 4
14
ISN
ISP 13
DESATP/ISOUT 12
DESATN 11
9
GPB7/CCD
GPB0/SDA 10
8
GPA5/MCLR/TEST_EN
GPA6/CCD
7
 2014-2015 Microchip Technology Inc.
MCP19114/5
28-Pin QFN
ANSEL
A/D
Timers
MSSP
Interrupt
Pull-Up
28-PIN SUMMARY
I/O
TABLE 2:
Basic
GPA0
1
Y
AN0
—
—
IOC
Y
—
Analog/Digital Debug Output(1)
GPA1
2
Y
AN1
—
—
IOC
Y
—
Sync Signal In/Out(2)
GPA2
3
Y
AN2
T0CKI
—
IOC
INT
Y
—
—
GPA3
5
Y
AN3
—
—
IOC
Y
—
—
(4)
IOC
(5)
Y
Additional
GPA5
8
N
—
—
—
MCLR
Test Enable Input
GPA6
7
N
—
—
—
IOC
Y
—
Dual Capture/Single
Compare1 Input
GPA7
6
N
—
—
SCL
IOC
N
—
—
GPB0
10
N
—
—
SDA
IOC
N
—
—
GPB1
26
Y
AN4
—
—
IOC
Y
—
VREF2(3)
GPB4
4
Y
AN5
—
—
IOC
Y
ICSPDAT
—
GPB5
27
Y
AN6
—
—
IOC
Y
ICSPCLK
—
GPB6
28
Y
AN7
—
—
IOC
Y
—
—
GPB7
9
Y
—
—
—
IOC
Y
—
Single Compare2 Input
DESATP/
ISOUT
12
N
—
—
—
—
—
—
DESATP input or ISOUT
Output(6)
DESATN
11
N
—
—
—
—
—
—
DESAT Negative Input
ISP
13
N
—
—
—
—
Y
—
Current Sense Amplifier
Noninverting Input
ISN
14
N
—
—
—
—
—
—
Current Sense Amplifier
Inverting Input
IP
15
N
—
—
—
—
—
—
Primary Input Current Sense
AGND
16
N
—
—
—
—
—
AGND
Small Signal Ground
PGND
17
N
—
—
—
—
—
PGND
Large Signal Ground
SDRV
18
N
—
—
—
—
—
—
Secondary LS Gate Drive
Output
PDRV
19
N
—
—
—
—
—
—
Primary LS Gate Drive Output
VDR
20
N
—
—
—
—
—
VDR
Gate Drive Supply Voltage
VDD
21
N
—
—
—
—
—
VDD
VDD Output
VIN
22
N
—
—
—
—
—
VIN
Input Supply Voltage
VS
23
N
—
—
—
—
—
—
Output Voltage Sense
IFB
24
N
—
—
—
—
—
—
Error Amplifier Feedback input
ICOMP
25
N
—
—
—
—
—
—
Error Amplifier Output
Note 1:
2:
3:
4:
5:
6:
The Analog/Digital Debug Output is selected through the control of the ABECON register.
Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the
MODECON register.
VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the
MODECON register.
The IOC is disabled when MCLR is enabled.
Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control.
When RFB of MODECON<6> = 0, the internal feedback resistor is enabled allow with DESATP input.
When RFB = 1, ISOUT is enabled.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 5
MCP19114/5
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Pin Description ........................................................................................................................................................................... 13
3.0 Functional Description ................................................................................................................................................................ 19
4.0 Electrical Characteristics ............................................................................................................................................................ 22
5.0 Digital Electrical Characteristics ................................................................................................................................................. 29
6.0 Configuring the MCP19114/5 ..................................................................................................................................................... 37
7.0 Typical Performance Curves ...................................................................................................................................................... 53
8.0 System Bench Testing ................................................................................................................................................................ 57
9.0 Device Calibration ...................................................................................................................................................................... 59
10.0 Memory Organization ................................................................................................................................................................. 69
11.0 Device Configuration .................................................................................................................................................................. 81
12.0 Oscillator Modes......................................................................................................................................................................... 83
13.0 Resets ........................................................................................................................................................................................ 85
14.0 Interrupts .................................................................................................................................................................................... 93
15.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 101
16.0 Watchdog Timer (WDT)............................................................................................................................................................ 103
17.0 Flash Program Memory Control ............................................................................................................................................... 105
18.0 I/O Ports .................................................................................................................................................................................... 111
19.0 Interrupt-On-Change ................................................................................................................................................................ 121
20.0 Internal Temperature Indicator Module..................................................................................................................................... 125
21.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 127
22.0 Timer0 Module.......................................................................................................................................................................... 137
23.0 Timer1 Module with Gate Control............................................................................................................................................. 139
24.0 Timer2 Module.......................................................................................................................................................................... 143
25.0 Enhanced PWM Module........................................................................................................................................................... 145
26.0 Dual Capture/Compare (CCD) Module..................................................................................................................................... 149
27.0 PWM Control Logic .................................................................................................................................................................. 153
28.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 155
29.0 Instruction Set Summary .......................................................................................................................................................... 199
30.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 209
31.0 Development Support................................................................................................................................................................211
32.0 Packaging Information.............................................................................................................................................................. 215
Appendix A: Revision History............................................................................................................................................................. 221
Index .................................................................................................................................................................................................. 223
The Microchip Web Site ..................................................................................................................................................................... 229
Customer Change Notification Service .............................................................................................................................................. 229
Customer Support .............................................................................................................................................................................. 229
Product Identification System............................................................................................................................................................. 231
DS20005281B-page 6
 2014-2015 Microchip Technology Inc.
MCP19114/5
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 2014-2015 Microchip Technology Inc.
DS20005281B-page 7
MCP19114/5
NOTES:
DS20005281B-page 8
 2014-2015 Microchip Technology Inc.
MCP19114/5
1.0
DEVICE OVERVIEW
The MCP19114/5 are highly integrated, mixed-signal
low-side synchronous controllers that operate from
4.5V to 42V. The family features an analog PWM
controller with an integrated microcontroller core used
for LED lighting systems, battery chargers and other
low-side switch PWM applications. The devices feature
an analog internal PWM controller similar to the
MCP1631, and a standard PIC® microcontroller similar
to the PIC12F617.
Complete customization of device operating
parameters, start-up or shutdown profiles, protection
levels and fault handling procedures are accomplished
by setting digital registers using Microchip’s MPLAB® X
Integrated Development Environment software and
one of Microchip’s many in-circuit debugger and device
programmers.
The MCP19114/5 mixed-signal low-side synchronous
controllers feature integrated programmable input
UVLO/OVLO, programmable output overvoltage (OV),
two low-side gate drive outputs with independent
programmable dead time, programmable leading edge
blanking (four steps), programmable 6-bit slope
compensation
and
an
integrated
internal
programmable
oscillator
for
fixed-frequency
applications. An integrated 8-bit reference voltage
(VREF) is used for setting output voltage or current. An
internal
comparator
supports
quasi-resonant
applications. Additional Capture and Compare
modules are integrated for additional control, including
enhanced dimming capability. The MCP19114/5
devices contain two internal LDOs. A 5V LDO is used
to power the internal processor and provide 5V
externally. This 5V external output can be used to
supply the gate drive. An analog filter between the VDD
output and the VDR input is recommended when
implementing a 5V gate drive supplied from VDD. Two
4.7 µF capacitors are recommended with one placed
as close as possible to VDD and one as close as
possible to VDR, separated by a 10 isolation resistor.
DO NOT exceed 10 µF on the VDD. An external supply
is required to implement higher gate drive voltages. By
utilizing Microchip’s TC1240A voltage doubler supplied
from VDD to provide VDR, a 10V gate drive can be
achieved. A 4V LDO is used to power the internal
analog circuitry. The two low-side drivers can be used
to operate the power converter in bidirectional mode,
enabling the “shaping” of LED dimming current in LED
applications or developing bidirectional power
converters for battery-powered applications.
The ability for system designers to configure
application-specific features allows the MCP19114/5 to
be offered in smaller packages than currently available
in integrated devices today. The General Purpose
Input/Output (GPIO) of the MCP19114/5 can be
configured to offer a status output; a device enable, to
control an external switch; a switching frequency
synchronization output or input or even a device status
or "heartbeat" indicator. This flexibility allows the
MCP19114/5 packages and complete solutions to be
smaller, thereby saving size and cost of the system
printed circuit boards.
With integrated features like output current adjustment
and dynamic output voltage positioning, the
MCP19114/5 family has the best in-class performance
and highest integration level currently available.
Power trains supported by this architecture include but
are not limited to boost, flyback, quasi-resonant
flyback, SEPIC, Ćuk, etc. Two low-side gate drivers are
capable of sinking and sourcing 1A at 10V VDR. With a
5V gate drive, the driver is capable of 0.5A sink and
source. The user has the option to allow the VIN UVLO
to shut down the drivers by setting the UVLOEN bit.
When this bit is not set, the device drivers will ride
through the UVLO condition and continue to operate
until VDR reaches the gate drive UVLO value. This
value is selectable at 2.7V or 5.4V and is always
enabled. An internal reset for the microcontroller core
is set to 2.0V. An internal comparator module is used to
sense the desaturation of the flyback transformer to
synchronize switching for quasi-resonant applications.
The operating input voltage for normal device operation
ranges from 4.5V to 42V with an absolute maximum of
44V. The maximum transient voltage is 48V for 500 ms.
An I2C serial bus is used for device communications
from the PWM controller to the system.
The MCP19114 is packaged in a 24-lead
4 mm x 4 mm QFN and offers an alternate-bonded
28-lead 5 mm x 5 mm QFN. The MCP19115 is
packaged in a 28-lead 5 mm x 5 mm QFN.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 9
MCP19114/5 FLYBACK SYNCHRONOUS QUASI-RESONANT BLOCK DIAGRAM
VIN 4.5V to 42V
VS CHS4
8
OV
OV_REF
OV REF
Bias Gen
CHS2
LIN
8
VREF2
VREF2
LIN
8
VREF
VIN/n
CHS0
VZC
IFB
BGAP
CHS1
A1
VZC
ISP
CHS6
A = 10
A2
A2
2 lsb
BGAP
OVLO_REF
CHS9
-
BGAP
DESATN
DESATP
8.8V to 44V
VVDD
VDR 2.7V or 5.4V
UVLO
5V to 10V
Gate
Drive
Timing
CHS10
PGND
4
ADJ
Offset
Lin
4
DESAT
MUX
QRS
Place recommended VVDD and VDR 4.7 μF
Capacitors as close to respective pins as possible
VDR
Gate
Drive
Timing
OV
VZC
DESAT P
/ ISOUT
PDRV
PWM
PGND
BGAP
AMUX
ADC
OSC
PIC CORE
ccd
DMUX
 2014-2015 Microchip Technology Inc.
OV UVLO OVLO VDD_OK
I/O
AGND
AGND
PGND
PGND
4.7 μF
ISP
ISN
LEB
DESAT N
VDR
10Ω
SDRV
2
IP
VVDD
4
IP_COMP
ISN
Interrupt and Logic to
PWM & PIC
4.7 μF
PWM Logic
PWM Comp
RFB
MUX
VVDD
OVLO
+
EA_SC
CHS5
IP
4V to 20V
UVLO
-
VIN_OVLO
6
Slope
Comp
Log
VZC
ICOMP
+
4 msb
OC 4 msb
Clamp
BG
RFB_INT
5 kΩ
PDRV
UVLO_REF
CHS8
VIN_UVLO
See Elec Specs
For Clamp Voltages
AVDD
BGAP
CHS3
EN
VVDD
2 lsb
BGAP
LIN
VREF
VDD (5V)
AVDD (4V)
LDO1
LDO2
VREF2
MUX to
GPB1
MCLR
SDA TEMP
DIMI
VDD
EN1 EN2
I/O x 3
BIN (x7 MCP19115)
GPIO
GPIO
MCP19114/5
DS20005281B-page 10
FIGURE 1-1:
MCP19114/5
FIGURE 1-2:
MCP19114 ĆUK SYNCHRONOUS POSITIVE OUTPUT APPLICATION DIAGRAM
VIN
TC1240
VOLTAGE
DOUBLER
5V
10V
VDR
VIN
EN
VDD
MCLR
DIMI
PDRV
CCD
IP
MCP19114
I/O
VDD
DESATN
4x4 24Ld QFN
DESATP
2
TEMP SNS
I/O
SDRV
ISN
ISP
IFB
VDD
ICOMP
BIN
2
VS
I/O
I/O
AGND
FIGURE 1-3:
PGND
I/O
MCP19114 BOOST QUASI-RESONANT APPLICATION DIAGRAM
VIN
DESATN
DESATP
5V
VDR
VIN
EN
VDD
MCLR
CCD
VDD SW1
I/O
SW2
I/O
2
TEMP SNS
PDRV
IP
DESATN
DESATP
I
MCP19114 SOUT
IFB
I/O
VDD
BIN
2
4x4 24Ld QFN
DIMI
I/O
AGND
 2014-2015 Microchip Technology Inc.
ICOMP
DESATN
DESATP
SW1
SW2
ISP
ISN
VS
SDRV
PGND
DS20005281B-page 11
MCP19114/5
FIGURE 1-4:
MICROCONTROLLER CORE BLOCK DIAGRAM
Configuration
13
Flash
4K x 14
Program
Memory
Program
Bus
PORTGPA
GPA0
GPA1
GPA2
GPA3
RAM
256
bytes
File
Registers
8 Level Stack
(13-bit)
14
8
Data Bus
Program Counter
RAM Addr
GPA5
GPA6
GPA7
9
Addr MUX
Instruction reg.
Direct Addr
7
8
Indirect
Addr
PORTGPB
GPB0
GPB1
FSR reg.
STATUS reg.
8
Instruction
Decode &
Control
TESTCLKIN
Timing
Generation
3
Power-Up
Timer
GPB4 (MCP19115)
GPB5 (MCP19115)
MUX
GPB6 (MCP19115)
GPB7 (MCP19115)
ALU
Power-On
Reset
8
W reg
Watchdog
Timer
I2C™
SDA
SCL
8 MHz Internal
Oscillator
MCLR VIN VSS
Timer0
PMDATL
Self read/
write flash
memory
Timer2
Timer1
EEADDR
T0CKI
Analog Interface
Registers
Enhanced
CCD
GPA6
DS20005281B-page 12
PWM
GPB7 (MCP19115)
 2014-2015 Microchip Technology Inc.
MCP19114/5
2.0
PIN DESCRIPTION
The 24-lead MCP19114 and 28-lead MCP19115
devices feature pins that have multiple functions
associated with each pin. Table 2-1 provides a
description of the different functions. Refer to
Section 2.1 “Detailed Pin Functional Description”
for more detailed information.
TABLE 2-1:
MCP19114/5 PINOUT DESCRIPTION
Name
Function
Input
Type
GPA0
TTL
AN0
AN
—
A/D Channel 0 input
TEST_OUT
—
—
Internal analog/digital signal multiplexer output(1)
GPA1
TTL
AN1
AN
CLKPIN
ST
CMOS Switching frequency clock input or output(2)
GPA2
ST
CMOS General-purpose I/O
AN2
AN
—
A/D Channel 2 input
T0CKI
ST
—
Timer0 clock input
INT
ST
—
External interrupt
GPA3
TTL
AN3
AN
—
A/D Channel 3 input
GPA0/AN0/TEST_OUT
GPA1/AN1/CLKPIN
GPA2/AN2/T0CKI/INT
GPA3/AN3
Output
Type
Description
CMOS General-purpose I/O
CMOS General-purpose I/O
—
A/D Channel 1 input
CMOS General-purpose I/O
GPA5
TTL
—
General-purpose input only
MCLR
ST
—
Master Clear with internal pull-up
GPA5/MCLR
GPA6/CCD/ICSPDAT
GPA6
ST
CMOS General-purpose I/O
ICSPDAT
ST
CMOS Serial Programming Data I/O
CMOS Single Compare output. Dual Capture input
GPA7/SCL/ICSPCLK
CCD
ST
GPA7
ST
OD
General-purpose open drain I/O
SCL
2C™
OD
I2C clock
ST
—
Serial Programming Clock
ICSPCLK
GPB0/SDA
I
GPB0
TTL
OD
General-purpose I/O
SDA
I2C™
OD
I2C data input/output
GPB1
TTL
AN4
AN
—
A/D Channel 4 input
VREF2
—
AN
VREF2 DAC Output(3)
GPB4
TTL
GPB1/AN4/VREF2
GPB4/AN5/ICSPDAT
(MCP19115 Only)
CMOS General-purpose I/O
CMOS General-purpose I/O
AN5
AN
ICSPDAT
ST
CMOS Primary Serial Programming Data I/O
GPB5
TTL
CMOS General-purpose I/O
AN6
AN
—
A/D Channel 6 input
ISCPCLK
ST
—
Primary Serial Programming Clock
GPB5/AN6/ICSPCLK
(MCP19115 Only)
—
A/D Channel 5 input
Legend:
AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open-Drain
TTL = TTL compatible input
ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C
Note 1:
The Analog/Digital Debug Output is selected through the control of the ABECON register.
2:
3:
Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register.
VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON
register.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 13
MCP19114/5
TABLE 2-1:
MCP19114/5 PINOUT DESCRIPTION (CONTINUED)
Function
Input
Type
GPB6/AN7
(MCP19115 Only)
GPB6
TTL
AN7
AN
GPB7/CCD
(MCP19115 Only)
GPB7
TTL
CMOS General-purpose I/O
CMOS Single Compare output. Dual Capture input.
Name
Output
Type
Description
CMOS General-purpose I/O
—
A/D Channel 7 input
CCD
ST
VIN
VIN
—
—
Device input supply voltage
VDD
VDD
—
—
Internal +5V LDO output pin
VDR
VDR
—
—
Gate drive supply voltage
AGND
AGND
—
—
Small signal quiet ground
PGND
PGND
—
—
Large signal power ground
PDRV
PDRV
—
—
Primary Low-Side MOSFET gate drive
SDRV
SDRV
—
—
Secondary Low-Side MOSFET gate drive
IP
IP
—
—
Primary input current sense
ISN
ISN
—
—
Secondary current sense amplifier negative input
ISP
ISP
—
—
Secondary current sense amplifier positive input
VS
VS
—
—
Sense voltage compared to overvoltage DAC
IFB
ICOMP
DESATP/ISOUT
DESATN
IFB
—
—
Error amplifier feedback input
ICOMP
—
—
Error amplifier output
DESATP/ISOUT
—
—
DESATP: DESAT detect comparator positive input
ISOUT: Secondary current sense amplifier output
DESATN
—
—
DESATN: DESAT detect comparator negative
input
Legend:
AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open-Drain
TTL = TTL compatible input
ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C
Note 1:
The Analog/Digital Debug Output is selected through the control of the ABECON register.
2:
3:
Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register.
VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON
register.
DS20005281B-page 14
 2014-2015 Microchip Technology Inc.
MCP19114/5
2.1
2.1.1
Detailed Pin Functional
Description
GPA0 PIN
2.1.5
GPA5 PIN
GPA5 is a general-purpose TTL input only pin. An
internal weak pull-up and interrupt-on-change are also
available.
GPA0 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
For programming purposes, this pin is to be connected
to the MCLR pin of the serial programmer. Refer to
Section 30.0 “In-Circuit Serial Programming™
(ICSP™)” for more information.
AN0 is an input to the A/D. To configure this pin to be
read by the A/D on channel 0, bits TRISA0 and ANSA0
must be set.
This pin is MCLR when the MCLRE bit is set in the
CONFIG register.
The ABECON register can be configured to set this pin
to the TEST_OUT function. It is a buffered output of the
internal analog or digital signal multiplexers. Analog
signals present on this pin are controlled by the
ADCON0 register. Digital signals present on this pin
are controlled by the ABECON register.
2.1.6
2.1.2
GPA6 is part of the CCD Module. For more information,
refer to Section 26.0 “Dual Capture/Compare (CCD)
Module”.
GPA1 PIN
GPA1 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
AN1 is an input to the A/D. To configure this pin to be
read by the A/D on channel 1, bits TRISA1 and ANSA1
must be set.
When the MCP19114/5 are configured as a master or
slave, this pin is configured to be the switching
frequency synchronization input or output (CLKPIN).
2.1.3
GPA2 PIN
GPA2 is a general-purpose ST input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
GPA6 PIN
GPA6 is a general-purpose CMOS output ST input pin
whose data direction is controlled in TRISGPA.
ICSPDAT is a serial programming data I/O function.
This can be used in conjunction with ICSPCLK to serial
program the device.
2.1.7
GPA7 PIN
GPA7 is a true open drain general-purpose pin whose
data direction is controlled in TRISGPA. There is no
internal connection between this pin and device VDD.
This pin does not have a weak pull-up, but interrupt-on-change is available.
This pin is the primary ICSPCLK input. This can be
used in conjunction with ICSPDAT to serial program
the device.
When the MCP19114/5 is configured for I2C
communication, Section 28.2 “I2C Mode Overview”,
GPA7 functions as the I2C clock (SCL). This pin must
be configured as an input to allow proper operation.
AN2 is an input to the A/D. To configure this pin to be
read by the A/D on channel 2, bits TRISA2 and ANSA2
must be set.
When bit T0CS is set in the OPTION_REG register, the
T0CKI function is enabled. Refer to Section 22.0
“Timer0 Module” for more information.
GPA2 can also be configured as an external interrupt
by setting the INTE bit. Refer to Section 14.2
“GPA2/INT Interrupt” for more information.
2.1.4
GPA3 PIN
GPA3 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
AN3 is an input to the A/D. To configure this pin to be
read by the A/D on channel 3, bits TRISA3 and ANSA3
must be set.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 15
MCP19114/5
2.1.8
GPB0 PIN
2.1.13
GPB7 PIN (MCP19115 ONLY)
GPB0 is a true open-drain general-purpose pin whose
data direction is controlled in TRISGPB. There is no
internal connection between this pin and device VDD.
This pin does not have a weak pull-up, but
interrupt-on-change
is
available.
When
the
MCP19114/5 are configured for I2C communication,
Section 28.2 “I2C Mode Overview”, GPB0 functions
as the I2C clock (SDA). This pin must be configured as
an input to allow proper operation.
GPB7 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
2.1.9
Internal comparator inverting input. Used during
quasi-resonant operation for desaturation detection.
GPB1 PIN
GPB1 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN4 is an input to the A/D. To configure this pin to be
read by the A/D on channel 4, bits TRISB1 and ANSB1
must be set.
When the MCP19114/5 are configured as a master, this
pin is configured to be the VREF2 DAC output.
2.1.10
GPB4 PIN (MCP19115 ONLY)
GPB4 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN5 is an input to the A/D. To configure this pin to be
read by the A/D on channel 5, bits TRISB4 and ANSB4
must be set.
ICSPDAT is the primary serial programming data I/O
function. This is used in conjunction with ICSPCLK to
serial program the device.
2.1.11
GPB5 PIN (MCP19115 ONLY)
GPB5 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN6 is an input to the A/D. To configure this pin to be
read by the A/D on channel 6, bits TRISB5 and ANSB5
must be set.
ICSPCLK is the primary serial programming clock
function. This is used in conjunction with ICSPDAT to
serial program the device.
2.1.12
GPB6 PIN (MCP19115 ONLY)
GPB6 is a general-purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
GPB7 is part of the CCD Module. For more information,
refer to Section 26.0 “Dual Capture/Compare (CCD)
Module”.
2.1.14
2.1.15
DESATN PIN
DESATP/ISOUT PIN
When using the internal comparator for desaturation
detection during quasi-resonant operation, this pin
connects to the comparator’s noninverting input. The
output of the remote sense current sense amplifier gets
configured to utilize the 5 k internal feedback resistor.
When not utilizing the internal comparator and not
configured to use the 5 k internal feedback resistor,
the current sense amplifier gets connected to this pin
and is ISOUT.
2.1.16
ISP PIN
The noninverting input to internal current sense
amplifier, typically used to differentially remote sense
secondary current. This pin can be internally pulled-up
to VDD by setting the <ISPUEN> bit in the PE1 register.
2.1.17
ISN PIN
The inverting input to internal current sense amplifier,
typically used to differentially remote sense secondary
current.
2.1.18
IP PIN
Primary input current sense for current mode control
and peak current limit. For voltage mode control, this
pin can be connected to an artificial ramp.
2.1.19
AGND PIN
AGND is the small signal ground connection pin. This
pin should be connected to the exposed pad on the
bottom of the package.
2.1.20
PGND PIN
Connect all large signal level ground returns to PGND.
These large-signal level ground traces should have a
small loop area and minimal length to prevent coupling
of switching noise to sensitive traces.
AN7 is an input to the A/D. To configure this pin to be
read by the A/D on channel 7, bits TRISB6 and ANSB6
must be set.
DS20005281B-page 16
 2014-2015 Microchip Technology Inc.
MCP19114/5
2.1.21
SDRV PIN
The gate of the low-side secondary MOSFET is
connected to SDRV. The PCB trace connecting SDRV
to the gate must be of minimal length and appropriate
width to handle the high-peak drive current and fast
voltage transitions.
2.1.22
PDRV PIN
The gate of the low-side primary MOSFET is
connected to PDRV. The PCB tracing connecting
PDRV to the gate must be of minimal length and
appropriate width to handle the high-peak drive
currents and fast voltage transitions.
2.1.23
Note:
Upon initial power-up, the device may apply
a weak pull-up effect on GPIO pads that
can be configured as analog inputs. Once
the external capacitance on the 5V (VDD) is
charged and the external 5V regulator
exceeds the internal 4V regulator (AVDD)
the pull-up effect is shut off. To prevent this
parasitic power-up effect, a pull-down resistor of 10 kΩ maximum is recommended for
GPIO with analog input capability. This
applies to GPA0, GPA1, GPA2, GPA3,
GPB1, GPB4 (MCP19115 only), GPBD
(MCP19115 only), GPB6 (MCP19115 only).
VDR PIN
The supply for the low-side drivers is connected to this
pin and has an absolute maximum rating of +13.5V.
This pin can be connected by an RC filter to the VDD
pin.
2.1.24
VDD PIN
The output of the internal +5.0V regulator is connected
to this pin. It is recommended that a 1.0 µF minimum/
10 µF maximum bypass capacitor be connected
between this pin and the GND pin of the device. The
bypass capacitor should be physically placed close to
the device.
2.1.25
VIN PIN
Input power connection pin of the device. It is
recommended that capacitance be placed between this
pin and the GND pin of the device.
2.1.26
VS PIN
Analog input connected to the noninverting input of the
overvoltage comparator. Typically used as output
voltage overvoltage protection. The inverting input of
the overvoltage comparator is controlled by the OV
REF DAC.
2.1.27
IFB PIN
Error amplifier inverting feedback connection.
2.1.28
ICOMP PIN
Error amplifier output signal.
2.1.29
EXPOSED PAD (EP)
It is recommended to connect the exposed pad to
AGND.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 17
MCP19114/5
NOTES:
DS20005281B-page 18
 2014-2015 Microchip Technology Inc.
MCP19114/5
3.0
FUNCTIONAL DESCRIPTION
3.1
Linear Regulators
The operating input voltage for the MCP19114/5
ranges from 4.5V to 42V. There are two internal Low
Dropout (LDO) voltage regulators. A 5V LDO is used to
power the internal processor and provide a 5V output
for external usage. A second LDO (AVDD) is a 4V
regulator and is used to power the remaining analog
internal circuitry. Using an LDO to power the
MCP19114/5, the input voltage is monitored using a
resistor divider. The MCP19114/5 also incorporate
brown-out protection. Refer to Section 13.3
“Brown-Out Reset (BOR)” for details. The PIC core
will reset at 2.0V VDD.
3.2
Output Drive Circuitry
The MCP19114/5 integrate two low-side drivers used
to drive the external low-side N-Channel power
MOSFETs for synchronous applications, such as
synchronous flyback and synchronous Ćuk converters.
Both converter types can be configured for
nonsynchronous control by replacing the synchronous
FET with a diode. The flyback is also capable of
quasi-resonant operation. The MCP19114/5 can also
be configured as a Boost or SEPIC switch-mode power
supply (SMPS). In Boost mode, nonsynchronous
fixed-frequency or nonsynchronous quasi-resonant
control can be utilized. This device can also be used as
a SEPIC SMPS in fixed-frequency nonsynchronous
mode. The low-side drive is capable of switching the
MOSFET at high frequency in typical SMPS
applications. The gate drive (VDR) can be supplied from
5V to 10V. The drive strength is capable of up to 1A
sink/source with 10V gate drive and down to 0.5A
sink/source with 5V gate drive. A programmable delay
is used to set the gate turn-on dead time. This prevents
overlap and shoot-through currents that can decrease
the converter efficiency. Each driver shall have its own
EN input controlled by the microcontroller core.
3.3
Current Sense
The output current is differentially sensed by the
MCP19114/5. In low-current applications, this helps
maintain high system efficiency by minimizing power
dissipation in current sense resistors. Differential
current sensing also minimizes external ground shift
errors. The internal differential amplifier has a typical
gain of 10 V/V.
 2014-2015 Microchip Technology Inc.
3.4
Peak Current Mode
The MCP19114/5 is a peak current mode controlled
device with the current sensing element in series with
the primary side MOSFET. Programmable leading
edge blanking can be implemented to blank current
spikes resulting from turn on. The blank time is
controlled from the ICLEBCON register.
Primary input current offset adjust is also available via
user programmability, thus limiting peak primary input
current. This offset adjustment is controlled by the
ICOACON register.
3.5
Magnetic Desaturation Detection
An internal comparator module is used to detect power
train magnetic desaturation for quasi-resonant
applications. The comparator output is used as a signal
to synchronize the start of the next switching cycle.
This
operation
differs
from
the traditional
fixed-frequency application. The DESAT comparator
output can be enabled and routed into the PWM
circuitry or disabled for fixed-frequency applications.
During Quasi-Resonant (QR) operation, the DESAT
comparator output is enabled and combined with a pair
of one-shot timers and a flip-flop to sustain PWM
operation. Timer2 (TMR2) must be initialized and set to
run at a frequency lower than the minimum QR
operating frequency. When the CDSWDE bit is set in
the DESATCON register, TMR2 serves as a watchdog.
An example of the order of events for a Flyback SMPS
in synchronous QR operation is as follows:
The primary gate drive (PDRV) goes high. The output
of the DESAT comparator is high. The primary current
increases until IP reaches the level of the Error Amp
and causes PWM comparator output to go low. The
PDRV goes low and the secondary gate drive (SDRV)
goes high (after programmed dead time). This triggers
the first one-shot to send a 200 ns pulse that resets the
flip-flop and TMR2 (WDM_RESET). The 200 ns
one-shot pulse design is implemented to mask out any
spurious transitions at the DESAT comparator output
caused by switching noise. The SDRV stays high until
the secondary winding completely runs out of energy,
at which time the output capacitance begins to source
current back through the winding and secondary
MOSFET. The DESAT comparator detects this and its
output goes low. This sets the flip-flop and triggers the
second one-shot to send a 33 ns pulse to the control
logic, causing the SDRV to go low and the PDRV to go
high (after programmed dead time). The cycle then
repeats. If, for any reason, the reset one-shot does not
fire, the WDM_RESET signal stays low and TMR2 is
allowed to run until the PWM signal kicks off a new
cycle.
The desaturation comparator module is controlled by
the DESATCON register.
DS20005281B-page 19
MCP19114/5
3.6
Start-Up
To control the output current during start-up, the
MCP19114/5 have the capability to monotonically
increase system current, at the user’s discretion. This
is accomplished through the control of the reference
voltage DAC (VREF). The entire start-up profile is under
user control via software.
3.7
Driver Control Circuitry
The internal driver control circuitry of the MCP19114/5
is comprised of an error amplifier (EA), a high-speed
comparator and a latch similar to the MCP1631.
The error amplifier generates the control voltage used
by the high-speed PWM comparator. There is an
internally generated reference voltage, VREF. The
difference or error between this internal reference
voltage and the actual feedback voltage is the control
voltage. Some applications will implement parked
times where the gate drives are not active. For
example, when changing between LED strings and
after voltage repositioning, the user can disable the
gate drives and park the error amplifier output low.
During the time when the EA is parked, its output will be
clamped low (1 * BG) such that it is in a known state
when reactivated. Before the output switches are
re-enabled, it may be necessary to re-enable the EA
some time prior to enabling the output drivers. This
prior-EA enable time will allow the EA to slew towards
the intended target and prevent the secondary switch
from turning on for an extensive period of time,
unintentionally discharging the output capacitance and
pulling the output voltage down. External
compensation is used to stabilize the control system.
Since the MCP19114/5 are peak current mode
controlled, the comparator compares the primary peak
current waveform (IP) that is based upon the current
flowing in the primary side with the error amplifier
control output voltage. This error amplifier control
output voltage also has user-programmable slope
compensation subtracted from it. In fixed-frequency
applications, the slope compensation signal is
generated to be greater than 1/2 the down slope of the
inductor current waveform and is controlled by the
SLPCRCON register. Offset adjust ability is also
available to set the peak current limit of the primary
switch for overcurrent protection. The range of the
slope compensation ramp is specified. When the
current sense signal reaches the level of the control
voltage minus slope compensation, the on cycle is
terminated and the external switch is latched off until
the beginning of the next cycle which begins at the next
clock cycle.
An S-R latch (Set-Rest-Flip-Flop) is used to prevent the
PWM circuitry from turning the external switch on until
the beginning of the next clock cycle.
3.8
Fixed PWM Frequency
The switching frequency of the MCP19114/5 while not
controlled by the DESAT comparator output is
generated by using a single edge of the 8 MHz internal
clock. The user sets the MCP19114/5 switching
frequency by configuring the PR2 register. The
maximum allowable PDRV duty cycle is adjustable and
is controlled by the PWMRL register. The
programmable range of the switching frequency will be
31.25 kHz to 2 MHz. The available switching frequency
below 2 MHz is defined as FSW = 8 MHz/N, where N is
a whole number between 4  N  256. Refer to
Section 25.0 “Enhanced PWM Module” for details.
3.9
VREF
This reference is used to generate the voltage
connected to the noninverting input of the error
amplifier. The entire analog control loop is raised to a
virtual ground pedestal equal to the Band Gap voltage
(1.23V).
3.10
OV REF
This reference is used to set the output overvoltage set
point. It is compared to the VS input pin, which is
typically proportional to the output voltage based on a
resistor divider. OV protection, when enabled, can be
set to a value for the protection of system circuitry or it
can be used to “ripple” regulate the converter output
voltage for repositioning purposes. For details, refer to
Register 6-4.
3.11
Independent Gate Drive with
Programmable Delay
Two independent low-side gate drives are integrated
for synchronous applications. Programmable delay has
been implemented to improve efficiency and prevent
shoot-through currents. Each gate drive has an
independent enable input controlled by the PE1
register and programmable dead time controlled by the
DEADCON register.
To improve current regulation at low levels, a pedestal
voltage (VZC) set to the BG (1.23V) is implemented.
This virtual ground serves as the reference for the error
amplifier (A1), slope compensation, current sense
amplifier (A2) and the IP offset adjustment.
DS20005281B-page 20
 2014-2015 Microchip Technology Inc.
MCP19114/5
3.12
3.12.1
Temperature Management
THERMAL SHUTDOWN
To protect the MCP19114/5 from overtemperature
conditions, a 150°C junction temperature thermal
shutdown has been implemented. When the junction
temperature reaches this limit, the device disables the
output drivers. In Shutdown mode, both PDRV and
SDRV outputs are disabled and the overtemperature
flag (OTIF) is set in the PIR2 register. When the
junction temperature is reduced by 20°C to 130°C, the
MCP19114/5 can resume normal output drive
switching.
3.12.2
TEMPERATURE REPORTING
The MCP19114/5 have a second on-chip temperature
monitoring circuit that can be read by the ADC through
the analog test MUX. Refer to Section 20.0 “Internal
Temperature Indicator Module” for details on this
internal temperature monitoring circuit.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 21
MCP19114/5
4.0
ELECTRICAL CHARACTERISTICS
4.1
ABSOLUTE MAXIMUM RATINGS †
VIN - VGND (operating) .................................................................................................................................................-0.3V to +44V
VIN (transient < 500 ms) ............................................................................................................................................+48V
PDRV ..................................................................................................................................(GND - 0.3V) to (VDR + 0.3V)
SDRV ....................................................................... ..........................................................(GND - 0.3V) to (VDR + 0.3V)
VDD Internally Generated ......................................... ...............................................................................................+6.5V
VDR Externally Generated ........................................ .............................................................................................+13.5V
Voltage on MCLR with respect to GND .................... ............................................................................... -0.3V to +13.5V
Maximum voltage: any other pin .................................. ...................................................+(VGND - 0.3V) to (VDD + 0.3V)
Maximum output current sunk by any single I/O pin .... ..........................................................................................25 mA
Maximum output current sourced by any single I/O pin ..........................................................................................25 mA
Maximum current sunk by all GPIO.............................. ..........................................................................................90 mA
Maximum current sourced by all GPIO ........................ ..........................................................................................35 mA
Storage Temperature.................................................... ..........................................................................-65°C to +150°C
Maximum Junction Temperature .................................. ........................................................................................ +150°C
Operating Junction Temperature .................................. ..........................................................................-40°C to +125°C
ESD protection on all pins (HBM)................................. ......................................................................................... 2.0 kV
ESD protection on all pins (MM)................................... ........................................................................................... 200V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
4.2
Electrical Characteristics
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
VIN
4.5
—
42
V
IQ
—
5
6.5
mA
—
5
6.75
—
30
150
µA
VIN = 12V
(Note 1)
VDD
4.75
5.0
5.5
V
VIN = 6.0V to 42V
IDD_OUT
35
—
—
mA
VIN = 6.0V to 42V
(Note 4)
Line Regulation
VDD-OUT/
(VDD-OUT * VIN)
-0.1
0.002
0.1
%/V
(VDD + 1.0V)  VIN  20V
(Note 4)
Load Regulation
VDD-OUT/
VDD-OUT
-0.65
0.1
+0.65
%
IDD_OUT = 1 mA to 20 mA
(Note 4)
IDD_SC
—
50
—
mA
Input
Input Voltage
Input Quiescent
Current
Shutdown Current
ISHDN
VIN = 12V, Not switching
VIN = 20V, Not switching
Linear Regulator VDD
Internal Circuitry Bias
Voltage
Maximum External
VDD Output Current
Output Short-Circuit
Current
Note 1:
2:
3:
4:
5:
6:
VIN = (VDD + 1.0V)
(Note 4)
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
DS20005281B-page 22
 2014-2015 Microchip Technology Inc.
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Dropout Voltage
VIN - VDD
—
0.3
0.5
V
IDD_OUT = 20 mA,
(Notes 4 and 5)
Power Supply
Rejection Ratio
PSRRLDO
—
60
—
dB
f  1000 Hz,
IDD_OUT = 25 mA
CIN = 0 µF, CDD = 1 µF
AVDD
—
4.0
—
V
BG
—
1.23
—
V
BGTOL
-2.5
—
+2.5
%
Linear Regulator AVDD
Internal Analog
Supply Voltage
Band Gap Voltage
Band Gap
Tolerance
Trimmed at 1.0% tolerance
Input UVLO Voltage
UVLO Range
UVLOON
4.0
—
20
V
VIN Falling
UVLOON Trip
Tolerance
UVLOTOL
-14
—
14
%
VIN Falling
UVLO trip set to 9V
VINUVLO = 0x21h
UVLO Hysteresis
UVLOHYS
1
4
8
%
Hysteresis is based upon
the UVLOON setting
UVLO trip set to 9V
VINUVLO = 0x21h
nbits
—
6
—
Bits
Logarithmic Steps
TD
—
5
—
µs
100 ns rise time to 1V
overdrive on VIN
VIN > UVLO to flag set
Resolution
UVLO Comparator
Input-to-Output Delay
Input OVLO Voltage
OVLO Range
OVLOON
8.8
—
44
V
VIN Rising
OVLOON Trip
Tolerance
OVLOTOL
-14
—
14
%
VIN Rising
OVLO trip set to 18V
VINOVLO = 0x1Fh
OVLO Hysteresis
OVLOHYS
1
5
8
%
Hysteresis is based upon the
OVLOON setting
OVLO trip set to 18V
VINOVLO = 0x1Fh
nbits
—
6
—
Bits
Logarithmic Steps
TD
—
5
—
µs
100 ns rise time to 1V
overdrive on VIN
VIN > OVLO to flag set
Resolution
OVLO Comparator
Input-to-Output Delay
Output OV DAC
Note 1:
2:
3:
4:
5:
6:
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 23
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Resolution
nbits
—
Full Scale Range
FSR
0
OVREFTOL
-10
Tolerance
Typ.
Max.
Units
8
—
Bits
—
2 * BG
V
—
+10
%
Conditions
Linear DAC
Full Scale, Code = 0xFF
Output OV Comparator
OVHYS
—
50
—
mV
Input Bias Current
IBIAS
—
±1
—
µA
Common-Mode Input
Voltage Range
VCMR
0
—
3.0
V
Note 3
Input-to-Output Delay
TD
—
200
—
ns
Note 3
100 ns rise time to 1V
overdrive on VS
VS > OV to flag set
Linear DAC
OV Hysteresis
Voltage Reference DAC (VREF)
Resolution
nbits
—
8
—
V/V
Full-Scale Range
FSR
BG
—
2 * BG
V
Pedestal set to BG
Voltage Reference DAC (VREF2)
Resolution
nbits
—
8
—
Bits
Full-Scale Range
FSR
0
—
BG
V
Sink Current
ISINK
-3
—
—
mA
VREF2 = 0V,
RL = 300to BG
ISOURCE
3
—
—
mA
VREF2 = BG,
RL = 300to GND
VREF2TOL
-10
—
+10
%
Full Scale, Code = 0xFF
Source Current
Tolerance
Linear DAC
Current Sense Amplifier (A2)
Amplifier PSRR
PSRR
—
65
—
dB
VCM = 2 * BG
Closed-Loop Voltage
Gain
A2VCL
—
10
—
V/V
RL = 5 k to 2.048V,
100 mV < A2 <
AVDD – 100 mV, VCM = BG
VOL
—
300
—
mV
RL = 5 k to 2.048V
Gain-Bandwidth
Product
GBWP
—
10
—
MHz
AVDD = 4V
Input Impedance
RIN
—
10
—
k
ISINK
-3
—
—
mA
ISP = ISN = GND
RL = 300 to 2 * BG
ISOURCE
3
—
—
mA
ISP = ISN = GND
RL = 300 to GND
Low-Level Output
Sink Current
Source Current
Note 1:
2:
3:
4:
5:
6:
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
DS20005281B-page 24
 2014-2015 Microchip Technology Inc.
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Common-Mode
Range
VCMR
GND – 0.3
—
VBG + 0.3
V
Common-Mode
Rejection Ratio
CMRR
—
70
—
dB
Internal Feedback
Resistor
RFB_INT
—
5
—
k
Internal Feedback
Resistor Tol
RFB_INT_TOL
—
2
—
%
VZC
—
BG
—
V
VOS
—
2
—
mV
CMRR
—
65
—
dB
VCM = 0V to BG
Open-Loop Voltage
Gain
AVOL
—
70
—
dB
Note 3
Low-Level Clamp
Value
VOL
BG - 0.35
V
RL = 5 k to 2.048V
GBWP
—
3.5
—
MHz
ISINK
-3
—
—
mA
VREF = BG, IFB = ICOMP
RL = 150 to 1.5 * BG
Error Amplifier Source
Current
ISOURCE
3
—
—
mA
VREF = 2 * BG, IFB = ICOMP
RL = 150 to 1.5 * BG
Maximum Error
Amplifier Output
High-Level Clamp
VEA_MAX
—
2 x BG
—
V
EA Output clamped to
2 x BG Voltage
VIP_MAX
—
BG
1.5
V
Note 3
TD
—
11
20
ns
Note 3
LEB
—
2
—
Bits
LEBRANGE
0
—
256
ns
Note 3
Trimmed
Pedestal Voltage
Pedestal Voltage
Level
Error Amplifier (EA)
Input Offset Voltage
Common-Mode
Rejection Ratio
Gain-Bandwidth
Product
Error Amplifier Sink
Current
BG - 0.22 BG - 0.1
Peak Current Sense Input
Maximum Primary
Current Sense
Signal Voltage
PWM Comparator
Input-to-Output Delay
Peak Current Leading Edge Blanking
Resolution
Blanking Time
Adjustable Range
Note 1:
2:
3:
4:
5:
6:
4-Step Programmable Range
(0, 50,100, and 200 ns)
(Note 3)
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 25
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
OSADJ
—
4
—
Bits
Offset Adjustment
Range
OSADJ_RANGE
0
—
750
mV
Offset Adjustment
Step Size
OSADJ_STEP
—
50
—
mV
Linear Steps
Log Steps
Offset Adjustment (IP Sense)
Resolution
Adjustable Slope Compensation
SCRES
—
6
—
Bits
m
4.1
—
432.5
mV/µs
Slope Step Size
SCSTEP
—
8
—
%
Ramp Set Point
Tolerance
mTOL
—
±1
±30
%
—
±1
—
mV
Trimmed, 5 bits adjustable
Resolution
Slope
Log Steps
Desaturation Detection Comparator
Input Offset Voltage
VOS
Input Bias Current
IBIAS
—
±1
—
µA
Internal Circuit Dependent
Common-Mode Input
Voltage Range
VCMR
GND – 0.3V
—
2.7
V
Note 3
Input-to-Output Delay
TD
—
20
—
ns
VDR UVLO
(2.7V VDR Falling)
VDR_UVLO_2.7_F
2.45
—
2.9
V
VDR UVLO
(2.7 VDR Rising)
VDR_UVLO_2.7_R
2.68
—
3.23
V
VDR UVLO
(2.7V) Hysteresis
VDR_UVLO 2.7 HYS
190
—
415
mV
VDR UVLO
(5.4V VDR Falling)
VDR_UVLO_5.4_F
4.7
—
5.96
V
VDR UVLO
(5.4V VDR Rising)
VDR_UVLO_5.4_R
5.15
—
6.56
V
VDR UVLO
(5.4V) Hysteresis
VDR_UVLO 5.4 HYS
380
—
830
mV
VDR UVLO
Output Driver (PDRV and SDRV)
PDRV/SDRV Gate
Drive Source
Resistance
RDR-SRC
—
—
13.5

VDR = 4.5V
(Note 3)
PDRV/SDRV Gate
Drive Sink Resistance
RDR-SINK
—
—
12

VDR = 4.5V
(Note 3)
Note 1:
2:
3:
4:
5:
6:
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
DS20005281B-page 26
 2014-2015 Microchip Technology Inc.
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
Sym.
PDRV/SDRV Gate
Drive Source Current
IDR-SRC
PDRV/SDRV Gate
Drive Sink Current
IDR-SINK
Min.
Typ.
Max.
Units
A
VDR = 5V
VDR = 10V
(Note 3)
A
VDR = 5V
VDR = 10V
(Note 3)
—
0.5
—
—
1.0
—
—
0.5
—
—
1.0
—
DTRES
—
4
—
Bits
Dead-Time Adjustable
Range
DTRANGE
16
—
256
ns
Dead-Time Step Size
DTSTEP
—
16
—
ns
Dead-Time Tolerance
DTTOL
—
±8
—
ns
Internal Oscillator
Frequency
FOSC
7.60
8.00
8.40
MHz
Switching Frequency
FSW
—
FOSC/N
—
MHz
Switching Frequency
Range Select
N
4
—
255
—
NR
—
—
10
Bits
Conditions
Dead-Time Adjustment
Resolution
Linear Steps
Oscillator/PWM
FMAX = 2 MHz
A/D Converter (ADC) Characteristics
Resolution
Integral Error
EIL
—
—
±1
LSb
VREF_ADC = AVDD
Differential Error
EDL
—
—
±1
LSb
No missing code in 10 bits,
VREF_ADC = AVDD (Note 2)
Offset Error
EOFF
—
+3.0
+7
LSb
VREF_ADC = AVDD
Gain Error
EGN
—
±2
±6
LSb
VREF_ADC = AVDD
Reference Voltage
VREF_ADC
—
AVDD
—
V
Full-Scale Range
FSRA/D
GND
—
AVDD
—
ISINK_GPIO
—
—
90
mA
Note 6
Maximum GPIO
Source Current
ISOURCE_GPIO
—
—
35
mA
Note 6
GPIO Weak Pull-Up
Current
IPULL-UP_GPIO
50
250
400
µA
VGPIO_IL
GND
—
0.8
V
I/O Port with TTL buffer,
VDD = 5V
GND
—
0.2VDD
V
I/O Port with Schmitt
Trigger buffer, VDD = 5V
GND
—
0.2VDD
V
MCLR
GPIO Pins
Maximum GPIO Sink
Current
GPIO Input
Low Voltage
Note 1:
2:
3:
4:
5:
6:
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 27
MCP19114/5
4.2
Electrical Characteristics (Continued)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications
apply over the TA range of -40°C to +125°C.
Parameters
GPIO Input
High Voltage
Sym.
Min.
Typ.
Max.
Units
Conditions
VGPIO_IH
2.0
—
VDD
V
I/O Port with TTL buffer,
VDD=5V
0.8VDD
—
VDD
V
I/O Port with Schmitt
Trigger buffer, VDD = 5V
0.8VDD
—
VDD
V
MCLR
GPIO Output Low
Voltage
VGPIO_OL
—
—
0.12VDD
V
IOL = 7 mA, VDD = 5V
GPIO Output High
Voltage
VGPIO_OH
VDD-0.7
—
—
V
IOH = 2.5 mA, VDD = 5V
GPIO Input Leakage
Current
GPIO_IIL
—
±0.1
±1
µA
Negative current is defined
as current sourced by the
pin.
VPOR
—
1.75
—
V
VPOR_HYS
—
100
—
mV
Thermal Shutdown
TSHD
—
150
—
°C
Thermal Shutdown
Hysteresis
TSHD_HYS
—
20
—
°C
POR
Power-On Reset
Voltage
Power-On Reset
Voltage Hysteresis
Thermal Shutdown
Note 1:
2:
3:
4:
5:
6:
4.3
Refer to Section 15.0 “Power-Down Mode (Sleep)”.
These parameters are characterized, but not production tested.
Ensured by design, not production tested.
VDD is the voltage present at the VDD pin.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential between VIN and VDD.
The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a
maximum of 15 mA.
Thermal Specifications
Parameters
Sym.
Min.
Typ.
Max.
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 24L-QFN 4x4
JA
—
42
—
°C/W
Thermal Resistance, 28L-QFN 5x5
JA
—
35.3
—
°C/W
Temperature Ranges
Thermal Package Resistances
DS20005281B-page 28
 2014-2015 Microchip Technology Inc.
MCP19114/5
5.0
DIGITAL ELECTRICAL
CHARACTERISTICS
5.1
Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
1. TppS2ppS
3. TCC:ST
(I2C™ specifications only)
2. TppS
4. Ts
(I2C specifications only)
T
F
Frequency
Lowercase letters (pp) and their meanings:
pp
cc
CCP1
ck
CLKOUT
cs
CS
di
SDI
do
SDO
dt
Data in
io
I/O port
mc
MCLR
Uppercase letters and their meanings:
S
F
Fall
H
High
I
Invalid (high-impedance)
L
Low
I2C™ only
AA
BUF
T
Time
osc
rd
rw
sc
ss
t0
wr
OSC1
RD
RD or WR
SCK
SS
T0CKI
WR
P
R
V
Z
Period
Rise
Valid
High-Impedance
High
Low
High
Low
Hold
SU
Setup
DATA input hold
START condition
STO
STOP condition
output access
Bus free
TCC:ST (I2C specifications only)
CC
HD
ST
DAT
STA
 2014-2015 Microchip Technology Inc.
DS20005281B-page 29
MCP19114/5
FIGURE 5-1:
LOAD CONDITIONS
Load Condition 1
Load Condition 2
VDD/2
RL
CL
Pin
CL
Pin
VSS
VSS
RL = 464
CL = 50 pF for all GPIO pins
5.2
AC Characteristics: MCP19114 (Industrial, Extended)
FIGURE 5-2:
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC
1
2
TABLE 5-1:
Param.
No.
EXTERNAL CLOCK TIMING REQUIREMENTS
Sym.
Characteristic
Min.
Typ.†
Max.
Units
FOSC
Oscillator Frequency(1)
—
8
—
MHz
—
250
—
ns
—
TCY

ns
1
TOSC
2
TCY
Oscillator
Period(1)
Instruction Cycle Time(1)
Conditions
TCY = 4 * TOSC
* These parameters are characterized but not tested.
† Data in “Typ.” column is at VIN = 12V (VDD = 5V), 25°C unless otherwise stated. These parameters are for
design guidance only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code.
DS20005281B-page 30
 2014-2015 Microchip Technology Inc.
MCP19114/5
FIGURE 5-3:
I/O TIMING
Q1
Q4
Q2
Q3
OSC
22
23
19
18
I/O Pin
(input)
17
I/O Pin
(output)
new value
old value
20, 21
TABLE 5-2:
I/O TIMING REQUIREMENTS
Param.
No.
Sym.
17
TosH2ioV
18
Min.
Typ.†
Max.
Units
OSC1 (Q1 cycle) to Port
out valid
—
50
70*
ns
TosH2ioI
OSC1(Q2 cycle) to Port
input invalid
(I/O in hold time)
50
—
—
ns
19
TioV2osH
Port input valid to OSC1
(I/O in setup time)
20
—
—
ns
20
TioR
Port output rise time
—
32
40
ns
Characteristic
21
TioF
Port output fall time
—
15
30
ns
22*
Tinp
INT pin high or low time
25
—
—
ns
23*
TRABP
TCY
—
—
ns
GPIO
interrupt-on-change
new input level time
Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at VIN = 12V (VDD = 5V), 25C unless otherwise stated.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 31
MCP19114/5
FIGURE 5-4:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
VDD
MCLR
30
Internal
POR
33
PWRT
Time Out
32
OSC
Time Out
Internal
Reset
Watchdog
Timer
Reset
34
31
34
I/O Pins
FIGURE 5-5:
BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
VBOR
BVHY
VBOR + BVHY
35
Reset (Due to BOR)
(Device not in Brown-out Reset)
DS20005281B-page 32
(Device in Brown-out Reset)
64 ms Time Out (if PWRTE)
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 5-3:
Param.
No.
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Sym.
Characteristic
Min.
Typ.†
Max.
Units
Conditions
30
TMCL
MCLR Pulse Width (low)
2
—
—
s
VDD = 5 V, -40°C to +85°C
31
TWDT
Watchdog Timer Time-Out
Period (No Prescaler)
7
18
33
ms
VDD = 5 V, -40°C to +85°C
32
TOST
Oscillation Start-Up Timer
Period
—
1024TOSC
—
—
TOSC = OSC1 period
33*
TPWRT
Power-up Timer Period
(4 x TWDT)
28
72
132
ms
VDD = 5 V, -40°C to +85°C
34
TIOZ
I/O high impedance from
MCLR Low or Watchdog Timer
Reset
—
—
2.0
µs
VBOR
Brown-out Reset voltage
2.0
2.13
2.3
V
BVHY
Brown-out Hysteresis
—
100
—
mV
TBCR
Brown-out Reset pulse width
100*
—
—
µs
2TOSC
—
7TOSC
35
48
TCKEZ-TMR Delay from clock edge to timer
increment
VDD  VBOR (D005)
* These parameters are characterized but not tested.
† Data in “Typ.” column is at VIN = 12V (VDD = AVDD = 5V), 25°C unless otherwise stated. These parameters
are for design guidance only and are not tested.
FIGURE 5-6:
TIMER0 AND TIMER1 EXTERNAL CLOCK TIMING
T0CKI
41
40
42
48
TMR0
 2014-2015 Microchip Technology Inc.
DS20005281B-page 33
MCP19114/5
TABLE 5-4:
Param.
No.
Sym.
40*
Tt0H
41*
TIMER0 EXTERNAL CLOCK REQUIREMENTS
T0CKI High Pulse Width
Tt0L
42*
Min.
Typ.†
No Prescaler
0.5TCY + 20
—
—
ns
With
Prescaler
10
—
—
ns
No Prescaler
0.5TCY + 20
—
—
ns
With
Prescaler
10
—
—
ns
Greater of:
20 or
—
—
ns
Characteristic
T0CKI Low Pulse Width
Tt0P
T0CKI Period
Max. Units
T CY + 40
----------------------N
*
†
Conditions
N = prescale
value
(2, 4, ..., 256)
These parameters are characterized but not tested.
Data in “Typ.” column is at VIN = 12V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
FIGURE 5-7:
PWM TIMINGS
PWM (CLKPIN)
53
Note:
TABLE 5-5:
54
Refer to Figure 5-1 for load conditions.
PWM REQUIREMENTS
Param.
Sym.
No.
Characteristic
Min.
Typ.† Max. Units
53*
TccR
PWM (CLKPIN) output rise time
—
10
25
ns
54*
TccF
PWM (CLKPIN) output fall time
—
10
25
ns
Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at VIN = 12V (AVDD = 4V), 25°C unless otherwise stated. Parameters are for
design guidance only and are not tested.
DS20005281B-page 34
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 5-6:
MCP19114/5 A/D CONVERTER (ADC) CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, operating temperature = 40°C  TA  +125°C
Param.
Sym.
No.
Characteristic
Min.
Typ.†
Max.
Units
Conditions
AD01
NR
Resolution
—
—
10 bits
bit
AD02
EIL
Integral Error
—
—
1
LSb
AVDD = 4.0V
AD03
EDL
Differential Error
—
—
1
LSb
No missing codes to 10 bits
AVDD = 4.0V
AD04
EOFF Offset Error
—
+3.0
+7
LSb
AVDD = 4.0V
AD07
EGN
Gain Error
—
2
6
LSb
AVDD = 4.0V
AD07
VAIN Full-Scale Range
AGND
—
AVDD
V
AD08
ZAIN Recommended Impedance
of Analog Voltage Source
—
—
10
k
* These parameters are characterized but not tested.
† Data in ‘Typ.’ column is at VIN = 12V (AVDD = 4V), 25°C unless otherwise stated. These parameters are
for design guidance only and are not tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module.
TABLE 5-7:
MCP19114/5 A/D CONVERSION REQUIREMENTS
Electrical Specifications: Unless otherwise noted, operating temperature = 40°C  TA  +125°C
Param.
Sym.
No.
Typ.†
Max.
Units
1.6
—
9.0
µs
TOSC-based
1.6
4.0
6.0
µs
ADCS<1:0> = 11 (ADRC mode)
Conversion Time
(not including
Acquisition Time)(1)
—
11
—
TAD
Set GO/DONE bit to new data in A/D
Result registers
AD132* TACQ
Acquisition Time
—
11.5
—
µs
AD133* TAMP
Amplifier Settling
Time
—
—
5
µs
Q4 to A/D Clock Start
—
TOSC/2
—
—
Characteristic
Min.
A/D Clock Period
A/D Internal RC
Oscillator Period
AD131 TCNV
AD130*
AD134
TAD
TGO
Conditions
* These parameters are characterized but not tested.
† Data in ‘Typ.’ column is at VIN = 12V (VDD = AVDD = 5V), 25°C unless otherwise stated. These parameters
are for design guidance only and are not tested.
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 35
MCP19114/5
FIGURE 5-8:
A/D CONVERSION TIMING
BSF ADCON0, GO
134
1/2 TCY
131
Q4
130
A/D CLK
9
A/D DATA
8
7
6
3
OLD_DATA
ADRES
2
1
0
NEW_DATA
ADIF
DONE
GO
SAMPLE
132
SAMPLING STOPPED
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This
allows the SLEEP instruction to be executed.
DS20005281B-page 36
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.0
CONFIGURING THE
MCP19114/5
The MCP19114/5 are analog controllers with a digital
peripheral. This means that device configuration is
handled through register settings instead of adding
external components. There are several internal
configurable comparator modules used to interface
analog circuits to digital processing that are very similar
to a standard comparator module found in many PIC
processors today (i.e. PIC16F1824/1828). The
following sections detail how to set the analog control
registers for all the configurable parameters.
6.1
Input Undervoltage and
Overvoltage Lockout
(UVLO and OVLO)
VINCON is the comparator control register for both the
VINUVLO and VINOVLO registers. It contains the
enable bits, the polarity edge detection bits and the
status output bits for both protection circuits. The
interrupt flags <UVLOIF> and <OVLOIF> in the PIR2
register are independent of the enable <UVLOEN> and
<OVLOEN> bits in the VINCON register. The
<UVLOOUT> undervoltage lockout status output bit in
the VINCON register indicates if an UVLO event has
occurred. The <OVLOOUT> overvoltage lockout status
output bit in the VINCON register indicates if an OVLO
event has occurred.
REGISTER 6-1:
The VINUVLO register contains the digital value that
sets the input undervoltage lockout. UVLO has a range
of 4V to 20V. For VIN values below this range and
above processor come-alive (VDD = 2V), the UVLO
comparator and the UVLOOUT status bit will indicate
an undervoltage condition. If using UVLO to determine
power-up VIN, it is recommended to poll the UVLOOUT
bit for status. When the input voltage on the VIN pin to
the MCP19114/5 is below this programmed level and
the <UVLOEN> bit in the VINCON register is set, both
PDRV and SDRV gate drivers are disabled. This bit is
automatically cleared when the MCP19114/5 VIN
voltage rises above this programmed level.
The VINOVLO register contains the digital value that
sets the input overvoltage lockout. OVLO has a range
of 8.8V to 44V. When the input voltage on the VIN pin to
the MCP19114/5 is above this programmed level and
the <OVLOEN> bit in the VINCON register is set, both
PDRV and SDRV gate drivers are disabled. This bit is
automatically cleared when the MCP19114/5 VIN
voltage drops below this programmed level. Refer to
Figure 27-1.
Note:
The UVLOIF and OVLOIF interrupt flag
bits are set when an interrupt condition
occurs, regardless of the state of its
corresponding enable bit or the Global
Enable bit (GIE) in the INTCON register.
VINCON: UVLO AND OVLO COMPARATOR CONTROL REGISTER
R/W-0
R-0
R/W-0
R/W-0
R/W-0
R-0
R/W-0
R/W-0
UVLOEN
UVLOOUT
UVLOINTP
UVLOINTN
OVLOEN
OVLOOUT
OVLOINTP
OVLOINTN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
UVLOEN: UVLO Comparator Module Logic Enable bit
1 = UVLO Comparator Module Logic enabled
0 = UVLO Comparator Module Logic disabled
bit 6
UVLOOUT: Undervoltage Lockout Status Output
1 = UVLO event has occurred
0 = No UVLO event has occurred
bit 5
UVLOINTP: UVLO Comparator Interrupt on Positive Going Edge Enable bit
1 = The UVLOIF interrupt flag will be set upon a positive going edge of the UVLO
0 = No UVLOIF interrupt flag will be set upon a positive going edge of the UVLO
bit 4
UVLOINTN: UVLO Comparator Interrupt on Negative Going Edge Enable bit
1 = The UVLOIF interrupt flag will be set upon a negative going edge of the UVLO
0 = No UVLOIF interrupt flag will be set upon a negative going edge of the UVLO
 2014-2015 Microchip Technology Inc.
DS20005281B-page 37
MCP19114/5
REGISTER 6-1:
VINCON: UVLO AND OVLO COMPARATOR CONTROL REGISTER (CONTINUED)
bit 3
OVLOEN: OVLO Comparator Module Logic enable bit
1 = OVLO Comparator Module Logic enabled
0 = OVLO Comparator Module Logic disabled
bit 2
OVLOOUT: Overvoltage Lockout Status Output bit
1 = OVLO event has occurred
0 = No OVLO event has occurred
bit 1
OVLOINTP: OVLO Comparator Interrupt on Positive Going Edge Enable bit
1 = The OVLOIF interrupt flag will be set upon a positive going edge of the OVLO
0 = No OVLOIF interrupt flag will be set upon a positive going edge of the OVLO
bit 0
OVLOINTN: OVLO Comparator Interrupt on Negative Going Edge Enable bit
1 = The OVLOIF interrupt flag will be set upon a negative going edge of the OVLO
0 = No OVLOIF interrupt flag will be set upon a negative going edge of the OVLO
REGISTER 6-2:
VINUVLO: INPUT UNDERVOLTAGE LOCKOUT REGISTER
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
UVLO5
UVLO4
UVLO3
UVLO2
UVLO1
UVLO0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
UVLO<5:0>: Undervoltage Lockout Configuration bits
UVLO(V) = 3.5472 * (1.0285N) where N = the decimal value written to the VINUVLO Register from 0
to 63
REGISTER 6-3:
VINOVLO: INPUT OVERVOLTAGE LOCKOUT REGISTER
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
OVLO5
OVLO4
OVLO3
OVLO2
OVLO1
OVLO0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
OVLO<5:0>: Overvoltage Lockout Configuration bits
OVLO(V) = 7.4847 * (1.0286N) where N = the decimal value written to the VINOVLO Register from 0
to 63
DS20005281B-page 38
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.2
Output Overvoltage Protection
The OVCON register contains the interrupt flag polarity
and OV enable bits along with the output status bit just
as VINCON does for the input voltage UVLO and
OVLO. When <OVEN> bit in the OVCON register is set
and an overvoltage occurs, the control logic will
automatically set the secondary gate drive output
(SDRV) high and set the primary gate drive output
(PDRV) low.
The MCP19114/5 feature output overvoltage
protection. This feature also utilizes a comparator
module similar to the standard PIC comparator module.
This is used to prevent the power system from being
damaged when the load is disconnected. The
OVREFCON register contains the digital value that
sets the analog DAC voltage at the inverting input of the
comparator. By comparing the divided down power
train output voltage connected to the noninverting input
(VS) of the comparator with the OVREF reference
voltage, the user will know when an overvoltage event
has occurred and can automatically take action.
REGISTER 6-4:
Note:
The OVIF interrupt flag bit is set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit or
the Global Enable bit (GIE) in the INTCON
register.
OVCON: OUTPUT OVERVOLTAGE COMPARATOR CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-0
R-0
R/W-0
R/W-0
—
—
—
—
OVEN
OVOUT
OVINTP
OVINTN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3
OVEN: OV Comparator output enable bit
1 = OV Comparator output is enabled
0 = OV Comparator output is Not enabled
bit 2
OVOUT: Output Overvoltage Status Output bit
1 = Output Overvoltage has occurred
0 = No Output Overvoltage has occurred
bit 1
OVINTP: OV Comparator Interrupt on Positive Going Edge Enable bit
1 = The OVIF interrupt flag will be set upon a positive going edge of the OV
0 = No OVIF interrupt flag will be set upon a positive going edge of the OV
bit 0
OVINTN: OV Comparator Interrupt on Negative Going Edge Enable bit
1 = The OVIF interrupt flag will be set upon a negative going edge of the OV
0 = No OVIF interrupt flag will be set upon a negative going edge of the OV
REGISTER 6-5:
OVREFCON: OUTPUT OVERVOLTAGE DETECT LEVEL REGISTER
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
OOV7
OOV6
OOV5
OOV4
OOV3
OOV2
OOV1
OOV0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
OOV<7:0>: Output Overvoltage Detect Level Configuration bits
VOV_REF(V) = 2 * VBG * (OOV(dec)/255)
 2014-2015 Microchip Technology Inc.
DS20005281B-page 39
MCP19114/5
The A/D converter Calibration Word 8 can be used to
improve OVREF accuracy. An ADC measurement
target (target in Example 6-1) is obtained by adding the
analog MUX buffer offset (BUOFFSET) to the desired
OVREF voltage (OVREFTARGET) and multiplying the
result by the ADC gain (GADC). OVREF is adjusted
until the ADC reading equals or exceeds the target.
\
An example of OVREF-calibration firmware is as
follows:
EXAMPLE 6-1:
EXAMPLE OVREF CORRECTION ROUTINE
//Assumes that calibration words ADCCAL and BUFF are read from
//program memory into variables ADCC and BUOFFSET, respectively.
extern volatile unsigned int ADRES @ 0x01C;
#define OVREFTARGET (unsigned int) 0x0800
// OVREF Target = 2.0
unsigned long tmp = (unsigned long)ADCC*(OVREFTARGET+BUOFFSET);
// ADC Reference + Buffer Offset
V
unsigned int target = (unsigned int)(tmp >> 15) - 3;
// Subtract ADC typical offset error 3
unsigned int adc;
OVREFCON = 0x00;
// Clear OVREFCON
ADCON0
// Enable and set channel to OVREF
= 0x09;
do {
// Adjust OVREFCON
OVREFCON++;
NOP(); NOP();
adc = 0;
for (unsigned char i = 4; i > 0; i--) {
ADCON0bits.GO_nDONE = 1;
while(ADCON0bits.GO_nDONE);
adc += ADRES;
}
adc >>= 2;
} while ((adc < target) && (OVREFCON != 0xFF));
Note 1: In this example, the LSb weight of OVREFTARGET is set to 1/(210) volt. Users can choose their own
resolution depending on their accuracy requirement. The digital value of 2.0V is determined as follows:
TRUNC(2.0 x 210) = 2048 (0x0800 hex).
DS20005281B-page 40
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.3
Desaturation Detection for
Quasi-Resonant Operation
The DESATCON register holds the setup control bits
for this module. Common control bits are the polarity
edge
trigger
for
the
interrupt
flag
<CDSINTP><CDSINTN>, comparator output polarity
control <CDSPOL>, output enable <CDSOE> and
output status <CDSOUT> bit. As with the other
comparator modules, the CDSIF is independent of the
CDSOE enable bit. On the front end connected to the
DESAT comparator noninverting input, there is a
two-channel MUX that connects either to the DESATP
pin or to the fixed internally generated band gap
voltage. Additionally, the input offset voltage of the
DESAT comparator is factory-trimmed to within ±1 mV
typically. These factory-trimmed values are stored in
the CALWD2 register at address 2081h. Firmware
must read these values into the DSTCAL register
(196h). If more offset is desired, the user can adjust the
values written to the DSTCAL per their implementation.
The MCP19114/5 have been designed with a built-in
desaturation detection comparator module custom
made for quasi-resonant topologies. This is especially
useful for LED-type applications. Through the use of
the MCP19114/5, both synchronous and asynchronous
quasi-resonant topologies can be implemented. The
DESAT comparator module has the same features as
the UVLO/OVLO and OV comparator modules, except
that it includes some additional programmable
parameters.
REGISTER 6-6:
DESATCON: DESATURATION COMPARATOR CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CDSMUX
CDSWDE
Reserved
CDSPOL
CDSOE
CDSOUT
CDSINTP
CDSINTN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
CDSMUX: DESAT Comparator Module Multiplexer channel selection bit
1 = BG Selected
0 = DESATP Selected (Default)
bit 6
CDSWDE: DESAT Comparator Watch Dog Enable bit
1 = Watch Dog signal enables PWM Reset
0 = Watch Dog signal does Not allow PWM reset
bit 5
Reserved
bit 4
CDSPOL: DESAT Comparator Polarity Select bit
1 = DESAT Comparator output is inverted
0 = DESAT Comparator output is Not inverted
bit 3
CDSOE: DESAT Comparator output enable bit
1 = DESAT Comparator output PWM is enabled
0 = DESAT Comparator output PWM is Not enabled
bit 2
CDSOUT: DESAT Comparator Output Status bit
If CDSPOL = 1 (inverted polarity)
1 = CDSVP < CDSVN (DESAT Detected)
0 = CDSVP > CDSVN (DESAT Not Detected)
If CDSPOL = 0 (noninverted polarity)
1 = CDSVP > CDSVN (DESAT Not Detected)
0 = CDSVP < CDSVN (DESAT Detected)
bit 1
CDSINTP: CDSIF Comparator Interrupt on Positive Going Edge Enable bit
1 = The CDSIF interrupt flag will be set upon a positive going edge
0 = No CDSIF interrupt flag will be set upon a positive going edge
bit 0
CDSINTN: CDSIF Comparator Interrupt on Negative Going Edge Enable bit
1 = The CDSIF interrupt flag will be set upon a negative going edge
0 = No CDSIF interrupt flag will be set upon a negative going edge
 2014-2015 Microchip Technology Inc.
DS20005281B-page 41
MCP19114/5
6.4
Primary Input Current Offset
Adjust
Primary input current offset adjust provides the ability
to add offset to the primary input current signal, thus
setting a peak primary current limit. This offset adjust is
controlled using the four bits in the ICOACON register.
REGISTER 6-7:
ICOACON: INPUT CURRENT OFFSET ADJUST CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
—
ICOAC3
ICOAC2
ICOAC1
ICOAC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
ICOAC<3:0>: Input current offset adjustment Configuration bits
0000 = 0 mV
0001 = 50 mV
0010 = 100 mV
0011 = 150 mV
0100 = 200 mV
0101 = 250 mV
0110 = 300 mV
0111 = 350 mV
1000 = 400 mV
1001 = 450 mV
1010 = 500 mV
1011 = 550 mV
1100 = 600 mV
1101 = 650 mV
1110 = 700 mV
1111 = 750 mV
DS20005281B-page 42
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.5
Leading Edge Blanking
The adjustable Leading Edge Blanking (LEB) is used to
blank primary current spikes resulting from primary
switch turn-on. Implementing adjustable LEB allows
the system to ignore turn-on noise to best suit the
application without primary current sense distortion
from RC filtering. There are four settings available for
LEB, including zero. These settings are controlled via
two bits in the ICLEBCON register.
REGISTER 6-8:
ICLEBCON: INPUT CURRENT LEADING EDGE BLANKING CONTROL
REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R/W-x
R/W-x
—
—
—
—
—
—
ICLEBC1
ICLEBC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1-0
ICLEBC<1:0>: Input current Leading Edge Blanking Configuration bits
00 = 0 ns
01 = 50 ns
10 = 100 ns
11 = 200 ns
 2014-2015 Microchip Technology Inc.
DS20005281B-page 43
MCP19114/5
6.6
Slope Compensation
A negative voltage slope is added to the output of the
error amplifier. This is done to prevent subharmonic
instability when:
1.
2.
the operating duty cycle is greater than 50%
wide changes in the duty cycle occur
The amount of negative slope added to the error
amplifier output is controlled by slope compensation
slew rate control bits.
The slope compensation is enabled by clearing the
SLPBY bit in the SLPCRCON register.
REGISTER 6-9:
SLPCRCON: SLOPE COMPENSATION RAMP CONTROL REGISTER
U-0
R/W-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
SLPBY
SLPS5
SLPS4
SLPS3
SLPS2
SLPS1
SLPS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6
SLPBY: Slope Compensation Bypass Control bit
1 = Slope compensation is Bypassed
0 = Slope compensation is not Bypassed
bit 5-0
SLPS<5:0>: Slope Compensation Slew Rate Control bits
SLPS (mV/µs) = 4.1505 mV/µs * e0.0739*(dec)
DS20005281B-page 44
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.7
MOSFET Driver Programmable
Dead Time
FIGURE 6-1:
The turn-on dead time of both PDRV and SDRV
low-side drive signals can be configured independently
to allow different MOSFETs and circuit board layouts to
be used to construct an optimized system (refer to
Figure 6-1).
PDRV
PDT
SDT
Clearing the PDRVBY and SDRVBY bits in the PE1
register enables the PDRV and SDRV low-side dead
timers respectively. The amount of dead time added is
controlled in the DEADCON register.
REGISTER 6-10:
MOSFET DRIVER DEAD
TIME
SDRV
DEADCON: DRIVER DEAD TIME CONTROL REGISTER
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
PDRVDT3
PDRVDT2
PDRVDT1
PDRVDT0
SDRVDT3
SDRVDT2
SDRVDT1
SDRVDT0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
PDRVDT<3:0>: PDRV Dead Time Configuration bits (tTD_1)
0000 = 16 ns delay
0001 = 32 ns delay
0010 = 48 ns delay
0011 = 64 ns delay
0100 = 80 ns delay
0101 = 96 ns delay
0110 = 112 ns delay
0111 = 128 ns delay
1000 = 144 ns delay
1001 = 160 ns delay
1010 = 176 ns delay
1011 = 192 ns delay
1100 = 208 ns delay
1101 = 224 ns delay
1110 = 240 ns delay
1111 = 256 ns delay
bit 3-0
SDRVDT<3:0>: SDRV Dead Time Configuration bits (tTD_2)
0000 = 16 ns delay
0001 = 32 ns delay
0010 = 48 ns delay
0011 = 64 ns delay
0100 = 80 ns delay
0101 = 96 ns delay
0110 = 112 ns delay
0111 = 128 ns delay
1000 = 144 ns delay
1001 = 160 ns delay
1010 = 176 ns delay
1011 = 192 ns delay
1100 = 208 ns delay
1101 = 224 ns delay
1110 = 240 ns delay
1111 = 256 ns delay
 2014-2015 Microchip Technology Inc.
DS20005281B-page 45
MCP19114/5
6.8
Output Regulation Reference
Voltage Configuration
The VREFCON register controls the error amplifier
reference voltage. This reference is used to set the
current or voltage regulation set point. VREFCON
holds the digital value used by an 8-bit linear DAC
setting the analog equivalent that gets summed with
the pedestal voltage (VZC) at the noninverting node of
the error amplifier. VZC is equal to the band gap
voltage (1.23V). The output of the current sense
amplifier A2 is also raised on the pedestal voltage,
effectively canceling its effect on the input. The
pedestal is implemented throughout the analog control
loop to improve accuracy at low levels. The VREF DAC
can be adjusted in 255 steps of 4.8 mV/step.
REGISTER 6-11:
VREFCON: CURRENT/VOLTAGE REGULATION SET POINT CONTROL
REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
VREF7
VREF6
VREF5
VREF4
VREF3
VREF2
VREF1
VREF0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
VREF<7:0>: Voltage-Controlling Current Regulation Set Point bits
VREF(V) = VBG * (VREF(dec)/255)
To ensure the best regulation accuracy while
implementing the Current Sense Amplifier (A2), the
initial gain error must be considered. An 8-bit
factory-stored calibration value A2CAL<7:0> has been
stored in CALWD10 at 208Bh. This value can be used
to compensate for A2 gain error by adjusting the VREF
command.
EXAMPLE 6-2:
To get the final commanded value, the CALWD10 value
gets multiplied by the original VREF decimal command
using the VREF expression, resulting in a 16-bit word.
Rotating the 16 bit result right produces the final
compensated command in the least significant byte.
The most significant byte is unused.
An example of the firmware is as follows:
EXAMPLE A2 GAIN CORRECTION
//Assumes that calibration word A2CAL has been read into variable A2COMP
unsigned int VREF1_TEMP = VREFCON*A2COMP;
// A2 Gain compensate for VREFCON
VREF1_TEMP >>= 7;
VREF1_TEMP &= 0x00FF;
VREFCON = VREF1_TEMP;
DS20005281B-page 46
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.9
VREF2 Voltage Reference
connect VREF2 to GPB1. In Stand-Alone mode, VREF2
is not accessible. VREFCON2 holds the digital value
used to set the VREF2 DAC. Since this reference is
intended to go off chip, there is no pedestal offset
associated with it and it is referenced to GND. It is an
8-bit linear DAC and has a range from 0V to 1.23V (BG)
equating to 255 steps at 4.8 mV/step.
The VREF2CON register controls a second reference
DAC that can be used externally. For example, it can be
sent off chip and used to set the current regulation set
point for a MCP1631 Pulse-Width Modulator. The
MCP19114/5 must be configured in Master Mode with
bits MSC<0:1> = 01 in the MODECON register to
VREF2CON: VREF2 VOLTAGE SET POINT REGISTER
REGISTER 6-12:
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
VREF27
VREF26
VREF25
VREF24
VREF23
VREF22
VREF21
VREF20
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
VREF2<7:0>: Voltage Controlling Current Regulation Set point bits
VREF2(V) = VBG * (VREF2(dec)/255)
The A/D converter Calibration Word 8 can be used to
improve VREF2 accuracy. An ADC measurement target
(target in Example 6-3) is obtained by multiplying the
desired VREF2 voltage (VREF2TARGET) by the ADC
gain (ADCC). VREF2 is adjusted until the ADC reading
equals or exceeds the target.
An example of VREF2- correction firmware is as follows:
EXAMPLE 6-3:
VREF2 CORRECTION ROUTINE
// Assumes that the calibration word ADCCAL has been read into variable ADCC
extern volatile unsigned int ADRES @ 0x01C;
#define VREF2TARGET (unsigned int) 0x02CC
// VREF2 Target = 0.7 V (1)
unsigned long tmp = (unsigned long)ADCC*VREF2TARGET;
// ADC Reference
unsigned int target = (unsigned int)(tmp >> 15) - 3;
// Subtract ADC typical offset error 3
unsigned int adc;
VREF2CON = 0x00;
// Clear VREF2CON
ADCON = 0x71;
// Enable ADC and set channel to GPB1/VREF2
do {
// Adjust VREF2CON
VREF2CON++;
NOP(); NOP();
adc = 0;
for (unsigned char i = 4; i > 0; i--) {
ADCON0bits.GO_nDONE = 1;
while(ADCON0bits.GO_nDONE);
adc += ADRES;
}
adc >>= 2;
} while ((adc < target) && (VREF2CON != 0xFF));
Note 1:
In this example, the LSb weight of VREF2TARGET is set to 1/(210) Volt. Users can choose their own resolution depending on
their accuracy requirement. The digital value of 0.7V is determined as follows: TRUNC(0.7 x 210) = 716 (0x02CC hex).
 2014-2015 Microchip Technology Inc.
DS20005281B-page 47
MCP19114/5
6.10
Analog Peripheral Control
6.10.3
The MCP19114/5 have various analog peripherals.
These peripherals can be configured to allow
customizable operation. Refer to Register 6-13 for
more information.
6.10.1
A high-impedance pull-up on the ISP pin can be
configured by setting the <ISPUEN> bit in the PE1
register. When set, the ISP pin is internally pulled-up to
VDD. Refer to Register 6-13 for details.
MOSFET GATE DRIVER ENABLES
6.10.4
The MCP19114/5 can enable and/or disable the
MOSFET gate driver outputs for the primary drive
(PDRV) and the secondary drive (SDRV)
independently. Setting the <PDRVEN> bit in the PE1
register enables the primary drive. Setting the
<SDRVEN> bit in the PE1 register enables the
secondary drive. Refer to Register 6-13 for details.
6.10.2
PWM STEERING
The MCP19114/5 have additional control circuitry to
allow open-loop repositioning of the output. The
PWMSTR_PEN bit enables a primary-only PWM signal
of fixed frequency and duty cycle to reposition the
output voltage up. The PWMSTR_SEN bit enables a
secondary-only PWM signal of fixed frequency and
duty cycle to reposition the output voltage down. When
repositioning output voltage down, the output
overvoltage protection must be active along with
PWMSTR_SEN for the PWM to pulse the SDRV.
Frequency and duty cycle are controlled through TMR2
registers PR2 and TMR1L. PWMSTPR_PEN and
PWMSTR_SEN should never be active at the same
time, therefore the PWMSTPR_PEN is the dominant
bit. For quasi-resonant operation during open-loop
repositioning, the DESAT comparator output should be
disabled with the <CDSOE> bit in the DEADCON
register.
MOSFET DRIVER DEAD TIME
As described in Section 6.7 “MOSFET Driver
Programmable Dead Time”, the MOSFET drive dead
time can be adjusted. The dead time can be set
independently for each driver from 16 ns to 256 ns in
increments of 16 ns using the DEADCON register.
Dead time can also be disabled for each driver
independently by setting the bypass bits <PDRVBY>
and <SDRVBY> in the PE1 register.
REGISTER 6-13:
SECONDARY CURRENT POSITIVE
SENSE PULL-UP
PE1: ANALOG PERIPHERAL ENABLE1 CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
PDRVEN
SDRVEN
PDRVBY
SDRVBY
—
ISPUEN
R/W-0
R/W-0
PWMSTR_PEN PWMSTR_SEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
PDRVEN: PDRV Gate Drive Enable bit
1 = ENABLED
0 = DISABLED
bit 6
SDRVEN: SDRV Gate Drive Enable bit
1 = ENABLED
0 = DISABLED
bit 5
PDRVBY: PDRV Dead Time Bypass bit
1 = PDRV dead time is bypassed
0 = PDRV dead time is not bypassed
bit 4
SDRVBY: SDRV Dead Time Bypass bit
1 = SDRV dead time is bypassed
0 = SDRV dead time is not bypassed.
bit 3
Unimplemented: Read as ‘0’
bit 2
ISPUEN: ISP Weak Pull-Up Enable bit
1 = ISP weak pull-up is enabled
0 = ISP weak pull-up is disabled
DS20005281B-page 48
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 6-13:
PE1: ANALOG PERIPHERAL ENABLE1 CONTROL REGISTER (CONTINUED)
bit 1
PWMSTR_PEN: PDRV PWM Steering bit
1 = Enables open-loop PWM control to the PDRV
0 = Disables open-loop PWM control to the PDRV
bit 0
PWMSTR_SEN: SDRV PWM Steering bit
1 = Enables open-loop PWM control to the SDRV
0 = Disables open-loop PWM control to the SDRV
6.11
Analog Blocks Enable Control
6.11.2
The error amplifier can be disabled such that its output
is parked to a known state. The <EADIS> bit defaults to
zero and the error amp is enabled during normal
operation. In case the user wants to disable the error
amplifier, setting the EADIS bit parks the error amplifier
output to just below the low clamp voltage. Under
normal operation, the error amplifier output runs
between 2 * BG (upper clamp value) and 1 * BG –
150 mV (lower clamp value). The analog feedback
circuitry utilizes an offset pedestal (1 * BG) to improve
accuracy at low levels.
Various analog circuit blocks can be enabled or
disabled, as shown in the ABECON register. The
ABECON register also contains bits controlling analog
and digital test signals. These signals can be
configured to GPA0. Setting the <DIGOEN> bit enables
the digital test signals to be connected to GPA0.
<DSEL2:0> selects the digital channels. Setting
<ANAOEN> enables the analog test signals to be
connected to GPA0. If <ANAOEN> and <DIGOEN>
both get set, the DIGOEN bit takes priority. When
ANAOEN is not set, the analog test signals are
connected to the internal ADC. The analog test channel
selections are controlled through the ADCON0 register.
6.11.1
ERROR AMPLIFIER DISABLE
MOSFET DRIVER UNDERVOLTAGE
LOCKOUT SELECTION
The MOSFET gate drivers have internal undervoltage
protection that is controlled by the <DRUVSEL> bit in
the ABECON register. Since the gate drive supply is
provided externally through the VDR pin, the drivers are
capable of driving logic level FETs or higher 10V (13.5V
maximum) FETs. <DRUVSEL> defaults to clear,
therefore selecting a gate drive UVLO of 2.7V. Setting
<DRUVSEL> selects the higher 5.4V gate drive UVLO.
Refer to Section 4.2 “Electrical Characteristics” for
additional electrical specifications.
REGISTER 6-14:
ABECON: ANALOG BLOCK ENABLE CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
DIGOEN
DSEL2
DSEL1
DSEL0
DRUVSEL
—
EADIS
ANAOEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
DIGOEN: DIG Test MUX to GPA0 connection control
1 = DIG Test MUX output is connected to external pin GPA0
0 = DIG Test MUX output is not connected to external pin GPA0
 2014-2015 Microchip Technology Inc.
DS20005281B-page 49
MCP19114/5
REGISTER 6-14:
ABECON: ANALOG BLOCK ENABLE CONTROL REGISTER (CONTINUED)
bit 6-4
DSEL<2:0>
000 = QRS (Output of DESAT comparator)
001 = PWM_L (PWM output after monostable)
010 = PWM (Oscillator output from the micro-controller)
011 = TMR2EQ (When TMR2 equals PR2)
100 = OV (Overvoltage comparator output)
101 = SWFRQ (Switching Frequency Output)
110 = SDRV_ON_ONESHOT (200 nS one-shot signal to reset WDM logic)
111 = Unimplemented
bit 3
DRUVSEL: Selects gate drive undervoltage lockout level
1 = Gate Drive UVLO set to 5.4V
0 = Gate Drive UVLO set to 2.7V
bit 2
Unimplemented: Read as ‘0’
bit 1
EADIS: Error Amplifier Disable bit
1 = Disables the error amplifier (Output parked low, clamped to 1 * BG)
0 = Enables the error amplifier (Normal operation)
bit 0
ANAOEN: Analog MUX Output Control bit
1 = Analog MUX output is connected to external pin GPA0
0 = Analog MUX output is not connected to external pin GPA0
DS20005281B-page 50
 2014-2015 Microchip Technology Inc.
MCP19114/5
6.12
Mode and RFB MUX Control
The MODECON register controls the Master/Slave
configuration and the internal resistor feedback MUX
for the current sense amplifier while in quasi-resonant
mode.
In Master/Slave mode, it allows the VREF2 signal of the
Master MCP19115 device to be buffered and
connected to a GPIO pin. This output signal can be
connected to a Slave PWM driver (MCP1631) at the
VREF input to regulate current via the Slave PWM
Controller. In Stand-Alone mode, the VREF2 unity gain
buffer is not connected to a separate GPIO Pin.
The RFB MUX selects the output of A2 current sense
amplifier to be connected to the internal 5 k feedback
resistor (quasi-resonant) or to the ISOUT pin.
REGISTER 6-15:
MODECON: MASTER/SLAVE AND RFB MUX CONTROL REGISTER
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
U-0
MSC1
MSC0
RFB
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
MSC<1:0>: Master/Slave Configuration bits
00 = Device set as stand-alone unit
01 = Device set as MASTER
10 = Device set as SLAVE
11 = RESERVED
bit 5
RFB: Current Sense Amplifier (A2) output resistor feedback MUX Configuration bit
0 = RFB_INT 5 k
1 = ISOUT
bit 4-0
Unimplemented: Read as ‘0’
 2014-2015 Microchip Technology Inc.
DS20005281B-page 51
MCP19114/5
NOTES:
DS20005281B-page 52
 2014-2015 Microchip Technology Inc.
MCP19114/5
7.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C.
5.10
6.0
5.09
5.9
VIN = 32V
5.8
VDD Voltage (V)
Quiescent Current (mA)
6.1
VIN = 25V
5.7
5.6
VIN = 12V
5.5
5.07
5.06
-40 -25 -10
5
FIGURE 7-1:
+25°C
Non-Switching
VIN = 6V
5.3
+125°C
5.05
5.04
5.4
-40°C
5.08
5.03
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Current (mA)
20 35 50 65 80 95 110 125
Temperature (°C)
IQ vs. Temperature.
FIGURE 7-4:
35
Load Regulation.
0.8
30
VDD Dropout Voltage (V)
Sleep Current (μA)
VIN = 32V
VIN = 25V
25
VIN = 12V
20
15
VIN = 6V
10
0.7
0.6
+125°C
0.5
+25°C
0.4
0.3
0.2
-40°C
0.1
0.0
-40 -25 -10
5
FIGURE 7-2:
Mode.
20 35 50 65 80
Temperature (°C)
95 110 125
IQ vs. Temperature in Sleep
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Current (mA)
FIGURE 7-5:
VDD Dropout Voltage vs.
Output Current (mA).
0.45
5.10
IDD = 1 mA
-40°C
VDD (V)
5.08
5.07
5.06
+125°C
5.05
+25°C
5.04
6
0.40
0.35
0.30
0.25
0.20
0.15
0.10
8 10 12 14 16 18 20 22 24 26 28 30 32
VIN (V)
FIGURE 7-3:
VDD Dropout Voltage (V)
IDD = 20 mA
5.09
Line Regulation.
 2014-2015 Microchip Technology Inc.
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 7-6:
Temperature.
VDD Dropout Voltage vs.
DS20005281B-page 53
MCP19114/5
Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C.
9.5
250
8.5
8.0
200
+125°C
150
100
50
4
6
8
10
Code (d)
7.0
12
14
-40 -25 -10
16
VDR = 5V
7.5
6.0
7.0
RDSon (Ÿ )
RPDRV-SOURCE
4.5
20 35 50 65 80 95 110 125
Temperature (°C)
8.0
VDR = 10V
5.5
5
FIGURE 7-10:
Sourcing Output Driver
RDSon vs. Temperature.
6.5
4.0
6.5
6.0
RPDRV-SINK
5.5
5.0
3.5
RSDRV-SOURCE
-40 -25 -10
5
RSDRV-SINK
4.5
3.0
4.0
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 7-8:
Sourcing Output Driver
RDSon vs. Temperature.
-40 -25 -10
5
FIGURE 7-11:
vs. Temperature.
20 35 50 65 80 95 110 125
Temperature (°C)
Sinking Output Driver RDSon
8.08
VDR = 10V
5.5
5.0
RPDRV-SINK
4.0
RSDRV-SINK
Oscillator Frequency (MHz)
6.0
3.5
RPDRV-SOURCE
4.5
2
FIGURE 7-7:
Output Driver Dead Time vs.
Code and Temperature.
4.5
RSDRV-SOURCE
6.5
5.0
0
RDSon (Ÿ)
7.0
5.5
0
RDSon (Ÿ)
7.5
6.0
+25°C
5.0
VDR = 5V
9.0
-40°C
RDSon (Ÿ)
PDRV/SDRV Dead Time (ns)
300
8.06
8.04
8.02
8.00
7.98
7.96
7.94
7.92
3.0
-40 -25 -10
5
FIGURE 7-9:
vs. Temperature.
DS20005281B-page 54
20 35 50 65 80 95 110 125
Temperature (°C)
Sinking Output Driver RDSon
-40 -25 -10
FIGURE 7-12:
Temperature.
5
20 35 50 65 80 95 110 125
Temperature (°C)
Oscillator Frequency vs.
 2014-2015 Microchip Technology Inc.
MCP19114/5
Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C.
5
Output Demand = 0.984V
1.03
4.95
1.02
Maximum
1.01
1
0.99
Typical
0.98
GPIO VOUT (V)
Normalized Output Demand
1.04
4.9
-40°C
4.85
4.8
+25°C
4.75
0.97
0.96
+125°C
4.7
Minimum
4.65
0.95
-40 -25 -10
5
FIGURE 7-13:
vs. Temperature.
20 35 50 65 80 95 110 125
Temperature (°C)
Normalized Output Demand
0
1
2
3
GPIO IOUT (mA)
4
5
FIGURE 7-16:
Average GPIO Output
Voltage vs. Current.
Normalized Output Demand
1.08
Output Demand = 0.492V
1.06
1.04
Maximum
1.02
1
Typical
0.98
0.96
0.94
0.92
0.9
Minimum
0.88
-40 -25 -10
5
¨%VDD – ¨%AVDD
FIGURE 7-14:
vs. Temperature.
20 35 50 65 80 95 110 125
Temperature (°C)
Normalized Output Demand
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
Maximum
Typical
Minimum
-40 -25 -10
FIGURE 7-15:
Drift Tracking.
5
20 35 50 65 80 95 110 125
Temperature (°C)
VDD vs. AVDD Temperature
 2014-2015 Microchip Technology Inc.
DS20005281B-page 55
MCP19114/5
NOTES:
DS20005281B-page 56
 2014-2015 Microchip Technology Inc.
MCP19114/5
8.0
SYSTEM BENCH TESTING
To allow for easier system design and bench testing,
the MCP19114/5 feature a multiplexer used to output
various internal analog signals. These signals can be
measured on the GPA0 pin through a unity gain buffer.
The configuration control of the GPA0 pin is found in
the ABECON register.
.
REGISTER 8-1:
Control of the signals present at the output of the unity
gain analog buffer is found in the ADCON0 register.
ADCON0: ANALOG-TO-DIGITAL CONTROL REGISTER
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-2
CHS<4:0>: Analog Channel Select bits
00000 = VIN/n analog voltage measurement (VIN/15.5328)
00001 = VREF + VZC (DAC reference voltage + VZC pedestal setting current regulation level)
00010 = OV_REF (reference for overvoltage comparator)
00011 = VBGR (band gap reference)
00100 = VS (voltage proportional to VOUT)
00101 = EA_SC (error amplifier after slope compensation output)
00110 = A2 (secondary current sense amplifier output at RFB_INT connection)
00111 = PEDESTAL (Pedestal Voltage)
01000 = RESERVED
01001 = RESERVED
01010 = IP_ADJ (IP after Pedestal and Offset Adjust (at PWM Comparator))
01011 = IP_OFF_REF (IP Offset Reference)
01100 = VDR/n (VDR/n analog driver voltage measurement = 0.229V/V * VDR)
01101 = TEMP_SNS (analog voltage representing internal temperature)
01110 = DLL_VCON (Delay Locked Loop Voltage Reference - control voltage for dead time)
01111 = SLPCMP_REF (slope compensation reference)
10000 = Unimplemented
10001 = Unimplemented
10010 = Unimplemented
10011 = Unimplemented
10100 = Unimplemented
10101 = Unimplemented
10110 = Unimplemented
10111 = Unimplemented
11000 = GPA0/AN0 (i.e. ADDR1)
11001 = GPA1/AN1 (i.e. ADDR0)
11010 = GPA2/AN2 (i.e. Temperature Sensor Input)
11011 = GPA3/AN3 (i.e. BIN)
11100 = GPB1/AN4
11101 = GPB4/AN5 (MCP19115 Only)
11110 = GPB5/AN6 (MCP19115 Only)
11111 = GPB6/AN7 (MCP19115 Only)
bit 1
GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0
ADON: A/D Conversion Status bit
1 = A/D converter module is operating
0 = A/D converter is shut off and consumes no operating current
 2014-2015 Microchip Technology Inc.
DS20005281B-page 57
MCP19114/5
NOTES:
DS20005281B-page 58
 2014-2015 Microchip Technology Inc.
MCP19114/5
9.0
DEVICE CALIBRATION
Read-only memory locations 2080h through 208Fh
contain factory calibration data. Refer to Section 17.0
“Flash Program Memory Control” for information on
how to read from these memory locations.
9.1
Calibration Word 1
Calibration Word 1 is at memory location 2080h. The
DCSRFB<6:0> bits set the offset calibration for the
current sense differential amplifier (A2) when
configured using the internal feedback resistor. A
calibration range of ±30 mV is provided with 20h and
00h being midscale (no offset). The MSB is polarity only.
Firmware must read these values and write them into
the DCSCAL register to implement offset calibration.
REGISTER 9-1:
CALWD1: CALIBRATION WORD 1 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
DCSRFB6
DCSRFB5
DCSRFB4
DCSRFB3
DCSRFB2
DCSRFB1
DCSRFB0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-7
Unimplemented: Read as ‘0’
bit 6-0
DCSRFB<6:0>: Input Differential Current Sense Calibration bits when configured using internal
feedback resistor
 2014-2015 Microchip Technology Inc.
DS20005281B-page 59
MCP19114/5
9.2
Calibration Word 2
Calibration Word 2 is at memory location 2081h. It
contains the calibration bits for the desaturation
comparator current measurement input offset.
Firmware must read these values and write them into
the DSTCAL register to implement the factory offset
calibration. The factory offset calibration will minimize
offset voltage. The desaturation comparator is one of
the few examples where the user may want to
implement their own offset voltage values. Writing user
defined values to the DSTCAL register provides this
flexibility. This register also contains the trim bits
needed to trim the internal 5k feedback resistor to
within 2% using the <RFBT5:0> bits. Firmware must
read these values and write them into the RFBTCAL
register to implement the factory-trimmed feedback
resistor value.
REGISTER 9-2:
CALWD2: CALIBRATION WORD 2 REGISTER
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
DST4
DST3
DST2
DST1
DST0
bit 13
bit 8
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
RFBT5
RFBT4
RFBT3
RFBT2
RFBT1
RFBT0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
DST<4:0>: Desaturation Comparator Current Measure Offset calibration bits
11111 = Maximum negative offset calibration (-30 mV)
•
•
•
10000 = Mid scale (0 mV)
00000 = Mid scale (0 mV)
•
•
•
01111 = Maximum positive offset calibration (+30 mV)
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
RFBT<5:0>: Internal Feedback Resistor Trim bits
DS20005281B-page 60
 2014-2015 Microchip Technology Inc.
MCP19114/5
9.3
Calibration Word 3
The VRO<5:0> bits at memory location 2082h calibrate
the offset of the buffer amplifier of the output voltage
regulation reference set point (VREF). Firmware must
read these values and write them to the VROCAL
register for proper calibration.
The BGR<3:0> bits at memory location 2082h calibrate
the band gap reference. Firmware must read these
values and write them to the BGRCAL register for
proper calibration.
REGISTER 9-3:
CALWD3: CALIBRATION WORD 3 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
VRO5
VRO4
VRO3
VRO2
VRO1
VRO0
bit 13
bit 8
U-0
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
—
BGR3
BGR2
BGR1
BGR0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-8
VRO<5:0>: Reference voltage (VREF) offset calibration bits
bit 7-4
Unused: Read as ‘0’
bit 3-0
BGR<3:0>: Band gap reference calibration bits
9.4
x = Bit is unknown
Calibration Word 4
The TTA<3:0> bits at memory location 2083h contain
the calibration bits for the factory-set overtemperature
threshold. Firmware must read these values and write
them into the TTACAL register for proper calibration.
REGISTER 9-4:
CALWD4: CALIBRATION WORD 4 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
—
TTA3
TTA2
TTA1
TTA0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-4
Unimplemented: Read as ‘0’
bit 3-0
TTA<3:0>: Overtemperature threshold calibration bits
 2014-2015 Microchip Technology Inc.
x = Bit is unknown
DS20005281B-page 61
MCP19114/5
9.5
Calibration Word 5
The TANA<9:0> bits at memory location 2084h contain
the ADC reading from the internal temperature sensor
when the silicon temperature is at 30°C. The
temperature coefficient of the internal temperature
sensor is 16 mV/°C.
REGISTER 9-5:
CALWD5: CALIBRATION WORD 5 REGISTER
U-0
U-0
U-0
U-0
R/P-1
R/P-1
—
—
—
—
TANA9
TANA8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
TANA7
TANA6
TANA5
TANA4
TANA3
TANA2
TANA1
TANA0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-10
Unimplemented: Read as ‘0’
bit 9-0
TANA<9:0>: ADC reading of internal silicon temperature at 30°C calibration bits
9.6
Calibration Word 6
The FCAL<6:0> bits at memory location 2085h set the
internal oscillator calibration. Firmware must read
these values and write them to the OSCCAL register
for proper calibration.
REGISTER 9-6:
CALWD6: CALIBRATION WORD 6 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
FCAL6
FCAL5
FCAL4
FCAL3
FCAL2
FCAL1
FCAL0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unused bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-7
Unimplemented: Read as ‘0’
bit 6-0
FCAL<6:0>: Internal oscillator calibration bits
DS20005281B-page 62
x = Bit is unknown
 2014-2015 Microchip Technology Inc.
MCP19114/5
9.7
Calibration Word 7
The DCS<6:0> bits at memory location 2086h store the
factory-set offset calibration for the current sense
differential amplifier (A2) when configured using ISOUT.
A configuration range of +/-30 mV is provided with 20h
and 00h being midscale (no offset). The MSB is polarity
only. Firmware must read this value into the DCSCAL
register to implement offset calibration. If using the
internal feedback resistor, refer to Register 9-1.
REGISTER 9-7:
CALWD7: CALIBRATION WORD 7 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
DCS6
DCS5
DCS4
DCS3
DCS2
DCS1
DCS0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-7
Unimplemented: Read as ‘0’
bit 6-0
DCS<6:0>: Differential Current Sense Amplifier Calibration bits when used with ISOUT.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 63
MCP19114/5
9.8
Calibration Word 8
The ADCCAL<13:0> bits at memory location 2089h
contain the calibration bits for the A/D converter.
Calibration Word 8 (ADCCAL <13:0>) contains the
factory measurement of the full scale ADC Reference.
The value represents the number of A/D converter
counts per volt. ADCC<4:0> bits represent the fraction
of an A/D converter count, which can provide additional
precision when oversampling the ADC for enhanced
resolution. This calibration word can be used to
calibrate signals read by the Analog-to-Digital
Converter.
REGISTER 9-8:
CALWD8: CALIBRATION WORD 8 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCC13
ADCC12
ADCC11
ADCC10
ADCC9
ADCC8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCC7
ADCC6
ADCC5
ADCC4
ADCC3
ADCC2
ADCC1
ADCC0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-5
ADCC<13:5>: Whole number of A/D converter count
111111111 = 511
•
•
•
000000000 = 0
bit 4-0
ADCC<4:0>: Fraction number of A/D converter count
11111 = 0.96875
•
•
•
00001 = 0.03125
00000 = 0.00000
DS20005281B-page 64
x = Bit is unknown
 2014-2015 Microchip Technology Inc.
MCP19114/5
9.9
Calibration Word 9
Calibration Word 9 is at memory location 208Ah. The
value stored at this memory location represents the
offset voltage (in units of mV) of the analog test buffer.
This is an 8-bit, two's complement word that can be
used to compensate any signal sent through the Analog
test multiplexer. See section 8.0 for test signal details.
REGISTER 9-9:
CALWD9: CALIBRATION WORD 9 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
BUFF7
BUFF6
BUFF5
BUFF4
BUFF3
BUFF2
BUFF1
BUFF0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-8
Unimplemented: Read as ‘0’
bit 7-0
BUFF<7:0>: Analog Buffer Offset calibration bits
11111111 = Mid-scale (-1 mV)
•
•
•
10000000 = Largest negative offset (-128 mV)
01111111 = Largest positive offset (127 mV)
•
•
•
00000000 = Mid-scale (0 mV)
 2014-2015 Microchip Technology Inc.
x = Bit is unknown
DS20005281B-page 65
MCP19114/5
9.10
Calibration Word 10
The A2CAL<7:0> bits at memory location 208Bh
contain the calibration bits for Current Sense Amplifier
(A2) Gain Error. For best regulation accuracy using this
amplifier, firmware can read this value and use it to
adjust the VREF command. Section 6.8 “Output
Regulation Reference Voltage Configuration” for
details.
REGISTER 9-10:
CALWD10: CALIBRATION WORD 10 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
A2CAL7
A2CAL6
A2CAL5
A2CAL4
A2CAL3
A2CAL2
A2CAL1
A2CAL0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-8
Unimplemented: Read as ‘0’
bit 7-0
A2CAL<7:0>: Current Sense Amplifier (A2) Gain Error Calibration bits
DS20005281B-page 66
 2014-2015 Microchip Technology Inc.
MCP19114/5
9.11
Calibration Word 11
The HFVDD<9:0> bits at memory location 2088h
stores the internal ADC reading (in counts) of VDD/2 or
half VDD. This is a factory stored value at 25°C. This
value can be used to calibrate ratio metric ADC
measurements powered up from VDD.
REGISTER 9-11:
CALWD11: CALIBRATION WORD 11 REGISTER
U-0
U-0
U-0
U-0
R/P-1
R/P-1
—
—
—
—
HFVDD9
HFVDD8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
HFVDD7
HFVDD6
HFVDD5
HFVDD4
HFVDD3
HFVDD2
HFVDD1
HFVDD0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-10
Unimplemented: Read as ‘0’
bit 9-0
HFVDD<9:0>: Half VDD Calibration bits
 2014-2015 Microchip Technology Inc.
x = Bit is unknown
DS20005281B-page 67
MCP19114/5
NOTES:
DS20005281B-page 68
 2014-2015 Microchip Technology Inc.
MCP19114/5
10.0
MEMORY ORGANIZATION
There are two types of memory in the MCP19114/5:
• Program Memory
• Data Memory
- Special Function Registers (SFRs)
- General-Purpose RAM
10.1
Program Memory Organization
The MCP19114/5 have a 13-bit program counter
capable of addressing an 8000 x 14 program memory
space. Only the first 4000 x 14 (0000h-0FFFh) is
physically implemented. Addressing a location above
this boundary will cause a wrap-around within the first
4000 x 14 space. The Reset vector is at 0000h and the
interrupt vector is at 0004h (refer to Figure 10-1). The
width of the program memory bus (instruction word) is
14 bits. Since all instructions are a single word, the
MCP19114/5 have space for 4000 instructions.
FIGURE 10-1:
PROGRAM MEMORY MAP
AND STACK FOR
MCP19114
PC<12:0>
CALL, RETURN
RETFIE, RETLW
13
Stack Level 1
Stack Level 8
Reset Vector
0000h
Interrupt Vector
0004h
0005h
On-Chip Program
Memory
0FFFh
Shadows 000-FFFh
1000h
1FFFh
User IDs(1)
2000h
2003h
ICD Instruction(1)
2004h
Codes(1)
2005h
Device ID (hardcoded)(1)
2006h
Config Word(1)
2007h
Manufacturing
Reserved
Reserved for
Manufacturing & Test(1)
Calibration Words(1)
2008h
200Ah
200Bh
207Fh
2080h
208Fh
2090h
Unimplemented
20FFh
2100h
Shadows 2000-20FFh
3FFFh
Note 1: Not code-protected.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 69
MCP19114/5
10.1.1
READING PROGRAM MEMORY
AS DATA
10.2
Data Memory Organization
The RETLW instruction can be used to provide access
to the tables of constants. The recommended way to
create such tables is shown in Example 10-1.
The data memory (refer to Figure 10-1) is partitioned
into four banks, which contain the General Purpose
Registers (GPR) and the Special Function Registers
(SFR). The Special Function Registers are located in
the first 32 locations of each bank. Register locations
20h-7Fh in Bank 0, A0h-EFh in Bank 1 and 120h-16Fh
in Bank 2 are General Purpose Registers,
implemented as static RAM. All other RAM is
unimplemented and returns ‘0’ when read. The
RP<1:0> bits in the STATUS register are the bank
select bits.
EXAMPLE 10-1:
EXAMPLE 10-2:
There are two methods of accessing constants in
program memory. The first method is to use tables of
RETLW instructions. The second method is to set a
Files Select Register (FSR) to point to the program
memory.
10.1.1.1
RETLW Instruction
constants
BRW
RETLW
RETLW
RETLW
RETLW
DATA0
DATA1
DATA2
DATA3
RETLW INSTRUCTION
;Add Index in W to
;program counter to
;select data
;Index0 data
;Index1 data
my_function
;… LOTS OF CODE…
MOVLW
DATA_INDEX
call constants
;… THE CONSTANT IS IN W
The BRW instruction makes this type of table very
simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available, so the older table-read
method must be used.
BANK SELECT
RP1
RP0
0
0
-> Bank 0 is selected
0
1
-> Bank 1 is selected
1
0
-> Bank 2 is selected
1
1
-> Bank 3 is selected
To move values from one register to another register,
the value must pass through the W register. This
means that for all register-to-register moves, two
instruction cycles are required.
The entire data memory can be accessed either
directly or indirectly. Direct addressing may require the
use of the RP<1:0> bits. Indirect addressing requires
the use of the FSR. Indirect addressing uses the
Indirect Register Pointer (IRP) bit in the STATUS
register for access to the Bank0/Bank1 or the
Bank2/Bank3 areas of data memory.
10.2.1
GENERAL PURPOSE REGISTER
FILE
The register file is organized as 64 x 8 in the
MCP19114/5. Each register is accessed, either directly
or indirectly, through the FSR (refer to Section 10.5
“Indirect Addressing, INDF and FSR Registers”).
DS20005281B-page 70
 2014-2015 Microchip Technology Inc.
MCP19114/5
10.2.2
CORE REGISTERS
10.2.2.1
The core registers contain the registers that directly
affect the basic operation. The core registers can be
addressed from any bank. These registers are listed
below in Table 10-1. For detailed information, refer to
Table 10-2.
TABLE 10-1: CORE REGISTERS
Addresses
BANKx
x00h, x80h, x100h, or x180h
INDF
x02h, x82h, x102h, or x182h
PCL
x03h, x83h, x103h, or x183h
STATUS
x04h, x84h, x104h, or x184h
FSR
x0Ah, x8Ah, x10Ah, or x18Ah
PCLATH
x0Bh, x8Bh, x10Bh, or x18Bh
INTCON
STATUS Register
The STATUS register contains:
• the arithmetic status of the ALU
• the Reset status
• the bank select bits for data memory (RAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits.
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
REGISTER 10-1:
R/W-0
STATUS: STATUS REGISTER
R/W-0
IRP
RP1
R/W-0
RP0
R-1
TO
R-1
PD
R/W-x
R/W-x
R/W-x
Z
DC(1)
C(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
x = Bit is unknown
‘0’ = Bit is cleared
‘1’ = Bit is set
bit 7
IRP: Register Bank Select bit (used for Indirect addressing)
1 = Bank 2 & 3 (100h - 1FFh)
0 = Bank 0 & 1 (00h - FFh)
bit 6-5
RP<1:0>: Register Bank Select bits (used for Direct addressing)
00 =Bank 0 (00h - 7Fh)
01 =Bank 1 (80h - FFh)
10 =Bank 2 (100h - 17Fh)
11 =Bank 3 (180h - 1FFh)
bit 4
TO: Time-Out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time out occurred
Note 1:
For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or
low-order bit in the source register.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 71
MCP19114/5
REGISTER 10-1:
STATUS: STATUS REGISTER (CONTINUED)
bit 3
PD: Power-Down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1
DC: Digit Carry/Digit Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0
C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
10.2.3
For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or
low-order bit in the source register.
SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (refer to Figure 10-2).
These registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the microcontroller core are described
in this section. Those related to the operation of the
peripheral features are described in the associated
section for that peripheral feature.
DS20005281B-page 72
 2014-2015 Microchip Technology Inc.
MCP19114/5
10.3
DATA MEMORY
FIGURE 10-2:
MCP19114/5 DATA MEMORY MAP
File
Address
Indirect addr.(1)
TMR0
PCL
STATUS
FSR
PORTGPA
PORTGPB
PIR1
PIR2
PCON
PCLATH
INTCON
TMR1L
TMR1H
T1CON
TMR2
T2CON
PR2
PWMPHL
PWMPHH
PWMRL
PWMRH
VREFCON
VREF2CON
OSCTUNE
ADRESL
ADRESH
ADCON0
ADCON1
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
General
Purpose
Register
File
Address
Indirect addr. (1)
OPTION_REG
PCL
STATUS
FSR
TRISGPA
TRISGPB
PIE1
PIE2
PCLATH
INTCON
VINUVLO
VINOVLO
VINCON
CC1RL
CC1RH
CC2RL
CC2RH
CCDCON
DESATCON
OVCON
OVREFCON
DEADCON
SLPCRCON
ICOACON
ICLEBCON
General
Purpose
Register
80 Bytes
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
File
Address
Indirect addr.(1)
TMR0
PCL
STATUS
FSR
WPUGPA
WPUGPB
PE1
MODECON
ABECON
PCLATH
INTCON
SSPADD
SSPBUF
SSPCON1
SSPCON2
SSPCON3
SSPMSK1
SSPSTAT
SSPADD2
SSPMSK2
General
Purpose
Register
100h
101h
102h
103h
104h
105h
106h
107h
108h
109h
10Ah
10Bh
10Ch
10Dh
10Eh
10Fh
110h
111h
112h
113h
114h
115h
116h
117h
118h
119h
11Ah
11Bh
11Ch
11Dh
11Eh
11Fh
120h
File
Address
Indirect addr. (1)
OPTION_REG
PCL
STATUS
FSR
IOCA
IOCB
ANSELA
ANSELB
PCLATH
INTCON
PORTICD(2)
TRISICD(2)
ICKBUG(2)
BIGBUG(2)
PMCON1
PMCON2
PMADRL
PMADRH
PMDATL
PMDATH
DSTCAL
RFBTCAL
OSCCAL
DCSCAL
TTACAL
BGRCAL
VROCAL
Reserved
180h
181h
182h
183h
184h
185h
186h
187h
188h
189h
18Ah
18Bh
18Ch
18Dh
18Eh
18Fh
190h
191h
192h
193h
194h
195h
196h
197h
198h
199h
19Ah
19Bh
19Ch
19Dh
19Eh
19Fh
1A0h
80 bytes
Accesses
Bank 0
96 Bytes
7Fh
Bank 0
EFh
F0h
Accesses
Bank 0
FFh
Bank 1
16F
170h
Accesses
Bank 0
17Fh
Bank2
1EF
1F0h
1FFh
Bank3
Unimplemented data memory locations, read as '0'.
Note 1:
2:
Not a physical register.
Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 73
Adr
Name
MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR Reset
Value on all other resets(1)
Bank 0
00h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
xxxx xxxx
01h
TMR0
Timer0 Module’s Register
xxxx xxxx
uuuu uuuu
02h
PCL
Program Counter's (PC) Least Significant byte
0000 0000
0000 0000
03h
STATUS
000q quuu
04h
FSR
05h
IRP
RP1
RP0
TO
PORTGPA
GPA7
GPA6
GPA5
06h
PORTGPB
GPB7
GPB6
GPB5
GPB4
—
—
07h
PIR1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
08h
PIR2
CDSIF
—
—
OTIF
OVIF
DRUVIF
—
—
—
PD
Z
DC
C
0001 1xxx
xxxx xxxx
uuuu uuuu
GPA1
GPA0
xxx- xxxx
uuu- uuuu
GPB1
GPB0
xxxx --xx
uuuu --uu
TMR2IF
TMR1IF
-000 0000
-000 0000
OVLOIF
UVLOIF
0--0 0000
0--0 0000
POR
BOR
---- --qq
---- --uu
Indirect data memory address pointer
09h
PCON
—
—
—
0Ah
PCLATH
—
—
—
0Bh
INTCON
GIE
PEIE
T0IE
0Ch
TMR1L
0Dh
TMR1H
0Eh
T1CON
0Fh
TMR2
10h
T2CON
11h
PR2
12h
—
13h
—
GPA3
GPA2
Write buffer for upper 5 bits of program counter
 2014-2015 Microchip Technology Inc.
---0 0000
---0 0000
0000 000x
0000 000u
Holding register for the Least Significant byte of the 16-bit TMR1
xxxx xxxx
uuuu uuuu
Holding register for the Most Significant byte of the 16-bit TMR1
xxxx xxxx
uuuu uuuu
--00 --00
--uu --uu
0000 0000
uuuu uuuu
---- -000
---- -000
Timer2 Module Period Register
1111 1111
1111 1111
Unimplemented
—
—
PWMPHL
SLAVE Phase Shift Register
xxxx xxxx
uuuu uuuu
14h
PWMPHH
SLAVE Phase Shift Register
xxxx xxxx
uuuu uuuu
15h
PWMRL
PWM Register Low Byte
xxxx xxxx
uuuu uuuu
16h
PWMRH
PWM Register High Byte
xxxx xxxx
uuuu uuuu
17h
—
Unimplemented
—
—
18h
—
Unimplemented
—
—
19h
VREFCON
VREF7
VREF6
VREF5
VREF4
VREF3
VREF2
VREF1
VREF0
0000 0000
0000 0000
1Ah
VREF2CON
VREF27
VREF26
VREF25
VREF24
VREF23
VREF22
VREF21
VREF20
0000 0000
0000 0000
1Bh
OSCTUNE
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
---0 0000
---0 0000
1Ch
ADRESL
Least significant 8 bits of the A/D result
xxxx xxxx
uuuu uuuu
1Dh
ADRESH
Most significant 2 bits of the A/D result
0000 00xx
0000 00uu
1Eh
ADCON0
—
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
-000 0000
-000 0000
1Fh
ADCON1
—
ADCS2
ADCS1
ADCS0
—
—
—
—
-000 ----
-000 ----
INTE
IOCE
—
—
T1CKPS1
T1CKPS0
—
—
—
—
T0IF
—
INTF
IOCF(2)
—
TMR1CS
TMR1ON
TMR2ON
T2CKPS1
T2CKPS0
Timer2 Module Register
—
Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists.
MCP19114/5
DS20005281B-page 74
TABLE 10-2:
 2014-2015 Microchip Technology Inc.
TABLE 10-3:
Addr
MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 1
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR Reset
Values on all other resets(1)
xxxx xxxx
uuuu uuuu
1111 1111
1111 1111
0000 0000
0000 0000
0001 1xxx
000q quuu
Bank 1
80h
INDF
81h
OPTION_REG
Addressing this location uses contents of FSR to address data memory (not a physical register)
82h
PCL
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
Program Counter's (PC) Least Significant byte
83h
STATUS
84h
FSR
85h
TRISGPA
TRISA7
TRISA6
TRISA5
—
86h
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
—
—
87h
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
88h
PIE2
CDSIE
—
—
OTIE
OVIE
DRUVIE
OVLOIE
89h
PS0
IRP
RP1
RP0
TO
PD
Z
DC
C
Indirect data memory address pointer
—
TRISA3
TRISA2
xxxx xxxx
uuuu uuuu
TRISA0
1110 1111
1110 1111
TRISB1
TRISB0
1111 0011
1111 0011
TMR2IE
TMR1IE
-000 0000
-000 0000
UVLOIE
0--0 0000
0--0 0000
TRISA1
Unimplemented
8Ah
PCLATH
—
—
—
8Bh
INTCON
GIE
PEIE
T0IE
Write buffer for upper 5 bits of program counter
INTE
IOCE
T0IF
INTF
IOCF(2)
—
—
---0 0000
---0 0000
0000 000u
—
Unimplemented
—
—
8Dh
—
Unimplemented
—
—
8Eh
—
Unimplemented
—
—
8Fh
—
Unimplemented
—
—
90h
VINUVLO
UVLO0
--xx xxxx
--uu uuuu
91h
VINOVLO
—
—
OVLO5
OVLO4
OVLO3
OVLO2
OVLO1
OVLO0
--xx xxxx
--uu uuuu
92h
VINCON
UVLOEN
UVLOOUT
UVLOINTP
UVLOINTN
OVLOEN
OVLOOUT
OVLOINTP
OVLOINTN
0x00 0x00
0u00 0u00
93h
CC1RL
Capture1/Compare1 Register1 x Low Byte (LSB)
xxxx xxxx
uuuu uuuu
94h
CC1RH
Capture1/Compare1 Register2 x High Byte (MSB)
xxxx xxxx
uuuu uuuu
95h
CC2RL
Capture2/Compare2 Register1 x Low Byte (LSB)
xxxx xxxx
uuuu uuuu
96h
CC2RH
Capture2/Compare2 Register2 x High Byte (MSB)
xxxx xxxx
uuuu uuuu
97h
CCDCON
xxxx xxxx
uuuu uuuu
98h
DESATCON
99h
OVCON
—
—
UVLO5
UVLO4
UVLO3
UVLO2
CC2M<3:0>
UVLO1
CC1M<3:0>
CDSMUX
CDSWDE
Reserved
CDSPOL
CDSOE
CDSOUT
CDSINTP
CDSINTN
0000 0x00
0000 0u00
—
—
—
—
OVEN
OVOUT
OVINTP
OVINTN
---- 0x00
---- 0u00
DS20005281B-page 75
9Ah
OVREFCON
OOV7
OOV6
OOV5
OOV4
OOV3
OOV2
OOV1
OOV0
xxxx xxxx
uuuu uuuu
9Bh
DEADCON
PDRVDT3
PDRVDT2
PDRVDT1
PDRVDT0
SDRVDT3
SDRVDT2
SDRVDT1
SDRVDT0
xxxx xxxx
uuuu uuuu
9Ch
SLPCRCON
—
SLPBY
SLPS5
SLPS4
SLPS3
SLPS2
SLPS1
SLPS0
-xxx xxxx
-uuu uuuu
9Dh
ICOACON
—
—
—
—
ICOAC3
ICOAC2
ICOAC1
ICOAC0
---- xxxx
---- uuuu
9Eh
ICLEBCON
—
—
—
—
—
—
ICLEBC1
ICLEBC0
---- --xx
---- --uu
—
—
9Fh
Legend:
Note 1:
2:
—
Unimplemented
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists.
MCP19114/5
0000 000x
8Ch
Adr
Name
MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 2
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR Reset
Value on all other resets(1)
Bank 2
100h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
xxxx xxxx
101h
TMR0
Timer0 Module’s Register
xxxx xxxx
uuuu uuuu
102h
PCL
Program Counter's (PC) Least Significant byte
0000 0000
0000 0000
103h
STATUS
0001 1xxx
000q quuu
104h
FSR
105h
WPUGPA
106h
WPUGPB
107h
PE1
108h
MODECON
109h
ABECON
IRP
RP1
RP0
TO
PD
Z
DC
C
Indirect data memory address pointer
—
—
WPUA5
—
WPUA3
WPUA2
WPUA1
WPUA0
xxxx xxxx
uuuu uuuu
--1- 1111
--u- uuuu
WPUB7
WPUB6
WPUB5
WPUB4
—
—
WPUB1
—
1111 --1-
uuuu --u-
PDRVEN
SDRVEN
PDRVBY
SDRVBY
—
ISPUEN
PWMSTR_PEN
PWMSTR_SEN
0000 -100
0000 -100
MSC1
MSC0
RFB
—
—
—
—
—
001- ----
001- ----
DIGOEN
DSEL2
DSEL1
DSEL0
DRUVSEL
—
EADIS
ANAOEN
0000 0-00
0000 0-00
---0 0000
---0 0000
0000 000x
0000 000u
10Ah
PCLATH
—
—
—
10Bh
INTCON
GIE
PEIE
T0IE
10Ch
—
Unimplemented
—
—
10Dh
—
Unimplemented
—
—
10Eh
—
Unimplemented
—
—
10Fh
—
Unimplemented
—
—
110h
SSPADD
ADD<7:0>
0000 0000
0000 0000
xxxx xxxx
uuuu uuuu
0000 0000
0000 0000
Write buffer for upper 5 bits of program counter
INTE
IOCE
T0IF
INTF
IOCF(2)
 2014-2015 Microchip Technology Inc.
111h
SSPBUF
112h
SSPCON1
WCOL
SSPOV
SSPEN
Synchronous Serial Port Receive Buffer/Transmit Register
CKP
113h
SSPCON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0000 0000
0000 0000
114h
SSPCON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
0000 0000
0000 0000
115h
SSPMSK1
1111 1111
1111 1111
116h
SSPSTAT
117h
SSPADD2
SSPM<3:0>
MSK<7:0>
SMP
CKE
D/A
P
S
R/W
UA
BF
—
—
ADD2<7:0>
0000 0000
0000 0000
118h
SSPMSK2
MSK2<7:0>
1111 1111
1111 1111
119h
—
Unimplemented
—
—
11Ah
—
Unimplemented
—
—
11Bh
—
Unimplemented
—
—
11Ch
—
Unimplemented
—
—
11Dh
—
Unimplemented
—
—
11Eh
—
Unimplemented
—
—
11Fh
—
Unimplemented
—
—
Legend:
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists.
1:
2:
MCP19114/5
DS20005281B-page 76
TABLE 10-4:
 2014-2015 Microchip Technology Inc.
TABLE 10-5:
Addr
MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 3
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR Reset
Values on all other resets(1)
xxxx xxxx
uuuu uuuu
1111 1111
1111 1111
0000 0000
0000 0000
0001 1xxx
000q quuu
xxxx xxxx
uuuu uuuu
Bank 3
180h
INDF
181h
OPTION_REG
Addressing this location uses contents of FSR to address data memory (not a physical register)
182h
PCL
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
Program Counter's (PC) Least Significant byte
183h
STATUS
184h
FSR
IRP
RP1
RP0
TO
185h
IOCA
IOCA7
IOCA6
IOCA5
—
IOCA3
IOCA2
IOCA1
IOCA0
000- 0000
0000 0000
186h
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
—
—
IOCB1
IOCB0
0000 -000
0000 -000
187h
ANSELA
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
---- 1111
---- 1111
188h
ANSELB
—
ANSB6
ANSB5
ANSB4
—
—
ANSB1
—
-111 --1-
-111 --1-
189h
—
18Ah
PCLATH
18Bh
INTCON
PD
Z
DC
C
Indirect data memory address pointer
Unimplemented
—
—
—
GIE
PEIE
T0IE
Write buffer for upper 5 bits of program counter
INTE
IOCE
T0IF
INTF
IOCF(2)
—
—
---0 0000
---0 0000
0000 000x
0000 000u
In-Circuit Debug Port Register
xxx --xx
uuuu --uu
TRISICD(3)
In-Circuit Debug TRIS Register
1111 0011
1111 0011
18Eh
ICKBUG(3)
In-Circuit Debug Register
0000 0000
000u uuuu
18Fh
BIGBUG(3)
In-Circuit Debug Breakpoint Register
0000 0000
uuuu uuuu
190h
PMCON1
-0-- -000
-0-- -000
18Ch
PORTICD
18Dh
(3)
—
CALSEL
—
—
—
WREN
WR
RD
191h
PMCON2
---- ----
---- ----
192h
PMADRL
PMADRL7
PMADRL6
Program Memory Control Register 2 (not a physical register)
PMADRL5
PMADRL4
PMADRL3
PMADRL2
PMADRL1
PMADRL0
0000 0000
0000 0000
193h
PMADRH
—
—
—
—
PMADRH3
PMADRH2
PMADRH1
PMADRH0
---- -000
---- -000
194h
PMDATL
PMDATL7
PMDATL6
PMDATL5
PMDATL4
PMDATL3
PMDATL2
PMDATL1
PMDATL0
0000 0000
0000 0000
195h
PMDATH
—
—
PMDATH5
PMDATH4
PMDATH3
PMDATH2
PMDATH1
PMDATH0
--00 0000
--00 0000
---u uuuu
DSTCAL
—
—
—
DSTCAL4
DSTCAL3
DSTCAL2
DSTCAL1
DSTCAL0
---x xxxx
RFBTCAL
—
—
RFBCAL5
RFBCAL4
RFBCAL3
RFBCAL2
RFBCAL1
RFBCAL0
--xx xxxx
--uu uuuu
198h
OSCCAL
—
FCALT6
FCALT5
FCALT4
FCALT3
FCALT2
FCALT1
FCALT1
-xxx xxxx
-uuu uuuu
199h
DCSCAL
—
DCSCAL6
DCSCAL5
DCSCAL4
DCSCAL3
DCSCAL2
DCSCAL1
DCSCAL0
-xxx xxxx
-uuu uuuu
19Ah
TTACAL
—
—
—
—
TTA3
TTA2
TTA1
TTA0
---- xxxx
---- uuuu
DS20005281B-page 77
19Bh
BGRCAL
—
—
—
—
BGRT3
BGRT2
BGRT1
BGRT0
---- xxxx
---- uuuu
19Ch
VROCAL
—
—
—
VROT4
VROT3
VROT2
VROT1
VROT0
---x xxxx
---u uuuu
19Dh
—
Unimplemented
—
—
19Eh
—
Unimplemented
—
—
19Fh
—
Reserved
—
—
Legend:
Note 1:
2:
3:
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists.
Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1.
MCP19114/5
196h
197h
MCP19114/5
10.3.1
OPTION_REG REGISTER
Note:
The OPTION_REG register is a readable and writable
register, which contains various control bits to
configure:
•
•
•
•
Timer0/WDT prescaler
External GPA2/INT interrupt
Timer0
Weak pull-ups on PORTGPA and PORTGPB
REGISTER 10-2:
To achieve a 1:1 prescaler assignment for
Timer0, assign the prescaler to the WDT
by setting PSA bit to ‘1’ in the
OPTION_REG
register.
Refer
to
Section 22.1.3 “Software Programmable Prescaler”.
OPTION_REG: OPTION REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
x = Bit is unknown
‘0’ = Bit is cleared
‘1’ = Bit is set
bit 7
RAPU: Port GPx Pull-Up Enable bit(1)
1 = Port GPx pull-ups are disabled
0 = Port GPx pull-ups are enabled
bit 6
INTEDG: Interrupt Edge Select bit
0 = Interrupt on rising edge of INT pin
1 = Interrupt on falling edge of INT pin
bit 5
T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock
bit 4
T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3
PSA: Prescaler Assignment bit
1 = Prescaler is assigned to WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0
PS<2:0>: Prescaler Rate Select bits
Note 1:
Bit Value
TMR0
Rate
WDT Rate
000
001
010
011
100
101
110
111
1: 2
1: 4
1: 8
1: 16
1: 32
1: 64
1: 128
1: 256
1: 1
1: 2
1: 4
1: 8
1: 16
1: 32
1: 64
1: 128
Individual WPUx bit must also be enabled.
DS20005281B-page 78
 2014-2015 Microchip Technology Inc.
MCP19114/5
10.4
PCL and PCLATH
10.4.3
COMPUTED FUNCTION CALLS
The Program Counter (PC) is 13 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
reset, the PC is cleared. Figure 10-3 shows the two
situations for loading the PC: the upper example shows
how the PC is loaded on a write to PCL (PCLATH <4:0>
 PCH), while the lower example in Figure 10-3 shows
how the PC is loaded during a CALL or GOTO instruction
(PCLATH<4:3>  PCH).
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
FIGURE 10-3:
The MCP19114/5 have an 8-level x 13-bit wide
hardware stack (refer to Figure 10-1). The stack space
is not part of either program or data space and the
Stack Pointer is not readable or writable. The PC is
PUSHed onto the stack when CALL instruction is
executed or an interrupt causes a branch. The stack is
POPed in the event of a RETURN, RETLW or a RETFIE
instruction execution. PCLATH is not affected by a
PUSH or POP operation.
PROGRAM COUNTER
(PC) LOADING IN
DIFFERENT SITUATIONS
PCH
PCL
12
8
7
0
Instruction with
Destination
PC
8
PCLATH<4:0>
5
ALU Result
PCLATH
PCH
12
11 10
PCL
8
0
7
PC
GOTO, CALL
2
PCLATH<4:3>
11
OPCODE <10:0>
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<4:3> is loaded with PCLATH<4:3>.
10.4.4
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the 9th
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
Note 1: There are no Status bits to indicate Stack
Overflow or Stack Underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interrupt address.
PCLATH
10.4.1
MODIFYING PCL REGISTER
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper 5 bits to the PCLATH register.
When the lower 8 bits are written to the PCL register, all
13 bits of the program counter will change to the values
contained in the PCLATH register and those being
written to the PCL register.
10.4.2
COMPUTED GOTO
A computed GOTO is accomplished by adding an offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address roll over from 0xFFh to 0X00h in the middle of
the table, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the table location within the table.
STACK
10.5
Indirect Addressing, INDF and
FSR Registers
The INDF register is not a physical register. Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
Register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register directly
results in a no operation (although Status bits may be
affected). An effective 9-bit address is obtained by
concatenating the 8-bit FSR and the IRP bit in the
STATUS register, as shown in Figure 10-4.
A simple program to clear RAM location 40h-7Fh using
indirect addressing is shown in Example 10-3.
For more information, refer to Application Note AN556,
“Implementing a Table Read” (DS00000556).
 2014-2015 Microchip Technology Inc.
DS20005281B-page 79
MCP19114/5
EXAMPLE 10-3:
MOVLW
MOVWF
NEXT
CLRF
INCF
BTFSS
GOTO
CONTINUE
INDIRECT ADDRESSING
0x40
FSR
INDF
FSR
FSR,7
NEXT
FIGURE 10-4:
;initialize pointer
;to RAM
;clear INDF register
;inc pointer
;all done?
;no clear next
;yes continue
DIRECT/INDIRECT ADDRESSING
Direct Addressing
RP1
RP0
Bank Select
From Opcode
6
Indirect Addressing
0
7
IRP
Bank Select
Location Select
00
01
10
File Select Register
0
Location Select
11
00h
180h
Data
Memory
7Fh
1FFh
Bank 0
Bank 1
Bank 2
Bank 3
For memory map detail, refer to Figure 10-2.
DS20005281B-page 80
 2014-2015 Microchip Technology Inc.
MCP19114/5
11.0
DEVICE CONFIGURATION
Note:
Device Configuration consists of Configuration Word,
Code Protection and Device ID.
11.1
Configuration Word
There are several Configuration Word bits that allow
different timers to be enabled and memory protection
options. These are implemented as Configuration
Word at 2007h.
REGISTER 11-1:
The DBGEN bit in Configuration Word is
managed
automatically
by
device
development tools, including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a '1'. Debug is available only on the
MCP19115.
CONFIG: CONFIGURATION WORD
R/P-1
U-1
R/P-1
R/P-1
U-1
R/P-1
DBGEN
—
WRT1
WRT0
—
BOREN
bit 13
bit 8
U-1
R/P-1
R/P-1
R/P-1
R/P-1
U-1
U-1
U-1
—
CP
MCLRE
PWRTE
WDTE
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
DBGEN: ICD Debug bit
1 = ICD debug mode disabled
0 = ICD debug mode enabled
bit 12
Unimplemented: Read as ‘0’
bit 11-10
WRT<1:0>: Flash Program Memory Self Write Enable bit
11 = Write protection off
10 = 000h to 3FFh write protected, 400h to FFFh may be modified by PMCON1 control
01 = 000h to 7FFh write protected, 800h to FFFh may be modified by PMCON1 control
00 = 000h to FFFh write protected, entire program memory is write protected.
bit 9
Unimplemented: Read as ‘0’
bit 8
BOREN: Brown-Out Reset Enable bit
1 = BOR disabled during Sleep and Enabled during operation
0 = BOR disabled
bit 7
Unimplemented: Read as ‘0’
bit 6
CP: Code Protection
1 = Program memory is not code protected
0 = Program memory is external read and write protected
bit 5
MCLRE: MCLR Pin Function Select
1 = MCLR pin is MCLR function and weak internal pull-up is enabled
0 = MCLR pin is alternate function, MCLR function is internally disabled
bit 4
PWRTE: Power-Up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3
WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0
Unimplemented: Read as ‘0’
Note 1:
Bit is reserved and not controlled by user.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 81
MCP19114/5
11.2
Code Protection
Code protection allows the device to be protected from
unauthorized access. Internal access to the program
memory is unaffected by any code protection setting.
11.2.1
PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in the
Configuration Word. When CP = 0, external reads and
writes of program memory are inhibited and a read will
return all ‘0’s. The CPU can continue to read program
memory, regardless of the protection bit settings.
Writing the program memory is dependent upon the
write protection setting. Refer to Section 11.3 “Write
Protection” for more information.
11.3
Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as boot
loader software, can be protected while allowing other
regions of the program memory to be modified.
The WRT<1:0> bits in the Configuration Word define
the size of the program memory block that is protected.
11.4
ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant 7 bits of the ID locations are
reported when using MPLAB Integrated Development
Environment (IDE).
DS20005281B-page 82
 2014-2015 Microchip Technology Inc.
MCP19114/5
12.0
OSCILLATOR MODES
12.2
The MCP19114/5 have one oscillator configuration
which is an 8 MHz internal oscillator.
12.1
Internal Oscillator (INTOSC)
The Internal Oscillator module provides a system
clock source of 8 MHz. The frequency of the internal
oscillator can be trimmed with a calibration value in the
OSCTUNE register.
Oscillator Calibration
The 8 MHz internal oscillator is factory-calibrated. The
factory calibration values reside in the read-only
CALWD6 register. These values must be read from the
CALWD6 register and stored in the OSCCAL register.
Refer to Section 17.0 “Flash Program Memory
Control” for the procedure on reading the program
memory.
Note:
12.3
The FCAL<6:0> bits in the CALWD6
register must be written into the OSCCAL
register to calibrate the internal oscillator.
Frequency Tuning in User Mode
In addition to the factory calibration, the base
frequency can be tuned in the user's application. This
frequency tuning capability allows the user to deviate
from the factory-calibrated frequency. The user can
tune the frequency by writing to the OSCTUNE
register (refer to Register 12-1).
REGISTER 12-1:
OSCTUNE: OSCILLATOR TUNING REGISTER
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
TUN<4:0>: Frequency Tuning bits
01111 = Maximum frequency
01110 =
•
•
•
00001 =
00000 = Center frequency. Oscillator Module is running at the calibrated frequency.
11111 =
•
•
•
10000 = Minimum frequency
 2014-2015 Microchip Technology Inc.
DS20005281B-page 83
MCP19114/5
12.3.1
OSCILLATOR DELAY UPON
POWER-UP, WAKE-UP AND BASE
FREQUENCY CHANGE
In applications where the OSCTUNE register is used to
shift the frequency of the internal oscillator, the
application should not expect the frequency of the
internal oscillator to stabilize immediately. In this case,
the frequency may shift gradually toward the new
value. The time for this frequency shift is less than eight
cycles of the base frequency.
On power-up, the device is held in reset by the
power-up time if the power-up timer is enabled.
Following a wake-up from Sleep mode or POR, an
internal delay of ~10 µs is invoked to allow the memory
bias to stabilize before program execution can begin.
TABLE 12-1:
SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
OSCTUNE
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
83
Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by clock sources.
TABLE 12-2:
Name
CONFIG6
SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH CLOCK SOURCES
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
Bit 10/2
Bit 9/1
Bit 8/0
13:8
—
—
—
—
—
—
—
—
7:0
—
FCAL6
FCAL5
FCAL4
FCAL3
FCAL2
FCAL1
FCAL0
Register
on Page
62
Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by clock sources.
DS20005281B-page 84
 2014-2015 Microchip Technology Inc.
MCP19114/5
13.0
RESETS
The reset logic is used to place the MCP19114/5 into a
known state. The source of the reset can be
determined by using the device status bits.
There are multiple ways to reset these devices:
•
•
•
•
•
Power-On Reset (POR)
Overtemperature Reset (OT)
MCLR Reset
WDT Reset
Brown-Out Reset (BOR)
To allow VDD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a POR
event.
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on:
•
•
•
•
•
Power-On Reset
MCLR Reset
MCLR Reset during Sleep
WDT Reset
Brown-Out Reset
WDT (Watchdog Timer) wake-up does not cause
register resets in the same manner as a WDT Reset,
since wake-up is viewed as the resumption of normal
operation. TO and PD bits are set or cleared differently
in different Reset situations, as indicated in Table 13-1.
The software can use these bits to determine the
nature of the Reset. Refer to Table 13-2 for a full
description of Reset states of all registers.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 13-1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. Refer to Section 5.0 “Digital
Electrical
Characteristics”
for
pulse-width
specifications.
FIGURE 13-1:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External
Reset
MCLR/TEST_EN
pin
Sleep
WDT
Module Time-Out
Reset
VDD Rise Power-On Reset
Detect
Brown-Out
Brown-Out Reset
VDD
S
Chip_Reset
Reset
R
Q
BOREN
PWRT
On-Chip
RC OSC
11-bit Ripple Counter
Enable PWRT
TABLE 13-1:
TIME-OUT IN VARIOUS
SITUATIONS
Power-Up
PWRTE = 0
PWRTE = 1
Wake-Up from
Sleep
TPWRT
—
—
 2014-2015 Microchip Technology Inc.
DS20005281B-page 85
MCP19114/5
TABLE 13-2:
STATUS/PCON BITS AND THEIR SIGNIFICANCE
POR
BOR
TO
PD
Condition
0
x
1
1
Power-On Reset
u
0
1
1
Brown-Out Reset
u
u
0
u
WDT Reset
u
u
0
0
WDT Wake-Up
u
u
u
u
MCLR Reset during normal operation
u
u
1
0
MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
13.1
Power-On Reset (POR)
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-On Reset.
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the
operating conditions are met.
13.2
MCLR
MCP19114/5 have a noise filter in the MCLR Reset
path. The filter will detect and ignore small pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
Voltages applied to the MCLR pin that exceed its
specification can result in both MCLR Resets and
excessive current beyond the device specification
during the ESD event. For this reason, Microchip
recommends that the MCLR pin no longer be tied
directly to VDD. The use of a Resistor-Capacitor (RC)
network, as shown in Figure 13-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bit in the CONFIG register. When MCLRE = 0,
the Reset signal to the chip is generated internally.
When MCLRE = 1, the MCLR pin becomes an external
Reset input. In this mode, the MCLR pin has a weak
pull-up to VDD.
FIGURE 13-2:
RECOMMENDED MCLR
CIRCUIT
VDD
R2
SW1
(optional)
100
(needed with
capacitor)
MCLR
MCP19114/5
R1
1 k (or greater)
C1
0.1 µF
(optional, not critical)
DS20005281B-page 86
 2014-2015 Microchip Technology Inc.
MCP19114/5
13.3
Brown-Out Reset (BOR)
Note:
The BOREN bit <8> in the CONFIG register enables or
disables the BOR mode, as defined in the CONFIG
register. A brown-out occurs when VDD falls below
VBOR for greater than 100 µs minimum. On any Reset
(Power-On, Brown-Out, Watchdog Timer, etc.), the
chip will remain in Reset until VDD rises above VBOR
(refer to Figure 13-3). If enabled, the Power-Up Timer
will be invoked by the Reset and will keep the chip in
Reset an additional 64 ms. During power-up, it is
recommended that the BOR configuration bit is
enabled holding the MCU in Reset (OSC turned off and
no code execution) until VDD exceeds the VBOR
threshold. Users have the option of adding an
additional 64 ms delay by clearing the PWRTE bit. At
this time, the VDD voltage level is high enough to
operate the MCU functions only; all other device
functionality is not operational. This is independent of
the value of VIN, which is typically VDD + VDROPOUT.
During power-down with BOR enabled, the MCU
operation will be held in Rset when VDD falls below the
VBOR threshold. With BOR disabled or while operating
in Sleep mode, the POR will hold the part in Reset
when VDD falls below the VPOR threshold. Since this
device runs at FOSC = 8 MHz and the processor is fully
operational at VDD = 2V, it is recommended that BOR
always be enabled during power-up and power-down.
FIGURE 13-3:
The Power-Up Timer is enabled by the
PWRTE bit in the CONFIG register. If VDD
drops below VBOR while the Power-Up
Timer is running, the chip will go back into
a Brown-Out Reset and the Power-Up
Timer will be re-initialized. Once the VDD
rises above VBOR, the Power-Up Timer
will execute a 64 ms reset.
BROWN-OUT SITUATIONS
VDD
Internal
Reset
VBOR
64 ms(1)
VDD
Internal
Reset
VBOR
< 64 ms
64 ms(1)
VDD
VBOR
Internal
Reset
64 ms(1)
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 87
MCP19114/5
13.4
Power-Up Timer (PWRT)
The Power-Up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR Reset. The
Power-Up Timer operates from an internal RC
oscillator. The chip is kept in Reset as long as PWRT is
active. The PWRT delay allows the VDD to rise to an
acceptable level. A bit (PWRTE) in the CONFIG
register can disable (if set) or enable (if cleared or
programmed) the Power-Up Timer.
The Power-Up Timer delay will vary from chip to chip
due to:
• VDD variation
• Temperature variation
• Process variation
Note:
Voltage spikes below VSS at the MCLR
pin, inducing currents greater than 80 mA,
may cause latch-up. Thus, a series
resistor of 50-100 should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
The Power-Up Timer optionally delays device execution
after a POR event. This timer is typically used to allow
VDD to stabilize before allowing the device to start
running.
The Power-Up Timer is controlled by the PWRTE bit in
the CONFIG register.
FIGURE 13-4:
13.5
Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. Refer to
Section 16.0 “Watchdog Timer (WDT)” for more
information.
13.6
Start-Up Sequence
Upon the release of a POR, the following must occur
before the device begins executing:
• Power-Up Timer runs to completion (if enabled)
• Oscillator start-up timer runs to completion
• MCLR must be released (if enabled)
The total time out will vary based on PWRTE bit status.
For example, with PWRTE bit erased (PWRT disabled),
there will be no time out at all. Figures 13-4, 13-5
and 13-6 depict time-out sequences.
Since the time outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(refer to Figure 13-5). This is useful for testing purposes
or to synchronize more than one MCP19114/5 device
operating in parallel.
13.6.1
POWER CONTROL (PCON)
REGISTER
The Power Control (PCON) register (address 8Eh) has
two Status bits to indicate what type of Reset occurred
last.
TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
VDD
MCLR
Internal POR
TPWRT
PWRT Time-Out
TIOSCST
OST Time-Out
Internal Reset
DS20005281B-page 88
 2014-2015 Microchip Technology Inc.
MCP19114/5
FIGURE 13-5:
TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
VDD
MCLR
Internal POR
TPWRT
PWRT Time-Out
TIOSCST
OST Time-Out
Internal Reset
FIGURE 13-6:
TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
VDD
MCLR
Internal POR
TPWRT
PWRT Time-Out
TIOSCST
OST Time-Out
Internal Reset
13.7
Determining the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Tables 13-3 and 13-4 show the Reset
conditions of these registers.
 2014-2015 Microchip Technology Inc.
TABLE 13-3:
RESET STATUS BITS AND
THEIR SIGNIFICANCE
POR BOR TO PD
Condition
0
x
1
1
Power-On Reset
u
0
1
1
Brown-Out Reset
u
u
0
u
WDT Reset
u
u
0
0
WDT Wake-Up from Sleep
u
u
1
0
Interrupt Wake-Up from
Sleep
u
u
u
u
MCLR Reset during normal
operation
u
u
1
0
MCLR Reset during Sleep
0
u
0
x
Not allowed. TO is set on
POR.
0
u
x
0
Not allowed. PD is set on
POR.
DS20005281B-page 89
MCP19114/5
TABLE 13-4:
RESET CONDITION FOR SPECIAL REGISTERS (Note 2)
Program
Counter
STATUS
Register
PCON
Register
Power-On Reset
0000h
0001 1xxx
---- --0u
Brown-Out Reset
0000
0001 1xxx
---- --u0
MCLR Reset during normal operation
0000h
000u uuuu
---- --uu
MCLR Reset during Sleep
0000h
0001 0uuu
---- --uu
WDT Reset
0000h
0000 uuuu
---- --uu
PC + 1
uuu0 0uuu
---- --uu
PC + 1(1)
uuu1 0uuu
---- --uu
Condition
WDT Wake-Up from Sleep
Interrupt Wake-Up from Sleep
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed
on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
2: If a Status bit is not implemented, that bit will be read as ‘0’.
DS20005281B-page 90
 2014-2015 Microchip Technology Inc.
MCP19114/5
13.8
Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-On Reset (POR)
• Brown-Out Reset (BOR)
The PCON register bits are shown in Register 13-1.
REGISTER 13-1:
PCON: POWER CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
—
POR
BOR
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-2
Unimplemented: Read as '0'
bit 1
POR: Power-On Reset Status bit
1 = No Power-On Reset occurred
0 = A Power-On Reset occurred (must be set in software after a Power-On Reset occurs)
bit 0
BOR: Brown-Out Reset
1 = No Brown-Out Reset occurred
0 = A Brown-Out Reset occurred (must be set in software after a Brown-Out Reset occurs)
TABLE 13-5:
Name
PCON
STATUS
SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
—
—
—
—
POR
BOR
91
IPR
RP1
RP0
TO
PD
Z
DC
C
71
Legend: — = unimplemented bit, read as ‘0’. Shaded cells are not used by Resets.
Note 1: Other (non power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 91
MCP19114/5
NOTES:
DS20005281B-page 92
 2014-2015 Microchip Technology Inc.
MCP19114/5
14.0
INTERRUPTS
The MCP19114/5 have multiple sources of interrupt:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
External Interrupt (INT pin)
Interrupt-On-Change (IOC) Interrupts
Timer0 Overflow Interrupt
Timer1 Overflow Interrupt
Timer2 Match Interrupt
ADC Interrupt
System Input Undervoltage Error
System Input Overvoltage Error
SSP
BCL
Desaturation Detection
Gate Drive UVLO
Capture/Compare 1
Capture/Compare 2
Overtemperature
The Interrupt Control (INTCON) register and the
Peripheral Interrupt Request (PIRx) registers record
individual interrupt requests in flag bits. The INTCON
register also has individual and global interrupt enable
bits.
The Global Interrupt Enable bit, GIE, in the INTCON
register enables (if set) all unmasked interrupts or
disables (if cleared) all interrupts. Individual interrupts
can be disabled through their corresponding enable
bits in the INTCON register and PIEx registers. GIE is
cleared on Reset.
When an interrupt is serviced, the following actions
occur automatically:
• The GIE is cleared to disable any further interrupt
• The return address is pushed onto the stack
• The PC is loaded with 0004h
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE bit.
For additional information on a specific interrupt’s
operation, refer to its peripheral chapter.
14.1
Interrupt Latency
For external interrupt events, such as the INT pin or
PORTGPx change interrupt, the interrupt latency will
be three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (refer to
Figure 14-2). The latency is the same for one- or
two-cycle instructions.
14.2
GPA2/INT Interrupt
The external interrupt on the GPA2/INT pin is
edge-triggered, either on the rising edge if the INTEDG
bit in the OPTION_REG register is set, or the falling
edge if the INTEDG bit is clear. When a valid edge
appears on the GPA2/INT pin, the INTF bit in the
INTCON register is set. This interrupt can be disabled
by clearing the INTE control bit in the INTCON register.
The INTF bit must be cleared by software in the
Interrupt Service Routine before re-enabling this
interrupt. The GPA2/INT interrupt can wake up the
processor from Sleep, if the INTE bit was set prior to
going into Sleep. Refer to Section 15.0 “Power-Down
Mode (Sleep)” for details on Sleep and Section 15.1
“Wake-Up from Sleep” for timing of wake-up from
Sleep through GPA2/INT interrupt.
Note:
The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’ and cannot generate an
interrupt.
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag but will not cause the
processor to redirect to the interrupt vector.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts which were
ignored are still pending to be serviced
when the GIE bit is set again.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 93
MCP19114/5
FIGURE 14-1:
INTERRUPT LOGIC
Plx2
CDSIF
CDSIE
OTIF
OTIE
OVIF
OVIE
DRUVIF
DRUVIE
OVLOIF
OVLOIE
UVLOIF
UVLOIE
INTCON
ADIF
ADIE
BCLIF
BCLIE
IOCF
IOCE
INTF
INTE
T0IF
T0IE
SSPIF
SSPIE
PEIF
PEIE
Plx1
CC2IF
CC2IE
CC1IF
CC1IE
TMR2F
TMR2E
TMR1IF
TMR1IE
FIGURE 14-2:
Wake-Up (If in Sleep mode)
Interrupt to CPU
GIE
INT PIN INTERRUPT TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN
CLKOUT(3)
(4)
INT pin
(1)
(1)
INTF flag
(INTCON reg.)
Interrupt Latency(2)
(5)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC
PC
Instruction
Fetched
Instruction
Executed
Note 1:
Inst (PC)
Inst (PC – 1)
PC + 1
Inst (PC + 1)
Inst (PC)
PC + 1
—
Dummy Cycle
0004h
0005h
Inst (0004h)
Inst (0005h)
Dummy Cycle
Inst (0004h)
INTF flag is sampled here (every Q1).
2:
Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single-cycle or a two-cycle instruction.
3:
CLKOUT is available only in INTOSC and RC Oscillator modes.
4:
For minimum width of INT pulse, refer to AC specifications in Section 5.0 “Digital Electrical Characteristics”.
5:
INTF is enabled to be set any time during the Q4-Q1 cycles.
DS20005281B-page 94
 2014-2015 Microchip Technology Inc.
MCP19114/5
14.3
Interrupt Control Registers
14.3.1
Note:
INTCON REGISTER
The INTCON register is a readable and writable
register that contains the various enable and flag bits
for the TMR0 register overflow, interrupt-on-change
and external INT pin interrupts.
REGISTER 14-1:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, in the INTCON register.
The user’s software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
INTCON: INTERRUPT CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-x
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6
PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5
T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4
INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3
IOCE: Interrupt-on-Change Enable bit(1)
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2
T0IF: TMR0 Overflow Interrupt Flag bit(2)
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1
INTF: External Interrupt Flag bit
1 = The external interrupt occurred (must be cleared in software)
0 = The external interrupt did not occur
bit 0
IOCF: Interrupt-on-Change Interrupt Flag bit
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1:
2:
x = Bit is unknown
IOCx registers must also be enabled.
T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before
clearing T0IF bit.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 95
MCP19114/5
14.3.1.1
PIE1 Register
Note 1: Bit PEIE in the INTCON register must be
set to enable any peripheral interrupt.
The PIE1 register contains the Peripheral Interrupt
Enable bits, as shown in Register 14-2.
REGISTER 14-2:
PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6
ADIE: ADC Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5
BCLIE: MSSP Bus Collision Interrupt Enable bit
1 = Enables the MSSP Bus Collision Interrupt
0 = Disables the MSSP Bus Collision Interrupt
bit 4
SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 3
CC2IE: Capture2/Compare2 Interrupt Enable bit
1 = Enables the Capture2/Compare2 interrupt
0 = Disables the Capture2/Compare2 interrupt
bit 2
CC1IE: Capture1/Compare1 Interrupt Enable bit
1 = Enables the Capture1/Compare1 interrupt
0 = Disables the Capture1/Compare1 interrupt
bit 1
TMR2IE: Timer2 Interrupt Enable
1 = Enables the Timer2 interrupt
0 = Disables the Timer2 interrupt
bit 0
TMR1IE: Timer1 Interrupt Enable
1 = Enables the Timer1 interrupt
0 = Disables the Timer1 interrupt
DS20005281B-page 96
x = Bit is unknown
 2014-2015 Microchip Technology Inc.
MCP19114/5
14.3.1.2
PIE2 Register
Note 1: Bit PEIE in the INTCON register must be
set to enable any peripheral interrupt.
The PIE2 register contains the Peripheral Interrupt
Enable bits, as shown in Register 14-3.
REGISTER 14-3:
PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CDSIE
—
—
OTIE
OVIE
DRUVIE
OVLOIE
UVLOIE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
CDSIE: Desaturation Detection Interrupt Enable bit
1 = Enables the DESAT Detect interrupt
0 = Disables the DESAT Detect interrupt
bit 6-5
Unimplemented: Read as ‘0’
bit 4
OTIE: Overtemperature Interrupt Enable bit
1 = Enables overtemperature interrupt
0 = Disables overtemperature interrupt
bit 3
OVIE: VOUT Overvoltage Interrupt Enable bit
1 = Enables the OV interrupt
0 = Disables the OV interrupt
bit 2
DRUVIE: Gate Drive Undervoltage Lockout Interrupt Enable bit
1 = Enables Gate Drive UVLO interrupt
0 = Disables Gate Drive UVLO interrupt
bit 1
OVLOIE: VIN Overvoltage Lockout Interrupt Enable bit
1 = Enables OVLO interrupt
0 = Disables OVLO interrupt
bit 0
UVLOIE: VIN Undervoltage Lockout Interrupt Enable bit
1 = Enables UVLO interrupt
0 = Disables UVLO interrupt
 2014-2015 Microchip Technology Inc.
x = Bit is unknown
DS20005281B-page 97
MCP19114/5
14.3.1.3
PIR1 Register
Note 1: Interrupt flag bits are set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit
or the Global Enable bit, GIE, in the
INTCON register. The user’s software
should ensure the appropriate interrupt
flag bits are clear prior to enabling an
interrupt.
The PIR1 register contains the Peripheral Interrupt
Flag bits, as shown in Register 14-4.
REGISTER 14-4:
PIR1: PERIPHERAL INTERRUPT FLAG REGISTER 1
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6
ADIF: ADC Interrupt Flag bit
1 = ADC conversion complete
0 = ADC conversion has not completed or has not been started
bit 5
BCLIF: MSSP Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4
SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3
CC2IF: Capture2/Compare2 Interrupt Flag bit
1 = Capture or Compare has occurred
0 = Capture or Compare has not occurred
bit 2
CC1IF: Capture1/Compare1 Interrupt Flag bit
1 = Capture or Compare has occurred
0 = Capture or Compare has not occurred
bit 1
TMR2IF: Timer2 to PR2 Match Interrupt Flag
1 = Timer2 to PR2 match occurred (must be cleared in software)
0 = Timer2 to PR2 match did not occur
bit 0
TMR1IF: Timer1 Interrupt Flag
1 = Timer1 rolled over (must be cleared in software)
0 = Timer1 has not rolled over
DS20005281B-page 98
x = Bit is unknown
 2014-2015 Microchip Technology Inc.
MCP19114/5
14.3.1.4
PIR2 Register
Note 1: Interrupt flag bits are set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit
or the Global Enable bit, GIE, in the
INTCON register. The user’s software
should ensure the appropriate interrupt
flag bits are clear prior to enabling an
interrupt.
The PIR2 register contains the Peripheral Interrupt
Flag bits, as shown in Register 14-3.
REGISTER 14-5:
PIR2: PERIPHERAL INTERRUPT FLAG REGISTER 2
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CDSIF
—
—
OTIF
OVIF
DRUVIF
OVLOIF
UVLOIF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
CDSIF: DESAT Detect comparator module interrupt flag bit
1 = An interrupt is pending
0 = An interrupt is not pending
bit 6-5
Unimplemented: Read as ‘0’
bit 4
OTIF: Overtemperature Interrupt Flag bit
1 = Overtemperature event has occurred
0 = Overtemperature event has not occurred
bit 3
OVIF: Overvoltage Interrupt Flag bit
With OVINTP bit set:
1 = A VOUT Not Overvoltage to Overvoltage edge has been detected
0 = A VOUT Not Overvoltage to Overvoltage edge has not been detected
With OVINTN bit set:
1 = A VOUT Overvoltage to Not Overvoltage edge has been detected
0 = A VOUT Overvoltage to Not Overvoltage edge has not been detected
bit 2
DRUVIF: Gate Drive Undervoltage Lockout Interrupt Flag bit
1 = Gate Drive Undervoltage Lockout has occurred
0 = Gate Drive Undervoltage Lockout has not occurred
bit 1
OVLOIF: VIN Overvoltage Lockout Interrupt Flag bit
With OVLOINTP bit set:
1 = A VIN Not Overvoltage to VIN Overvoltage edge has been detected
0 = A VIN Not Overvoltage to VIN Overvoltage edge has not been detected
With OVLOINTN bit set:
1 = A VIN Overvoltage to VIN Not Overvoltage edge has been detected
0 = A VIN Overvoltage to VIN Not Overvoltage edge has not been detected
bit 0
UVLOIF: VIN Undervoltage Lockout Interrupt Flag bit
With UVLOINTP bit set:
1 = A VIN Not Undervoltage to VIN Undervoltage edge has been detected
0 = A VIN Not Undervoltage to VIN Undervoltage edge has not been detected
With UVLOINTN bit set:
1 = A VIN Undervoltage to VIN Not Undervoltage edge has been detected
0 = A VIN Undervoltage to VIN Not Undervoltage edge has not been detected
 2014-2015 Microchip Technology Inc.
DS20005281B-page 99
MCP19114/5
TABLE 14-1:
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
78
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIE2
CDSIE
—
—
OTIE
OVIE
DRUVIE
OVLOIE
UVLOIE
97
PIR1
—
ADIF
BCLIF
SSPIF
—
—
TMR2IF
TMR1IF
98
PIR2
CDSIF
—
—
OTIF
OVIF
DRUVIF
OVLOIF
UVLOIF
99
Name
INTCON
OPTION_REG
Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by Interrupts.
14.4
Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Temporary
holding
registers
W_TEMP
and
STATUS_TEMP should be placed in the last 16 bytes
of GPR (refer to Figure 10-3). These 16 locations are
common to all banks and do not require banking. This
makes context save and restore operations simpler.
The code shown in Example 14-1 can be used to:
•
•
•
•
•
Store the W register
Store the STATUS register
Execute the ISR code
Restore the Status (and Bank Select Bit) register
Restore the W register
Note:
The MCP19114/5 do not require saving
the PCLATH. However, if computed
GOTOs are used in both the ISR and the
main code, the PCLATH must be saved
and restored in the ISR.
EXAMPLE 14-1:
MOVWF
SWAPF
SAVING STATUS AND W REGISTERS IN RAM
W_TEMP
STATUS,W
MOVWF
STATUS_TEMP
:
:(ISR)
:
SWAPF
STATUS_TEMP,W
MOVWF
SWAPF
SWAPF
STATUS
W_TEMP,F
W_TEMP,W
DS20005281B-page 100
;Copy W to TEMP
;Swap status to
;Swaps are used
;Save status to
register
be saved into W
because they do not affect the status bits
bank zero STATUS_TEMP register
;Insert user code here
;Swap STATUS_TEMP register into W
;(sets bank to original state)
;Move W into STATUS register
;Swap W_TEMP
;Swap W_TEMP into W
 2014-2015 Microchip Technology Inc.
MCP19114/5
15.0
POWER-DOWN MODE (SLEEP)
15.1
Wake-Up from Sleep
The Power-Down mode is entered by executing a
SLEEP instruction.
The device can wake up from Sleep through one of the
following events:
Upon entering Sleep mode, the following conditions
exist:
1.
2.
3.
4.
5.
1.
2.
3.
4.
5.
6.
7.
8.
9.
WDT will be cleared but keeps running, if
enabled for operation during Sleep.
PD bit in the STATUS register is cleared.
TO bit in the STATUS register is set.
CPU clock is disabled.
The ADC is inoperable due to the absence of the
4V LDO power (AVDD).
I/O ports maintain the status they had before
SLEEP was executed (driving high, low or
high-impedance).
Resets other than WDT are not affected by
Sleep mode.
Analog Circuit power (AVDD) is removed during
Sleep mode.
POR level changes to 1.2V typical.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following
conditions should be considered:
•
•
•
•
I/O pins should not be floating.
External circuitry sinking current from I/O pins.
Internal circuitry sourcing current from I/O pins.
Current draw from pins with internal weak
pull-ups.
• Modules using Timer1 oscillator.
I/O pins that are high-impedance inputs should be
pulled to VDD or GND externally to avoid switching
currents caused by floating inputs.
External Reset input on MCLR pin, if enabled
POR Reset
Watchdog Timer, if enabled
Any external interrupt
Interrupts by peripherals capable of running
during Sleep (see individual peripheral for more
information)
The first two events will cause a device reset. The last
three events are considered a continuation of program
execution. To determine whether a device reset or
wake-up event occurred, refer to Section 13.7
“Determining the Cause of a Reset”.
The following peripheral interrupts can wake the device
from Sleep:
1.
2.
Interrupt-on-change
External Interrupt from INT pin
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction and will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have an NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
The SLEEP instruction removes power from the analog
circuitry. AVDD is shut down to minimize current draw in
Sleep mode and to maintain a shutdown current of
30 µA typical. The 5V LDO (VDD) voltage drops to
2.5V-3V in Sleep mode. External current draw from the
5V LDO (VDD) should be limited to less than 200 µA.
Loads drawing more than 200 µA externally during
Sleep mode risk loading down the VDD voltage and
tripping POR. A POR event during Sleep mode will
wake the device from Sleep. The enable state of the
analog circuitry does not change with the execution of
the SLEEP instruction.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 101
MCP19114/5
15.1.1
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
- SLEEP instruction will execute as an NOP
- WDT and WDT prescaler will not be cleared
- TO bit in the STATUS register will not be set
- PD bit in the STATUS register will not be
cleared
FIGURE 15-1:
• If the interrupt occurs during or after the
execution of a SLEEP instruction
- SLEEP instruction will be completely
executed
- Device will immediately wake up from Sleep
- WDT and WDT prescaler will be cleared
- TO bit in the STATUS register will be set
- PD bit in the STATUS register will be cleared
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as an NOP.
WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3
Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC
TOST
Interrupt Latency (1)
Interrupt flag
GIE bit
(INTCON reg.)
Processor in
Sleep
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
Note
1:
PC
Inst(PC) = Sleep
Inst(PC - 1)
PC + 1
PC + 2
PC + 2
Inst(PC + 1)
Inst(PC + 2)
Sleep
Inst(PC + 1)
PC + 2
Dummy Cycle
0004h
0005h
Inst(0004h)
Inst(0005h)
Dummy Cycle
Inst(0004h)
GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
TABLE 15-1:
SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register on
Page
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
IOCA
IOCA7
IOCA6
IOCA5
—
IOCA3
IOCA2
IOCA1
IOCA0
122
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
—
—
IOCB1
IOCB0
122
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIE2
CDSIE
—
—
OTIE
OVIE
DRUVIE
OVLOIE
UVLOIE
97
PIR1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
98
PIR2
CDSIF
—
—
OTIF
OVIF
DRUVIF
OVLOIF
UVLOIF
99
IRP
RP1
RP0
TO
PD
Z
DC
C
71
STATUS
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode.
DS20005281B-page 102
 2014-2015 Microchip Technology Inc.
MCP19114/5
16.0
WATCHDOG TIMER (WDT)
16.2
The WDT has a nominal time-out period of 18 ms (with
no prescaler). The time-out periods vary with
temperature, VDD and process variations from part to
part (refer to Table 5-3). If longer time-out periods are
desired, a prescaler with a division ratio of up to 1:128
can be assigned to the WDT under software control by
writing to the OPTION_REG register. Thus, time-out
periods up to 2.3 seconds can be realized.
The Watchdog Timer is a free running timer. The WDT
is enabled by setting the WDTE bit in the CONFIG
register (default setting).
During normal operation, a WDT time out generates a
device reset. If the device is in Sleep mode, a WDT
time out causes the device to wake up and continue
with normal operation.
The WDT can be permanently disabled by clearing the
WDTE bit in the CONFIG register. Refer to
Section 11.1 “Configuration Word” for more
information.
16.1
WDT Period
The CLRWDT and SLEEP instructions clear the WDT
and the prescaler, if assigned to the WDT, and prevent
it from timing out and generating a device reset.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time out.
Watchdog Timer (WDT) Operation
During normal operation, a WDT time out generates a
device reset. If the device is in Sleep mode, a WDT
time out causes the device to wake-up and continue
with normal operation; this is known as a WDT
wake-up. The WDT can be permanently disabled by
clearing the WDTE configuration bit.
16.3
WDT Programming
Considerations
Under worst-case conditions (i.e., VDD = Minimum,
Temperature = Maximum, Maximum WDT prescaler), it
may take several seconds before a WDT time out occurs.
The postscaler assignment is fully under software
control and can be changed during program execution.
FIGURE 16-1:
WATCHDOG TIMER WITH SHARED PRESCALE BLOCK DIAGRAM
FOSC/4
Data Bus
0
8
1
Sync
2 TCY
1
T0CKI
pin
T0SE
T0CS
0
0
Set Flag bit T0IF
on Overflow
PSA
8-Bit
Prescaler
TMR0
1
PSA
8
PS<2:0>
Watchdog
Timer
1
0
PSA
WDT
Time-Out
WDTE
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register.
2: WDTE bit is in the CONFIG register.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 103
MCP19114/5
TABLE 16-1:
WDT STATUS
Conditions
WDT
WDTE = 0
CLRWDT Command
Cleared
Exit Sleep
TABLE 16-2:
SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register on
Page
OPTION_REG
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
78
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: Refer to Register 11-1 for operation of all the bits in the CONFIG register.
TABLE 16-3:
Name
CONFIG
SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
Bit 10/2
Bit 9/1
Bit 8/0
Register
on Page
13:8
—
—
DBGEN
—
WRT1
WRT0
—
BOREN
81
7:0
—
CP
MCLRE
PWRTE
WDTE
—
—
—
Legend: — = unimplemented location, read as ‘1’. Shaded cells are not used by Watchdog Timer.
DS20005281B-page 104
 2014-2015 Microchip Technology Inc.
MCP19114/5
17.0
FLASH PROGRAM MEMORY
CONTROL
The Flash program memory is readable and writable
during normal operation (full VIN range). This memory is
not directly mapped in the register file space. Instead, it
is indirectly addressed through the Special Function
Registers (refer to Registers 17-1 to 17-5). There are
six SFRs used to read and write this memory:
•
•
•
•
•
•
PMCON1
PMCON2
PMDATL
PMDATH
PMADRL
PMADRH
When interfacing the program memory block, the
PMDATL and PMDATH registers form a two-byte word
which holds the 14-bit data for read/write, and the
PMADRL and PMADRH registers form a two-byte
word which holds the 13-bit address of the FLASH
location being accessed. These devices have 4k
words of program Flash with an address range from
0000h to 0FFFh.
The program memory allows single-word read and a
four-word write. A four-word write automatically erases
the row of the location and writes the new data (erase
before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range
of the device for byte or word operations.
17.1
PMADRH and PMADRL Registers
The PMADRH and PMADRL registers can address up
to a maximum of 4k words of program memory.
When selecting a program address value, the Most
Significant Byte (MSB) of the address is written to the
PMADRH register and the Least Significant Byte
(LSB) is written to the PMADRL register.
17.2
PMCON1 and PMCON2 Registers
The PMCON1 register is the control register for the
data program memory accesses.
Control bits RD and WR initiate read and write,
respectively. In software, these bits can only be set,
not cleared. They are cleared in hardware at
completion of the read or write operation. The inability
to clear the WR bit in software prevents the accidental
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear.
The CALSEL bit allows the user to read locations in
test memory in case there are calibration bits stored in
the calibration word locations that need to be
transferred to SFR trim registers. The CALSEL bit is
only for reads. If a write operation is attempted with
CALSEL = 1, no write will occur.
PMCON2 is not a physical register. Reading PMCON2
will read all '0's. The PMCON2 register is used
exclusively in the flash memory write sequence.
When the device is code-protected, the CPU may
continue to read and write the Flash program memory.
Depending on the settings of the Flash Program
Memory Enable (WRT<1:0>) bits, the device may or
may not be able to write certain blocks of the program
memory; however, reads of the program memory are
allowed.
When the Flash Program Memory Code Protection
(CP) bit is enabled, the program memory is
code-protected and the device programmer (ICSP)
cannot access data or program memory.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 105
MCP19114/5
17.3
Flash Program Memory Control Registers
REGISTER 17-1:
R/W-0
PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMDATL<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
PMDATL<7:0>: 8 Least Significant Data bits to Write or Read from Program Memory
REGISTER 17-2:
R/W-0
PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMADRL<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation
REGISTER 17-3:
PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
U-0
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMDATH<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
PMDATH<5:0>: 6 Most Significant Data bits from Program Memory
DS20005281B-page 106
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 17-4:
PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
PMADRH<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
PMADRH<3:0>: 4 Most Significant Address bits or High bits for Program Memory Reads
REGISTER 17-5:
PMCON1: PROGRAM MEMORY CONTROL REGISTER 1
U-1
R/W-0
U-0
U-0
U-0
R/W-0
R/S-0
R/S-0
—
CALSEL
—
—
—
WREN
WR
RD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
S = Bit can only be set
bit 7
Unimplemented: Read as '1'
bit 6
CALSEL: Program Memory calibration space select bit
1 = Select test memory area for reads only (for loading calibration trim registers)
0 = Select user area for reads
bit 5-3
Unimplemented: Read as '0'
bit 2
WREN: Program Memory Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the EEPROM
bit 1
WR: Write Control bit
1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete.
The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the Flash memory is complete
bit 0
RD: Read Control bit
1 = Initiates a program memory read. (The read takes one cycle. The RD is cleared in hardware; the
RD bit can only be set (not cleared) in software.)
0 = Does not initiate a Flash memory read
 2014-2015 Microchip Technology Inc.
DS20005281B-page 107
MCP19114/5
17.3.1
READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must
write two bytes of the address to the PMADRL and
PMADRH registers, and then set control bit RD (bit 0
in the PMCON1register). Once the read control bit is
set, the Program Memory Flash controller will use the
second instruction cycle to read the data. This causes
the second instruction immediately following the BSF
PMCON1,RD instruction to be ignored. The data is
available, in the very next cycle, in the PMDATL and
PMDATH registers; it can be read as two bytes in the
following instructions. PMDATL and PMDATH
registers will hold this value until another read or until it
is written to by the user (during a write operation).
EXAMPLE 17-1:
FLASH PROGRAM READ
BANKSELPM_ADR; Change STATUS bits RP1:0 to select bank with PMADR
MOVLWMS_PROG_PM_ADDR;
MOVWFPMADRH; MS Byte of Program Address to read
MOVLWLS_PROG_PM_ADDR;
MOVWFPMADRL; LS Byte of Program Address to read
BANKSELPMCON1; Bank to containing PMCON1
BSF PMCON1, RD; EE Read
NOP
; First instruction after BSF PMCON1,RD executes normally
NOP
; Any instructions here are ignored as program
; memory is read in second cycle after BSF PMCON1,RD
;
BANKSELPMDATL; Bank to containing PMADRL
MOVFPMDATL, W; W = LS Byte of Program PMDATL
MOVFPMDATH, W; W = MS Byte of Program PMDATL
FIGURE 17-1:
Q1
Flash ADDR
FLASH PROGRAM MEMORY READ CYCLE EXECUTION – NORMAL MODE
Q2
Q3
Q4
PC
Flash DATA
Q1
Q2
Q4
PC + 1
INSTR (PC)
INSTR (PC - 1)
Executed here
Q3
Q1
Q2
Q3
Q4
PMADRH,PMADRL
INSTR (PC + 1)
BSF PMCON1,RD
Executed here
Q1
Q2
Q3
Q1
Q2
Q3
Q4
PC + 4
PC+3
PC
+3
PMDATH,PMDATL
INSTR (PC + 1)
Executed here
Q4
INSTR (PC + 3)
NOP
Executed here
Q1
Q2
Q3
Q4
PC + 5
INSTR (PC + 4)
INSTR (PC + 3)
Executed here
INSTR (PC + 4)
Executed here
RD bit
PMDATH
PMDATL
Register
EERHLT
DS20005281B-page 108
 2014-2015 Microchip Technology Inc.
MCP19114/5
17.3.2
WRITING TO THE FLASH
PROGRAM MEMORY
A word of the Flash program memory may only be
written to if the word is in an unprotected segment of
memory, as defined in Section 11.1 “Configuration
Word” (bits <WRT1:0>).
Note: The write protect bits are used to protect the
user’s program from modification by the
user’s code. They have no effect when
programming is performed by ICSP. The
code-protect bits, when programmed for
code protection, will prevent the program
memory from being written via the ICSP
interface.
Flash program memory must be written in four-word
blocks. Refer to Figures 17-2 and 17-3 for more details.
A block consists of four words with sequential
addresses, with a lower boundary defined by an
address, where PMADRL<1:0> = 00. All block writes to
program memory are done as 16-word erase by
four-word write operations. The write operation is
edge-aligned and cannot occur across boundaries.
To write program data, the WREN bit must first be
loaded into the buffer registers (refer to Figure 17-2).
This is accomplished by first writing the destination
address to PMADRL and PMADRH and then writing
the data to PMDATL and PMDATH. After the address
and data have been set, the following sequence of
events must be executed:
1.
2.
Write 55h, then AAh, to PMCON2 (Flash
programming sequence).
Set the WR control bit in the PMCON1 register.
All four buffer register locations should be written to
with correct data. If less than four words are being
written to in the block of four words, a read from the
program memory location(s) not being written to must
be performed. This takes the data from the program
location(s) not being written and loads it into the
PMDATL and PMDATH registers. Then the sequence
of events to transfer data to the buffer registers must be
executed.
To transfer data from the buffer registers to the program
memory, the PMADRL and PMADRH must point to the
last
location
in
the
four-word
block
(PMADRL<1:0> = 11). Then the following sequence of
events must be executed:
1.
2.
Write 55h, then AAh, to PMCON2 (Flash
programming sequence).
Set control bit WR in the PMCON1 register to
begin the write operation.
 2014-2015 Microchip Technology Inc.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011). When the write is performed on the last
word (PMADRL<1:0> = 11), a block of sixteen words is
automatically erased and the content of the four-word
buffer registers are written into the program memory.
After the BSF PMCON1,WR instruction, the processor
requires two cycles to set up the erase/write operation.
The user must place two NOP instructions after the WR
bit is set. Since data is being written to buffer registers,
the writing of the first three words of the block appears
to occur immediately. The processor will halt internal
operations for the typical 4 ms only during the cycle in
which the erase takes place (i.e., the last word of the
sixteen-word block erase). This is not Sleep mode, as
the clocks and peripherals will continue to run. After
the four-word write cycle, the processor will resume
operation with the third instruction after the PMCON1
write instruction. The above sequence must be
repeated for the higher 12 words.
Note: An erase is only initiated for the write of four
words just after a row boundary; or
PMCON1<WR> set with
PMADRL<3:0> = xxxx0011.
Refer to Figure 17-2 for a block diagram of the buffer
registers and the control signals for test mode.
17.3.3
PROTECTION AGAINST SPURIOUS
WRITE
There are conditions when the device should not write
to the program memory. To protect against spurious
writes, various mechanisms have been built in. On
power-up, WREN is cleared. Also, the Power-Up
Timer (72 ms duration) prevents program memory
writes.
The write initiate sequence and the WREN bit help
prevent an accidental write during a power glitch or
software malfunction.
17.3.4
OPERATION DURING CODE
PROTECT
When the device is code-protected, the CPU is able to
read and write unscrambled data to the program
memory. The test mode access is disabled.
17.3.5
OPERATION DURING WRITE
PROTECT
When the program memory is write-protected, the
CPU can read and execute from the program memory.
The portions of program memory that are
write-protected cannot be modified by the CPU using
the PMCON registers. The write protection has no
effect in ICSP mode.
DS20005281B-page 109
MCP19114/5
FIGURE 17-2:
BLOCK WRITES TO 4K FLASH PROGRAM MEMORY
7
5
0
0 7
PMDATL
PMDATH
6
8
14
14
First word of block
to be written
14
PMADRL<1:0> = 00
Buffer Register
Buffer Register
14
PMADRL<1:0> = 10
PMADRL<1:0> = 01
If at new row
sixteen words of
Flash are erased,
then four buffers are
transferred to Flash
automatically
after
this word is written
PMADRL<1:0> = 11
Buffer Register
Buffer Register
Program Memory
FIGURE 17-3:
FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
PMADRH, PMADRL
PC + 1
Flash
ADDR
INSTR
(PC)
Flash
DATA
Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
INSTR
(PC + 1)
ignored
read
BSF PMCON1,WR INSTR (PC + 1)
Executed here
Executed here
PMDATH, PMDATL
Processor halted
EE Write Time
PC + 2
PC + 3
INSTR (PC+2)
NOP
Executed here
PC + 4
INSTR (PC+3)
(INSTR (PC + 2)
NOP
INSTR (PC + 3)
Executed here Executed here
Flash
Memory
Location
WR bit
PMWHLT
DS20005281B-page 110
 2014-2015 Microchip Technology Inc.
MCP19114/5
18.0
I/O PORTS
18.1
In general, when a peripheral is enabled, that pin may
not be used as a general-purpose I/O pin.
Each port has the registers for its operation. These
registers are:
• TRISGPx registers (data direction register)
• PORTGPx registers (read the levels on the pins of
the device)
Some ports may have one or more of the following
additional registers. These registers are:
• ANSELx (analog select)
• WPUGPx (weak pull-up)
Ports with analog functions also have an ANSELx
register, which can disable the digital input and save
power. A simplified model of a generic I/O port, without
the interfaces to other peripherals, is shown in
Figure 18-1.
FIGURE 18-1:
GENERIC I/O PORTGPX
OPERATION
Read LATx
D
TRISGPx
Write PORTGPx
Q
CK
PORTGPA is an 8-bit wide, bidirectional port consisting
of five CMOS I/Os, one open-drain I/O and one
open-drain input-only pin (GPA4 is not available). The
corresponding data direction register is TRISGPA.
Setting a TRISGPA bit to 1 will make the corresponding
PORTGPA pin an input (i.e., disable the output driver).
Clearing a TRISGPA bit set to 0 will make the
corresponding PORTGPA pin an output (i.e., enables
output driver). The exception is GPA5, which is input
only and its TRISGPA bit will always read as ‘1’.
Example 18-1 shows how to initialize an I/O port.
Reading the PORTGPA register reads the status of the
pins, whereas writing to it will write to the PORT latch.
All write operations are read-modify-write operations.
The TRISGPA register controls the PORTGPA pin
output drivers, even when they are being used as
analog inputs. The user must ensure the bits in the
TRISGPA register are maintained set when using them
as analog inputs. I/O pins configured as analog input
always read ‘0’. If the pin is configured for a digital
output (either port or alternate function), the TRISGPA
bit must be cleared in order for the pin to drive the
signal, and a read will reflect the state of the pin.
18.1.1
Write LATx
VDD
Data Register
PORTGPA and TRISGPA Registers
INTERRUPT-ON-CHANGE
Each PORTGPA pin is individually configurable as an
interrupt-on-change pin. Control bits IOCB<7:4> and
IOCB<2:0> enable or disable the interrupt function for
each pin. The interrupt-on-change feature is disabled
on a Power-On Reset. Reference Section 19.0
“Interrupt-On-Change” for more information.
Data Bus
I/O pin
Read PORTGPx
To peripherals
ANSELx
EXAMPLE 18-1:
;
;
;
;
VSS
INITIALIZING PORTGPA
This code example illustrates
initializing the PORTGPA register. The
other ports are initialized in the same
manner.
BANKSEL
CLRF
BANKSEL
CLRF
BANKSEL
MOVLW
MOVWF
PORTGPA;
PORTGPA;Init PORTA
ANSELA;
ANSELA;digital I/O
TRISGPA;
B'00011111';Set GPA<3:0> as
;inputs
TRISGPA;and set GPA<7:5> as
;outputs
 2014-2015 Microchip Technology Inc.
18.1.2
WEAK PULL-UPS
PORTGPA <3:0> and PORTGPA5 have an internal weak
pull-up. PORTGPA<7:6> do not have internal weak
pull-ups. Individual control bits can enable or disable the
internal weak pull-ups (refer to Register 18-3). The weak
pull-up is automatically turned off when the port pin is
configured as an output, an alternative function or on a
Power-On Reset setting the RAPU bit in the
OPTION_REG register. The weak pull-up on GPA5 is
enabled when configured as MCLR pin by setting bit 5 in
the CONFIG register, and disabled when GPA5 is an I/O.
There is no software control of the MCLR pull-up.
DS20005281B-page 111
MCP19114/5
18.1.3
ANSELA REGISTER
The ANSELA register is used to configure the input
mode of an I/O pin to analog. Setting the appropriate
ANSELA bit high will cause all digital reads on the pin
to be read as ‘0’ and allow analog functions on the pin
to operate correctly.
The state of the ANSELA bits has no effect on digital
output functions. A pin with TRISGPA cleared and
ANSELx set will still operate as a digital output, but the
input mode will be analog. This can cause unexpected
behavior
when
executing
read-modify-write
instructions on the affected port.
Note:
18.1.4
The ANSELA bits default to the Analog
mode after Reset. To use any pins as
digital general-purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by the user’s
software.
PORTGPA FUNCTIONS AND
OUTPUT PRIORITIES
Each PORTGPA pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are shown in Table 18-1. For additional
information, refer to the appropriate section in this data
sheet.
TABLE 18-1:
PORTGPA OUTPUT
PRIORITY
Function Priority(1)
Pin Name
GPA0
GPA0
GPA1
GPA1
GPA2
GPA2
TEST_OUT
CLKPIN
T0CKI
INT
GPA3
GPA3
GPA5
GPA5 (open-drain, input only)
MCLR
TEST_EN
GPA6
GPA6
CCD
ICSPDAT
GPA7
GPA7 (open-drain output, ST
input)
SCL
Note 1:
Output function priority listed from lowest
to highest.
Pin GPA7 in the PORTGPA register is a true open-drain
pin with no connection back to VDD.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC, are not shown in
the priority lists. These inputs are active when the I/O
pin is set for Analog mode using the ANSELA register.
Digital output functions may control the pin when it is in
Analog mode with the priority shown in Table 18-1.
DS20005281B-page 112
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 18-1:
PORTGPA: PORTGPA REGISTER
R/W-x
R/W-x
R-x
U-0
R/W-x
R/W-x
R/W-x
R/W-x
GPA7
GPA6
GPA5
—
GPA3
GPA2
GPA1
GPA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
GPA7: General-Purpose Open-Drain I/O pin
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 6
GPA6: General-Purpose I/O pin
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 5
GPA5/MCLR/TEST_EN5: General-Purpose Open-Drain input pin
bit 4
Unimplemented: Read as ‘0’
bit 3-0
GPA<3:0>: General-Purpose I/O pin
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 18-2:
R/W-1
TRISGPA: PORTGPA TRI-STATE REGISTER
R/W-1
TRISA7
TRISA6
R-1
U-0
R/W-1
R/W-1
R/W-1
R/W-1
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
TRISA<7:6>: PORTGPA Tri-State Control bit
1 = PORTGPA pin configured as an input (tri-stated)
0 = PORTGPA pin configured as an output
bit 5
TRISA5: GPA5 Port Tri-State Control bit
This bit is always ‘1’ as GPA5 is an input only
bit 4
Unimplemented: Read as ‘0’
bit 3-0
TRISA<3:0>: PORTGPA Tri-State Control bit
1 = PORTGPA pin configured as an input (tri-stated)
0 = PORTGPA pin configured as an output
 2014-2015 Microchip Technology Inc.
DS20005281B-page 113
MCP19114/5
REGISTER 18-3:
WPUGPA: WEAK PULL-UP PORTGPA REGISTER
U-0
U-0
R/W-1
U-0
R/W-1
R/W-1
R/W-1
R/W-1
—
—
WPUA5
—
WPUA3
WPUA2
WPUA1
WPUA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5
WPUA5: Weak Pull-Up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 4
Unimplemented: Read as ‘0’
bit 3-0
WPUA<3:0>: Weak Pull-Up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
Note 1:
2:
The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode
(TRISGPA = 1) and the individual WPUA bit is enabled (WPUA = 1), and the pin is not configured as an
analog input.
GPA5 weak pull-up is also enabled when the pin is configured as MCLR in the CONFIG register.
REGISTER 18-4:
ANSELA: ANALOG SELECT GPA REGISTER
U-0
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
ANSA<3:0>: Analog Select GPA Register bit
1 = Analog input. Pin is assigned as analog input.(1)
0 = Digital I/O. Pin is assigned to port or special function.
Note 1:
Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and
interrupt-on-change if available. The corresponding TRISA bit must be set to Input mode in order to allow
external control of the voltage on the pin.
DS20005281B-page 114
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 18-2:
Name
ANSELA
OPTION_REG
SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPA
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
114
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
78
PORTGPA
GPA7
GPA6
GPA5
—
GPA3
GPA2
GPA1
GPA0
113
TRISGPA
TRISA7
TRISA6
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
113
WPUGPA
—
—
WPUA5
—
WPUA3
WPUA2
WPUA1
WPUA0
114
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPA.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 115
MCP19114/5
18.2
PORTGPB and TRISGPB
Registers
Due to special function pin requirements, a limited
number of the PORTGPB I/Os are utilized. On the
24-pin QFN MCP19114, GPB0 and GPB1 are
implemented. GPB0 is an open-drain general-purpose
I/O and SDA pin. GPB1 is a general-purpose I/O,
analog input and VREF2 DAC output. The 28-pin QFN
MCP19114 has four additional general-purpose
PORTGPB I/O pins. The corresponding data direction
register is TRISGPB. Setting a TRISGPB bit to 1 will
make the corresponding PORTGPB pin an input (i.e.,
disable the output driver). Clearing a TRISGPB bit to 0
will make the corresponding PORTGPB pin an output
(i.e., enable the output driver). Example 18-1 shows
how to initialize an I/O port.
Some pins for PORTGPB are multiplexed with an
alternate function for the peripheral or a clock function.
In general, when a peripheral or clock function is
enabled, that pin may not be used as a
general-purpose I/O pin.
Reading the PORTGPB register reads the status of the
pins, whereas writing to it will write to the PORT latch.
All write operations are read-modify-write operations.
The TRISGPB register controls the PORTGPB pin output drivers, even when they are being used as analog
inputs. The user should ensure the bits in the TRISGPB
register are maintained set when using them as analog
inputs. I/O pins configured as analog input always read
‘0’. If the pin is configured for a digital output (either port
or alternate function), the TRISGPB bit must be cleared
in order for the pin to drive the signal and a read will
reflect the state of the pin.
18.2.1
18.2.2
WEAK PULL-UPS
Each of the PORTGPB pins has an individually
configurable internal weak pull-up. Control bits
WPUB<7:4> and WPUB<1> enable or disable each
pull-up (refer to Register 18-7). Each weak pull-up is
automatically turned off when the port pin is configured
as an output. All pull-ups are disabled on a Power-On
Reset by the RAPU bit in the OPTION_REG register.
18.2.3
ANSELB REGISTER
The ANSELB register is used to configure the input
mode of an I/O pin to analog. Setting the appropriate
ANSELB bit high will cause all digital reads on the pin
to be read as ‘0’ and allow analog functions on the pin
to operate correctly.
The state of the ANSELB bits has no effect on the digital
output functions. A pin with TRISGPB clear and
ANSELB set will still operate as a digital output, but the
input mode will be analog. This can cause unexpected
behavior when executing read-modify-write instructions
on the affected port.
The TRISGPB register controls the PORTGPB pin output
drivers, even when they are being used as analog inputs.
The user should ensure the bits in the TRISGPB register
are maintained set when using them as analog inputs. I/O
pins configured as analog input always read ‘0’.
Note:
The ANSELB bits default to the Analog
mode after Reset. To use any pins as
digital general-purpose or peripheral
inputs, the corresponding ANSELB bits
must be initialized to ‘0’ by the user’s
software.
INTERRUPT-ON-CHANGE
Each PORTGPB pin is individually configurable as an
interrupt-on-change pin. Control bits IOCB<7:4> and
IOCB<2:0> enable or disable the interrupt function for
each pin. The interrupt-on-change feature is disabled
on a Power-On Reset. Reference Section 19.0
“Interrupt-On-Change” for more information.
DS20005281B-page 116
 2014-2015 Microchip Technology Inc.
MCP19114/5
18.2.4
PORTGPB FUNCTIONS AND
OUTPUT PRIORITIES
TABLE 18-3:
Each PORTGPB pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are shown in Table 18-3. For additional
information, refer to the appropriate section in this data
sheet.
GPB0
SDA
GPB7
GPB1
VREF2
GPB4
GPB4 (MCP19114)
ICSPDAT
Analog input functions, such as ADC, and some digital
input functions are not included in the list below. These
inputs are active when the I/O pin is set for Analog
mode using the ANSELB register. Digital output
functions may control the pin when it is in Analog mode,
with the priority shown in Table 18-3.
(1)
GPB0 (open-drain input/output)
GPB1
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
R/W-x
Function Priority(1)
Pin Name
GPB0 pin in the PORTGPB register is a true open-drain
pin with no connection back to VDD.
REGISTER 18-5:
PORTGPB OUTPUT
PRIORITY
GPB5
GPB5 (MCP19114)
GPB6
GPB6 (MCP19114)
GPB7
GPB7 (MCP19114)
CCD2
Note 1:
Output function priority listed from lowest
to highest.
PORTGPB: PORTGPB REGISTER
R/W-x
R/W-x
R/W-x
U-0
U-0
R/W-x
R/W-x
GPB6(1)
GPB5(1)
GPB4(1)
—
—
GPB1
GPB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
GPB<7:4>: General-Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
GPB<1:0>: General-Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1:
MCP19115 only.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 117
MCP19114/5
REGISTER 18-6:
R/W-1
TRISB7
TRISGPB: PORTGPB TRI-STATE REGISTER
R/W-1
(1)
TRISB6
(1)
R/W-1
TRISB5
(1)
R/W-1
TRISB4
(1)
U-0
U-0
R/W-1
R/W-1
—
—
TRISB1
TRISB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
TRISB<7:4>: PORTGPB Tri-State Control bit
1 =PORTGPB pin configured as an input (tri-stated)
0 = PORTGPB pin configured as an output
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
TRISB<1:0>: PORTGPB Tri-State Control bit
1 =PORTGPB pin configured as an input (tri-stated)
0 = PORTGPB pin configured as an output
Note 1:
MCP19115 only.
REGISTER 18-7:
WPUGPB: WEAK PULL-UP PORTGPB REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
U-0
U-0
R/W-1
U-0
WPUB7(2)
WPUB6(2)
WPUB5(2)
WPUB4(2)
—
—
WPUB1
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
WPUB<7:4>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 3-2
Unimplemented: Read as ‘0’
bit 1
WPUB<1>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode
(TRISGPA = 1) and the individual WPUB bit is enabled (WPUB = 1), and the pin is not configured as an
analog input.
MCP19115 only.
DS20005281B-page 118
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 18-8:
ANSELB: ANALOG SELECT GPB REGISTER
U-0
R/W-1
—
ANSB6(1)
R/W-1
ANSB5
R/W-1
(1)
(1)
ANSB4
U-0
U-0
R/W-1
U-0
—
—
ANSB1
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-4
ANSB<6:4>: Analog Select GPB Register bit
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 3-2
Unimplemented: Read as ‘0’
bit 1
ANSB1: Analog Select GPB Register bit
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
MCP19115 only.
Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
TABLE 18-4:
Name
ANSELB
OPTION_REG
SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPB
Bit 7
Bit 6
—
ANSB6(1)
RAPU
(1)
Bit 5
Bit 4
ANSB5(1) ANSB4(1)
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB1
—
119
PS1
PS0
78
INTEDG
T0CS
T0SE
PSA
PS2
GPB6(1)
GPB5(1)
GPB4(1)
—
—
GPB1
GPB0
117
TRISGPB
TRISB7(1) TRISB6(1) TRISB5(1) TRISB4(1)
—
—
TRISB1
TRISB0
118
WPUGPB
WPUB7(1) WPUB6(1) WPUB5(1) WPUB4(1)
—
—
WPUB1
—
118
PORTGPB
GPB7
= unimplemented locations, read as ‘0’. Shaded cells are not used by the PORTGPB register.
Legend:
—
Note 1:
MCP19115 only.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 119
MCP19114/5
NOTES:
DS20005281B-page 120
 2014-2015 Microchip Technology Inc.
MCP19114/5
19.0
INTERRUPT-ON-CHANGE
Each PORTGPA and PORTGPB pin is individually
configurable as an interrupt-on-change pin. Control bits
IOCA and IOCB enable or disable the interrupt function
for each pin. Refer to Registers 19-1 and 19-2. The
interrupt-on-change is disabled on a Power-On Reset.
The interrupt-on-change on GPA5 is disabled when
configured as MCLR pin in the CONFIG register.
For enabled interrupt-on-change pins, the values are
compared with the old value latched on the last read of
PORTGPA or PORTGPB. The mismatched outputs of
the last read of all the PORTGPA and PORTGPB pins
are OR’ed together to set the Interrupt-on-Change
Interrupt Flag (IOCF) bit in the INTCON register.
19.1
Enabling the Module
To allow individual port pins to generate an interrupt, the
IOCE bit in the INTCON register must be set. If the IOCE
bit is disabled, the edge detection on the pin will still
occur, but an interrupt will not be generated.
19.2
Individual Pin Configuration
To enable a pin to detect an interrupt-on-change, the
associated IOCAx or IOCBx bit in the IOCA or IOCB
registers is set.
19.3
Clearing Interrupt Flags
The user, in the Interrupt Service Routine, clears the
interrupt by:
a)
Any read of PORTGPA or PORTGPB AND
Clear flag bit IOCF. This will end the mismatch
condition.
OR
b)
Any write of PORTGPA or PORTGPB AND
Clear flag bit IOCF will end the mismatch
condition.
A mismatch condition will continue to set flag bit IOCF.
Reading PORTGPA or PORTGPB will end the
mismatch condition and allow flag bit IOCF to be
cleared. The latch holding the last read value is not
affected by a MCLR Reset. After this Reset, the IOCF
flag will continue to be set if a mismatch is present.
Note:
19.4
If a change on the I/O pin should occur
when any PORTGPA or PORTGPB
operation is being executed, the IOCF
interrupt flag may not get set.
Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCE bit is set.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 121
MCP19114/5
19.5
Interrupt-On-Change Registers
REGISTER 19-1:
IOCA: INTERRUPT-ON-CHANGE PORTGPA REGISTER
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
IOCA7
IOCA6
IOCA5
—
IOCA3
IOCA2
IOCA1
IOCA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
IOCA<7:6>: Interrupt-on-Change PORTGPA register bits
1 = Interrupt-on-change enabled on the pin.
0 = Interrupt-on-change disabled on the pin.
bit 5
IOCA<5>: Interrupt-on-Change PORTGPA register bits(1)
1 = Interrupt-on-change enabled on the pin.
0 = Interrupt-on-change disabled on the pin.
bit 4
Unimplemented: Read as ‘0’
bit 3-0
IOCA<3:0>: Interrupt-on-Change PORTGPA register bits
1 = Interrupt-on-change enabled on the pin.
0 = Interrupt-on-change disabled on the pin.
Note 1:
The Interrupt-on-Change on GPA5 is disabled if GPA5 is configured as MCLR.
REGISTER 19-2:
IOCB: INTERRUPT-ON-CHANGE PORTGPB REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
R/W-0
IOCB7(1)
IOCB6(1)
IOCB5(1)
IOCB4(1)
—
—
IOCB1
IOCB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
IOCB<7:4>: Interrupt-on-Change PORTGPB register bits
1 = Interrupt-on-change enabled on the pin.
0 = Interrupt-on-change disabled on the pin.
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
IOCB<1:0>: Interrupt-on-Change PORTGPB register bits
1 = Interrupt-on-change enabled on the pin.
0 = Interrupt-on-change disabled on the pin.
Note 1:
MCP19115 only.
DS20005281B-page 122
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 19-1:
Name
ANSELA
ANSELB
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
Bit 7
Bit 6
—
—
—
ANSB6
Bit 5
Bit 4
—
(1)
ANSB5
—
(1)
(1)
ANSB4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSA3
ANSA2
ANSA1
ANSA0
114
—
—
ANSB1
—
119
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
IOCA
IOCA7
IOCA6
IOCA5
—
IOCA3
IOCA2
IOCA1
IOCA0
122
IOCB
IOCB7(1)
IOCB6(1)
IOCB5(1)
IOCB4(1)
—
—
IOCB1
IOCB0
122
TRISGPA
TRISA7
TRISA6
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
113
—
—
TRISB1
TRISB0
118
INTCON
TRISGPB
TRISB7
(1)
TRISB6
(1)
TRISB5
(1)
TRISB4
(1)
Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by interrupt-on-change.
Note 1: MCP19115 only.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 123
MCP19114/5
NOTES:
DS20005281B-page 124
 2014-2015 Microchip Technology Inc.
MCP19114/5
20.0
INTERNAL TEMPERATURE
INDICATOR MODULE
The MCP19114/5 are equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit's range of operating
temperature falls between -40°C and +125°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
20.1
Circuit Operation
This internal temperature measurement circuit is
always enabled.
FIGURE 20-1:
20.2
Temperature Output
The output of the circuit is measured using the internal
analog-to-digital converter. Channel 13 is reserved for
the temperature circuit output. Refer to Section 21.0
“Analog-to-Digital Converter (ADC) Module” for
detailed information.
The temperature of the silicon die can be calculated by
the ADC measurement by using Equation 20-1. A
factory-stored 10-bit ADC value for 30°C is located at
address 2084h. The temperature coefficient for this
circuit is 15.7 mV/°C (±0.8 mV/°C). Other temperature
readings can be calculated from the 30°C mark.
TEMPERATURE CIRCUIT
DIAGRAM
VDD
VOUT
ADC
MUX
ADC
n
CHS bits
(ADCON0 register)
EQUATION 20-1:
SILICON DIE TEMPERATURE
 ADC_READING (counts) – ADC_30  C_READING (counts 
TEMP_DIE(  C  = ----------------------------------------------------------------------------------------------------------------------------------------------------- + 30  C
4.0 (counts/  C 
 2014-2015 Microchip Technology Inc.
DS20005281B-page 125
MCP19114/5
NOTES:
DS20005281B-page 126
 2014-2015 Microchip Technology Inc.
MCP19114/5
21.0
ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
Note:
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs which are multiplexed into a single
sample-and-hold circuit. The output of the
sample-and-hold is connected to the input of the
converter. The converter generates a 10-bit binary
result via successive approximation and stores the
right justified conversion result into the ADC result
registers
(ADRESH:ADRESL
register
pair).
Figure 21-1 shows the block diagram of the ADC.
Once
VIN
is
greater
than
AVDD + VDROPOUT, AVDD is in regulation,
allowing A/D readings to be accurate.
Once VIN is greater than VDD + VDROPOUT,
VDD is in regulation, allowing accurate
ratiometric measurements.
The internal band gap supplies the voltage reference to
the ADC.
FIGURE 21-1:
ADC BLOCK DIAGRAM
Note 1: When ADON = 0, all multiplexer inputs are
disconnected.
VIN/n
00000
VREF
OV_REF
00001
00010
VBGR*
00011
VS
00100
EA_SC
00101
A2
00110
PEDESTAL
00111
RESERVED
01000 TRI-STATE
RESERVED
01001
IP_ADJ
01010
IP_OFF_REF
01011
VDR/n
01100
TEMP_SNS
01101
DLL_VCON
01110
SLPCMP_REF
01111
2: Refer to ADCON0 register for detailed analog
channel selection per device.
AVDD
CHS4: CHS0
GPA0/AN0
11000
GPA1/AN1
11001
GPA2/AN2
11010
GPA3/AN3
11011
GPB1/AN4
11100
(MCP19115 Only) GPB4/AN5
11101
(MCP19115 Only) GPB5/AN6
11110
(MCP19115 Only) GPB6/AN7
11111
ADC
10
GO/DONE
10
ADON
ADRESH ADRESL
VSS
CHS4: CHS0
 2014-2015 Microchip Technology Inc.
DS20005281B-page 127
MCP19114/5
21.1
ADC Configuration
When configuring and using the ADC, the following
functions must be considered:
•
•
•
•
•
Port configuration
Channel selection
ADC conversion clock source
Interrupt control
Result formatting
21.1.1
PORT CONFIGURATION
The ADC is used to convert analog signals into a
corresponding digital representation. When converting
analog signals, the I/O pin should be configured for
analog by setting the associated TRIS and ANSEL bits.
Refer to Section 18.0 “I/O Ports” for more
information.
Note:
21.1.2
Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
21.1.3
ADC CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits in the ADCON1 register.
There are five possible clock options:
•
•
•
•
•
FOSC/8
FOSC/16
FOSC/32
FOSC/64
FRC (clock derived from internal oscillator with a
divisor of 16)
The time to complete one-bit conversion is defined as
TAD. One full 10-bit conversion requires 11 TAD periods,
as shown in Figure 21-2.
For a correct conversion, the appropriate TAD
specification must be met. Refer to the A/D conversion
requirements
in
Section 4.0
“Electrical
Characteristics” for more information. Table 21-1
gives examples of appropriate ADC clock selections.
Note:
CHANNEL SELECTION
There are up to 21 channel selections available for the
MCP19114 and 24 channels for the MCP19115:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
AN<4:0> pins
AN<7:5> pins (MCP19115 Only)
VIN: 1/15.53 of the input voltage (VIN)
VREF: voltage reference for regulation set point
OV_REF: reference for OV comparator
VBGR: band gap reference
VS: voltage proportional to VOUT
EA_SC: error amplifier output after slope
compensation
A2: secondary current sense amplifier output
PEDESTAL
RESERVED
RESERVED
IP_ADJ: IP after pedestal and offset adjust
IP_OFF_REF: IP offset reference
VDR: VDR * 0.229V/V
TEMP_SNS: analog voltage representing internal
temperature (refer to Equation 20-1)
DLL_VCON: delay locked loop voltage reference
SLPCMP_REF: slope compensation reference
The CHS<4:0> bits in the ADCON0 register determine
which channel is connected to the sample and hold
circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 21.2
“ADC Operation” for more information.
DS20005281B-page 128
Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
TABLE 21-1:
ADC CLOCK PERIOD (TAD) VS.
DEVICE OPERATING
FREQUENCIES
ADC Clock Period (TAD)
Device
Frequency
(FOSC)
ADC
Clock Source
ADCS<2:0>
8 MHz
FOSC/8
001
1.0 µs(2)
FOSC/16
101
2.0 µs
FOSC/32
010
4.0 µs
FOSC/64
110
8.0 µs(3)
FRC
x11
2.0-6.0 µs(1, 4)
Legend: Shaded cells are outside of
recommended range.
Note 1: The FRC source has a typical TAD time of
4 µs for VDD > 3.0V.
2: These values violate the minimum
required TAD time.
3: For faster conversion times, the selection
of another clock source is recommended.
4: The FRC clock source is only
recommended if the conversion will be
performed during Sleep.
 2014-2015 Microchip Technology Inc.
MCP19114/5
FIGURE 21-2:
ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11
b9
b8
b7
b6
b5
b4
b2
b3
b1
b0
Conversion starts
Holding capacitor is disconnected from analog input (typically 100 ns)
Set GO/DONE bit
On the following cycle:
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
21.1.4
INTERRUPTS
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake up from Sleep and resume in-line code
execution, the GIE and PEIE bits in the INTCON
register must be disabled. If the GIE and PEIE bits in
the INTCON register are enabled, execution will switch
to the Interrupt Service Routine.
The ADC module allows for the ability to generate an
interrupt upon completion of an analog-to-digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
21.1.5
2: The ADC operates during Sleep only
when the FRC oscillator is selected.
FIGURE 21-3:
RESULT FORMATTING
The 10-bit A/D conversion result is supplied in right
justified format only.
10-BIT A/D RESULT FORMAT
(ADFM = 1)
MSB
bit 7
LSB
bit 0
Read as ‘0
 2014-2015 Microchip Technology Inc.
bit 7
bit 0
10-bit A/D Result
DS20005281B-page 129
MCP19114/5
21.2
21.2.1
ADC Operation
STARTING A CONVERSION
To enable the ADC module, the ADON bit in the
ADCON0 register must be set to a ‘1’. Setting the
GO/DONE bit in the ADCON0 register to a ‘1’ will start
the analog-to-digital conversion.
Note:
21.2.2
The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer
to
Section 21.2.5
“A/D
Conversion Procedure”.
COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
• Update the ADRESH:ADRESL registers with new
conversion result
21.2.3
TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete analog-to-digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion.
Additionally, two ADC clock cycles are required before
another acquisition can be initiated. Following the
delay, an input acquisition is automatically started on
the selected channel.
Note:
21.2.4
A device reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
ADC OPERATION DURING SLEEP
The ADC is not operational during Sleep mode. The
AVDD 4V reference has been removed to minimize
Sleep current.
DS20005281B-page 130
21.2.5
A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an analog-to-digital conversion:
1.
2.
3.
4.
5.
6.
7.
8.
Configure Port:
• Disable pin output driver (refer to the
TRISGPx registers)
• Configure pin as analog (refer to the ANSELx
registers)
Configure the ADC module:
• Select ADC conversion clock
• Select ADC input channel
• Turn on ADC module
Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
Wait the required acquisition time(2).
Start conversion by setting the GO/DONE bit.
Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
Read ADC Result.
Clear the ADC interrupt flag (required if interrupt
is enabled).
Note 1: The global interrupt can be disabled if the
user is attempting to wake up from Sleep
and resume in-line code execution.
2: Refer to Section 21.4 “A/D Acquisition
Requirements”.
EXAMPLE 21-1:
A/D CONVERSION
;This code block configures the ADC
;for polling, Frc clock and AN0 input.
;
;Conversion start & polling for completion ;
are included.
;
BANKSELADCON1;
MOVLWB’01110000’;Frc clock
MOVWFADCON1;
BANKSELTRISGPA;
BSF TRISGPA,0;Set GPA0 to input
BANKSELANSELA;
BSF ANSELA,0;Set GPA0 to analog
BANKSELADCON0;
MOVLWB’01100001’;Select channel AN0
MOVWFADCON0;Turn ADC On
CALLSampleTime;Acquisiton delay
BSF ADCON0,1;Start conversion
BTFSCADCON0,1;Is conversion done?
GOTO$-1 ;No, test again
BANKSELADRESH;
MOVFADRESH,W;Read upper 2 bits
MOVWFRESULTHI;store in GPR space
BANKSELADRESL;
MOVFADRESL,W;Read lower 8 bits
MOVWFRESULTLO;Store in GPR space
 2014-2015 Microchip Technology Inc.
MCP19114/5
21.3
ADC Register Definitions
The following registers are used to control the
operation of the ADC:
REGISTER 21-1:
ADCON0: A/D CONTROL REGISTER 0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-2
CHS<4:0>: Analog Channel Select bits
00000 = VIN/n analog voltage measurement (VIN/n = VIN/15.5328)
00001 = VREF (DAC reference voltage setting current regulation level)
00010 = OV_REF (reference for overvoltage comparator)
00011 = VBGR (band gap reference)
00100 = VS (Voltage proportional to VOUT)
00101 = EA_SC (Error amp after Slope Compensation output)
00110 = A2 (Secondary Current Sense Amplifier output)
00111 = PEDESTAL (Pedestal Voltage)
01000 = RESERVED
01001 = RESERVED
01010 = IP_ADJ (IP after Pedestal and Offset Adjust (at PWM Comparator))
01011 = IP_OFF_REF (IP Offset Reference)
01100 = VDR/n (VDR/n analog driver voltage measurement = 0.229V/V * VDR)
01101 = TEMP_SNS (analog voltage representing internal temperature)
01110 = DLL_VCON (Delay Locked-Loop Voltage Reference – Control voltage for dead time)
01111 = SLPCMP_REF (Slope compensation reference)
10000 = Unimplemented
10001 = Unimplemented
10010 = Unimplemented
10011 = Unimplemented
10100 = Unimplemented
10101 = Unimplemented
10110 = Unimplemented
10111 = Unimplemented
11000 = GPA0/AN0 (i.e. ADDR1)
11001 = GPA1/AN1 (i.e. ADDR0)
11010 = GPA2/AN2 (i.e. Temperature Sensor Input)
11011 = GPA3/AN3 (i.e. BIN)
11100 = GPB1/AN4
11101 = GPB4/AN5 (MCP19115 only)
11110 = GPB5/AN6 (MCP19115 only)
11111 = GPB6/AN7 (MCP19115 only)
bit 1
GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0
ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
 2014-2015 Microchip Technology Inc.
DS20005281B-page 131
MCP19114/5
REGISTER 21-2:
ADCON1: A/D CONTROL REGISTER 1
U-0
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
—
ADCS2
ADCS1
ADCS0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-4
ADCS<2:0>: A/D Conversion Clock Select bits
000 =Reserved
001 =FOSC/8
010 =FOSC/32
x11 =FRC (clock derived from internal oscillator with a divisor of 16)
100 =Reserved
101 =FOSC/16
110 =FOSC/64
bit 3-0
Unimplemented: Read as ‘0’
REGISTER 21-3:
ADRESH: ADC RESULT REGISTER HIGH
U-0
U-0
U-0
U-0
U-0
U-0
R-x
R-x
—
—
—
—
—
—
ADRES9
ADRES8
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1-0
ADRES<9:8>: Most Significant A/D Results
REGISTER 21-4:
ADRESL: ADC RESULT REGISTER LOW
R-x
R-x
R-x
R-x
R-x
R-x
R-x
R-x
ADRES7
ADRES6
ADRES5
ADRES4
ADRES3
ADRES2
ADRES1
ADRES0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ADRES<7:0>: Least Significant A/D results
DS20005281B-page 132
 2014-2015 Microchip Technology Inc.
MCP19114/5
21.4
A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 21-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 21-4. The maximum recommended
impedance for analog sources is 10 k.
EQUATION 21-1:
As the source impedance is decreased, the acquisition
time may be decreased. After the analog input channel
is selected (or changed), an A/D acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 21-1 may be
used. This equation assumes that 1/2 LSb error is used
(1,024 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
ACQUISITION TIME EXAMPLE
Assumptions: Temperature = +50°C and external impedance of 10 k  5.0V V
DD
T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
= T AMP + T C + T COFF
= 2 µs + T C +   Temperature - 25°C   0.05 µs/°C  
The value for TC can be approximated with the following equations:


1
V APPLIED  1 – ------------------------------ = V CHOLD
n+1

2
 – 1
– TC

----------

RC 
V
1–e
 = V CHOLD
APPLIED 



– TC

----------



RC 
1
V
1–e
 = V APPLIED  1 – ------------------------------
APPLIED 
n+1


2
 – 1


;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
Note: Where n = number of bits of the ADC.
Solving for TC:
T C = – C HOLD  R IC + R SS + R S  ln(1/2047)
= – 10 pF  1 k  + 7 k  + 10 k   ln(0.0004885)
= 1.37 µs
Therefore:
T
ACQ
= 2 µs + 1.37µs +   50°C- 25°C   0.05µs/°C  
= 4.67 µs
Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion.
2: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 133
MCP19114/5
FIGURE 21-4:
ANALOG INPUT MODEL
RS
VA
Sampling
Switch
SS RSS
VDD
Analog
Input
pin
VT  0.6V
CPIN
5 pF
VT  0.6V
RIC  1k
ILEAKAGE(1)
CHOLD = 10 pF
VSS/VREF-
Legend:
CHOLD = Sample/Hold Capacitance
CPIN = Input Capacitance
ILEAKAGE = Leakage current at the pin due to various junctions
6V
5V
VDD 4V
3V
2V
RIC = Interconnect Resistance
RSS
5 6 7 8 91011
Sampling Switch
(kW)
RSS = Resistance of Sampling Switch
SS = Sampling Switch
VT = Threshold Voltage
Note 1: Refer to Section 4.0 “Electrical Characteristics”.
FIGURE 21-5:
ADC TRANSFER FUNCTION
ADC Output Code
Full-Scale Range
3FFh
3FEh
3FDh
3FCh
3FBh
03h
02h
01h
00h
Analog Input Voltage
0.5 LSB
VREF-
DS20005281B-page 134
Zero-Scale
Transition
1.5 LSB
Full-Scale
Transition
VREF+
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 21-2:
SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ADCON0
—
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
131
Name
ADCON1
—
ADCS2
ADCS1
ADCS0
—
—
—
—
132
ADRESH
—
—
—
—
—
—
ADRES9
ADRES8
132
ADRESL
ADRES7
ADRES6
ADRES5
ADRES4
ADRES3
ADRES2
ADRES1
ADRES0
132
ANSELA
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
114
ANSELB
—
ANSB6
ANSB5
ANSB4
—
—
ANSB1
—
119
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIR1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
98
TRISGPA
TRISA7
TRISA6
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
113
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
—
—
TRISB1
TRISB0
118
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for ADC module.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 135
MCP19114/5
NOTES:
DS20005281B-page 136
 2014-2015 Microchip Technology Inc.
MCP19114/5
22.0
TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
•
•
•
•
•
8-bit timer/counter register (TMR0)
8-bit prescaler
Programmable internal or external clock source
Programmable external clock edge selection
Interrupt on overflow
Figure 22-1 is a block diagram of the Timer0 module.
FIGURE 22-1:
TIMER0 BLOCK DIAGRAM
FOSC/4
Data Bus
0
T0CKI
1
1
0
TMR0SE TMR0CS
8-bit
Prescaler
PSA
8
Sync
2 TCY
TMR0
Set Flag bit TMR0IF
on Overflow
Overflow to Timer1
8
PS<2:0>
22.1
Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
22.1.1
8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-Bit Timer mode is
selected by clearing the T0CS bit in the OPTION_REG
register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
Note:
22.1.2
The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
8-BIT COUNTER MODE
22.1.3
SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignment is controlled by the PSA bit in the
OPTION_REG register. To assign the prescaler to
Timer0, the PSA bit must be cleared to ‘0’.
There are eight prescaler options for the Timer0
module ranging from 1:2 to 1:256. The prescale values
are selectable via the PS<2:0> bits in the
OPTION_REG register. In order to have a 1:1 prescaler
value for the Timer0 module, the prescaler must be
disabled by setting the PSA bit in the OPTION_REG
register.
The prescaler is not readable or writable. When
assigned to the Timer0 module, all instructions writing to
the TMR0 register will clear the prescaler.
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin. The
incrementing edge is determined by the T0SE bit in the
OPTION_REG register.
8-Bit Counter mode using the T0CKI pin is selected by
setting the T0CS bit in the OPTION_REG register to ‘1’.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 137
MCP19114/5
22.1.4
22.1.5
SWITCHING PRESCALER
BETWEEN TIMER0 AND WDT
MODULES
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device reset when switching prescaler
values. When changing the prescaler assignment from
Timer0 to the WDT module, the instruction sequence
shown in Example 22-1 must be executed.
EXAMPLE 22-1:
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit in the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit can only
be cleared in software. The Timer0 interrupt enable is
the T0IE bit in the INTCON register.
Note:
CHANGING PRESCALER
(TIMER0  WDT)
22.1.6
BANKSELTMR0;
CLRWDT ;Clear WDT
CLRFTMR0;Clear TMR0 and
;prescaler
BANKSELOPTION_REG;
BSF OPTION_REG,PSA;Select WDT
CLRWDT ;
;
MOVLWb’11111000’;Mask prescaler
ANDWFOPTION_REG,W;bits
IORLWb’00000101’;Set WDT prescaler
MOVWFOPTION_REG;to 1:32
The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Counter mode, the synchronization
of the T0CKI input and the Timer0 register is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks.
Therefore, the high and low periods of the external
clock source must meet the timing requirements as
shown in Section 4.0 “Electrical Characteristics”.
22.1.7
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be executed (refer to Example 22-2).
EXAMPLE 22-2:
TIMER0 INTERRUPT
OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
CHANGING PRESCALER
(WDT  TIMER0)
CLRWDT ;Clear WDT and
;prescaler
BANKSELOPTION_REG;
MOVLWb’11110000’;Mask TMR0 select and
ANDWFOPTION_REG,W;prescaler bits
IORLWb’00000011’;Set prescale to 1:16
MOVWFOPTION_REG;
TABLE 22-1:
Name
INTCON
OPTION_REG
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
GIE
PEIE
T0IE
INTE
IOCIE
T0IF
INTF
IOCIF
95
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
TMR0
TRISGPA
Timer0 Module Register
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
78
137*
TRISA2
TRISA1
TRISA0
113
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
DS20005281B-page 138
 2014-2015 Microchip Technology Inc.
MCP19114/5
23.0
TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer with the following
features:
•
•
•
•
•
16-bit timer register pair (TMR1H:TMR1L)
Readable and Writable (both registers)
Selectable internal clock source
2-bit prescaler
Interrupt on overflow
Figure 23-1 is a block diagram of the Timer1 module.
FIGURE 23-1:
TIMER1 BLOCK DIAGRAM
TMR1ON
Set flag bit
TMR1IF on
Overflow
TMR1(1)
TMR1H
TMR1L
FOSC
1
Prescaler
1, 2, 4, 8
0
2
T1CKPS<1:0>
TMR1CS
Note 1: TMR1 register increments on rising edge.
23.1
Timer1 Operation
The Timer1 module is a 16-bit incrementing timer which
is accessed through the TMR1H:TMR1L register pair.
Writes to TMR1H or TMR1L directly update the
counter. The timer is incremented on every instruction
cycle.
Timer1 is enabled by configuring the TMR1ON bit in the
T1CON register. Table 23-1 displays the Timer1 enable
selections.
23.2
Clock Source Selection
The TMR1CS bit in the T1CON register is used to select
the clock source for Timer1. Table 23-1 displays the
clock source selections.
 2014-2015 Microchip Technology Inc.
23.2.1
INTERNAL CLOCK SOURCE
The TMR1H:TMR1L register pair will increment on
multiples of FOSC or FOSC/4 as determined by the
Timer1 prescaler.
As an example, when the FOSC internal clock source is
selected, the Timer1 register value will increment by four
counts every instruction clock cycle.
TABLE 23-1:
TMR1CS
CLOCK SOURCE
SELECTIONS
Clock Source
1
8 MHz system clock (FOSC)
0
2 MHz instruction clock (FOSC/4)
DS20005281B-page 139
MCP19114/5
23.3
Timer1 Prescaler
23.5
Timer1 in Sleep
Timer1 has four prescaler options, allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits in the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
Unlike other standard mid-range Timer1 modules, the
MCP19114/5 Timer1 module only clocks from an internal
system clock, and thus cannot run during Sleep mode,
nor can it be used to wake the device from this mode.
23.4
The Timer1 Control (T1CON) register, shown in
Register 23-1, is used to control Timer1 and select the
various features of the Timer1 module.
23.6
Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit in the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
•
•
•
•
Timer1 Control Register
TMR1ON bit in the T1CON register
TMR1IE bit in the PIE1 register
PEIE bit in the INTCON register
GIE bit in the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
Note:
The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
REGISTER 23-1:
T1CON: TIMER1 CONTROL REGISTER
U-0
U-0
R/W-0
R/W-0
U-0
U-0
R/W-0/
R/W-0
—
—
T1CKPS1
T1CKPS0
—
—
TMR1CS
TMR1ON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 =1:8 Prescale value
10 =1:4 Prescale value
01 =1:2 Prescale value
00 =1:1 Prescale value
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TMR1CS: Timer1 Clock Source Control bit
1 = 8 MHz system clock (FOSC)
0 = 2 MHz instruction clock (FOSC/4)
bit 0
TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1, Clears Timer1 gate flip-flop
DS20005281B-page 140
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 23-2:
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIR1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
98
TMR1H
Holding Register for the Most Significant Byte of the 16-bit TMR1 Register
139*
TMR1L
Holding Register for the Least Significant Byte of the 16-bit TMR1 Register
139*
T1CON
—
—
T1CKPS1 T1CKPS0
—
—
TMR1CS TMR1ON
140
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
* Page provides register information.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 141
MCP19114/5
NOTES:
DS20005281B-page 142
 2014-2015 Microchip Technology Inc.
MCP19114/5
24.0
TIMER2 MODULE
The Timer2 module is an 8-bit timer with the following
features:
•
•
•
•
8-bit timer register (TMR2)
8-bit period register (PR2)
Interrupt on TMR2 match with PR2
Software programmable prescaler (1:1, 1:4, 1:16)
Timer2 Operation
The clock input to the Timer2 module is the system
clock (FOSC). The clock is fed into the Timer2 prescaler,
which has prescale options of 1:1, 1:4 or 1:16. The
output of the prescaler is then used to increment the
TMR2 register.
The values of TMR2 and PR2 are constantly compared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, TMR2 is reset to 00h on the next
increment cycle.
FIGURE 24-1:
The TMR2 and PR2 registers are both fully readable
and writable. On any Reset, the TMR2 register is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Timer2 is turned off by clearing
the TMR2ON bit to a ‘0’.
Refer to Figure 24-1 for a block diagram of Timer2.
24.1
The match output of the Timer2/PR2 comparator is
used to set the TMR2IF interrupt flag bit in the PIR1
register.
The Timer2 prescaler is controlled by the T2CKPS bits
in the T2CON register. The prescaler counter are
cleared when:
• A write to TMR2 occurs.
• A write to T2CON occurs.
• Any device reset occurs (Power-On Reset, MCLR
Reset, Watchdog Timer Reset or Brown-Out
Reset).
Note:
TMR2 is not cleared when T2CON is
written.
TIMER2 BLOCK DIAGRAM
TMR2
Output
FOSC
Prescaler
1:1, 1:4, 1:8, 1:16
2
TMR2
Comparator
T2CKPS<1:0>
Sets Flag
bit TMR2IF
Reset
EQ
PR2
 2014-2015 Microchip Technology Inc.
DS20005281B-page 143
MCP19114/5
24.2
Timer2 Control Register
REGISTER 24-1:
T2CON: TIMER2 CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
TMR2ON
T2CKPS1
T2CKPS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
Unimplemented: Read as ‘0’
bit 2
TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0
T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
10 =Prescaler is 8
11 =Prescaler is 16
TABLE 24-1:
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
Name
Bit 7
INTCON
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
PIE1
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIR1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
PR2
T2CON
Timer2 Module Period Register
—
TMR2
—
—
—
—
98
143*
TMR2ON T2CKPS1 T2CKPS0
Holding Register for the 8-bit TMR2 Time Base
144
143*
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
DS20005281B-page 144
 2014-2015 Microchip Technology Inc.
MCP19114/5
25.0
ENHANCED PWM MODULE
The PWM module implemented on the MCP19114/5 is
a scaled-down version of the Capture/Compare/PWM
(CCP) module found in standard mid-range
microcontrollers. The module only features the PWM
module, which is slightly modified from standard
mid-range microcontrollers. In the MCP19114/5, the
PWM module is used to generate the system clock or
system oscillator. This system clock can control the
MCP19114/5 switching frequency, as well as set the
maximum allowable duty cycle. The PWM module
does not continuously adjust the duty cycle to control
the output voltage. This is accomplished by the analog
control loop and associated circuitry.
25.1
25.1.1
When the MCP19114/5 is running stand-alone, the
PWM signal functions as the system clock. It is
operating at the programmed switching frequency with
a programmed maximum duty cycle (DCLOCK). The
programmed maximum duty cycle is not adjusted on a
cycle-by-cycle basis to control the MCP19114/5
system output. The required duty cycle (DPDRVON) to
control the output is adjusted by the MCP19114/5
analog control loop and associated circuitry. DCLOCK
does however set the maximum allowable DPDRVON.
EQUATION 25-1:
D BUCK  1 – D CLOCK
Standard Pulse-Width Modulation
Mode
The CCP will only function in PWM mode. The PWM
signal is used to set the operating frequency and
maximum allowable duty cycle of the MCP19114/5.
Figure 25-1 is a snippet of the MCP19114/5 block
diagram showing the PWM signal from the CCP
module.
FIGURE 25-1: MCP19114/5 SNIPPET
SHOWING SYSTEM CLOCK
FROM PWM MODULE
PWM Signal From CCP
116
OV
OVE
PWM
STAND-ALONE (NONFREQUENCY
SYNCHRONIZATION) MODE
25.1.2
SWITCHING FREQUENCY
SYNCHRONIZATION MODE
The MCP19114/5 can be programmed to be switching
frequency MASTER or SLAVE devices. The MASTER
device functions as described in Section 25.1.1
“Stand-Alone (NonFrequency Synchronization)
Mode” with the exception of the system clock also
being applied to GPA1.
A SLAVE device will receive the MASTER system
clock on GPA1. This MASTER system clock will be
OR’ed with the output of the TIMER2 module. This
OR’ed signal will latch PWMRL into PWMRH and
PWMPHL into PWMPHH.
Figure 25-1 shows a simplified block diagram of the
CCP module in PWM mode.
S
Q
The PWMPHL register allows for a phase shift to be
added to the SLAVE system clock.
R
Q
It is desired to have the MCP19114/5 SLAVE device’s
system clock start point shifted by a programmed
amount from the MASTER system clock. This SLAVE
phase shift is specified by writing to the PWMPHL
register. The SLAVE phase shift can be calculated by
using the following equation.
There are two modes of operation that concern the
system clock PWM signal. These modes are
Stand-Alone (nonfrequency synchronization) and
Frequency Synchronization.
EQUATION 25-2:
SLAVE PHASE SHIFT = PWMPHL  T OSC   T2 PRESCALE VALUE 
 2014-2015 Microchip Technology Inc.
DS20005281B-page 145
MCP19114/5
FIGURE 25-1:
SIMPLIFIED PWM BLOCK DIAGRAM
PWMPHL
PWMRL
8
8
PWMPHH
(SLAVE)
PWMRH
(SLAVE)
LATCH DATA
LATCH DATA
8
8
Comparator
Comparator
8
R
Q
S
Q
OSC
SYSTEM
CLOCK
8
RESET TIMER
TMR2
(Note 1)
WDM_ RESET
8
Comparator
8
EN_ SS
CLKPIN_IN
PR2
Note 1: TIMER 2 should be clocked by FOSC (8 MHz).
A PWM output (Figure 25-2) has a time base (period)
and a time that the output stays high (duty cycle). The
frequency of the PWM is the inverse of the period
(1/period).
FIGURE 25-2: PWM OUTPUT
Period
25.1.3
PWM PERIOD
The PWM period is specified by writing to the PR2
register. The PWM period can be calculated using the
following equation.
EQUATION 25-3:
PWM PERIOD =   PR2  + 1   T OSC   T2 PRESCALE VALUE 
Duty Cycle
TMR2 = PR2 + 1
TMR2 = PWMRH
TMR2 = PR2 + 1
DS20005281B-page 146
When TMR2 is equal to PR2, the following two events
occur on the next increment cycle:
• TMR2 is cleared
• The PWM duty cycle is latched from PWMRL into
PWMRH
 2014-2015 Microchip Technology Inc.
MCP19114/5
25.1.4
PWM DUTY CYCLE (DCLOCK)
The PWM duty cycle (DCLOCK) is specified by writing
to the PWMRL register. Up to 8-bit resolution is
available. The following equation is used to calculate
the PWM duty cycle (DCLOCK).
DUTY CYCLE
TABLE 25-1:
= PWMRL  T
OSC
25.2
  T2 PRESCALE VALUE 
SUMMARY OF REGISTERS ASSOCIATED WITH PWM MODULE
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
MODECON
MSC1
MSC0
RFB
—
—
—
—
—
—
—
T2CON
Operation During Sleep
When the device is placed in Sleep, the allocated
timer will not increment and the state of the module will
not change. If the CLKPIN pin is driving a value, it will
continue to drive that value. When the device wakes
up, it will continue from this state.
EQUATION 25-4:
PWM
The PWMRL bits can be written to at any time, but the
duty cycle value is not latched into PWMRH until after
a match between PR2 and TMR2 occurs.
PR2
PWMRL
PWMPHL
Bit 2
Bit 1
Bit 0
—
—
—
TMR2ON T2CKPS1 T2CKPS0
Register
on Page
51
144
Timer2 Module Period Register
143
PWM Register Low Byte
145*
Phase Shift Low Byte
145*
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by PWM mode.
* Page provides register information.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 147
MCP19114/5
NOTES:
DS20005281B-page 148
 2014-2015 Microchip Technology Inc.
MCP19114/5
26.0
DUAL CAPTURE/COMPARE (CCD)
MODULE
The CCD module is implemented on the MCP19114/5.
This module is a new module based on the standard
CCP module. It has two capture and compare only
register sets with no PWM function.
26.1
Capture Mode
In Capture mode, the CCxRH:CCxRL register set
captures the 16-bit value of the TMR1 register when
an event occurs on the DIMI pin. An event is defined
as one of the following:
•
•
•
•
Every falling edge
Every rising edge
Every 4th rising edge
Every 16th rising edge
FIGURE 26-1:
The type of event is configured by control bits
CCxM3:CCxM0 (CCDCON<3:0> for register set 1 or
CCDCON<7:4> for register set 2). When a capture is
made, the interrupt request flag bit, CCxIF (PIR1<2>
for register set 1 or PIR1<3> for register set 2), is set.
The interrupt flag must be cleared in software. If
another capture occurs before the value in the register
set is read, the old captured value is overwritten by the
new value.
26.1.1
CCX PIN CONFIGURATION
In Capture mode, the DIMI pin should be configured
as an input by setting the TRIS bit for that pin.
Note: If the DIMI pin is configured as an output, a
write to the port can cause a capture
condition.
CAPTURE MODE OPERATION BLOCK DIAGRAM
Prescaler
÷1, 4, 16
Set Flag bit CCxIF
(PIR1 register)
CCxRH
CCD pin
and
Edge Detect
CCxRL
Capture
Enable
TMR1H
TMR1L
CCDCON<CCxM3:0
System Clock
>
(FOSC)
26.1.2
TIMER1 MODE SELECTION
Timer1 must be running off of the instruction clock for
the CCD module to use the capture feature. If Timer1
is running off of the 8 MHz clock, the capture feature
may not function correctly.
26.1.3
SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
enable for the capture interrupt clear in order to avoid
false interrupts and should clear the flag bit, CCxIF,
following any such change in the operating mode.
 2014-2015 Microchip Technology Inc.
26.1.4
CCD PRESCALER
There are four prescaler settings, specified by bits
CCxM3:CCxM0. Whenever the CCD register set is
disabled or not set to Capture mode, the prescaler
counter is cleared. Any reset will clear the prescaler
counter.
Switching from one capture prescaler to another may
generate an interrupt. Also, the prescaler counter will
not be cleared, therefore, the first capture may be from
a nonzero prescaler. It is recommended to disable the
register set (CCxM3:0 = 00xx) prior to changing the
prescaler value.
DS20005281B-page 149
MCP19114/5
26.2
Compare Mode
The action on the pin is based on the value of the
control bits, CCxM3:CCxM0. At the same time,
interrupt flag bit, CCP1IF, is set.
In Compare mode, the 16-bit CCDRx register value is
constantly compared against the TMR1 register pair
value. When a match occurs, the CMPx pin:
•
•
•
•
Is driven high
Is driven low
Toggles
Remains unchanged
FIGURE 26-2:
COMPARE MODE OPERATION BLOCK DIAGRAM
CCDCON<CCxM3:0>
Mode Select Set CCDxIF
Interrupt Flag
(PIR1)
4
CCDRxH
Q
S
R
CCD pin
Output
Logic
CCDRxL
Comparator
Match
TRIS
Output Enable
TMR1H
TMR1L
Special Event
Trigger
Special Event Trigger will:
- NOT set interrupt flag bit TMR1IF in the PIR1 register.
- Set the GO/DONE bit to start the ADC conversion.
26.2.1
CMPX PIN CONFIGURATION
The user must configure the CMPx pin as an output by
clearing the TRIS bit for that pin.
Note: Clearing the CCxM<3:0> bits will set the
CMPx compare output latch to the default
state. This is not the GPIO pin data latch.
The default state for set on match or toggle
on match is 0 but the default state for clear
on match is 1.
26.2.2
TIMER1 MODE SELECTION
Timer1 must be running off of the instruction clock for
the CCD module to use the compare feature. If Timer1
is running off of the 8 MHz clock, the compare feature
may not function correctly.
DS20005281B-page 150
26.2.3
SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen, the
CCP1 pin is not affected. The CCP1IF bit is set,
causing a CCx interrupt (if enabled).
26.2.4
SPECIAL EVENT TRIGGER
In this mode, an internal hardware trigger is generated,
which may be used to initiate an action. The Special
Event Trigger output of CCD does not reset the TMR1
register pair and starts an A/D conversion (if the A/D
module is enabled).
Note: The Special Event Trigger from the CCD
module will not set the interrupt flag bit
TMR1IF (bit 0 in the PIR1 register).
 2014-2015 Microchip Technology Inc.
MCP19114/5
26.3
Dual Capture/Compare Register
The Dual Capture/Compare Module is a new module
based on the standard CCP. It has no PWM function.
REGISTER 26-1:
CCDCON: DUAL CAPTURE/COMPARE CONTROL MODULE
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CC2M3
CC2M2
CC2M1
CC2M0
CC1M3
CC1M2
CC1M1
CC1M0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
CC2M<3:0>: CC Register Set 2 Mode Select bits
00xx = Capture/Compare off (resets the module)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CC2IF bit is set)
1001 = Compare mode, clear output on match (CC2IF bit is set)
1010 = Compare mode, toggle output on match (CC2IF bit is set)
1011 = Reserved
11xx = Compare mode, generate software interrupt on match (CC2IF bit is set, CMP2 pin is
unaffected and configured as an I/O)
1111 = Compare mode, trigger special event (CC2IF bit is set; CC2 does not reset TMR1(1) and
starts an A/D conversion, if the A/D module is enabled. CMP2 pin is unaffected and
configured as an I/O port).
bit 3-0
CC1M<3:0>: CC Register Set 1 Mode Select bits
00xx = Capture/Compare off (resets the module)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CC1IF bit is set)
1001 = Compare mode, clear output on match (CC1IF bit is set)
1010 = Compare mode, toggle output on match (CC1IF bit is set)
1011 = Reserved
11xx = Compare mode, generate software interrupt on match (CC1IF bit is set, CMP1 pin is
unaffected and configured as an I/O)
1111 = Compare mode, trigger special event (CC1IF bit is set; CC1 resets TMR1 and starts an A/D
conversion, if the A/D module is enabled. CMP1 pin is unaffected and configured as an I/O
port).
Note 1:
When the Compare interrupt is set, a PIC will typically reset TMR1. This module does NOT reset TMR1.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 151
MCP19114/5
NOTES:
DS20005281B-page 152
 2014-2015 Microchip Technology Inc.
MCP19114/5
27.0
PWM CONTROL LOGIC
The PWM Control Logic implements standard
comparator modules to identify events such as input
undervoltage, input overvoltage and desaturation
detection. The control logic takes action in hardware to
appropriately enable/disable the output drive
(PDRV/SDRV), as well as to set corresponding
interrupt flags to be read by software. This control logic
also defines normal PWM operation. For definition of
individual bits within the control logic, refer to the
Special Function Register (SFR) sections.
FIGURE 27-1:
PWM CONTROL LOGIC
D Q
Q1 EN
UVLOOUT
UVLOINTP
OVINTP
UVLOIF
UVLOINTN
OVIF
OVINTN
VS
OV_REF
+
-
OVLOINTP
UVLO
UVLOEN
OV
D Q
Q1 EN
OVOUT
D Q OVLOOUT
Q1 EN
OVLOIF
OVLOINTN
OVLO
OVLOEN
PWM
PWMSTR_SEN
SDRVEN
OVEN
PDRVEN
DELAY
SDRV
SDRV_ON
E/AOUT +
Ip DELAY
PDRV
PWM
S
PWMSTR_PEN
CDSINTP
DESATP
BG
CDSPOL
MUX
CDSIF
CDSINTN
+
DESATN -
VDRUVBY
VDRUVLO
+
DRUVIF
CDSMUX
DEFAULT TO
DESATP
Q CDSOUT
D
Q1 EN
S
CDSOE
200 ns
SDRV_ON
ONE
SHOT
 2014-2015 Microchip Technology Inc.
Q
33 ns
PWM
ONE
SHOT
TMPTBY
S
OT
+
OTIF
R
CDSWDE
WDM_RESET
DS20005281B-page 153
MCP19114/5
NOTES:
DS20005281B-page 154
 2014-2015 Microchip Technology Inc.
MCP19114/5
28.0
28.1
The I2C interface supports the following modes and
features:
MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
•
•
•
•
•
•
•
•
•
•
•
•
•
MSSP Module Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be Serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSP module
in the MCP19114/5 only operates in Inter-Integrated
Circuit (I2C) mode.
Master mode
Slave mode
Byte NACKing (Slave mode)
Limited Multi-Master support
7-bit and 10-bit addressing
Start and Stop interrupts
Interrupt masking
Clock stretching
Bus collision detection
General call address matching
Dual Address masking
Address Hold and Data Hold modes
Selectable SDA hold times
Figure 28-1 is a block diagram of the I2C interface
module in Master mode. Figure 28-2 is a diagram of the
I2C interface module in Slave mode.
FIGURE 28-1:
MSSP BLOCK DIAGRAM (I2C MASTER MODE)
Internal
Data Bus
Read
[SSPxM 3:0]
Write
SSPBUF
Baud rate
generator
(SSPADD)
Shift
Clock
SDA
SDA in
Start bit, Stop bit,
Acknowledge
Generate (SSPCON2)
SCL in
Bus Collision
 2014-2015 Microchip Technology Inc.
Start bit detect,
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
Address Match detect
Clock arbitrate/BCOL detect
(Hold off clock source)
Receive Enable (RCEN)
SCL
LSb
Clock Cntl
SSPSR
MSb
Set/Reset: S, P, SSPSTAT, WCOL, SSPxOV
Reset SEN, PEN (SSPCON2)
Set SSPIF, BCLIF
DS20005281B-page 155
MCP19114/5
FIGURE 28-2:
MSSP BLOCK DIAGRAM
(I2C SLAVE MODE)
Internal
Data Bus
Read
Write
SSPBUF Reg
SCL
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the
complement, either in Receive mode or Transmit
mode, respectively.
Shift
Clock
SSPSR Reg
SDA
LSb
MSb
SSPMSK1 Reg
Match Detect
Addr Match
SSPADD Reg
Start and
Stop bit Detect
28.2
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a
single Read/Write bit, which determines whether the
master intends to transmit to or receive data from the
slave device.
Set, Reset
S, P bits
(SSPSTAT Reg)
A Start bit is indicated by a high-to-low transition of the
SDA line while the SCL line is held high. Address and
data bytes are sent out Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
I2C MODE OVERVIEW
VDD
The Inter-Integrated Circuit Bus (I2C) is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment, where the master
devices initiate the communication. A Slave device is
controlled through addressing.
The I
2C
I2C MASTER/
SLAVE CONNECTION
FIGURE 28-3:
bus specifies two signal connections:
• Serial Clock (SCL)
• Serial Data (SDA)
Both the SCL and SDA connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero; letting the line float is considered a
logical one.
Figure 28-3 shows a typical connection between two
devices configured as master and slave.
The I2C bus can operate with one or more master
devices and one or more slave devices.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
(master is receiving data from a slave)
• Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from a master)
DS20005281B-page 156
SCL
SCL
VDD
Master
SDA
Slave
SDA
The Acknowledge bit (ACK) is an active-low signal
which holds the SDA line low to indicate to the
transmitter that the slave device has received the
transmitted data and is ready to receive more.
The transition of a data bit is always performed while
the SCL line is held low. Transitions that occur while the
SCL line is held high are used to indicate Start and Stop
bits.
If the master intends to write to the slave, it repeatedly
sends out a byte of data, with the slave responding
after each byte with an ACK bit. In this example, the
master device is in Master Transmit mode and the
slave is in Slave Receive mode.
If the master intends to read from the slave, it
repeatedly receives a byte of data from the slave and
responds after each byte with an ACK bit. In this
example, the master device is in Master Receive mode
and the slave is Slave Transmit mode.
 2014-2015 Microchip Technology Inc.
MCP19114/5
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is
indicated by a low-to-high transition of the SDA line
while the SCL line is held high.
In some cases, the master may want to maintain
control of the bus and re-initiate another transmission.
If so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in Receive
mode.
The I2C bus specifies three message protocols:
• Single message where a master writes data to a
slave
• Single message where a master reads data from
a slave
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves
When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a
logical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCL line, is called clock stretching.
Clock stretching gives slave devices a mechanism to
control the flow of data. When this detection is used on
the SDA line, it is called arbitration. Arbitration ensures
that there is only one master device communicating at
any single time.
28.2.1
CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of Clock Stretching. An addressed slave
device may hold the SCL clock line low after receiving
or sending a bit, indicating that it is not yet ready to
continue. The master that is communicating with the
slave will attempt to raise the SCL line in order to
transfer the next bit, but will detect that the clock line
has not yet been released. Because the SCL
connection is open-drain, the slave has the ability to
hold that line low until it is ready to continue
communicating.
28.2.2
ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
idle state.
However, two master devices may try to initiate a
transmission at or about the same time. When this
occurs, the process of arbitration begins. Each
transmitter checks the level of the SDA data line and
compares it to the level that it expects to find. The first
transmitter to observe that the two levels don't match,
loses arbitration and must stop transmitting on the SDA
line.
For example, if one transmitter holds the SDA line to a
logical one (lets it float) and a second transmitter holds
it to a logical zero (pulls it low), the result is that the
SDA line will be low. The first transmitter then observes
that the level of the line is different than expected and
concludes that another transmitter is communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDA
line. If this transmitter is also a master device, it must
also stop driving the SCL line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDA line continues with its
original transmission. It can do so without any
complications, because so far the transmission
appears exactly as expected, with no other transmitter
disturbing the message.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less
common.
If two master devices are sending a message to two
different slave devices at the address stage, the master
sending the lower slave address always wins
arbitration. When two master devices send messages
to the same slave address, and addresses can
sometimes refer to multiple slaves, the arbitration
process must continue into the data stage.
Arbitration usually occurs very rarely, but it is a
necessary process for proper multi-master support.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 157
MCP19114/5
28.3
I2C MODE OPERATION
All MSSP I2C communication is byte-oriented and
shifted out MSb first. Six SFR registers and two
interrupt flags interface the module with the PIC
microcontroller and with the user’s software. Two pins,
SDA and SCL, are exercised by the module to
communicate with other external I2C devices.
28.3.1
BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a Master to a Slave or vice versa,
followed by an Acknowledge bit sent back. After the 8th
falling edge of the SCL line, the device outputting data
on the SDA changes that pin to an input and reads in
an acknowledge value on the next clock pulse.
The clock signal, SCL, is provided by the master. Data is
valid to change while the SCL signal is low, and sampled
on the rising edge of the clock. Changes on the SDA line
while the SCL line is high define special conditions on
the bus, explained in the following sections.
TABLE 28-1:
28.3.2
DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. Such word usage is defined in Table 28-1 and
may be used in the rest of this document without
explanation. The information in this table was adapted
from the Philips I2C specification.
28.3.3
SDA AND SCL PINS
Selecting any I2C mode with the SSPEN bit set forces
the SCL and SDA pins to be open-drain. These pins
should be set by the user to inputs by setting the
appropriate TRIS bits.
Note: Data is tied to output zero when an I2C
mode is enabled.
28.3.4
SDA HOLD TIME
The hold time of the SDA pin is selected by the SDAHT
bit in the SSPCON3 register. Hold time is the time SDA
is held valid after the falling edge of SCL. Setting the
SDAHT bit selects a longer 300 ns minimum hold time
and may help on buses with large capacitance.
I2C BUS TERMS
Term
Description
Transmitter
The device that shifts data out onto the bus
Receiver
The device that shifts data in from the bus
Master
The device that initiates a transfer, generates clock signals and terminates a transfer
Slave
The device addressed by the master
Multi-Master
A bus with more than one device that can initiate data transfers
Arbitration
Procedure to ensure that only one master at a time controls the bus. Winning arbitration
ensures that the message is not corrupted.
Synchronization
Procedure to synchronize the clocks of two or more devices on the bus
Idle
No master is controlling the bus and both SDA and SCL lines are high
Active
Any time one or more master devices are controlling the bus
Addressed Slave
Slave device that has received a matching address and is actively being clocked by a master
Matching Address
Address byte that is clocked into a slave that matches the value stored in SSPADDx
Write Request
Slave receives a matching address with R/W bit clear and is ready to clock in data
Read Request
Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of
the Slave. This data is the next and all following bytes until a Restart or Stop.
Clock Stretching
When a device on the bus holds SCL low to stall communication
Bus Collision
Any time the SDA line is sampled low by the module while it is outputting and expected high
state
DS20005281B-page 158
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MCP19114/5
28.3.5
START CONDITION
28.3.7
2
RESTART CONDITION
The I C specification defines a Start condition as a
transition of SDA from a high state to a low state, while
SCL line is high. A Start condition is always generated
by the master and signifies the transition of the bus
from an Idle to an Active state. Figure 28-4 shows the
wave forms for Start and Stop conditions.
A Restart is valid any time that a Stop is valid. A master
can issue a Restart if it wishes to hold the bus after
terminating the current transfer. A Restart has the same
effect on the slave that a Start would, resetting all slave
logic and preparing it to clock in an address. The master
may want to address the same or another slave.
A bus collision can occur on a Start condition if the
module samples the SDA line low before asserting it
low. This does not conform to the I2C Specification that
states no bus collision can occur on a Start.
In 10-bit Addressing Slave mode, a Restart is required
for the master to clock data out of the addressed
slave. Once a slave has been fully addressed,
matching both high and low address bytes, the master
can issue a Restart and the high address byte with the
R/W bit set. The slave logic will then hold the clock
and prepare to clock out data.
28.3.6
STOP CONDITION
A Stop condition is a transition of the SDA line from
low-to-high state while the SCL line is high.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop
condition, a high address with R/W clear or a high
address match fails.
Note: At least one SCL low time must appear
before a Stop is valid. Therefore, if the SDA
line goes low then high again while the SCL
line stays high, only the Start condition is
detected.
28.3.8
START/STOP CONDITION
INTERRUPT MASKING
The SCIE and PCIE bits in the SSPCON3 register can
enable the generation of an interrupt in Slave modes
that do not typically support this function. These bits
will have no effect on slave modes where interrupt on
Start and Stop detect are already enabled.
FIGURE 28-4:
I2C START AND STOP CONDITIONS
SDA
SCL
S
Start
Condition
FIGURE 28-5:
P
Change of
Data Allowed
Change of
Data Allowed
Stop
Condition
I2C RESTART CONDITION
Sr
Change of
Data Allowed
 2014-2015 Microchip Technology Inc.
Restart
Condition
Change of
Data Allowed
DS20005281B-page 159
MCP19114/5
28.3.9
ACKNOWLEDGE SEQUENCE
th
28.4.2
2
The 9 SCL pulse for any transferred byte in I C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDA line low. The transmitter must release control
of the line during this time to shift in the response. The
Acknowledge (ACK) is an active-low signal, pulling the
SDA line low, indicating to the transmitter that the
device has received the transmitted data and is ready
to receive more.
The result of an ACK is placed in the ACKSTAT bit in
the SSPCON2 register.
Slave software, when the AHEN and DHEN bits are
set, allows the user to set the ACK value sent back to
the transmitter. The ACKDT bit in the SSPCON2
register is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits in the SSPCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit in the SSPSTAT register
or the SSPOV bit in the SSPCON1 register are set
when a byte is received, the ACK will not be sent.
When the module is addressed, after the 8th falling
edge of SCL on the bus, the ACKTIM bit in the
SSPCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus. The ACKTIM
status bit is only active when the AHEN or DHEN bits
are enabled.
28.4
I2C SLAVE MODE OPERATION
The MSSP Slave mode operates in one of the four
modes selected in the SSPM bits in SSPCON1
register. The modes can be divided into 7-bit and
10-bit Addressing mode. 10-bit Addressing mode
operates the same as 7-bit, with some additional
overhead for handling the larger addresses.
Modes with Start and Stop bit interrupts operate the
same as the other modes, with SSPIF additionally getting
set upon detection of a Start, Restart or Stop condition.
28.4.1
SLAVE MODE ADDRESSES
The SSPADD register contains the Slave mode
address. The first byte received after a Start or Restart
condition is compared against the value stored in this
register. If the byte matches, the value is loaded into
the SSPBUF register and an interrupt is generated. If
the value does not match, the module goes idle and no
indication is given to the software that anything
happened.
The SSPMSK1 register affects the address matching
process. Refer to Section 28.4.10 “SSPMSK1
Register” for more information.
DS20005281B-page 160
SECOND SLAVE MODE ADDRESS
The SSPADD2 register contains a second 7-bit Slave
mode address. The first byte received after a Start or
Restart condition is compared against the value stored
in this register. If the byte matches, the value is loaded
into the SSPBUF register and an interrupt is
generated. If the value does not match, the module
goes idle and no indication is given to the software that
anything happened.
The SSPMSK2 register affects the address matching
process. Refer to Section 28.4.10 “SSPMSK1
Register” for more information.
28.4.2.1
I2C Slave 7-Bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
28.4.2.2
I2C Slave 10-Bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8
0’. A9 and A8 are the two MSb of the 10-bit address
and are stored in bits 2 and 1 in the SSPADD register.
After the high byte has been acknowledged, the UA bit
is set and SCL is held low until the user updates
SSPADD with the low address. The low address byte is
clocked in, and all 8 bits are compared to the low
address value in SSPADD. Even if there is no address
match, SSPIF and UA are set and SCL is held low until
SSPADD is updated to receive a high byte again. When
SSPADD is updated, the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing
communication. A transmission can be initiated by
issuing a Restart once the slave is addressed, and
clocking in the high address with the R/W bit set. The
slave hardware will then acknowledge the read
request and prepare to clock out data. This is only
valid for a slave after it has received a complete high
and low address-byte match.
28.4.3
SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit in the SSPSTAT register is cleared.
The received address is loaded into the SSPBUF
register and acknowledged.
When an overflow condition exists for a received
address, then Not Acknowledge is given. An overflow
condition is defined as either bit BF in the SSPSTAT
register is set, or bit SSPOV in the SSPCON1 register is
set. The BOEN bit in the SSPCON3 register modifies this
operation. For more information, refer to Register 28-4.
 2014-2015 Microchip Technology Inc.
MCP19114/5
An MSSP interrupt is generated for each transferred
data byte. Flag bit SSPIF must be cleared by software.
28.4.3.2
When the SEN bit in the SSPCON2 register is set, SCL
will be held low (clock stretch) following each received
byte. The clock must be released by setting the CKP
bit in the SSPCON1 register, except sometimes in
10-bit mode.
Slave device reception with AHEN and DHEN set
operates the same as without these options with extra
interrupts and clock stretching added after the 8th falling
edge of SCL. These additional interrupts allow the slave
software to decide whether it wants the ACK to receive
address or data byte, rather than the hardware.
28.4.3.1
7-Bit Addressing Reception
This section describes a standard sequence of events
for the MSSP module configured as an I2C Slave in
7-bit Addressing mode, including all decisions made
by hardware or software and their effect on reception.
Figures 28-5 and 28-6 are used as a visual reference
for this description.
This is a step-by-step process of what typically must
be done to accomplish I2C communication.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Start bit detected.
S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
Matching address with R/W bit clear is received.
The slave pulls SDA low, sending an ACK to the
master, and sets SSPIF bit.
Software clears the SSPIF bit.
Software reads received address from SSPBUF
clearing the BF flag.
If SEN = 1, Slave software sets CKP bit to
release the SCL line.
The master clocks out a data byte.
Slave drives SDA low sending an ACK to the
master, and sets SSPIF bit.
Software clears SSPIF.
Software reads the received byte from SSPBUF
clearing BF.
Steps 8–12 are repeated for all received bytes
from the Master.
Master sends Stop condition, setting P bit in the
SSPSTAT register, and the bus goes idle.
 2014-2015 Microchip Technology Inc.
7-Bit Reception with AHEN and
DHEN
This list describes the steps that need to be taken by
slave software to use these options for I2C
communication. Figure 28-7 displays a module using
both address and data holding. Figure 28-8 includes
the operation with the SEN bit in the SSPCON2
register set.
1.
S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSPIF is set and CKP cleared after the 8th
falling edge of SCL.
3. Slave clears the SSPIF.
4. Slave can look at the ACKTIM bit in the
SSPCON3 register to determine if the SSPIF
was after or before the ACK.
5. Slave reads the address value from SSPBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSPxIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSPIF.
Note: SSPIF is still set after the 9th falling edge of
SCL even if there is no clock stretching and
BF has been cleared. Only if NACK is sent
to Master is SSPIF not set.
11. SSPIF set and CKP cleared after 8th falling edge
of SCL for a received data byte.
12. Slave looks at ACKTIM bit in the SSPCON3
register to determine the source of the interrupt.
13. Slave reads the received data from SSPBUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK = 1 or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop Detect is disabled, the slave will only know
by polling the P bit in the SSPSTAT register.
DS20005281B-page 161
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
Bus Master sends
Stop condition
From Slave to Master
Receiving Address
SDA
A7 A6 A5 A4
SCL
S
1
2
3
4
Receiving Data
A3 A2 A1
5
6
7
ACK
8
9
Receiving Data
ACK = 1
D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
SSPIF
Cleared by software
BF
SSPBUF is read
SSPOV
Cleared by software
First byte
of data is
available
in SSPBUF
SSPOV set because
SSPBUF is still full.
ACK is not sent.
8
9
P
SSPIF set on 9th
falling edge of
SCL
MCP19114/5
DS20005281B-page 162
FIGURE 28-6:
 2014-2015 Microchip Technology Inc.
 2014-2015 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
FIGURE 28-7:
Bus Master sends
Stop condition
Receive Address
SDA
SCL
A7 A6 A5 A4 A3 A2 A1
S
1
2
3
4
5
6
7
R/W=0
8
9
Receive Data
ACK
Receive Data
D7 D6 D5 D4 D3 D2 D1 D0 ACK
SEN 1 2 3 4 5 6 7 8
Clock is held low until CKP is
set to ‘1’
9
ACK
D7 D6 D5 D4 D3 D2 D1 D0
SEN 1
2
3
4
5
6
7
8
SSPIF
Cleared by software
BF
SSPBUF is read
SSPOV
Cleared by software
9
P
SSPIF set on
9th falling
edge of SCL
First byte
of data is
available
in SSPBUF
SSPOV set because
SSPBUF is still full.
ACK is not sent.
CKP
CKP is written to ‘1’ in software,
releasing SCL
CKP is written to ‘1’ in software,
releasing SCL
DS20005281B-page 163
MCP19114/5
SCL is not held
low because
ACK = 1
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
Master Releases SDAx
to slave for ACK sequence
Receiving Address
SDA
A7 A6 A5 A4 A3 A2 A1
Master sends
Stop condition
Receiving Data
ACK D7 D6 D5 D4 D3 D2 D1 D0
ACK
Received Data
ACK = 1
D7 D6 D5 D4 D3 D2 D1 D0
SCL
S
1 2 3
4 5 6 7 8
9 1 2 3 4 5
6 7 8
9 1 2 3 4 5 6 7 8
9
P
SSPIF
If AHEN = 1,
SSPIF is set
BF
ACKDT
CKP
Address is read
from SSBUF
ACKTIM
 2014-2015 Microchip Technology Inc.
ACKTIM set by hardware
on 8th falling edge of SCL
P
Cleared by software
Data is read from SSPBUF
Slave software
clears ACKDT to
ACK the received byte
When AHEN = 1:
CKP is cleared by hardware
and SCL is stretched
S
SSPIF is set on
9th falling edge of
SCL, after ACK
Slave software
sets ACKDT to
not ACK
When DHEN = 1:
CKP is cleared by
hardware on 8th falling
edge of SCL
ACKTIM cleared by
hardware on 9th
rising edge of SCL
CKP set by software,
SCL is released
ACKTIM set by hardware
on 8th falling edge of SCL
No interrupt
after not ACK
from Slave
MCP19114/5
DS20005281B-page 164
FIGURE 28-8:
 2014-2015 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
FIGURE 28-9:
R/W = 0
Receiving Address
SDA
A7 A6 A5 A4 A3 A2 A1
SCL
S
1
2 3
4
5
6
7
Master sends
Stop condition
Master releases
SDA to slave for ACK sequence
Receive Data
ACK D7 D6 D5 D4 D3 D2 D1 D0
8
9
1
2
3
4 5
6
7
8
ACK
Receive Data
D7 D6 D5 D4 D3 D2 D1 D0
9
1
2
3
4
5
6 7
8
SSPIF
Received
address is loaded into
SSPBUF
ACKDT
Slave software clears
ACKDT to ACK
the received byte
CKP
When AHEN = 1:
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM
ACKTIM is set by hardware
on 8th falling edge of SCL
P
SSPBUF can be
read any time before
next byte is loaded
Slave sends
not ACK
When DHEN = 1:
on the 8th falling edge
of SCL of a received
data byte, CKP is
cleared
Set by software,
release SCL
CKP is not cleared
if not ACK
ACKTIM is cleared by hardware
on 9th rising edge of SCL
DS20005281B-page 165
MCP19114/5
S
Received data is
available
on SSPBUF
P
No interrupt after
if not ACK
from Slave
Cleared by software
BF
9
MCP19114/5
28.4.4
SLAVE TRANSMISSION
28.4.4.2
7-Bit Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit in the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register and an ACK pulse is
sent by the slave on the 9th bit.
A master device can transmit a read request to a
slave, and then it clocks data out of the slave. The list
below outlines what software for a slave will need to
do to accomplish a standard transmission.
Figure 28-10 can be used as a reference to this list.
Following the ACK, slave hardware clears the CKP bit
and the SCL pin is held low. Refer to Section 28.4.7
“Clock Stretching” for more details. By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
1.
The transmit data must be loaded into the SSPBUF
register, which also loads the SSPSR register. Then the
SCL pin should be released by setting the CKP bit in
the SSPCON1 register. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the 9th SCL input pulse. This ACK
value is copied to the ACKSTAT bit in the SSPCON2
register. If ACKSTAT is set (not ACK), the data transfer
is complete. In this case, when the not ACK is latched
by the slave, the slave goes idle and waits for another
occurrence of the Start bit. If the SDA line was low
(ACK), the next transmit data must be loaded into the
SSPBUF register. Again, the SCL pin must be released
by setting bit CKP.
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared by software, and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the 9th clock pulse.
28.4.4.1
Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDA line. If a bus collision is detected
and the SBCDE bit in the SSPCON3 register is set, the
BCLIF bit in the PIR register is set. Once a bus collision
is detected, the slave goes idle and waits to be
addressed again. The user’s software can use the
BCLIF bit to handle a slave bus collision.
DS20005281B-page 166
Master sends a Start condition on SDA and
SCL.
2. S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
3. Matching address with R/W bit set is received by
the Slave setting SSPIF bit.
4. Slave hardware generates an ACK and sets
SSPIF.
5. SSPIF bit is cleared by user.
6. Software reads the received address from
SSPBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSPBUF.
9. CKP bit is set releasing SCL, allowing the
master to clock the data out of the slave.
10. SSPIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
Note 1: If the master ACKs, the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCL (9th) rather than on the
falling edge.
13. Steps 9–13 are repeated for each transmitted
byte.
14. If the master sends a not ACK, the clock is not
held but SSPIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
 2014-2015 Microchip Technology Inc.
 2014-2015 Microchip Technology Inc.
FIGURE 28-10:
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
Master sends
Stop condition
Receiving Address R/W = 1 Automatic
Transmitting Data
Automatic
Transmitting Data ACK
ACK
A7 A6 A5 A4 A3 A2 A1
D7 D6 D5 D4 D3 D2 D1 D0 ACK
D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
S
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
SSPIF
Cleared by software
BF
Received address
is read from SSPBUF
Data to transmit is
loaded into SSPBUF
BF is automatically
cleared after 8th
falling edge of SCL
CKP
ACKSTAT
When R/W is set,
SCL is always
held low after 9th SCL
falling edge
Master’s not ACK
is copied to
ACKSTAT
R/W
D/A
R/W is copied from the
matching address byte
DS20005281B-page 167
P
MCP19114/5
Indicates an address
has been received
S
Set by software
CKP is not
held for not
ACK
MCP19114/5
28.4.4.3
7-Bit Transmission with Address
Hold Enabled
Setting the AHEN bit in the SSPCON3 register
enables additional clock stretching and interrupt
generation after the 8th falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSPIF
interrupt is set.
Figure 28-11 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1.
2.
Bus starts idle.
Master sends Start condition; the S bit in the
SSPSTAT register is set; SSPIF is set if interrupt
on Start detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCL line, the
CKP bit is cleared and SSPIF interrupt is
generated.
4. Slave software clears SSPIF.
5. Slave software reads ACKTIM bit in the
SSPCON3 register and R/W and D/A bits in the
SSPSTAT register to determine the source of
the interrupt.
6. Slave reads the address value from the
SSPBUF register, clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK, and sets ACKDT bit
in the SSPCON2 register accordingly.
8. Slave sets the CKP bit releasing SCL.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPIF.
12. Slave loads value to transmit to the master into
SSPBUF setting the BF bit.
Note:
SSPBUF cannot be loaded until after the
ACK.
13. Slave sets CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCL pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit in the SSPCON2 register.
16. Steps 10–15 are repeated for each byte
transmitted to the master from the slave.
17. If the master sends a not ACK, the slave
releases the bus, allowing the master to send a
Stop and end the communication.
Note:
Master must send a not ACK on the last
byte to ensure that the slave releases the
SCL line to receive a Stop.
DS20005281B-page 168
 2014-2015 Microchip Technology Inc.
 2014-2015 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
FIGURE 28-11:
Master sends
Stop condition
Receiving Address R/W = 1
SDA
SCL
A7 A6 A5 A4 A3 A2 A1
S
1
2 3 4
5 6 7 8
9
SSPIF
BF
Automatic
Transmitting Data
Automatic
Transmitting Data ACK
ACK
D7 D6 D5 D4 D3 D2 D1 D0 ACK
D7 D6 D5 D4 D3 D2 D1 D0
1
2 3
4 5 6 7 8 9
1 2
3 4
5 6 7 8
9
P
Cleared by software
Received address
is read from SSPBUF
Data to transmit is
loaded into SSPBUF
BF is automatically
cleared after 8th
falling edge of SCL
ACKDT
Slave clears
ACKDT to ACK
address
ACKSTAT
Master’s ACK
response is copied
to SSPSTAT
CKP
ACKTIM
DS20005281B-page 169
D/A
ACKTIM is set on 8th falling
edge of SCL
When R/W = 1:
CKP is always
cleared after ACK
Set by software,
releases SCL
ACKTIM is set on 9th rising
edge of SCL
CKP not cleared
after not ACK
MCP19114/5
R/W
When AHEN = 1:
CKP is cleared by hardware
after receiving matching
address.
MCP19114/5
28.4.5
SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSP module configured as an I2C Slave in
10-bit Addressing mode.
Figure 28-12 is used as a visual reference for this
description.
This is a step-by-step process of what must be done
by slave software to accomplish I2C communication:
1.
2.
3.
4.
5.
6.
7.
8.
Bus starts idle.
Master sends Start condition; S bit in the SSPSTAT register is set; SSPIF is set if interrupt on
Start detect is enabled.
Master sends matching high address with R/W
bit clear; UA bit in the SSPSTAT register is set.
Slave sends ACK and SSPIF is set.
Software clears the SSPIF bit.
Software reads received address from SSPBUF,
clearing the BF flag.
Slave loads low address into SSPADD,
releasing SCL.
Master sends matching low-address byte to the
Slave; UA bit is set.
28.4.6
10-BIT ADDRESSING WITH
ADDRESS OR DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and the SCL line is held low, is the
same. Figure 28-13 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 28-14 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSPADD register are not
allowed until after the ACK sequence.
9.
Slave sends ACK and SSPIF is set.
Note: If the low address does not match, SSPIF
and UA are still set so that the slave
software can set SSPADD back to the high
address. BF is not set because there is no
match. CKP is unaffected.
10. Slave clears SSPIF.
11. Slave reads the received matching address
from SSPBUF, clearing BF.
12. Slave loads high address into SSPADD.
13. Master clocks a data byte to the slave and
clocks out the slave’s ACK on the 9th SCL pulse;
SSPIF is set.
14. If SEN bit in the SSPCON2 register is set, CKP
is cleared by hardware and the clock is
stretched.
15. Slave clears SSPIF.
16. Slave reads the received byte from SSPBUF,
clearing BF.
17. If SEN is set, the slave sets CKP to release the
SCL.
18. Steps 13–17 are repeated for each received
byte.
19. Master sends Stop to end the transmission.
DS20005281B-page 170
 2014-2015 Microchip Technology Inc.
 2014-2015 Microchip Technology Inc.
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
FIGURE 28-12:
Master sends
Stop condition
Receive First Address Byte
SDA
S
SSPIF
BF
UA
ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
1 1 1 1 0 A9 A8
SCL
1
2
3
4
5
6
7
Receive Data
Receive Data
Receive Second Address Byte
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
SCL is held low
while CKP = 0
Set by hardware
on 9th falling edge
Cleared by software
Receive address is
read from SSPBUF
If address matches
SSPADD, it is loaded into
SSPBUF
When UA = 1:
SCL is held low
Data is read
from SSPBUF
Software updates SSPADD
and releases SCL
CKP
Set by software,
releasing SCL
DS20005281B-page 171
MCP19114/5
When SEN = 1:
CKP is cleared after
9th falling edge of received byte
Receive First Address Byte
SDA
SCL
S
1
1
1
1
0 A9 A8
1
2
3
4
5
6
7
R/W = 0 Receive Second Address Byte
ACK
A7 A6 A5 A4 A3 A2 A1 A0
8
9 UA 1
2
3
4
5
6
7
8
Receive Data
Receive Data
ACK
D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5
9 UA 1
2
3
4
5
6
7
8
9
1
2
SSPIF
Set by hardware
on 9th falling edge
Cleared by software
Cleared by software
BF
ACKDT
Slave software clears
ACKDT to ACK
the received byte
SSPBUF can be
read anytime
before the next
received cycle
Received data
is read from
SSPBUF
UA
Update to SSPADD is
not allowed until 9th
falling edge of SCL
 2014-2015 Microchip Technology Inc.
If when AHEN = 1:
on the 8th falling edge of SCL
of an address byte, CKP is
ACKTIM cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
CKP
Update of SSPADD,
clears UA and releases
SCL
Set CKP with software
releases SCL
MCP19114/5
DS20005281B-page 172
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
FIGURE 28-13:
 2014-2015 Microchip Technology Inc.
FIGURE 28-14:
I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
Master sends
Master sends
Stop condition
not ACK
Master sends
Restart event
Receiving Address R/W = 0 Receiving Second Address Byte
1 1 1 1 0 A9 A8 ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK
SDA
SCL
S
1 2 3 4 5 6 7 8 9
1 2 3 4 5 6 7 8 9
Receive First Address Byte
1 1 1 1 0 A9 A8 ACK
1 2 3 4 5 6 7 8 9
Transmitting Data Byte ACK = 1
D7 D6 D5 D4D3 D2 D1 D0
1 2 3 4 5 6 7 8 9
Sr
P
SSPIF
Set by hardware
BF
UA
CKP
Cleared by
software
Received address is
read from SSPBUF
SSPBUF loaded
with received address
UA indicates SSPADD
must be updated
ACKSTAT
Set by hardware
After SSPADD is updated.
UA is cleared and SCL is
released
Data to transmit is
loaded into SSPBUF
High address is loaded
back into SSPADD
When R/W = 1:
CKP is cleared on 9th falling edge of SCLx
Set by software
releases SCL
Master’s not ACK is copied
R/W
R/W is copied from the
matching address byte
Indicates an address
has been received
DS20005281B-page 173
MCP19114/5
D/A
MCP19114/5
28.4.7
CLOCK STRETCHING
28.4.7.2
Clock stretching occurs when a device on the bus holds
the SCL line low, effectively pausing communication.
The slave may stretch the clock to allow more time to
handle data or prepare a response for the master
device. A master device is not concerned with
stretching, as it is stretching anytime it is active on the
bus and not transferring data. Any stretching done by a
slave is invisible to the master software and handled by
the hardware that generates SCL.
The CKP bit in the SSPCON1 register is used to
control stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCL line to go low
and then hold it. Setting CKP will release SCL and
allow more communication.
28.4.7.1
Normal Clock Stretching
Following an ACK, if the R/W bit in the SSPSTAT
register is set, causing a read request, the slave
hardware will clear CKP. This allows the slave time to
update SSPBUF with data to transfer to the master. If
the SEN bit in the SSPCON2 register is set, the slave
hardware will always stretch the clock after the ACK
sequence. Once the slave is ready, CKP is set by
software and communication resumes.
Note 1: The BF bit has no effect on whether the
clock will be stretched or not. This is
different than previous versions of the
module that would not stretch the clock or
clear CKP if SSPBUF was read before
the 9th falling edge of SCL.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPBUF was loaded before the 9th falling
edge of SCL. It is now always cleared for
read requests.
FIGURE 28-15:
10-Bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set, the
clock is always stretched. This is the only time the SCL
is stretched without CKP being cleared. SCL is
released immediately after a write to SSPADD.
Note:
28.4.7.3
Previous versions of the module did not
stretch the clock if the second address
byte did not match.
Byte NACKing
When AHEN bit in the SSPCON3 register is set, CKP
is cleared by hardware after the 8th falling edge of SCL
for a received matching address byte. When DHEN bit
in the SSPCON3 register is set, CKP is cleared after
the 8th falling edge of SCL for received data.
Stretching after the 8th falling edge of SCL allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
28.4.8
CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCL line to go low and then hold it. However,
clearing the CKP bit will not assert the SCL output low
until the SCL output is already sampled low.
Therefore, the CKP bit will not assert the SCL line until
an external I2C master device has already asserted
the SCL line. The SCL output will remain low until the
CKP bit is set and all other devices on the I2C bus
have released SCL. This ensures that a write to the
CKP bit will not violate the minimum high time
requirement for SCL (refer to Figure 28-16).
CLOCK SYNCHRONIZATION TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SDA
DX
DX ‚ – 1
SCL
CKP
Master device
asserts clock
Master device
releases clock
WR
SSPCON1
DS20005281B-page 174
 2014-2015 Microchip Technology Inc.
MCP19114/5
28.4.9
GENERAL CALL ADDRESS
SUPPORT
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed
by the master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
If the AHEN bit in the SSPCON3 register is set, just as
with any other address reception, the slave hardware
will stretch the clock after the 8th falling edge of SCL.
The slave must then set its ACKDT value and release
the clock with communication progressing as it would
normally.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit in the SSPCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPADD.
After the slave clocks in an address of all zeros with
the R/W bit clear, an interrupt is generated and slave
software can read SSPBUF and respond.
Figure 28-17 shows a general call reception
sequence.
FIGURE 28-16:
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
Address is compared to General Call Address
after ACK, set interrupt
Receiving Data
ACK
R/W = 0
ACK D7 D6 D5 D4 D3 D2 D1 D0
General Call Address
SDA
SCL
S
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SSPIF
BF (SSPSTAT<0>)
GCEN (SSPCON2<7>)
Cleared by software
SSPBUF is read
‘1’
28.4.10
SSPMSK1 REGISTER
An SSP Mask (SSPMSK1) register is available in I2C
Slave mode as a mask for the value held in the
SSPSR register during an address comparison
operation. A zero (‘0’) bit in the SSPMSK1 register has
the effect of making the corresponding bit of the
received address a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
The SSPMSK1 register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 175
MCP19114/5
28.5
I2C MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPM bits in the SSPCON1 register and
by setting the SSPEN bit. In Master mode, the SDA and
SCK pins must be configured as inputs. The MSSP
peripheral hardware will override the output driver TRIS
controls when necessary, to drive the pins low.
The Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset or when the MSSP module is disabled.
Control of the I 2C bus may be taken when the P bit is
set or the bus is idle.
In Firmware-Controlled Master mode, user code
conducts all I 2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user’s software
directly manipulating the SDA and SCL lines.
The following events will cause the SSP Interrupt Flag
bit (SSPIF) to be set (SSP interrupt, if enabled):
•
•
•
•
•
Start condition detected
Stop condition detected
Data transfer byte transmitted/received
Acknowledge transmitted/received
Repeated Start generated
Note 1: The MSSP module, when configured in
I2C Master mode, does not allow queuing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start
condition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a
write to the SSPBUF did not occur.
2: When in Master mode, Start/Stop
detection is masked and an interrupt is
generated when the SEN/PEN bit is
cleared and the generation is complete.
DS20005281B-page 176
28.5.1
I2C MASTER MODE OPERATION
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmit mode, serial data is output through
SDA while SCL outputs the serial clock. The first byte
transmitted contains the slave address of the receiving
device (7 bits) and the Read/Write (R/W) bit. In this
case, the R/W bit will be logic ‘0’. Serial data is
transmitted 8 bits at a time. After each byte is
transmitted, an Acknowledge bit is received. Start and
Stop conditions are output to indicate the beginning
and the end of a serial transfer.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received 8 bits at a time. After
each byte is received, an Acknowledge bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
A Baud Rate Generator is used to set the clock
frequency output on SCL. Refer to Section 28.6
“Baud Rate Generator” for more details.
28.5.2
CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate
Generator (BRG) is suspended from counting until the
SCL pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD<7:0> and begins
counting. This ensures that the SCL high time will
always be at least one BRG rollover count in the event
that the clock is held low by an external device
(Figure 28-17).
 2014-2015 Microchip Technology Inc.
MCP19114/5
FIGURE 28-17:
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDA
DX
DX ‚ – 1
SCL deasserted but slave holds
SCL low (clock arbitration)
SCL allowed to transition high
SCL
BGR decrements on
Q2 and Q4 cycles
BRG
Value
03h
02h
01h
00h (hold off)
03h
02h
SCL is sampled high, reload takes
place and BRG starts its count
BRG
Reload
28.5.3
WCOL STATUS FLAG
If the user writes the SSPBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set, it indicates that an action on SSPBUF
was attempted while the module was not idle.
Note:
28.5.4
Because queuing of events is not allowed,
writing to the lower 5 bits in the SSPCON2
register is disabled until the Start condition
is complete.
I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN, in the SSPCON2 register. If the SDA
and SCL pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPADD<7:0> and starts its count. If SCL and SDA
are both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
FIGURE 28-18:
of the SDA being driven low while SCL is high is the
Start condition and causes the S bit in the SSPSTAT1
register to be set. Following this, the Baud Rate
Generator is reloaded with the contents of
SSPADD<7:0> and resumes its count. When the Baud
Rate Generator times out (TBRG), the SEN bit in the
SSPCON2 register will be automatically cleared by
hardware; the Baud Rate Generator is suspended,
leaving the SDA line held low and the Start condition is
complete.
Note 1: If, at the beginning of the Start condition,
the SDA and SCL pins are already
sampled low, or if, during the Start
condition, the SCL line is sampled low
before the SDA line is driven low, a bus
collision occurs, the Bus Collision
Interrupt Flag, BCLIF, is set, the Start
condition is aborted and the I2C module is
reset into its idle state.
2: The Philips I2C Specification states that a
bus collision cannot occur on a Start.
FIRST START BIT TIMING
Write to SEN bit occurs here Set S bit (SSPSTAT<3>)
At completion of Start bit,
SDA = 1,
hardware clears SEN bit
SCL = 1
and sets SSPIF bit
TBRG
TBRG
SDA
Write to SSPBUF occurs here
1st bit
2nd bit
TBRG
SCL
S
 2014-2015 Microchip Technology Inc.
TBRG
DS20005281B-page 177
MCP19114/5
28.5.5
I2C MASTER MODE REPEATED
START CONDITION TIMING
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
A Repeated Start condition occurs when the RSEN bit
in the SSPCON2 register is programmed high and the
Master state machine is no longer active. When the
RSEN bit is set, the SCL pin is asserted low. When the
SCL pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDA pin is released
(brought high) for one Baud Rate Generator count
(TBRG). When the Baud Rate Generator times out, if
SDA is sampled high, the SCL pin will be deasserted
(brought high). When SCL is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDA
and SCL must be sampled high for one TBRG. This
action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG while SCL is high. SCL is
asserted low. Following this, the RSEN bit in the
SSPCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDA pin held low. As soon as a Start condition is
detected on the SDA and SCL pins, the S bit in the
SSPSTAT register will be set. The SSPIF bit will not be
set until the Baud Rate Generator has timed out.
FIGURE 28-19:
2: A bus collision during the Repeated Start
condition occurs if:
•SDA is sampled low when SCL goes
from low to high.
•SCL goes low before SDA is
asserted low. This may indicate
that another master is attempting to
transmit a data ‘1’.
REPEAT START CONDITION WAVEFORM
Write to SSPCON2
occurs here
SDA = 1,
SCL (no change)
S bit set by hardware
At completion of Start bit,
hardware clears RSEN bit
and sets SSPIF
SDA = 1,
SCL = 1
TBRG TBRG TBRG
1st bit
SDA
Write to SSPBUF occurs here
TBRG
SCL
Sr
Repeated Start
DS20005281B-page 178
TBRG
 2014-2015 Microchip Technology Inc.
MCP19114/5
28.5.6
I2C MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPBUF register. This action will
set the Buffer Full (BF) flag bit and allow the Baud Rate
Generator to begin counting and start the next
transmission. Each bit of address/data will be shifted
out onto the SDA pin after the falling edge of SCL is
asserted. SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high. When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin must
remain stable for that duration and some hold time after
the next falling edge of SCL. After the 8th bit is shifted
out (the falling edge of the 8th clock), the BF flag is
cleared and the master releases the SDA. This allows
the slave device being addressed to respond with an
ACK bit during the 9th bit time if an address match
occurred or if data was received properly. The status of
ACK is written into the ACKSTAT bit on the rising edge
of the 9th clock. If the master receives an Acknowledge,
the Acknowledge Status bit (ACKSTAT) is cleared. If
not, the bit is set. After the 9th clock, the SSPIF bit is set
and the master clock (Baud Rate Generator) is
suspended until the next data byte is loaded into the
SSPBUF, leaving SCL low and SDA unchanged
(Figure 28-20).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the 8th clock, the master will release
the SDA pin, allowing the slave to respond with an
Acknowledge. On the falling edge of the 9th clock, the
master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT status bit in the SSPCON2
register. Following the falling edge of the 9th clock
transmission of the address, the SSPIF is set, the BF
flag is cleared and the Baud Rate Generator is turned
off until another write to the SSPBUF takes place,
holding SCL low and allowing SDA to float.
28.5.6.1
28.5.6.2
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
28.5.6.3
 2014-2015 Microchip Technology Inc.
ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit in the SSPCON2
register is cleared when the slave has sent an
Acknowledge (ACK = 0) and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call) or when the slave has
properly received its data.
28.5.6.4
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
BF Status Flag
In Transmit mode, the BF bit in the SSPSTAT register
is set when the CPU writes to SSPBUF and is cleared
when all 8 bits are shifted out.
WCOL Status Flag
12.
13.
Typical Transmit Sequence:
The user generates a Start condition by setting
the SEN bit in the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
The MSSP module will wait the required start
time before any other operation takes place.
The user loads the SSPBUF with the slave
address to transmit.
Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the 9th clock cycle by setting the SSPIF
bit.
The user loads the SSPBUF with 8 bits of data.
Data is shifted out the SDA pin until all 8 bits are
transmitted.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
Steps 8-11 are repeated for all transmitted data
bytes.
The user generates a Stop or Restart condition
by setting the PEN or RSEN bits in the
SSPCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
DS20005281B-page 179
ACKSTAT in
SSPCON2 = 1
Write SSPCON2<0> SEN = 1
From slave, clear ACKSTAT bit
SSPCON2<6>
Transmitting Data or Second Half
of 10-bit Address
Start condition begins
SEN = 0
Transmit Address to Slave
SDA
A7
A6
A5
A4
A3
R/W = 0
A2
ACK = 0
A1
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
SSPBUF written with 7-bit address and R/W
start transmit
SCL
S
1
2
3
4
5
6
7
8
9
SCL held low
while CPU
responds to SSPIF
9
P
SSPIF
Cleared by software
Cleared by software service routine
from SSP interrupt
BF (SSPSTAT<0>)
SSPBUF written
SEN
After Start condition, SEN cleared by hardware
 2014-2015 Microchip Technology Inc.
PEN
R/W
SSPBUF is written by software
Cleared by software
MCP19114/5
DS20005281B-page 180
I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
FIGURE 28-20:
MCP19114/5
28.5.7
I2C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable (RCEN) bit in the SSPCON2 register.
28.5.7.4
1.
2.
Note:
The MSSP module must be in an idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
The Baud Rate Generator begins counting and, upon
each rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSPSR. After the falling edge of the 8th clock, the
receive enable flag is automatically cleared, the
contents of the SSPSR are loaded into the SSPBUF,
the BF flag bit is set, the SSPIF flag bit is set and the
Baud Rate Generator is suspended from counting,
holding SCL low. The MSSP is now in idle state
awaiting the next command. When the buffer is read by
the CPU, the BF flag bit is automatically cleared. The
user can then send an Acknowledge bit at the end of
reception by setting the Acknowledge Sequence
Enable (ACKEN) bit in the SSPCON2 register.
28.5.7.1
BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
28.5.7.2
SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
28.5.7.3
WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write does not occur).
 2014-2015 Microchip Technology Inc.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Typical Receive Sequence:
The user generates a Start condition by setting
the SEN bit in the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
User writes SSPBUF with the slave address to
transmit and the R/W bit set.
Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the 9th clock cycle by setting the SSPIF
bit.
User sets the RCEN bit in the SSPCON2 register
and the Master clocks in a byte from the slave.
After the 8th falling edge of SCL, SSPIF and BF
are set.
Master clears SSPIF and reads the received
byte from SSPUF, then clears BF.
Master sets ACK value sent to slave in ACKDT
bit in the SSPCON2 register and initiates the
ACK by setting the ACKEN bit.
Masters ACK is clocked out to the Slave and
SSPIF is set.
The user clears SSPIF.
Steps 8-13 are repeated for each received byte
from the slave.
Master sends a not ACK or Stop to end
communication.
DS20005281B-page 181
I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
Write to SSPCON2<4> to start Acknowledge
sequence SDA = ACKDT (SSPCON2<5>) = 0
Write to SSPCON2<0>
(SEN = 1),
ACK from Master
begin Start condition
Master configured as a receiver
SDA = ACKDT = 0
SEN = 0
by programming SSPCON2<3> (RCEN = 1)
Write to SSPBUF
RCEN = 1, start
RCEN cleared
ACK from Slave
occurs here, start XMIT
next receive
automatically
A7
A6 A5 A4 A3 A2
A1 R/W ACK
D7 D6 D5 D4 D3 D2 D1
RCEN cleared
automatically
PEN bit = 1 written here
Receiving Data from Slave
Receiving Data from Slave
SDA
Set ACKEN, start Acknowledge sequence
SDA = ACKDT = 1
ACK
D0
D7 D6 D5 D4 D3 D2 D1
D0
ACK
ACK is not sent
SCL
S
1
2
3
4
5
6
7
8
9
1
2 3
4
5
6
7
9
8
SSPIF
Cleared by software
Cleared by software
Cleared by software
BF
(SSPSTAT<0>)
2
3
4
5 6
7
8
9
Data shifted in on falling edge of CLK Set SSPIF
Set SSPIF interrupt
at end of receive
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of receive
SDA = 0, SCLx = 1
while CPU
responds to SSPxIR
1
Cleared by software
Cleared in
software
P
Bus master
terminates
transfer
Set SSPIF interrupt
at end of
Acknowledge
sequence
Set P bit
(SSPSTAT<4>)
and SSPIF
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
SSPOV
SSPOV is set because
SSPBUF is still full
 2014-2015 Microchip Technology Inc.
ACKEN
RCEN
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
RCEN cleared
automatically
ACK from Master
SDA = ACKDT = 0
RCEN cleared
automatically
MCP19114/5
DS20005281B-page 182
FIGURE 28-21:
MCP19114/5
28.5.8
ACKNOWLEDGE SEQUENCE
TIMING
28.5.9
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN, in the SSPCON2 register. At the end of a
receive/transmit, the SCL line is held low after the
falling edge of the 9th clock. When the PEN bit is set,
the master will assert the SDA line low. When the SDA
line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCL pin will be brought high
and then, one TBRG (Baud Rate Generator rollover
count) later, the SDA pin will be deasserted. When the
SDA pin is sampled high while SCL is high, the P bit in
the SSPSTAT register, is set. A TBRG later, the PEN bit
is cleared and the SSPIF bit is set (Figure 28-23).
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable (ACKEN) bit in the
SSPCON2 register. When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to
generate an Acknowledge, then the ACKDT bit should
be cleared. If not, the user should set the ACKDT bit
before starting an Acknowledge sequence. The Baud
Rate Generator then counts for one rollover period
(TBRG) and the SCL pin is deasserted (pulled high).
When the SCL pin is sampled high (clock arbitration),
the Baud Rate Generator counts for TBRG. The SCL pin
is then pulled low. Following this, the ACKEN bit is
automatically cleared, the Baud Rate Generator is
turned off and the MSSP module then goes into Idle
mode (Figure 28-22).
28.5.8.1
STOP CONDITION TIMING
28.5.9.1
WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, the WCOL bit is set and the contents of
the buffer are unchanged (the write does not occur).
WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, WCOL is set and the contents
of the buffer are unchanged (the write does not occur).
FIGURE 28-22:
ACKNOWLEDGE SEQUENCE WAVEFORM
Acknowledge sequence starts here,
write to SSPCON2
ACKEN = 1, ACKDT = 0
SDA
ACKEN automatically cleared
SCL
TBRG
TBRG
D0
ACK
8
9
SSPIF
SSPIF set at the end
of receive
Note:
TBRG = one Baud Rate Generator period.
FIGURE 28-23:
Cleared in
software
STOP CONDITION RECEIVE OR TRANSMIT MODE
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
after SDA sampled high. P bit (SSPSTAT<4>) is set.
PEN bit (SSPCON2<2>) is cleared by
hardware and the SSPIF bit is set
Write to SSPCON2,
set PEN
Falling edge of 9th clock
TBRG
SCL
SDA
ACK
TBRG
Note:
Cleared in
software
SSPIF set at the end
of Acknowledge sequence
P
TBRG
TBRG
SCL brought high after TBRG
TBRG = one Baud Rate Generator period.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 183
MCP19114/5
28.5.10
SLEEP OPERATION
28.5.13
2
While in Sleep mode, the I C slave module can receive
addresses or data and, when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
28.5.11
EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
28.5.12
MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSPx module is disabled. Control of the I 2C bus may
be taken when the P bit in the SSPSTAT register is set
or the bus is idle, with both the S and P bits clear. When
the bus is busy, enabling the SSP interrupt will
generate the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
•
•
•
•
•
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA by letting SDA float high,
and another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA pin is
‘0’, a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag (BCLIF) and reset the
I2C port to its Idle state (Figure 28-24).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDA and SCL
lines are deasserted and the respective control bits in
the SSPCON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the SSPSTAT
register, or the bus is idle and the S and P bits are
cleared.
FIGURE 28-24:
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
Data changes
while SCL = 0
SDA line pulled low Sample SDA. While SCL is high,
by another source data does not match what is driven
by the master.
Bus collision has occurred.
SDA released
by master
SDA
SCL
Set Bus Collision
Interrupt (BCLIF)
BCLIF
DS20005281B-page 184
 2014-2015 Microchip Technology Inc.
MCP19114/5
28.5.13.1
Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a)
b)
SDA or SCL are sampled low at the beginning of
the Start condition (Figure 28-25)
SCL is sampled low before SDA is asserted low
(Figure 28-26)
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 28-27). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to zero; if the SCL pin is sampled as ‘0’
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
Note:
If the SDA pin is already low or the SCL pin is already
low, all of the following occur:
• the Start condition is aborted
• the BCLIF flag is set and
• the MSSP module is reset to its Idle state
(Figure 28-25)
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded and counts down. If the
SCL pin is sampled low while SDA is high, a bus
collision occurs because it is assumed that another
master is attempting to drive a data ‘1’ during the Start
condition.
FIGURE 28-25:
The reason why bus collision is not a
factor during a Start condition is that no
two bus masters can assert a Start
condition at the exact same time.
Therefore, one master will always assert
SDA before the other. This condition does
not cause a bus collision because the two
masters must be allowed to arbitrate the
first address following the Start condition.
If the address is the same, arbitration
must be allowed to continue into the data
portion, Repeated Start or Stop
conditions.
BUS COLLISION DURING A START CONDITION (SDA ONLY)
SDA goes low before the SEN bit is set.
Set BCLIF,
S bit and SSPIF set because
SDA = 0, SCL = 1.
SDA
SCL
Set SEN, enable Start condition
if SDA = 1, SCL = 1
SEN
BCLIF
SEN cleared automatically because of bus
collision.
SSP module reset into Idle state.
SDA sampled low before Start condition.
Set BCLIF. S bit and SSPIF set because
SDA = 0, SCL = 1.
SSPIF and BCLIF
are cleared by software
S
SSPIF
SSPIF and BCLIF
are cleared by software
 2014-2015 Microchip Technology Inc.
DS20005281B-page 185
MCP19114/5
FIGURE 28-26:
BUS COLLISION DURING A START CONDITION (SCL = 0)
SDA = 0, SCL = 1
TBRG
TBRG
SDA
SCL
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
SCL = 0 before SDA = 0,
bus collision occurs. Set BCLIF.
SEN
SCL = 0 before BRG time out,
bus collision occurs. Set BCLIF.
BCLIF
S
‘0’
SSPIF
‘0’
FIGURE 28-27:
Interrupt cleared
by software
‘0’
‘0’
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA = 0, SCL = 1
Set S
Less than Tbrg
T
Set SSPIF
BRG
SDA
SDA pulled low by other master.
Reset BRG and assert SDAx.
SCL
s
SCLx pulled low after BRG
time out
SEN
BCLIF
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
‘0’
S
SSPIF
DS20005281B-page 186
SDAx = 0, SCL = 1,
set SSPIF
Interrupts cleared
by software
 2014-2015 Microchip Technology Inc.
MCP19114/5
28.5.13.2
Bus Collision During a Repeated
Start Condition
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 28-28).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high to low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
A low level is sampled on SDA when SCL goes
from low level to high level
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’
If SCL goes from high to low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(refer to Figure 28-29).
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and,
when sampled high, the SDA pin is sampled.
FIGURE 28-28:
If, at the end of the BRG time out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
SDA
SCL
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
RSEN
BCLIF
Cleared by software
‘0’
S
‘0’
SSPIF
FIGURE 28-29:
BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)
TBRG
TBRG
SDA
SCL
BCLIF
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
RSEN
Interrupt cleared
by software
S
‘0’
SSPIF
‘0’
 2014-2015 Microchip Technology Inc.
DS20005281B-page 187
MCP19114/5
28.5.13.3
Bus Collision During a Stop
Condition
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 28-30). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 28-31).
Bus collision occurs during a Stop condition if:
a)
b)
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
FIGURE 28-30:
BUS COLLISION DURING A STOP CONDITION (CASE 1)
TBRG
TBRG
SDA sampled
low after TBRG,
set BCLIF
TBRG
SDA
SCL
SDA asserted low
PEN
BCLIF
P
‘0’
SSPIF
‘0’
FIGURE 28-31:
BUS COLLISION DURING A STOP CONDITION (CASE 2)
TBRG
SDA
Assert SDA
TBRG
TBRG
SCL goes low before SDA goes high,
set BCLIF
SCL
PEN
BCLIF
P
‘0’
SSPIF
‘0’
DS20005281B-page 188
 2014-2015 Microchip Technology Inc.
MCP19114/5
TABLE 28-2:
SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Values
on
Page:
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
95
—
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
96
PIE1
—
ADIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
98
TRISGPA
PIR1
TRISA7
TRISA6
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
113
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
—
—
TRISB1
TRISB0
118
SSPADD
ADD7
ADD6
ADD5
ADD4
ADD3
ADD2
ADD1
ADD0
196
WCOL
SSPOV
SSPEN
CKP
SSPCON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
SSPCON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
SSPMSK1
MSK7
MSK6
MSK5
MSK4
MSK3
MSK2
SSPSTAT
SMP
CKE
D/A
P
S
R/W
SSPMSK2
MSK27
MSK26
MSK25
MSK24
MSK23
SSPADD2
ADD27
ADD26
ADD25
ADD24
ADD23
SSPBUF
SSPCON1
Synchronous Serial Port Receive Buffer/Transmit Register
SSPM3
SSPM2
155*
SSPM1
SSPM0
192
RSEN
SEN
194
AHEN
DHEN
195
MSK1
MSK0
196
UA
BF
191
MSK22
MSK21
MSK20
197
ADD22
ADD21
ADD20
197
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I
* Page provides register information.
 2014-2015 Microchip Technology Inc.
2C
mode.
DS20005281B-page 189
MCP19114/5
28.6
Baud Rate Generator
The MSSP module has a Baud Rate Generator
available for clock generation in the I2C Master mode.
The Baud Rate Generator (BRG) reload value is placed
in the SSPADD register. When a write occurs to
SSPBUF, the Baud Rate Generator will automatically
begin counting down.
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
An internal signal “Reload” in Figure 28-32 triggers the
value from SSPADD to be loaded into the BRG counter.
This occurs twice for each oscillation of the module
clock line. The logic dictating when the reload signal is
asserted depends on the mode the MSSP is being
operated in.
Table 28-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
EQUATION 28-1:
FOSC
F CLOCK = --------------------------------------------- SSPADD + 1   4 
FIGURE 28-32:
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPM<3:0>
SSPM<3:0>
SCL
Reload
Control
SSPCLK
Note:
Reload
BRG Down Counter
FOSC/2
Values of 0x00, 0x01 and 0x02 are not
valid for SSPADD when used as a Baud
Rate Generator for I2C. This is an
implementation limitation.
TABLE 28-3:
Note 1:
SSPADD<7:0>
MSSP CLOCK RATE W/BRG
FOSC
FCY
BRG Value
FCLOCK
(2 Rollovers of BRG)
8 MHz
2 MHz
04h
400 kHz(1)
8 MHz
2 MHz
0Bh
166 kHz
8 MHz
2 MHz
13h
100 kHz
The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
DS20005281B-page 190
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 28-1:
SSPSTAT: SSP STATUS REGISTER
R/W-0
R/W-0
R-0
R-0
R-0
R-0
R-0
R-0
SMP
CKE
D/A
P
S
R/W
UA
BF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
SMP: Data Input Sample bit
1 = Slew rate control disabled for standard-speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high-speed mode (400 kHz)
bit 6
CKE: Clock Edge Select bit
1 = Enable input logic so that thresholds are compliant with SM bus specification
0 = Disable SM bus specific inputs
bit 5
D/A: Data/Address bit
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4
P: Stop bit
(This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3
S: Start bit
(This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2
R/W: Read/Write bit information
This bit holds the R/W bit information following the last address match. This bit is only valid from the
address match to the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.
bit 1
UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0
BF: Buffer Full status bit
Receive:
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit:
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
 2014-2015 Microchip Technology Inc.
DS20005281B-page 191
MCP19114/5
REGISTER 28-2:
SSPCON1: SSP CONTROL REGISTER 1
R/C/HS-0
R/C/HS-0
R/W-0
R/W-0
WCOL
SSPOV
SSPEN
CKP
R/W-0
R/W-0
R/W-0
R/W-0
SSPM<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
HS = Bit is set by hardware
C = User cleared
bit 7
WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a
transmission to be started
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in
software)
0 = No collision
bit 6
SSPOV: Receive Overflow Indicator bit(1)
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t
care” in Transmit mode (must be cleared in software).
0 = No overflow
bit 5
SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port
pins(2)
0 = Disables serial port and configures these pins as I/O port pins
bit 4
CKP: Clock Polarity Select bit
In I2 C Slave mode:
SCL release control
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2 C Master mode:
Unused in this mode
Note 1:
2:
3:
In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by
writing to the SSPBUF register.
When enabled, the SDA and SCL pins must be configured as inputs.
SSPADD values of 0, 1 or 2 are not supported for I2C mode.
DS20005281B-page 192
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 28-2:
bit 3-0
SSPCON1: SSP CONTROL REGISTER 1 (CONTINUED)
SSPM<3:0>: Synchronous Serial Port Mode Select bits
0000 = Reserved
0001 = Reserved
0010 = Reserved
0011 = Reserved
0100 = Reserved
0101 = Reserved
0110 = I2C Slave mode, 7-bit address
0111 = I2C Slave mode, 10-bit address
1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD+1))(3)
1001 = Reserved
1010 = Reserved
1011 = I2C Firmware-Controlled Master mode (Slave idle)
1100 = Reserved
1101 = Reserved
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
Note 1:
2:
3:
In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by
writing to the SSPBUF register.
When enabled, the SDA and SCL pins must be configured as inputs.
SSPADD values of 0, 1 or 2 are not supported for I2C mode.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 193
MCP19114/5
REGISTER 28-3:
SSPCON2: SSP CONTROL REGISTER 2
R/W-0/0
R-0/0
R/W-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/W/HS-0/0
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
H = Bit is set by hardware
S = User set
bit 7
GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR register
0 = General call address disabled
bit 6
ACKSTAT: Acknowledge Status bit (in I2C mode only)
1 = Acknowledge was not received
0 = Acknowledge was received
bit 5
ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically
cleared by hardware.
0 = Acknowledge sequence idle
bit 3
RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2
PEN: Stop Condition Enable bit (in I2C Master mode only)
SCK Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition idle
bit 1
RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition idle
bit 0
SEN: Start Condition Enabled bit (in I2C Master mode only)
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition idle
In Slave mode:
1 = Clock stretching is enabled for both Slave Transmit and Slave Receive (stretch enabled)
0 = Clock stretching is disabled
Note 1:
For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
DS20005281B-page 194
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 28-4:
SSPCON3: SSP CONTROL REGISTER 3
R-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
ACKTIM: Acknowledge Time status bit (I2C mode only)(2)
1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9th rising edge of SCL clock
bit 6
PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled(1)
bit 5
SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled(1)
bit 4
BOEN: Buffer Overwrite Enable bit
In I2C Master mode:
This bit is ignored.
In I2C Slave mode:
1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of
the SSPOV bit only if the BF bit = 0.
0 = SSPBUF is only updated when SSPOV is clear.
bit 3
SDAHT: SDA Hold Time Selection bit
1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL
0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL
bit 2
SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If, on the rising edge of SCL, SDA is sampled low when the module outputs a high state, the BCLIF bit
in the PIR1 register is set and bus goes idle.
1 = Enable slave bus collision interrupts
0 = Slave bus collision interrupts are disabled
bit 1
AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit in the
SSPCON1 register will be cleared and the SCL will be held low.
0 = Address holding is disabled
bit 0
DHEN: Data Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit
in the SSPCON1 register and SCL is held low.
0 = Data holding is disabled
Note 1:
2:
This bit has no effect in Slave modes where Start and Stop condition detection is explicitly listed as
enabled.
The ACKTIM status bit is only active when the AHEN bit or DHEN bit is set.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 195
MCP19114/5
REGISTER 28-5:
R/W-1
SSPMSK1: SSP MASK REGISTER 1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
MSK<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0
MSK<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address,
the bit is ignored
REGISTER 28-6:
R/W-0
SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADD<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD<7:0>: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC
10-Bit Slave mode — Most Significant Address byte:
bit 7-3
Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
ADD<2:1>: Two Most Significant bits of 10-bit address.
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address byte:
bit 7-0
ADD<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
ADD<7:1>: 7-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
DS20005281B-page 196
 2014-2015 Microchip Technology Inc.
MCP19114/5
REGISTER 28-7:
R/W-1
SSPMSK2: SSP MASK REGISTER 2
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
MSK2<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
MSK2<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD2<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0
MSK2<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD2<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address,
the bit is ignored
REGISTER 28-8:
R/W-0
SSPADD2: MSSP ADDRESS 2
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADD2<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD2<7:0>: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC
10-Bit Slave mode — Most Significant Address byte:
bit 7-3
Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
ADD2<2:1>: Two Most Significant bits of 10-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address byte:
bit 7-0
ADD2<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
ADD2<7:1>: 7-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 197
MCP19114/5
NOTES:
DS20005281B-page 198
 2014-2015 Microchip Technology Inc.
MCP19114/5
29.0
INSTRUCTION SET SUMMARY
The MCP19114/5 instruction set is highly orthogonal
and is comprised of three basic categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal and control operations
Each instruction is a 14-bit word divided into an
opcode, which specifies the instruction type, and one
or more operands, which further specify the operation
of the instruction. The formats for each of the
categories is presented in Figure 29-1, while the
various opcode fields are summarized in Table 29-1.
Table 29-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W register. If ‘d’ is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instruction cycle consists of four oscillator periods;
for an oscillator frequency of 4 MHz, this gives a normal
instruction execution time of 1 µs. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as an NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
TABLE 29-1:
OPCODE FIELD
DESCRIPTIONS
Field
f
Description
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d
Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC
Program Counter
TO
Time-Out bit
C
DC
Z
Carry bit
Digit carry bit
Zero bit
PD
Power-down bit
FIGURE 29-1:
GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file register operations
13
8 7 6
OPCODE
d
f (FILE #)
0
d = 0 for destination W
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13
10 9
7 6
OPCODE
b (BIT #)
f (FILE #)
0
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
General
29.1
Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the
instruction or the destination designator ‘d’. A read
operation is performed on a register even if the
instruction writes to that register.
For example, a CLRF PORTA instruction will read
PORTGPA, clear all the data bits, then write the result
back to PORTGPA. This example would have the
unintended consequence of clearing the condition that
sets the IOCIF flag.
 2014-2015 Microchip Technology Inc.
13
8
7
0
OPCODE
k (literal)
k = 8-bit immediate value
CALL and GOTO instructions only
13
11
OPCODE
10
0
k (literal)
k = 11-bit immediate value
DS20005281B-page 199
MCP19114/5
TABLE 29-2:
MCP19114/5 INSTRUCTION SET
Mnemonic,
Operands
Description
Cycles
14-Bit Opcode
MSb
LSb
Status
Notes
Affected
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff C, DC, Z
Z
ffff
Z
ffff
Z
xxxx
ffff
Z
ffff
Z
ffff
ffff
Z
ffff
ffff
Z
ffff
Z
ffff
0000
ffff
C
ffff
C
ffff C, DC, Z
ffff
ffff
Z
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk C, DC, Z
kkkk
Z
kkkk
0100 TO, PD
kkkk
Z
kkkk
kkkk
1001
kkkk
1000
0011 TO, PD
kkkk C, DC, Z
Z
kkkk
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
Note 1:
2:
3:
k
k
k
–
k
k
k
–
k
–
–
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and
is driven low by an external device, the data will be written back with a ‘0’.
If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be
cleared if assigned to the Timer0 module.
If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles.
The second cycle is executed as an NOP.
DS20005281B-page 200
 2014-2015 Microchip Technology Inc.
MCP19114/5
29.2
Instruction Descriptions
ADDLW
Add literal and W
Syntax:
[ label ] ADDLW
Operands:
0  k  255
Operation:
(W) + k  (W)
Status Affected:
Description:
BCF
Bit Clear f
Syntax:
[ label ] BCF
Operands:
0  f  127
0b7
C, DC, Z
Operation:
0  (f<b>)
The contents of the W register
are added to the 8-bit literal ‘k’
and the result is placed in the W
register.
Status Affected:
None
Description:
Bit ‘b’ in register ‘f’ is cleared.
ADDWF
Add W and f
BSF
Bit Set f
Syntax:
[ label ] ADDWF
Syntax:
[ label ] BSF
Operands:
0  f  127
d 0,1
Operands:
0  f  127
0b7
Operation:
(W) + (f)  (destination)
Operation:
1  (f<b>)
Status Affected:
C, DC, Z
Status Affected:
None
Description:
Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If
‘d’ is ‘1’, the result is stored back
in register ‘f’.
Description:
Bit ‘b’ in register ‘f’ is set.
ANDLW
AND literal with W
BTFSC
Bit Test f, Skip if Clear
Syntax:
[ label ] ANDLW
Syntax:
[ label ] BTFSC f,b
Operands:
0  k  255
Operands:
Operation:
(W) .AND. (k)  (W)
0  f  127
0b7
Status Affected:
Z
Operation:
skip if (f<b>) = 0
Description:
The contents of W register are
AND’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
Status Affected:
None
Description:
If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is discarded, and an
NOP is executed instead, making
this a two-cycle instruction.
ANDWF
AND W with f
Syntax:
[ label ] ANDWF
Operands:
0  f  127
d 0,1
Operation:
(W) .AND. (f)  (destination)
Status Affected:
Z
Description:
AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
 2014-2015 Microchip Technology Inc.
k
f,d
k
f,b
f,b
f,d
DS20005281B-page 201
MCP19114/5
BTFSS
Bit Test f, Skip if Set
CLRWDT
Clear Watchdog Timer
Syntax:
[ label ] BTFSS f,b
Syntax:
[ label ] CLRWDT
Operands:
0  f  127
0b<7
Operands:
None
Operation:
00h  WDT
0  WDT prescaler,
1  TO
1  PD
Status Affected:
TO, PD
Description:
CLRWDT instruction resets the
Watchdog Timer. It also resets the
prescaler of the WDT.
Bits TO and PD in the STATUS
register are set.
Operation:
skip if (f<b>) = 1
Status Affected:
None
Description:
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, the next instruction
is discarded and an NOP is
executed instead, making this a
two-cycle instruction.
CALL
Call Subroutine
COMF
Complement f
Syntax:
[ label ] CALL k
Syntax:
[ label ] COMF
Operands:
0  k  2047
Operands:
Operation:
(PC)+ 1 TOS,
k  PC<10:0>,
(PCLATH<4:3>)  PC<12:11>
0  f  127
d  [0,1]
Operation:
(f)  (destination)
Status Affected:
Z
Status Affected:
None
Description:
Description:
Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The 11-bit immediate
address is loaded into PC bits
<10:0>. The upper bits of the PC
are loaded from PCLATH. CALL is
a two-cycle instruction.
The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
CLRF
Clear f
DECF
Decrement f
Syntax:
[ label ] CLRF
Syntax:
[ label ] DECF f,d
Operands:
0  f  127
Operands:
Operation:
00h  (f)
1Z
0  f  127
d  [0,1]
Operation:
(f) - 1  (destination)
Status Affected:
Z
Status Affected:
Z
Description:
The contents of register ‘f’ are
cleared and the Z bit is set.
Description:
Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
CLRW
Clear W
Syntax:
[ label ] CLRW
f
Operands:
None
Operation:
00h  (W)
1Z
Status Affected:
Z
Description:
W register is cleared. Zero (Z) bit
is set.
DS20005281B-page 202
f,d
 2014-2015 Microchip Technology Inc.
MCP19114/5
DECFSZ
Decrement f, Skip if 0
INCFSZ
Increment f, Skip if 0
Syntax:
[ label ] DECFSZ f,d
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
Operands:
0  f  127
d  [0,1]
Operation:
(f) - 1  (destination);
skip if result = 0
Operation:
(f) + 1  (destination),
skip if result = 0
Status Affected:
None
Status Affected:
None
Description:
The contents of register ‘f’ are
decremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, an NOP is executed
instead, making it a two-cycle
instruction.
Description:
The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, an NOP is executed
instead, making it a two-cycle
instruction.
GOTO
Unconditional Branch
IORLW
Inclusive OR literal with W
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0  k  2047
Operands:
0  k  255
Operation:
k  PC<10:0>
PCLATH<4:3>  PC<12:11>
Operation:
(W) .OR. k  (W)
Status Affected:
Z
Status Affected:
None
Description:
Description:
GOTO is an unconditional branch.
The 11-bit immediate value is
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
The contents of the W register are
OR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
INCF
Increment f
IORWF
Inclusive OR W with f
Syntax:
[ label ]
Syntax:
[ label ]
0  f  127
d  [0,1]
Operands:
Operands:
0  f  127
d  [0,1]
Operation:
(f) + 1  (destination)
Operation:
(W) .OR. (f)  (destination)
Status Affected:
Z
Status Affected:
Z
Description:
The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
Description:
Inclusive OR the W register with
register ‘f’. If ‘d’ is ‘0’, the result is
placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
GOTO k
INCF f,d
 2014-2015 Microchip Technology Inc.
INCFSZ f,d
IORLW k
IORWF
f,d
DS20005281B-page 203
MCP19114/5
MOVF
Move f
MOVWF
Syntax:
[ label ]
MOVF f,d
Operands:
0  f  127
d  [0,1]
Operation:
(f)  (dest)
Status Affected:
Z
Description:
The contents of register ‘f’ are
moved to a destination
dependent upon the status of
‘d’. If d = 0, the destination is W
register. If d = 1, the destination
is file register ‘f’ itself. d = 1 is
useful to test a file register since
STATUS flag Z is affected.
Words:
1
Cycles:
1
Example:
MOVF
FSR,
Syntax:
Move W to f
[ label ]
MOVWF
f
Operands:
0  f  127
Operation:
(W)  (f)
Status Affected:
None
Description:
Move data from W register to
register ‘f’.
Words:
1
Cycles:
1
Example:
MOVW
F
OPTION
Before Instruction
OPTION =
W
=
After Instruction
OPTION =
W
=
0
0xFF
0x4F
0x4F
0x4F
After Instruction
W =
value in FSR
register
Z = 1
MOVLW
NOP
Move literal to W
No Operation
Syntax:
[ label ]
0  k  255
Operands:
None
Operation:
k  (W)
Operation:
No operation
Status
Affected:
None
Status Affected:
None
Description:
No operation.
Description:
The 8-bit literal ‘k’ is loaded into
W register. The “don’t cares” will
assemble as ‘0’s.
Words:
1
Cycles:
1
Words:
1
Example:
NOP
Cycles:
1
Syntax:
[ label ]
Operands:
Example:
MOVLW
MOVLW k
0x5A
After Instruction
W =
DS20005281B-page 204
NOP
0x5A
 2014-2015 Microchip Technology Inc.
MCP19114/5
RETFIE
Return from Interrupt
Return from Subroutine
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
None
Operands:
None
Operation:
TOS  PC,
1  GIE
Operation:
TOS  PC
Status Affected:
None
Status Affected:
None
Description:
Return from Interrupt. Stack is
POPed and Top-of-Stack (TOS)
is loaded in the PC. Interrupts
are enabled by setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a
two-cycle instruction.
Description:
Return from subroutine. The stack
is POPed and the Top-of-Stack
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
Words:
1
Cycles:
2
Example:
RETFIE
RETFIE
RETURN
After Interrupt
PC =
GIE =
RETLW
TOS
1
Rotate Left f through Carry
Syntax:
[ label
]
Operands:
0  f  127
d  [0,1]
Operation:
See description below
Syntax:
[ label ]
0  k  255
Operation:
k  (W);
TOS  PC
None
Description:
The W register is loaded with
the 8-bit literal ‘k’. The program
counter is loaded from the
Top-of-Stack (the return
address). This is a two-cycle
instruction.
Words:
1
Cycles:
2
Example:
CALL TABLE;W contains
;table offset
;value
GOTO DONE
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ;End of table
f,d
C
Description:
The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
RETLW k
Status Affected:
RLF
Status Affected:
Return with literal in W
Operands:
TABLE
RLF
RETURN
C
Words:
1
Cycles:
1
Example:
RLF
Register f
REG1,0
Before Instruction
REG1
C
=
=
1110 0110
0
=
=
=
1110 0110
1100 1100
1
After Instruction
REG1
W
C
DONE
Before Instruction
W = 0x07
After Instruction
W = value of k8
 2014-2015 Microchip Technology Inc.
DS20005281B-page 205
MCP19114/5
RRF
Rotate Right f through Carry
SUBWF
Subtract W from f
Syntax:
[ label ]
Syntax:
[ label ] SUBWF f,d
Operands:
0  f  127
d  [0,1]
Operands:
0  f  127
d  [0,1]
Operation:
See description below
Operation:
(f) - (W) destination)
Status Affected:
C
Status Affected: C, DC, Z
Description:
The contents of register ‘f’ are
rotated one bit to the right through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is placed
back in register ‘f’.
Description:
RRF f,d
C
Register f
Subtract (two’s complement
method) W register from register ‘f’.
If ‘d’ is ‘0’, the result is stored in the
W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C=0
Wf
C=1
Wf
DC = 0
W<3:0>  f<3:0>
DC = 1
W<3:0>  f<3:0>
SLEEP
Enter Sleep mode
SWAPF
Swap Nibbles in f
Syntax:
[ label ] SLEEP
Syntax:
[ label ] SWAPF f,d
Operands:
None
Operands:
Operation:
00h  WDT,
0  WDT prescaler,
1  TO,
0  PD
0  f  127
d  [0,1]
Operation:
(f<3:0>)  (destination<7:4>),
(f<7:4>)  (destination<3:0>)
Status Affected:
None
Description:
The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
‘0’, the result is placed in the W
register. If ‘d’ is ‘1’, the result is
placed in register ‘f’.
Status Affected:
TO, PD
Description:
The power-down STATUS bit,
PD, is cleared. Time-Out
STATUS bit, TO, is set.
Watchdog Timer and its
prescaler are cleared.
The processor is put into Sleep
mode with the oscillator stopped.
XORLW
Exclusive OR literal with W
Syntax:
[ label ] XORLW k
Operands:
0  k  255
Operation:
(W) .XOR. k W)
SUBLW
Subtract W from literal
Syntax:
[ label ] SUBLW k
Operands:
0  k  255
Operation:
k - (W) W)
Status Affected:
Z
Description:
The contents of the W register
are XOR’ed with the 8-bit literal
‘k’. The result is placed in the W
register.
Status Affected: C, DC, Z
Description:
The W register is subtracted (two’s
complement method) from the 8-bit
literal ‘k’. The result is placed in the
W register.
Result
Condition
C=0
Wk
C=1
Wk
DC = 0
W<3:0>  k<3:0>
DC = 1
W<3:0>  k<3:0>
DS20005281B-page 206
 2014-2015 Microchip Technology Inc.
MCP19114/5
XORWF
Exclusive OR W with f
Syntax:
[ label ] XORWF
Operands:
0  f  127
d  [0,1]
Operation:
(W) .XOR. (f) destination)
Status Affected:
Z
Description:
Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
 2014-2015 Microchip Technology Inc.
f,d
DS20005281B-page 207
MCP19114/5
NOTES:
DS20005281B-page 208
 2014-2015 Microchip Technology Inc.
MCP19114/5
30.0
IN-CIRCUIT SERIAL
PROGRAMMING™ (ICSP™)
30.1
Common Programming Interfaces
Connection to a target device is typically done through
an ICSP header. A commonly found connector on
development tools is the RJ-11 in the 6P6C (6-pin, 6connector) configuration. Refer to Figure 30-1.
ICSP allows customers to manufacture circuit boards
with unprogrammed devices. Programming can be done
after the assembly process, allowing the device to be
programmed with the most recent firmware or a custom
firmware. Five pins are needed for ICSP programming:
• ICSPCLK
• ICSPDAT
• MCLR
• VDD
• VSS (AGND)
FIGURE 30-1:
In Program/Verify mode, the Program Memory, User IDs
and the Configuration Words are programmed through
serial communications. The ICSPDAT pin is a
bidirectional I/O used for transferring the serial data and
the ICSPCLK pin is the clock input. The device is placed
into a Program/Verify mode by holding the ICSPDAT and
ICSPCLK pins low, while raising the MCLR pin from VIL to
VIHH.
ICD RJ-11 STYLE
CONNECTOR INTERFACE
ICSPDAT
NC
ICSPCLK
5
Target
PC Board
VSS
Bottom Side
2 4 6
VDD
1 3
MCLR
Pin Description*
1 = MCLR
2 = VDD Target
3 = VSS (Ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
Another connector often found in use with the PICkit™
programmers is a standard 6-pin header with 0.1 inch
spacing. Refer to Figure 30-2.
FIGURE 30-2:
PICkit™ STYLE CONNECTOR INTERFACE
Pin 1 Indicator
Pin Description*
1 = MCLR
1
2
3
4
5
6
2 = VDD Target
3 = VSS (AGND)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
*
The 6-pin header (0.100" spacing) accepts 0.025" square pins.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 209
MCP19114/5
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes or even jumpers. Refer to Figure 30-3 for more
information.
FIGURE 30-3:
TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
External
Programming
Signals
VDD
Device to be
programmed
VDD
VDD
VPP
MCLR
VSS
VSS
Data
ICSPDAT
Clock
ICSPCLK
*
*
*
To Normal Connections
*
Note:
DS20005281B-page 210
Isolation devices (as required).
If powering via back feeding VDD, VDD must be tied to VIN.
 2014-2015 Microchip Technology Inc.
MCP19114/5
31.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers (MCU) and dsPIC® digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB® X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
31.1
MPLAB X Integrated Development
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows®,
Linux and Mac OS® X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software
components
and
plug-ins
for
high-performance application development and
debugging. Moving between tools and upgrading from
software simulators to hardware debugging and
programming tools is simple with the seamless user
interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
•
•
•
•
Multiple projects
Multiple tools
Multiple configurations
Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
 2014-2015 Microchip Technology Inc.
DS20005281B-page 211
MCP19114/5
31.2
MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other
relocatable object files and archives to create an
executable file. MPLAB XC Compiler uses the
assembler to produce its object file. Notable features of
the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
31.3
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
The MPASM Assembler features include:
31.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
31.5
MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
DS20005281B-page 212
 2014-2015 Microchip Technology Inc.
MCP19114/5
31.6
MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment, making it an excellent, economical software
development tool.
31.7
MPLAB REAL ICE In-Circuit
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant,
Low-Voltage
Differential
Signal
(LVDS)
interconnection (CAT5).
The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE
offers significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
 2014-2015 Microchip Technology Inc.
31.8
MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a
high-speed USB 2.0 interface and is connected to the
target with a connector compatible with the MPLAB
ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB
ICD 3 supports all MPLAB ICD 2 headers.
31.9
PICkit 3 In-Circuit
Debugger/Programmer
The MPLAB PICkit 3 allows debugging and
programming of PIC and dsPIC Flash microcontrollers
at a most affordable price point using the powerful
graphical user interface of the MPLAB IDE. The
MPLAB PICkit 3 is connected to the design engineer’s
PC using a full-speed USB interface and can be
connected to the target via a Microchip debug (RJ-11)
connector (compatible with MPLAB ICD 3 and MPLAB
REAL ICE). The connector uses two device I/O pins
and the Reset line to implement in-circuit debugging
and In-Circuit Serial Programming™ (ICSP™).
31.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a
modular, detachable socket assembly to support
various package types. The ICSP cable assembly is
included as a standard item. In Stand-Alone mode, the
MPLAB PM3 Device Programmer can read, verify and
program PIC devices without a PC connection. It can
also set code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
DS20005281B-page 213
MCP19114/5
31.11 Demonstration/Development
Boards, Evaluation Kits
and Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide
application firmware and source code for examination
and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
31.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent® and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika®
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and
demonstration software for analog filter design,
KEELOQ® security ICs, CAN, IrDA®, PowerSmart
battery management, SEEVAL® evaluation system,
Sigma-Delta ADC, flow rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
DS20005281B-page 214
 2014-2015 Microchip Technology Inc.
MCP19114/5
32.0
PACKAGING INFORMATION
32.1
Package Marking Information
24-Lead QFN (4x4x0.9 mm) (MCP19114 only)
PIN 1
Example
PIN 1
28-Lead QFN (5x5x0.9 mm)
19114
E/MJ^^
e3
1450
256
Example
PIN 1
PIN 1
19115
E/MQ^^
e3
1450256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 215
MCP19114/5
24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005281B-page 216
 2014-2015 Microchip Technology Inc.
MCP19114/5
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2014-2015 Microchip Technology Inc.
DS20005281B-page 217
MCP19114/5
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
NOTE 1
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
TOP VIEW
0.10 C
0.10 C
C
SEATING
PLANE
A1
A
28X
A3
SIDE VIEW
0.08 C
0.10
C A B
D2
0.10
C A B
E2
28X K
2
1
NOTE 1
N
28X L
e
BOTTOM VIEW
28X b
0.10
0.05
C A B
C
Microchip Technology Drawing C04-140C Sheet 1 of 2
DS20005281B-page 218
 2014-2015 Microchip Technology Inc.
MCP19114/5
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
b
Contact Width
Contact Length
L
Contact-to-Exposed Pad
K
MIN
0.80
0.00
3.15
3.15
0.18
0.35
0.20
MILLIMETERS
NOM
28
0.50 BSC
0.90
0.02
0.20 REF
5.00 BSC
3.25
5.00 BSC
3.25
0.25
0.40
-
MAX
1.00
0.05
3.35
3.35
0.30
0.45
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-140C Sheet 2 of 2
 2014-2015 Microchip Technology Inc.
DS20005281B-page 219
MCP19114/5
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern
With 0.55 mm Contact Length
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Microchip Technology Drawing C04-2140A
DS20005281B-page 220
 2014-2015 Microchip Technology Inc.
MCP19114/5
APPENDIX A:
REVISION HISTORY
Revision B (February 2015)
The following is the list of modifications:
1.
2.
3.
4.
Updated the Features section.
Updated the Electrical Characteristics table.
Updated Tables 5-5 and 5-6.
Updated Section 2.0 “Pin Description” with a
note on GPIO power-up.
5. Updated Section 6.1 “Input Undervoltage and
Overvoltage Lockout (UVLO and OVLO)”.
6. Updated Figure 7-14 and added Figures 7-15
and 7-16 in Section 7.0 “Typical Performance
Curves”.
7. Updated Section 13.1 “Power-On Reset
(POR)” and Section 13.3 “Brown-Out Reset
(BOR)”.
8. Updated Section 15.0 “Power-Down Mode
(Sleep)”.
9. Updated Section 20.2 “Temperature Output”.
10. Updated Equation 20-1.
Revision A (March 2014)
• Original Release of this Document.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 221
MCP19114/5
NOTES:
DS20005281B-page 222
 2014-2015 Microchip Technology Inc.
MCP19114/5
INDEX
A
A/D
Specifications...................................................... 3, 5, 35
A/D Conversion. See ADC
ABECON Register .............................................................. 49
Absolute Maximum Ratings ................................................ 22
AC Characteristics .............................................................. 30
ACKSTAT
Status Flag................................................................ 179
ADC .................................................................................. 127
10-Bit Result Format ................................................. 129
Acquisition Requirements ......................................... 133
Associated Registers ................................................ 135
Block Diagram........................................................... 127
Calculating Acquisition Time..................................... 133
Channel Selection..................................................... 128
Configuration............................................................. 128
Configuring Interrupt ................................................. 130
Conversion Clock...................................................... 128
Conversion Procedure .............................................. 130
Internal Sampling Switch (RSS) Impedance.............. 133
Interrupts................................................................... 129
Operation .................................................................. 130
Operation During Sleep ............................................ 130
Port Configuration ..................................................... 128
Register Definitions................................................... 131
Requirements.............................................................. 35
Source Impedance (RS)............................................ 133
Timing Diagram........................................................... 36
ADCON0 Register....................................................... 57, 131
ADCON1 Register............................................................. 132
ADRESH Register............................................................. 132
ADRESL Register ............................................................. 132
Analog Blocks Enable Control ............................................ 49
Error Amplifier Disable ................................................ 49
Analog Peripheral Control ................................................... 48
PWM Steering............................................................. 48
Secondary Current Positive Sense Pull-Up ................ 48
Analog-to-Digital Converter. See ADC
ANSELA Register ............................................................. 114
ANSELB Register ............................................................. 119
Application Diagrams
MCP19114 Boost Quasi-Resonant............................. 11
MCP19114 Cuk’ Synchronous Positive Output .......... 11
Assembler
MPASM Assembler................................................... 212
B
Bench Testing
System ........................................................................ 57
BF ..................................................................................... 181
Status Flag................................................................ 179
BF Status Flag .................................................................. 181
Block Diagrams
ADC .......................................................................... 127
ADC Transfer Function ............................................. 134
Analog Input Model ................................................... 134
Baud Rate Generator................................................ 190
Capture Mode Operation .......................................... 149
Compare Mode Operation ........................................ 150
Interrupt Logic ............................................................. 94
MCP19114/5 Flyback Synchronous Quasi-Resonant. 10
Microcontroller Core.................................................... 12
 2014-2015 Microchip Technology Inc.
MSSP (I2C Master Mode)......................................... 155
MSSP (I2C Slave Mode)........................................... 156
On-Chip Reset Circuit................................................. 85
Pulse-Width Modulation (PWM) ............................... 146
Recommended MCLR Circuit..................................... 86
Timer0 ...................................................................... 137
Timer1 ...................................................................... 139
Timer2 ...................................................................... 143
Watchdog Timer with Shared Prescale .................... 103
Brown-Out Reset (BOR) ..................................................... 87
C
C Compilers
MPLAB XC ............................................................... 212
Calibration Word Registers
CALWD1 (Calibration Word 1) ................................... 59
CALWD10 (Calibration Word 10) ............................... 66
CALWD11 (Calibration Word 11) ............................... 67
CALWD2 (Calibration Word 2) ................................... 60
CALWD3 (Calibration Word 3) ................................... 61
CALWD4 (Calibration Word 4) ................................... 61
CALWD5 (Calibration Word 5) ................................... 62
CALWD6 (Calibration Word 6) ................................... 62
CALWD7 (Calibration Word 7) ................................... 63
CALWD8 (Calibration Word 8) ................................... 64
CALWD9 (Calibration Word 9) ................................... 65
Capture Mode
Block Diagram .......................................................... 149
Capture/Compare (CCD) Module
Capture Mode........................................................... 149
CCP1IF............................................................. 149
CCX Pin Configuration ..................................... 149
Prescaler .......................................................... 149
Software Interrupt ............................................. 149
Timer1 Mode Selection..................................... 149
Compare Mode
CCP1IF............................................................. 150
CMPX Pin Configuration................................... 150
Software Interrupt ............................................. 150
Special Event Trigger ....................................... 150
Timer1 Mode Selection..................................... 150
Register .................................................................... 151
CCDCON Register............................................................ 151
Clock Switching .................................................................. 84
Code Example
Indirect Addressing..................................................... 80
Code Examples
A/D Conversion ........................................................ 130
Assigning Prescaler to Timer0.................................. 138
Assigning Prescaler to WDT..................................... 138
Initializing PORTGPA ............................................... 111
Saving Status and W Registers in RAM ................... 100
Compare Mode
Block Diagram .......................................................... 150
Computed Function Calls ................................................... 79
Computed GOTO................................................................ 79
Configuration Word............................................................. 81
Registers Associated with Clock Sources .................. 84
with Watchdog Timer................................................ 104
Current Sense .................................................................... 19
Customer Change Notification Service............................. 229
Customer Support............................................................. 229
DS20005281B-page 223
MCP19114/5
D
I
Data Memory
Core Registers ............................................................ 71
STATUS Register ............................................... 71
General Purpose Registers......................................... 70
Map ............................................................................. 73
Organization................................................................ 70
Special Function Registers ................................... 70, 72
DC and AC Characteristics ................................................. 53
Graphs and Tables ..................................................... 53
DEADCON Register............................................................ 45
DESATCON Register.......................................................... 41
Desaturation Detection for Quasi-Resonant Operation....... 41
Development Support ....................................................... 211
Device Calibration ............................................................... 59
CALWD1 (Calibration Word 1) .................................... 59
CALWD10 (Calibration Word 10) ................................ 66
CALWD11 (Calibration Word 11) ................................ 67
CALWD2 (Calibration Word 2) .................................... 60
CALWD3 (Calibration Word 3) .................................... 61
CALWD4 (Calibration Word 4) .................................... 61
CALWD5 (Calibration Word 5) .................................... 62
CALWD6 (Calibration Word 6) .................................... 62
CALWD7 (Calibration Word 7) .................................... 63
CALWD8 (Calibration Word 8) .................................... 64
CALWD9 (Calibration Word 9) .................................... 65
Device Configuration..................................................... 37, 81
Code Protection .......................................................... 82
Configuration Word ..................................................... 81
ID Locations ................................................................ 82
Write Protection .......................................................... 82
Device Overview ................................................................... 9
Digital Electrical Characteristics.......................................... 29
Direct Addressing................................................................ 80
Driver Control Circuitry........................................................ 20
I/O
E
Electrical Characteristics..................................................... 22
Errata .................................................................................... 7
External Clock
Timing ......................................................................... 30
Timing Requirements .................................................. 30
F
Features ................................................................................ 1
Microcontroller .............................................................. 1
Timer0 Module .......................................................... 137
Timer1 Module .......................................................... 139
File Select Register. See FSR
Firmware Instructions........................................................ 199
Flash Program Memory
Control ...................................................................... 105
Operation During Code Protect......................... 109
Operation During Write Protect......................... 109
Protection Against Spurious Write .................... 109
Registers........................................................... 106
Reading..................................................................... 108
Writing to ................................................................... 109
FSR
Register....................................................................... 79
G
General Purpose Register. See GPR
GPR
Register....................................................................... 70
DS20005281B-page 224
Ports ......................................................................... 111
I2C Mode (MSSP)
Acknowledge Sequence ........................................... 160
Acknowledge Sequence Timing ............................... 183
Associated Registers ................................................ 189
Bus Collision
During a Repeated Start Condition................... 187
During a Start Condition ................................... 185
During a Stop Condition ................................... 188
Effects of a Reset ..................................................... 184
I2C Clock Rate w/BRG.............................................. 190
Master Mode............................................................. 176
Clock Arbitration ............................................... 176
Operation.......................................................... 176
Reception ......................................................... 181
Repeated Start Condition Timing ..................... 178
Start Condition Timing ...................................... 177
Transmission .................................................... 179
Multi-Master Communication, Bus Collision and Arbitration.................................................................... 184
Multi-Master Mode .................................................... 184
Operation .................................................................. 158
Overview................................................................... 156
Read/Write Bit Information (R/W Bit) ........................ 160
Slave Mode
10-bit Address Reception ................................. 170
Bus Collision..................................................... 166
Clock Stretching ............................................... 174
Clock Synchronization ...................................... 174
General Call Address Support .......................... 175
Operation.......................................................... 160
SSPMSK1 Register .......................................... 175
Transmission .................................................... 166
Sleep Operation........................................................ 184
Stop Condition Timing .............................................. 183
ICLEBCON Register ........................................................... 43
ICOACON Register............................................................. 42
In-Circuit Serial Programming (ICSP)............................... 209
Common Programming Interfaces............................ 209
INDF
Register ...................................................................... 79
Indirect Addressing ....................................................... 79, 80
Input.................................................................................... 22
Overvoltage Lockout................................................... 37
Type............................................................................ 13
Undervoltage Lockout................................................. 37
Instruction Format............................................................. 199
Instruction Set................................................................... 199
ADDLW..................................................................... 201
ADDWF..................................................................... 201
ANDLW..................................................................... 201
ANDWF..................................................................... 201
BCF .......................................................................... 201
BSF........................................................................... 201
BTFSC ...................................................................... 201
BTFSS ...................................................................... 202
CALL......................................................................... 202
CLRF ........................................................................ 202
CLRW ....................................................................... 202
CLRWDT .................................................................. 202
COMF ....................................................................... 202
DECF ........................................................................ 202
DECFSZ ................................................................... 203
 2014-2015 Microchip Technology Inc.
MCP19114/5
GOTO ....................................................................... 203
INCF.......................................................................... 203
INCFSZ ..................................................................... 203
IORLW ...................................................................... 203
IORWF ...................................................................... 203
MOVF........................................................................ 204
MOVLW .................................................................... 204
MOVWF .................................................................... 204
NOP .......................................................................... 204
RETFIE ..................................................................... 205
RETLW ..................................................................... 205
RETURN ................................................................... 205
RLF ........................................................................... 205
RRF........................................................................... 206
SLEEP ...................................................................... 206
SUBLW ..................................................................... 206
SUBWF ..................................................................... 206
Summary Table......................................................... 200
SWAPF ..................................................................... 206
XORLW..................................................................... 206
XORWF..................................................................... 207
INTCON Register ................................................................ 95
Internal Sampling Switch (RSS) Impedance ...................... 133
Internet Address................................................................ 229
Interrupt-on-Change.......................................................... 121
Associated Registers ................................................ 123
Clearing Interrupt Flags ............................................ 121
Enabling the Module ................................................. 121
Individual Pin Configuration ...................................... 121
Operation in Sleep .................................................... 121
Registers................................................................... 122
Interrupts
ADC .......................................................................... 130
Associated Registers ................................................ 100
Configuration Word w/ Clock Sources ........................ 84
Context Saving.......................................................... 100
Control Registers ........................................................ 95
GPA2/INT.................................................................... 93
Timer0....................................................................... 138
Timer1....................................................................... 140
IOCA Register ................................................................... 122
IOCB Register ................................................................... 122
MPLAB Integrated Development Environment Software.. 211
MPLAB PM3 Device Programmer .................................... 213
MPLAB REAL ICE In-Circuit Emulator System ................ 213
MPLAB X SIM Software Simulator ................................... 213
MPLINK Object Linker/MPLIB Object Librarian ................ 212
MSSP ............................................................................... 155
Arbitration ................................................................. 157
Baud Rate Generator ............................................... 190
Block Diagram (I2C Master Mode)............................ 155
Block Diagram (I2C Slave Mode).............................. 156
Clock Stretching ....................................................... 157
I2C Bus Terms .......................................................... 158
I2C Master Mode ...................................................... 176
I2C Mode .................................................................. 156
I2C Mode Operation.................................................. 158
I2C Slave Mode Operation........................................ 160
Overview................................................................... 155
O
OPCODE Field Descriptions............................................. 199
OPTION_REG Register...................................................... 78
Oscillator............................................................................. 83
Associated Registers.................................................. 84
Calibration .................................................................. 83
Delay Upon Base Frequency Change ........................ 84
Delay Upon Power-Up................................................ 84
Delay Upon Wake-Up................................................. 84
Frequency Tuning....................................................... 83
Internal........................................................................ 83
OSCTUNE Register............................................................ 83
Output
Drive Circuitry ............................................................. 19
Overvoltage ................................................................ 39
OVCON Register ................................................ 39
OVREFCON Register......................................... 39
Protection ........................................................... 39
Type............................................................................ 13
Output Regulation Reference Voltage Configuration.......... 46
OVCON Register ................................................................ 39
Overvoltage Lockout
Input............................................................................ 37
OVREFCON Register ......................................................... 39
L
P
Leading Edge Blanking ....................................................... 43
Linear Regulators................................................................ 19
Packaging ......................................................................... 215
Marking..................................................................... 215
Specifications ........................................................... 216
PCL..................................................................................... 79
Modifying .................................................................... 79
PCLATH ............................................................................. 79
PCON Register ............................................................. 88, 91
PE1 Register ...................................................................... 48
Peak Current Mode............................................................. 19
PICkit 3 In-Circuit Debugger/PICkit 3 In-Circuit Programmer .
213
PIE1 Register ..................................................................... 96
PIE2 Register ..................................................................... 97
Pin Diagram
24-Pin QFN (MCP19114) ............................................. 2
28-Pin QFN (MCP19115) ............................................. 4
Pinout Description
Summary .................................................................. 3, 5
Table........................................................................... 13
PIR1 Register ..................................................................... 98
PIR2 Register ..................................................................... 99
PMADRH Register.................................................... 105, 107
M
Magnetic Desaturation Detection ........................................ 19
Master Synchronous Serial Port. See MSSP
MCLR .................................................................................. 86
Internal ........................................................................ 86
Memory Organization.......................................................... 69
Data ............................................................................ 70
Program ...................................................................... 69
Microchip Internet Web Site .............................................. 229
Mode and RFB MUX Control .............................................. 51
MODECON Register ........................................................... 51
MOSFET ............................................................................. 17
Driver
Dead Time .......................................................... 48
Programmable Dead Time.................................. 45
Undervoltage Lockout Selection ......................... 49
Gate Driver Enables.................................................... 48
MPLAB Assembler, Linker, Librarian ................................ 212
MPLAB ICD 3 In-Circuit Debugger System ...................... 213
 2014-2015 Microchip Technology Inc.
DS20005281B-page 225
MCP19114/5
PMADRL Register..................................................... 105, 106
PMCON1 Register .................................................... 105, 107
PMCON2 Register ............................................................ 105
PMDATH Register............................................................. 106
PMDATL Register ............................................................. 106
PORTGPA................................................................. 111, 121
ANSELA Register ..................................................... 112
Associated Registers ................................................ 115
Functions and Output Priorities................................. 112
Interrupt-on-Change.................................................. 111
Output Priority ........................................................... 112
Register............................................................. 111, 113
Weak Pull-Ups .......................................................... 111
PORTGPB................................................................. 116, 121
ANSELB Register ..................................................... 116
Associated Registers ................................................ 119
Functions and Output Priorities................................. 117
Interrupt-on-Change.................................................. 116
Output Priority ........................................................... 117
Register............................................................. 116, 117
Weak Pull-Ups .......................................................... 116
Power-Down Mode (Sleep) ............................................... 101
Associated Registers ................................................ 102
Power-On Reset (POR) ...................................................... 86
Power-Up Timer (PWRT) .................................................... 88
Primary Input Current Offset Adjust .................................... 42
Program Memory
Map and Stack (MCP19114)....................................... 69
Organization................................................................ 69
Protection .................................................................... 82
Programming, Device Instructions .................................... 199
Pulse-Width Modulation
Control Logic ............................................................. 153
Pulse-Width Modulation. See PWM
PWM ................................................................................... 34
Associated Registers ................................................ 147
Control Logic ............................................................. 153
Duty Cycle................................................................. 147
Enhanced Module ..................................................... 145
Fixed Frequency ......................................................... 20
Operation During Sleep ............................................ 147
Output ....................................................................... 146
Period........................................................................ 146
Requirements.............................................................. 34
Simplified Diagram .................................................... 146
Stand-alone Mode..................................................... 145
Standard Mode ......................................................... 145
Steering....................................................................... 48
Switching Frequency Synchronization Mode ............ 145
Timing Diagram........................................................... 34
R
Read-Modify-Write Operations.......................................... 199
Registers
ABECON (Analog Block Enable Control).................... 49
ADCON0 (A/D Control 0) .......................................... 131
ADCON0 (Analog-to-Digital Control) .......................... 57
ADCON1 (A/D Control 1) .......................................... 132
ADRESH (ADC Result High) .................................... 132
ADRESL (ADC Result Low) ...................................... 132
ANSELA (Analog Select GPA).................................. 114
ANSELB (Analog Select GPB).................................. 119
CALWD1 (Calibration Word 1) .................................... 59
CALWD10 (Calibration Word 10) ................................ 66
CALWD11 (Calibration Word 11) ................................ 67
CALWD2 (Calibration Word 2) .................................... 60
DS20005281B-page 226
CALWD3 (Calibration Word 3).................................... 61
CALWD4 (Calibration Word 4).................................... 61
CALWD5 (Calibration Word 5).................................... 62
CALWD6 (Calibration Word 6).................................... 62
CALWD7 (Calibration Word 7).................................... 63
CALWD8 (Calibration Word 8).................................... 64
CALWD9 (Calibration Word 9).................................... 65
CCDCON (Dual Capture/Compare Control Module) 151
CONFIG (Configuration Word) ................................... 81
DEADCON (Driver Dead Time Control)...................... 45
DESATCON (Desaturation Comparator Control) ....... 41
FSR (File Select Register) .......................................... 79
General Purpose Register .......................................... 70
ICLEBCON (Input Current Leading Edge Blanking Control) ..................................................................... 43
ICOACON (Input Current Offset Adjust Control) ........ 42
INDF ........................................................................... 79
INTCON (Interrupt Control)......................................... 95
IOCA (Interrupt-on-Change PORTGPA)................... 122
IOCB (Interrupt-on-Change PORTGPB)................... 122
MODECON (Master/Slave and RFB MUX Control).... 51
OPTION_REG (Option) .............................................. 78
OSCTUNE (Oscillator Tuning).................................... 83
OVCON (Output Overvoltage Comparator Control) ... 39
OVREFCON (Output Overvoltage Detect Level)........ 39
PCON (Power Control) ......................................... 88, 91
PE1 (Analog Peripheral Enable1 Control) .................. 48
PIE1 (Peripheral Interrupt Enable 1)........................... 96
PIE2 (Peripheral Interrupt Enable 2)........................... 97
PIR1 (Peripheral Interrupt Flag 1)............................... 98
PIR2 (Peripheral Interrupt Flag 2)............................... 99
PMADRH (Program Memory Address High) .... 105, 107
PMADRL (Program Memory Address Low)...... 105, 106
PMCON1 (Program Memory Control 1)............ 105, 107
PMCON2 (Program Memory Control 2).................... 105
PMDATH (Program Memory Data High) .................. 106
PMDATL (Program Memory Data Low).................... 106
PORTGPA ........................................................ 111, 113
PORTGPB ........................................................ 116, 117
SLPCRCON (Slope Compensation Ramp Control).... 44
Special Function ......................................................... 70
Special Registers Summary
Bank 0 ................................................................ 74
Bank 1 ................................................................ 75
Bank 2 ................................................................ 76
Bank 3 ................................................................ 77
SSPADD (MSSP Address and Baud Rate 1) ........... 196
SSPADD2 (MSSP Address 2) .................................. 197
SSPCON1 (SSP Control 1) ...................................... 192
SSPCON2 (SSP Control 2) ...................................... 194
SSPCON3 (SSP Control 3) ...................................... 195
SSPMSK (SSP Mask 1)............................................ 196
SSPMSK1 (SSP Mask)............................................. 175
SSPMSK2 (SSP Mask 2).......................................... 197
SSPSTAT (SSP Status)............................................ 191
STATUS ..................................................................... 71
T1CON (Timer1 Control) .......................................... 140
T2CON (Timer2 Control) .......................................... 144
TRISGPA (PORTGPA Tri-State) ...................... 111, 113
TRISGPB (PORTGPB Tri-State) ...................... 116, 118
VINCON (UVLO and OVLO Comparator Control) ...... 37
VINOVLO (Input Overvoltage Lockout) ...................... 38
VINUVLO (Input Undervoltage Lockout)..................... 38
VREF2CON (VREF2 Voltage Set Point) ...................... 47
VREFCON (Current/Voltage Regulation Set Point Con-
 2014-2015 Microchip Technology Inc.
MCP19114/5
trol)...................................................................... 46
WPUGPA (Weak Pull-Up PORTGPA) ...................... 114
WPUGPB (Weak Pull-Up PORTGPB) ...................... 118
Requirements
A/D Acquisition.......................................................... 133
A/D Conversion........................................................... 35
External Clock, Timing ................................................ 30
I/O, Timing .................................................................. 31
PWM ........................................................................... 34
Reset, Watchdog Timer, Oscillator Start-Up Timer and
Power-Up Timer.................................................. 33
Timer0 External Clock................................................. 34
Resets ................................................................................. 85
Associated Registers .................................................. 91
Brown-Out................................................................... 87
Determining Causes ................................................... 89
Power-On.................................................................... 86
Watchdog Timer.......................................................... 88
S
Sleep
Wake-Up from........................................................... 101
Wake-Up Using Interrupts......................................... 102
Slope Compensation........................................................... 44
SLPCRCON Register.......................................................... 44
Software Simulator (MPLAB X SIM) ................................. 213
Special Event Trigger
Capture/Compare Module......................................... 150
Special Function Registers (SFR)....................................... 70
SSPADD Register ............................................................. 196
SSPADD2 Register ........................................................... 197
SSPCON1 Register .......................................................... 192
SSPCON2 Register .......................................................... 194
SSPCON3 Register .......................................................... 195
SSPMSK Register............................................................. 196
SSPMSK1 Register........................................................... 175
SSPMSK2 Register........................................................... 197
SSPOV.............................................................................. 181
SSPOV Status Flag .......................................................... 181
SSPSTAT Register ........................................................... 191
R/W Bit...................................................................... 160
Stack ................................................................................... 79
Start-Up............................................................................... 20
Start-Up Sequence ............................................................. 88
STATUS Register ............................................................... 71
System Bench Testing ........................................................ 57
T
T1CON Register ............................................................... 140
T2CON Register ............................................................... 144
Temperature Indicator Module .......................................... 125
Circuit Operation ....................................................... 125
Temperature Output.................................................. 125
Thermal Specifications........................................................ 28
Timer0 ............................................................................... 137
8-bit Counter Mode ................................................... 137
8-bit Timer Mode....................................................... 137
Associated Registers ................................................ 138
Block Diagram........................................................... 137
External Clock........................................................... 138
Requirements ..................................................... 34
Timing ................................................................. 33
Interrupt..................................................................... 138
Module ...................................................................... 137
Features............................................................ 137
Operation .................................................................. 137
 2014-2015 Microchip Technology Inc.
During Sleep..................................................... 138
Software Programmable Prescaler........................... 137
Switching Prescaler .................................................. 138
T0CKI ....................................................................... 138
TMR0 Register ......................................................... 137
Timer1 .............................................................................. 139
Associated Registers................................................ 141
Block Diagram .......................................................... 139
Clock Source Selection ............................................ 139
Control Register........................................................ 140
External Clock Timing................................................. 33
Interrupt .................................................................... 140
Module...................................................................... 139
Features ........................................................... 139
Operation.................................................................. 139
During Sleep..................................................... 140
Prescaler .................................................................. 140
TMR1H Register....................................................... 139
TMR1L Register ....................................................... 139
Timer2
Associated Registers................................................ 144
Block Diagram .......................................................... 143
Control Register........................................................ 144
Module...................................................................... 143
Features ........................................................... 143
Operation.................................................................. 143
Timers
Timer1 (T1CON)....................................................... 139
Timer2 (T2CON)....................................................... 143
Timing Diagrams
A/D Conversion .......................................................... 36
Acknowledge Sequence ........................................... 183
Baud Rate Generator with Clock Arbitration............. 177
BRG Reset Due to SDA Arbitration During Start Condition.................................................................... 186
Bus Collision During a Repeated Start Condition (Case
1) ...................................................................... 187
Bus Collision During a Repeated Start Condition (Case
2) ...................................................................... 187
Bus Collision During a Start Condition (SCL = 0) ..... 186
Bus Collision During a Start Condition (SDA Only) .. 185
Bus Collision During a Stop Condition (Case 1)....... 188
Bus Collision During a Stop Condition (Case 2)....... 188
Bus Collision for Transmit and Acknowledge ........... 184
Clock Synchronization .............................................. 174
First Start Bit ............................................................. 177
I/O............................................................................... 31
I2C Master Mode (7 or 10-Bit Transmission) ............ 180
I2C Master Mode (7-Bit Reception) .......................... 182
INT Pin Interrupt ......................................................... 94
Power-Up Timer ......................................................... 32
Pulse-Width Modulation.............................................. 34
Repeat Start Condition ............................................. 178
Reset .......................................................................... 32
Start-Up Timer ............................................................ 32
Stop Condition Receive or Transmit Mode............... 183
Time-Out Sequence
Case 1 ................................................................ 88
Case 2 ................................................................ 89
Case 3 ................................................................ 89
Timer0, External Clock ............................................... 33
Timer1, External Clock ............................................... 33
Wake-up from Interrupt............................................. 102
Watchdog Timer ......................................................... 32
Timing Parameter Symbology ............................................ 29
DS20005281B-page 227
MCP19114/5
TRISGPA .......................................................................... 111
Register............................................................. 111, 113
TRISGPB .......................................................................... 116
Register............................................................. 116, 118
Typical Performance Curves............................................... 53
U
Undervoltage Lockout
Input ............................................................................ 37
Selection for MOSFET Driver ..................................... 49
V
VINCON Register................................................................ 37
VINOVLO Register.............................................................. 38
VINUVLO Register .............................................................. 38
VREF2 Voltage Reference.................................................... 47
VREF2CON Register .......................................................... 47
VREFCON Register ............................................................ 46
W
Watchdog Timer. See WDT
WCOL ............................................................................... 183
Status Flag ........................................ 177, 179, 181, 183
WCOL Status Flag ............................................................ 183
WDT .................................................................................. 103
Associated Registers ................................................ 104
Block Diagram........................................................... 103
Configuration Word w/ Watchdog Timer ................... 104
Operation .................................................................. 103
Period........................................................................ 103
Programming Considerations ................................... 103
Reset........................................................................... 88
Switching Prescaler .................................................. 138
WPUGPA Register............................................................ 114
WPUGPB Register............................................................ 118
WWW Address.................................................................. 229
WWW, On-Line Support........................................................ 7
DS20005281B-page 228
 2014-2015 Microchip Technology Inc.
MCP19114/5
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our web site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://www.microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2014-2015 Microchip Technology Inc.
DS20005281B-page 229
MCP19114/5
NOTES:
DS20005281B-page 230
 2014-2015 Microchip Technology Inc.
MCP19114/5
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
Device:
-
X
Tape and Reel Temperature
Option
Range
/XX
XXX
Package
Pattern
MCP19114: Digitally Enhanced PWM Power Analog
High-Speed Controller
MCP19115: Digitally Enhanced PWM Power Analog
High-Speed Controller
Tape and Reel
Option:
Blank
T
= Standard packaging (tube)
= Tape and Reel
Temperature
Range:
E
= -40C to +125C
Package:
MJ
Examples:
a)
b)
Extended Temperature,
24 LD QFN 4x4 package
MCP19114T-E/MJ: Tape and Reel,
Extended Temperature,
24 LD QFN 4x4 package
a)
MCP19115-E/MQ:
b)
MCP19114-E/MJ:
Extended Temperature,
28 LD QFN 5x5 package
MCP19115T-E/MQ: Tape and Reel,
Extended Temperature,
28 LD QFN 5x5 package
(Extended)
Note 1:
MQ
= 24-Lead Plastic Quad Flat, No Lead Package 4x4x0.9 mm Body (QFN)
= 28-Lead Plastic Quad Flat, No Lead Package 5x5x0.9 mm Body (QFN)
 2014-2015 Microchip Technology Inc.
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes
and is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
DS20005281B-page 231
MCP19114/5
NOTES:
DS20005281B-page 232
 2014-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-090-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2014-2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005281B-page 233
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01/27/15
DS20005281B-page 234
 2014-2015 Microchip Technology Inc.