MCP19114/5 Digitally Enhanced Power Analog Synchronous Low-Side PWM Controller Features Microcontroller Features • Input Voltage: 4.5V to 42V • Can be Configured with Multiple Topologies Including but not Limited to: - Flyback - Ćuk - Boost - SEPIC (Single-Ended Primary-Inductor Converter) • Capable of Quasi-Resonant or Fixed-Frequency Operation • Low Quiescent Current: 5 mA Typical • Low Sleep Current: 30 µA Typical • Low-Side Gate Drivers: - +5V gate drive - 0.5A sink/source current - +10V gate drive - 1A sink/source current • Peak Current Mode Control • Differential Remote Output Sense • Multiple Output Systems: - Master or Slave • AEC-Q100 Qualified • Configurable Parameters: - VREF, Precision IOUT/VOUT Set Point (DAC) - Input Undervoltage Lockout (UVLO) - Input Overvoltage Lockout (OVLO) - Detection and protection - Primary current leading edge blanking (0, 50 ns, 100 ns and 200 ns) - Gate drive dead time (16 ns to 256 ns) - Fixed switching frequency range: 31.25 kHz to 2.0 MHz - Slope compensation - Quasi-resonant configuration with built-in comparator and programmable offset voltage adjustment - Primary current offset adjustment - Configurable GPIO pin options • Integrated Low-Side Differential Current Sense Amplifier • ±5% Current Regulation • Thermal Shutdown • Precision 8 MHz Internal Oscillator Block: - Factory-calibrated to ±1%, typical • Interrupt-Capable - Firmware - Interrupt-on-change pins • Only 35 Instructions to Learn • 4096 Words On-Chip Program Memory • High-Endurance Flash: - 100,000 write Flash endurance - Flash retention: >40 years • Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation • Programmable Code Protection • In-Circuit Serial Programming™ (ICSP™) via Two Pins • Eight I/O Pins and One Input-Only Pin - Two open-drain pins • Analog-to-Digital Converter (ADC): - 10-bit resolution - Five external channels • Timer0: 8-bit Timer/Counter with 8-bit Prescaler • Enhanced Timer1: - 16-bit timer with prescaler - Two selectable clock sources • Timer2: 8-Bit Timer with Prescaler - 8-bit period register • I2CTM Communication: - 7-bit address masking - Two dedicated address registers 2014-2015 Microchip Technology Inc. DS20005281B-page 1 MCP19114/5 GPB1/AN4/VREF2 ICOMP IFB VS VIN VDD 24 23 22 21 20 19 Pin Diagram – 24-Pin QFN (MCP19114) GPA0/AN0/TEST_OUT 1 18 VDR GPA1/AN1/CLKPIN 2 17 PDRV GPA2/AN2/T0CKI/INT 3 16 SDRV MCP19114 GPA3/AN3 4 15 PGND GPA7/SCL/ICSPCLK 5 14 AGND GPA6/CCD/ICSPDAT 6 13 IP DS20005281B-page 2 12 11 ISP ISN 10 DESATP/ISOUT 9 DESATN 8 GPB0/SDA GPA5/MCLR/TEST_EN 7 EXP-25 2014-2015 Microchip Technology Inc. MCP19114/5 24-Pin QFN ANSEL A/D Timers MSSP Interrupt Pull-Up 24-PIN SUMMARY I/O TABLE 1: Basic GPA0 1 Y AN0 — — IOC Y — Analog/Digital Debug Output(1) GPA1 2 Y AN1 — — IOC Y — Sync Signal In/Out(2) GPA2 3 Y AN2 T0CKI — IOC INT Y — — GPA3 4 Y AN3 — — IOC Y — — GPA5 7 N — — — IOC(4) Y(5) MCLR Test Enable Input GPA6 6 N — — — IOC Y ICSPDAT Dual Capture/Compare Input Additional GPA7 5 N — — SCL IOC N ICSPCLK — GPB0 8 N — — SDA IOC N — — GPB1 24 Y AN4 — — IOC Y — VREF2(3) DESATN 9 N — — — — — — DESAT Negative Input DESATP/ ISOUT 10 N — — — — — — DESATP Input or ISOUT Output(6) ISP 11 N — — — — Y — Current Sense Amplifier Positive Input ISN 12 N — — — — — — Current Sense Amplifier Negative Input IP 13 N — — — — — — Primary Input Current Sense AGND 14 N — — — — — AGND Small Signal Ground PGND 15 N — — — — — PGND Large Signal Ground SDRV 16 N — — — — — — Secondary LS Gate Drive Output PDRV 17 N — — — — — — Primary LS Gate Drive Output VDR 18 N — — — — — VDR Gate Drive Supply Voltage VDD 19 N — — — — — VDD VDD Output VIN 20 N — — — — — VIN Input Supply Voltage VS 21 N — — — — — — Output Voltage Sense IFB 22 N — — — — — — Error Amplifier Feedback Input 23 N — — — — — — Error Amplifier Output ICOMP Note 1: 2: 3: 4: 5: 6: The Analog/Digital Debug Output is selected through the control of the ABECON register. Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register. VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. When RFB of MODECON<5> = 0, the internal feedback resistor and DESATP input are enabled. When RFB = 1, ISOUT is enabled. 2014-2015 Microchip Technology Inc. DS20005281B-page 3 MCP19114/5 GPB6/AN7 GPB5/AN6/ICSPCLK GPB1/AN4/VREF2 ICOMP IFB VS VIN 28 27 26 25 24 23 22 Pin Diagram – 28-Pin QFN (MCP19115) GPA0/AN0/TEST_OUT 1 21 VDD GPA1/AN1/CLKPIN 2 20 VDR GPA2/AN2/T0CKI/INT 3 19 PDRV GPB4/AN5/ICSPDAT 4 18 SDRV GPA3/AN3 5 17 PGND 6 16 AGND 15 IP GPA7/SCL MCP19115 EXP-29 DS20005281B-page 4 14 ISN ISP 13 DESATP/ISOUT 12 DESATN 11 9 GPB7/CCD GPB0/SDA 10 8 GPA5/MCLR/TEST_EN GPA6/CCD 7 2014-2015 Microchip Technology Inc. MCP19114/5 28-Pin QFN ANSEL A/D Timers MSSP Interrupt Pull-Up 28-PIN SUMMARY I/O TABLE 2: Basic GPA0 1 Y AN0 — — IOC Y — Analog/Digital Debug Output(1) GPA1 2 Y AN1 — — IOC Y — Sync Signal In/Out(2) GPA2 3 Y AN2 T0CKI — IOC INT Y — — GPA3 5 Y AN3 — — IOC Y — — (4) IOC (5) Y Additional GPA5 8 N — — — MCLR Test Enable Input GPA6 7 N — — — IOC Y — Dual Capture/Single Compare1 Input GPA7 6 N — — SCL IOC N — — GPB0 10 N — — SDA IOC N — — GPB1 26 Y AN4 — — IOC Y — VREF2(3) GPB4 4 Y AN5 — — IOC Y ICSPDAT — GPB5 27 Y AN6 — — IOC Y ICSPCLK — GPB6 28 Y AN7 — — IOC Y — — GPB7 9 Y — — — IOC Y — Single Compare2 Input DESATP/ ISOUT 12 N — — — — — — DESATP input or ISOUT Output(6) DESATN 11 N — — — — — — DESAT Negative Input ISP 13 N — — — — Y — Current Sense Amplifier Noninverting Input ISN 14 N — — — — — — Current Sense Amplifier Inverting Input IP 15 N — — — — — — Primary Input Current Sense AGND 16 N — — — — — AGND Small Signal Ground PGND 17 N — — — — — PGND Large Signal Ground SDRV 18 N — — — — — — Secondary LS Gate Drive Output PDRV 19 N — — — — — — Primary LS Gate Drive Output VDR 20 N — — — — — VDR Gate Drive Supply Voltage VDD 21 N — — — — — VDD VDD Output VIN 22 N — — — — — VIN Input Supply Voltage VS 23 N — — — — — — Output Voltage Sense IFB 24 N — — — — — — Error Amplifier Feedback input ICOMP 25 N — — — — — — Error Amplifier Output Note 1: 2: 3: 4: 5: 6: The Analog/Digital Debug Output is selected through the control of the ABECON register. Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register. VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON register. The IOC is disabled when MCLR is enabled. Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control. When RFB of MODECON<6> = 0, the internal feedback resistor is enabled allow with DESATP input. When RFB = 1, ISOUT is enabled. 2014-2015 Microchip Technology Inc. DS20005281B-page 5 MCP19114/5 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Pin Description ........................................................................................................................................................................... 13 3.0 Functional Description ................................................................................................................................................................ 19 4.0 Electrical Characteristics ............................................................................................................................................................ 22 5.0 Digital Electrical Characteristics ................................................................................................................................................. 29 6.0 Configuring the MCP19114/5 ..................................................................................................................................................... 37 7.0 Typical Performance Curves ...................................................................................................................................................... 53 8.0 System Bench Testing ................................................................................................................................................................ 57 9.0 Device Calibration ...................................................................................................................................................................... 59 10.0 Memory Organization ................................................................................................................................................................. 69 11.0 Device Configuration .................................................................................................................................................................. 81 12.0 Oscillator Modes......................................................................................................................................................................... 83 13.0 Resets ........................................................................................................................................................................................ 85 14.0 Interrupts .................................................................................................................................................................................... 93 15.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 101 16.0 Watchdog Timer (WDT)............................................................................................................................................................ 103 17.0 Flash Program Memory Control ............................................................................................................................................... 105 18.0 I/O Ports .................................................................................................................................................................................... 111 19.0 Interrupt-On-Change ................................................................................................................................................................ 121 20.0 Internal Temperature Indicator Module..................................................................................................................................... 125 21.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 127 22.0 Timer0 Module.......................................................................................................................................................................... 137 23.0 Timer1 Module with Gate Control............................................................................................................................................. 139 24.0 Timer2 Module.......................................................................................................................................................................... 143 25.0 Enhanced PWM Module........................................................................................................................................................... 145 26.0 Dual Capture/Compare (CCD) Module..................................................................................................................................... 149 27.0 PWM Control Logic .................................................................................................................................................................. 153 28.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 155 29.0 Instruction Set Summary .......................................................................................................................................................... 199 30.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 209 31.0 Development Support................................................................................................................................................................211 32.0 Packaging Information.............................................................................................................................................................. 215 Appendix A: Revision History............................................................................................................................................................. 221 Index .................................................................................................................................................................................................. 223 The Microchip Web Site ..................................................................................................................................................................... 229 Customer Change Notification Service .............................................................................................................................................. 229 Customer Support .............................................................................................................................................................................. 229 Product Identification System............................................................................................................................................................. 231 DS20005281B-page 6 2014-2015 Microchip Technology Inc. MCP19114/5 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2014-2015 Microchip Technology Inc. DS20005281B-page 7 MCP19114/5 NOTES: DS20005281B-page 8 2014-2015 Microchip Technology Inc. MCP19114/5 1.0 DEVICE OVERVIEW The MCP19114/5 are highly integrated, mixed-signal low-side synchronous controllers that operate from 4.5V to 42V. The family features an analog PWM controller with an integrated microcontroller core used for LED lighting systems, battery chargers and other low-side switch PWM applications. The devices feature an analog internal PWM controller similar to the MCP1631, and a standard PIC® microcontroller similar to the PIC12F617. Complete customization of device operating parameters, start-up or shutdown profiles, protection levels and fault handling procedures are accomplished by setting digital registers using Microchip’s MPLAB® X Integrated Development Environment software and one of Microchip’s many in-circuit debugger and device programmers. The MCP19114/5 mixed-signal low-side synchronous controllers feature integrated programmable input UVLO/OVLO, programmable output overvoltage (OV), two low-side gate drive outputs with independent programmable dead time, programmable leading edge blanking (four steps), programmable 6-bit slope compensation and an integrated internal programmable oscillator for fixed-frequency applications. An integrated 8-bit reference voltage (VREF) is used for setting output voltage or current. An internal comparator supports quasi-resonant applications. Additional Capture and Compare modules are integrated for additional control, including enhanced dimming capability. The MCP19114/5 devices contain two internal LDOs. A 5V LDO is used to power the internal processor and provide 5V externally. This 5V external output can be used to supply the gate drive. An analog filter between the VDD output and the VDR input is recommended when implementing a 5V gate drive supplied from VDD. Two 4.7 µF capacitors are recommended with one placed as close as possible to VDD and one as close as possible to VDR, separated by a 10 isolation resistor. DO NOT exceed 10 µF on the VDD. An external supply is required to implement higher gate drive voltages. By utilizing Microchip’s TC1240A voltage doubler supplied from VDD to provide VDR, a 10V gate drive can be achieved. A 4V LDO is used to power the internal analog circuitry. The two low-side drivers can be used to operate the power converter in bidirectional mode, enabling the “shaping” of LED dimming current in LED applications or developing bidirectional power converters for battery-powered applications. The ability for system designers to configure application-specific features allows the MCP19114/5 to be offered in smaller packages than currently available in integrated devices today. The General Purpose Input/Output (GPIO) of the MCP19114/5 can be configured to offer a status output; a device enable, to control an external switch; a switching frequency synchronization output or input or even a device status or "heartbeat" indicator. This flexibility allows the MCP19114/5 packages and complete solutions to be smaller, thereby saving size and cost of the system printed circuit boards. With integrated features like output current adjustment and dynamic output voltage positioning, the MCP19114/5 family has the best in-class performance and highest integration level currently available. Power trains supported by this architecture include but are not limited to boost, flyback, quasi-resonant flyback, SEPIC, Ćuk, etc. Two low-side gate drivers are capable of sinking and sourcing 1A at 10V VDR. With a 5V gate drive, the driver is capable of 0.5A sink and source. The user has the option to allow the VIN UVLO to shut down the drivers by setting the UVLOEN bit. When this bit is not set, the device drivers will ride through the UVLO condition and continue to operate until VDR reaches the gate drive UVLO value. This value is selectable at 2.7V or 5.4V and is always enabled. An internal reset for the microcontroller core is set to 2.0V. An internal comparator module is used to sense the desaturation of the flyback transformer to synchronize switching for quasi-resonant applications. The operating input voltage for normal device operation ranges from 4.5V to 42V with an absolute maximum of 44V. The maximum transient voltage is 48V for 500 ms. An I2C serial bus is used for device communications from the PWM controller to the system. The MCP19114 is packaged in a 24-lead 4 mm x 4 mm QFN and offers an alternate-bonded 28-lead 5 mm x 5 mm QFN. The MCP19115 is packaged in a 28-lead 5 mm x 5 mm QFN. 2014-2015 Microchip Technology Inc. DS20005281B-page 9 MCP19114/5 FLYBACK SYNCHRONOUS QUASI-RESONANT BLOCK DIAGRAM VIN 4.5V to 42V VS CHS4 8 OV OV_REF OV REF Bias Gen CHS2 LIN 8 VREF2 VREF2 LIN 8 VREF VIN/n CHS0 VZC IFB BGAP CHS1 A1 VZC ISP CHS6 A = 10 A2 A2 2 lsb BGAP OVLO_REF CHS9 - BGAP DESATN DESATP 8.8V to 44V VVDD VDR 2.7V or 5.4V UVLO 5V to 10V Gate Drive Timing CHS10 PGND 4 ADJ Offset Lin 4 DESAT MUX QRS Place recommended VVDD and VDR 4.7 μF Capacitors as close to respective pins as possible VDR Gate Drive Timing OV VZC DESAT P / ISOUT PDRV PWM PGND BGAP AMUX ADC OSC PIC CORE ccd DMUX 2014-2015 Microchip Technology Inc. OV UVLO OVLO VDD_OK I/O AGND AGND PGND PGND 4.7 μF ISP ISN LEB DESAT N VDR 10Ω SDRV 2 IP VVDD 4 IP_COMP ISN Interrupt and Logic to PWM & PIC 4.7 μF PWM Logic PWM Comp RFB MUX VVDD OVLO + EA_SC CHS5 IP 4V to 20V UVLO - VIN_OVLO 6 Slope Comp Log VZC ICOMP + 4 msb OC 4 msb Clamp BG RFB_INT 5 kΩ PDRV UVLO_REF CHS8 VIN_UVLO See Elec Specs For Clamp Voltages AVDD BGAP CHS3 EN VVDD 2 lsb BGAP LIN VREF VDD (5V) AVDD (4V) LDO1 LDO2 VREF2 MUX to GPB1 MCLR SDA TEMP DIMI VDD EN1 EN2 I/O x 3 BIN (x7 MCP19115) GPIO GPIO MCP19114/5 DS20005281B-page 10 FIGURE 1-1: MCP19114/5 FIGURE 1-2: MCP19114 ĆUK SYNCHRONOUS POSITIVE OUTPUT APPLICATION DIAGRAM VIN TC1240 VOLTAGE DOUBLER 5V 10V VDR VIN EN VDD MCLR DIMI PDRV CCD IP MCP19114 I/O VDD DESATN 4x4 24Ld QFN DESATP 2 TEMP SNS I/O SDRV ISN ISP IFB VDD ICOMP BIN 2 VS I/O I/O AGND FIGURE 1-3: PGND I/O MCP19114 BOOST QUASI-RESONANT APPLICATION DIAGRAM VIN DESATN DESATP 5V VDR VIN EN VDD MCLR CCD VDD SW1 I/O SW2 I/O 2 TEMP SNS PDRV IP DESATN DESATP I MCP19114 SOUT IFB I/O VDD BIN 2 4x4 24Ld QFN DIMI I/O AGND 2014-2015 Microchip Technology Inc. ICOMP DESATN DESATP SW1 SW2 ISP ISN VS SDRV PGND DS20005281B-page 11 MCP19114/5 FIGURE 1-4: MICROCONTROLLER CORE BLOCK DIAGRAM Configuration 13 Flash 4K x 14 Program Memory Program Bus PORTGPA GPA0 GPA1 GPA2 GPA3 RAM 256 bytes File Registers 8 Level Stack (13-bit) 14 8 Data Bus Program Counter RAM Addr GPA5 GPA6 GPA7 9 Addr MUX Instruction reg. Direct Addr 7 8 Indirect Addr PORTGPB GPB0 GPB1 FSR reg. STATUS reg. 8 Instruction Decode & Control TESTCLKIN Timing Generation 3 Power-Up Timer GPB4 (MCP19115) GPB5 (MCP19115) MUX GPB6 (MCP19115) GPB7 (MCP19115) ALU Power-On Reset 8 W reg Watchdog Timer I2C™ SDA SCL 8 MHz Internal Oscillator MCLR VIN VSS Timer0 PMDATL Self read/ write flash memory Timer2 Timer1 EEADDR T0CKI Analog Interface Registers Enhanced CCD GPA6 DS20005281B-page 12 PWM GPB7 (MCP19115) 2014-2015 Microchip Technology Inc. MCP19114/5 2.0 PIN DESCRIPTION The 24-lead MCP19114 and 28-lead MCP19115 devices feature pins that have multiple functions associated with each pin. Table 2-1 provides a description of the different functions. Refer to Section 2.1 “Detailed Pin Functional Description” for more detailed information. TABLE 2-1: MCP19114/5 PINOUT DESCRIPTION Name Function Input Type GPA0 TTL AN0 AN — A/D Channel 0 input TEST_OUT — — Internal analog/digital signal multiplexer output(1) GPA1 TTL AN1 AN CLKPIN ST CMOS Switching frequency clock input or output(2) GPA2 ST CMOS General-purpose I/O AN2 AN — A/D Channel 2 input T0CKI ST — Timer0 clock input INT ST — External interrupt GPA3 TTL AN3 AN — A/D Channel 3 input GPA0/AN0/TEST_OUT GPA1/AN1/CLKPIN GPA2/AN2/T0CKI/INT GPA3/AN3 Output Type Description CMOS General-purpose I/O CMOS General-purpose I/O — A/D Channel 1 input CMOS General-purpose I/O GPA5 TTL — General-purpose input only MCLR ST — Master Clear with internal pull-up GPA5/MCLR GPA6/CCD/ICSPDAT GPA6 ST CMOS General-purpose I/O ICSPDAT ST CMOS Serial Programming Data I/O CMOS Single Compare output. Dual Capture input GPA7/SCL/ICSPCLK CCD ST GPA7 ST OD General-purpose open drain I/O SCL 2C™ OD I2C clock ST — Serial Programming Clock ICSPCLK GPB0/SDA I GPB0 TTL OD General-purpose I/O SDA I2C™ OD I2C data input/output GPB1 TTL AN4 AN — A/D Channel 4 input VREF2 — AN VREF2 DAC Output(3) GPB4 TTL GPB1/AN4/VREF2 GPB4/AN5/ICSPDAT (MCP19115 Only) CMOS General-purpose I/O CMOS General-purpose I/O AN5 AN ICSPDAT ST CMOS Primary Serial Programming Data I/O GPB5 TTL CMOS General-purpose I/O AN6 AN — A/D Channel 6 input ISCPCLK ST — Primary Serial Programming Clock GPB5/AN6/ICSPCLK (MCP19115 Only) — A/D Channel 5 input Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open-Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Note 1: The Analog/Digital Debug Output is selected through the control of the ABECON register. 2: 3: Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register. VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON register. 2014-2015 Microchip Technology Inc. DS20005281B-page 13 MCP19114/5 TABLE 2-1: MCP19114/5 PINOUT DESCRIPTION (CONTINUED) Function Input Type GPB6/AN7 (MCP19115 Only) GPB6 TTL AN7 AN GPB7/CCD (MCP19115 Only) GPB7 TTL CMOS General-purpose I/O CMOS Single Compare output. Dual Capture input. Name Output Type Description CMOS General-purpose I/O — A/D Channel 7 input CCD ST VIN VIN — — Device input supply voltage VDD VDD — — Internal +5V LDO output pin VDR VDR — — Gate drive supply voltage AGND AGND — — Small signal quiet ground PGND PGND — — Large signal power ground PDRV PDRV — — Primary Low-Side MOSFET gate drive SDRV SDRV — — Secondary Low-Side MOSFET gate drive IP IP — — Primary input current sense ISN ISN — — Secondary current sense amplifier negative input ISP ISP — — Secondary current sense amplifier positive input VS VS — — Sense voltage compared to overvoltage DAC IFB ICOMP DESATP/ISOUT DESATN IFB — — Error amplifier feedback input ICOMP — — Error amplifier output DESATP/ISOUT — — DESATP: DESAT detect comparator positive input ISOUT: Secondary current sense amplifier output DESATN — — DESATN: DESAT detect comparator negative input Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open-Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C Note 1: The Analog/Digital Debug Output is selected through the control of the ABECON register. 2: 3: Selected when functioning as master or slave by proper configuration of the MSC<1:0> bits in the MODECON register. VREF2 output selected when configured as master by proper configuration of the MSC<1:0> bits in the MODECON register. DS20005281B-page 14 2014-2015 Microchip Technology Inc. MCP19114/5 2.1 2.1.1 Detailed Pin Functional Description GPA0 PIN 2.1.5 GPA5 PIN GPA5 is a general-purpose TTL input only pin. An internal weak pull-up and interrupt-on-change are also available. GPA0 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. For programming purposes, this pin is to be connected to the MCLR pin of the serial programmer. Refer to Section 30.0 “In-Circuit Serial Programming™ (ICSP™)” for more information. AN0 is an input to the A/D. To configure this pin to be read by the A/D on channel 0, bits TRISA0 and ANSA0 must be set. This pin is MCLR when the MCLRE bit is set in the CONFIG register. The ABECON register can be configured to set this pin to the TEST_OUT function. It is a buffered output of the internal analog or digital signal multiplexers. Analog signals present on this pin are controlled by the ADCON0 register. Digital signals present on this pin are controlled by the ABECON register. 2.1.6 2.1.2 GPA6 is part of the CCD Module. For more information, refer to Section 26.0 “Dual Capture/Compare (CCD) Module”. GPA1 PIN GPA1 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN1 is an input to the A/D. To configure this pin to be read by the A/D on channel 1, bits TRISA1 and ANSA1 must be set. When the MCP19114/5 are configured as a master or slave, this pin is configured to be the switching frequency synchronization input or output (CLKPIN). 2.1.3 GPA2 PIN GPA2 is a general-purpose ST input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. GPA6 PIN GPA6 is a general-purpose CMOS output ST input pin whose data direction is controlled in TRISGPA. ICSPDAT is a serial programming data I/O function. This can be used in conjunction with ICSPCLK to serial program the device. 2.1.7 GPA7 PIN GPA7 is a true open drain general-purpose pin whose data direction is controlled in TRISGPA. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-on-change is available. This pin is the primary ICSPCLK input. This can be used in conjunction with ICSPDAT to serial program the device. When the MCP19114/5 is configured for I2C communication, Section 28.2 “I2C Mode Overview”, GPA7 functions as the I2C clock (SCL). This pin must be configured as an input to allow proper operation. AN2 is an input to the A/D. To configure this pin to be read by the A/D on channel 2, bits TRISA2 and ANSA2 must be set. When bit T0CS is set in the OPTION_REG register, the T0CKI function is enabled. Refer to Section 22.0 “Timer0 Module” for more information. GPA2 can also be configured as an external interrupt by setting the INTE bit. Refer to Section 14.2 “GPA2/INT Interrupt” for more information. 2.1.4 GPA3 PIN GPA3 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPA. An internal weak pull-up and interrupt-on-change are also available. AN3 is an input to the A/D. To configure this pin to be read by the A/D on channel 3, bits TRISA3 and ANSA3 must be set. 2014-2015 Microchip Technology Inc. DS20005281B-page 15 MCP19114/5 2.1.8 GPB0 PIN 2.1.13 GPB7 PIN (MCP19115 ONLY) GPB0 is a true open-drain general-purpose pin whose data direction is controlled in TRISGPB. There is no internal connection between this pin and device VDD. This pin does not have a weak pull-up, but interrupt-on-change is available. When the MCP19114/5 are configured for I2C communication, Section 28.2 “I2C Mode Overview”, GPB0 functions as the I2C clock (SDA). This pin must be configured as an input to allow proper operation. GPB7 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. 2.1.9 Internal comparator inverting input. Used during quasi-resonant operation for desaturation detection. GPB1 PIN GPB1 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN4 is an input to the A/D. To configure this pin to be read by the A/D on channel 4, bits TRISB1 and ANSB1 must be set. When the MCP19114/5 are configured as a master, this pin is configured to be the VREF2 DAC output. 2.1.10 GPB4 PIN (MCP19115 ONLY) GPB4 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN5 is an input to the A/D. To configure this pin to be read by the A/D on channel 5, bits TRISB4 and ANSB4 must be set. ICSPDAT is the primary serial programming data I/O function. This is used in conjunction with ICSPCLK to serial program the device. 2.1.11 GPB5 PIN (MCP19115 ONLY) GPB5 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. AN6 is an input to the A/D. To configure this pin to be read by the A/D on channel 6, bits TRISB5 and ANSB5 must be set. ICSPCLK is the primary serial programming clock function. This is used in conjunction with ICSPDAT to serial program the device. 2.1.12 GPB6 PIN (MCP19115 ONLY) GPB6 is a general-purpose TTL input or CMOS output pin whose data direction is controlled in TRISGPB. An internal weak pull-up and interrupt-on-change are also available. GPB7 is part of the CCD Module. For more information, refer to Section 26.0 “Dual Capture/Compare (CCD) Module”. 2.1.14 2.1.15 DESATN PIN DESATP/ISOUT PIN When using the internal comparator for desaturation detection during quasi-resonant operation, this pin connects to the comparator’s noninverting input. The output of the remote sense current sense amplifier gets configured to utilize the 5 k internal feedback resistor. When not utilizing the internal comparator and not configured to use the 5 k internal feedback resistor, the current sense amplifier gets connected to this pin and is ISOUT. 2.1.16 ISP PIN The noninverting input to internal current sense amplifier, typically used to differentially remote sense secondary current. This pin can be internally pulled-up to VDD by setting the <ISPUEN> bit in the PE1 register. 2.1.17 ISN PIN The inverting input to internal current sense amplifier, typically used to differentially remote sense secondary current. 2.1.18 IP PIN Primary input current sense for current mode control and peak current limit. For voltage mode control, this pin can be connected to an artificial ramp. 2.1.19 AGND PIN AGND is the small signal ground connection pin. This pin should be connected to the exposed pad on the bottom of the package. 2.1.20 PGND PIN Connect all large signal level ground returns to PGND. These large-signal level ground traces should have a small loop area and minimal length to prevent coupling of switching noise to sensitive traces. AN7 is an input to the A/D. To configure this pin to be read by the A/D on channel 7, bits TRISB6 and ANSB6 must be set. DS20005281B-page 16 2014-2015 Microchip Technology Inc. MCP19114/5 2.1.21 SDRV PIN The gate of the low-side secondary MOSFET is connected to SDRV. The PCB trace connecting SDRV to the gate must be of minimal length and appropriate width to handle the high-peak drive current and fast voltage transitions. 2.1.22 PDRV PIN The gate of the low-side primary MOSFET is connected to PDRV. The PCB tracing connecting PDRV to the gate must be of minimal length and appropriate width to handle the high-peak drive currents and fast voltage transitions. 2.1.23 Note: Upon initial power-up, the device may apply a weak pull-up effect on GPIO pads that can be configured as analog inputs. Once the external capacitance on the 5V (VDD) is charged and the external 5V regulator exceeds the internal 4V regulator (AVDD) the pull-up effect is shut off. To prevent this parasitic power-up effect, a pull-down resistor of 10 kΩ maximum is recommended for GPIO with analog input capability. This applies to GPA0, GPA1, GPA2, GPA3, GPB1, GPB4 (MCP19115 only), GPBD (MCP19115 only), GPB6 (MCP19115 only). VDR PIN The supply for the low-side drivers is connected to this pin and has an absolute maximum rating of +13.5V. This pin can be connected by an RC filter to the VDD pin. 2.1.24 VDD PIN The output of the internal +5.0V regulator is connected to this pin. It is recommended that a 1.0 µF minimum/ 10 µF maximum bypass capacitor be connected between this pin and the GND pin of the device. The bypass capacitor should be physically placed close to the device. 2.1.25 VIN PIN Input power connection pin of the device. It is recommended that capacitance be placed between this pin and the GND pin of the device. 2.1.26 VS PIN Analog input connected to the noninverting input of the overvoltage comparator. Typically used as output voltage overvoltage protection. The inverting input of the overvoltage comparator is controlled by the OV REF DAC. 2.1.27 IFB PIN Error amplifier inverting feedback connection. 2.1.28 ICOMP PIN Error amplifier output signal. 2.1.29 EXPOSED PAD (EP) It is recommended to connect the exposed pad to AGND. 2014-2015 Microchip Technology Inc. DS20005281B-page 17 MCP19114/5 NOTES: DS20005281B-page 18 2014-2015 Microchip Technology Inc. MCP19114/5 3.0 FUNCTIONAL DESCRIPTION 3.1 Linear Regulators The operating input voltage for the MCP19114/5 ranges from 4.5V to 42V. There are two internal Low Dropout (LDO) voltage regulators. A 5V LDO is used to power the internal processor and provide a 5V output for external usage. A second LDO (AVDD) is a 4V regulator and is used to power the remaining analog internal circuitry. Using an LDO to power the MCP19114/5, the input voltage is monitored using a resistor divider. The MCP19114/5 also incorporate brown-out protection. Refer to Section 13.3 “Brown-Out Reset (BOR)” for details. The PIC core will reset at 2.0V VDD. 3.2 Output Drive Circuitry The MCP19114/5 integrate two low-side drivers used to drive the external low-side N-Channel power MOSFETs for synchronous applications, such as synchronous flyback and synchronous Ćuk converters. Both converter types can be configured for nonsynchronous control by replacing the synchronous FET with a diode. The flyback is also capable of quasi-resonant operation. The MCP19114/5 can also be configured as a Boost or SEPIC switch-mode power supply (SMPS). In Boost mode, nonsynchronous fixed-frequency or nonsynchronous quasi-resonant control can be utilized. This device can also be used as a SEPIC SMPS in fixed-frequency nonsynchronous mode. The low-side drive is capable of switching the MOSFET at high frequency in typical SMPS applications. The gate drive (VDR) can be supplied from 5V to 10V. The drive strength is capable of up to 1A sink/source with 10V gate drive and down to 0.5A sink/source with 5V gate drive. A programmable delay is used to set the gate turn-on dead time. This prevents overlap and shoot-through currents that can decrease the converter efficiency. Each driver shall have its own EN input controlled by the microcontroller core. 3.3 Current Sense The output current is differentially sensed by the MCP19114/5. In low-current applications, this helps maintain high system efficiency by minimizing power dissipation in current sense resistors. Differential current sensing also minimizes external ground shift errors. The internal differential amplifier has a typical gain of 10 V/V. 2014-2015 Microchip Technology Inc. 3.4 Peak Current Mode The MCP19114/5 is a peak current mode controlled device with the current sensing element in series with the primary side MOSFET. Programmable leading edge blanking can be implemented to blank current spikes resulting from turn on. The blank time is controlled from the ICLEBCON register. Primary input current offset adjust is also available via user programmability, thus limiting peak primary input current. This offset adjustment is controlled by the ICOACON register. 3.5 Magnetic Desaturation Detection An internal comparator module is used to detect power train magnetic desaturation for quasi-resonant applications. The comparator output is used as a signal to synchronize the start of the next switching cycle. This operation differs from the traditional fixed-frequency application. The DESAT comparator output can be enabled and routed into the PWM circuitry or disabled for fixed-frequency applications. During Quasi-Resonant (QR) operation, the DESAT comparator output is enabled and combined with a pair of one-shot timers and a flip-flop to sustain PWM operation. Timer2 (TMR2) must be initialized and set to run at a frequency lower than the minimum QR operating frequency. When the CDSWDE bit is set in the DESATCON register, TMR2 serves as a watchdog. An example of the order of events for a Flyback SMPS in synchronous QR operation is as follows: The primary gate drive (PDRV) goes high. The output of the DESAT comparator is high. The primary current increases until IP reaches the level of the Error Amp and causes PWM comparator output to go low. The PDRV goes low and the secondary gate drive (SDRV) goes high (after programmed dead time). This triggers the first one-shot to send a 200 ns pulse that resets the flip-flop and TMR2 (WDM_RESET). The 200 ns one-shot pulse design is implemented to mask out any spurious transitions at the DESAT comparator output caused by switching noise. The SDRV stays high until the secondary winding completely runs out of energy, at which time the output capacitance begins to source current back through the winding and secondary MOSFET. The DESAT comparator detects this and its output goes low. This sets the flip-flop and triggers the second one-shot to send a 33 ns pulse to the control logic, causing the SDRV to go low and the PDRV to go high (after programmed dead time). The cycle then repeats. If, for any reason, the reset one-shot does not fire, the WDM_RESET signal stays low and TMR2 is allowed to run until the PWM signal kicks off a new cycle. The desaturation comparator module is controlled by the DESATCON register. DS20005281B-page 19 MCP19114/5 3.6 Start-Up To control the output current during start-up, the MCP19114/5 have the capability to monotonically increase system current, at the user’s discretion. This is accomplished through the control of the reference voltage DAC (VREF). The entire start-up profile is under user control via software. 3.7 Driver Control Circuitry The internal driver control circuitry of the MCP19114/5 is comprised of an error amplifier (EA), a high-speed comparator and a latch similar to the MCP1631. The error amplifier generates the control voltage used by the high-speed PWM comparator. There is an internally generated reference voltage, VREF. The difference or error between this internal reference voltage and the actual feedback voltage is the control voltage. Some applications will implement parked times where the gate drives are not active. For example, when changing between LED strings and after voltage repositioning, the user can disable the gate drives and park the error amplifier output low. During the time when the EA is parked, its output will be clamped low (1 * BG) such that it is in a known state when reactivated. Before the output switches are re-enabled, it may be necessary to re-enable the EA some time prior to enabling the output drivers. This prior-EA enable time will allow the EA to slew towards the intended target and prevent the secondary switch from turning on for an extensive period of time, unintentionally discharging the output capacitance and pulling the output voltage down. External compensation is used to stabilize the control system. Since the MCP19114/5 are peak current mode controlled, the comparator compares the primary peak current waveform (IP) that is based upon the current flowing in the primary side with the error amplifier control output voltage. This error amplifier control output voltage also has user-programmable slope compensation subtracted from it. In fixed-frequency applications, the slope compensation signal is generated to be greater than 1/2 the down slope of the inductor current waveform and is controlled by the SLPCRCON register. Offset adjust ability is also available to set the peak current limit of the primary switch for overcurrent protection. The range of the slope compensation ramp is specified. When the current sense signal reaches the level of the control voltage minus slope compensation, the on cycle is terminated and the external switch is latched off until the beginning of the next cycle which begins at the next clock cycle. An S-R latch (Set-Rest-Flip-Flop) is used to prevent the PWM circuitry from turning the external switch on until the beginning of the next clock cycle. 3.8 Fixed PWM Frequency The switching frequency of the MCP19114/5 while not controlled by the DESAT comparator output is generated by using a single edge of the 8 MHz internal clock. The user sets the MCP19114/5 switching frequency by configuring the PR2 register. The maximum allowable PDRV duty cycle is adjustable and is controlled by the PWMRL register. The programmable range of the switching frequency will be 31.25 kHz to 2 MHz. The available switching frequency below 2 MHz is defined as FSW = 8 MHz/N, where N is a whole number between 4 N 256. Refer to Section 25.0 “Enhanced PWM Module” for details. 3.9 VREF This reference is used to generate the voltage connected to the noninverting input of the error amplifier. The entire analog control loop is raised to a virtual ground pedestal equal to the Band Gap voltage (1.23V). 3.10 OV REF This reference is used to set the output overvoltage set point. It is compared to the VS input pin, which is typically proportional to the output voltage based on a resistor divider. OV protection, when enabled, can be set to a value for the protection of system circuitry or it can be used to “ripple” regulate the converter output voltage for repositioning purposes. For details, refer to Register 6-4. 3.11 Independent Gate Drive with Programmable Delay Two independent low-side gate drives are integrated for synchronous applications. Programmable delay has been implemented to improve efficiency and prevent shoot-through currents. Each gate drive has an independent enable input controlled by the PE1 register and programmable dead time controlled by the DEADCON register. To improve current regulation at low levels, a pedestal voltage (VZC) set to the BG (1.23V) is implemented. This virtual ground serves as the reference for the error amplifier (A1), slope compensation, current sense amplifier (A2) and the IP offset adjustment. DS20005281B-page 20 2014-2015 Microchip Technology Inc. MCP19114/5 3.12 3.12.1 Temperature Management THERMAL SHUTDOWN To protect the MCP19114/5 from overtemperature conditions, a 150°C junction temperature thermal shutdown has been implemented. When the junction temperature reaches this limit, the device disables the output drivers. In Shutdown mode, both PDRV and SDRV outputs are disabled and the overtemperature flag (OTIF) is set in the PIR2 register. When the junction temperature is reduced by 20°C to 130°C, the MCP19114/5 can resume normal output drive switching. 3.12.2 TEMPERATURE REPORTING The MCP19114/5 have a second on-chip temperature monitoring circuit that can be read by the ADC through the analog test MUX. Refer to Section 20.0 “Internal Temperature Indicator Module” for details on this internal temperature monitoring circuit. 2014-2015 Microchip Technology Inc. DS20005281B-page 21 MCP19114/5 4.0 ELECTRICAL CHARACTERISTICS 4.1 ABSOLUTE MAXIMUM RATINGS † VIN - VGND (operating) .................................................................................................................................................-0.3V to +44V VIN (transient < 500 ms) ............................................................................................................................................+48V PDRV ..................................................................................................................................(GND - 0.3V) to (VDR + 0.3V) SDRV ....................................................................... ..........................................................(GND - 0.3V) to (VDR + 0.3V) VDD Internally Generated ......................................... ...............................................................................................+6.5V VDR Externally Generated ........................................ .............................................................................................+13.5V Voltage on MCLR with respect to GND .................... ............................................................................... -0.3V to +13.5V Maximum voltage: any other pin .................................. ...................................................+(VGND - 0.3V) to (VDD + 0.3V) Maximum output current sunk by any single I/O pin .... ..........................................................................................25 mA Maximum output current sourced by any single I/O pin ..........................................................................................25 mA Maximum current sunk by all GPIO.............................. ..........................................................................................90 mA Maximum current sourced by all GPIO ........................ ..........................................................................................35 mA Storage Temperature.................................................... ..........................................................................-65°C to +150°C Maximum Junction Temperature .................................. ........................................................................................ +150°C Operating Junction Temperature .................................. ..........................................................................-40°C to +125°C ESD protection on all pins (HBM)................................. ......................................................................................... 2.0 kV ESD protection on all pins (MM)................................... ........................................................................................... 200V † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 4.2 Electrical Characteristics Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions VIN 4.5 — 42 V IQ — 5 6.5 mA — 5 6.75 — 30 150 µA VIN = 12V (Note 1) VDD 4.75 5.0 5.5 V VIN = 6.0V to 42V IDD_OUT 35 — — mA VIN = 6.0V to 42V (Note 4) Line Regulation VDD-OUT/ (VDD-OUT * VIN) -0.1 0.002 0.1 %/V (VDD + 1.0V) VIN 20V (Note 4) Load Regulation VDD-OUT/ VDD-OUT -0.65 0.1 +0.65 % IDD_OUT = 1 mA to 20 mA (Note 4) IDD_SC — 50 — mA Input Input Voltage Input Quiescent Current Shutdown Current ISHDN VIN = 12V, Not switching VIN = 20V, Not switching Linear Regulator VDD Internal Circuitry Bias Voltage Maximum External VDD Output Current Output Short-Circuit Current Note 1: 2: 3: 4: 5: 6: VIN = (VDD + 1.0V) (Note 4) Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. DS20005281B-page 22 2014-2015 Microchip Technology Inc. MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Dropout Voltage VIN - VDD — 0.3 0.5 V IDD_OUT = 20 mA, (Notes 4 and 5) Power Supply Rejection Ratio PSRRLDO — 60 — dB f 1000 Hz, IDD_OUT = 25 mA CIN = 0 µF, CDD = 1 µF AVDD — 4.0 — V BG — 1.23 — V BGTOL -2.5 — +2.5 % Linear Regulator AVDD Internal Analog Supply Voltage Band Gap Voltage Band Gap Tolerance Trimmed at 1.0% tolerance Input UVLO Voltage UVLO Range UVLOON 4.0 — 20 V VIN Falling UVLOON Trip Tolerance UVLOTOL -14 — 14 % VIN Falling UVLO trip set to 9V VINUVLO = 0x21h UVLO Hysteresis UVLOHYS 1 4 8 % Hysteresis is based upon the UVLOON setting UVLO trip set to 9V VINUVLO = 0x21h nbits — 6 — Bits Logarithmic Steps TD — 5 — µs 100 ns rise time to 1V overdrive on VIN VIN > UVLO to flag set Resolution UVLO Comparator Input-to-Output Delay Input OVLO Voltage OVLO Range OVLOON 8.8 — 44 V VIN Rising OVLOON Trip Tolerance OVLOTOL -14 — 14 % VIN Rising OVLO trip set to 18V VINOVLO = 0x1Fh OVLO Hysteresis OVLOHYS 1 5 8 % Hysteresis is based upon the OVLOON setting OVLO trip set to 18V VINOVLO = 0x1Fh nbits — 6 — Bits Logarithmic Steps TD — 5 — µs 100 ns rise time to 1V overdrive on VIN VIN > OVLO to flag set Resolution OVLO Comparator Input-to-Output Delay Output OV DAC Note 1: 2: 3: 4: 5: 6: Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. 2014-2015 Microchip Technology Inc. DS20005281B-page 23 MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Resolution nbits — Full Scale Range FSR 0 OVREFTOL -10 Tolerance Typ. Max. Units 8 — Bits — 2 * BG V — +10 % Conditions Linear DAC Full Scale, Code = 0xFF Output OV Comparator OVHYS — 50 — mV Input Bias Current IBIAS — ±1 — µA Common-Mode Input Voltage Range VCMR 0 — 3.0 V Note 3 Input-to-Output Delay TD — 200 — ns Note 3 100 ns rise time to 1V overdrive on VS VS > OV to flag set Linear DAC OV Hysteresis Voltage Reference DAC (VREF) Resolution nbits — 8 — V/V Full-Scale Range FSR BG — 2 * BG V Pedestal set to BG Voltage Reference DAC (VREF2) Resolution nbits — 8 — Bits Full-Scale Range FSR 0 — BG V Sink Current ISINK -3 — — mA VREF2 = 0V, RL = 300to BG ISOURCE 3 — — mA VREF2 = BG, RL = 300to GND VREF2TOL -10 — +10 % Full Scale, Code = 0xFF Source Current Tolerance Linear DAC Current Sense Amplifier (A2) Amplifier PSRR PSRR — 65 — dB VCM = 2 * BG Closed-Loop Voltage Gain A2VCL — 10 — V/V RL = 5 k to 2.048V, 100 mV < A2 < AVDD – 100 mV, VCM = BG VOL — 300 — mV RL = 5 k to 2.048V Gain-Bandwidth Product GBWP — 10 — MHz AVDD = 4V Input Impedance RIN — 10 — k ISINK -3 — — mA ISP = ISN = GND RL = 300 to 2 * BG ISOURCE 3 — — mA ISP = ISN = GND RL = 300 to GND Low-Level Output Sink Current Source Current Note 1: 2: 3: 4: 5: 6: Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. DS20005281B-page 24 2014-2015 Microchip Technology Inc. MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Common-Mode Range VCMR GND – 0.3 — VBG + 0.3 V Common-Mode Rejection Ratio CMRR — 70 — dB Internal Feedback Resistor RFB_INT — 5 — k Internal Feedback Resistor Tol RFB_INT_TOL — 2 — % VZC — BG — V VOS — 2 — mV CMRR — 65 — dB VCM = 0V to BG Open-Loop Voltage Gain AVOL — 70 — dB Note 3 Low-Level Clamp Value VOL BG - 0.35 V RL = 5 k to 2.048V GBWP — 3.5 — MHz ISINK -3 — — mA VREF = BG, IFB = ICOMP RL = 150 to 1.5 * BG Error Amplifier Source Current ISOURCE 3 — — mA VREF = 2 * BG, IFB = ICOMP RL = 150 to 1.5 * BG Maximum Error Amplifier Output High-Level Clamp VEA_MAX — 2 x BG — V EA Output clamped to 2 x BG Voltage VIP_MAX — BG 1.5 V Note 3 TD — 11 20 ns Note 3 LEB — 2 — Bits LEBRANGE 0 — 256 ns Note 3 Trimmed Pedestal Voltage Pedestal Voltage Level Error Amplifier (EA) Input Offset Voltage Common-Mode Rejection Ratio Gain-Bandwidth Product Error Amplifier Sink Current BG - 0.22 BG - 0.1 Peak Current Sense Input Maximum Primary Current Sense Signal Voltage PWM Comparator Input-to-Output Delay Peak Current Leading Edge Blanking Resolution Blanking Time Adjustable Range Note 1: 2: 3: 4: 5: 6: 4-Step Programmable Range (0, 50,100, and 200 ns) (Note 3) Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. 2014-2015 Microchip Technology Inc. DS20005281B-page 25 MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions OSADJ — 4 — Bits Offset Adjustment Range OSADJ_RANGE 0 — 750 mV Offset Adjustment Step Size OSADJ_STEP — 50 — mV Linear Steps Log Steps Offset Adjustment (IP Sense) Resolution Adjustable Slope Compensation SCRES — 6 — Bits m 4.1 — 432.5 mV/µs Slope Step Size SCSTEP — 8 — % Ramp Set Point Tolerance mTOL — ±1 ±30 % — ±1 — mV Trimmed, 5 bits adjustable Resolution Slope Log Steps Desaturation Detection Comparator Input Offset Voltage VOS Input Bias Current IBIAS — ±1 — µA Internal Circuit Dependent Common-Mode Input Voltage Range VCMR GND – 0.3V — 2.7 V Note 3 Input-to-Output Delay TD — 20 — ns VDR UVLO (2.7V VDR Falling) VDR_UVLO_2.7_F 2.45 — 2.9 V VDR UVLO (2.7 VDR Rising) VDR_UVLO_2.7_R 2.68 — 3.23 V VDR UVLO (2.7V) Hysteresis VDR_UVLO 2.7 HYS 190 — 415 mV VDR UVLO (5.4V VDR Falling) VDR_UVLO_5.4_F 4.7 — 5.96 V VDR UVLO (5.4V VDR Rising) VDR_UVLO_5.4_R 5.15 — 6.56 V VDR UVLO (5.4V) Hysteresis VDR_UVLO 5.4 HYS 380 — 830 mV VDR UVLO Output Driver (PDRV and SDRV) PDRV/SDRV Gate Drive Source Resistance RDR-SRC — — 13.5 VDR = 4.5V (Note 3) PDRV/SDRV Gate Drive Sink Resistance RDR-SINK — — 12 VDR = 4.5V (Note 3) Note 1: 2: 3: 4: 5: 6: Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. DS20005281B-page 26 2014-2015 Microchip Technology Inc. MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. PDRV/SDRV Gate Drive Source Current IDR-SRC PDRV/SDRV Gate Drive Sink Current IDR-SINK Min. Typ. Max. Units A VDR = 5V VDR = 10V (Note 3) A VDR = 5V VDR = 10V (Note 3) — 0.5 — — 1.0 — — 0.5 — — 1.0 — DTRES — 4 — Bits Dead-Time Adjustable Range DTRANGE 16 — 256 ns Dead-Time Step Size DTSTEP — 16 — ns Dead-Time Tolerance DTTOL — ±8 — ns Internal Oscillator Frequency FOSC 7.60 8.00 8.40 MHz Switching Frequency FSW — FOSC/N — MHz Switching Frequency Range Select N 4 — 255 — NR — — 10 Bits Conditions Dead-Time Adjustment Resolution Linear Steps Oscillator/PWM FMAX = 2 MHz A/D Converter (ADC) Characteristics Resolution Integral Error EIL — — ±1 LSb VREF_ADC = AVDD Differential Error EDL — — ±1 LSb No missing code in 10 bits, VREF_ADC = AVDD (Note 2) Offset Error EOFF — +3.0 +7 LSb VREF_ADC = AVDD Gain Error EGN — ±2 ±6 LSb VREF_ADC = AVDD Reference Voltage VREF_ADC — AVDD — V Full-Scale Range FSRA/D GND — AVDD — ISINK_GPIO — — 90 mA Note 6 Maximum GPIO Source Current ISOURCE_GPIO — — 35 mA Note 6 GPIO Weak Pull-Up Current IPULL-UP_GPIO 50 250 400 µA VGPIO_IL GND — 0.8 V I/O Port with TTL buffer, VDD = 5V GND — 0.2VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V GND — 0.2VDD V MCLR GPIO Pins Maximum GPIO Sink Current GPIO Input Low Voltage Note 1: 2: 3: 4: 5: 6: Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. 2014-2015 Microchip Technology Inc. DS20005281B-page 27 MCP19114/5 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 150 kHz, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters GPIO Input High Voltage Sym. Min. Typ. Max. Units Conditions VGPIO_IH 2.0 — VDD V I/O Port with TTL buffer, VDD=5V 0.8VDD — VDD V I/O Port with Schmitt Trigger buffer, VDD = 5V 0.8VDD — VDD V MCLR GPIO Output Low Voltage VGPIO_OL — — 0.12VDD V IOL = 7 mA, VDD = 5V GPIO Output High Voltage VGPIO_OH VDD-0.7 — — V IOH = 2.5 mA, VDD = 5V GPIO Input Leakage Current GPIO_IIL — ±0.1 ±1 µA Negative current is defined as current sourced by the pin. VPOR — 1.75 — V VPOR_HYS — 100 — mV Thermal Shutdown TSHD — 150 — °C Thermal Shutdown Hysteresis TSHD_HYS — 20 — °C POR Power-On Reset Voltage Power-On Reset Voltage Hysteresis Thermal Shutdown Note 1: 2: 3: 4: 5: 6: 4.3 Refer to Section 15.0 “Power-Down Mode (Sleep)”. These parameters are characterized, but not production tested. Ensured by design, not production tested. VDD is the voltage present at the VDD pin. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential between VIN and VDD. The VDD LDO will limit the total source current to a maximum of 35 mA. Individually each pin can source a maximum of 15 mA. Thermal Specifications Parameters Sym. Min. Typ. Max. Units Specified Temperature Range TA -40 — +125 °C Operating Junction Temperature Range TJ -40 — +125 °C Maximum Junction Temperature TJ — — +150 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 24L-QFN 4x4 JA — 42 — °C/W Thermal Resistance, 28L-QFN 5x5 JA — 35.3 — °C/W Temperature Ranges Thermal Package Resistances DS20005281B-page 28 2014-2015 Microchip Technology Inc. MCP19114/5 5.0 DIGITAL ELECTRICAL CHARACTERISTICS 5.1 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 3. TCC:ST (I2C™ specifications only) 2. TppS 4. Ts (I2C specifications only) T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (high-impedance) L Low I2C™ only AA BUF T Time osc rd rw sc ss t0 wr OSC1 RD RD or WR SCK SS T0CKI WR P R V Z Period Rise Valid High-Impedance High Low High Low Hold SU Setup DATA input hold START condition STO STOP condition output access Bus free TCC:ST (I2C specifications only) CC HD ST DAT STA 2014-2015 Microchip Technology Inc. DS20005281B-page 29 MCP19114/5 FIGURE 5-1: LOAD CONDITIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin CL Pin VSS VSS RL = 464 CL = 50 pF for all GPIO pins 5.2 AC Characteristics: MCP19114 (Industrial, Extended) FIGURE 5-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC 1 2 TABLE 5-1: Param. No. EXTERNAL CLOCK TIMING REQUIREMENTS Sym. Characteristic Min. Typ.† Max. Units FOSC Oscillator Frequency(1) — 8 — MHz — 250 — ns — TCY ns 1 TOSC 2 TCY Oscillator Period(1) Instruction Cycle Time(1) Conditions TCY = 4 * TOSC * These parameters are characterized but not tested. † Data in “Typ.” column is at VIN = 12V (VDD = 5V), 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. DS20005281B-page 30 2014-2015 Microchip Technology Inc. MCP19114/5 FIGURE 5-3: I/O TIMING Q1 Q4 Q2 Q3 OSC 22 23 19 18 I/O Pin (input) 17 I/O Pin (output) new value old value 20, 21 TABLE 5-2: I/O TIMING REQUIREMENTS Param. No. Sym. 17 TosH2ioV 18 Min. Typ.† Max. Units OSC1 (Q1 cycle) to Port out valid — 50 70* ns TosH2ioI OSC1(Q2 cycle) to Port input invalid (I/O in hold time) 50 — — ns 19 TioV2osH Port input valid to OSC1 (I/O in setup time) 20 — — ns 20 TioR Port output rise time — 32 40 ns Characteristic 21 TioF Port output fall time — 15 30 ns 22* Tinp INT pin high or low time 25 — — ns 23* TRABP TCY — — ns GPIO interrupt-on-change new input level time Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at VIN = 12V (VDD = 5V), 25C unless otherwise stated. 2014-2015 Microchip Technology Inc. DS20005281B-page 31 MCP19114/5 FIGURE 5-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time Out 32 OSC Time Out Internal Reset Watchdog Timer Reset 34 31 34 I/O Pins FIGURE 5-5: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR BVHY VBOR + BVHY 35 Reset (Due to BOR) (Device not in Brown-out Reset) DS20005281B-page 32 (Device in Brown-out Reset) 64 ms Time Out (if PWRTE) 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 5-3: Param. No. RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER REQUIREMENTS Sym. Characteristic Min. Typ.† Max. Units Conditions 30 TMCL MCLR Pulse Width (low) 2 — — s VDD = 5 V, -40°C to +85°C 31 TWDT Watchdog Timer Time-Out Period (No Prescaler) 7 18 33 ms VDD = 5 V, -40°C to +85°C 32 TOST Oscillation Start-Up Timer Period — 1024TOSC — — TOSC = OSC1 period 33* TPWRT Power-up Timer Period (4 x TWDT) 28 72 132 ms VDD = 5 V, -40°C to +85°C 34 TIOZ I/O high impedance from MCLR Low or Watchdog Timer Reset — — 2.0 µs VBOR Brown-out Reset voltage 2.0 2.13 2.3 V BVHY Brown-out Hysteresis — 100 — mV TBCR Brown-out Reset pulse width 100* — — µs 2TOSC — 7TOSC 35 48 TCKEZ-TMR Delay from clock edge to timer increment VDD VBOR (D005) * These parameters are characterized but not tested. † Data in “Typ.” column is at VIN = 12V (VDD = AVDD = 5V), 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 5-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMING T0CKI 41 40 42 48 TMR0 2014-2015 Microchip Technology Inc. DS20005281B-page 33 MCP19114/5 TABLE 5-4: Param. No. Sym. 40* Tt0H 41* TIMER0 EXTERNAL CLOCK REQUIREMENTS T0CKI High Pulse Width Tt0L 42* Min. Typ.† No Prescaler 0.5TCY + 20 — — ns With Prescaler 10 — — ns No Prescaler 0.5TCY + 20 — — ns With Prescaler 10 — — ns Greater of: 20 or — — ns Characteristic T0CKI Low Pulse Width Tt0P T0CKI Period Max. Units T CY + 40 ----------------------N * † Conditions N = prescale value (2, 4, ..., 256) These parameters are characterized but not tested. Data in “Typ.” column is at VIN = 12V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 5-7: PWM TIMINGS PWM (CLKPIN) 53 Note: TABLE 5-5: 54 Refer to Figure 5-1 for load conditions. PWM REQUIREMENTS Param. Sym. No. Characteristic Min. Typ.† Max. Units 53* TccR PWM (CLKPIN) output rise time — 10 25 ns 54* TccF PWM (CLKPIN) output fall time — 10 25 ns Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at VIN = 12V (AVDD = 4V), 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS20005281B-page 34 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 5-6: MCP19114/5 A/D CONVERTER (ADC) CHARACTERISTICS Electrical Specifications: Unless otherwise noted, operating temperature = 40°C TA +125°C Param. Sym. No. Characteristic Min. Typ.† Max. Units Conditions AD01 NR Resolution — — 10 bits bit AD02 EIL Integral Error — — 1 LSb AVDD = 4.0V AD03 EDL Differential Error — — 1 LSb No missing codes to 10 bits AVDD = 4.0V AD04 EOFF Offset Error — +3.0 +7 LSb AVDD = 4.0V AD07 EGN Gain Error — 2 6 LSb AVDD = 4.0V AD07 VAIN Full-Scale Range AGND — AVDD V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k * These parameters are characterized but not tested. † Data in ‘Typ.’ column is at VIN = 12V (AVDD = 4V), 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. TABLE 5-7: MCP19114/5 A/D CONVERSION REQUIREMENTS Electrical Specifications: Unless otherwise noted, operating temperature = 40°C TA +125°C Param. Sym. No. Typ.† Max. Units 1.6 — 9.0 µs TOSC-based 1.6 4.0 6.0 µs ADCS<1:0> = 11 (ADRC mode) Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO/DONE bit to new data in A/D Result registers AD132* TACQ Acquisition Time — 11.5 — µs AD133* TAMP Amplifier Settling Time — — 5 µs Q4 to A/D Clock Start — TOSC/2 — — Characteristic Min. A/D Clock Period A/D Internal RC Oscillator Period AD131 TCNV AD130* AD134 TAD TGO Conditions * These parameters are characterized but not tested. † Data in ‘Typ.’ column is at VIN = 12V (VDD = AVDD = 5V), 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle. 2014-2015 Microchip Technology Inc. DS20005281B-page 35 MCP19114/5 FIGURE 5-8: A/D CONVERSION TIMING BSF ADCON0, GO 134 1/2 TCY 131 Q4 130 A/D CLK 9 A/D DATA 8 7 6 3 OLD_DATA ADRES 2 1 0 NEW_DATA ADIF DONE GO SAMPLE 132 SAMPLING STOPPED Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. DS20005281B-page 36 2014-2015 Microchip Technology Inc. MCP19114/5 6.0 CONFIGURING THE MCP19114/5 The MCP19114/5 are analog controllers with a digital peripheral. This means that device configuration is handled through register settings instead of adding external components. There are several internal configurable comparator modules used to interface analog circuits to digital processing that are very similar to a standard comparator module found in many PIC processors today (i.e. PIC16F1824/1828). The following sections detail how to set the analog control registers for all the configurable parameters. 6.1 Input Undervoltage and Overvoltage Lockout (UVLO and OVLO) VINCON is the comparator control register for both the VINUVLO and VINOVLO registers. It contains the enable bits, the polarity edge detection bits and the status output bits for both protection circuits. The interrupt flags <UVLOIF> and <OVLOIF> in the PIR2 register are independent of the enable <UVLOEN> and <OVLOEN> bits in the VINCON register. The <UVLOOUT> undervoltage lockout status output bit in the VINCON register indicates if an UVLO event has occurred. The <OVLOOUT> overvoltage lockout status output bit in the VINCON register indicates if an OVLO event has occurred. REGISTER 6-1: The VINUVLO register contains the digital value that sets the input undervoltage lockout. UVLO has a range of 4V to 20V. For VIN values below this range and above processor come-alive (VDD = 2V), the UVLO comparator and the UVLOOUT status bit will indicate an undervoltage condition. If using UVLO to determine power-up VIN, it is recommended to poll the UVLOOUT bit for status. When the input voltage on the VIN pin to the MCP19114/5 is below this programmed level and the <UVLOEN> bit in the VINCON register is set, both PDRV and SDRV gate drivers are disabled. This bit is automatically cleared when the MCP19114/5 VIN voltage rises above this programmed level. The VINOVLO register contains the digital value that sets the input overvoltage lockout. OVLO has a range of 8.8V to 44V. When the input voltage on the VIN pin to the MCP19114/5 is above this programmed level and the <OVLOEN> bit in the VINCON register is set, both PDRV and SDRV gate drivers are disabled. This bit is automatically cleared when the MCP19114/5 VIN voltage drops below this programmed level. Refer to Figure 27-1. Note: The UVLOIF and OVLOIF interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit (GIE) in the INTCON register. VINCON: UVLO AND OVLO COMPARATOR CONTROL REGISTER R/W-0 R-0 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 UVLOEN UVLOOUT UVLOINTP UVLOINTN OVLOEN OVLOOUT OVLOINTP OVLOINTN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ x = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 UVLOEN: UVLO Comparator Module Logic Enable bit 1 = UVLO Comparator Module Logic enabled 0 = UVLO Comparator Module Logic disabled bit 6 UVLOOUT: Undervoltage Lockout Status Output 1 = UVLO event has occurred 0 = No UVLO event has occurred bit 5 UVLOINTP: UVLO Comparator Interrupt on Positive Going Edge Enable bit 1 = The UVLOIF interrupt flag will be set upon a positive going edge of the UVLO 0 = No UVLOIF interrupt flag will be set upon a positive going edge of the UVLO bit 4 UVLOINTN: UVLO Comparator Interrupt on Negative Going Edge Enable bit 1 = The UVLOIF interrupt flag will be set upon a negative going edge of the UVLO 0 = No UVLOIF interrupt flag will be set upon a negative going edge of the UVLO 2014-2015 Microchip Technology Inc. DS20005281B-page 37 MCP19114/5 REGISTER 6-1: VINCON: UVLO AND OVLO COMPARATOR CONTROL REGISTER (CONTINUED) bit 3 OVLOEN: OVLO Comparator Module Logic enable bit 1 = OVLO Comparator Module Logic enabled 0 = OVLO Comparator Module Logic disabled bit 2 OVLOOUT: Overvoltage Lockout Status Output bit 1 = OVLO event has occurred 0 = No OVLO event has occurred bit 1 OVLOINTP: OVLO Comparator Interrupt on Positive Going Edge Enable bit 1 = The OVLOIF interrupt flag will be set upon a positive going edge of the OVLO 0 = No OVLOIF interrupt flag will be set upon a positive going edge of the OVLO bit 0 OVLOINTN: OVLO Comparator Interrupt on Negative Going Edge Enable bit 1 = The OVLOIF interrupt flag will be set upon a negative going edge of the OVLO 0 = No OVLOIF interrupt flag will be set upon a negative going edge of the OVLO REGISTER 6-2: VINUVLO: INPUT UNDERVOLTAGE LOCKOUT REGISTER U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — UVLO5 UVLO4 UVLO3 UVLO2 UVLO1 UVLO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 UVLO<5:0>: Undervoltage Lockout Configuration bits UVLO(V) = 3.5472 * (1.0285N) where N = the decimal value written to the VINUVLO Register from 0 to 63 REGISTER 6-3: VINOVLO: INPUT OVERVOLTAGE LOCKOUT REGISTER U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — OVLO5 OVLO4 OVLO3 OVLO2 OVLO1 OVLO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 OVLO<5:0>: Overvoltage Lockout Configuration bits OVLO(V) = 7.4847 * (1.0286N) where N = the decimal value written to the VINOVLO Register from 0 to 63 DS20005281B-page 38 2014-2015 Microchip Technology Inc. MCP19114/5 6.2 Output Overvoltage Protection The OVCON register contains the interrupt flag polarity and OV enable bits along with the output status bit just as VINCON does for the input voltage UVLO and OVLO. When <OVEN> bit in the OVCON register is set and an overvoltage occurs, the control logic will automatically set the secondary gate drive output (SDRV) high and set the primary gate drive output (PDRV) low. The MCP19114/5 feature output overvoltage protection. This feature also utilizes a comparator module similar to the standard PIC comparator module. This is used to prevent the power system from being damaged when the load is disconnected. The OVREFCON register contains the digital value that sets the analog DAC voltage at the inverting input of the comparator. By comparing the divided down power train output voltage connected to the noninverting input (VS) of the comparator with the OVREF reference voltage, the user will know when an overvoltage event has occurred and can automatically take action. REGISTER 6-4: Note: The OVIF interrupt flag bit is set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit (GIE) in the INTCON register. OVCON: OUTPUT OVERVOLTAGE COMPARATOR CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-0 R-0 R/W-0 R/W-0 — — — — OVEN OVOUT OVINTP OVINTN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 OVEN: OV Comparator output enable bit 1 = OV Comparator output is enabled 0 = OV Comparator output is Not enabled bit 2 OVOUT: Output Overvoltage Status Output bit 1 = Output Overvoltage has occurred 0 = No Output Overvoltage has occurred bit 1 OVINTP: OV Comparator Interrupt on Positive Going Edge Enable bit 1 = The OVIF interrupt flag will be set upon a positive going edge of the OV 0 = No OVIF interrupt flag will be set upon a positive going edge of the OV bit 0 OVINTN: OV Comparator Interrupt on Negative Going Edge Enable bit 1 = The OVIF interrupt flag will be set upon a negative going edge of the OV 0 = No OVIF interrupt flag will be set upon a negative going edge of the OV REGISTER 6-5: OVREFCON: OUTPUT OVERVOLTAGE DETECT LEVEL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x OOV7 OOV6 OOV5 OOV4 OOV3 OOV2 OOV1 OOV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 OOV<7:0>: Output Overvoltage Detect Level Configuration bits VOV_REF(V) = 2 * VBG * (OOV(dec)/255) 2014-2015 Microchip Technology Inc. DS20005281B-page 39 MCP19114/5 The A/D converter Calibration Word 8 can be used to improve OVREF accuracy. An ADC measurement target (target in Example 6-1) is obtained by adding the analog MUX buffer offset (BUOFFSET) to the desired OVREF voltage (OVREFTARGET) and multiplying the result by the ADC gain (GADC). OVREF is adjusted until the ADC reading equals or exceeds the target. \ An example of OVREF-calibration firmware is as follows: EXAMPLE 6-1: EXAMPLE OVREF CORRECTION ROUTINE //Assumes that calibration words ADCCAL and BUFF are read from //program memory into variables ADCC and BUOFFSET, respectively. extern volatile unsigned int ADRES @ 0x01C; #define OVREFTARGET (unsigned int) 0x0800 // OVREF Target = 2.0 unsigned long tmp = (unsigned long)ADCC*(OVREFTARGET+BUOFFSET); // ADC Reference + Buffer Offset V unsigned int target = (unsigned int)(tmp >> 15) - 3; // Subtract ADC typical offset error 3 unsigned int adc; OVREFCON = 0x00; // Clear OVREFCON ADCON0 // Enable and set channel to OVREF = 0x09; do { // Adjust OVREFCON OVREFCON++; NOP(); NOP(); adc = 0; for (unsigned char i = 4; i > 0; i--) { ADCON0bits.GO_nDONE = 1; while(ADCON0bits.GO_nDONE); adc += ADRES; } adc >>= 2; } while ((adc < target) && (OVREFCON != 0xFF)); Note 1: In this example, the LSb weight of OVREFTARGET is set to 1/(210) volt. Users can choose their own resolution depending on their accuracy requirement. The digital value of 2.0V is determined as follows: TRUNC(2.0 x 210) = 2048 (0x0800 hex). DS20005281B-page 40 2014-2015 Microchip Technology Inc. MCP19114/5 6.3 Desaturation Detection for Quasi-Resonant Operation The DESATCON register holds the setup control bits for this module. Common control bits are the polarity edge trigger for the interrupt flag <CDSINTP><CDSINTN>, comparator output polarity control <CDSPOL>, output enable <CDSOE> and output status <CDSOUT> bit. As with the other comparator modules, the CDSIF is independent of the CDSOE enable bit. On the front end connected to the DESAT comparator noninverting input, there is a two-channel MUX that connects either to the DESATP pin or to the fixed internally generated band gap voltage. Additionally, the input offset voltage of the DESAT comparator is factory-trimmed to within ±1 mV typically. These factory-trimmed values are stored in the CALWD2 register at address 2081h. Firmware must read these values into the DSTCAL register (196h). If more offset is desired, the user can adjust the values written to the DSTCAL per their implementation. The MCP19114/5 have been designed with a built-in desaturation detection comparator module custom made for quasi-resonant topologies. This is especially useful for LED-type applications. Through the use of the MCP19114/5, both synchronous and asynchronous quasi-resonant topologies can be implemented. The DESAT comparator module has the same features as the UVLO/OVLO and OV comparator modules, except that it includes some additional programmable parameters. REGISTER 6-6: DESATCON: DESATURATION COMPARATOR CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CDSMUX CDSWDE Reserved CDSPOL CDSOE CDSOUT CDSINTP CDSINTN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CDSMUX: DESAT Comparator Module Multiplexer channel selection bit 1 = BG Selected 0 = DESATP Selected (Default) bit 6 CDSWDE: DESAT Comparator Watch Dog Enable bit 1 = Watch Dog signal enables PWM Reset 0 = Watch Dog signal does Not allow PWM reset bit 5 Reserved bit 4 CDSPOL: DESAT Comparator Polarity Select bit 1 = DESAT Comparator output is inverted 0 = DESAT Comparator output is Not inverted bit 3 CDSOE: DESAT Comparator output enable bit 1 = DESAT Comparator output PWM is enabled 0 = DESAT Comparator output PWM is Not enabled bit 2 CDSOUT: DESAT Comparator Output Status bit If CDSPOL = 1 (inverted polarity) 1 = CDSVP < CDSVN (DESAT Detected) 0 = CDSVP > CDSVN (DESAT Not Detected) If CDSPOL = 0 (noninverted polarity) 1 = CDSVP > CDSVN (DESAT Not Detected) 0 = CDSVP < CDSVN (DESAT Detected) bit 1 CDSINTP: CDSIF Comparator Interrupt on Positive Going Edge Enable bit 1 = The CDSIF interrupt flag will be set upon a positive going edge 0 = No CDSIF interrupt flag will be set upon a positive going edge bit 0 CDSINTN: CDSIF Comparator Interrupt on Negative Going Edge Enable bit 1 = The CDSIF interrupt flag will be set upon a negative going edge 0 = No CDSIF interrupt flag will be set upon a negative going edge 2014-2015 Microchip Technology Inc. DS20005281B-page 41 MCP19114/5 6.4 Primary Input Current Offset Adjust Primary input current offset adjust provides the ability to add offset to the primary input current signal, thus setting a peak primary current limit. This offset adjust is controlled using the four bits in the ICOACON register. REGISTER 6-7: ICOACON: INPUT CURRENT OFFSET ADJUST CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x — — — — ICOAC3 ICOAC2 ICOAC1 ICOAC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ICOAC<3:0>: Input current offset adjustment Configuration bits 0000 = 0 mV 0001 = 50 mV 0010 = 100 mV 0011 = 150 mV 0100 = 200 mV 0101 = 250 mV 0110 = 300 mV 0111 = 350 mV 1000 = 400 mV 1001 = 450 mV 1010 = 500 mV 1011 = 550 mV 1100 = 600 mV 1101 = 650 mV 1110 = 700 mV 1111 = 750 mV DS20005281B-page 42 2014-2015 Microchip Technology Inc. MCP19114/5 6.5 Leading Edge Blanking The adjustable Leading Edge Blanking (LEB) is used to blank primary current spikes resulting from primary switch turn-on. Implementing adjustable LEB allows the system to ignore turn-on noise to best suit the application without primary current sense distortion from RC filtering. There are four settings available for LEB, including zero. These settings are controlled via two bits in the ICLEBCON register. REGISTER 6-8: ICLEBCON: INPUT CURRENT LEADING EDGE BLANKING CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-x R/W-x — — — — — — ICLEBC1 ICLEBC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 ICLEBC<1:0>: Input current Leading Edge Blanking Configuration bits 00 = 0 ns 01 = 50 ns 10 = 100 ns 11 = 200 ns 2014-2015 Microchip Technology Inc. DS20005281B-page 43 MCP19114/5 6.6 Slope Compensation A negative voltage slope is added to the output of the error amplifier. This is done to prevent subharmonic instability when: 1. 2. the operating duty cycle is greater than 50% wide changes in the duty cycle occur The amount of negative slope added to the error amplifier output is controlled by slope compensation slew rate control bits. The slope compensation is enabled by clearing the SLPBY bit in the SLPCRCON register. REGISTER 6-9: SLPCRCON: SLOPE COMPENSATION RAMP CONTROL REGISTER U-0 R/W-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — SLPBY SLPS5 SLPS4 SLPS3 SLPS2 SLPS1 SLPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 SLPBY: Slope Compensation Bypass Control bit 1 = Slope compensation is Bypassed 0 = Slope compensation is not Bypassed bit 5-0 SLPS<5:0>: Slope Compensation Slew Rate Control bits SLPS (mV/µs) = 4.1505 mV/µs * e0.0739*(dec) DS20005281B-page 44 2014-2015 Microchip Technology Inc. MCP19114/5 6.7 MOSFET Driver Programmable Dead Time FIGURE 6-1: The turn-on dead time of both PDRV and SDRV low-side drive signals can be configured independently to allow different MOSFETs and circuit board layouts to be used to construct an optimized system (refer to Figure 6-1). PDRV PDT SDT Clearing the PDRVBY and SDRVBY bits in the PE1 register enables the PDRV and SDRV low-side dead timers respectively. The amount of dead time added is controlled in the DEADCON register. REGISTER 6-10: MOSFET DRIVER DEAD TIME SDRV DEADCON: DRIVER DEAD TIME CONTROL REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x PDRVDT3 PDRVDT2 PDRVDT1 PDRVDT0 SDRVDT3 SDRVDT2 SDRVDT1 SDRVDT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 PDRVDT<3:0>: PDRV Dead Time Configuration bits (tTD_1) 0000 = 16 ns delay 0001 = 32 ns delay 0010 = 48 ns delay 0011 = 64 ns delay 0100 = 80 ns delay 0101 = 96 ns delay 0110 = 112 ns delay 0111 = 128 ns delay 1000 = 144 ns delay 1001 = 160 ns delay 1010 = 176 ns delay 1011 = 192 ns delay 1100 = 208 ns delay 1101 = 224 ns delay 1110 = 240 ns delay 1111 = 256 ns delay bit 3-0 SDRVDT<3:0>: SDRV Dead Time Configuration bits (tTD_2) 0000 = 16 ns delay 0001 = 32 ns delay 0010 = 48 ns delay 0011 = 64 ns delay 0100 = 80 ns delay 0101 = 96 ns delay 0110 = 112 ns delay 0111 = 128 ns delay 1000 = 144 ns delay 1001 = 160 ns delay 1010 = 176 ns delay 1011 = 192 ns delay 1100 = 208 ns delay 1101 = 224 ns delay 1110 = 240 ns delay 1111 = 256 ns delay 2014-2015 Microchip Technology Inc. DS20005281B-page 45 MCP19114/5 6.8 Output Regulation Reference Voltage Configuration The VREFCON register controls the error amplifier reference voltage. This reference is used to set the current or voltage regulation set point. VREFCON holds the digital value used by an 8-bit linear DAC setting the analog equivalent that gets summed with the pedestal voltage (VZC) at the noninverting node of the error amplifier. VZC is equal to the band gap voltage (1.23V). The output of the current sense amplifier A2 is also raised on the pedestal voltage, effectively canceling its effect on the input. The pedestal is implemented throughout the analog control loop to improve accuracy at low levels. The VREF DAC can be adjusted in 255 steps of 4.8 mV/step. REGISTER 6-11: VREFCON: CURRENT/VOLTAGE REGULATION SET POINT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VREF7 VREF6 VREF5 VREF4 VREF3 VREF2 VREF1 VREF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 VREF<7:0>: Voltage-Controlling Current Regulation Set Point bits VREF(V) = VBG * (VREF(dec)/255) To ensure the best regulation accuracy while implementing the Current Sense Amplifier (A2), the initial gain error must be considered. An 8-bit factory-stored calibration value A2CAL<7:0> has been stored in CALWD10 at 208Bh. This value can be used to compensate for A2 gain error by adjusting the VREF command. EXAMPLE 6-2: To get the final commanded value, the CALWD10 value gets multiplied by the original VREF decimal command using the VREF expression, resulting in a 16-bit word. Rotating the 16 bit result right produces the final compensated command in the least significant byte. The most significant byte is unused. An example of the firmware is as follows: EXAMPLE A2 GAIN CORRECTION //Assumes that calibration word A2CAL has been read into variable A2COMP unsigned int VREF1_TEMP = VREFCON*A2COMP; // A2 Gain compensate for VREFCON VREF1_TEMP >>= 7; VREF1_TEMP &= 0x00FF; VREFCON = VREF1_TEMP; DS20005281B-page 46 2014-2015 Microchip Technology Inc. MCP19114/5 6.9 VREF2 Voltage Reference connect VREF2 to GPB1. In Stand-Alone mode, VREF2 is not accessible. VREFCON2 holds the digital value used to set the VREF2 DAC. Since this reference is intended to go off chip, there is no pedestal offset associated with it and it is referenced to GND. It is an 8-bit linear DAC and has a range from 0V to 1.23V (BG) equating to 255 steps at 4.8 mV/step. The VREF2CON register controls a second reference DAC that can be used externally. For example, it can be sent off chip and used to set the current regulation set point for a MCP1631 Pulse-Width Modulator. The MCP19114/5 must be configured in Master Mode with bits MSC<0:1> = 01 in the MODECON register to VREF2CON: VREF2 VOLTAGE SET POINT REGISTER REGISTER 6-12: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VREF27 VREF26 VREF25 VREF24 VREF23 VREF22 VREF21 VREF20 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 VREF2<7:0>: Voltage Controlling Current Regulation Set point bits VREF2(V) = VBG * (VREF2(dec)/255) The A/D converter Calibration Word 8 can be used to improve VREF2 accuracy. An ADC measurement target (target in Example 6-3) is obtained by multiplying the desired VREF2 voltage (VREF2TARGET) by the ADC gain (ADCC). VREF2 is adjusted until the ADC reading equals or exceeds the target. An example of VREF2- correction firmware is as follows: EXAMPLE 6-3: VREF2 CORRECTION ROUTINE // Assumes that the calibration word ADCCAL has been read into variable ADCC extern volatile unsigned int ADRES @ 0x01C; #define VREF2TARGET (unsigned int) 0x02CC // VREF2 Target = 0.7 V (1) unsigned long tmp = (unsigned long)ADCC*VREF2TARGET; // ADC Reference unsigned int target = (unsigned int)(tmp >> 15) - 3; // Subtract ADC typical offset error 3 unsigned int adc; VREF2CON = 0x00; // Clear VREF2CON ADCON = 0x71; // Enable ADC and set channel to GPB1/VREF2 do { // Adjust VREF2CON VREF2CON++; NOP(); NOP(); adc = 0; for (unsigned char i = 4; i > 0; i--) { ADCON0bits.GO_nDONE = 1; while(ADCON0bits.GO_nDONE); adc += ADRES; } adc >>= 2; } while ((adc < target) && (VREF2CON != 0xFF)); Note 1: In this example, the LSb weight of VREF2TARGET is set to 1/(210) Volt. Users can choose their own resolution depending on their accuracy requirement. The digital value of 0.7V is determined as follows: TRUNC(0.7 x 210) = 716 (0x02CC hex). 2014-2015 Microchip Technology Inc. DS20005281B-page 47 MCP19114/5 6.10 Analog Peripheral Control 6.10.3 The MCP19114/5 have various analog peripherals. These peripherals can be configured to allow customizable operation. Refer to Register 6-13 for more information. 6.10.1 A high-impedance pull-up on the ISP pin can be configured by setting the <ISPUEN> bit in the PE1 register. When set, the ISP pin is internally pulled-up to VDD. Refer to Register 6-13 for details. MOSFET GATE DRIVER ENABLES 6.10.4 The MCP19114/5 can enable and/or disable the MOSFET gate driver outputs for the primary drive (PDRV) and the secondary drive (SDRV) independently. Setting the <PDRVEN> bit in the PE1 register enables the primary drive. Setting the <SDRVEN> bit in the PE1 register enables the secondary drive. Refer to Register 6-13 for details. 6.10.2 PWM STEERING The MCP19114/5 have additional control circuitry to allow open-loop repositioning of the output. The PWMSTR_PEN bit enables a primary-only PWM signal of fixed frequency and duty cycle to reposition the output voltage up. The PWMSTR_SEN bit enables a secondary-only PWM signal of fixed frequency and duty cycle to reposition the output voltage down. When repositioning output voltage down, the output overvoltage protection must be active along with PWMSTR_SEN for the PWM to pulse the SDRV. Frequency and duty cycle are controlled through TMR2 registers PR2 and TMR1L. PWMSTPR_PEN and PWMSTR_SEN should never be active at the same time, therefore the PWMSTPR_PEN is the dominant bit. For quasi-resonant operation during open-loop repositioning, the DESAT comparator output should be disabled with the <CDSOE> bit in the DEADCON register. MOSFET DRIVER DEAD TIME As described in Section 6.7 “MOSFET Driver Programmable Dead Time”, the MOSFET drive dead time can be adjusted. The dead time can be set independently for each driver from 16 ns to 256 ns in increments of 16 ns using the DEADCON register. Dead time can also be disabled for each driver independently by setting the bypass bits <PDRVBY> and <SDRVBY> in the PE1 register. REGISTER 6-13: SECONDARY CURRENT POSITIVE SENSE PULL-UP PE1: ANALOG PERIPHERAL ENABLE1 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 PDRVEN SDRVEN PDRVBY SDRVBY — ISPUEN R/W-0 R/W-0 PWMSTR_PEN PWMSTR_SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PDRVEN: PDRV Gate Drive Enable bit 1 = ENABLED 0 = DISABLED bit 6 SDRVEN: SDRV Gate Drive Enable bit 1 = ENABLED 0 = DISABLED bit 5 PDRVBY: PDRV Dead Time Bypass bit 1 = PDRV dead time is bypassed 0 = PDRV dead time is not bypassed bit 4 SDRVBY: SDRV Dead Time Bypass bit 1 = SDRV dead time is bypassed 0 = SDRV dead time is not bypassed. bit 3 Unimplemented: Read as ‘0’ bit 2 ISPUEN: ISP Weak Pull-Up Enable bit 1 = ISP weak pull-up is enabled 0 = ISP weak pull-up is disabled DS20005281B-page 48 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 6-13: PE1: ANALOG PERIPHERAL ENABLE1 CONTROL REGISTER (CONTINUED) bit 1 PWMSTR_PEN: PDRV PWM Steering bit 1 = Enables open-loop PWM control to the PDRV 0 = Disables open-loop PWM control to the PDRV bit 0 PWMSTR_SEN: SDRV PWM Steering bit 1 = Enables open-loop PWM control to the SDRV 0 = Disables open-loop PWM control to the SDRV 6.11 Analog Blocks Enable Control 6.11.2 The error amplifier can be disabled such that its output is parked to a known state. The <EADIS> bit defaults to zero and the error amp is enabled during normal operation. In case the user wants to disable the error amplifier, setting the EADIS bit parks the error amplifier output to just below the low clamp voltage. Under normal operation, the error amplifier output runs between 2 * BG (upper clamp value) and 1 * BG – 150 mV (lower clamp value). The analog feedback circuitry utilizes an offset pedestal (1 * BG) to improve accuracy at low levels. Various analog circuit blocks can be enabled or disabled, as shown in the ABECON register. The ABECON register also contains bits controlling analog and digital test signals. These signals can be configured to GPA0. Setting the <DIGOEN> bit enables the digital test signals to be connected to GPA0. <DSEL2:0> selects the digital channels. Setting <ANAOEN> enables the analog test signals to be connected to GPA0. If <ANAOEN> and <DIGOEN> both get set, the DIGOEN bit takes priority. When ANAOEN is not set, the analog test signals are connected to the internal ADC. The analog test channel selections are controlled through the ADCON0 register. 6.11.1 ERROR AMPLIFIER DISABLE MOSFET DRIVER UNDERVOLTAGE LOCKOUT SELECTION The MOSFET gate drivers have internal undervoltage protection that is controlled by the <DRUVSEL> bit in the ABECON register. Since the gate drive supply is provided externally through the VDR pin, the drivers are capable of driving logic level FETs or higher 10V (13.5V maximum) FETs. <DRUVSEL> defaults to clear, therefore selecting a gate drive UVLO of 2.7V. Setting <DRUVSEL> selects the higher 5.4V gate drive UVLO. Refer to Section 4.2 “Electrical Characteristics” for additional electrical specifications. REGISTER 6-14: ABECON: ANALOG BLOCK ENABLE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 DIGOEN DSEL2 DSEL1 DSEL0 DRUVSEL — EADIS ANAOEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DIGOEN: DIG Test MUX to GPA0 connection control 1 = DIG Test MUX output is connected to external pin GPA0 0 = DIG Test MUX output is not connected to external pin GPA0 2014-2015 Microchip Technology Inc. DS20005281B-page 49 MCP19114/5 REGISTER 6-14: ABECON: ANALOG BLOCK ENABLE CONTROL REGISTER (CONTINUED) bit 6-4 DSEL<2:0> 000 = QRS (Output of DESAT comparator) 001 = PWM_L (PWM output after monostable) 010 = PWM (Oscillator output from the micro-controller) 011 = TMR2EQ (When TMR2 equals PR2) 100 = OV (Overvoltage comparator output) 101 = SWFRQ (Switching Frequency Output) 110 = SDRV_ON_ONESHOT (200 nS one-shot signal to reset WDM logic) 111 = Unimplemented bit 3 DRUVSEL: Selects gate drive undervoltage lockout level 1 = Gate Drive UVLO set to 5.4V 0 = Gate Drive UVLO set to 2.7V bit 2 Unimplemented: Read as ‘0’ bit 1 EADIS: Error Amplifier Disable bit 1 = Disables the error amplifier (Output parked low, clamped to 1 * BG) 0 = Enables the error amplifier (Normal operation) bit 0 ANAOEN: Analog MUX Output Control bit 1 = Analog MUX output is connected to external pin GPA0 0 = Analog MUX output is not connected to external pin GPA0 DS20005281B-page 50 2014-2015 Microchip Technology Inc. MCP19114/5 6.12 Mode and RFB MUX Control The MODECON register controls the Master/Slave configuration and the internal resistor feedback MUX for the current sense amplifier while in quasi-resonant mode. In Master/Slave mode, it allows the VREF2 signal of the Master MCP19115 device to be buffered and connected to a GPIO pin. This output signal can be connected to a Slave PWM driver (MCP1631) at the VREF input to regulate current via the Slave PWM Controller. In Stand-Alone mode, the VREF2 unity gain buffer is not connected to a separate GPIO Pin. The RFB MUX selects the output of A2 current sense amplifier to be connected to the internal 5 k feedback resistor (quasi-resonant) or to the ISOUT pin. REGISTER 6-15: MODECON: MASTER/SLAVE AND RFB MUX CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 MSC1 MSC0 RFB — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 MSC<1:0>: Master/Slave Configuration bits 00 = Device set as stand-alone unit 01 = Device set as MASTER 10 = Device set as SLAVE 11 = RESERVED bit 5 RFB: Current Sense Amplifier (A2) output resistor feedback MUX Configuration bit 0 = RFB_INT 5 k 1 = ISOUT bit 4-0 Unimplemented: Read as ‘0’ 2014-2015 Microchip Technology Inc. DS20005281B-page 51 MCP19114/5 NOTES: DS20005281B-page 52 2014-2015 Microchip Technology Inc. MCP19114/5 7.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C. 5.10 6.0 5.09 5.9 VIN = 32V 5.8 VDD Voltage (V) Quiescent Current (mA) 6.1 VIN = 25V 5.7 5.6 VIN = 12V 5.5 5.07 5.06 -40 -25 -10 5 FIGURE 7-1: +25°C Non-Switching VIN = 6V 5.3 +125°C 5.05 5.04 5.4 -40°C 5.08 5.03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Current (mA) 20 35 50 65 80 95 110 125 Temperature (°C) IQ vs. Temperature. FIGURE 7-4: 35 Load Regulation. 0.8 30 VDD Dropout Voltage (V) Sleep Current (μA) VIN = 32V VIN = 25V 25 VIN = 12V 20 15 VIN = 6V 10 0.7 0.6 +125°C 0.5 +25°C 0.4 0.3 0.2 -40°C 0.1 0.0 -40 -25 -10 5 FIGURE 7-2: Mode. 20 35 50 65 80 Temperature (°C) 95 110 125 IQ vs. Temperature in Sleep 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Current (mA) FIGURE 7-5: VDD Dropout Voltage vs. Output Current (mA). 0.45 5.10 IDD = 1 mA -40°C VDD (V) 5.08 5.07 5.06 +125°C 5.05 +25°C 5.04 6 0.40 0.35 0.30 0.25 0.20 0.15 0.10 8 10 12 14 16 18 20 22 24 26 28 30 32 VIN (V) FIGURE 7-3: VDD Dropout Voltage (V) IDD = 20 mA 5.09 Line Regulation. 2014-2015 Microchip Technology Inc. -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (°C) FIGURE 7-6: Temperature. VDD Dropout Voltage vs. DS20005281B-page 53 MCP19114/5 Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C. 9.5 250 8.5 8.0 200 +125°C 150 100 50 4 6 8 10 Code (d) 7.0 12 14 -40 -25 -10 16 VDR = 5V 7.5 6.0 7.0 RDSon ( ) RPDRV-SOURCE 4.5 20 35 50 65 80 95 110 125 Temperature (°C) 8.0 VDR = 10V 5.5 5 FIGURE 7-10: Sourcing Output Driver RDSon vs. Temperature. 6.5 4.0 6.5 6.0 RPDRV-SINK 5.5 5.0 3.5 RSDRV-SOURCE -40 -25 -10 5 RSDRV-SINK 4.5 3.0 4.0 20 35 50 65 80 95 110 125 Temperature (°C) FIGURE 7-8: Sourcing Output Driver RDSon vs. Temperature. -40 -25 -10 5 FIGURE 7-11: vs. Temperature. 20 35 50 65 80 95 110 125 Temperature (°C) Sinking Output Driver RDSon 8.08 VDR = 10V 5.5 5.0 RPDRV-SINK 4.0 RSDRV-SINK Oscillator Frequency (MHz) 6.0 3.5 RPDRV-SOURCE 4.5 2 FIGURE 7-7: Output Driver Dead Time vs. Code and Temperature. 4.5 RSDRV-SOURCE 6.5 5.0 0 RDSon () 7.0 5.5 0 RDSon () 7.5 6.0 +25°C 5.0 VDR = 5V 9.0 -40°C RDSon () PDRV/SDRV Dead Time (ns) 300 8.06 8.04 8.02 8.00 7.98 7.96 7.94 7.92 3.0 -40 -25 -10 5 FIGURE 7-9: vs. Temperature. DS20005281B-page 54 20 35 50 65 80 95 110 125 Temperature (°C) Sinking Output Driver RDSon -40 -25 -10 FIGURE 7-12: Temperature. 5 20 35 50 65 80 95 110 125 Temperature (°C) Oscillator Frequency vs. 2014-2015 Microchip Technology Inc. MCP19114/5 Note: Unless otherwise indicated, VIN = 12V, FSW = 150 kHz, TA = +25°C. 5 Output Demand = 0.984V 1.03 4.95 1.02 Maximum 1.01 1 0.99 Typical 0.98 GPIO VOUT (V) Normalized Output Demand 1.04 4.9 -40°C 4.85 4.8 +25°C 4.75 0.97 0.96 +125°C 4.7 Minimum 4.65 0.95 -40 -25 -10 5 FIGURE 7-13: vs. Temperature. 20 35 50 65 80 95 110 125 Temperature (°C) Normalized Output Demand 0 1 2 3 GPIO IOUT (mA) 4 5 FIGURE 7-16: Average GPIO Output Voltage vs. Current. Normalized Output Demand 1.08 Output Demand = 0.492V 1.06 1.04 Maximum 1.02 1 Typical 0.98 0.96 0.94 0.92 0.9 Minimum 0.88 -40 -25 -10 5 ¨%VDD – ¨%AVDD FIGURE 7-14: vs. Temperature. 20 35 50 65 80 95 110 125 Temperature (°C) Normalized Output Demand 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 Maximum Typical Minimum -40 -25 -10 FIGURE 7-15: Drift Tracking. 5 20 35 50 65 80 95 110 125 Temperature (°C) VDD vs. AVDD Temperature 2014-2015 Microchip Technology Inc. DS20005281B-page 55 MCP19114/5 NOTES: DS20005281B-page 56 2014-2015 Microchip Technology Inc. MCP19114/5 8.0 SYSTEM BENCH TESTING To allow for easier system design and bench testing, the MCP19114/5 feature a multiplexer used to output various internal analog signals. These signals can be measured on the GPA0 pin through a unity gain buffer. The configuration control of the GPA0 pin is found in the ABECON register. . REGISTER 8-1: Control of the signals present at the output of the unity gain analog buffer is found in the ADCON0 register. ADCON0: ANALOG-TO-DIGITAL CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = VIN/n analog voltage measurement (VIN/15.5328) 00001 = VREF + VZC (DAC reference voltage + VZC pedestal setting current regulation level) 00010 = OV_REF (reference for overvoltage comparator) 00011 = VBGR (band gap reference) 00100 = VS (voltage proportional to VOUT) 00101 = EA_SC (error amplifier after slope compensation output) 00110 = A2 (secondary current sense amplifier output at RFB_INT connection) 00111 = PEDESTAL (Pedestal Voltage) 01000 = RESERVED 01001 = RESERVED 01010 = IP_ADJ (IP after Pedestal and Offset Adjust (at PWM Comparator)) 01011 = IP_OFF_REF (IP Offset Reference) 01100 = VDR/n (VDR/n analog driver voltage measurement = 0.229V/V * VDR) 01101 = TEMP_SNS (analog voltage representing internal temperature) 01110 = DLL_VCON (Delay Locked Loop Voltage Reference - control voltage for dead time) 01111 = SLPCMP_REF (slope compensation reference) 10000 = Unimplemented 10001 = Unimplemented 10010 = Unimplemented 10011 = Unimplemented 10100 = Unimplemented 10101 = Unimplemented 10110 = Unimplemented 10111 = Unimplemented 11000 = GPA0/AN0 (i.e. ADDR1) 11001 = GPA1/AN1 (i.e. ADDR0) 11010 = GPA2/AN2 (i.e. Temperature Sensor Input) 11011 = GPA3/AN3 (i.e. BIN) 11100 = GPB1/AN4 11101 = GPB4/AN5 (MCP19115 Only) 11110 = GPB5/AN6 (MCP19115 Only) 11111 = GPB6/AN7 (MCP19115 Only) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: A/D Conversion Status bit 1 = A/D converter module is operating 0 = A/D converter is shut off and consumes no operating current 2014-2015 Microchip Technology Inc. DS20005281B-page 57 MCP19114/5 NOTES: DS20005281B-page 58 2014-2015 Microchip Technology Inc. MCP19114/5 9.0 DEVICE CALIBRATION Read-only memory locations 2080h through 208Fh contain factory calibration data. Refer to Section 17.0 “Flash Program Memory Control” for information on how to read from these memory locations. 9.1 Calibration Word 1 Calibration Word 1 is at memory location 2080h. The DCSRFB<6:0> bits set the offset calibration for the current sense differential amplifier (A2) when configured using the internal feedback resistor. A calibration range of ±30 mV is provided with 20h and 00h being midscale (no offset). The MSB is polarity only. Firmware must read these values and write them into the DCSCAL register to implement offset calibration. REGISTER 9-1: CALWD1: CALIBRATION WORD 1 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — DCSRFB6 DCSRFB5 DCSRFB4 DCSRFB3 DCSRFB2 DCSRFB1 DCSRFB0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-7 Unimplemented: Read as ‘0’ bit 6-0 DCSRFB<6:0>: Input Differential Current Sense Calibration bits when configured using internal feedback resistor 2014-2015 Microchip Technology Inc. DS20005281B-page 59 MCP19114/5 9.2 Calibration Word 2 Calibration Word 2 is at memory location 2081h. It contains the calibration bits for the desaturation comparator current measurement input offset. Firmware must read these values and write them into the DSTCAL register to implement the factory offset calibration. The factory offset calibration will minimize offset voltage. The desaturation comparator is one of the few examples where the user may want to implement their own offset voltage values. Writing user defined values to the DSTCAL register provides this flexibility. This register also contains the trim bits needed to trim the internal 5k feedback resistor to within 2% using the <RFBT5:0> bits. Firmware must read these values and write them into the RFBTCAL register to implement the factory-trimmed feedback resistor value. REGISTER 9-2: CALWD2: CALIBRATION WORD 2 REGISTER U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — DST4 DST3 DST2 DST1 DST0 bit 13 bit 8 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — RFBT5 RFBT4 RFBT3 RFBT2 RFBT1 RFBT0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13 Unimplemented: Read as ‘0’ bit 12-8 DST<4:0>: Desaturation Comparator Current Measure Offset calibration bits 11111 = Maximum negative offset calibration (-30 mV) • • • 10000 = Mid scale (0 mV) 00000 = Mid scale (0 mV) • • • 01111 = Maximum positive offset calibration (+30 mV) bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RFBT<5:0>: Internal Feedback Resistor Trim bits DS20005281B-page 60 2014-2015 Microchip Technology Inc. MCP19114/5 9.3 Calibration Word 3 The VRO<5:0> bits at memory location 2082h calibrate the offset of the buffer amplifier of the output voltage regulation reference set point (VREF). Firmware must read these values and write them to the VROCAL register for proper calibration. The BGR<3:0> bits at memory location 2082h calibrate the band gap reference. Firmware must read these values and write them to the BGRCAL register for proper calibration. REGISTER 9-3: CALWD3: CALIBRATION WORD 3 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 VRO5 VRO4 VRO3 VRO2 VRO1 VRO0 bit 13 bit 8 U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — — — BGR3 BGR2 BGR1 BGR0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-8 VRO<5:0>: Reference voltage (VREF) offset calibration bits bit 7-4 Unused: Read as ‘0’ bit 3-0 BGR<3:0>: Band gap reference calibration bits 9.4 x = Bit is unknown Calibration Word 4 The TTA<3:0> bits at memory location 2083h contain the calibration bits for the factory-set overtemperature threshold. Firmware must read these values and write them into the TTACAL register for proper calibration. REGISTER 9-4: CALWD4: CALIBRATION WORD 4 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 — — — — TTA3 TTA2 TTA1 TTA0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-4 Unimplemented: Read as ‘0’ bit 3-0 TTA<3:0>: Overtemperature threshold calibration bits 2014-2015 Microchip Technology Inc. x = Bit is unknown DS20005281B-page 61 MCP19114/5 9.5 Calibration Word 5 The TANA<9:0> bits at memory location 2084h contain the ADC reading from the internal temperature sensor when the silicon temperature is at 30°C. The temperature coefficient of the internal temperature sensor is 16 mV/°C. REGISTER 9-5: CALWD5: CALIBRATION WORD 5 REGISTER U-0 U-0 U-0 U-0 R/P-1 R/P-1 — — — — TANA9 TANA8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 TANA7 TANA6 TANA5 TANA4 TANA3 TANA2 TANA1 TANA0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-10 Unimplemented: Read as ‘0’ bit 9-0 TANA<9:0>: ADC reading of internal silicon temperature at 30°C calibration bits 9.6 Calibration Word 6 The FCAL<6:0> bits at memory location 2085h set the internal oscillator calibration. Firmware must read these values and write them to the OSCCAL register for proper calibration. REGISTER 9-6: CALWD6: CALIBRATION WORD 6 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unused bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-7 Unimplemented: Read as ‘0’ bit 6-0 FCAL<6:0>: Internal oscillator calibration bits DS20005281B-page 62 x = Bit is unknown 2014-2015 Microchip Technology Inc. MCP19114/5 9.7 Calibration Word 7 The DCS<6:0> bits at memory location 2086h store the factory-set offset calibration for the current sense differential amplifier (A2) when configured using ISOUT. A configuration range of +/-30 mV is provided with 20h and 00h being midscale (no offset). The MSB is polarity only. Firmware must read this value into the DCSCAL register to implement offset calibration. If using the internal feedback resistor, refer to Register 9-1. REGISTER 9-7: CALWD7: CALIBRATION WORD 7 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — DCS6 DCS5 DCS4 DCS3 DCS2 DCS1 DCS0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-7 Unimplemented: Read as ‘0’ bit 6-0 DCS<6:0>: Differential Current Sense Amplifier Calibration bits when used with ISOUT. 2014-2015 Microchip Technology Inc. DS20005281B-page 63 MCP19114/5 9.8 Calibration Word 8 The ADCCAL<13:0> bits at memory location 2089h contain the calibration bits for the A/D converter. Calibration Word 8 (ADCCAL <13:0>) contains the factory measurement of the full scale ADC Reference. The value represents the number of A/D converter counts per volt. ADCC<4:0> bits represent the fraction of an A/D converter count, which can provide additional precision when oversampling the ADC for enhanced resolution. This calibration word can be used to calibrate signals read by the Analog-to-Digital Converter. REGISTER 9-8: CALWD8: CALIBRATION WORD 8 REGISTER R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCC13 ADCC12 ADCC11 ADCC10 ADCC9 ADCC8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 ADCC7 ADCC6 ADCC5 ADCC4 ADCC3 ADCC2 ADCC1 ADCC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-5 ADCC<13:5>: Whole number of A/D converter count 111111111 = 511 • • • 000000000 = 0 bit 4-0 ADCC<4:0>: Fraction number of A/D converter count 11111 = 0.96875 • • • 00001 = 0.03125 00000 = 0.00000 DS20005281B-page 64 x = Bit is unknown 2014-2015 Microchip Technology Inc. MCP19114/5 9.9 Calibration Word 9 Calibration Word 9 is at memory location 208Ah. The value stored at this memory location represents the offset voltage (in units of mV) of the analog test buffer. This is an 8-bit, two's complement word that can be used to compensate any signal sent through the Analog test multiplexer. See section 8.0 for test signal details. REGISTER 9-9: CALWD9: CALIBRATION WORD 9 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BUFF7 BUFF6 BUFF5 BUFF4 BUFF3 BUFF2 BUFF1 BUFF0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-8 Unimplemented: Read as ‘0’ bit 7-0 BUFF<7:0>: Analog Buffer Offset calibration bits 11111111 = Mid-scale (-1 mV) • • • 10000000 = Largest negative offset (-128 mV) 01111111 = Largest positive offset (127 mV) • • • 00000000 = Mid-scale (0 mV) 2014-2015 Microchip Technology Inc. x = Bit is unknown DS20005281B-page 65 MCP19114/5 9.10 Calibration Word 10 The A2CAL<7:0> bits at memory location 208Bh contain the calibration bits for Current Sense Amplifier (A2) Gain Error. For best regulation accuracy using this amplifier, firmware can read this value and use it to adjust the VREF command. Section 6.8 “Output Regulation Reference Voltage Configuration” for details. REGISTER 9-10: CALWD10: CALIBRATION WORD 10 REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 A2CAL7 A2CAL6 A2CAL5 A2CAL4 A2CAL3 A2CAL2 A2CAL1 A2CAL0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13-8 Unimplemented: Read as ‘0’ bit 7-0 A2CAL<7:0>: Current Sense Amplifier (A2) Gain Error Calibration bits DS20005281B-page 66 2014-2015 Microchip Technology Inc. MCP19114/5 9.11 Calibration Word 11 The HFVDD<9:0> bits at memory location 2088h stores the internal ADC reading (in counts) of VDD/2 or half VDD. This is a factory stored value at 25°C. This value can be used to calibrate ratio metric ADC measurements powered up from VDD. REGISTER 9-11: CALWD11: CALIBRATION WORD 11 REGISTER U-0 U-0 U-0 U-0 R/P-1 R/P-1 — — — — HFVDD9 HFVDD8 bit 13 bit 8 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 HFVDD7 HFVDD6 HFVDD5 HFVDD4 HFVDD3 HFVDD2 HFVDD1 HFVDD0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-10 Unimplemented: Read as ‘0’ bit 9-0 HFVDD<9:0>: Half VDD Calibration bits 2014-2015 Microchip Technology Inc. x = Bit is unknown DS20005281B-page 67 MCP19114/5 NOTES: DS20005281B-page 68 2014-2015 Microchip Technology Inc. MCP19114/5 10.0 MEMORY ORGANIZATION There are two types of memory in the MCP19114/5: • Program Memory • Data Memory - Special Function Registers (SFRs) - General-Purpose RAM 10.1 Program Memory Organization The MCP19114/5 have a 13-bit program counter capable of addressing an 8000 x 14 program memory space. Only the first 4000 x 14 (0000h-0FFFh) is physically implemented. Addressing a location above this boundary will cause a wrap-around within the first 4000 x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (refer to Figure 10-1). The width of the program memory bus (instruction word) is 14 bits. Since all instructions are a single word, the MCP19114/5 have space for 4000 instructions. FIGURE 10-1: PROGRAM MEMORY MAP AND STACK FOR MCP19114 PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-Chip Program Memory 0FFFh Shadows 000-FFFh 1000h 1FFFh User IDs(1) 2000h 2003h ICD Instruction(1) 2004h Codes(1) 2005h Device ID (hardcoded)(1) 2006h Config Word(1) 2007h Manufacturing Reserved Reserved for Manufacturing & Test(1) Calibration Words(1) 2008h 200Ah 200Bh 207Fh 2080h 208Fh 2090h Unimplemented 20FFh 2100h Shadows 2000-20FFh 3FFFh Note 1: Not code-protected. 2014-2015 Microchip Technology Inc. DS20005281B-page 69 MCP19114/5 10.1.1 READING PROGRAM MEMORY AS DATA 10.2 Data Memory Organization The RETLW instruction can be used to provide access to the tables of constants. The recommended way to create such tables is shown in Example 10-1. The data memory (refer to Figure 10-1) is partitioned into four banks, which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-7Fh in Bank 0, A0h-EFh in Bank 1 and 120h-16Fh in Bank 2 are General Purpose Registers, implemented as static RAM. All other RAM is unimplemented and returns ‘0’ when read. The RP<1:0> bits in the STATUS register are the bank select bits. EXAMPLE 10-1: EXAMPLE 10-2: There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set a Files Select Register (FSR) to point to the program memory. 10.1.1.1 RETLW Instruction constants BRW RETLW RETLW RETLW RETLW DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION ;Add Index in W to ;program counter to ;select data ;Index0 data ;Index1 data my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available, so the older table-read method must be used. BANK SELECT RP1 RP0 0 0 -> Bank 0 is selected 0 1 -> Bank 1 is selected 1 0 -> Bank 2 is selected 1 1 -> Bank 3 is selected To move values from one register to another register, the value must pass through the W register. This means that for all register-to-register moves, two instruction cycles are required. The entire data memory can be accessed either directly or indirectly. Direct addressing may require the use of the RP<1:0> bits. Indirect addressing requires the use of the FSR. Indirect addressing uses the Indirect Register Pointer (IRP) bit in the STATUS register for access to the Bank0/Bank1 or the Bank2/Bank3 areas of data memory. 10.2.1 GENERAL PURPOSE REGISTER FILE The register file is organized as 64 x 8 in the MCP19114/5. Each register is accessed, either directly or indirectly, through the FSR (refer to Section 10.5 “Indirect Addressing, INDF and FSR Registers”). DS20005281B-page 70 2014-2015 Microchip Technology Inc. MCP19114/5 10.2.2 CORE REGISTERS 10.2.2.1 The core registers contain the registers that directly affect the basic operation. The core registers can be addressed from any bank. These registers are listed below in Table 10-1. For detailed information, refer to Table 10-2. TABLE 10-1: CORE REGISTERS Addresses BANKx x00h, x80h, x100h, or x180h INDF x02h, x82h, x102h, or x182h PCL x03h, x83h, x103h, or x183h STATUS x04h, x84h, x104h, or x184h FSR x0Ah, x8Ah, x10Ah, or x18Ah PCLATH x0Bh, x8Bh, x10Bh, or x18Bh INTCON STATUS Register The STATUS register contains: • the arithmetic status of the ALU • the Reset status • the bank select bits for data memory (RAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. REGISTER 10-1: R/W-0 STATUS: STATUS REGISTER R/W-0 IRP RP1 R/W-0 RP0 R-1 TO R-1 PD R/W-x R/W-x R/W-x Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR x = Bit is unknown ‘0’ = Bit is cleared ‘1’ = Bit is set bit 7 IRP: Register Bank Select bit (used for Indirect addressing) 1 = Bank 2 & 3 (100h - 1FFh) 0 = Bank 0 & 1 (00h - FFh) bit 6-5 RP<1:0>: Register Bank Select bits (used for Direct addressing) 00 =Bank 0 (00h - 7Fh) 01 =Bank 1 (80h - FFh) 10 =Bank 2 (100h - 17Fh) 11 =Bank 3 (180h - 1FFh) bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time out occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit in the source register. 2014-2015 Microchip Technology Inc. DS20005281B-page 71 MCP19114/5 REGISTER 10-1: STATUS: STATUS REGISTER (CONTINUED) bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 10.2.3 For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit in the source register. SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (refer to Figure 10-2). These registers are static RAM. The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the microcontroller core are described in this section. Those related to the operation of the peripheral features are described in the associated section for that peripheral feature. DS20005281B-page 72 2014-2015 Microchip Technology Inc. MCP19114/5 10.3 DATA MEMORY FIGURE 10-2: MCP19114/5 DATA MEMORY MAP File Address Indirect addr.(1) TMR0 PCL STATUS FSR PORTGPA PORTGPB PIR1 PIR2 PCON PCLATH INTCON TMR1L TMR1H T1CON TMR2 T2CON PR2 PWMPHL PWMPHH PWMRL PWMRH VREFCON VREF2CON OSCTUNE ADRESL ADRESH ADCON0 ADCON1 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h General Purpose Register File Address Indirect addr. (1) OPTION_REG PCL STATUS FSR TRISGPA TRISGPB PIE1 PIE2 PCLATH INTCON VINUVLO VINOVLO VINCON CC1RL CC1RH CC2RL CC2RH CCDCON DESATCON OVCON OVREFCON DEADCON SLPCRCON ICOACON ICLEBCON General Purpose Register 80 Bytes 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h File Address Indirect addr.(1) TMR0 PCL STATUS FSR WPUGPA WPUGPB PE1 MODECON ABECON PCLATH INTCON SSPADD SSPBUF SSPCON1 SSPCON2 SSPCON3 SSPMSK1 SSPSTAT SSPADD2 SSPMSK2 General Purpose Register 100h 101h 102h 103h 104h 105h 106h 107h 108h 109h 10Ah 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 11Dh 11Eh 11Fh 120h File Address Indirect addr. (1) OPTION_REG PCL STATUS FSR IOCA IOCB ANSELA ANSELB PCLATH INTCON PORTICD(2) TRISICD(2) ICKBUG(2) BIGBUG(2) PMCON1 PMCON2 PMADRL PMADRH PMDATL PMDATH DSTCAL RFBTCAL OSCCAL DCSCAL TTACAL BGRCAL VROCAL Reserved 180h 181h 182h 183h 184h 185h 186h 187h 188h 189h 18Ah 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 19Dh 19Eh 19Fh 1A0h 80 bytes Accesses Bank 0 96 Bytes 7Fh Bank 0 EFh F0h Accesses Bank 0 FFh Bank 1 16F 170h Accesses Bank 0 17Fh Bank2 1EF 1F0h 1FFh Bank3 Unimplemented data memory locations, read as '0'. Note 1: 2: Not a physical register. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. 2014-2015 Microchip Technology Inc. DS20005281B-page 73 Adr Name MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other resets(1) Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 01h TMR0 Timer0 Module’s Register xxxx xxxx uuuu uuuu 02h PCL Program Counter's (PC) Least Significant byte 0000 0000 0000 0000 03h STATUS 000q quuu 04h FSR 05h IRP RP1 RP0 TO PORTGPA GPA7 GPA6 GPA5 06h PORTGPB GPB7 GPB6 GPB5 GPB4 — — 07h PIR1 — ADIF BCLIF SSPIF CC2IF CC1IF 08h PIR2 CDSIF — — OTIF OVIF DRUVIF — — — PD Z DC C 0001 1xxx xxxx xxxx uuuu uuuu GPA1 GPA0 xxx- xxxx uuu- uuuu GPB1 GPB0 xxxx --xx uuuu --uu TMR2IF TMR1IF -000 0000 -000 0000 OVLOIF UVLOIF 0--0 0000 0--0 0000 POR BOR ---- --qq ---- --uu Indirect data memory address pointer 09h PCON — — — 0Ah PCLATH — — — 0Bh INTCON GIE PEIE T0IE 0Ch TMR1L 0Dh TMR1H 0Eh T1CON 0Fh TMR2 10h T2CON 11h PR2 12h — 13h — GPA3 GPA2 Write buffer for upper 5 bits of program counter 2014-2015 Microchip Technology Inc. ---0 0000 ---0 0000 0000 000x 0000 000u Holding register for the Least Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu Holding register for the Most Significant byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu --00 --00 --uu --uu 0000 0000 uuuu uuuu ---- -000 ---- -000 Timer2 Module Period Register 1111 1111 1111 1111 Unimplemented — — PWMPHL SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 14h PWMPHH SLAVE Phase Shift Register xxxx xxxx uuuu uuuu 15h PWMRL PWM Register Low Byte xxxx xxxx uuuu uuuu 16h PWMRH PWM Register High Byte xxxx xxxx uuuu uuuu 17h — Unimplemented — — 18h — Unimplemented — — 19h VREFCON VREF7 VREF6 VREF5 VREF4 VREF3 VREF2 VREF1 VREF0 0000 0000 0000 0000 1Ah VREF2CON VREF27 VREF26 VREF25 VREF24 VREF23 VREF22 VREF21 VREF20 0000 0000 0000 0000 1Bh OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---0 0000 1Ch ADRESL Least significant 8 bits of the A/D result xxxx xxxx uuuu uuuu 1Dh ADRESH Most significant 2 bits of the A/D result 0000 00xx 0000 00uu 1Eh ADCON0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON -000 0000 -000 0000 1Fh ADCON1 — ADCS2 ADCS1 ADCS0 — — — — -000 ---- -000 ---- INTE IOCE — — T1CKPS1 T1CKPS0 — — — — T0IF — INTF IOCF(2) — TMR1CS TMR1ON TMR2ON T2CKPS1 T2CKPS0 Timer2 Module Register — Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2: MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists. MCP19114/5 DS20005281B-page 74 TABLE 10-2: 2014-2015 Microchip Technology Inc. TABLE 10-3: Addr MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Values on all other resets(1) xxxx xxxx uuuu uuuu 1111 1111 1111 1111 0000 0000 0000 0000 0001 1xxx 000q quuu Bank 1 80h INDF 81h OPTION_REG Addressing this location uses contents of FSR to address data memory (not a physical register) 82h PCL RAPU INTEDG T0CS T0SE PSA PS2 PS1 Program Counter's (PC) Least Significant byte 83h STATUS 84h FSR 85h TRISGPA TRISA7 TRISA6 TRISA5 — 86h TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 — — 87h PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE 88h PIE2 CDSIE — — OTIE OVIE DRUVIE OVLOIE 89h PS0 IRP RP1 RP0 TO PD Z DC C Indirect data memory address pointer — TRISA3 TRISA2 xxxx xxxx uuuu uuuu TRISA0 1110 1111 1110 1111 TRISB1 TRISB0 1111 0011 1111 0011 TMR2IE TMR1IE -000 0000 -000 0000 UVLOIE 0--0 0000 0--0 0000 TRISA1 Unimplemented 8Ah PCLATH — — — 8Bh INTCON GIE PEIE T0IE Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF IOCF(2) — — ---0 0000 ---0 0000 0000 000u — Unimplemented — — 8Dh — Unimplemented — — 8Eh — Unimplemented — — 8Fh — Unimplemented — — 90h VINUVLO UVLO0 --xx xxxx --uu uuuu 91h VINOVLO — — OVLO5 OVLO4 OVLO3 OVLO2 OVLO1 OVLO0 --xx xxxx --uu uuuu 92h VINCON UVLOEN UVLOOUT UVLOINTP UVLOINTN OVLOEN OVLOOUT OVLOINTP OVLOINTN 0x00 0x00 0u00 0u00 93h CC1RL Capture1/Compare1 Register1 x Low Byte (LSB) xxxx xxxx uuuu uuuu 94h CC1RH Capture1/Compare1 Register2 x High Byte (MSB) xxxx xxxx uuuu uuuu 95h CC2RL Capture2/Compare2 Register1 x Low Byte (LSB) xxxx xxxx uuuu uuuu 96h CC2RH Capture2/Compare2 Register2 x High Byte (MSB) xxxx xxxx uuuu uuuu 97h CCDCON xxxx xxxx uuuu uuuu 98h DESATCON 99h OVCON — — UVLO5 UVLO4 UVLO3 UVLO2 CC2M<3:0> UVLO1 CC1M<3:0> CDSMUX CDSWDE Reserved CDSPOL CDSOE CDSOUT CDSINTP CDSINTN 0000 0x00 0000 0u00 — — — — OVEN OVOUT OVINTP OVINTN ---- 0x00 ---- 0u00 DS20005281B-page 75 9Ah OVREFCON OOV7 OOV6 OOV5 OOV4 OOV3 OOV2 OOV1 OOV0 xxxx xxxx uuuu uuuu 9Bh DEADCON PDRVDT3 PDRVDT2 PDRVDT1 PDRVDT0 SDRVDT3 SDRVDT2 SDRVDT1 SDRVDT0 xxxx xxxx uuuu uuuu 9Ch SLPCRCON — SLPBY SLPS5 SLPS4 SLPS3 SLPS2 SLPS1 SLPS0 -xxx xxxx -uuu uuuu 9Dh ICOACON — — — — ICOAC3 ICOAC2 ICOAC1 ICOAC0 ---- xxxx ---- uuuu 9Eh ICLEBCON — — — — — — ICLEBC1 ICLEBC0 ---- --xx ---- --uu — — 9Fh Legend: Note 1: 2: — Unimplemented — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists. MCP19114/5 0000 000x 8Ch Adr Name MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other resets(1) Bank 2 100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx 101h TMR0 Timer0 Module’s Register xxxx xxxx uuuu uuuu 102h PCL Program Counter's (PC) Least Significant byte 0000 0000 0000 0000 103h STATUS 0001 1xxx 000q quuu 104h FSR 105h WPUGPA 106h WPUGPB 107h PE1 108h MODECON 109h ABECON IRP RP1 RP0 TO PD Z DC C Indirect data memory address pointer — — WPUA5 — WPUA3 WPUA2 WPUA1 WPUA0 xxxx xxxx uuuu uuuu --1- 1111 --u- uuuu WPUB7 WPUB6 WPUB5 WPUB4 — — WPUB1 — 1111 --1- uuuu --u- PDRVEN SDRVEN PDRVBY SDRVBY — ISPUEN PWMSTR_PEN PWMSTR_SEN 0000 -100 0000 -100 MSC1 MSC0 RFB — — — — — 001- ---- 001- ---- DIGOEN DSEL2 DSEL1 DSEL0 DRUVSEL — EADIS ANAOEN 0000 0-00 0000 0-00 ---0 0000 ---0 0000 0000 000x 0000 000u 10Ah PCLATH — — — 10Bh INTCON GIE PEIE T0IE 10Ch — Unimplemented — — 10Dh — Unimplemented — — 10Eh — Unimplemented — — 10Fh — Unimplemented — — 110h SSPADD ADD<7:0> 0000 0000 0000 0000 xxxx xxxx uuuu uuuu 0000 0000 0000 0000 Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF IOCF(2) 2014-2015 Microchip Technology Inc. 111h SSPBUF 112h SSPCON1 WCOL SSPOV SSPEN Synchronous Serial Port Receive Buffer/Transmit Register CKP 113h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 114h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 115h SSPMSK1 1111 1111 1111 1111 116h SSPSTAT 117h SSPADD2 SSPM<3:0> MSK<7:0> SMP CKE D/A P S R/W UA BF — — ADD2<7:0> 0000 0000 0000 0000 118h SSPMSK2 MSK2<7:0> 1111 1111 1111 1111 119h — Unimplemented — — 11Ah — Unimplemented — — 11Bh — Unimplemented — — 11Ch — Unimplemented — — 11Dh — Unimplemented — — 11Eh — Unimplemented — — 11Fh — Unimplemented — — Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists. 1: 2: MCP19114/5 DS20005281B-page 76 TABLE 10-4: 2014-2015 Microchip Technology Inc. TABLE 10-5: Addr MCP19114/5 SPECIAL REGISTERS SUMMARY BANK 3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Values on all other resets(1) xxxx xxxx uuuu uuuu 1111 1111 1111 1111 0000 0000 0000 0000 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu Bank 3 180h INDF 181h OPTION_REG Addressing this location uses contents of FSR to address data memory (not a physical register) 182h PCL RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Program Counter's (PC) Least Significant byte 183h STATUS 184h FSR IRP RP1 RP0 TO 185h IOCA IOCA7 IOCA6 IOCA5 — IOCA3 IOCA2 IOCA1 IOCA0 000- 0000 0000 0000 186h IOCB IOCB7 IOCB6 IOCB5 IOCB4 — — IOCB1 IOCB0 0000 -000 0000 -000 187h ANSELA — — — — ANSA3 ANSA2 ANSA1 ANSA0 ---- 1111 ---- 1111 188h ANSELB — ANSB6 ANSB5 ANSB4 — — ANSB1 — -111 --1- -111 --1- 189h — 18Ah PCLATH 18Bh INTCON PD Z DC C Indirect data memory address pointer Unimplemented — — — GIE PEIE T0IE Write buffer for upper 5 bits of program counter INTE IOCE T0IF INTF IOCF(2) — — ---0 0000 ---0 0000 0000 000x 0000 000u In-Circuit Debug Port Register xxx --xx uuuu --uu TRISICD(3) In-Circuit Debug TRIS Register 1111 0011 1111 0011 18Eh ICKBUG(3) In-Circuit Debug Register 0000 0000 000u uuuu 18Fh BIGBUG(3) In-Circuit Debug Breakpoint Register 0000 0000 uuuu uuuu 190h PMCON1 -0-- -000 -0-- -000 18Ch PORTICD 18Dh (3) — CALSEL — — — WREN WR RD 191h PMCON2 ---- ---- ---- ---- 192h PMADRL PMADRL7 PMADRL6 Program Memory Control Register 2 (not a physical register) PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000 193h PMADRH — — — — PMADRH3 PMADRH2 PMADRH1 PMADRH0 ---- -000 ---- -000 194h PMDATL PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000 195h PMDATH — — PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000 ---u uuuu DSTCAL — — — DSTCAL4 DSTCAL3 DSTCAL2 DSTCAL1 DSTCAL0 ---x xxxx RFBTCAL — — RFBCAL5 RFBCAL4 RFBCAL3 RFBCAL2 RFBCAL1 RFBCAL0 --xx xxxx --uu uuuu 198h OSCCAL — FCALT6 FCALT5 FCALT4 FCALT3 FCALT2 FCALT1 FCALT1 -xxx xxxx -uuu uuuu 199h DCSCAL — DCSCAL6 DCSCAL5 DCSCAL4 DCSCAL3 DCSCAL2 DCSCAL1 DCSCAL0 -xxx xxxx -uuu uuuu 19Ah TTACAL — — — — TTA3 TTA2 TTA1 TTA0 ---- xxxx ---- uuuu DS20005281B-page 77 19Bh BGRCAL — — — — BGRT3 BGRT2 BGRT1 BGRT0 ---- xxxx ---- uuuu 19Ch VROCAL — — — VROT4 VROT3 VROT2 VROT1 VROT0 ---x xxxx ---u uuuu 19Dh — Unimplemented — — 19Eh — Unimplemented — — 19Fh — Reserved — — Legend: Note 1: 2: 3: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation. MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will be set again if the mismatch exists. Only accessible when DBGEN = 0 and ICKBUG<INBUG> = 1. MCP19114/5 196h 197h MCP19114/5 10.3.1 OPTION_REG REGISTER Note: The OPTION_REG register is a readable and writable register, which contains various control bits to configure: • • • • Timer0/WDT prescaler External GPA2/INT interrupt Timer0 Weak pull-ups on PORTGPA and PORTGPB REGISTER 10-2: To achieve a 1:1 prescaler assignment for Timer0, assign the prescaler to the WDT by setting PSA bit to ‘1’ in the OPTION_REG register. Refer to Section 22.1.3 “Software Programmable Prescaler”. OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR x = Bit is unknown ‘0’ = Bit is cleared ‘1’ = Bit is set bit 7 RAPU: Port GPx Pull-Up Enable bit(1) 1 = Port GPx pull-ups are disabled 0 = Port GPx pull-ups are enabled bit 6 INTEDG: Interrupt Edge Select bit 0 = Interrupt on rising edge of INT pin 1 = Interrupt on falling edge of INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: Bit Value TMR0 Rate WDT Rate 000 001 010 011 100 101 110 111 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 1: 256 1: 1 1: 2 1: 4 1: 8 1: 16 1: 32 1: 64 1: 128 Individual WPUx bit must also be enabled. DS20005281B-page 78 2014-2015 Microchip Technology Inc. MCP19114/5 10.4 PCL and PCLATH 10.4.3 COMPUTED FUNCTION CALLS The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any reset, the PC is cleared. Figure 10-3 shows the two situations for loading the PC: the upper example shows how the PC is loaded on a write to PCL (PCLATH <4:0> PCH), while the lower example in Figure 10-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). FIGURE 10-3: The MCP19114/5 have an 8-level x 13-bit wide hardware stack (refer to Figure 10-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. PROGRAM COUNTER (PC) LOADING IN DIFFERENT SITUATIONS PCH PCL 12 8 7 0 Instruction with Destination PC 8 PCLATH<4:0> 5 ALU Result PCLATH PCH 12 11 10 PCL 8 0 7 PC GOTO, CALL 2 PCLATH<4:3> 11 OPCODE <10:0> If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<4:3> is loaded with PCLATH<4:3>. 10.4.4 The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the 9th push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no Status bits to indicate Stack Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. PCLATH 10.4.1 MODIFYING PCL REGISTER Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<12:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 5 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 13 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 10.4.2 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). Care should be exercised when jumping into a look-up table or program branch table (computed GOTO) by modifying the PCL register. Assuming that PCLATH is set to the table start address, if the table length is greater than 255 instructions or if the lower 8 bits of the memory address roll over from 0xFFh to 0X00h in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the table location within the table. STACK 10.5 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register directly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR and the IRP bit in the STATUS register, as shown in Figure 10-4. A simple program to clear RAM location 40h-7Fh using indirect addressing is shown in Example 10-3. For more information, refer to Application Note AN556, “Implementing a Table Read” (DS00000556). 2014-2015 Microchip Technology Inc. DS20005281B-page 79 MCP19114/5 EXAMPLE 10-3: MOVLW MOVWF NEXT CLRF INCF BTFSS GOTO CONTINUE INDIRECT ADDRESSING 0x40 FSR INDF FSR FSR,7 NEXT FIGURE 10-4: ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue DIRECT/INDIRECT ADDRESSING Direct Addressing RP1 RP0 Bank Select From Opcode 6 Indirect Addressing 0 7 IRP Bank Select Location Select 00 01 10 File Select Register 0 Location Select 11 00h 180h Data Memory 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail, refer to Figure 10-2. DS20005281B-page 80 2014-2015 Microchip Technology Inc. MCP19114/5 11.0 DEVICE CONFIGURATION Note: Device Configuration consists of Configuration Word, Code Protection and Device ID. 11.1 Configuration Word There are several Configuration Word bits that allow different timers to be enabled and memory protection options. These are implemented as Configuration Word at 2007h. REGISTER 11-1: The DBGEN bit in Configuration Word is managed automatically by device development tools, including debuggers and programmers. For normal device operation, this bit should be maintained as a '1'. Debug is available only on the MCP19115. CONFIG: CONFIGURATION WORD R/P-1 U-1 R/P-1 R/P-1 U-1 R/P-1 DBGEN — WRT1 WRT0 — BOREN bit 13 bit 8 U-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 U-1 U-1 — CP MCLRE PWRTE WDTE — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 13 DBGEN: ICD Debug bit 1 = ICD debug mode disabled 0 = ICD debug mode enabled bit 12 Unimplemented: Read as ‘0’ bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bit 11 = Write protection off 10 = 000h to 3FFh write protected, 400h to FFFh may be modified by PMCON1 control 01 = 000h to 7FFh write protected, 800h to FFFh may be modified by PMCON1 control 00 = 000h to FFFh write protected, entire program memory is write protected. bit 9 Unimplemented: Read as ‘0’ bit 8 BOREN: Brown-Out Reset Enable bit 1 = BOR disabled during Sleep and Enabled during operation 0 = BOR disabled bit 7 Unimplemented: Read as ‘0’ bit 6 CP: Code Protection 1 = Program memory is not code protected 0 = Program memory is external read and write protected bit 5 MCLRE: MCLR Pin Function Select 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is alternate function, MCLR function is internally disabled bit 4 PWRTE: Power-Up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 Unimplemented: Read as ‘0’ Note 1: Bit is reserved and not controlled by user. 2014-2015 Microchip Technology Inc. DS20005281B-page 81 MCP19114/5 11.2 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 11.2.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in the Configuration Word. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. Refer to Section 11.3 “Write Protection” for more information. 11.3 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as boot loader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in the Configuration Word define the size of the program memory block that is protected. 11.4 ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify mode. Only the Least Significant 7 bits of the ID locations are reported when using MPLAB Integrated Development Environment (IDE). DS20005281B-page 82 2014-2015 Microchip Technology Inc. MCP19114/5 12.0 OSCILLATOR MODES 12.2 The MCP19114/5 have one oscillator configuration which is an 8 MHz internal oscillator. 12.1 Internal Oscillator (INTOSC) The Internal Oscillator module provides a system clock source of 8 MHz. The frequency of the internal oscillator can be trimmed with a calibration value in the OSCTUNE register. Oscillator Calibration The 8 MHz internal oscillator is factory-calibrated. The factory calibration values reside in the read-only CALWD6 register. These values must be read from the CALWD6 register and stored in the OSCCAL register. Refer to Section 17.0 “Flash Program Memory Control” for the procedure on reading the program memory. Note: 12.3 The FCAL<6:0> bits in the CALWD6 register must be written into the OSCCAL register to calibrate the internal oscillator. Frequency Tuning in User Mode In addition to the factory calibration, the base frequency can be tuned in the user's application. This frequency tuning capability allows the user to deviate from the factory-calibrated frequency. The user can tune the frequency by writing to the OSCTUNE register (refer to Register 12-1). REGISTER 12-1: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 TUN<4:0>: Frequency Tuning bits 01111 = Maximum frequency 01110 = • • • 00001 = 00000 = Center frequency. Oscillator Module is running at the calibrated frequency. 11111 = • • • 10000 = Minimum frequency 2014-2015 Microchip Technology Inc. DS20005281B-page 83 MCP19114/5 12.3.1 OSCILLATOR DELAY UPON POWER-UP, WAKE-UP AND BASE FREQUENCY CHANGE In applications where the OSCTUNE register is used to shift the frequency of the internal oscillator, the application should not expect the frequency of the internal oscillator to stabilize immediately. In this case, the frequency may shift gradually toward the new value. The time for this frequency shift is less than eight cycles of the base frequency. On power-up, the device is held in reset by the power-up time if the power-up timer is enabled. Following a wake-up from Sleep mode or POR, an internal delay of ~10 µs is invoked to allow the memory bias to stabilize before program execution can begin. TABLE 12-1: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 83 Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by clock sources. TABLE 12-2: Name CONFIG6 SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH CLOCK SOURCES Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 13:8 — — — — — — — — 7:0 — FCAL6 FCAL5 FCAL4 FCAL3 FCAL2 FCAL1 FCAL0 Register on Page 62 Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by clock sources. DS20005281B-page 84 2014-2015 Microchip Technology Inc. MCP19114/5 13.0 RESETS The reset logic is used to place the MCP19114/5 into a known state. The source of the reset can be determined by using the device status bits. There are multiple ways to reset these devices: • • • • • Power-On Reset (POR) Overtemperature Reset (OT) MCLR Reset WDT Reset Brown-Out Reset (BOR) To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a POR event. Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on: • • • • • Power-On Reset MCLR Reset MCLR Reset during Sleep WDT Reset Brown-Out Reset WDT (Watchdog Timer) wake-up does not cause register resets in the same manner as a WDT Reset, since wake-up is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations, as indicated in Table 13-1. The software can use these bits to determine the nature of the Reset. Refer to Table 13-2 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 13-1. The MCLR Reset path has a noise filter to detect and ignore small pulses. Refer to Section 5.0 “Digital Electrical Characteristics” for pulse-width specifications. FIGURE 13-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/TEST_EN pin Sleep WDT Module Time-Out Reset VDD Rise Power-On Reset Detect Brown-Out Brown-Out Reset VDD S Chip_Reset Reset R Q BOREN PWRT On-Chip RC OSC 11-bit Ripple Counter Enable PWRT TABLE 13-1: TIME-OUT IN VARIOUS SITUATIONS Power-Up PWRTE = 0 PWRTE = 1 Wake-Up from Sleep TPWRT — — 2014-2015 Microchip Technology Inc. DS20005281B-page 85 MCP19114/5 TABLE 13-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-On Reset u 0 1 1 Brown-Out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-Up u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep Legend: u = unchanged, x = unknown 13.1 Power-On Reset (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply connect the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-On Reset. When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure proper operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. 13.2 MCLR MCP19114/5 have a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. Voltages applied to the MCLR pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of a Resistor-Capacitor (RC) network, as shown in Figure 13-2, is suggested. An internal MCLR option is enabled by clearing the MCLRE bit in the CONFIG register. When MCLRE = 0, the Reset signal to the chip is generated internally. When MCLRE = 1, the MCLR pin becomes an external Reset input. In this mode, the MCLR pin has a weak pull-up to VDD. FIGURE 13-2: RECOMMENDED MCLR CIRCUIT VDD R2 SW1 (optional) 100 (needed with capacitor) MCLR MCP19114/5 R1 1 k (or greater) C1 0.1 µF (optional, not critical) DS20005281B-page 86 2014-2015 Microchip Technology Inc. MCP19114/5 13.3 Brown-Out Reset (BOR) Note: The BOREN bit <8> in the CONFIG register enables or disables the BOR mode, as defined in the CONFIG register. A brown-out occurs when VDD falls below VBOR for greater than 100 µs minimum. On any Reset (Power-On, Brown-Out, Watchdog Timer, etc.), the chip will remain in Reset until VDD rises above VBOR (refer to Figure 13-3). If enabled, the Power-Up Timer will be invoked by the Reset and will keep the chip in Reset an additional 64 ms. During power-up, it is recommended that the BOR configuration bit is enabled holding the MCU in Reset (OSC turned off and no code execution) until VDD exceeds the VBOR threshold. Users have the option of adding an additional 64 ms delay by clearing the PWRTE bit. At this time, the VDD voltage level is high enough to operate the MCU functions only; all other device functionality is not operational. This is independent of the value of VIN, which is typically VDD + VDROPOUT. During power-down with BOR enabled, the MCU operation will be held in Rset when VDD falls below the VBOR threshold. With BOR disabled or while operating in Sleep mode, the POR will hold the part in Reset when VDD falls below the VPOR threshold. Since this device runs at FOSC = 8 MHz and the processor is fully operational at VDD = 2V, it is recommended that BOR always be enabled during power-up and power-down. FIGURE 13-3: The Power-Up Timer is enabled by the PWRTE bit in the CONFIG register. If VDD drops below VBOR while the Power-Up Timer is running, the chip will go back into a Brown-Out Reset and the Power-Up Timer will be re-initialized. Once the VDD rises above VBOR, the Power-Up Timer will execute a 64 ms reset. BROWN-OUT SITUATIONS VDD Internal Reset VBOR 64 ms(1) VDD Internal Reset VBOR < 64 ms 64 ms(1) VDD VBOR Internal Reset 64 ms(1) Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’. 2014-2015 Microchip Technology Inc. DS20005281B-page 87 MCP19114/5 13.4 Power-Up Timer (PWRT) The Power-Up Timer provides a fixed 64 ms (nominal) time-out on power-up only, from POR Reset. The Power-Up Timer operates from an internal RC oscillator. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A bit (PWRTE) in the CONFIG register can disable (if set) or enable (if cleared or programmed) the Power-Up Timer. The Power-Up Timer delay will vary from chip to chip due to: • VDD variation • Temperature variation • Process variation Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin, rather than pulling this pin directly to VSS. The Power-Up Timer optionally delays device execution after a POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-Up Timer is controlled by the PWRTE bit in the CONFIG register. FIGURE 13-4: 13.5 Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. Refer to Section 16.0 “Watchdog Timer (WDT)” for more information. 13.6 Start-Up Sequence Upon the release of a POR, the following must occur before the device begins executing: • Power-Up Timer runs to completion (if enabled) • Oscillator start-up timer runs to completion • MCLR must be released (if enabled) The total time out will vary based on PWRTE bit status. For example, with PWRTE bit erased (PWRT disabled), there will be no time out at all. Figures 13-4, 13-5 and 13-6 depict time-out sequences. Since the time outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then, bringing MCLR high will begin execution immediately (refer to Figure 13-5). This is useful for testing purposes or to synchronize more than one MCP19114/5 device operating in parallel. 13.6.1 POWER CONTROL (PCON) REGISTER The Power Control (PCON) register (address 8Eh) has two Status bits to indicate what type of Reset occurred last. TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1 VDD MCLR Internal POR TPWRT PWRT Time-Out TIOSCST OST Time-Out Internal Reset DS20005281B-page 88 2014-2015 Microchip Technology Inc. MCP19114/5 FIGURE 13-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2 VDD MCLR Internal POR TPWRT PWRT Time-Out TIOSCST OST Time-Out Internal Reset FIGURE 13-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD) VDD MCLR Internal POR TPWRT PWRT Time-Out TIOSCST OST Time-Out Internal Reset 13.7 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Tables 13-3 and 13-4 show the Reset conditions of these registers. 2014-2015 Microchip Technology Inc. TABLE 13-3: RESET STATUS BITS AND THEIR SIGNIFICANCE POR BOR TO PD Condition 0 x 1 1 Power-On Reset u 0 1 1 Brown-Out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-Up from Sleep u u 1 0 Interrupt Wake-Up from Sleep u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep 0 u 0 x Not allowed. TO is set on POR. 0 u x 0 Not allowed. PD is set on POR. DS20005281B-page 89 MCP19114/5 TABLE 13-4: RESET CONDITION FOR SPECIAL REGISTERS (Note 2) Program Counter STATUS Register PCON Register Power-On Reset 0000h 0001 1xxx ---- --0u Brown-Out Reset 0000 0001 1xxx ---- --u0 MCLR Reset during normal operation 0000h 000u uuuu ---- --uu MCLR Reset during Sleep 0000h 0001 0uuu ---- --uu WDT Reset 0000h 0000 uuuu ---- --uu PC + 1 uuu0 0uuu ---- --uu PC + 1(1) uuu1 0uuu ---- --uu Condition WDT Wake-Up from Sleep Interrupt Wake-Up from Sleep Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2: If a Status bit is not implemented, that bit will be read as ‘0’. DS20005281B-page 90 2014-2015 Microchip Technology Inc. MCP19114/5 13.8 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-On Reset (POR) • Brown-Out Reset (BOR) The PCON register bits are shown in Register 13-1. REGISTER 13-1: PCON: POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — — POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as '0' bit 1 POR: Power-On Reset Status bit 1 = No Power-On Reset occurred 0 = A Power-On Reset occurred (must be set in software after a Power-On Reset occurs) bit 0 BOR: Brown-Out Reset 1 = No Brown-Out Reset occurred 0 = A Brown-Out Reset occurred (must be set in software after a Brown-Out Reset occurs) TABLE 13-5: Name PCON STATUS SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — — — POR BOR 91 IPR RP1 RP0 TO PD Z DC C 71 Legend: — = unimplemented bit, read as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2014-2015 Microchip Technology Inc. DS20005281B-page 91 MCP19114/5 NOTES: DS20005281B-page 92 2014-2015 Microchip Technology Inc. MCP19114/5 14.0 INTERRUPTS The MCP19114/5 have multiple sources of interrupt: • • • • • • • • • • • • • • • External Interrupt (INT pin) Interrupt-On-Change (IOC) Interrupts Timer0 Overflow Interrupt Timer1 Overflow Interrupt Timer2 Match Interrupt ADC Interrupt System Input Undervoltage Error System Input Overvoltage Error SSP BCL Desaturation Detection Gate Drive UVLO Capture/Compare 1 Capture/Compare 2 Overtemperature The Interrupt Control (INTCON) register and the Peripheral Interrupt Request (PIRx) registers record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. The Global Interrupt Enable bit, GIE, in the INTCON register enables (if set) all unmasked interrupts or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in the INTCON register and PIEx registers. GIE is cleared on Reset. When an interrupt is serviced, the following actions occur automatically: • The GIE is cleared to disable any further interrupt • The return address is pushed onto the stack • The PC is loaded with 0004h The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. 14.1 Interrupt Latency For external interrupt events, such as the INT pin or PORTGPx change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (refer to Figure 14-2). The latency is the same for one- or two-cycle instructions. 14.2 GPA2/INT Interrupt The external interrupt on the GPA2/INT pin is edge-triggered, either on the rising edge if the INTEDG bit in the OPTION_REG register is set, or the falling edge if the INTEDG bit is clear. When a valid edge appears on the GPA2/INT pin, the INTF bit in the INTCON register is set. This interrupt can be disabled by clearing the INTE control bit in the INTCON register. The INTF bit must be cleared by software in the Interrupt Service Routine before re-enabling this interrupt. The GPA2/INT interrupt can wake up the processor from Sleep, if the INTE bit was set prior to going into Sleep. Refer to Section 15.0 “Power-Down Mode (Sleep)” for details on Sleep and Section 15.1 “Wake-Up from Sleep” for timing of wake-up from Sleep through GPA2/INT interrupt. Note: The ANSEL register must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’ and cannot generate an interrupt. The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag but will not cause the processor to redirect to the interrupt vector. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts which were ignored are still pending to be serviced when the GIE bit is set again. 2014-2015 Microchip Technology Inc. DS20005281B-page 93 MCP19114/5 FIGURE 14-1: INTERRUPT LOGIC Plx2 CDSIF CDSIE OTIF OTIE OVIF OVIE DRUVIF DRUVIE OVLOIF OVLOIE UVLOIF UVLOIE INTCON ADIF ADIE BCLIF BCLIE IOCF IOCE INTF INTE T0IF T0IE SSPIF SSPIE PEIF PEIE Plx1 CC2IF CC2IE CC1IF CC1IE TMR2F TMR2E TMR1IF TMR1IE FIGURE 14-2: Wake-Up (If in Sleep mode) Interrupt to CPU GIE INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN CLKOUT(3) (4) INT pin (1) (1) INTF flag (INTCON reg.) Interrupt Latency(2) (5) GIE bit (INTCON reg.) INSTRUCTION FLOW PC PC Instruction Fetched Instruction Executed Note 1: Inst (PC) Inst (PC – 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 — Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single-cycle or a two-cycle instruction. 3: CLKOUT is available only in INTOSC and RC Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 5.0 “Digital Electrical Characteristics”. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. DS20005281B-page 94 2014-2015 Microchip Technology Inc. MCP19114/5 14.3 Interrupt Control Registers 14.3.1 Note: INTCON REGISTER The INTCON register is a readable and writable register that contains the various enable and flag bits for the TMR0 register overflow, interrupt-on-change and external INT pin interrupts. REGISTER 14-1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, in the INTCON register. The user’s software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE T0IE INTE IOCE T0IF INTF IOCF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCE: Interrupt-on-Change Enable bit(1) 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: External Interrupt Flag bit 1 = The external interrupt occurred (must be cleared in software) 0 = The external interrupt did not occur bit 0 IOCF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: 2: x = Bit is unknown IOCx registers must also be enabled. T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit. 2014-2015 Microchip Technology Inc. DS20005281B-page 95 MCP19114/5 14.3.1.1 PIE1 Register Note 1: Bit PEIE in the INTCON register must be set to enable any peripheral interrupt. The PIE1 register contains the Peripheral Interrupt Enable bits, as shown in Register 14-2. REGISTER 14-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 ADIE: ADC Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 BCLIE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 4 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 3 CC2IE: Capture2/Compare2 Interrupt Enable bit 1 = Enables the Capture2/Compare2 interrupt 0 = Disables the Capture2/Compare2 interrupt bit 2 CC1IE: Capture1/Compare1 Interrupt Enable bit 1 = Enables the Capture1/Compare1 interrupt 0 = Disables the Capture1/Compare1 interrupt bit 1 TMR2IE: Timer2 Interrupt Enable 1 = Enables the Timer2 interrupt 0 = Disables the Timer2 interrupt bit 0 TMR1IE: Timer1 Interrupt Enable 1 = Enables the Timer1 interrupt 0 = Disables the Timer1 interrupt DS20005281B-page 96 x = Bit is unknown 2014-2015 Microchip Technology Inc. MCP19114/5 14.3.1.2 PIE2 Register Note 1: Bit PEIE in the INTCON register must be set to enable any peripheral interrupt. The PIE2 register contains the Peripheral Interrupt Enable bits, as shown in Register 14-3. REGISTER 14-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CDSIE — — OTIE OVIE DRUVIE OVLOIE UVLOIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CDSIE: Desaturation Detection Interrupt Enable bit 1 = Enables the DESAT Detect interrupt 0 = Disables the DESAT Detect interrupt bit 6-5 Unimplemented: Read as ‘0’ bit 4 OTIE: Overtemperature Interrupt Enable bit 1 = Enables overtemperature interrupt 0 = Disables overtemperature interrupt bit 3 OVIE: VOUT Overvoltage Interrupt Enable bit 1 = Enables the OV interrupt 0 = Disables the OV interrupt bit 2 DRUVIE: Gate Drive Undervoltage Lockout Interrupt Enable bit 1 = Enables Gate Drive UVLO interrupt 0 = Disables Gate Drive UVLO interrupt bit 1 OVLOIE: VIN Overvoltage Lockout Interrupt Enable bit 1 = Enables OVLO interrupt 0 = Disables OVLO interrupt bit 0 UVLOIE: VIN Undervoltage Lockout Interrupt Enable bit 1 = Enables UVLO interrupt 0 = Disables UVLO interrupt 2014-2015 Microchip Technology Inc. x = Bit is unknown DS20005281B-page 97 MCP19114/5 14.3.1.3 PIR1 Register Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, in the INTCON register. The user’s software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. The PIR1 register contains the Peripheral Interrupt Flag bits, as shown in Register 14-4. REGISTER 14-4: PIR1: PERIPHERAL INTERRUPT FLAG REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 ADIF: ADC Interrupt Flag bit 1 = ADC conversion complete 0 = ADC conversion has not completed or has not been started bit 5 BCLIF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 CC2IF: Capture2/Compare2 Interrupt Flag bit 1 = Capture or Compare has occurred 0 = Capture or Compare has not occurred bit 2 CC1IF: Capture1/Compare1 Interrupt Flag bit 1 = Capture or Compare has occurred 0 = Capture or Compare has not occurred bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match did not occur bit 0 TMR1IF: Timer1 Interrupt Flag 1 = Timer1 rolled over (must be cleared in software) 0 = Timer1 has not rolled over DS20005281B-page 98 x = Bit is unknown 2014-2015 Microchip Technology Inc. MCP19114/5 14.3.1.4 PIR2 Register Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, in the INTCON register. The user’s software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. The PIR2 register contains the Peripheral Interrupt Flag bits, as shown in Register 14-3. REGISTER 14-5: PIR2: PERIPHERAL INTERRUPT FLAG REGISTER 2 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CDSIF — — OTIF OVIF DRUVIF OVLOIF UVLOIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CDSIF: DESAT Detect comparator module interrupt flag bit 1 = An interrupt is pending 0 = An interrupt is not pending bit 6-5 Unimplemented: Read as ‘0’ bit 4 OTIF: Overtemperature Interrupt Flag bit 1 = Overtemperature event has occurred 0 = Overtemperature event has not occurred bit 3 OVIF: Overvoltage Interrupt Flag bit With OVINTP bit set: 1 = A VOUT Not Overvoltage to Overvoltage edge has been detected 0 = A VOUT Not Overvoltage to Overvoltage edge has not been detected With OVINTN bit set: 1 = A VOUT Overvoltage to Not Overvoltage edge has been detected 0 = A VOUT Overvoltage to Not Overvoltage edge has not been detected bit 2 DRUVIF: Gate Drive Undervoltage Lockout Interrupt Flag bit 1 = Gate Drive Undervoltage Lockout has occurred 0 = Gate Drive Undervoltage Lockout has not occurred bit 1 OVLOIF: VIN Overvoltage Lockout Interrupt Flag bit With OVLOINTP bit set: 1 = A VIN Not Overvoltage to VIN Overvoltage edge has been detected 0 = A VIN Not Overvoltage to VIN Overvoltage edge has not been detected With OVLOINTN bit set: 1 = A VIN Overvoltage to VIN Not Overvoltage edge has been detected 0 = A VIN Overvoltage to VIN Not Overvoltage edge has not been detected bit 0 UVLOIF: VIN Undervoltage Lockout Interrupt Flag bit With UVLOINTP bit set: 1 = A VIN Not Undervoltage to VIN Undervoltage edge has been detected 0 = A VIN Not Undervoltage to VIN Undervoltage edge has not been detected With UVLOINTN bit set: 1 = A VIN Undervoltage to VIN Not Undervoltage edge has been detected 0 = A VIN Undervoltage to VIN Not Undervoltage edge has not been detected 2014-2015 Microchip Technology Inc. DS20005281B-page 99 MCP19114/5 TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 78 PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIE2 CDSIE — — OTIE OVIE DRUVIE OVLOIE UVLOIE 97 PIR1 — ADIF BCLIF SSPIF — — TMR2IF TMR1IF 98 PIR2 CDSIF — — OTIF OVIF DRUVIF OVLOIF UVLOIF 99 Name INTCON OPTION_REG Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by Interrupts. 14.4 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W and STATUS registers). This must be implemented in software. Temporary holding registers W_TEMP and STATUS_TEMP should be placed in the last 16 bytes of GPR (refer to Figure 10-3). These 16 locations are common to all banks and do not require banking. This makes context save and restore operations simpler. The code shown in Example 14-1 can be used to: • • • • • Store the W register Store the STATUS register Execute the ISR code Restore the Status (and Bank Select Bit) register Restore the W register Note: The MCP19114/5 do not require saving the PCLATH. However, if computed GOTOs are used in both the ISR and the main code, the PCLATH must be saved and restored in the ISR. EXAMPLE 14-1: MOVWF SWAPF SAVING STATUS AND W REGISTERS IN RAM W_TEMP STATUS,W MOVWF STATUS_TEMP : :(ISR) : SWAPF STATUS_TEMP,W MOVWF SWAPF SWAPF STATUS W_TEMP,F W_TEMP,W DS20005281B-page 100 ;Copy W to TEMP ;Swap status to ;Swaps are used ;Save status to register be saved into W because they do not affect the status bits bank zero STATUS_TEMP register ;Insert user code here ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W 2014-2015 Microchip Technology Inc. MCP19114/5 15.0 POWER-DOWN MODE (SLEEP) 15.1 Wake-Up from Sleep The Power-Down mode is entered by executing a SLEEP instruction. The device can wake up from Sleep through one of the following events: Upon entering Sleep mode, the following conditions exist: 1. 2. 3. 4. 5. 1. 2. 3. 4. 5. 6. 7. 8. 9. WDT will be cleared but keeps running, if enabled for operation during Sleep. PD bit in the STATUS register is cleared. TO bit in the STATUS register is set. CPU clock is disabled. The ADC is inoperable due to the absence of the 4V LDO power (AVDD). I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). Resets other than WDT are not affected by Sleep mode. Analog Circuit power (AVDD) is removed during Sleep mode. POR level changes to 1.2V typical. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following conditions should be considered: • • • • I/O pins should not be floating. External circuitry sinking current from I/O pins. Internal circuitry sourcing current from I/O pins. Current draw from pins with internal weak pull-ups. • Modules using Timer1 oscillator. I/O pins that are high-impedance inputs should be pulled to VDD or GND externally to avoid switching currents caused by floating inputs. External Reset input on MCLR pin, if enabled POR Reset Watchdog Timer, if enabled Any external interrupt Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) The first two events will cause a device reset. The last three events are considered a continuation of program execution. To determine whether a device reset or wake-up event occurred, refer to Section 13.7 “Determining the Cause of a Reset”. The following peripheral interrupts can wake the device from Sleep: 1. 2. Interrupt-on-change External Interrupt from INT pin When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction and will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have an NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. The SLEEP instruction removes power from the analog circuitry. AVDD is shut down to minimize current draw in Sleep mode and to maintain a shutdown current of 30 µA typical. The 5V LDO (VDD) voltage drops to 2.5V-3V in Sleep mode. External current draw from the 5V LDO (VDD) should be limited to less than 200 µA. Loads drawing more than 200 µA externally during Sleep mode risk loading down the VDD voltage and tripping POR. A POR event during Sleep mode will wake the device from Sleep. The enable state of the analog circuitry does not change with the execution of the SLEEP instruction. 2014-2015 Microchip Technology Inc. DS20005281B-page 101 MCP19114/5 15.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction - SLEEP instruction will execute as an NOP - WDT and WDT prescaler will not be cleared - TO bit in the STATUS register will not be set - PD bit in the STATUS register will not be cleared FIGURE 15-1: • If the interrupt occurs during or after the execution of a SLEEP instruction - SLEEP instruction will be completely executed - Device will immediately wake up from Sleep - WDT and WDT prescaler will be cleared - TO bit in the STATUS register will be set - PD bit in the STATUS register will be cleared Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as an NOP. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC TOST Interrupt Latency (1) Interrupt flag GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC Instruction Fetched Instruction Executed Note 1: PC Inst(PC) = Sleep Inst(PC - 1) PC + 1 PC + 2 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Dummy Cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy Cycle Inst(0004h) GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 15-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 IOCA IOCA7 IOCA6 IOCA5 — IOCA3 IOCA2 IOCA1 IOCA0 122 IOCB IOCB7 IOCB6 IOCB5 IOCB4 — — IOCB1 IOCB0 122 PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIE2 CDSIE — — OTIE OVIE DRUVIE OVLOIE UVLOIE 97 PIR1 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 98 PIR2 CDSIF — — OTIF OVIF DRUVIF OVLOIF UVLOIF 99 IRP RP1 RP0 TO PD Z DC C 71 STATUS Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode. DS20005281B-page 102 2014-2015 Microchip Technology Inc. MCP19114/5 16.0 WATCHDOG TIMER (WDT) 16.2 The WDT has a nominal time-out period of 18 ms (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (refer to Table 5-3). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION_REG register. Thus, time-out periods up to 2.3 seconds can be realized. The Watchdog Timer is a free running timer. The WDT is enabled by setting the WDTE bit in the CONFIG register (default setting). During normal operation, a WDT time out generates a device reset. If the device is in Sleep mode, a WDT time out causes the device to wake up and continue with normal operation. The WDT can be permanently disabled by clearing the WDTE bit in the CONFIG register. Refer to Section 11.1 “Configuration Word” for more information. 16.1 WDT Period The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device reset. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time out. Watchdog Timer (WDT) Operation During normal operation, a WDT time out generates a device reset. If the device is in Sleep mode, a WDT time out causes the device to wake-up and continue with normal operation; this is known as a WDT wake-up. The WDT can be permanently disabled by clearing the WDTE configuration bit. 16.3 WDT Programming Considerations Under worst-case conditions (i.e., VDD = Minimum, Temperature = Maximum, Maximum WDT prescaler), it may take several seconds before a WDT time out occurs. The postscaler assignment is fully under software control and can be changed during program execution. FIGURE 16-1: WATCHDOG TIMER WITH SHARED PRESCALE BLOCK DIAGRAM FOSC/4 Data Bus 0 8 1 Sync 2 TCY 1 T0CKI pin T0SE T0CS 0 0 Set Flag bit T0IF on Overflow PSA 8-Bit Prescaler TMR0 1 PSA 8 PS<2:0> Watchdog Timer 1 0 PSA WDT Time-Out WDTE Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register. 2: WDTE bit is in the CONFIG register. 2014-2015 Microchip Technology Inc. DS20005281B-page 103 MCP19114/5 TABLE 16-1: WDT STATUS Conditions WDT WDTE = 0 CLRWDT Command Cleared Exit Sleep TABLE 16-2: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 78 Legend: Shaded cells are not used by the Watchdog Timer. Note 1: Refer to Register 11-1 for operation of all the bits in the CONFIG register. TABLE 16-3: Name CONFIG SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page 13:8 — — DBGEN — WRT1 WRT0 — BOREN 81 7:0 — CP MCLRE PWRTE WDTE — — — Legend: — = unimplemented location, read as ‘1’. Shaded cells are not used by Watchdog Timer. DS20005281B-page 104 2014-2015 Microchip Technology Inc. MCP19114/5 17.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation (full VIN range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (refer to Registers 17-1 to 17-5). There are six SFRs used to read and write this memory: • • • • • • PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When interfacing the program memory block, the PMDATL and PMDATH registers form a two-byte word which holds the 14-bit data for read/write, and the PMADRL and PMADRH registers form a two-byte word which holds the 13-bit address of the FLASH location being accessed. These devices have 4k words of program Flash with an address range from 0000h to 0FFFh. The program memory allows single-word read and a four-word write. A four-word write automatically erases the row of the location and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. 17.1 PMADRH and PMADRL Registers The PMADRH and PMADRL registers can address up to a maximum of 4k words of program memory. When selecting a program address value, the Most Significant Byte (MSB) of the address is written to the PMADRH register and the Least Significant Byte (LSB) is written to the PMADRL register. 17.2 PMCON1 and PMCON2 Registers The PMCON1 register is the control register for the data program memory accesses. Control bits RD and WR initiate read and write, respectively. In software, these bits can only be set, not cleared. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The CALSEL bit allows the user to read locations in test memory in case there are calibration bits stored in the calibration word locations that need to be transferred to SFR trim registers. The CALSEL bit is only for reads. If a write operation is attempted with CALSEL = 1, no write will occur. PMCON2 is not a physical register. Reading PMCON2 will read all '0's. The PMCON2 register is used exclusively in the flash memory write sequence. When the device is code-protected, the CPU may continue to read and write the Flash program memory. Depending on the settings of the Flash Program Memory Enable (WRT<1:0>) bits, the device may or may not be able to write certain blocks of the program memory; however, reads of the program memory are allowed. When the Flash Program Memory Code Protection (CP) bit is enabled, the program memory is code-protected and the device programmer (ICSP) cannot access data or program memory. 2014-2015 Microchip Technology Inc. DS20005281B-page 105 MCP19114/5 17.3 Flash Program Memory Control Registers REGISTER 17-1: R/W-0 PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown PMDATL<7:0>: 8 Least Significant Data bits to Write or Read from Program Memory REGISTER 17-2: R/W-0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMADRL<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation REGISTER 17-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMDATH<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits from Program Memory DS20005281B-page 106 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 17-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER U-0 U-0 U-0 U-0 — — — — R/W-0 R/W-0 R/W-0 R/W-0 PMADRH<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 PMADRH<3:0>: 4 Most Significant Address bits or High bits for Program Memory Reads REGISTER 17-5: PMCON1: PROGRAM MEMORY CONTROL REGISTER 1 U-1 R/W-0 U-0 U-0 U-0 R/W-0 R/S-0 R/S-0 — CALSEL — — — WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown S = Bit can only be set bit 7 Unimplemented: Read as '1' bit 6 CALSEL: Program Memory calibration space select bit 1 = Select test memory area for reads only (for loading calibration trim registers) 0 = Select user area for reads bit 5-3 Unimplemented: Read as '0' bit 2 WREN: Program Memory Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the Flash memory is complete bit 0 RD: Read Control bit 1 = Initiates a program memory read. (The read takes one cycle. The RD is cleared in hardware; the RD bit can only be set (not cleared) in software.) 0 = Does not initiate a Flash memory read 2014-2015 Microchip Technology Inc. DS20005281B-page 107 MCP19114/5 17.3.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must write two bytes of the address to the PMADRL and PMADRH registers, and then set control bit RD (bit 0 in the PMCON1register). Once the read control bit is set, the Program Memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the BSF PMCON1,RD instruction to be ignored. The data is available, in the very next cycle, in the PMDATL and PMDATH registers; it can be read as two bytes in the following instructions. PMDATL and PMDATH registers will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 17-1: FLASH PROGRAM READ BANKSELPM_ADR; Change STATUS bits RP1:0 to select bank with PMADR MOVLWMS_PROG_PM_ADDR; MOVWFPMADRH; MS Byte of Program Address to read MOVLWLS_PROG_PM_ADDR; MOVWFPMADRL; LS Byte of Program Address to read BANKSELPMCON1; Bank to containing PMCON1 BSF PMCON1, RD; EE Read NOP ; First instruction after BSF PMCON1,RD executes normally NOP ; Any instructions here are ignored as program ; memory is read in second cycle after BSF PMCON1,RD ; BANKSELPMDATL; Bank to containing PMADRL MOVFPMDATL, W; W = LS Byte of Program PMDATL MOVFPMDATH, W; W = MS Byte of Program PMDATL FIGURE 17-1: Q1 Flash ADDR FLASH PROGRAM MEMORY READ CYCLE EXECUTION – NORMAL MODE Q2 Q3 Q4 PC Flash DATA Q1 Q2 Q4 PC + 1 INSTR (PC) INSTR (PC - 1) Executed here Q3 Q1 Q2 Q3 Q4 PMADRH,PMADRL INSTR (PC + 1) BSF PMCON1,RD Executed here Q1 Q2 Q3 Q1 Q2 Q3 Q4 PC + 4 PC+3 PC +3 PMDATH,PMDATL INSTR (PC + 1) Executed here Q4 INSTR (PC + 3) NOP Executed here Q1 Q2 Q3 Q4 PC + 5 INSTR (PC + 4) INSTR (PC + 3) Executed here INSTR (PC + 4) Executed here RD bit PMDATH PMDATL Register EERHLT DS20005281B-page 108 2014-2015 Microchip Technology Inc. MCP19114/5 17.3.2 WRITING TO THE FLASH PROGRAM MEMORY A word of the Flash program memory may only be written to if the word is in an unprotected segment of memory, as defined in Section 11.1 “Configuration Word” (bits <WRT1:0>). Note: The write protect bits are used to protect the user’s program from modification by the user’s code. They have no effect when programming is performed by ICSP. The code-protect bits, when programmed for code protection, will prevent the program memory from being written via the ICSP interface. Flash program memory must be written in four-word blocks. Refer to Figures 17-2 and 17-3 for more details. A block consists of four words with sequential addresses, with a lower boundary defined by an address, where PMADRL<1:0> = 00. All block writes to program memory are done as 16-word erase by four-word write operations. The write operation is edge-aligned and cannot occur across boundaries. To write program data, the WREN bit must first be loaded into the buffer registers (refer to Figure 17-2). This is accomplished by first writing the destination address to PMADRL and PMADRH and then writing the data to PMDATL and PMDATH. After the address and data have been set, the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set the WR control bit in the PMCON1 register. All four buffer register locations should be written to with correct data. If less than four words are being written to in the block of four words, a read from the program memory location(s) not being written to must be performed. This takes the data from the program location(s) not being written and loads it into the PMDATL and PMDATH registers. Then the sequence of events to transfer data to the buffer registers must be executed. To transfer data from the buffer registers to the program memory, the PMADRL and PMADRH must point to the last location in the four-word block (PMADRL<1:0> = 11). Then the following sequence of events must be executed: 1. 2. Write 55h, then AAh, to PMCON2 (Flash programming sequence). Set control bit WR in the PMCON1 register to begin the write operation. 2014-2015 Microchip Technology Inc. The user must follow the same specific sequence to initiate the write for each word in the program block, writing each program word in sequence (000, 001, 010, 011). When the write is performed on the last word (PMADRL<1:0> = 11), a block of sixteen words is automatically erased and the content of the four-word buffer registers are written into the program memory. After the BSF PMCON1,WR instruction, the processor requires two cycles to set up the erase/write operation. The user must place two NOP instructions after the WR bit is set. Since data is being written to buffer registers, the writing of the first three words of the block appears to occur immediately. The processor will halt internal operations for the typical 4 ms only during the cycle in which the erase takes place (i.e., the last word of the sixteen-word block erase). This is not Sleep mode, as the clocks and peripherals will continue to run. After the four-word write cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. The above sequence must be repeated for the higher 12 words. Note: An erase is only initiated for the write of four words just after a row boundary; or PMCON1<WR> set with PMADRL<3:0> = xxxx0011. Refer to Figure 17-2 for a block diagram of the buffer registers and the control signals for test mode. 17.3.3 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the device should not write to the program memory. To protect against spurious writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-Up Timer (72 ms duration) prevents program memory writes. The write initiate sequence and the WREN bit help prevent an accidental write during a power glitch or software malfunction. 17.3.4 OPERATION DURING CODE PROTECT When the device is code-protected, the CPU is able to read and write unscrambled data to the program memory. The test mode access is disabled. 17.3.5 OPERATION DURING WRITE PROTECT When the program memory is write-protected, the CPU can read and execute from the program memory. The portions of program memory that are write-protected cannot be modified by the CPU using the PMCON registers. The write protection has no effect in ICSP mode. DS20005281B-page 109 MCP19114/5 FIGURE 17-2: BLOCK WRITES TO 4K FLASH PROGRAM MEMORY 7 5 0 0 7 PMDATL PMDATH 6 8 14 14 First word of block to be written 14 PMADRL<1:0> = 00 Buffer Register Buffer Register 14 PMADRL<1:0> = 10 PMADRL<1:0> = 01 If at new row sixteen words of Flash are erased, then four buffers are transferred to Flash automatically after this word is written PMADRL<1:0> = 11 Buffer Register Buffer Register Program Memory FIGURE 17-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 PMADRH, PMADRL PC + 1 Flash ADDR INSTR (PC) Flash DATA Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 INSTR (PC + 1) ignored read BSF PMCON1,WR INSTR (PC + 1) Executed here Executed here PMDATH, PMDATL Processor halted EE Write Time PC + 2 PC + 3 INSTR (PC+2) NOP Executed here PC + 4 INSTR (PC+3) (INSTR (PC + 2) NOP INSTR (PC + 3) Executed here Executed here Flash Memory Location WR bit PMWHLT DS20005281B-page 110 2014-2015 Microchip Technology Inc. MCP19114/5 18.0 I/O PORTS 18.1 In general, when a peripheral is enabled, that pin may not be used as a general-purpose I/O pin. Each port has the registers for its operation. These registers are: • TRISGPx registers (data direction register) • PORTGPx registers (read the levels on the pins of the device) Some ports may have one or more of the following additional registers. These registers are: • ANSELx (analog select) • WPUGPx (weak pull-up) Ports with analog functions also have an ANSELx register, which can disable the digital input and save power. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 18-1. FIGURE 18-1: GENERIC I/O PORTGPX OPERATION Read LATx D TRISGPx Write PORTGPx Q CK PORTGPA is an 8-bit wide, bidirectional port consisting of five CMOS I/Os, one open-drain I/O and one open-drain input-only pin (GPA4 is not available). The corresponding data direction register is TRISGPA. Setting a TRISGPA bit to 1 will make the corresponding PORTGPA pin an input (i.e., disable the output driver). Clearing a TRISGPA bit set to 0 will make the corresponding PORTGPA pin an output (i.e., enables output driver). The exception is GPA5, which is input only and its TRISGPA bit will always read as ‘1’. Example 18-1 shows how to initialize an I/O port. Reading the PORTGPA register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. The TRISGPA register controls the PORTGPA pin output drivers, even when they are being used as analog inputs. The user must ensure the bits in the TRISGPA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. If the pin is configured for a digital output (either port or alternate function), the TRISGPA bit must be cleared in order for the pin to drive the signal, and a read will reflect the state of the pin. 18.1.1 Write LATx VDD Data Register PORTGPA and TRISGPA Registers INTERRUPT-ON-CHANGE Each PORTGPA pin is individually configurable as an interrupt-on-change pin. Control bits IOCB<7:4> and IOCB<2:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-On Reset. Reference Section 19.0 “Interrupt-On-Change” for more information. Data Bus I/O pin Read PORTGPx To peripherals ANSELx EXAMPLE 18-1: ; ; ; ; VSS INITIALIZING PORTGPA This code example illustrates initializing the PORTGPA register. The other ports are initialized in the same manner. BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF PORTGPA; PORTGPA;Init PORTA ANSELA; ANSELA;digital I/O TRISGPA; B'00011111';Set GPA<3:0> as ;inputs TRISGPA;and set GPA<7:5> as ;outputs 2014-2015 Microchip Technology Inc. 18.1.2 WEAK PULL-UPS PORTGPA <3:0> and PORTGPA5 have an internal weak pull-up. PORTGPA<7:6> do not have internal weak pull-ups. Individual control bits can enable or disable the internal weak pull-ups (refer to Register 18-3). The weak pull-up is automatically turned off when the port pin is configured as an output, an alternative function or on a Power-On Reset setting the RAPU bit in the OPTION_REG register. The weak pull-up on GPA5 is enabled when configured as MCLR pin by setting bit 5 in the CONFIG register, and disabled when GPA5 is an I/O. There is no software control of the MCLR pull-up. DS20005281B-page 111 MCP19114/5 18.1.3 ANSELA REGISTER The ANSELA register is used to configure the input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRISGPA cleared and ANSELx set will still operate as a digital output, but the input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: 18.1.4 The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general-purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by the user’s software. PORTGPA FUNCTIONS AND OUTPUT PRIORITIES Each PORTGPA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 18-1. For additional information, refer to the appropriate section in this data sheet. TABLE 18-1: PORTGPA OUTPUT PRIORITY Function Priority(1) Pin Name GPA0 GPA0 GPA1 GPA1 GPA2 GPA2 TEST_OUT CLKPIN T0CKI INT GPA3 GPA3 GPA5 GPA5 (open-drain, input only) MCLR TEST_EN GPA6 GPA6 CCD ICSPDAT GPA7 GPA7 (open-drain output, ST input) SCL Note 1: Output function priority listed from lowest to highest. Pin GPA7 in the PORTGPA register is a true open-drain pin with no connection back to VDD. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELA register. Digital output functions may control the pin when it is in Analog mode with the priority shown in Table 18-1. DS20005281B-page 112 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 18-1: PORTGPA: PORTGPA REGISTER R/W-x R/W-x R-x U-0 R/W-x R/W-x R/W-x R/W-x GPA7 GPA6 GPA5 — GPA3 GPA2 GPA1 GPA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GPA7: General-Purpose Open-Drain I/O pin 1 = Port pin is > VIH 0 = Port pin is < VIL bit 6 GPA6: General-Purpose I/O pin 1 = Port pin is > VIH 0 = Port pin is < VIL bit 5 GPA5/MCLR/TEST_EN5: General-Purpose Open-Drain input pin bit 4 Unimplemented: Read as ‘0’ bit 3-0 GPA<3:0>: General-Purpose I/O pin 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 18-2: R/W-1 TRISGPA: PORTGPA TRI-STATE REGISTER R/W-1 TRISA7 TRISA6 R-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 TRISA5 — TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TRISA<7:6>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output bit 5 TRISA5: GPA5 Port Tri-State Control bit This bit is always ‘1’ as GPA5 is an input only bit 4 Unimplemented: Read as ‘0’ bit 3-0 TRISA<3:0>: PORTGPA Tri-State Control bit 1 = PORTGPA pin configured as an input (tri-stated) 0 = PORTGPA pin configured as an output 2014-2015 Microchip Technology Inc. DS20005281B-page 113 MCP19114/5 REGISTER 18-3: WPUGPA: WEAK PULL-UP PORTGPA REGISTER U-0 U-0 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 — — WPUA5 — WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 WPUA5: Weak Pull-Up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 4 Unimplemented: Read as ‘0’ bit 3-0 WPUA<3:0>: Weak Pull-Up Register bit 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode (TRISGPA = 1) and the individual WPUA bit is enabled (WPUA = 1), and the pin is not configured as an analog input. GPA5 weak pull-up is also enabled when the pin is configured as MCLR in the CONFIG register. REGISTER 18-4: ANSELA: ANALOG SELECT GPA REGISTER U-0 U-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 — — — — ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ANSA<3:0>: Analog Select GPA Register bit 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and interrupt-on-change if available. The corresponding TRISA bit must be set to Input mode in order to allow external control of the voltage on the pin. DS20005281B-page 114 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 18-2: Name ANSELA OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — ANSA3 ANSA2 ANSA1 ANSA0 114 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 78 PORTGPA GPA7 GPA6 GPA5 — GPA3 GPA2 GPA1 GPA0 113 TRISGPA TRISA7 TRISA6 TRISA5 — TRISA3 TRISA2 TRISA1 TRISA0 113 WPUGPA — — WPUA5 — WPUA3 WPUA2 WPUA1 WPUA0 114 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPA. 2014-2015 Microchip Technology Inc. DS20005281B-page 115 MCP19114/5 18.2 PORTGPB and TRISGPB Registers Due to special function pin requirements, a limited number of the PORTGPB I/Os are utilized. On the 24-pin QFN MCP19114, GPB0 and GPB1 are implemented. GPB0 is an open-drain general-purpose I/O and SDA pin. GPB1 is a general-purpose I/O, analog input and VREF2 DAC output. The 28-pin QFN MCP19114 has four additional general-purpose PORTGPB I/O pins. The corresponding data direction register is TRISGPB. Setting a TRISGPB bit to 1 will make the corresponding PORTGPB pin an input (i.e., disable the output driver). Clearing a TRISGPB bit to 0 will make the corresponding PORTGPB pin an output (i.e., enable the output driver). Example 18-1 shows how to initialize an I/O port. Some pins for PORTGPB are multiplexed with an alternate function for the peripheral or a clock function. In general, when a peripheral or clock function is enabled, that pin may not be used as a general-purpose I/O pin. Reading the PORTGPB register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. The TRISGPB register controls the PORTGPB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISGPB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. If the pin is configured for a digital output (either port or alternate function), the TRISGPB bit must be cleared in order for the pin to drive the signal and a read will reflect the state of the pin. 18.2.1 18.2.2 WEAK PULL-UPS Each of the PORTGPB pins has an individually configurable internal weak pull-up. Control bits WPUB<7:4> and WPUB<1> enable or disable each pull-up (refer to Register 18-7). Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are disabled on a Power-On Reset by the RAPU bit in the OPTION_REG register. 18.2.3 ANSELB REGISTER The ANSELB register is used to configure the input mode of an I/O pin to analog. Setting the appropriate ANSELB bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELB bits has no effect on the digital output functions. A pin with TRISGPB clear and ANSELB set will still operate as a digital output, but the input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. The TRISGPB register controls the PORTGPB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISGPB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. Note: The ANSELB bits default to the Analog mode after Reset. To use any pins as digital general-purpose or peripheral inputs, the corresponding ANSELB bits must be initialized to ‘0’ by the user’s software. INTERRUPT-ON-CHANGE Each PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCB<7:4> and IOCB<2:0> enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-On Reset. Reference Section 19.0 “Interrupt-On-Change” for more information. DS20005281B-page 116 2014-2015 Microchip Technology Inc. MCP19114/5 18.2.4 PORTGPB FUNCTIONS AND OUTPUT PRIORITIES TABLE 18-3: Each PORTGPB pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 18-3. For additional information, refer to the appropriate section in this data sheet. GPB0 SDA GPB7 GPB1 VREF2 GPB4 GPB4 (MCP19114) ICSPDAT Analog input functions, such as ADC, and some digital input functions are not included in the list below. These inputs are active when the I/O pin is set for Analog mode using the ANSELB register. Digital output functions may control the pin when it is in Analog mode, with the priority shown in Table 18-3. (1) GPB0 (open-drain input/output) GPB1 When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. R/W-x Function Priority(1) Pin Name GPB0 pin in the PORTGPB register is a true open-drain pin with no connection back to VDD. REGISTER 18-5: PORTGPB OUTPUT PRIORITY GPB5 GPB5 (MCP19114) GPB6 GPB6 (MCP19114) GPB7 GPB7 (MCP19114) CCD2 Note 1: Output function priority listed from lowest to highest. PORTGPB: PORTGPB REGISTER R/W-x R/W-x R/W-x U-0 U-0 R/W-x R/W-x GPB6(1) GPB5(1) GPB4(1) — — GPB1 GPB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 GPB<7:4>: General-Purpose I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 GPB<1:0>: General-Purpose I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: MCP19115 only. 2014-2015 Microchip Technology Inc. DS20005281B-page 117 MCP19114/5 REGISTER 18-6: R/W-1 TRISB7 TRISGPB: PORTGPB TRI-STATE REGISTER R/W-1 (1) TRISB6 (1) R/W-1 TRISB5 (1) R/W-1 TRISB4 (1) U-0 U-0 R/W-1 R/W-1 — — TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 TRISB<7:4>: PORTGPB Tri-State Control bit 1 =PORTGPB pin configured as an input (tri-stated) 0 = PORTGPB pin configured as an output bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 TRISB<1:0>: PORTGPB Tri-State Control bit 1 =PORTGPB pin configured as an input (tri-stated) 0 = PORTGPB pin configured as an output Note 1: MCP19115 only. REGISTER 18-7: WPUGPB: WEAK PULL-UP PORTGPB REGISTER R/W-1 R/W-1 R/W-1 R/W-1 U-0 U-0 R/W-1 U-0 WPUB7(2) WPUB6(2) WPUB5(2) WPUB4(2) — — WPUB1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 WPUB<7:4>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 3-2 Unimplemented: Read as ‘0’ bit 1 WPUB<1>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 0 Unimplemented: Read as ‘0’ Note 1: 2: The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode (TRISGPA = 1) and the individual WPUB bit is enabled (WPUB = 1), and the pin is not configured as an analog input. MCP19115 only. DS20005281B-page 118 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 18-8: ANSELB: ANALOG SELECT GPB REGISTER U-0 R/W-1 — ANSB6(1) R/W-1 ANSB5 R/W-1 (1) (1) ANSB4 U-0 U-0 R/W-1 U-0 — — ANSB1 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 ANSB<6:4>: Analog Select GPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 3-2 Unimplemented: Read as ‘0’ bit 1 ANSB1: Analog Select GPB Register bit 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 0 Unimplemented: Read as ‘0’ Note 1: 2: MCP19115 only. Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. TABLE 18-4: Name ANSELB OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPB Bit 7 Bit 6 — ANSB6(1) RAPU (1) Bit 5 Bit 4 ANSB5(1) ANSB4(1) Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — ANSB1 — 119 PS1 PS0 78 INTEDG T0CS T0SE PSA PS2 GPB6(1) GPB5(1) GPB4(1) — — GPB1 GPB0 117 TRISGPB TRISB7(1) TRISB6(1) TRISB5(1) TRISB4(1) — — TRISB1 TRISB0 118 WPUGPB WPUB7(1) WPUB6(1) WPUB5(1) WPUB4(1) — — WPUB1 — 118 PORTGPB GPB7 = unimplemented locations, read as ‘0’. Shaded cells are not used by the PORTGPB register. Legend: — Note 1: MCP19115 only. 2014-2015 Microchip Technology Inc. DS20005281B-page 119 MCP19114/5 NOTES: DS20005281B-page 120 2014-2015 Microchip Technology Inc. MCP19114/5 19.0 INTERRUPT-ON-CHANGE Each PORTGPA and PORTGPB pin is individually configurable as an interrupt-on-change pin. Control bits IOCA and IOCB enable or disable the interrupt function for each pin. Refer to Registers 19-1 and 19-2. The interrupt-on-change is disabled on a Power-On Reset. The interrupt-on-change on GPA5 is disabled when configured as MCLR pin in the CONFIG register. For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of PORTGPA or PORTGPB. The mismatched outputs of the last read of all the PORTGPA and PORTGPB pins are OR’ed together to set the Interrupt-on-Change Interrupt Flag (IOCF) bit in the INTCON register. 19.1 Enabling the Module To allow individual port pins to generate an interrupt, the IOCE bit in the INTCON register must be set. If the IOCE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 19.2 Individual Pin Configuration To enable a pin to detect an interrupt-on-change, the associated IOCAx or IOCBx bit in the IOCA or IOCB registers is set. 19.3 Clearing Interrupt Flags The user, in the Interrupt Service Routine, clears the interrupt by: a) Any read of PORTGPA or PORTGPB AND Clear flag bit IOCF. This will end the mismatch condition. OR b) Any write of PORTGPA or PORTGPB AND Clear flag bit IOCF will end the mismatch condition. A mismatch condition will continue to set flag bit IOCF. Reading PORTGPA or PORTGPB will end the mismatch condition and allow flag bit IOCF to be cleared. The latch holding the last read value is not affected by a MCLR Reset. After this Reset, the IOCF flag will continue to be set if a mismatch is present. Note: 19.4 If a change on the I/O pin should occur when any PORTGPA or PORTGPB operation is being executed, the IOCF interrupt flag may not get set. Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCE bit is set. 2014-2015 Microchip Technology Inc. DS20005281B-page 121 MCP19114/5 19.5 Interrupt-On-Change Registers REGISTER 19-1: IOCA: INTERRUPT-ON-CHANGE PORTGPA REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 IOCA7 IOCA6 IOCA5 — IOCA3 IOCA2 IOCA1 IOCA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 IOCA<7:6>: Interrupt-on-Change PORTGPA register bits 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 5 IOCA<5>: Interrupt-on-Change PORTGPA register bits(1) 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 4 Unimplemented: Read as ‘0’ bit 3-0 IOCA<3:0>: Interrupt-on-Change PORTGPA register bits 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. Note 1: The Interrupt-on-Change on GPA5 is disabled if GPA5 is configured as MCLR. REGISTER 19-2: IOCB: INTERRUPT-ON-CHANGE PORTGPB REGISTER R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 IOCB7(1) IOCB6(1) IOCB5(1) IOCB4(1) — — IOCB1 IOCB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 IOCB<7:4>: Interrupt-on-Change PORTGPB register bits 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 IOCB<1:0>: Interrupt-on-Change PORTGPB register bits 1 = Interrupt-on-change enabled on the pin. 0 = Interrupt-on-change disabled on the pin. Note 1: MCP19115 only. DS20005281B-page 122 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 19-1: Name ANSELA ANSELB SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 — — — ANSB6 Bit 5 Bit 4 — (1) ANSB5 — (1) (1) ANSB4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSA3 ANSA2 ANSA1 ANSA0 114 — — ANSB1 — 119 GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 IOCA IOCA7 IOCA6 IOCA5 — IOCA3 IOCA2 IOCA1 IOCA0 122 IOCB IOCB7(1) IOCB6(1) IOCB5(1) IOCB4(1) — — IOCB1 IOCB0 122 TRISGPA TRISA7 TRISA6 TRISA5 — TRISA3 TRISA2 TRISA1 TRISA0 113 — — TRISB1 TRISB0 118 INTCON TRISGPB TRISB7 (1) TRISB6 (1) TRISB5 (1) TRISB4 (1) Legend: — = unimplemented locations, read as ‘0’. Shaded cells are not used by interrupt-on-change. Note 1: MCP19115 only. 2014-2015 Microchip Technology Inc. DS20005281B-page 123 MCP19114/5 NOTES: DS20005281B-page 124 2014-2015 Microchip Technology Inc. MCP19114/5 20.0 INTERNAL TEMPERATURE INDICATOR MODULE The MCP19114/5 are equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit's range of operating temperature falls between -40°C and +125°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. 20.1 Circuit Operation This internal temperature measurement circuit is always enabled. FIGURE 20-1: 20.2 Temperature Output The output of the circuit is measured using the internal analog-to-digital converter. Channel 13 is reserved for the temperature circuit output. Refer to Section 21.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. The temperature of the silicon die can be calculated by the ADC measurement by using Equation 20-1. A factory-stored 10-bit ADC value for 30°C is located at address 2084h. The temperature coefficient for this circuit is 15.7 mV/°C (±0.8 mV/°C). Other temperature readings can be calculated from the 30°C mark. TEMPERATURE CIRCUIT DIAGRAM VDD VOUT ADC MUX ADC n CHS bits (ADCON0 register) EQUATION 20-1: SILICON DIE TEMPERATURE ADC_READING (counts) – ADC_30 C_READING (counts TEMP_DIE( C = ----------------------------------------------------------------------------------------------------------------------------------------------------- + 30 C 4.0 (counts/ C 2014-2015 Microchip Technology Inc. DS20005281B-page 125 MCP19114/5 NOTES: DS20005281B-page 126 2014-2015 Microchip Technology Inc. MCP19114/5 21.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE Note: The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs which are multiplexed into a single sample-and-hold circuit. The output of the sample-and-hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the right justified conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 21-1 shows the block diagram of the ADC. Once VIN is greater than AVDD + VDROPOUT, AVDD is in regulation, allowing A/D readings to be accurate. Once VIN is greater than VDD + VDROPOUT, VDD is in regulation, allowing accurate ratiometric measurements. The internal band gap supplies the voltage reference to the ADC. FIGURE 21-1: ADC BLOCK DIAGRAM Note 1: When ADON = 0, all multiplexer inputs are disconnected. VIN/n 00000 VREF OV_REF 00001 00010 VBGR* 00011 VS 00100 EA_SC 00101 A2 00110 PEDESTAL 00111 RESERVED 01000 TRI-STATE RESERVED 01001 IP_ADJ 01010 IP_OFF_REF 01011 VDR/n 01100 TEMP_SNS 01101 DLL_VCON 01110 SLPCMP_REF 01111 2: Refer to ADCON0 register for detailed analog channel selection per device. AVDD CHS4: CHS0 GPA0/AN0 11000 GPA1/AN1 11001 GPA2/AN2 11010 GPA3/AN3 11011 GPB1/AN4 11100 (MCP19115 Only) GPB4/AN5 11101 (MCP19115 Only) GPB5/AN6 11110 (MCP19115 Only) GPB6/AN7 11111 ADC 10 GO/DONE 10 ADON ADRESH ADRESL VSS CHS4: CHS0 2014-2015 Microchip Technology Inc. DS20005281B-page 127 MCP19114/5 21.1 ADC Configuration When configuring and using the ADC, the following functions must be considered: • • • • • Port configuration Channel selection ADC conversion clock source Interrupt control Result formatting 21.1.1 PORT CONFIGURATION The ADC is used to convert analog signals into a corresponding digital representation. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 18.0 “I/O Ports” for more information. Note: 21.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. 21.1.3 ADC CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits in the ADCON1 register. There are five possible clock options: • • • • • FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (clock derived from internal oscillator with a divisor of 16) The time to complete one-bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods, as shown in Figure 21-2. For a correct conversion, the appropriate TAD specification must be met. Refer to the A/D conversion requirements in Section 4.0 “Electrical Characteristics” for more information. Table 21-1 gives examples of appropriate ADC clock selections. Note: CHANNEL SELECTION There are up to 21 channel selections available for the MCP19114 and 24 channels for the MCP19115: • • • • • • • • • • • • • • • • • • AN<4:0> pins AN<7:5> pins (MCP19115 Only) VIN: 1/15.53 of the input voltage (VIN) VREF: voltage reference for regulation set point OV_REF: reference for OV comparator VBGR: band gap reference VS: voltage proportional to VOUT EA_SC: error amplifier output after slope compensation A2: secondary current sense amplifier output PEDESTAL RESERVED RESERVED IP_ADJ: IP after pedestal and offset adjust IP_OFF_REF: IP offset reference VDR: VDR * 0.229V/V TEMP_SNS: analog voltage representing internal temperature (refer to Equation 20-1) DLL_VCON: delay locked loop voltage reference SLPCMP_REF: slope compensation reference The CHS<4:0> bits in the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 21.2 “ADC Operation” for more information. DS20005281B-page 128 Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. TABLE 21-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 8 MHz FOSC/8 001 1.0 µs(2) FOSC/16 101 2.0 µs FOSC/32 010 4.0 µs FOSC/64 110 8.0 µs(3) FRC x11 2.0-6.0 µs(1, 4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 4 µs for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: The FRC clock source is only recommended if the conversion will be performed during Sleep. 2014-2015 Microchip Technology Inc. MCP19114/5 FIGURE 21-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b2 b3 b1 b0 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO/DONE bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. 21.1.4 INTERRUPTS This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake up from Sleep and resume in-line code execution, the GIE and PEIE bits in the INTCON register must be disabled. If the GIE and PEIE bits in the INTCON register are enabled, execution will switch to the Interrupt Service Routine. The ADC module allows for the ability to generate an interrupt upon completion of an analog-to-digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 21.1.5 2: The ADC operates during Sleep only when the FRC oscillator is selected. FIGURE 21-3: RESULT FORMATTING The 10-bit A/D conversion result is supplied in right justified format only. 10-BIT A/D RESULT FORMAT (ADFM = 1) MSB bit 7 LSB bit 0 Read as ‘0 2014-2015 Microchip Technology Inc. bit 7 bit 0 10-bit A/D Result DS20005281B-page 129 MCP19114/5 21.2 21.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit in the ADCON0 register must be set to a ‘1’. Setting the GO/DONE bit in the ADCON0 register to a ‘1’ will start the analog-to-digital conversion. Note: 21.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 21.2.5 “A/D Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH:ADRESL registers with new conversion result 21.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete analog-to-digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, two ADC clock cycles are required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. Note: 21.2.4 A device reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. ADC OPERATION DURING SLEEP The ADC is not operational during Sleep mode. The AVDD 4V reference has been removed to minimize Sleep current. DS20005281B-page 130 21.2.5 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an analog-to-digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: • Disable pin output driver (refer to the TRISGPx registers) • Configure pin as analog (refer to the ANSELx registers) Configure the ADC module: • Select ADC conversion clock • Select ADC input channel • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). Note 1: The global interrupt can be disabled if the user is attempting to wake up from Sleep and resume in-line code execution. 2: Refer to Section 21.4 “A/D Acquisition Requirements”. EXAMPLE 21-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Frc clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSELADCON1; MOVLWB’01110000’;Frc clock MOVWFADCON1; BANKSELTRISGPA; BSF TRISGPA,0;Set GPA0 to input BANKSELANSELA; BSF ANSELA,0;Set GPA0 to analog BANKSELADCON0; MOVLWB’01100001’;Select channel AN0 MOVWFADCON0;Turn ADC On CALLSampleTime;Acquisiton delay BSF ADCON0,1;Start conversion BTFSCADCON0,1;Is conversion done? GOTO$-1 ;No, test again BANKSELADRESH; MOVFADRESH,W;Read upper 2 bits MOVWFRESULTHI;store in GPR space BANKSELADRESL; MOVFADRESL,W;Read lower 8 bits MOVWFRESULTLO;Store in GPR space 2014-2015 Microchip Technology Inc. MCP19114/5 21.3 ADC Register Definitions The following registers are used to control the operation of the ADC: REGISTER 21-1: ADCON0: A/D CONTROL REGISTER 0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = VIN/n analog voltage measurement (VIN/n = VIN/15.5328) 00001 = VREF (DAC reference voltage setting current regulation level) 00010 = OV_REF (reference for overvoltage comparator) 00011 = VBGR (band gap reference) 00100 = VS (Voltage proportional to VOUT) 00101 = EA_SC (Error amp after Slope Compensation output) 00110 = A2 (Secondary Current Sense Amplifier output) 00111 = PEDESTAL (Pedestal Voltage) 01000 = RESERVED 01001 = RESERVED 01010 = IP_ADJ (IP after Pedestal and Offset Adjust (at PWM Comparator)) 01011 = IP_OFF_REF (IP Offset Reference) 01100 = VDR/n (VDR/n analog driver voltage measurement = 0.229V/V * VDR) 01101 = TEMP_SNS (analog voltage representing internal temperature) 01110 = DLL_VCON (Delay Locked-Loop Voltage Reference – Control voltage for dead time) 01111 = SLPCMP_REF (Slope compensation reference) 10000 = Unimplemented 10001 = Unimplemented 10010 = Unimplemented 10011 = Unimplemented 10100 = Unimplemented 10101 = Unimplemented 10110 = Unimplemented 10111 = Unimplemented 11000 = GPA0/AN0 (i.e. ADDR1) 11001 = GPA1/AN1 (i.e. ADDR0) 11010 = GPA2/AN2 (i.e. Temperature Sensor Input) 11011 = GPA3/AN3 (i.e. BIN) 11100 = GPB1/AN4 11101 = GPB4/AN5 (MCP19115 only) 11110 = GPB5/AN6 (MCP19115 only) 11111 = GPB6/AN7 (MCP19115 only) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current 2014-2015 Microchip Technology Inc. DS20005281B-page 131 MCP19114/5 REGISTER 21-2: ADCON1: A/D CONTROL REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — ADCS2 ADCS1 ADCS0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 =Reserved 001 =FOSC/8 010 =FOSC/32 x11 =FRC (clock derived from internal oscillator with a divisor of 16) 100 =Reserved 101 =FOSC/16 110 =FOSC/64 bit 3-0 Unimplemented: Read as ‘0’ REGISTER 21-3: ADRESH: ADC RESULT REGISTER HIGH U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x — — — — — — ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 ADRES<9:8>: Most Significant A/D Results REGISTER 21-4: ADRESL: ADC RESULT REGISTER LOW R-x R-x R-x R-x R-x R-x R-x R-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: Least Significant A/D results DS20005281B-page 132 2014-2015 Microchip Technology Inc. MCP19114/5 21.4 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 21-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 21-4. The maximum recommended impedance for analog sources is 10 k. EQUATION 21-1: As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 21-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Assumptions: Temperature = +50°C and external impedance of 10 k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2 µs + T C + Temperature - 25°C 0.05 µs/°C The value for TC can be approximated with the following equations: 1 V APPLIED 1 – ------------------------------ = V CHOLD n+1 2 – 1 – TC ---------- RC V 1–e = V CHOLD APPLIED – TC ---------- RC 1 V 1–e = V APPLIED 1 – ------------------------------ APPLIED n+1 2 – 1 ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] Note: Where n = number of bits of the ADC. Solving for TC: T C = – C HOLD R IC + R SS + R S ln(1/2047) = – 10 pF 1 k + 7 k + 10 k ln(0.0004885) = 1.37 µs Therefore: T ACQ = 2 µs + 1.37µs + 50°C- 25°C 0.05µs/°C = 4.67 µs Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion. 2: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. 2014-2015 Microchip Technology Inc. DS20005281B-page 133 MCP19114/5 FIGURE 21-4: ANALOG INPUT MODEL RS VA Sampling Switch SS RSS VDD Analog Input pin VT 0.6V CPIN 5 pF VT 0.6V RIC 1k ILEAKAGE(1) CHOLD = 10 pF VSS/VREF- Legend: CHOLD = Sample/Hold Capacitance CPIN = Input Capacitance ILEAKAGE = Leakage current at the pin due to various junctions 6V 5V VDD 4V 3V 2V RIC = Interconnect Resistance RSS 5 6 7 8 91011 Sampling Switch (kW) RSS = Resistance of Sampling Switch SS = Sampling Switch VT = Threshold Voltage Note 1: Refer to Section 4.0 “Electrical Characteristics”. FIGURE 21-5: ADC TRANSFER FUNCTION ADC Output Code Full-Scale Range 3FFh 3FEh 3FDh 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB VREF- DS20005281B-page 134 Zero-Scale Transition 1.5 LSB Full-Scale Transition VREF+ 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 21-2: SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ADCON0 — CHS4 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 131 Name ADCON1 — ADCS2 ADCS1 ADCS0 — — — — 132 ADRESH — — — — — — ADRES9 ADRES8 132 ADRESL ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 132 ANSELA — — — — ANSA3 ANSA2 ANSA1 ANSA0 114 ANSELB — ANSB6 ANSB5 ANSB4 — — ANSB1 — 119 INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIR1 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 98 TRISGPA TRISA7 TRISA6 TRISA5 — TRISA3 TRISA2 TRISA1 TRISA0 113 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 — — TRISB1 TRISB0 118 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for ADC module. 2014-2015 Microchip Technology Inc. DS20005281B-page 135 MCP19114/5 NOTES: DS20005281B-page 136 2014-2015 Microchip Technology Inc. MCP19114/5 22.0 TIMER0 MODULE The Timer0 module is an 8-bit timer/counter with the following features: • • • • • 8-bit timer/counter register (TMR0) 8-bit prescaler Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow Figure 22-1 is a block diagram of the Timer0 module. FIGURE 22-1: TIMER0 BLOCK DIAGRAM FOSC/4 Data Bus 0 T0CKI 1 1 0 TMR0SE TMR0CS 8-bit Prescaler PSA 8 Sync 2 TCY TMR0 Set Flag bit TMR0IF on Overflow Overflow to Timer1 8 PS<2:0> 22.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 22.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-Bit Timer mode is selected by clearing the T0CS bit in the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 22.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. 8-BIT COUNTER MODE 22.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit in the OPTION_REG register. To assign the prescaler to Timer0, the PSA bit must be cleared to ‘0’. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits in the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit in the OPTION_REG register. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit in the OPTION_REG register. 8-Bit Counter mode using the T0CKI pin is selected by setting the T0CS bit in the OPTION_REG register to ‘1’. 2014-2015 Microchip Technology Inc. DS20005281B-page 137 MCP19114/5 22.1.4 22.1.5 SWITCHING PRESCALER BETWEEN TIMER0 AND WDT MODULES As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 22-1 must be executed. EXAMPLE 22-1: Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit in the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit can only be cleared in software. The Timer0 interrupt enable is the T0IE bit in the INTCON register. Note: CHANGING PRESCALER (TIMER0 WDT) 22.1.6 BANKSELTMR0; CLRWDT ;Clear WDT CLRFTMR0;Clear TMR0 and ;prescaler BANKSELOPTION_REG; BSF OPTION_REG,PSA;Select WDT CLRWDT ; ; MOVLWb’11111000’;Mask prescaler ANDWFOPTION_REG,W;bits IORLWb’00000101’;Set WDT prescaler MOVWFOPTION_REG;to 1:32 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in Section 4.0 “Electrical Characteristics”. 22.1.7 When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (refer to Example 22-2). EXAMPLE 22-2: TIMER0 INTERRUPT OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. CHANGING PRESCALER (WDT TIMER0) CLRWDT ;Clear WDT and ;prescaler BANKSELOPTION_REG; MOVLWb’11110000’;Mask TMR0 select and ANDWFOPTION_REG,W;prescaler bits IORLWb’00000011’;Set prescale to 1:16 MOVWFOPTION_REG; TABLE 22-1: Name INTCON OPTION_REG SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 95 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 TMR0 TRISGPA Timer0 Module Register TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 78 137* TRISA2 TRISA1 TRISA0 113 Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. DS20005281B-page 138 2014-2015 Microchip Technology Inc. MCP19114/5 23.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer with the following features: • • • • • 16-bit timer register pair (TMR1H:TMR1L) Readable and Writable (both registers) Selectable internal clock source 2-bit prescaler Interrupt on overflow Figure 23-1 is a block diagram of the Timer1 module. FIGURE 23-1: TIMER1 BLOCK DIAGRAM TMR1ON Set flag bit TMR1IF on Overflow TMR1(1) TMR1H TMR1L FOSC 1 Prescaler 1, 2, 4, 8 0 2 T1CKPS<1:0> TMR1CS Note 1: TMR1 register increments on rising edge. 23.1 Timer1 Operation The Timer1 module is a 16-bit incrementing timer which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. The timer is incremented on every instruction cycle. Timer1 is enabled by configuring the TMR1ON bit in the T1CON register. Table 23-1 displays the Timer1 enable selections. 23.2 Clock Source Selection The TMR1CS bit in the T1CON register is used to select the clock source for Timer1. Table 23-1 displays the clock source selections. 2014-2015 Microchip Technology Inc. 23.2.1 INTERNAL CLOCK SOURCE The TMR1H:TMR1L register pair will increment on multiples of FOSC or FOSC/4 as determined by the Timer1 prescaler. As an example, when the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. TABLE 23-1: TMR1CS CLOCK SOURCE SELECTIONS Clock Source 1 8 MHz system clock (FOSC) 0 2 MHz instruction clock (FOSC/4) DS20005281B-page 139 MCP19114/5 23.3 Timer1 Prescaler 23.5 Timer1 in Sleep Timer1 has four prescaler options, allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits in the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. Unlike other standard mid-range Timer1 modules, the MCP19114/5 Timer1 module only clocks from an internal system clock, and thus cannot run during Sleep mode, nor can it be used to wake the device from this mode. 23.4 The Timer1 Control (T1CON) register, shown in Register 23-1, is used to control Timer1 and select the various features of the Timer1 module. 23.6 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit in the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • • • • Timer1 Control Register TMR1ON bit in the T1CON register TMR1IE bit in the PIE1 register PEIE bit in the INTCON register GIE bit in the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. REGISTER 23-1: T1CON: TIMER1 CONTROL REGISTER U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0/ R/W-0 — — T1CKPS1 T1CKPS0 — — TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 =1:8 Prescale value 10 =1:4 Prescale value 01 =1:2 Prescale value 00 =1:1 Prescale value bit 3-2 Unimplemented: Read as ‘0’ bit 1 TMR1CS: Timer1 Clock Source Control bit 1 = 8 MHz system clock (FOSC) 0 = 2 MHz instruction clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1, Clears Timer1 gate flip-flop DS20005281B-page 140 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 23-2: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIR1 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 98 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 139* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 139* T1CON — — T1CKPS1 T1CKPS0 — — TMR1CS TMR1ON 140 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information. 2014-2015 Microchip Technology Inc. DS20005281B-page 141 MCP19114/5 NOTES: DS20005281B-page 142 2014-2015 Microchip Technology Inc. MCP19114/5 24.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: • • • • 8-bit timer register (TMR2) 8-bit period register (PR2) Interrupt on TMR2 match with PR2 Software programmable prescaler (1:1, 1:4, 1:16) Timer2 Operation The clock input to the Timer2 module is the system clock (FOSC). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, TMR2 is reset to 00h on the next increment cycle. FIGURE 24-1: The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a ‘1’. Timer2 is turned off by clearing the TMR2ON bit to a ‘0’. Refer to Figure 24-1 for a block diagram of Timer2. 24.1 The match output of the Timer2/PR2 comparator is used to set the TMR2IF interrupt flag bit in the PIR1 register. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The prescaler counter are cleared when: • A write to TMR2 occurs. • A write to T2CON occurs. • Any device reset occurs (Power-On Reset, MCLR Reset, Watchdog Timer Reset or Brown-Out Reset). Note: TMR2 is not cleared when T2CON is written. TIMER2 BLOCK DIAGRAM TMR2 Output FOSC Prescaler 1:1, 1:4, 1:8, 1:16 2 TMR2 Comparator T2CKPS<1:0> Sets Flag bit TMR2IF Reset EQ PR2 2014-2015 Microchip Technology Inc. DS20005281B-page 143 MCP19114/5 24.2 Timer2 Control Register REGISTER 24-1: T2CON: TIMER2 CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 =Prescaler is 1 01 =Prescaler is 4 10 =Prescaler is 8 11 =Prescaler is 16 TABLE 24-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 INTCON Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 PIE1 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIR1 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF PR2 T2CON Timer2 Module Period Register — TMR2 — — — — 98 143* TMR2ON T2CKPS1 T2CKPS0 Holding Register for the 8-bit TMR2 Time Base 144 143* Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information. DS20005281B-page 144 2014-2015 Microchip Technology Inc. MCP19114/5 25.0 ENHANCED PWM MODULE The PWM module implemented on the MCP19114/5 is a scaled-down version of the Capture/Compare/PWM (CCP) module found in standard mid-range microcontrollers. The module only features the PWM module, which is slightly modified from standard mid-range microcontrollers. In the MCP19114/5, the PWM module is used to generate the system clock or system oscillator. This system clock can control the MCP19114/5 switching frequency, as well as set the maximum allowable duty cycle. The PWM module does not continuously adjust the duty cycle to control the output voltage. This is accomplished by the analog control loop and associated circuitry. 25.1 25.1.1 When the MCP19114/5 is running stand-alone, the PWM signal functions as the system clock. It is operating at the programmed switching frequency with a programmed maximum duty cycle (DCLOCK). The programmed maximum duty cycle is not adjusted on a cycle-by-cycle basis to control the MCP19114/5 system output. The required duty cycle (DPDRVON) to control the output is adjusted by the MCP19114/5 analog control loop and associated circuitry. DCLOCK does however set the maximum allowable DPDRVON. EQUATION 25-1: D BUCK 1 – D CLOCK Standard Pulse-Width Modulation Mode The CCP will only function in PWM mode. The PWM signal is used to set the operating frequency and maximum allowable duty cycle of the MCP19114/5. Figure 25-1 is a snippet of the MCP19114/5 block diagram showing the PWM signal from the CCP module. FIGURE 25-1: MCP19114/5 SNIPPET SHOWING SYSTEM CLOCK FROM PWM MODULE PWM Signal From CCP 116 OV OVE PWM STAND-ALONE (NONFREQUENCY SYNCHRONIZATION) MODE 25.1.2 SWITCHING FREQUENCY SYNCHRONIZATION MODE The MCP19114/5 can be programmed to be switching frequency MASTER or SLAVE devices. The MASTER device functions as described in Section 25.1.1 “Stand-Alone (NonFrequency Synchronization) Mode” with the exception of the system clock also being applied to GPA1. A SLAVE device will receive the MASTER system clock on GPA1. This MASTER system clock will be OR’ed with the output of the TIMER2 module. This OR’ed signal will latch PWMRL into PWMRH and PWMPHL into PWMPHH. Figure 25-1 shows a simplified block diagram of the CCP module in PWM mode. S Q The PWMPHL register allows for a phase shift to be added to the SLAVE system clock. R Q It is desired to have the MCP19114/5 SLAVE device’s system clock start point shifted by a programmed amount from the MASTER system clock. This SLAVE phase shift is specified by writing to the PWMPHL register. The SLAVE phase shift can be calculated by using the following equation. There are two modes of operation that concern the system clock PWM signal. These modes are Stand-Alone (nonfrequency synchronization) and Frequency Synchronization. EQUATION 25-2: SLAVE PHASE SHIFT = PWMPHL T OSC T2 PRESCALE VALUE 2014-2015 Microchip Technology Inc. DS20005281B-page 145 MCP19114/5 FIGURE 25-1: SIMPLIFIED PWM BLOCK DIAGRAM PWMPHL PWMRL 8 8 PWMPHH (SLAVE) PWMRH (SLAVE) LATCH DATA LATCH DATA 8 8 Comparator Comparator 8 R Q S Q OSC SYSTEM CLOCK 8 RESET TIMER TMR2 (Note 1) WDM_ RESET 8 Comparator 8 EN_ SS CLKPIN_IN PR2 Note 1: TIMER 2 should be clocked by FOSC (8 MHz). A PWM output (Figure 25-2) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 25-2: PWM OUTPUT Period 25.1.3 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following equation. EQUATION 25-3: PWM PERIOD = PR2 + 1 T OSC T2 PRESCALE VALUE Duty Cycle TMR2 = PR2 + 1 TMR2 = PWMRH TMR2 = PR2 + 1 DS20005281B-page 146 When TMR2 is equal to PR2, the following two events occur on the next increment cycle: • TMR2 is cleared • The PWM duty cycle is latched from PWMRL into PWMRH 2014-2015 Microchip Technology Inc. MCP19114/5 25.1.4 PWM DUTY CYCLE (DCLOCK) The PWM duty cycle (DCLOCK) is specified by writing to the PWMRL register. Up to 8-bit resolution is available. The following equation is used to calculate the PWM duty cycle (DCLOCK). DUTY CYCLE TABLE 25-1: = PWMRL T OSC 25.2 T2 PRESCALE VALUE SUMMARY OF REGISTERS ASSOCIATED WITH PWM MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 MODECON MSC1 MSC0 RFB — — — — — — — T2CON Operation During Sleep When the device is placed in Sleep, the allocated timer will not increment and the state of the module will not change. If the CLKPIN pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. EQUATION 25-4: PWM The PWMRL bits can be written to at any time, but the duty cycle value is not latched into PWMRH until after a match between PR2 and TMR2 occurs. PR2 PWMRL PWMPHL Bit 2 Bit 1 Bit 0 — — — TMR2ON T2CKPS1 T2CKPS0 Register on Page 51 144 Timer2 Module Period Register 143 PWM Register Low Byte 145* Phase Shift Low Byte 145* Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by PWM mode. * Page provides register information. 2014-2015 Microchip Technology Inc. DS20005281B-page 147 MCP19114/5 NOTES: DS20005281B-page 148 2014-2015 Microchip Technology Inc. MCP19114/5 26.0 DUAL CAPTURE/COMPARE (CCD) MODULE The CCD module is implemented on the MCP19114/5. This module is a new module based on the standard CCP module. It has two capture and compare only register sets with no PWM function. 26.1 Capture Mode In Capture mode, the CCxRH:CCxRL register set captures the 16-bit value of the TMR1 register when an event occurs on the DIMI pin. An event is defined as one of the following: • • • • Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge FIGURE 26-1: The type of event is configured by control bits CCxM3:CCxM0 (CCDCON<3:0> for register set 1 or CCDCON<7:4> for register set 2). When a capture is made, the interrupt request flag bit, CCxIF (PIR1<2> for register set 1 or PIR1<3> for register set 2), is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the register set is read, the old captured value is overwritten by the new value. 26.1.1 CCX PIN CONFIGURATION In Capture mode, the DIMI pin should be configured as an input by setting the TRIS bit for that pin. Note: If the DIMI pin is configured as an output, a write to the port can cause a capture condition. CAPTURE MODE OPERATION BLOCK DIAGRAM Prescaler ÷1, 4, 16 Set Flag bit CCxIF (PIR1 register) CCxRH CCD pin and Edge Detect CCxRL Capture Enable TMR1H TMR1L CCDCON<CCxM3:0 System Clock > (FOSC) 26.1.2 TIMER1 MODE SELECTION Timer1 must be running off of the instruction clock for the CCD module to use the capture feature. If Timer1 is running off of the 8 MHz clock, the capture feature may not function correctly. 26.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the enable for the capture interrupt clear in order to avoid false interrupts and should clear the flag bit, CCxIF, following any such change in the operating mode. 2014-2015 Microchip Technology Inc. 26.1.4 CCD PRESCALER There are four prescaler settings, specified by bits CCxM3:CCxM0. Whenever the CCD register set is disabled or not set to Capture mode, the prescaler counter is cleared. Any reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore, the first capture may be from a nonzero prescaler. It is recommended to disable the register set (CCxM3:0 = 00xx) prior to changing the prescaler value. DS20005281B-page 149 MCP19114/5 26.2 Compare Mode The action on the pin is based on the value of the control bits, CCxM3:CCxM0. At the same time, interrupt flag bit, CCP1IF, is set. In Compare mode, the 16-bit CCDRx register value is constantly compared against the TMR1 register pair value. When a match occurs, the CMPx pin: • • • • Is driven high Is driven low Toggles Remains unchanged FIGURE 26-2: COMPARE MODE OPERATION BLOCK DIAGRAM CCDCON<CCxM3:0> Mode Select Set CCDxIF Interrupt Flag (PIR1) 4 CCDRxH Q S R CCD pin Output Logic CCDRxL Comparator Match TRIS Output Enable TMR1H TMR1L Special Event Trigger Special Event Trigger will: - NOT set interrupt flag bit TMR1IF in the PIR1 register. - Set the GO/DONE bit to start the ADC conversion. 26.2.1 CMPX PIN CONFIGURATION The user must configure the CMPx pin as an output by clearing the TRIS bit for that pin. Note: Clearing the CCxM<3:0> bits will set the CMPx compare output latch to the default state. This is not the GPIO pin data latch. The default state for set on match or toggle on match is 0 but the default state for clear on match is 1. 26.2.2 TIMER1 MODE SELECTION Timer1 must be running off of the instruction clock for the CCD module to use the compare feature. If Timer1 is running off of the 8 MHz clock, the compare feature may not function correctly. DS20005281B-page 150 26.2.3 SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen, the CCP1 pin is not affected. The CCP1IF bit is set, causing a CCx interrupt (if enabled). 26.2.4 SPECIAL EVENT TRIGGER In this mode, an internal hardware trigger is generated, which may be used to initiate an action. The Special Event Trigger output of CCD does not reset the TMR1 register pair and starts an A/D conversion (if the A/D module is enabled). Note: The Special Event Trigger from the CCD module will not set the interrupt flag bit TMR1IF (bit 0 in the PIR1 register). 2014-2015 Microchip Technology Inc. MCP19114/5 26.3 Dual Capture/Compare Register The Dual Capture/Compare Module is a new module based on the standard CCP. It has no PWM function. REGISTER 26-1: CCDCON: DUAL CAPTURE/COMPARE CONTROL MODULE R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CC2M3 CC2M2 CC2M1 CC2M0 CC1M3 CC1M2 CC1M1 CC1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 CC2M<3:0>: CC Register Set 2 Mode Select bits 00xx = Capture/Compare off (resets the module) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CC2IF bit is set) 1001 = Compare mode, clear output on match (CC2IF bit is set) 1010 = Compare mode, toggle output on match (CC2IF bit is set) 1011 = Reserved 11xx = Compare mode, generate software interrupt on match (CC2IF bit is set, CMP2 pin is unaffected and configured as an I/O) 1111 = Compare mode, trigger special event (CC2IF bit is set; CC2 does not reset TMR1(1) and starts an A/D conversion, if the A/D module is enabled. CMP2 pin is unaffected and configured as an I/O port). bit 3-0 CC1M<3:0>: CC Register Set 1 Mode Select bits 00xx = Capture/Compare off (resets the module) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CC1IF bit is set) 1001 = Compare mode, clear output on match (CC1IF bit is set) 1010 = Compare mode, toggle output on match (CC1IF bit is set) 1011 = Reserved 11xx = Compare mode, generate software interrupt on match (CC1IF bit is set, CMP1 pin is unaffected and configured as an I/O) 1111 = Compare mode, trigger special event (CC1IF bit is set; CC1 resets TMR1 and starts an A/D conversion, if the A/D module is enabled. CMP1 pin is unaffected and configured as an I/O port). Note 1: When the Compare interrupt is set, a PIC will typically reset TMR1. This module does NOT reset TMR1. 2014-2015 Microchip Technology Inc. DS20005281B-page 151 MCP19114/5 NOTES: DS20005281B-page 152 2014-2015 Microchip Technology Inc. MCP19114/5 27.0 PWM CONTROL LOGIC The PWM Control Logic implements standard comparator modules to identify events such as input undervoltage, input overvoltage and desaturation detection. The control logic takes action in hardware to appropriately enable/disable the output drive (PDRV/SDRV), as well as to set corresponding interrupt flags to be read by software. This control logic also defines normal PWM operation. For definition of individual bits within the control logic, refer to the Special Function Register (SFR) sections. FIGURE 27-1: PWM CONTROL LOGIC D Q Q1 EN UVLOOUT UVLOINTP OVINTP UVLOIF UVLOINTN OVIF OVINTN VS OV_REF + - OVLOINTP UVLO UVLOEN OV D Q Q1 EN OVOUT D Q OVLOOUT Q1 EN OVLOIF OVLOINTN OVLO OVLOEN PWM PWMSTR_SEN SDRVEN OVEN PDRVEN DELAY SDRV SDRV_ON E/AOUT + Ip DELAY PDRV PWM S PWMSTR_PEN CDSINTP DESATP BG CDSPOL MUX CDSIF CDSINTN + DESATN - VDRUVBY VDRUVLO + DRUVIF CDSMUX DEFAULT TO DESATP Q CDSOUT D Q1 EN S CDSOE 200 ns SDRV_ON ONE SHOT 2014-2015 Microchip Technology Inc. Q 33 ns PWM ONE SHOT TMPTBY S OT + OTIF R CDSWDE WDM_RESET DS20005281B-page 153 MCP19114/5 NOTES: DS20005281B-page 154 2014-2015 Microchip Technology Inc. MCP19114/5 28.0 28.1 The I2C interface supports the following modes and features: MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE • • • • • • • • • • • • • MSSP Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be Serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module in the MCP19114/5 only operates in Inter-Integrated Circuit (I2C) mode. Master mode Slave mode Byte NACKing (Slave mode) Limited Multi-Master support 7-bit and 10-bit addressing Start and Stop interrupts Interrupt masking Clock stretching Bus collision detection General call address matching Dual Address masking Address Hold and Data Hold modes Selectable SDA hold times Figure 28-1 is a block diagram of the I2C interface module in Master mode. Figure 28-2 is a diagram of the I2C interface module in Slave mode. FIGURE 28-1: MSSP BLOCK DIAGRAM (I2C MASTER MODE) Internal Data Bus Read [SSPxM 3:0] Write SSPBUF Baud rate generator (SSPADD) Shift Clock SDA SDA in Start bit, Stop bit, Acknowledge Generate (SSPCON2) SCL in Bus Collision 2014-2015 Microchip Technology Inc. Start bit detect, Stop bit detect Write collision detect Clock arbitration State counter for end of XMIT/RCV Address Match detect Clock arbitrate/BCOL detect (Hold off clock source) Receive Enable (RCEN) SCL LSb Clock Cntl SSPSR MSb Set/Reset: S, P, SSPSTAT, WCOL, SSPxOV Reset SEN, PEN (SSPCON2) Set SSPIF, BCLIF DS20005281B-page 155 MCP19114/5 FIGURE 28-2: MSSP BLOCK DIAGRAM (I2C SLAVE MODE) Internal Data Bus Read Write SSPBUF Reg SCL If the requested slave exists on the bus, it will respond with an Acknowledge bit, otherwise known as an ACK. The master then continues in either Transmit mode or Receive mode and the slave continues in the complement, either in Receive mode or Transmit mode, respectively. Shift Clock SSPSR Reg SDA LSb MSb SSPMSK1 Reg Match Detect Addr Match SSPADD Reg Start and Stop bit Detect 28.2 To begin communication, a master device starts out in Master Transmit mode. The master device sends out a Start bit followed by the address byte of the slave it intends to communicate with. This is followed by a single Read/Write bit, which determines whether the master intends to transmit to or receive data from the slave device. Set, Reset S, P bits (SSPSTAT Reg) A Start bit is indicated by a high-to-low transition of the SDA line while the SCL line is held high. Address and data bytes are sent out Most Significant bit (MSb) first. The Read/Write bit is sent out as a logical one when the master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the slave. I2C MODE OVERVIEW VDD The Inter-Integrated Circuit Bus (I2C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment, where the master devices initiate the communication. A Slave device is controlled through addressing. The I 2C I2C MASTER/ SLAVE CONNECTION FIGURE 28-3: bus specifies two signal connections: • Serial Clock (SCL) • Serial Data (SDA) Both the SCL and SDA connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero; letting the line float is considered a logical one. Figure 28-3 shows a typical connection between two devices configured as master and slave. The I2C bus can operate with one or more master devices and one or more slave devices. There are four potential modes of operation for a given device: • Master Transmit mode (master is transmitting data to a slave) • Master Receive mode (master is receiving data from a slave) • Slave Transmit mode (slave is transmitting data to a master) • Slave Receive mode (slave is receiving data from a master) DS20005281B-page 156 SCL SCL VDD Master SDA Slave SDA The Acknowledge bit (ACK) is an active-low signal which holds the SDA line low to indicate to the transmitter that the slave device has received the transmitted data and is ready to receive more. The transition of a data bit is always performed while the SCL line is held low. Transitions that occur while the SCL line is held high are used to indicate Start and Stop bits. If the master intends to write to the slave, it repeatedly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this example, the master device is in Master Transmit mode and the slave is in Slave Receive mode. If the master intends to read from the slave, it repeatedly receives a byte of data from the slave and responds after each byte with an ACK bit. In this example, the master device is in Master Receive mode and the slave is Slave Transmit mode. 2014-2015 Microchip Technology Inc. MCP19114/5 On the last byte of data communicated, the master device may end the transmission by sending a Stop bit. If the master device is in Receive mode, it sends the Stop bit in place of the last ACK bit. A Stop bit is indicated by a low-to-high transition of the SDA line while the SCL line is held high. In some cases, the master may want to maintain control of the bus and re-initiate another transmission. If so, the master device may send another Start bit in place of the Stop bit or last ACK bit when it is in Receive mode. The I2C bus specifies three message protocols: • Single message where a master writes data to a slave • Single message where a master reads data from a slave • Combined message where a master initiates a minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves When one device is transmitting a logical one, or letting the line float, and a second device is transmitting a logical zero, or holding the line low, the first device can detect that the line is not a logical one. This detection, when used on the SCL line, is called clock stretching. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on the SDA line, it is called arbitration. Arbitration ensures that there is only one master device communicating at any single time. 28.2.1 CLOCK STRETCHING When a slave device has not completed processing data, it can delay the transfer of more data through the process of Clock Stretching. An addressed slave device may hold the SCL clock line low after receiving or sending a bit, indicating that it is not yet ready to continue. The master that is communicating with the slave will attempt to raise the SCL line in order to transfer the next bit, but will detect that the clock line has not yet been released. Because the SCL connection is open-drain, the slave has the ability to hold that line low until it is ready to continue communicating. 28.2.2 ARBITRATION Each master device must monitor the bus for Start and Stop bits. If the device detects that the bus is busy, it cannot begin a new message until the bus returns to an idle state. However, two master devices may try to initiate a transmission at or about the same time. When this occurs, the process of arbitration begins. Each transmitter checks the level of the SDA data line and compares it to the level that it expects to find. The first transmitter to observe that the two levels don't match, loses arbitration and must stop transmitting on the SDA line. For example, if one transmitter holds the SDA line to a logical one (lets it float) and a second transmitter holds it to a logical zero (pulls it low), the result is that the SDA line will be low. The first transmitter then observes that the level of the line is different than expected and concludes that another transmitter is communicating. The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDA line. If this transmitter is also a master device, it must also stop driving the SCL line. It then can monitor the lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDA line continues with its original transmission. It can do so without any complications, because so far the transmission appears exactly as expected, with no other transmitter disturbing the message. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less common. If two master devices are sending a message to two different slave devices at the address stage, the master sending the lower slave address always wins arbitration. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. Arbitration usually occurs very rarely, but it is a necessary process for proper multi-master support. Clock stretching allows receivers that cannot keep up with a transmitter to control the flow of incoming data. 2014-2015 Microchip Technology Inc. DS20005281B-page 157 MCP19114/5 28.3 I2C MODE OPERATION All MSSP I2C communication is byte-oriented and shifted out MSb first. Six SFR registers and two interrupt flags interface the module with the PIC microcontroller and with the user’s software. Two pins, SDA and SCL, are exercised by the module to communicate with other external I2C devices. 28.3.1 BYTE FORMAT All communication in I2C is done in 9-bit segments. A byte is sent from a Master to a Slave or vice versa, followed by an Acknowledge bit sent back. After the 8th falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and reads in an acknowledge value on the next clock pulse. The clock signal, SCL, is provided by the master. Data is valid to change while the SCL signal is low, and sampled on the rising edge of the clock. Changes on the SDA line while the SCL line is high define special conditions on the bus, explained in the following sections. TABLE 28-1: 28.3.2 DEFINITION OF I2C TERMINOLOGY There is language and terminology in the description of I2C communication that have definitions specific to I2C. Such word usage is defined in Table 28-1 and may be used in the rest of this document without explanation. The information in this table was adapted from the Philips I2C specification. 28.3.3 SDA AND SCL PINS Selecting any I2C mode with the SSPEN bit set forces the SCL and SDA pins to be open-drain. These pins should be set by the user to inputs by setting the appropriate TRIS bits. Note: Data is tied to output zero when an I2C mode is enabled. 28.3.4 SDA HOLD TIME The hold time of the SDA pin is selected by the SDAHT bit in the SSPCON3 register. Hold time is the time SDA is held valid after the falling edge of SCL. Setting the SDAHT bit selects a longer 300 ns minimum hold time and may help on buses with large capacitance. I2C BUS TERMS Term Description Transmitter The device that shifts data out onto the bus Receiver The device that shifts data in from the bus Master The device that initiates a transfer, generates clock signals and terminates a transfer Slave The device addressed by the master Multi-Master A bus with more than one device that can initiate data transfers Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus Idle No master is controlling the bus and both SDA and SCL lines are high Active Any time one or more master devices are controlling the bus Addressed Slave Slave device that has received a matching address and is actively being clocked by a master Matching Address Address byte that is clocked into a slave that matches the value stored in SSPADDx Write Request Slave receives a matching address with R/W bit clear and is ready to clock in data Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus holds SCL low to stall communication Bus Collision Any time the SDA line is sampled low by the module while it is outputting and expected high state DS20005281B-page 158 2014-2015 Microchip Technology Inc. MCP19114/5 28.3.5 START CONDITION 28.3.7 2 RESTART CONDITION The I C specification defines a Start condition as a transition of SDA from a high state to a low state, while SCL line is high. A Start condition is always generated by the master and signifies the transition of the bus from an Idle to an Active state. Figure 28-4 shows the wave forms for Start and Stop conditions. A Restart is valid any time that a Stop is valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an address. The master may want to address the same or another slave. A bus collision can occur on a Start condition if the module samples the SDA line low before asserting it low. This does not conform to the I2C Specification that states no bus collision can occur on a Start. In 10-bit Addressing Slave mode, a Restart is required for the master to clock data out of the addressed slave. Once a slave has been fully addressed, matching both high and low address bytes, the master can issue a Restart and the high address byte with the R/W bit set. The slave logic will then hold the clock and prepare to clock out data. 28.3.6 STOP CONDITION A Stop condition is a transition of the SDA line from low-to-high state while the SCL line is high. After a full match with R/W clear in 10-bit mode, a prior match flag is set and maintained. Until a Stop condition, a high address with R/W clear or a high address match fails. Note: At least one SCL low time must appear before a Stop is valid. Therefore, if the SDA line goes low then high again while the SCL line stays high, only the Start condition is detected. 28.3.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits in the SSPCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. These bits will have no effect on slave modes where interrupt on Start and Stop detect are already enabled. FIGURE 28-4: I2C START AND STOP CONDITIONS SDA SCL S Start Condition FIGURE 28-5: P Change of Data Allowed Change of Data Allowed Stop Condition I2C RESTART CONDITION Sr Change of Data Allowed 2014-2015 Microchip Technology Inc. Restart Condition Change of Data Allowed DS20005281B-page 159 MCP19114/5 28.3.9 ACKNOWLEDGE SEQUENCE th 28.4.2 2 The 9 SCL pulse for any transferred byte in I C is dedicated as an Acknowledge. It allows receiving devices to respond back to the transmitter by pulling the SDA line low. The transmitter must release control of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pulling the SDA line low, indicating to the transmitter that the device has received the transmitted data and is ready to receive more. The result of an ACK is placed in the ACKSTAT bit in the SSPCON2 register. Slave software, when the AHEN and DHEN bits are set, allows the user to set the ACK value sent back to the transmitter. The ACKDT bit in the SSPCON2 register is set/cleared to determine the response. Slave hardware will generate an ACK response if the AHEN and DHEN bits in the SSPCON3 register are clear. There are certain conditions where an ACK will not be sent by the slave. If the BF bit in the SSPSTAT register or the SSPOV bit in the SSPCON1 register are set when a byte is received, the ACK will not be sent. When the module is addressed, after the 8th falling edge of SCL on the bus, the ACKTIM bit in the SSPCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM status bit is only active when the AHEN or DHEN bits are enabled. 28.4 I2C SLAVE MODE OPERATION The MSSP Slave mode operates in one of the four modes selected in the SSPM bits in SSPCON1 register. The modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing mode operates the same as 7-bit, with some additional overhead for handling the larger addresses. Modes with Start and Stop bit interrupts operate the same as the other modes, with SSPIF additionally getting set upon detection of a Start, Restart or Stop condition. 28.4.1 SLAVE MODE ADDRESSES The SSPADD register contains the Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes idle and no indication is given to the software that anything happened. The SSPMSK1 register affects the address matching process. Refer to Section 28.4.10 “SSPMSK1 Register” for more information. DS20005281B-page 160 SECOND SLAVE MODE ADDRESS The SSPADD2 register contains a second 7-bit Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes idle and no indication is given to the software that anything happened. The SSPMSK2 register affects the address matching process. Refer to Section 28.4.10 “SSPMSK1 Register” for more information. 28.4.2.1 I2C Slave 7-Bit Addressing Mode In 7-bit Addressing mode, the LSb of the received data byte is ignored when determining if there is an address match. 28.4.2.2 I2C Slave 10-Bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 and A8 are the two MSb of the 10-bit address and are stored in bits 2 and 1 in the SSPADD register. After the high byte has been acknowledged, the UA bit is set and SCL is held low until the user updates SSPADD with the low address. The low address byte is clocked in, and all 8 bits are compared to the low address value in SSPADD. Even if there is no address match, SSPIF and UA are set and SCL is held low until SSPADD is updated to receive a high byte again. When SSPADD is updated, the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hardware will then acknowledge the read request and prepare to clock out data. This is only valid for a slave after it has received a complete high and low address-byte match. 28.4.3 SLAVE RECEPTION When the R/W bit of a matching received address byte is clear, the R/W bit in the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and acknowledged. When an overflow condition exists for a received address, then Not Acknowledge is given. An overflow condition is defined as either bit BF in the SSPSTAT register is set, or bit SSPOV in the SSPCON1 register is set. The BOEN bit in the SSPCON3 register modifies this operation. For more information, refer to Register 28-4. 2014-2015 Microchip Technology Inc. MCP19114/5 An MSSP interrupt is generated for each transferred data byte. Flag bit SSPIF must be cleared by software. 28.4.3.2 When the SEN bit in the SSPCON2 register is set, SCL will be held low (clock stretch) following each received byte. The clock must be released by setting the CKP bit in the SSPCON1 register, except sometimes in 10-bit mode. Slave device reception with AHEN and DHEN set operates the same as without these options with extra interrupts and clock stretching added after the 8th falling edge of SCL. These additional interrupts allow the slave software to decide whether it wants the ACK to receive address or data byte, rather than the hardware. 28.4.3.1 7-Bit Addressing Reception This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 7-bit Addressing mode, including all decisions made by hardware or software and their effect on reception. Figures 28-5 and 28-6 are used as a visual reference for this description. This is a step-by-step process of what typically must be done to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Start bit detected. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. Matching address with R/W bit clear is received. The slave pulls SDA low, sending an ACK to the master, and sets SSPIF bit. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. If SEN = 1, Slave software sets CKP bit to release the SCL line. The master clocks out a data byte. Slave drives SDA low sending an ACK to the master, and sets SSPIF bit. Software clears SSPIF. Software reads the received byte from SSPBUF clearing BF. Steps 8–12 are repeated for all received bytes from the Master. Master sends Stop condition, setting P bit in the SSPSTAT register, and the bus goes idle. 2014-2015 Microchip Technology Inc. 7-Bit Reception with AHEN and DHEN This list describes the steps that need to be taken by slave software to use these options for I2C communication. Figure 28-7 displays a module using both address and data holding. Figure 28-8 includes the operation with the SEN bit in the SSPCON2 register set. 1. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 2. Matching address with R/W bit clear is clocked in. SSPIF is set and CKP cleared after the 8th falling edge of SCL. 3. Slave clears the SSPIF. 4. Slave can look at the ACKTIM bit in the SSPCON3 register to determine if the SSPIF was after or before the ACK. 5. Slave reads the address value from SSPBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPxIF is set after an ACK, not after a NACK. 9. If SEN = 1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPIF. Note: SSPIF is still set after the 9th falling edge of SCL even if there is no clock stretching and BF has been cleared. Only if NACK is sent to Master is SSPIF not set. 11. SSPIF set and CKP cleared after 8th falling edge of SCL for a received data byte. 12. Slave looks at ACKTIM bit in the SSPCON3 register to determine the source of the interrupt. 13. Slave reads the received data from SSPBUF clearing BF. 14. Steps 7-14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK = 1 or the master sending a Stop condition. If a Stop is sent and Interrupt on Stop Detect is disabled, the slave will only know by polling the P bit in the SSPSTAT register. DS20005281B-page 161 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0) Bus Master sends Stop condition From Slave to Master Receiving Address SDA A7 A6 A5 A4 SCL S 1 2 3 4 Receiving Data A3 A2 A1 5 6 7 ACK 8 9 Receiving Data ACK = 1 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 SSPIF Cleared by software BF SSPBUF is read SSPOV Cleared by software First byte of data is available in SSPBUF SSPOV set because SSPBUF is still full. ACK is not sent. 8 9 P SSPIF set on 9th falling edge of SCL MCP19114/5 DS20005281B-page 162 FIGURE 28-6: 2014-2015 Microchip Technology Inc. 2014-2015 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 28-7: Bus Master sends Stop condition Receive Address SDA SCL A7 A6 A5 A4 A3 A2 A1 S 1 2 3 4 5 6 7 R/W=0 8 9 Receive Data ACK Receive Data D7 D6 D5 D4 D3 D2 D1 D0 ACK SEN 1 2 3 4 5 6 7 8 Clock is held low until CKP is set to ‘1’ 9 ACK D7 D6 D5 D4 D3 D2 D1 D0 SEN 1 2 3 4 5 6 7 8 SSPIF Cleared by software BF SSPBUF is read SSPOV Cleared by software 9 P SSPIF set on 9th falling edge of SCL First byte of data is available in SSPBUF SSPOV set because SSPBUF is still full. ACK is not sent. CKP CKP is written to ‘1’ in software, releasing SCL CKP is written to ‘1’ in software, releasing SCL DS20005281B-page 163 MCP19114/5 SCL is not held low because ACK = 1 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1) Master Releases SDAx to slave for ACK sequence Receiving Address SDA A7 A6 A5 A4 A3 A2 A1 Master sends Stop condition Receiving Data ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK Received Data ACK = 1 D7 D6 D5 D4 D3 D2 D1 D0 SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF If AHEN = 1, SSPIF is set BF ACKDT CKP Address is read from SSBUF ACKTIM 2014-2015 Microchip Technology Inc. ACKTIM set by hardware on 8th falling edge of SCL P Cleared by software Data is read from SSPBUF Slave software clears ACKDT to ACK the received byte When AHEN = 1: CKP is cleared by hardware and SCL is stretched S SSPIF is set on 9th falling edge of SCL, after ACK Slave software sets ACKDT to not ACK When DHEN = 1: CKP is cleared by hardware on 8th falling edge of SCL ACKTIM cleared by hardware on 9th rising edge of SCL CKP set by software, SCL is released ACKTIM set by hardware on 8th falling edge of SCL No interrupt after not ACK from Slave MCP19114/5 DS20005281B-page 164 FIGURE 28-8: 2014-2015 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1) FIGURE 28-9: R/W = 0 Receiving Address SDA A7 A6 A5 A4 A3 A2 A1 SCL S 1 2 3 4 5 6 7 Master sends Stop condition Master releases SDA to slave for ACK sequence Receive Data ACK D7 D6 D5 D4 D3 D2 D1 D0 8 9 1 2 3 4 5 6 7 8 ACK Receive Data D7 D6 D5 D4 D3 D2 D1 D0 9 1 2 3 4 5 6 7 8 SSPIF Received address is loaded into SSPBUF ACKDT Slave software clears ACKDT to ACK the received byte CKP When AHEN = 1: on the 8th falling edge of SCL of an address byte, CKP is cleared ACKTIM ACKTIM is set by hardware on 8th falling edge of SCL P SSPBUF can be read any time before next byte is loaded Slave sends not ACK When DHEN = 1: on the 8th falling edge of SCL of a received data byte, CKP is cleared Set by software, release SCL CKP is not cleared if not ACK ACKTIM is cleared by hardware on 9th rising edge of SCL DS20005281B-page 165 MCP19114/5 S Received data is available on SSPBUF P No interrupt after if not ACK from Slave Cleared by software BF 9 MCP19114/5 28.4.4 SLAVE TRANSMISSION 28.4.4.2 7-Bit Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit in the SSPSTAT register is set. The received address is loaded into the SSPBUF register and an ACK pulse is sent by the slave on the 9th bit. A master device can transmit a read request to a slave, and then it clocks data out of the slave. The list below outlines what software for a slave will need to do to accomplish a standard transmission. Figure 28-10 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit and the SCL pin is held low. Refer to Section 28.4.7 “Clock Stretching” for more details. By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. 1. The transmit data must be loaded into the SSPBUF register, which also loads the SSPSR register. Then the SCL pin should be released by setting the CKP bit in the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. The ACK pulse from the master-receiver is latched on the rising edge of the 9th SCL input pulse. This ACK value is copied to the ACKSTAT bit in the SSPCON2 register. If ACKSTAT is set (not ACK), the data transfer is complete. In this case, when the not ACK is latched by the slave, the slave goes idle and waits for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the SCL pin must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software, and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the 9th clock pulse. 28.4.4.1 Slave Mode Bus Collision A slave receives a Read request and begins shifting data out on the SDA line. If a bus collision is detected and the SBCDE bit in the SSPCON3 register is set, the BCLIF bit in the PIR register is set. Once a bus collision is detected, the slave goes idle and waits to be addressed again. The user’s software can use the BCLIF bit to handle a slave bus collision. DS20005281B-page 166 Master sends a Start condition on SDA and SCL. 2. S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit set is received by the Slave setting SSPIF bit. 4. Slave hardware generates an ACK and sets SSPIF. 5. SSPIF bit is cleared by user. 6. Software reads the received address from SSPBUF, clearing BF. 7. R/W is set so CKP was automatically cleared after the ACK. 8. The slave software loads the transmit data into SSPBUF. 9. CKP bit is set releasing SCL, allowing the master to clock the data out of the slave. 10. SSPIF is set after the ACK response from the master is loaded into the ACKSTAT register. 11. SSPIF bit is cleared. 12. The slave software checks the ACKSTAT bit to see if the master wants to clock out more data. Note 1: If the master ACKs, the clock will be stretched. 2: ACKSTAT is the only bit updated on the rising edge of SCL (9th) rather than on the falling edge. 13. Steps 9–13 are repeated for each transmitted byte. 14. If the master sends a not ACK, the clock is not held but SSPIF is still set. 15. The master sends a Restart condition or a Stop. 16. The slave is no longer addressed. 2014-2015 Microchip Technology Inc. 2014-2015 Microchip Technology Inc. FIGURE 28-10: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0) Master sends Stop condition Receiving Address R/W = 1 Automatic Transmitting Data Automatic Transmitting Data ACK ACK A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SSPIF Cleared by software BF Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL CKP ACKSTAT When R/W is set, SCL is always held low after 9th SCL falling edge Master’s not ACK is copied to ACKSTAT R/W D/A R/W is copied from the matching address byte DS20005281B-page 167 P MCP19114/5 Indicates an address has been received S Set by software CKP is not held for not ACK MCP19114/5 28.4.4.3 7-Bit Transmission with Address Hold Enabled Setting the AHEN bit in the SSPCON3 register enables additional clock stretching and interrupt generation after the 8th falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPIF interrupt is set. Figure 28-11 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. 2. Bus starts idle. Master sends Start condition; the S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the 8th falling edge of the SCL line, the CKP bit is cleared and SSPIF interrupt is generated. 4. Slave software clears SSPIF. 5. Slave software reads ACKTIM bit in the SSPCON3 register and R/W and D/A bits in the SSPSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPBUF register, clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK, and sets ACKDT bit in the SSPCON2 register accordingly. 8. Slave sets the CKP bit releasing SCL. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPIF after the ACK if the R/W bit is set. 11. Slave software clears SSPIF. 12. Slave loads value to transmit to the master into SSPBUF setting the BF bit. Note: SSPBUF cannot be loaded until after the ACK. 13. Slave sets CKP bit releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the 9th SCL pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit in the SSPCON2 register. 16. Steps 10–15 are repeated for each byte transmitted to the master from the slave. 17. If the master sends a not ACK, the slave releases the bus, allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCL line to receive a Stop. DS20005281B-page 168 2014-2015 Microchip Technology Inc. 2014-2015 Microchip Technology Inc. I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1) FIGURE 28-11: Master sends Stop condition Receiving Address R/W = 1 SDA SCL A7 A6 A5 A4 A3 A2 A1 S 1 2 3 4 5 6 7 8 9 SSPIF BF Automatic Transmitting Data Automatic Transmitting Data ACK ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Cleared by software Received address is read from SSPBUF Data to transmit is loaded into SSPBUF BF is automatically cleared after 8th falling edge of SCL ACKDT Slave clears ACKDT to ACK address ACKSTAT Master’s ACK response is copied to SSPSTAT CKP ACKTIM DS20005281B-page 169 D/A ACKTIM is set on 8th falling edge of SCL When R/W = 1: CKP is always cleared after ACK Set by software, releases SCL ACKTIM is set on 9th rising edge of SCL CKP not cleared after not ACK MCP19114/5 R/W When AHEN = 1: CKP is cleared by hardware after receiving matching address. MCP19114/5 28.4.5 SLAVE MODE 10-BIT ADDRESS RECEPTION This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 10-bit Addressing mode. Figure 28-12 is used as a visual reference for this description. This is a step-by-step process of what must be done by slave software to accomplish I2C communication: 1. 2. 3. 4. 5. 6. 7. 8. Bus starts idle. Master sends Start condition; S bit in the SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled. Master sends matching high address with R/W bit clear; UA bit in the SSPSTAT register is set. Slave sends ACK and SSPIF is set. Software clears the SSPIF bit. Software reads received address from SSPBUF, clearing the BF flag. Slave loads low address into SSPADD, releasing SCL. Master sends matching low-address byte to the Slave; UA bit is set. 28.4.6 10-BIT ADDRESSING WITH ADDRESS OR DATA HOLD Reception using 10-bit addressing with AHEN or DHEN set is the same as with 7-bit modes. The only difference is the need to update the SSPADD register using the UA bit. All functionality, specifically when the CKP bit is cleared and the SCL line is held low, is the same. Figure 28-13 can be used as a reference of a slave in 10-bit addressing with AHEN set. Figure 28-14 shows a standard waveform for a slave transmitter in 10-bit Addressing mode. Note: Updates to the SSPADD register are not allowed until after the ACK sequence. 9. Slave sends ACK and SSPIF is set. Note: If the low address does not match, SSPIF and UA are still set so that the slave software can set SSPADD back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPIF. 11. Slave reads the received matching address from SSPBUF, clearing BF. 12. Slave loads high address into SSPADD. 13. Master clocks a data byte to the slave and clocks out the slave’s ACK on the 9th SCL pulse; SSPIF is set. 14. If SEN bit in the SSPCON2 register is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPIF. 16. Slave reads the received byte from SSPBUF, clearing BF. 17. If SEN is set, the slave sets CKP to release the SCL. 18. Steps 13–17 are repeated for each received byte. 19. Master sends Stop to end the transmission. DS20005281B-page 170 2014-2015 Microchip Technology Inc. 2014-2015 Microchip Technology Inc. I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) FIGURE 28-12: Master sends Stop condition Receive First Address Byte SDA S SSPIF BF UA ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK 1 1 1 1 0 A9 A8 SCL 1 2 3 4 5 6 7 Receive Data Receive Data Receive Second Address Byte 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P SCL is held low while CKP = 0 Set by hardware on 9th falling edge Cleared by software Receive address is read from SSPBUF If address matches SSPADD, it is loaded into SSPBUF When UA = 1: SCL is held low Data is read from SSPBUF Software updates SSPADD and releases SCL CKP Set by software, releasing SCL DS20005281B-page 171 MCP19114/5 When SEN = 1: CKP is cleared after 9th falling edge of received byte Receive First Address Byte SDA SCL S 1 1 1 1 0 A9 A8 1 2 3 4 5 6 7 R/W = 0 Receive Second Address Byte ACK A7 A6 A5 A4 A3 A2 A1 A0 8 9 UA 1 2 3 4 5 6 7 8 Receive Data Receive Data ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 9 UA 1 2 3 4 5 6 7 8 9 1 2 SSPIF Set by hardware on 9th falling edge Cleared by software Cleared by software BF ACKDT Slave software clears ACKDT to ACK the received byte SSPBUF can be read anytime before the next received cycle Received data is read from SSPBUF UA Update to SSPADD is not allowed until 9th falling edge of SCL 2014-2015 Microchip Technology Inc. If when AHEN = 1: on the 8th falling edge of SCL of an address byte, CKP is ACKTIM cleared ACKTIM is set by hardware on 8th falling edge of SCL CKP Update of SSPADD, clears UA and releases SCL Set CKP with software releases SCL MCP19114/5 DS20005281B-page 172 I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0) FIGURE 28-13: 2014-2015 Microchip Technology Inc. FIGURE 28-14: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0) Master sends Master sends Stop condition not ACK Master sends Restart event Receiving Address R/W = 0 Receiving Second Address Byte 1 1 1 1 0 A9 A8 ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 Receive First Address Byte 1 1 1 1 0 A9 A8 ACK 1 2 3 4 5 6 7 8 9 Transmitting Data Byte ACK = 1 D7 D6 D5 D4D3 D2 D1 D0 1 2 3 4 5 6 7 8 9 Sr P SSPIF Set by hardware BF UA CKP Cleared by software Received address is read from SSPBUF SSPBUF loaded with received address UA indicates SSPADD must be updated ACKSTAT Set by hardware After SSPADD is updated. UA is cleared and SCL is released Data to transmit is loaded into SSPBUF High address is loaded back into SSPADD When R/W = 1: CKP is cleared on 9th falling edge of SCLx Set by software releases SCL Master’s not ACK is copied R/W R/W is copied from the matching address byte Indicates an address has been received DS20005281B-page 173 MCP19114/5 D/A MCP19114/5 28.4.7 CLOCK STRETCHING 28.4.7.2 Clock stretching occurs when a device on the bus holds the SCL line low, effectively pausing communication. The slave may stretch the clock to allow more time to handle data or prepare a response for the master device. A master device is not concerned with stretching, as it is stretching anytime it is active on the bus and not transferring data. Any stretching done by a slave is invisible to the master software and handled by the hardware that generates SCL. The CKP bit in the SSPCON1 register is used to control stretching in software. Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. Setting CKP will release SCL and allow more communication. 28.4.7.1 Normal Clock Stretching Following an ACK, if the R/W bit in the SSPSTAT register is set, causing a read request, the slave hardware will clear CKP. This allows the slave time to update SSPBUF with data to transfer to the master. If the SEN bit in the SSPCON2 register is set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready, CKP is set by software and communication resumes. Note 1: The BF bit has no effect on whether the clock will be stretched or not. This is different than previous versions of the module that would not stretch the clock or clear CKP if SSPBUF was read before the 9th falling edge of SCL. 2: Previous versions of the module did not stretch the clock for a transmission if SSPBUF was loaded before the 9th falling edge of SCL. It is now always cleared for read requests. FIGURE 28-15: 10-Bit Addressing Mode In 10-bit Addressing mode, when the UA bit is set, the clock is always stretched. This is the only time the SCL is stretched without CKP being cleared. SCL is released immediately after a write to SSPADD. Note: 28.4.7.3 Previous versions of the module did not stretch the clock if the second address byte did not match. Byte NACKing When AHEN bit in the SSPCON3 register is set, CKP is cleared by hardware after the 8th falling edge of SCL for a received matching address byte. When DHEN bit in the SSPCON3 register is set, CKP is cleared after the 8th falling edge of SCL for received data. Stretching after the 8th falling edge of SCL allows the slave to look at the received address or data and decide if it wants to ACK the received data. 28.4.8 CLOCK SYNCHRONIZATION AND THE CKP BIT Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have released SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (refer to Figure 28-16). CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDA DX DX ‚ – 1 SCL CKP Master device asserts clock Master device releases clock WR SSPCON1 DS20005281B-page 174 2014-2015 Microchip Technology Inc. MCP19114/5 28.4.9 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave will prepare to receive the second byte as data, just as it would in 7-bit mode. The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master device. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an acknowledge. If the AHEN bit in the SSPCON3 register is set, just as with any other address reception, the slave hardware will stretch the clock after the 8th falling edge of SCL. The slave must then set its ACKDT value and release the clock with communication progressing as it would normally. The general call address is a reserved address in the I2C protocol, defined as address 0x00. When the GCEN bit in the SSPCON2 register is set, the slave module will automatically ACK the reception of this address regardless of the value stored in SSPADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPBUF and respond. Figure 28-17 shows a general call reception sequence. FIGURE 28-16: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt Receiving Data ACK R/W = 0 ACK D7 D6 D5 D4 D3 D2 D1 D0 General Call Address SDA SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SSPIF BF (SSPSTAT<0>) GCEN (SSPCON2<7>) Cleared by software SSPBUF is read ‘1’ 28.4.10 SSPMSK1 REGISTER An SSP Mask (SSPMSK1) register is available in I2C Slave mode as a mask for the value held in the SSPSR register during an address comparison operation. A zero (‘0’) bit in the SSPMSK1 register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. The SSPMSK1 register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0> only. The SSP mask has no effect during the reception of the first (high) byte of the address. 2014-2015 Microchip Technology Inc. DS20005281B-page 175 MCP19114/5 28.5 I2C MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in the SSPCON1 register and by setting the SSPEN bit. In Master mode, the SDA and SCK pins must be configured as inputs. The MSSP peripheral hardware will override the output driver TRIS controls when necessary, to drive the pins low. The Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set or the bus is idle. In Firmware-Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit condition detection. Start and Stop condition detection is the only active circuitry in this mode. All other communication is done by the user’s software directly manipulating the SDA and SCL lines. The following events will cause the SSP Interrupt Flag bit (SSPIF) to be set (SSP interrupt, if enabled): • • • • • Start condition detected Stop condition detected Data transfer byte transmitted/received Acknowledge transmitted/received Repeated Start generated Note 1: The MSSP module, when configured in I2C Master mode, does not allow queuing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. 2: When in Master mode, Start/Stop detection is masked and an interrupt is generated when the SEN/PEN bit is cleared and the generation is complete. DS20005281B-page 176 28.5.1 I2C MASTER MODE OPERATION The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmit mode, serial data is output through SDA while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. A Baud Rate Generator is used to set the clock frequency output on SCL. Refer to Section 28.6 “Baud Rate Generator” for more details. 28.5.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 28-17). 2014-2015 Microchip Technology Inc. MCP19114/5 FIGURE 28-17: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA DX DX ‚ – 1 SCL deasserted but slave holds SCL low (clock arbitration) SCL allowed to transition high SCL BGR decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h SCL is sampled high, reload takes place and BRG starts its count BRG Reload 28.5.3 WCOL STATUS FLAG If the user writes the SSPBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set, it indicates that an action on SSPBUF was attempted while the module was not idle. Note: 28.5.4 Because queuing of events is not allowed, writing to the lower 5 bits in the SSPCON2 register is disabled until the Start condition is complete. I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN, in the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action FIGURE 28-18: of the SDA being driven low while SCL is high is the Start condition and causes the S bit in the SSPSTAT1 register to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit in the SSPCON2 register will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. Note 1: If, at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if, during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its idle state. 2: The Philips I2C Specification states that a bus collision cannot occur on a Start. FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPSTAT<3>) At completion of Start bit, SDA = 1, hardware clears SEN bit SCL = 1 and sets SSPIF bit TBRG TBRG SDA Write to SSPBUF occurs here 1st bit 2nd bit TBRG SCL S 2014-2015 Microchip Technology Inc. TBRG DS20005281B-page 177 MCP19114/5 28.5.5 I2C MASTER MODE REPEATED START CONDITION TIMING Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. A Repeated Start condition occurs when the RSEN bit in the SSPCON2 register is programmed high and the Master state machine is no longer active. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. SCL is asserted low. Following this, the RSEN bit in the SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit in the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. FIGURE 28-19: 2: A bus collision during the Repeated Start condition occurs if: •SDA is sampled low when SCL goes from low to high. •SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. REPEAT START CONDITION WAVEFORM Write to SSPCON2 occurs here SDA = 1, SCL (no change) S bit set by hardware At completion of Start bit, hardware clears RSEN bit and sets SSPIF SDA = 1, SCL = 1 TBRG TBRG TBRG 1st bit SDA Write to SSPBUF occurs here TBRG SCL Sr Repeated Start DS20005281B-page 178 TBRG 2014-2015 Microchip Technology Inc. MCP19114/5 28.5.6 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full (BF) flag bit and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high. When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the 8th bit is shifted out (the falling edge of the 8th clock), the BF flag is cleared and the master releases the SDA. This allows the slave device being addressed to respond with an ACK bit during the 9th bit time if an address match occurred or if data was received properly. The status of ACK is written into the ACKSTAT bit on the rising edge of the 9th clock. If the master receives an Acknowledge, the Acknowledge Status bit (ACKSTAT) is cleared. If not, the bit is set. After the 9th clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 28-20). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the 8th clock, the master will release the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the 9th clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit in the SSPCON2 register. Following the falling edge of the 9th clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 28.5.6.1 28.5.6.2 If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. 28.5.6.3 2014-2015 Microchip Technology Inc. ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit in the SSPCON2 register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call) or when the slave has properly received its data. 28.5.6.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. BF Status Flag In Transmit mode, the BF bit in the SSPSTAT register is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. WCOL Status Flag 12. 13. Typical Transmit Sequence: The user generates a Start condition by setting the SEN bit in the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. The MSSP module will wait the required start time before any other operation takes place. The user loads the SSPBUF with the slave address to transmit. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. The user loads the SSPBUF with 8 bits of data. Data is shifted out the SDA pin until all 8 bits are transmitted. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. Steps 8-11 are repeated for all transmitted data bytes. The user generates a Stop or Restart condition by setting the PEN or RSEN bits in the SSPCON2 register. Interrupt is generated once the Stop/Restart condition is complete. DS20005281B-page 179 ACKSTAT in SSPCON2 = 1 Write SSPCON2<0> SEN = 1 From slave, clear ACKSTAT bit SSPCON2<6> Transmitting Data or Second Half of 10-bit Address Start condition begins SEN = 0 Transmit Address to Slave SDA A7 A6 A5 A4 A3 R/W = 0 A2 ACK = 0 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 SSPBUF written with 7-bit address and R/W start transmit SCL S 1 2 3 4 5 6 7 8 9 SCL held low while CPU responds to SSPIF 9 P SSPIF Cleared by software Cleared by software service routine from SSP interrupt BF (SSPSTAT<0>) SSPBUF written SEN After Start condition, SEN cleared by hardware 2014-2015 Microchip Technology Inc. PEN R/W SSPBUF is written by software Cleared by software MCP19114/5 DS20005281B-page 180 I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) FIGURE 28-20: MCP19114/5 28.5.7 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable (RCEN) bit in the SSPCON2 register. 28.5.7.4 1. 2. Note: The MSSP module must be in an idle state before the RCEN bit is set or the RCEN bit will be disregarded. The Baud Rate Generator begins counting and, upon each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the 8th clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable (ACKEN) bit in the SSPCON2 register. 28.5.7.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 28.5.7.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 28.5.7.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). 2014-2015 Microchip Technology Inc. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Typical Receive Sequence: The user generates a Start condition by setting the SEN bit in the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. User writes SSPBUF with the slave address to transmit and the R/W bit set. Address is shifted out the SDA pin until all 8 bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit in the SSPCON2 register. The MSSP module generates an interrupt at the end of the 9th clock cycle by setting the SSPIF bit. User sets the RCEN bit in the SSPCON2 register and the Master clocks in a byte from the slave. After the 8th falling edge of SCL, SSPIF and BF are set. Master clears SSPIF and reads the received byte from SSPUF, then clears BF. Master sets ACK value sent to slave in ACKDT bit in the SSPCON2 register and initiates the ACK by setting the ACKEN bit. Masters ACK is clocked out to the Slave and SSPIF is set. The user clears SSPIF. Steps 8-13 are repeated for each received byte from the slave. Master sends a not ACK or Stop to end communication. DS20005281B-page 181 I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 Write to SSPCON2<0> (SEN = 1), ACK from Master begin Start condition Master configured as a receiver SDA = ACKDT = 0 SEN = 0 by programming SSPCON2<3> (RCEN = 1) Write to SSPBUF RCEN = 1, start RCEN cleared ACK from Slave occurs here, start XMIT next receive automatically A7 A6 A5 A4 A3 A2 A1 R/W ACK D7 D6 D5 D4 D3 D2 D1 RCEN cleared automatically PEN bit = 1 written here Receiving Data from Slave Receiving Data from Slave SDA Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 ACK D0 D7 D6 D5 D4 D3 D2 D1 D0 ACK ACK is not sent SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 9 8 SSPIF Cleared by software Cleared by software Cleared by software BF (SSPSTAT<0>) 2 3 4 5 6 7 8 9 Data shifted in on falling edge of CLK Set SSPIF Set SSPIF interrupt at end of receive at end of Acknowledge sequence Set SSPIF interrupt at end of receive SDA = 0, SCLx = 1 while CPU responds to SSPxIR 1 Cleared by software Cleared in software P Bus master terminates transfer Set SSPIF interrupt at end of Acknowledge sequence Set P bit (SSPSTAT<4>) and SSPIF Last bit is shifted into SSPSR and contents are unloaded into SSPBUF SSPOV SSPOV is set because SSPBUF is still full 2014-2015 Microchip Technology Inc. ACKEN RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically MCP19114/5 DS20005281B-page 182 FIGURE 28-21: MCP19114/5 28.5.8 ACKNOWLEDGE SEQUENCE TIMING 28.5.9 A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN, in the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the 9th clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and then, one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit in the SSPSTAT register, is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 28-23). An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable (ACKEN) bit in the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 28-22). 28.5.8.1 STOP CONDITION TIMING 28.5.9.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, WCOL is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 28-22: ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, write to SSPCON2 ACKEN = 1, ACKDT = 0 SDA ACKEN automatically cleared SCL TBRG TBRG D0 ACK 8 9 SSPIF SSPIF set at the end of receive Note: TBRG = one Baud Rate Generator period. FIGURE 28-23: Cleared in software STOP CONDITION RECEIVE OR TRANSMIT MODE SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set Write to SSPCON2, set PEN Falling edge of 9th clock TBRG SCL SDA ACK TBRG Note: Cleared in software SSPIF set at the end of Acknowledge sequence P TBRG TBRG SCL brought high after TBRG TBRG = one Baud Rate Generator period. 2014-2015 Microchip Technology Inc. DS20005281B-page 183 MCP19114/5 28.5.10 SLEEP OPERATION 28.5.13 2 While in Sleep mode, the I C slave module can receive addresses or data and, when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 28.5.11 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 28.5.12 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSPx module is disabled. Control of the I 2C bus may be taken when the P bit in the SSPSTAT register is set or the bus is idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • • • • • Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA by letting SDA float high, and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’, a bus collision has taken place. The master will set the Bus Collision Interrupt Flag (BCLIF) and reset the I2C port to its Idle state (Figure 28-24). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is idle and the S and P bits are cleared. FIGURE 28-24: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Data changes while SCL = 0 SDA line pulled low Sample SDA. While SCL is high, by another source data does not match what is driven by the master. Bus collision has occurred. SDA released by master SDA SCL Set Bus Collision Interrupt (BCLIF) BCLIF DS20005281B-page 184 2014-2015 Microchip Technology Inc. MCP19114/5 28.5.13.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 28-25) SCL is sampled low before SDA is asserted low (Figure 28-26) During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 28-27). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to zero; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: If the SDA pin is already low or the SCL pin is already low, all of the following occur: • the Start condition is aborted • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 28-25) The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. FIGURE 28-25: The reason why bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. BUS COLLISION DURING A START CONDITION (SDA ONLY) SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1. SDA SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN BCLIF SEN cleared automatically because of bus collision. SSP module reset into Idle state. SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. SSPIF and BCLIF are cleared by software S SSPIF SSPIF and BCLIF are cleared by software 2014-2015 Microchip Technology Inc. DS20005281B-page 185 MCP19114/5 FIGURE 28-26: BUS COLLISION DURING A START CONDITION (SCL = 0) SDA = 0, SCL = 1 TBRG TBRG SDA SCL Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SEN SCL = 0 before BRG time out, bus collision occurs. Set BCLIF. BCLIF S ‘0’ SSPIF ‘0’ FIGURE 28-27: Interrupt cleared by software ‘0’ ‘0’ BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA = 0, SCL = 1 Set S Less than Tbrg T Set SSPIF BRG SDA SDA pulled low by other master. Reset BRG and assert SDAx. SCL s SCLx pulled low after BRG time out SEN BCLIF Set SEN, enable Start sequence if SDA = 1, SCL = 1 ‘0’ S SSPIF DS20005281B-page 186 SDAx = 0, SCL = 1, set SSPIF Interrupts cleared by software 2014-2015 Microchip Technology Inc. MCP19114/5 28.5.13.2 Bus Collision During a Repeated Start Condition If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 28-28). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high to low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from low level to high level SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’ If SCL goes from high to low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition (refer to Figure 28-29). When the user releases SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to zero. The SCL pin is then deasserted and, when sampled high, the SDA pin is sampled. FIGURE 28-28: If, at the end of the BRG time out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDA SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN BCLIF Cleared by software ‘0’ S ‘0’ SSPIF FIGURE 28-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 2) TBRG TBRG SDA SCL BCLIF SCL goes low before SDA, set BCLIF. Release SDA and SCL. RSEN Interrupt cleared by software S ‘0’ SSPIF ‘0’ 2014-2015 Microchip Technology Inc. DS20005281B-page 187 MCP19114/5 28.5.13.3 Bus Collision During a Stop Condition The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 28-30). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 28-31). Bus collision occurs during a Stop condition if: a) b) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. FIGURE 28-30: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG SDA sampled low after TBRG, set BCLIF TBRG SDA SCL SDA asserted low PEN BCLIF P ‘0’ SSPIF ‘0’ FIGURE 28-31: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG SDA Assert SDA TBRG TBRG SCL goes low before SDA goes high, set BCLIF SCL PEN BCLIF P ‘0’ SSPIF ‘0’ DS20005281B-page 188 2014-2015 Microchip Technology Inc. MCP19114/5 TABLE 28-2: SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: INTCON GIE PEIE T0IE INTE IOCE T0IF INTF IOCF 95 — ADIE BCLIE SSPIE CC2IE CC1IE TMR2IE TMR1IE 96 PIE1 — ADIF BCLIF SSPIF CC2IF CC1IF TMR2IF TMR1IF 98 TRISGPA PIR1 TRISA7 TRISA6 TRISA5 — TRISA3 TRISA2 TRISA1 TRISA0 113 TRISGPB TRISB7 TRISB6 TRISB5 TRISB4 — — TRISB1 TRISB0 118 SSPADD ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 196 WCOL SSPOV SSPEN CKP SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE SSPMSK1 MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 SSPSTAT SMP CKE D/A P S R/W SSPMSK2 MSK27 MSK26 MSK25 MSK24 MSK23 SSPADD2 ADD27 ADD26 ADD25 ADD24 ADD23 SSPBUF SSPCON1 Synchronous Serial Port Receive Buffer/Transmit Register SSPM3 SSPM2 155* SSPM1 SSPM0 192 RSEN SEN 194 AHEN DHEN 195 MSK1 MSK0 196 UA BF 191 MSK22 MSK21 MSK20 197 ADD22 ADD21 ADD20 197 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I * Page provides register information. 2014-2015 Microchip Technology Inc. 2C mode. DS20005281B-page 189 MCP19114/5 28.6 Baud Rate Generator The MSSP module has a Baud Rate Generator available for clock generation in the I2C Master mode. The Baud Rate Generator (BRG) reload value is placed in the SSPADD register. When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting down. Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will remain in its last state. An internal signal “Reload” in Figure 28-32 triggers the value from SSPADD to be loaded into the BRG counter. This occurs twice for each oscillation of the module clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is being operated in. Table 28-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 28-1: FOSC F CLOCK = --------------------------------------------- SSPADD + 1 4 FIGURE 28-32: BAUD RATE GENERATOR BLOCK DIAGRAM SSPM<3:0> SSPM<3:0> SCL Reload Control SSPCLK Note: Reload BRG Down Counter FOSC/2 Values of 0x00, 0x01 and 0x02 are not valid for SSPADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 28-3: Note 1: SSPADD<7:0> MSSP CLOCK RATE W/BRG FOSC FCY BRG Value FCLOCK (2 Rollovers of BRG) 8 MHz 2 MHz 04h 400 kHz(1) 8 MHz 2 MHz 0Bh 166 kHz 8 MHz 2 MHz 13h 100 kHz The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. DS20005281B-page 190 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 28-1: SSPSTAT: SSP STATUS REGISTER R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SMP: Data Input Sample bit 1 = Slew rate control disabled for standard-speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high-speed mode (400 kHz) bit 6 CKE: Clock Edge Select bit 1 = Enable input logic so that thresholds are compliant with SM bus specification 0 = Disable SM bus specific inputs bit 5 D/A: Data/Address bit 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I2 C Slave mode: 1 = Read 0 = Write In I2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full status bit Receive: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Transmit: 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty 2014-2015 Microchip Technology Inc. DS20005281B-page 191 MCP19114/5 REGISTER 28-2: SSPCON1: SSP CONTROL REGISTER 1 R/C/HS-0 R/C/HS-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP R/W-0 R/W-0 R/W-0 R/W-0 SSPM<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) 1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output 1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In I2 C Slave mode: SCL release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I2 C Master mode: Unused in this mode Note 1: 2: 3: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, the SDA and SCL pins must be configured as inputs. SSPADD values of 0, 1 or 2 are not supported for I2C mode. DS20005281B-page 192 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 28-2: bit 3-0 SSPCON1: SSP CONTROL REGISTER 1 (CONTINUED) SSPM<3:0>: Synchronous Serial Port Mode Select bits 0000 = Reserved 0001 = Reserved 0010 = Reserved 0011 = Reserved 0100 = Reserved 0101 = Reserved 0110 = I2C Slave mode, 7-bit address 0111 = I2C Slave mode, 10-bit address 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD+1))(3) 1001 = Reserved 1010 = Reserved 1011 = I2C Firmware-Controlled Master mode (Slave idle) 1100 = Reserved 1101 = Reserved 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled Note 1: 2: 3: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, the SDA and SCL pins must be configured as inputs. SSPADD values of 0, 1 or 2 are not supported for I2C mode. 2014-2015 Microchip Technology Inc. DS20005281B-page 193 MCP19114/5 REGISTER 28-3: SSPCON2: SSP CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared H = Bit is set by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR register 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only) 1 = Enables Receive mode for I2C 0 = Receive idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only) SCK Release Control: 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition idle bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition idle bit 0 SEN: Start Condition Enabled bit (in I2C Master mode only) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition idle In Slave mode: 1 = Clock stretching is enabled for both Slave Transmit and Slave Receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). DS20005281B-page 194 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 28-4: SSPCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ACKTIM: Acknowledge Time status bit (I2C mode only)(2) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCL clock 0 = Not an Acknowledge sequence, cleared on 9th rising edge of SCL clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(1) bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(1) bit 4 BOEN: Buffer Overwrite Enable bit In I2C Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPBUF is only updated when SSPOV is clear. bit 3 SDAHT: SDA Hold Time Selection bit 1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If, on the rising edge of SCL, SDA is sampled low when the module outputs a high state, the BCLIF bit in the PIR1 register is set and bus goes idle. 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit in the SSPCON1 register will be cleared and the SCL will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit in the SSPCON1 register and SCL is held low. 0 = Data holding is disabled Note 1: 2: This bit has no effect in Slave modes where Start and Stop condition detection is explicitly listed as enabled. The ACKTIM status bit is only active when the AHEN bit or DHEN bit is set. 2014-2015 Microchip Technology Inc. DS20005281B-page 195 MCP19114/5 REGISTER 28-5: R/W-1 SSPMSK1: SSP MASK REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 28-6: R/W-0 SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC 10-Bit Slave mode — Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address. bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode — Least Significant Address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. DS20005281B-page 196 2014-2015 Microchip Technology Inc. MCP19114/5 REGISTER 28-7: R/W-1 SSPMSK2: SSP MASK REGISTER 2 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK2<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD2<n> to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK2<0>: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD2<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 28-8: R/W-0 SSPADD2: MSSP ADDRESS 2 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD2<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD2<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) * 4)/FOSC 10-Bit Slave mode — Most Significant Address byte: bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD2<2:1>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode — Least Significant Address byte: bit 7-0 ADD2<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD2<7:1>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 2014-2015 Microchip Technology Inc. DS20005281B-page 197 MCP19114/5 NOTES: DS20005281B-page 198 2014-2015 Microchip Technology Inc. MCP19114/5 29.0 INSTRUCTION SET SUMMARY The MCP19114/5 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each instruction is a 14-bit word divided into an opcode, which specifies the instruction type, and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 29-1, while the various opcode fields are summarized in Table 29-1. Table 29-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 µs. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as an NOP. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. TABLE 29-1: OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-Out bit C DC Z Carry bit Digit carry bit Zero bit PD Power-down bit FIGURE 29-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 29.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTGPA, clear all the data bits, then write the result back to PORTGPA. This example would have the unintended consequence of clearing the condition that sets the IOCIF flag. 2014-2015 Microchip Technology Inc. 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value DS20005281B-page 199 MCP19114/5 TABLE 29-2: MCP19114/5 INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Notes Affected BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff C, DC, Z Z ffff Z ffff Z xxxx ffff Z ffff Z ffff ffff Z ffff ffff Z ffff Z ffff 0000 ffff C ffff C ffff C, DC, Z ffff ffff Z bfff bfff bfff bfff ffff ffff ffff ffff kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk C, DC, Z kkkk Z kkkk 0100 TO, PD kkkk Z kkkk kkkk 1001 kkkk 1000 0011 TO, PD kkkk C, DC, Z Z kkkk 1, 2 1, 2 2 1, 2 1, 2 1, 2, 3 1, 2 1, 2, 3 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k – k k k – k – – k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as an NOP. DS20005281B-page 200 2014-2015 Microchip Technology Inc. MCP19114/5 29.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW Operands: 0 k 255 Operation: (W) + k (W) Status Affected: Description: BCF Bit Clear f Syntax: [ label ] BCF Operands: 0 f 127 0b7 C, DC, Z Operation: 0 (f<b>) The contents of the W register are added to the 8-bit literal ‘k’ and the result is placed in the W register. Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. ADDWF Add W and f BSF Bit Set f Syntax: [ label ] ADDWF Syntax: [ label ] BSF Operands: 0 f 127 d 0,1 Operands: 0 f 127 0b7 Operation: (W) + (f) (destination) Operation: 1 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Bit ‘b’ in register ‘f’ is set. ANDLW AND literal with W BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDLW Syntax: [ label ] BTFSC f,b Operands: 0 k 255 Operands: Operation: (W) .AND. (k) (W) 0 f 127 0b7 Status Affected: Z Operation: skip if (f<b>) = 0 Description: The contents of W register are AND’ed with the 8-bit literal ‘k’. The result is placed in the W register. Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is discarded, and an NOP is executed instead, making this a two-cycle instruction. ANDWF AND W with f Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2014-2015 Microchip Technology Inc. k f,d k f,b f,b f,d DS20005281B-page 201 MCP19114/5 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0 f 127 0b<7 Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Bits TO and PD in the STATUS register are set. Operation: skip if (f<b>) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, the next instruction is discarded and an NOP is executed instead, making this a two-cycle instruction. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF Operands: 0 k 2047 Operands: Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Status Affected: None Description: Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The 11-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRF Clear f DECF Decrement f Syntax: [ label ] CLRF Syntax: [ label ] DECF f,d Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW f Operands: None Operation: 00h (W) 1Z Status Affected: Z Description: W register is cleared. Zero (Z) bit is set. DS20005281B-page 202 f,d 2014-2015 Microchip Technology Inc. MCP19114/5 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, an NOP is executed instead, making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, an NOP is executed instead, making it a two-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The 11-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR’ed with the 8-bit literal ‘k’. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] 0 f 127 d [0,1] Operands: Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. GOTO k INCF f,d 2014-2015 Microchip Technology Inc. INCFSZ f,d IORLW k IORWF f,d DS20005281B-page 203 MCP19114/5 MOVF Move f MOVWF Syntax: [ label ] MOVF f,d Operands: 0 f 127 d [0,1] Operation: (f) (dest) Status Affected: Z Description: The contents of register ‘f’ are moved to a destination dependent upon the status of ‘d’. If d = 0, the destination is W register. If d = 1, the destination is file register ‘f’ itself. d = 1 is useful to test a file register since STATUS flag Z is affected. Words: 1 Cycles: 1 Example: MOVF FSR, Syntax: Move W to f [ label ] MOVWF f Operands: 0 f 127 Operation: (W) (f) Status Affected: None Description: Move data from W register to register ‘f’. Words: 1 Cycles: 1 Example: MOVW F OPTION Before Instruction OPTION = W = After Instruction OPTION = W = 0 0xFF 0x4F 0x4F 0x4F After Instruction W = value in FSR register Z = 1 MOVLW NOP Move literal to W No Operation Syntax: [ label ] 0 k 255 Operands: None Operation: k (W) Operation: No operation Status Affected: None Status Affected: None Description: No operation. Description: The 8-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Words: 1 Cycles: 1 Words: 1 Example: NOP Cycles: 1 Syntax: [ label ] Operands: Example: MOVLW MOVLW k 0x5A After Instruction W = DS20005281B-page 204 NOP 0x5A 2014-2015 Microchip Technology Inc. MCP19114/5 RETFIE Return from Interrupt Return from Subroutine Syntax: [ label ] Syntax: [ label ] Operands: None Operands: None Operation: TOS PC, 1 GIE Operation: TOS PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Description: Return from subroutine. The stack is POPed and the Top-of-Stack (TOS) is loaded into the program counter. This is a two-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE RETFIE RETURN After Interrupt PC = GIE = RETLW TOS 1 Rotate Left f through Carry Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: See description below Syntax: [ label ] 0 k 255 Operation: k (W); TOS PC None Description: The W register is loaded with the 8-bit literal ‘k’. The program counter is loaded from the Top-of-Stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: CALL TABLE;W contains ;table offset ;value GOTO DONE • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ;End of table f,d C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. RETLW k Status Affected: RLF Status Affected: Return with literal in W Operands: TABLE RLF RETURN C Words: 1 Cycles: 1 Example: RLF Register f REG1,0 Before Instruction REG1 C = = 1110 0110 0 = = = 1110 0110 1100 1100 1 After Instruction REG1 W C DONE Before Instruction W = 0x07 After Instruction W = value of k8 2014-2015 Microchip Technology Inc. DS20005281B-page 205 MCP19114/5 RRF Rotate Right f through Carry SUBWF Subtract W from f Syntax: [ label ] Syntax: [ label ] SUBWF f,d Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: See description below Operation: (f) - (W) destination) Status Affected: C Status Affected: C, DC, Z Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Description: RRF f,d C Register f Subtract (two’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SLEEP Enter Sleep mode SWAPF Swap Nibbles in f Syntax: [ label ] SLEEP Syntax: [ label ] SWAPF f,d Operands: None Operands: Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. Status Affected: TO, PD Description: The power-down STATUS bit, PD, is cleared. Time-Out STATUS bit, TO, is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) SUBLW Subtract W from literal Syntax: [ label ] SUBLW k Operands: 0 k 255 Operation: k - (W) W) Status Affected: Z Description: The contents of the W register are XOR’ed with the 8-bit literal ‘k’. The result is placed in the W register. Status Affected: C, DC, Z Description: The W register is subtracted (two’s complement method) from the 8-bit literal ‘k’. The result is placed in the W register. Result Condition C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> DS20005281B-page 206 2014-2015 Microchip Technology Inc. MCP19114/5 XORWF Exclusive OR W with f Syntax: [ label ] XORWF Operands: 0 f 127 d [0,1] Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2014-2015 Microchip Technology Inc. f,d DS20005281B-page 207 MCP19114/5 NOTES: DS20005281B-page 208 2014-2015 Microchip Technology Inc. MCP19114/5 30.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) 30.1 Common Programming Interfaces Connection to a target device is typically done through an ICSP header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6-pin, 6connector) configuration. Refer to Figure 30-1. ICSP allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP programming: • ICSPCLK • ICSPDAT • MCLR • VDD • VSS (AGND) FIGURE 30-1: In Program/Verify mode, the Program Memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. The device is placed into a Program/Verify mode by holding the ICSPDAT and ICSPCLK pins low, while raising the MCLR pin from VIL to VIHH. ICD RJ-11 STYLE CONNECTOR INTERFACE ICSPDAT NC ICSPCLK 5 Target PC Board VSS Bottom Side 2 4 6 VDD 1 3 MCLR Pin Description* 1 = MCLR 2 = VDD Target 3 = VSS (Ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 30-2. FIGURE 30-2: PICkit™ STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 = MCLR 1 2 3 4 5 6 2 = VDD Target 3 = VSS (AGND) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins. 2014-2015 Microchip Technology Inc. DS20005281B-page 209 MCP19114/5 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes or even jumpers. Refer to Figure 30-3 for more information. FIGURE 30-3: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING External Programming Signals VDD Device to be programmed VDD VDD VPP MCLR VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Note: DS20005281B-page 210 Isolation devices (as required). If powering via back feeding VDD, VDD must be tied to VIN. 2014-2015 Microchip Technology Inc. MCP19114/5 31.0 DEVELOPMENT SUPPORT The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® X IDE Software • Compilers/Assemblers/Linkers - MPLAB XC Compiler - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB X SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers/Programmers - MPLAB ICD 3 - PICkit™ 3 • Device Programmers - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits and Starter Kits • Third-party development tools 31.1 MPLAB X Integrated Development Environment Software The MPLAB X IDE is a single, unified graphical user interface for Microchip and third-party software, and hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, MPLAB X IDE is an entirely new IDE with a host of free software components and plug-ins for high-performance application development and debugging. Moving between tools and upgrading from software simulators to hardware debugging and programming tools is simple with the seamless user interface. With complete project management, visual call graphs, a configurable watch window and a feature-rich editor that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new users. With the ability to support multiple tools on multiple projects with simultaneous debugging, MPLAB X IDE is also suitable for the needs of experienced users. Feature-Rich Editor: • Color syntax highlighting • Smart code completion makes suggestions and provides hints as you type • Automatic code formatting based on user-defined rules • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • • • • Multiple projects Multiple tools Multiple configurations Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker 2014-2015 Microchip Technology Inc. DS20005281B-page 211 MCP19114/5 31.2 MPLAB XC Compilers The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU and DSC devices. These compilers provide powerful integration capabilities, superior code optimization and ease of use. MPLAB XC Compilers run on Windows, Linux or MAC OS X. For easy source level debugging, the compilers provide debug information that is optimized to the MPLAB X IDE. The free MPLAB XC Compiler editions support all devices and commands, with no time or memory restrictions, and offer sufficient code optimization for most applications. MPLAB XC Compilers include an assembler, linker and utilities. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to produce its object file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility 31.3 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code, and COFF files for debugging. The MPASM Assembler features include: 31.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 31.5 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC DSC devices. MPLAB XC Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process DS20005281B-page 212 2014-2015 Microchip Technology Inc. MCP19114/5 31.6 MPLAB X SIM Software Simulator The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB X SIM Software Simulator fully supports symbolic debugging using the MPLAB XC Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 31.7 MPLAB REAL ICE In-Circuit Emulator System The MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs all 8, 16 and 32-bit MCU, and DSC devices with the easy-to-use, powerful graphical user interface of the MPLAB X IDE. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) or with the new high-speed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE offers significant advantages over competitive emulators including full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, logic probes, a ruggedized probe interface and long (up to three meters) interconnection cables. 2014-2015 Microchip Technology Inc. 31.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB ICD 3 In-Circuit Debugger System is Microchip’s most cost-effective, high-speed hardware debugger/programmer for Microchip Flash DSC and MCU devices. It debugs and programs PIC Flash microcontrollers and dsPIC DSCs with the powerful, yet easy-to-use graphical user interface of the MPLAB IDE. The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 31.9 PICkit 3 In-Circuit Debugger/Programmer The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB IDE. The MPLAB PICkit 3 is connected to the design engineer’s PC using a full-speed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the Reset line to implement in-circuit debugging and In-Circuit Serial Programming™ (ICSP™). 31.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various package types. The ICSP cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS20005281B-page 213 MCP19114/5 31.11 Demonstration/Development Boards, Evaluation Kits and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. 31.12 Third-Party Development Tools Microchip also offers a great collection of tools from third-party vendors. These tools are carefully selected to offer good value and unique functionality. • Device Programmers and Gang Programmers from companies, such as SoftLog and CCS • Software Tools from companies, such as Gimpel and Trace Systems • Protocol Analyzers from companies, such as Saleae and Total Phase • Demonstration Boards from companies, such as MikroElektronika, Digilent® and Olimex • Embedded Ethernet Solutions from companies, such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS20005281B-page 214 2014-2015 Microchip Technology Inc. MCP19114/5 32.0 PACKAGING INFORMATION 32.1 Package Marking Information 24-Lead QFN (4x4x0.9 mm) (MCP19114 only) PIN 1 Example PIN 1 28-Lead QFN (5x5x0.9 mm) 19114 E/MJ^^ e3 1450 256 Example PIN 1 PIN 1 19115 E/MQ^^ e3 1450256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2014-2015 Microchip Technology Inc. DS20005281B-page 215 MCP19114/5 24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005281B-page 216 2014-2015 Microchip Technology Inc. MCP19114/5 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2015 Microchip Technology Inc. DS20005281B-page 217 MCP19114/5 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.10 C 2X TOP VIEW 0.10 C 0.10 C C SEATING PLANE A1 A 28X A3 SIDE VIEW 0.08 C 0.10 C A B D2 0.10 C A B E2 28X K 2 1 NOTE 1 N 28X L e BOTTOM VIEW 28X b 0.10 0.05 C A B C Microchip Technology Drawing C04-140C Sheet 1 of 2 DS20005281B-page 218 2014-2015 Microchip Technology Inc. MCP19114/5 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Contact Thickness A3 Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 3.15 3.15 0.18 0.35 0.20 MILLIMETERS NOM 28 0.50 BSC 0.90 0.02 0.20 REF 5.00 BSC 3.25 5.00 BSC 3.25 0.25 0.40 - MAX 1.00 0.05 3.35 3.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-140C Sheet 2 of 2 2014-2015 Microchip Technology Inc. DS20005281B-page 219 MCP19114/5 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A DS20005281B-page 220 2014-2015 Microchip Technology Inc. MCP19114/5 APPENDIX A: REVISION HISTORY Revision B (February 2015) The following is the list of modifications: 1. 2. 3. 4. Updated the Features section. Updated the Electrical Characteristics table. Updated Tables 5-5 and 5-6. Updated Section 2.0 “Pin Description” with a note on GPIO power-up. 5. Updated Section 6.1 “Input Undervoltage and Overvoltage Lockout (UVLO and OVLO)”. 6. Updated Figure 7-14 and added Figures 7-15 and 7-16 in Section 7.0 “Typical Performance Curves”. 7. Updated Section 13.1 “Power-On Reset (POR)” and Section 13.3 “Brown-Out Reset (BOR)”. 8. Updated Section 15.0 “Power-Down Mode (Sleep)”. 9. Updated Section 20.2 “Temperature Output”. 10. Updated Equation 20-1. Revision A (March 2014) • Original Release of this Document. 2014-2015 Microchip Technology Inc. DS20005281B-page 221 MCP19114/5 NOTES: DS20005281B-page 222 2014-2015 Microchip Technology Inc. MCP19114/5 INDEX A A/D Specifications...................................................... 3, 5, 35 A/D Conversion. See ADC ABECON Register .............................................................. 49 Absolute Maximum Ratings ................................................ 22 AC Characteristics .............................................................. 30 ACKSTAT Status Flag................................................................ 179 ADC .................................................................................. 127 10-Bit Result Format ................................................. 129 Acquisition Requirements ......................................... 133 Associated Registers ................................................ 135 Block Diagram........................................................... 127 Calculating Acquisition Time..................................... 133 Channel Selection..................................................... 128 Configuration............................................................. 128 Configuring Interrupt ................................................. 130 Conversion Clock...................................................... 128 Conversion Procedure .............................................. 130 Internal Sampling Switch (RSS) Impedance.............. 133 Interrupts................................................................... 129 Operation .................................................................. 130 Operation During Sleep ............................................ 130 Port Configuration ..................................................... 128 Register Definitions................................................... 131 Requirements.............................................................. 35 Source Impedance (RS)............................................ 133 Timing Diagram........................................................... 36 ADCON0 Register....................................................... 57, 131 ADCON1 Register............................................................. 132 ADRESH Register............................................................. 132 ADRESL Register ............................................................. 132 Analog Blocks Enable Control ............................................ 49 Error Amplifier Disable ................................................ 49 Analog Peripheral Control ................................................... 48 PWM Steering............................................................. 48 Secondary Current Positive Sense Pull-Up ................ 48 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 114 ANSELB Register ............................................................. 119 Application Diagrams MCP19114 Boost Quasi-Resonant............................. 11 MCP19114 Cuk’ Synchronous Positive Output .......... 11 Assembler MPASM Assembler................................................... 212 B Bench Testing System ........................................................................ 57 BF ..................................................................................... 181 Status Flag................................................................ 179 BF Status Flag .................................................................. 181 Block Diagrams ADC .......................................................................... 127 ADC Transfer Function ............................................. 134 Analog Input Model ................................................... 134 Baud Rate Generator................................................ 190 Capture Mode Operation .......................................... 149 Compare Mode Operation ........................................ 150 Interrupt Logic ............................................................. 94 MCP19114/5 Flyback Synchronous Quasi-Resonant. 10 Microcontroller Core.................................................... 12 2014-2015 Microchip Technology Inc. MSSP (I2C Master Mode)......................................... 155 MSSP (I2C Slave Mode)........................................... 156 On-Chip Reset Circuit................................................. 85 Pulse-Width Modulation (PWM) ............................... 146 Recommended MCLR Circuit..................................... 86 Timer0 ...................................................................... 137 Timer1 ...................................................................... 139 Timer2 ...................................................................... 143 Watchdog Timer with Shared Prescale .................... 103 Brown-Out Reset (BOR) ..................................................... 87 C C Compilers MPLAB XC ............................................................... 212 Calibration Word Registers CALWD1 (Calibration Word 1) ................................... 59 CALWD10 (Calibration Word 10) ............................... 66 CALWD11 (Calibration Word 11) ............................... 67 CALWD2 (Calibration Word 2) ................................... 60 CALWD3 (Calibration Word 3) ................................... 61 CALWD4 (Calibration Word 4) ................................... 61 CALWD5 (Calibration Word 5) ................................... 62 CALWD6 (Calibration Word 6) ................................... 62 CALWD7 (Calibration Word 7) ................................... 63 CALWD8 (Calibration Word 8) ................................... 64 CALWD9 (Calibration Word 9) ................................... 65 Capture Mode Block Diagram .......................................................... 149 Capture/Compare (CCD) Module Capture Mode........................................................... 149 CCP1IF............................................................. 149 CCX Pin Configuration ..................................... 149 Prescaler .......................................................... 149 Software Interrupt ............................................. 149 Timer1 Mode Selection..................................... 149 Compare Mode CCP1IF............................................................. 150 CMPX Pin Configuration................................... 150 Software Interrupt ............................................. 150 Special Event Trigger ....................................... 150 Timer1 Mode Selection..................................... 150 Register .................................................................... 151 CCDCON Register............................................................ 151 Clock Switching .................................................................. 84 Code Example Indirect Addressing..................................................... 80 Code Examples A/D Conversion ........................................................ 130 Assigning Prescaler to Timer0.................................. 138 Assigning Prescaler to WDT..................................... 138 Initializing PORTGPA ............................................... 111 Saving Status and W Registers in RAM ................... 100 Compare Mode Block Diagram .......................................................... 150 Computed Function Calls ................................................... 79 Computed GOTO................................................................ 79 Configuration Word............................................................. 81 Registers Associated with Clock Sources .................. 84 with Watchdog Timer................................................ 104 Current Sense .................................................................... 19 Customer Change Notification Service............................. 229 Customer Support............................................................. 229 DS20005281B-page 223 MCP19114/5 D I Data Memory Core Registers ............................................................ 71 STATUS Register ............................................... 71 General Purpose Registers......................................... 70 Map ............................................................................. 73 Organization................................................................ 70 Special Function Registers ................................... 70, 72 DC and AC Characteristics ................................................. 53 Graphs and Tables ..................................................... 53 DEADCON Register............................................................ 45 DESATCON Register.......................................................... 41 Desaturation Detection for Quasi-Resonant Operation....... 41 Development Support ....................................................... 211 Device Calibration ............................................................... 59 CALWD1 (Calibration Word 1) .................................... 59 CALWD10 (Calibration Word 10) ................................ 66 CALWD11 (Calibration Word 11) ................................ 67 CALWD2 (Calibration Word 2) .................................... 60 CALWD3 (Calibration Word 3) .................................... 61 CALWD4 (Calibration Word 4) .................................... 61 CALWD5 (Calibration Word 5) .................................... 62 CALWD6 (Calibration Word 6) .................................... 62 CALWD7 (Calibration Word 7) .................................... 63 CALWD8 (Calibration Word 8) .................................... 64 CALWD9 (Calibration Word 9) .................................... 65 Device Configuration..................................................... 37, 81 Code Protection .......................................................... 82 Configuration Word ..................................................... 81 ID Locations ................................................................ 82 Write Protection .......................................................... 82 Device Overview ................................................................... 9 Digital Electrical Characteristics.......................................... 29 Direct Addressing................................................................ 80 Driver Control Circuitry........................................................ 20 I/O E Electrical Characteristics..................................................... 22 Errata .................................................................................... 7 External Clock Timing ......................................................................... 30 Timing Requirements .................................................. 30 F Features ................................................................................ 1 Microcontroller .............................................................. 1 Timer0 Module .......................................................... 137 Timer1 Module .......................................................... 139 File Select Register. See FSR Firmware Instructions........................................................ 199 Flash Program Memory Control ...................................................................... 105 Operation During Code Protect......................... 109 Operation During Write Protect......................... 109 Protection Against Spurious Write .................... 109 Registers........................................................... 106 Reading..................................................................... 108 Writing to ................................................................... 109 FSR Register....................................................................... 79 G General Purpose Register. See GPR GPR Register....................................................................... 70 DS20005281B-page 224 Ports ......................................................................... 111 I2C Mode (MSSP) Acknowledge Sequence ........................................... 160 Acknowledge Sequence Timing ............................... 183 Associated Registers ................................................ 189 Bus Collision During a Repeated Start Condition................... 187 During a Start Condition ................................... 185 During a Stop Condition ................................... 188 Effects of a Reset ..................................................... 184 I2C Clock Rate w/BRG.............................................. 190 Master Mode............................................................. 176 Clock Arbitration ............................................... 176 Operation.......................................................... 176 Reception ......................................................... 181 Repeated Start Condition Timing ..................... 178 Start Condition Timing ...................................... 177 Transmission .................................................... 179 Multi-Master Communication, Bus Collision and Arbitration.................................................................... 184 Multi-Master Mode .................................................... 184 Operation .................................................................. 158 Overview................................................................... 156 Read/Write Bit Information (R/W Bit) ........................ 160 Slave Mode 10-bit Address Reception ................................. 170 Bus Collision..................................................... 166 Clock Stretching ............................................... 174 Clock Synchronization ...................................... 174 General Call Address Support .......................... 175 Operation.......................................................... 160 SSPMSK1 Register .......................................... 175 Transmission .................................................... 166 Sleep Operation........................................................ 184 Stop Condition Timing .............................................. 183 ICLEBCON Register ........................................................... 43 ICOACON Register............................................................. 42 In-Circuit Serial Programming (ICSP)............................... 209 Common Programming Interfaces............................ 209 INDF Register ...................................................................... 79 Indirect Addressing ....................................................... 79, 80 Input.................................................................................... 22 Overvoltage Lockout................................................... 37 Type............................................................................ 13 Undervoltage Lockout................................................. 37 Instruction Format............................................................. 199 Instruction Set................................................................... 199 ADDLW..................................................................... 201 ADDWF..................................................................... 201 ANDLW..................................................................... 201 ANDWF..................................................................... 201 BCF .......................................................................... 201 BSF........................................................................... 201 BTFSC ...................................................................... 201 BTFSS ...................................................................... 202 CALL......................................................................... 202 CLRF ........................................................................ 202 CLRW ....................................................................... 202 CLRWDT .................................................................. 202 COMF ....................................................................... 202 DECF ........................................................................ 202 DECFSZ ................................................................... 203 2014-2015 Microchip Technology Inc. MCP19114/5 GOTO ....................................................................... 203 INCF.......................................................................... 203 INCFSZ ..................................................................... 203 IORLW ...................................................................... 203 IORWF ...................................................................... 203 MOVF........................................................................ 204 MOVLW .................................................................... 204 MOVWF .................................................................... 204 NOP .......................................................................... 204 RETFIE ..................................................................... 205 RETLW ..................................................................... 205 RETURN ................................................................... 205 RLF ........................................................................... 205 RRF........................................................................... 206 SLEEP ...................................................................... 206 SUBLW ..................................................................... 206 SUBWF ..................................................................... 206 Summary Table......................................................... 200 SWAPF ..................................................................... 206 XORLW..................................................................... 206 XORWF..................................................................... 207 INTCON Register ................................................................ 95 Internal Sampling Switch (RSS) Impedance ...................... 133 Internet Address................................................................ 229 Interrupt-on-Change.......................................................... 121 Associated Registers ................................................ 123 Clearing Interrupt Flags ............................................ 121 Enabling the Module ................................................. 121 Individual Pin Configuration ...................................... 121 Operation in Sleep .................................................... 121 Registers................................................................... 122 Interrupts ADC .......................................................................... 130 Associated Registers ................................................ 100 Configuration Word w/ Clock Sources ........................ 84 Context Saving.......................................................... 100 Control Registers ........................................................ 95 GPA2/INT.................................................................... 93 Timer0....................................................................... 138 Timer1....................................................................... 140 IOCA Register ................................................................... 122 IOCB Register ................................................................... 122 MPLAB Integrated Development Environment Software.. 211 MPLAB PM3 Device Programmer .................................... 213 MPLAB REAL ICE In-Circuit Emulator System ................ 213 MPLAB X SIM Software Simulator ................................... 213 MPLINK Object Linker/MPLIB Object Librarian ................ 212 MSSP ............................................................................... 155 Arbitration ................................................................. 157 Baud Rate Generator ............................................... 190 Block Diagram (I2C Master Mode)............................ 155 Block Diagram (I2C Slave Mode).............................. 156 Clock Stretching ....................................................... 157 I2C Bus Terms .......................................................... 158 I2C Master Mode ...................................................... 176 I2C Mode .................................................................. 156 I2C Mode Operation.................................................. 158 I2C Slave Mode Operation........................................ 160 Overview................................................................... 155 O OPCODE Field Descriptions............................................. 199 OPTION_REG Register...................................................... 78 Oscillator............................................................................. 83 Associated Registers.................................................. 84 Calibration .................................................................. 83 Delay Upon Base Frequency Change ........................ 84 Delay Upon Power-Up................................................ 84 Delay Upon Wake-Up................................................. 84 Frequency Tuning....................................................... 83 Internal........................................................................ 83 OSCTUNE Register............................................................ 83 Output Drive Circuitry ............................................................. 19 Overvoltage ................................................................ 39 OVCON Register ................................................ 39 OVREFCON Register......................................... 39 Protection ........................................................... 39 Type............................................................................ 13 Output Regulation Reference Voltage Configuration.......... 46 OVCON Register ................................................................ 39 Overvoltage Lockout Input............................................................................ 37 OVREFCON Register ......................................................... 39 L P Leading Edge Blanking ....................................................... 43 Linear Regulators................................................................ 19 Packaging ......................................................................... 215 Marking..................................................................... 215 Specifications ........................................................... 216 PCL..................................................................................... 79 Modifying .................................................................... 79 PCLATH ............................................................................. 79 PCON Register ............................................................. 88, 91 PE1 Register ...................................................................... 48 Peak Current Mode............................................................. 19 PICkit 3 In-Circuit Debugger/PICkit 3 In-Circuit Programmer . 213 PIE1 Register ..................................................................... 96 PIE2 Register ..................................................................... 97 Pin Diagram 24-Pin QFN (MCP19114) ............................................. 2 28-Pin QFN (MCP19115) ............................................. 4 Pinout Description Summary .................................................................. 3, 5 Table........................................................................... 13 PIR1 Register ..................................................................... 98 PIR2 Register ..................................................................... 99 PMADRH Register.................................................... 105, 107 M Magnetic Desaturation Detection ........................................ 19 Master Synchronous Serial Port. See MSSP MCLR .................................................................................. 86 Internal ........................................................................ 86 Memory Organization.......................................................... 69 Data ............................................................................ 70 Program ...................................................................... 69 Microchip Internet Web Site .............................................. 229 Mode and RFB MUX Control .............................................. 51 MODECON Register ........................................................... 51 MOSFET ............................................................................. 17 Driver Dead Time .......................................................... 48 Programmable Dead Time.................................. 45 Undervoltage Lockout Selection ......................... 49 Gate Driver Enables.................................................... 48 MPLAB Assembler, Linker, Librarian ................................ 212 MPLAB ICD 3 In-Circuit Debugger System ...................... 213 2014-2015 Microchip Technology Inc. DS20005281B-page 225 MCP19114/5 PMADRL Register..................................................... 105, 106 PMCON1 Register .................................................... 105, 107 PMCON2 Register ............................................................ 105 PMDATH Register............................................................. 106 PMDATL Register ............................................................. 106 PORTGPA................................................................. 111, 121 ANSELA Register ..................................................... 112 Associated Registers ................................................ 115 Functions and Output Priorities................................. 112 Interrupt-on-Change.................................................. 111 Output Priority ........................................................... 112 Register............................................................. 111, 113 Weak Pull-Ups .......................................................... 111 PORTGPB................................................................. 116, 121 ANSELB Register ..................................................... 116 Associated Registers ................................................ 119 Functions and Output Priorities................................. 117 Interrupt-on-Change.................................................. 116 Output Priority ........................................................... 117 Register............................................................. 116, 117 Weak Pull-Ups .......................................................... 116 Power-Down Mode (Sleep) ............................................... 101 Associated Registers ................................................ 102 Power-On Reset (POR) ...................................................... 86 Power-Up Timer (PWRT) .................................................... 88 Primary Input Current Offset Adjust .................................... 42 Program Memory Map and Stack (MCP19114)....................................... 69 Organization................................................................ 69 Protection .................................................................... 82 Programming, Device Instructions .................................... 199 Pulse-Width Modulation Control Logic ............................................................. 153 Pulse-Width Modulation. See PWM PWM ................................................................................... 34 Associated Registers ................................................ 147 Control Logic ............................................................. 153 Duty Cycle................................................................. 147 Enhanced Module ..................................................... 145 Fixed Frequency ......................................................... 20 Operation During Sleep ............................................ 147 Output ....................................................................... 146 Period........................................................................ 146 Requirements.............................................................. 34 Simplified Diagram .................................................... 146 Stand-alone Mode..................................................... 145 Standard Mode ......................................................... 145 Steering....................................................................... 48 Switching Frequency Synchronization Mode ............ 145 Timing Diagram........................................................... 34 R Read-Modify-Write Operations.......................................... 199 Registers ABECON (Analog Block Enable Control).................... 49 ADCON0 (A/D Control 0) .......................................... 131 ADCON0 (Analog-to-Digital Control) .......................... 57 ADCON1 (A/D Control 1) .......................................... 132 ADRESH (ADC Result High) .................................... 132 ADRESL (ADC Result Low) ...................................... 132 ANSELA (Analog Select GPA).................................. 114 ANSELB (Analog Select GPB).................................. 119 CALWD1 (Calibration Word 1) .................................... 59 CALWD10 (Calibration Word 10) ................................ 66 CALWD11 (Calibration Word 11) ................................ 67 CALWD2 (Calibration Word 2) .................................... 60 DS20005281B-page 226 CALWD3 (Calibration Word 3).................................... 61 CALWD4 (Calibration Word 4).................................... 61 CALWD5 (Calibration Word 5).................................... 62 CALWD6 (Calibration Word 6).................................... 62 CALWD7 (Calibration Word 7).................................... 63 CALWD8 (Calibration Word 8).................................... 64 CALWD9 (Calibration Word 9).................................... 65 CCDCON (Dual Capture/Compare Control Module) 151 CONFIG (Configuration Word) ................................... 81 DEADCON (Driver Dead Time Control)...................... 45 DESATCON (Desaturation Comparator Control) ....... 41 FSR (File Select Register) .......................................... 79 General Purpose Register .......................................... 70 ICLEBCON (Input Current Leading Edge Blanking Control) ..................................................................... 43 ICOACON (Input Current Offset Adjust Control) ........ 42 INDF ........................................................................... 79 INTCON (Interrupt Control)......................................... 95 IOCA (Interrupt-on-Change PORTGPA)................... 122 IOCB (Interrupt-on-Change PORTGPB)................... 122 MODECON (Master/Slave and RFB MUX Control).... 51 OPTION_REG (Option) .............................................. 78 OSCTUNE (Oscillator Tuning).................................... 83 OVCON (Output Overvoltage Comparator Control) ... 39 OVREFCON (Output Overvoltage Detect Level)........ 39 PCON (Power Control) ......................................... 88, 91 PE1 (Analog Peripheral Enable1 Control) .................. 48 PIE1 (Peripheral Interrupt Enable 1)........................... 96 PIE2 (Peripheral Interrupt Enable 2)........................... 97 PIR1 (Peripheral Interrupt Flag 1)............................... 98 PIR2 (Peripheral Interrupt Flag 2)............................... 99 PMADRH (Program Memory Address High) .... 105, 107 PMADRL (Program Memory Address Low)...... 105, 106 PMCON1 (Program Memory Control 1)............ 105, 107 PMCON2 (Program Memory Control 2).................... 105 PMDATH (Program Memory Data High) .................. 106 PMDATL (Program Memory Data Low).................... 106 PORTGPA ........................................................ 111, 113 PORTGPB ........................................................ 116, 117 SLPCRCON (Slope Compensation Ramp Control).... 44 Special Function ......................................................... 70 Special Registers Summary Bank 0 ................................................................ 74 Bank 1 ................................................................ 75 Bank 2 ................................................................ 76 Bank 3 ................................................................ 77 SSPADD (MSSP Address and Baud Rate 1) ........... 196 SSPADD2 (MSSP Address 2) .................................. 197 SSPCON1 (SSP Control 1) ...................................... 192 SSPCON2 (SSP Control 2) ...................................... 194 SSPCON3 (SSP Control 3) ...................................... 195 SSPMSK (SSP Mask 1)............................................ 196 SSPMSK1 (SSP Mask)............................................. 175 SSPMSK2 (SSP Mask 2).......................................... 197 SSPSTAT (SSP Status)............................................ 191 STATUS ..................................................................... 71 T1CON (Timer1 Control) .......................................... 140 T2CON (Timer2 Control) .......................................... 144 TRISGPA (PORTGPA Tri-State) ...................... 111, 113 TRISGPB (PORTGPB Tri-State) ...................... 116, 118 VINCON (UVLO and OVLO Comparator Control) ...... 37 VINOVLO (Input Overvoltage Lockout) ...................... 38 VINUVLO (Input Undervoltage Lockout)..................... 38 VREF2CON (VREF2 Voltage Set Point) ...................... 47 VREFCON (Current/Voltage Regulation Set Point Con- 2014-2015 Microchip Technology Inc. MCP19114/5 trol)...................................................................... 46 WPUGPA (Weak Pull-Up PORTGPA) ...................... 114 WPUGPB (Weak Pull-Up PORTGPB) ...................... 118 Requirements A/D Acquisition.......................................................... 133 A/D Conversion........................................................... 35 External Clock, Timing ................................................ 30 I/O, Timing .................................................................. 31 PWM ........................................................................... 34 Reset, Watchdog Timer, Oscillator Start-Up Timer and Power-Up Timer.................................................. 33 Timer0 External Clock................................................. 34 Resets ................................................................................. 85 Associated Registers .................................................. 91 Brown-Out................................................................... 87 Determining Causes ................................................... 89 Power-On.................................................................... 86 Watchdog Timer.......................................................... 88 S Sleep Wake-Up from........................................................... 101 Wake-Up Using Interrupts......................................... 102 Slope Compensation........................................................... 44 SLPCRCON Register.......................................................... 44 Software Simulator (MPLAB X SIM) ................................. 213 Special Event Trigger Capture/Compare Module......................................... 150 Special Function Registers (SFR)....................................... 70 SSPADD Register ............................................................. 196 SSPADD2 Register ........................................................... 197 SSPCON1 Register .......................................................... 192 SSPCON2 Register .......................................................... 194 SSPCON3 Register .......................................................... 195 SSPMSK Register............................................................. 196 SSPMSK1 Register........................................................... 175 SSPMSK2 Register........................................................... 197 SSPOV.............................................................................. 181 SSPOV Status Flag .......................................................... 181 SSPSTAT Register ........................................................... 191 R/W Bit...................................................................... 160 Stack ................................................................................... 79 Start-Up............................................................................... 20 Start-Up Sequence ............................................................. 88 STATUS Register ............................................................... 71 System Bench Testing ........................................................ 57 T T1CON Register ............................................................... 140 T2CON Register ............................................................... 144 Temperature Indicator Module .......................................... 125 Circuit Operation ....................................................... 125 Temperature Output.................................................. 125 Thermal Specifications........................................................ 28 Timer0 ............................................................................... 137 8-bit Counter Mode ................................................... 137 8-bit Timer Mode....................................................... 137 Associated Registers ................................................ 138 Block Diagram........................................................... 137 External Clock........................................................... 138 Requirements ..................................................... 34 Timing ................................................................. 33 Interrupt..................................................................... 138 Module ...................................................................... 137 Features............................................................ 137 Operation .................................................................. 137 2014-2015 Microchip Technology Inc. During Sleep..................................................... 138 Software Programmable Prescaler........................... 137 Switching Prescaler .................................................. 138 T0CKI ....................................................................... 138 TMR0 Register ......................................................... 137 Timer1 .............................................................................. 139 Associated Registers................................................ 141 Block Diagram .......................................................... 139 Clock Source Selection ............................................ 139 Control Register........................................................ 140 External Clock Timing................................................. 33 Interrupt .................................................................... 140 Module...................................................................... 139 Features ........................................................... 139 Operation.................................................................. 139 During Sleep..................................................... 140 Prescaler .................................................................. 140 TMR1H Register....................................................... 139 TMR1L Register ....................................................... 139 Timer2 Associated Registers................................................ 144 Block Diagram .......................................................... 143 Control Register........................................................ 144 Module...................................................................... 143 Features ........................................................... 143 Operation.................................................................. 143 Timers Timer1 (T1CON)....................................................... 139 Timer2 (T2CON)....................................................... 143 Timing Diagrams A/D Conversion .......................................................... 36 Acknowledge Sequence ........................................... 183 Baud Rate Generator with Clock Arbitration............. 177 BRG Reset Due to SDA Arbitration During Start Condition.................................................................... 186 Bus Collision During a Repeated Start Condition (Case 1) ...................................................................... 187 Bus Collision During a Repeated Start Condition (Case 2) ...................................................................... 187 Bus Collision During a Start Condition (SCL = 0) ..... 186 Bus Collision During a Start Condition (SDA Only) .. 185 Bus Collision During a Stop Condition (Case 1)....... 188 Bus Collision During a Stop Condition (Case 2)....... 188 Bus Collision for Transmit and Acknowledge ........... 184 Clock Synchronization .............................................. 174 First Start Bit ............................................................. 177 I/O............................................................................... 31 I2C Master Mode (7 or 10-Bit Transmission) ............ 180 I2C Master Mode (7-Bit Reception) .......................... 182 INT Pin Interrupt ......................................................... 94 Power-Up Timer ......................................................... 32 Pulse-Width Modulation.............................................. 34 Repeat Start Condition ............................................. 178 Reset .......................................................................... 32 Start-Up Timer ............................................................ 32 Stop Condition Receive or Transmit Mode............... 183 Time-Out Sequence Case 1 ................................................................ 88 Case 2 ................................................................ 89 Case 3 ................................................................ 89 Timer0, External Clock ............................................... 33 Timer1, External Clock ............................................... 33 Wake-up from Interrupt............................................. 102 Watchdog Timer ......................................................... 32 Timing Parameter Symbology ............................................ 29 DS20005281B-page 227 MCP19114/5 TRISGPA .......................................................................... 111 Register............................................................. 111, 113 TRISGPB .......................................................................... 116 Register............................................................. 116, 118 Typical Performance Curves............................................... 53 U Undervoltage Lockout Input ............................................................................ 37 Selection for MOSFET Driver ..................................... 49 V VINCON Register................................................................ 37 VINOVLO Register.............................................................. 38 VINUVLO Register .............................................................. 38 VREF2 Voltage Reference.................................................... 47 VREF2CON Register .......................................................... 47 VREFCON Register ............................................................ 46 W Watchdog Timer. See WDT WCOL ............................................................................... 183 Status Flag ........................................ 177, 179, 181, 183 WCOL Status Flag ............................................................ 183 WDT .................................................................................. 103 Associated Registers ................................................ 104 Block Diagram........................................................... 103 Configuration Word w/ Watchdog Timer ................... 104 Operation .................................................................. 103 Period........................................................................ 103 Programming Considerations ................................... 103 Reset........................................................................... 88 Switching Prescaler .................................................. 138 WPUGPA Register............................................................ 114 WPUGPB Register............................................................ 118 WWW Address.................................................................. 229 WWW, On-Line Support........................................................ 7 DS20005281B-page 228 2014-2015 Microchip Technology Inc. MCP19114/5 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2014-2015 Microchip Technology Inc. DS20005281B-page 229 MCP19114/5 NOTES: DS20005281B-page 230 2014-2015 Microchip Technology Inc. MCP19114/5 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device Device: - X Tape and Reel Temperature Option Range /XX XXX Package Pattern MCP19114: Digitally Enhanced PWM Power Analog High-Speed Controller MCP19115: Digitally Enhanced PWM Power Analog High-Speed Controller Tape and Reel Option: Blank T = Standard packaging (tube) = Tape and Reel Temperature Range: E = -40C to +125C Package: MJ Examples: a) b) Extended Temperature, 24 LD QFN 4x4 package MCP19114T-E/MJ: Tape and Reel, Extended Temperature, 24 LD QFN 4x4 package a) MCP19115-E/MQ: b) MCP19114-E/MJ: Extended Temperature, 28 LD QFN 5x5 package MCP19115T-E/MQ: Tape and Reel, Extended Temperature, 28 LD QFN 5x5 package (Extended) Note 1: MQ = 24-Lead Plastic Quad Flat, No Lead Package 4x4x0.9 mm Body (QFN) = 28-Lead Plastic Quad Flat, No Lead Package 5x5x0.9 mm Body (QFN) 2014-2015 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005281B-page 231 MCP19114/5 NOTES: DS20005281B-page 232 2014-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-090-5 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2014-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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