Data Sheet, Rev. 1.3, April 2009 BTS5210G Smart High-Side Power Switch PROFET Automotive Smart High-Side Power Switch BTS5210G 6PDUW+LJK6LGH3RZHU6ZLWFK 7ZR&KDQQHOV[PΩ 6WDWXV)HHGEDFN Product Summary Package 9EE $FWLYHFKDQQHOV 2QVWDWH5HVLVWDQFH 521 1RPLQDOORDGFXUUHQW ,/120 &XUUHQWOLPLWDWLRQ ,/6&U 2SHUDWLQJ9ROWDJH RQH PΩ $ $ 9 WZRSDUDOOHO PΩ $ $ P-DSO-14 PG-DSO-14-37 *HQHUDO'HVFULSWLRQ • • 1FKDQQHOYHUWLFDOSRZHU026)(7ZLWKFKDUJHSXPSJURXQGUHIHUHQFHG&026FRPSDWLEOHLQSXWDQG ® GLDJQRVWLFIHHGEDFNPRQROLWKLFDOO\LQWHJUDWHGLQ6PDUW6,3026 WHFKQRORJ\ 3URYLGLQJHPEHGGHGSURWHFWLYHIXQFWLRQV $SSOLFDWLRQV • • • • &FRPSDWLEOHKLJKVLGHSRZHUVZLWFKZLWKGLDJQRVWLFIHHGEDFNIRU9DQG9JURXQGHGORDGV $OOW\SHVRIUHVLVWLYHLQGXFWLYHDQGFDSDFLWYHORDGV 0RVWVXLWDEOHIRUORDGVZLWKKLJKLQUXVKFXUUHQWVVRDVODPSV 5HSODFHVHOHFWURPHFKDQLFDOUHOD\VIXVHVDQGGLVFUHWHFLUFXLWV %DVLF)XQFWLRQV • • • • • • • 9HU\ORZVWDQGE\FXUUHQW &026FRPSDWLEOHLQSXW ,PSURYHGHOHFWURPDJQHWLFFRPSDWLELOLW\(0& )DVWGHPDJQHWL]DWLRQRILQGXFWLYHORDGV 6WDEOHEHKDYLRXUDWXQGHUYROWDJH :LGHRSHUDWLQJYROWDJHUDQJH /RJLFJURXQGLQGHSHQGHQWIURPORDGJURXQG 3URWHFWLRQ)XQFWLRQV • • • • • • • • 6KRUWFLUFXLWSURWHFWLRQ 2YHUORDGSURWHFWLRQ &XUUHQWOLPLWDWLRQ 7KHUPDOVKXWGRZQ 2YHUYROWDJHSURWHFWLRQLQFOXGLQJORDGGXPSZLWKH[WHUQDO UHVLVWRU 5HYHUVHEDWWHU\SURWHFWLRQZLWKH[WHUQDOUHVLVWRU /RVVRIJURXQGDQGORVVRI9EESURWHFWLRQ (OHFWURVWDWLFGLVFKDUJHSURWHFWLRQ(6' 'LDJQRVWLF)XQFWLRQ • • • 'LDJQRVWLFIHHGEDFNZLWKRSHQGUDLQRXWSXW 2SHQORDGGHWHFWLRQLQ2))VWDWH )HHGEDFNRIWKHUPDOVKXWGRZQLQ21VWDWH • • AEC Qualified Green product (RoHS compliant) Data Sheet Block Diagram 9EE ,1 67 ,1 67 /RJLF &KDQQHO &KDQQHO /RDG /RDG *1' 2 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G )XQFWLRQDOGLDJUDP *1' ORJLF LQWHUQDO YROWDJHVXSSO\ FXUUHQWOLPLW JDWH FRQWURO FKDUJH SXPS 9%% FODPSIRU LQGXFWLYHORDG 287 ,1 67 (6' WHPSHUDWXUH VHQVRU UHYHUVH EDWWHU\ SURWHFWLRQ 2SHQORDG GHWHFWLRQ FKDQQHO ,1 67 control and protection circuit equivalent to channel 1 287 Data Sheet 3 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Pin Definitions and Functions Pin Symbol 1,7, 8,14 Vbb 2 3 5 4 6 GND IN1 IN2 ST1 ST2 12,13 OUT1 9,10 OUT2 Output 1,2 protected high-side power output of channel 1,2. Design the wiring for the max. short circuit current; both output pins have to be connected in parallel for operation according this spec. 11 NC Not Connected Data Sheet Function Positive power supply voltage. Design the wiring for the simultaneous max. short circuit currents from channel 1 to 2 and also for low thermal resistance Logic Ground Input 1,2 activates channel 1,2 in case of logic high signal Diagnostic feedback 1,2 of channel 1,2 open drain 4 Pin configuration (top view) Vbb GND IN1 ST1 IN2 ST2 Vbb 1 2 3 4 5 6 7 • 14 13 12 11 10 9 8 Vbb OUT1 OUT1 NC OUT2 OUT2 Vbb Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Parameter Symbol Supply voltage (overvoltage protection see page 6) Supply voltage for full short circuit protection Tj,start = -40 ...+150°C Load current (Short-circuit current, see page 6) Load dump protection1) VLoadDump = VA + Vs, VA = 13.5 V RI2) = 2 Ω, td = 400 ms; IN = low or high, each channel loaded with RL = 13.5 Ω, Operating temperature range Storage temperature range Power dissipation (DC)4) Ta = 25°C: (all channels active) Ta = 85°C: Maximal switchable inductance, single pulse Vbb = 12V, Tj,start = 150°C4), see diagrams on page 10 IL = 2.9 A, EAS = 65 mJ, 0 Ω one channel: IL = 5.7 A, EAS = 125 mJ, 0 Ω two parallel channels: Electrostatic discharge capability (ESD) IN: (Human Body Model) ST: out to all other pins shorted: Vbb Vbb Values Unit 43 36 V V IL VLoad dump3) self-limited 60 A V Tj Tstg Ptot -40 ...+150 -55 ...+150 3,05 1,59 °C 11,2 5,6 mH 1.0 4.0 8.0 kV -10 ... +16 ±0.3 ±5.0 ±5.0 V mA ZL VESD W acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993 R=1.5kΩ; C=100pF Input voltage (DC) see internal circuit diagram page 9 Current through input pin (DC) Pulsed current through input pin5) Current through status pin (DC) 1) 2) 3) 4) 5) VIN IIN IINp IST Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω resistor for the GND connection is recommended. RI = internal resistance of the load dump test pulse generator VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70μm thick) copper area for Vbb connection. PCB is vertical without blown air. See page 14 only for testing Data Sheet 5 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Parameter and Conditions Thermal resistance junction - soldering point6)7) junction – ambient6) @ 6 cm2 cooling area Symbol each channel: Rthjs Rthja one channel active: all channels active: Values min typ max Unit 15 ---- K/W Values min typ max Unit ----- --45 40 Electrical Characteristics Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified Load Switching Capabilities and Characteristics On-state resistance (Vbb to OUT); IL = 2 A each channel, Tj = 25°C: RON Tj = 150°C: two parallel channels, Tj = 25°C: ---- 110 210 55 140 280 70 mΩ 1.8 3.4 2.4 3.9 -- A -- -- 2 mA --- 100 100 250 270 μs 0.2 0.2 --- 1.0 1.1 V/μs V/μs see diagram, page 11 Nominal load current one channel active: IL(NOM) two parallel channels active: Device on PCB6), Ta = 85°C, Tj ≤ 150°C Output current while GND disconnected or pulled up8); IL(GNDhigh) Vbb = 32 V, VIN = 0, see diagram page 9 Turn-on time9) Turn-off time RL = 12 Ω Slew rate on 9) Slew rate off 9) 6) 7) 8) 9) IN IN to 90% VOUT: ton to 10% VOUT: toff 10 to 30% VOUT, RL = 12 Ω: dV/dton 70 to 40% VOUT, RL = 12 Ω: -dV/dtoff Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70μm thick) copper area for Vbb connection. PCB is vertical without blown air. See page 14 Soldering point: upper side of solder edge of device pin 15. See page 14 not subject to production test, specified by design See timing diagram on page 12. Data Sheet 6 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified Values min typ max Unit Operating Parameters Operating voltage Undervoltage switch off10) Overvoltage protection12) I bb = 40 mA Standby current13) VIN = 0; see diagram page 11 Vbb(on) Tj =-40°C...25°C: Vbb(u so) Tj =125°C: Vbb(AZ) Tj =-40°C...25°C: Ibb(off) Tj =150°C: Tj =125°C: Off-State output current (included in Ibb(off)) IL(off) VIN = 0; each channel Operating current 14), VIN = 5V, one channel on: IGND all channels on: Protection Functions15) Current limit, Vout = 0V, (see timing diagrams, page 12) Tj =-40°C: IL(lim) Tj =25°C: =+150°C: Tj Repetitive short circuit current limit, Tj = Tjt each channel IL(SCr) two channels 5.5 --41 ---47 40 4.5 4.511) 52 V V ----- 5 --1 8 12 811) 5 μA --- 0.5 1.0 0.9 1.7 mA --5 -9 -- 14 --- A --- 6.5 6.5 --- A -- 2 -- ms 41 47 52 V 150 -- -10 --- °C K V μA (see timing diagrams, page 12) Initial short circuit shutdown time Vout = 0V Tj,start =25°C: toff(SC) (see timing diagrams on page 12) VON(CL) Output clamp (inductive load switch off)16) at VON(CL) = Vbb - VOUT, IL= 40 mA Tjt ΔTjt Thermal overload trip temperature Thermal hysteresis 10) 11) 12) 13) 14) 15) 16) is the voltage, where the device doesn´t change it´s switching condition for 15ms after the supply voltage falling below the lower limit of Vbb(on) not subject to production test, specified by design Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω resistor for the GND connection is recommended). See also VON(CL) in table of protection functions and circuit diagram on page 9. Measured with load; for the whole device; all channels off Add IST, if IST > 0 Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest VON(CL) Data Sheet 7 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Parameter and Conditions, each of the four channels Symbol at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified Reverse Battery Reverse battery voltage 17) Drain-source diode voltage (Vout > Vbb) IL = - 2.0 A, Tj = +150°C -Vbb -VON Values min typ max Unit --- -600 32 -- V mV Diagnostic Characteristics Open load detection voltage V OUT(OL) 1.7 2.8 4.0 V Input and Status Feedback18) Input resistance RI 2.5 4.0 6.0 kΩ VIN(T+) VIN(T-) Δ VIN(T) td(STon) -1.0 --- --0.2 10 2.5 --20 V V V s td(STon) 30 -- -- s td(SToff) -- -- 500 s td(SToff) -- -- 20 s IIN(off) IIN(on) 5 10 -35 20 60 μA μA VST(high) VST(low) 5.4 -- --- -0.6 V 1 (see circuit page 9) Input turn-on threshold voltage Input turn-off threshold voltage Input threshold hysteresis Status change after positive input slope19) with open load Status change after positive input slope19) with overload Status change after negative input slope with open load Status change after negative input slope19) with overtemperature Off state input current VIN = 0.4 V: On state input current VIN = 5 V: Status output (open drain) Zener limit voltage IST = +1.6 mA: ST low voltage IST = +1.6 mA: 17) Requires a 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 4 and circuit page 9). 18) If ground resistors R GND are used, add the voltage drop across these resistors. 19) not subject to production test, specified by design Data Sheet 8 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Truth Table ( each channel ) Normal operation Open load Overtemperature L = "Low" Level H = "High" Level IN OUT ST L H L H L H Z H H H L H L L L20) H H L X = don't care Z = high impedance, potential depends on external circuit Status signal valid after the time delay shown in the timing diagrams Parallel switching of channel 1 and 2 is easily possible by connecting the inputs and outputs in parallel (see truth table). If switching channel 1 to 2 in parallel, the status outputs ST1 and ST2 have to be configured as a 'Wired OR' function with a single pull-up resistor. Terms ,EE 9 9 21 9 21 /HDGIUDPH EE , ,1 , ,1 9,1 9 ,1 9 , 67 , 67 9EE ,1 ,1 287 , / , / 352)(7 287 67 67 *1' 67 9 67 9 , 5 *1' 287 9 287 *1' Leadframe (Vbb) is connected to pin 1,7,8,14 External RGND optional; single resistor RGND = 150 Ω for reverse battery protection up to the max. operating voltage. 20) L, if potential at the Output exceeds the OpenLoad detection voltage Data Sheet 9 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Input circuit (ESD protection), IN1 or IN2 Overvolt. and reverse batt. protection 9 ,1 5 , 9EE 5 67 ,1 (6'=' , , 9 5, = /RJLF , 5 67 67 *1' 287 9 = The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. *1' 5 *1' /RDG*1' 6LJQDO*1' Status output, ST1 or ST2 VZ1 = 6.1 V typ., VZ2 = 47 V typ., RGND = 150 Ω, RST= 15 kΩ, RI= 3.5 kΩ typ. In case of reverse battery the load current has to be limited by the load. Temperature protection is not active 9 5 6721 67 Open-load detection, OUT1 or OUT2 (6' =' *1' 5 /RDG OFF-state diagnostic condition: Open Load, if VOUT > 3 V typ.; IN low ESD-Zener diode: 6.1 V typ., max 0.3 mA; RST(ON) < 375 Ω at 1.6 mA. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. 9 EE 5 (;7 Inductive and overvoltage output clamp, 2)) OUT1 or OUT2 9 9EE 9= /RJLF XQLW 9 287 2SHQORDG GHWHFWLRQ 21 6LJQDO*1' 287 GND disconnect 3RZHU*1' VON clamped to VON(CL) = 47 V typ. ,1 9EE 352)(7 287 67 *1' 9 EE 9 ,1 9 67 9 *1' Any kind of load. In case of IN = high is VOUT ≈ VIN - VIN(T+). Due to VGND > 0, no VST = low signal available. Data Sheet 10 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G GND disconnect with GND pull up Inductive load switch-off energy dissipation ( EE ,1 9EE ( $6 352)(7 287 ,1 67 *1' 9 9 EE 352)(7 287 / 67 9 ,1 67 9 Vbb disconnect with energized inductive load ,1 *1' *1' Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND > 0, no VST = low signal available. KLJK (/RD 9EE ^ 5 (5 / Energy stored in load inductance: 2 EL = 1/2·L·I L While demagnetizing load inductance, the energy dissipated in PROFET is EAS= Ebb + EL - ER= VON(CL)·iL(t) dt, 9EE 352)(7 =/ (/ with an approximate solution for RL > 0 Ω: 287 EAS= 67 IL· L (V + |VOUT(CL)|) 2·RL bb OQ(1+ |V IL·RL OUT(CL)| ) *1' 9 Maximum allowable load inductance for a single switch off (one channel)4) EE For inductive load currents up to the limits defined by ZL (max. ratings and diagram on page 10) each switch is protected against loss of Vbb. / I,/Tj,start = 150°C, Vbb = 12 V, RL = 0 Ω ZL [mH] Consider at your PCB layout that in the case of Vbb disconnection with energized inductive load all the load current flows through the GND connection. IL [A] Data Sheet 11 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Typ. on-state resistance 521 I9EE7M; IL = 2 A, IN = high RON [mOhm] 7M & & & Vbb [V] Typ. standby current ,EERII I7M; Vbb = 9...34 V, IN1,2 = low Ibb(off) [μA] Tj [°C] Data Sheet 12 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Timing diagrams All channels are symmetric and consequently the diagrams are valid for channel 1 to channel 4 Figure 2b: Switching a lamp: Figure 1a: Vbb turn on: ,1 ,1 ,1 9 EE 67 9 287 9 9 287 287 67RSHQGUDLQ , / 67RSHQGUDLQ W W Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition: Figure 3a: Turn on into short circuit: shut down by overtemperature, restart by cooling ,1 ,1 RWKHUFKDQQHOQRUP DORSHUDWLRQ 9287 , W on / G9GWRII , /OLP , G9GWRQ W /6&U off W ,/ 67 RII6& W W Data Sheet Heating up of the chip may require several milliseconds, depending on external conditions 13 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Figure 5a: Open load: detection in OFF-state, turn on/off to open load Open load of channel 1; other channels normal operation Figure 3b: Turn on into short circuit: shut down by overtemperature, restart by cooling (two parallel switched channels 1 and 2) ,1 ,1 ,, 9287 // [,/OLP , W 67 , / /6&U 67 RII6& V V W ST1 and ST2 have to be configured as a 'Wired OR' function ST1/2 with a single pull-up resistor. Figure 6a: Status change after, turn on/off to overtemperature Overtemperature of channel 1; other channels normal operation Figure 4a: Overtemperature: Reset if Tj <Tjt ,1 ,1 67 67 V V 9 287 7 - W Data Sheet 14 Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Package Outlines 1.75 MAX. 1) 4 -0.2 B 1.27 0.64 ±0.25 0.1 2) 0.41+0.10 -0.06 0.2 M 14 6±0.2 A B 14x 0.2 M C 8 1 7 1) 8.75 -0.2 8˚MAX. 0.19 +0.06 0.175 ±0.07 (1.47) 0.35 x 45˚ C A Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area GPS01230 Figure 1 PG-DSO-14-37 (Plastic Dual Small Outline Package) (RoHS-compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Please specify the package needed (e.g. green package) when placing an order You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 15 Dimensions in mm Rev. 1.3, 2009-04-16 Smart High-Side Power Switch BTS5210G Revision History Version Date Changes Rev. 1.3 2009-04-16 Modification of the package name extension. V1.2 2007-09-25 Modification of the package drawing. V1.1 2007-05-29 Creation of the green datasheet. First page : Adding the green logo and the AEC qualified Adding the bullet AEC qualified and the RoHS compliant features Package page Modification of the package to be green. Data Sheet 16 Rev. 1.3, 2009-04-16 Edition 2009-04-16 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.