SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 D D D D D D D D D DBV OR DCK PACKAGE (TOP VIEW) Available in the Texas Instruments NanoStar and NanoFree Packages Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub 1-V Operable Max tpd of 2.5 ns at 1.8 V Low Power Consumption, 10-µA Max ICC ±8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) OE A GND 1 5 VCC 4 Y 2 3 YEP OR YZP PACKAGE (BOTTOM VIEW) GND A OE 3 4 Y 2 1 5 VCC description/ordering information This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC1G126 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION –40 C to 85 –40°C 85°C C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING‡ NanoStar WCSP (DSBGA) – YEP Tape and reel SN74AUC1G126YEPR NanoFree WCSP (DSBGA) – YZP (Pb-free) Tape and reel SN74AUC1G126YZPR SOT (SOT-23) – DBV Tape and reel SN74AUC1G126DBVR U26_ SOT (SC-70) – DCK Tape and reel SN74AUC1G126DCKR UN_ _ _ _UN_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 FUNCTION TABLE INPUTS OE A OUTPUT Y H H H H L L L X Z logic diagram (positive logic) 1 OE A 2 4 Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.6 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level input voltage VCC = 0.8 V VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 0.8 V MIN MAX 0.8 2.7 VCC 0.65 × VCC UNIT V V 1.7 0 0.35 × VCC VIL Low-level input voltage VI VO Input voltage 0 3.6 V Output voltage 0 VCC –0.7 V VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 0.8 V VCC = 1.1 V IOH IOL ∆t/∆v t/ v High-level output current Low-level output current Input transition rise or fall rate 0.7 –3 VCC = 1.4 V VCC = 1.65 V –5 VCC = 2.3 V VCC = 0.8 V –9 0.7 3 VCC = 1.65 V VCC = 2.3 V 8 VCC = 2.3 V to 2.7 V mA –8 VCC = 1.1 V VCC = 1.4 V VCC = 0.8 V to 1.6 V VCC = 1.65 V to 1.95 V V 5 mA 9 20 10 ns/V 3 TA Operating free-air temperature –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 0.8 V to 2.7 V IOH = –100 µA IOH = –0.7 mA VOH VOL II Ioff A or OE input TYP† MIN MAX 0.8 V 0.55 IOH = –3 mA IOH = –5 mA 1.1 V 0.8 1.4 V 1 IOH = –8 mA IOH = –9 mA 1.65 V 1.2 2.3 V 1.8 IOL = 100 µA IOL = 0.7 mA 0.8 V to 2.7 V V 0.2 0.8 V 0.25 IOL = 3 mA IOL = 5 mA 1.1 V 0.3 1.4 V 0.4 IOL = 8 mA IOL = 9 mA 1.65 V 0.45 2.3 V 0.6 VI = VCC or GND VI or VO = 2.7 V IOZ ICC VO = VCC or GND VI = VCC or GND, Ci VI = VCC or GND IO = 0 UNIT VCC–0.1 V 0 to 2.7 V ±5 µA 0 ±10 µA 2.7 V ±10 µA 0.8 V to 2.7 V 10 µA Co VO = VCC or GND † All typical values are at TA = 25°C. 2.5 V 2.5 pF 2.5 V 5.5 pF switching characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX A Y 4.5 0.8 3.6 0.6 2.3 ‡ ‡ ‡ ‡ ‡ ns 2.5 ‡ ‡ ‡ ‡ ‡ ns 4.1 ‡ ‡ ‡ ‡ ‡ ns tpd ten OE 4.9 Y tdis OE 4.9 Y ‡ This information was not available at the time of publication. 0.7 2.2 3.8 4.7 0.7 1.8 UNIT switching characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A ten tdis PARAMETER 4 VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V UNIT MIN TYP MAX MIN MAX Y 1 1.5 2.5 0.9 1.7 ns OE Y 1.1 1.6 2.5 0.9 1.9 ns OE Y 1.3 2.6 3.1 1 2.1 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS VCC = 0.8 V TYP VCC = 1.2 V TYP VCC = 1.5 V TYP VCC = 1.8 V TYP VCC = 2.5 V TYP 14 14 14 15 16 1.5 1.5 1.5 2 2.5 f = 10 MHz UNIT pF POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SCES383F – MARCH 2002 – REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) RL VCC 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V LOAD CIRCUIT TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND CL RL 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω V∆ 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input VCC/2 th VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL tPHL VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 0V tPLZ tPZL VCC VCC/2 Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ tPZH VOH Output Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH VCC/2 VCC Output Control VCC/2 VOH – V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUC1G126DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G126DCKR ACTIVE SC70 DCK 5 3000 Pb-Free (RoHS) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G126YEPR ACTIVE WCSP YEP 5 3000 None SNPB Level-1-260C-UNLIM SN74AUC1G126YZPR ACTIVE WCSP YZP 5 3000 Pb-Free (RoHS) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002 DCK (R-PDSO-G5) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 5 0,10 M 4 1,40 1,10 1 0,13 NOM 2,40 1,80 3 Gage Plane 2,15 1,85 0,15 0°–8° 0,46 0,26 Seating Plane 1,10 0,80 0,10 0,00 0,10 4093553-2/D 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-203 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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