Material Content Data Sheet Sales Product Name BTS5012-1EKB MA# MA001109496 Package PG-DSO-14-47 Issued 29. August 2013 Weight* 150.70 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.564 2.36 0.017 0.01 0.069 0.05 459 1.383 0.92 9180 56.175 37.28 38.26 372765 382519 0.692 0.46 0.46 4589 4589 0.168 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.36 23649 23649 115 1112 7.711 5.12 75.933 50.38 55.61 503877 556155 2.472 1.64 1.64 16401 16401 1.470 0.98 0.98 9757 9757 0.183 0.12 0.862 0.57 51166 1213 0.69 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5717 6930 1000000