Reliability Investigation Results, Type: TL431SDT Time period Q4/2012 to Q3/2013 AEC Q100 Test Conditions Duration Quantity Rejects all parts see below 6720 0 # E1 TEST Pre- and Post-Stress Electrical Test Ta = 25 °C N/A # A1 PC Preconditioning JESD22-A113 Bake Ta = 125 °C Soak Ta = 85 °C, RH = 85% Reflow soldering 24 hours 168 hours 3 cycles # A2 THB Temperature Humidity Bias JESD22-A101 Ta = 85 °C, RH = 85% Vref = 0 V, VKA = 36 V 1000 hours 1680 0 # A3 AC Autoclave JESD22-A102 Ta = 121 °C, RH = 100% Pressure = 205 kPa (29.7 psia) 96 hours 1680 0 # A4 TC Temperature Cycling JESD22-A104 -65 °C to +150 °C 1000 cycles 1680 0 # A5 IOL Intermittent Operating Life MIL-STD-750 Method 1037 ton = toff = 2min P = 250 mW to insure ΔTj = 100 °C for 15000 cycles 1000 hours 1680 0 Ta = 150°C, Vref = 0V, VKA = 36V 1000 hours 1680 0 JESD22-A111 / JESD22 -B106 260 °C ± 5 °C 10 s 630 0 JESD22-B102 245 °C ± 5 °C 3s 5490 0 # B1 # C3 HTOL High Temperature Operating Life RSH Resistance to Solder Heat SD Solderability Calculation of FIT and MTBF Test considered for FIT calculation: High Temp. Operating Life (HTOL, AEC Q100 Test # B1) Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168-1000 hours Wafer Fab Technology Quantity Rejects Failure Rate MTBF NXP DHAM Bipolar Analog Power 1680 0 2.53 FIT 45130 years © 2014 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: Jun 2014