Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC13783VK5 TMAP 247 10*10*0.7P0.5 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-02-04 5320A1.3 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MC13783VK5 TMAP 247 10*10*0.7P0.5 ALL 0.205300 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.005 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000375 g Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.001 g Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.000375 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 Bonding Wire SubstanceWeight SubPart% ARTICLEPPM ARTICLE% UoM SubPart PPM 75000 7.5 1826 0.1826 200000 20 4870 0.487 g 75000 7.5 1826 0.1826 0.001 g 200000 20 4870 0.487 0.00225 g 450000 45 10959 1.0959 1000000 100 17535 1.7535 g 0.0036 Bonding Wire Die Encapsulant, Halogen-free Exemption g Metals Gold, metal 7440-57-5 0.0036 0.1064 g g Die Encapsulant, Halogen-free Metals Aluminum, metal 7429-90-5 0.00012811 g 1204 0.1204 624 0.0624 Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other Epoxy resins - 0.01281545 g 120446 12.0446 62423 6.2423 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.00032037 g 3011 0.3011 1560 0.156 Die Encapsulant, Halogen-free Metals Magnesium, metal 7439-95-4 0.00012811 g 1204 0.1204 624 0.0624 Die Encapsulant, Halogen-free Plastics/polymers Other polymers - 0.00032037 g 3011 0.3011 1560 0.156 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.09268759 g 871124 87.1124 451488 45.1488 Silicon Semiconductor Die 0.0198 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000396 g 20000 2 1928 0.1928 Silicon Semiconductor Die Glass Silicon, doped - 0.019404 g 980000 98 94515 9.4515 Organic Substrate, Halogen-fre 0.0437 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.0097014 g 222000 22.2 47254 4.7254 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.0098325 g 225000 22.5 47893 4.7893 Organic Substrate, Halogen-fre Plastics/polymers Other Epoxy resins - 0.0028405 g 65000 6.5 13835 1.3835 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.000437 g 10000 1 2128 0.2128 Organic Substrate, Halogen-fre Metals Other nickel compounds - 0.0045885 g 105000 10.5 22350 2.235 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other organic phosphorous compounds - 0.004807 g 110000 11 23414 2.3414 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.0003496 g 8000 0.8 1702 0.1702 Organic Substrate, Halogen-fre Glass Silica, crystalline - tridymite 15468-32-3 0.0111435 g 255000 25.5 54279 5.4279 Solder Balls - Lead Free 0.0268 g Solder Balls - Lead Free Metals Aluminum, metal 7429-90-5 0.00000027 g 10 0.001 1 0.0001 Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00001337 g 499 0.0499 65 0.0065 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000801 g 299 0.0299 39 0.0039 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000801 g 299 0.0299 39 0.0039 Solder Balls - Lead Free Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000054 g 20 0.002 2 0.0002 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.00004012 g 1497 0.1497 195 0.0195 Solder Balls - Lead Free Metals Gold, metal 7440-57-5 0.00000134 g 50 0.005 6 0.0006 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.00000536 g 200 0.02 26 0.0026 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00001337 g 499 0.0499 65 0.0065 Solder Balls - Lead Free Nickel (external applications only) Nickel 7440-02-0 0.00000801 g 299 0.0299 39 0.0039 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00026776 g 9991 0.9991 1304 0.1304 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.02643357 g 986327 98.6327 128755 12.8755 Solder Balls - Lead Free Metals Zinc, metal 7440-66-6 0.00000027 g 10 0.001 1 0.0001 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC13783VK5_IPC1752_v11.xml http://www.freescale.com/mcds/MC13783VK5_IPC1752A.xml