BZT585B2V4T - BZT585B43T SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data • ±2.0% Tolerance on Breakdown Voltage • • Small, Low Profile Surface Mount Package • • Flat Lead Package Design for Low Profile and High Power Case: SOD523 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Dissipation • Moisture Sensitivity: Level 1 per J-STD-020 • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Terminal Connections: Cathode Band • Halogen and Antimony Free. “Green” Device (Note 3) • • Qualified to AEC-Q101 Standards for High Reliability Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe. Solderable per MIL-STD-202, Method 208 e3 • Weight: 0.001 grams (approximate) Top View Ordering Information (Note 4) Part Number (Type Number)-7* (Note 4) Case SOD523 Packaging 3000/Tape & Reel *Add “-7” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener = BZT585B6V2T-7. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information xx BZT585B2V4T - BZT585B43T Document number: DS36638 Rev. 5 - 2 xx = Product Type Marking Code (See Electrical Characteristics Table) 1 of 4 www.diodes.com March 2014 © Diodes Incorporated BZT585B2V4T - BZT585B43T Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Forward Voltage @ IF = 10mA @ IF = 100mA Continuous Forward Current Symbol Value Unit VF 0.9 1.1 V IF 200 mA Symbol PD Value 350 Unit mW RθJA 357 °C/W TJ, TSTG -65 to +150 °C Thermal Characteristics Characteristic Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Air (Note 5) Operating and Storage Temperature Range Note: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can be found on our website at http://www.diodes.com. Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Zener Voltage Range (Note 6) Type Number Marking Codes VZ @ IZT Maximum Zener Impedance (Note 7) IZT ZZT @ ZZK @ IZT IZK IZK Ω mA Nom (V) Min (V) Max (V) mA BZT585B2V4T BZT585B2V7T BZT585B3V3T BZT585B3V6T BZT585B3V9T BZT585B4V3T BZT585B4V7T BZT585B5V1T BZT585B5V6T BZT585B6V2T BZT585B6V8T BZT585B7V5T BZT585B8V2T BZT585B9V1T BZT585B10T BZT585B11T BZT585B12T BZT585B13T BZT585B15T BZT585B16T BZT585B18T BZT585B20T BZT585B22T BZT585B24T BZT585B27T BZT585B30T BZT585B33T BZT585B36T BZT585B39T BZT585B43T Notes: 3C 3E 3H 3J 3K 3L 3M 3N 3P 3S 3T 3U 3V 3X 3Y 3Z 4A 4B 4D 4E 4F 4G 4H 4J 4K 4M 4N 4P 4R 4S 2.4 2.7 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 2.35 2.65 3.23 3.53 3.82 4.21 4.61 5.00 5.49 6.08 6.66 7.35 8.04 8.92 9.80 10.78 11.76 12.74 14.70 15.68 17.64 19.60 21.56 23.52 26.46 29.40 32.34 35.28 38.22 42.14 2.45 2.75 3.37 3.67 3.98 4.39 4.79 5.20 5.71 6.32 6.94 7.65 8.36 9.28 10.20 11.22 12.24 13.26 15.30 16.32 18.36 20.40 22.44 24.48 27.54 30.60 33.66 36.72 39.78 43.86 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 2 100 100 95 90 90 90 80 60 40 10 15 10 10 10 10 10 10 10 15 40 45 55 55 70 80 80 80 90 130 150 400 450 500 500 500 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 375 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0.5 0.5 0.5 0.5 0.5 0.5 Temperature Coefficient TC @ IZT Typical (mV/°C) -1.3 -1.4 -1.8 -1.9 -1.9 -1.7 -1.2 -0.5 1.0 2.2 3.0 3.8 4.7 5.8 7.0 8.2 9.5 10.7 13.2 14.4 16.9 19.4 21.9 24.4 25.4 31.1 36.7 42.4 48.1 55.7 Total Capacitance CT @ f = 1MHz, VR = 0V Max (pF) 450 440 410 390 370 350 325 300 275 250 215 170 150 120 110 110 105 105 100 90 80 70 60 55 50 50 45 45 45 40 Maximum Reverse Current (Note 6) IR @ VR µA V 50 20 5 5 3 3 3 2 1 3 2 1 0.7 0.5 0.2 0.1 0.1 0.1 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 1 1 1 1 1 1 2 2 2 4 4 5 5 6 7 8 8 8 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 30.1 6. Short duration pulse test used to minimize self-heating effect. 7. f = 1kHz. BZT585B2V4T - BZT585B43T Document number: DS36638 Rev. 5 - 2 2 of 4 www.diodes.com March 2014 © Diodes Incorporated BZT585B2V4T - BZT585B43T IF, INSTANTANEOUS FORWARD CURRENT(mA) 0.4 PD, POWER DISSIPATION (W) Note 5 0.3 0.2 0.1 0 0 50 25 50 75 100 125 TA, AMBIENT TEMPERATURE (° C) Figure 1 Power Derating Curve 1000 150 TA = 150°C 100 TA = 125°C 10 TA = 85°C TA = 25°C 1 TA = -55°C 0.1 200 400 600 800 1000 1200 1400 1600 VF, INSTANTANEOUS FORWARD VOLTAGE(mV) Figure 2 Typical Forward Characteristics 30 T J = 25°C T J = 25°C 6V2 10 2V4 30 2V7 20 39 33 27 15 IZ, ZENER CURRENT (mA) IZ, ZENER CURRENT (mA) 22 40 36 30 20 43 24 20 10 10 0 3 4 5 6 7 8 9 10 11 12 VZ, ZENER VOLTAGE (V) Figure 3 Typical Zener Breakdown Characteristics 0 1 2 0 10 20 30 40 50 VZ, ZENER VOLTAGE (V) Figure 4 Typical Zener Breakdown Characteristics Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. L C SOD523 Dim Min Max A 0.25 0.35 B 0.70 0.90 C 1.50 1.70 H 1.10 1.30 K 0.55 0.65 L 0.10 0.30 M 0.10 0.12 All Dimensions in mm H M A B BZT585B2V4T - BZT585B43T Document number: DS36638 Rev. 5 - 2 K 3 of 4 www.diodes.com March 2014 © Diodes Incorporated BZT585B2V4T - BZT585B43T Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version. X1 X Dimensions Value (in mm) G 0.80 X 0.60 X1 2.00 Y 0.70 Y G IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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