TC1300 300 mA CMOS LDO with Shutdown, Bypass and Independent Delayed Reset Function Features General Description • LDO with Integrated Microcontroller Reset Monitor Functionality • Low Input Supply Current (80 µA, typical) • Very Low Dropout Voltage • 10 µsec (typ.) Wake-Up Time from SHDN • 300 mA Output Current • Standard or Custom Output and Detected Voltages • Power-Saving Shutdown Mode • Bypass Input for Quiet Operation • Separate Input for Detected Voltage • 140 msec Minimum RESET Output Duration • Space-Saving MSOP Package • Specified Junction Temperature Range: -40°C to +125°C The TC1300 combines a low dropout regulator and a microcontroller reset monitor in an 8-Pin MSOP package. Total supply current is 80 µA (typical), 20 to 60 times lower than bipolar regulators. Applications • • • • • Battery-Operated Systems Portable Computers Medical Instruments Pagers Cellular / GSM / PHS Phones The TC1300 has a precise output with a typical accuracy of ±0.5%. Other key features include low noise operation, low dropout voltage and internal feedforward compensation for fast response to step changes in load. The TC1300 has both over-temperature and over-current protection. When the shutdown control (SHDN) is low, the regulator output voltage falls to zero, RESET output remains valid and supply current is reduced to 30 µA (typical). The TC1300 is rated for 300 mA of output current and stable with a 1 µF output capacitor. An active-low RESET is asserted when the detected voltage (VDET) falls below the reset voltage threshold. The RESET output remains low for 300 msec (typical) after VDET rises above reset threshold. The TC1300 also has a fast wake-up response time (10 µsec., typical) when released from shutdown. Typical Application Circuit Related Literature RESET MSOP GND 3 Bypass 4 2 C1 1 µF TC1300VUA VDET VIN VOUT 8 3 4 GND Bypass NC SHDN VDET 7 C2 1 µF TC1300 CBYPASS 470 pF (Optional) Package Type RESET 1 VOUT 2 VOUT RESET + • AN765, “Using Microchip’s Micropower LDOs”, DS00765. • AN766, “Pin-Compatible CMOS Upgrades to Bipolar LDOs”, DS00766. • AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792. 1 6 Battery 5 Shutdown Control (from Power Control Logic) 8 VDET 7 VIN 6 NC 5 SHDN 2001-2012 Microchip Technology Inc. DS21385D-page 1 TC1300 1.0 ELECTRICAL CHARACTERISTICS PIN DESCRIPTIONS Pin Absolute Maximum Ratings* RESET Input Voltage ....................................................................6.5V Output Voltage ................................. (VSS - 0.3) to (VIN + 0.3) Power Dissipation ......................... Internally Limited (Note 6) Operating Junction Temperature, TJ ....... – 40°C < TJ< 150°C Maximum Junction Temperature, Tj .............................. 150°C Storage Temperature................................... – 65°C to +150°C Maximum Voltage on Any Pin ............. (VSS-0.3) to (VIN+0.3) VOUT GND *Notice: Stresses above those listed under “maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Description RESET output remains low while VDET is below the reset voltage threshold and for 300 msec after VDET rises above reset theshold. Regulated Voltage Output Ground Terminal Bypass Reference Bypass Input. Connecting an optional 470 pF to this input further reduces output noise. SHDN Shutdown Control Input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid and supply current is reduced to 30 µA (typ.). NC No connect VIN Power Supply Input VDET Detected Input Voltage. VDET and VIN can be connected together. ELECTRICAL CHARACTERISTICS VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature (Note 8) of -40°C to +125°C. Parameters Sym Min Typ Max Units VIN 2.7 — 6.0 V IOUTMAX 300 — — mA VOUT — VR - 2.5% VR ± 0.5% — — VR + 2.5% V VOUT/T — 25 — Line Regulation VOUT/VIN — 0.02 0.35 % (VR + 1V) < VIN < 6V Load Regulation VOUT/VOUT — 0.5 2.0 % IL = 0.1 mA to IOUTMAX, Note 3 Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Conditions Note 7 Note 1 ppm/°C Note 2 Note 1: VR is the regulator output voltage setting. 2: 6 VOUTMAX – V OUTMIN 10 TCV OUT = ------------------------------------------------------------------------------------V OUT T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data sheet for more details. 7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT). 8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. DS21385D-page 2 2001-2012 Microchip Technology Inc. TC1300 ELECTRICAL CHARACTERISTICS (CONTINUED) VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature (Note 8) of -40°C to +125°C. Parameters Sym Min Typ Max Units VIN –VOUT — 1 70 210 30 130 390 mV IL = 0.1 mA IL = 100 mA IL = 300 mA Supply Current ISS1 — 80 160 µA SHDN = VIH Shutdown Supply Current ISS2 — 30 60 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 60 — dB f 1 kHz, CBYPASS = 1 nF Output Short Circuit Current IOUTSC — 800 1200 mA VOUT = 0V VOUT/PD — 0.04 — %/W Note 5 Output Noise eN — 900 — nV/Hz Wake-Up Time (from Shutdown Mode) tWK — 10 20 µsec CIN = 1 µF, VIN = 5V, COUT = 4.7 µF, IL = 30 mA, See Figure 3-2 Settling Time (from Shutdown Mode) ts — 50 — µsec CIN = 1 µF, VIN = 5V COUT = 4.7 µF IL = 30 mA, See Figure 3-2 Thermal Shutdown Die Temperature TSD — 150 — °C Thermal Shutdown Hysteresis THYS — 10 — °C RthetaJA — 200 — SHDN Input High Threshold VIH 45 — — %VIN VIN = 2.5V to 6.0V SHDN Input Low Threshold VIL — — 15 %VIN VIN = 2.5V to 6.0V Dropout Voltage (Note 4) Thermal Regulation Thermal Resistance Junction to Case Conditions f < 1 kHz, COUT = 1 µF, RLOAD = 50 CBYPASS = 1 nF °C/Watt EIA/JEDEC JESD51-751-7 4Layer Board Note 1: VR is the regulator output voltage setting. 2: 6 VOUTMAX – V OUTMIN 10 TCV OUT = ------------------------------------------------------------------------------------V T OUT 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data sheet for more details. 7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT). 8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. 2001-2012 Microchip Technology Inc. DS21385D-page 3 TC1300 ELECTRICAL CHARACTERISTICS (CONTINUED) VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperature (Note 8) of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Voltage Range VDET 1.0 1.2 — — 6.0 6.0 V TA = 0°C to +70°C TA = – 40°C to +125°C Reset Threshold VTH 2.59 2.63 2.66 V TC1300R-XX, TA = +25°C 2.55 — 2.70 TC1300R-XX, TA = – 40°C to +125°C 2.36 2.40 2.43 TC1300Y-XX, TA = +25°C 2.32 — 2.47 TC1300Y-XX, TA = – 40°C to +125°C VTH / T — 30 — ppm/°C VDET to Reset Delay tRPD — 160 — µsec Reset Active Timeout Period tRPU 140 300 560 msec RESET Output Voltage Low VOL — — 0.3 V VDET = VTH min, ISINK = 1.2 mA RESET Output Voltage High VOH 0.8 VDET — — V VDET > VTH max, ISOURCE = 500 µA RESET Output Reset Threshold Tempco VDET = VTH to (VTH – 100 mV) Note 1: VR is the regulator output voltage setting. 2: 6 VOUTMAX – V OUTMIN 10 TCV OUT = -------------------------------------------------------------------------------------V OUT T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data sheet for more details. 7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT). 8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. DS21385D-page 4 2001-2012 Microchip Technology Inc. TC1300 2.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambient temperature is not significant. Line Regulation (%) 0.035 VOUT = 3.0V VIN = 3.5V to 6.0V 0.030 0.025 0.020 0.015 0.010 0.005 0.000 Reset Active Time-out Period (ms) Note: 450 400 350 300 250 200 150 100 50 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 Junction Temperature (°C) FIGURE 2-1: Temperature. Line Regulation vs. 35 10.00 VOUT = 5.0V 0.10 VOUT = 3.0V 0.08 VOUT = 2.5V 0.06 0.04 0.02 -40 -25 -10 5 65 80 95 110 125 1.00 0.10 0.01 0.01 20 35 50 65 80 95 110 125 1 1.00 0.10 10 10.00 100 100.00 1000 1000.00 Frequency (kHz) Junction Temperature (°C) FIGURE 2-2: Temperature. 50 RLOAD = 50 Ohms COUT = 1 µF VIN = VOUT + 1V Output Noise (µV/lHz) 0.12 0.00 Supply Current vs. FIGURE 2-5: Output Noise vs. Frequency. 0.30 2.500 VOUT = 2.5V 2.498 2.497 2.496 2.495 2.494 VIN = VOUT + 1V IOUT = 100 µA VOUT = 2.5V 2.493 2.492 Dropout Voltage (V) 2.499 Output Voltage (V) 20 FIGURE 2-4: Reset Active Time-out Period vs. Temperature. 0.14 Supply Current (mA) 5 Junction Temperature (°C) 0.25 TJ = -40°C TJ = +125°C 0.20 0.15 TJ = +25°C 0.10 0.05 0.00 2.491 -40 -25 -10 5 20 35 50 65 80 95 110 125 0 FIGURE 2-3: Temperature. Normalized VOUT vs. 2001-2012 Microchip Technology Inc. 100 200 300 400 Load Current (mA) Junction Temperature (°C) FIGURE 2-6: Current (2.5V). Dropout Voltage vs. Load DS21385D-page 5 TC1300 2.0 TYPICAL CHARACTERISTICS (CON’T) 60 VIN = 3.8V VOUT = 2.8V IOUT = 50 mA COUT = 10 μF COUTesr = 0.25 : CBYPASS = 0 μF 45 30 15 0.3 VOUT = 5.0V Dropout Voltage (V) Power Supply Ripple Rejection (dB) Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambient temperature is not significant. 0 0.25 TJ = +125°C 0.2 0.15 TJ = +25°C 0.1 0.05 0 10 1k 1000 100 10k 10000 100k 100000 1M 100000 0 100 Frequency (Hz) 200 300 400 Load Current (mA) FIGURE 2-7: Power Supply Rejection Ratio vs. Frequency. Reset Voltage Threshold (V) TJ = -40°C FIGURE 2-10: Current (5.0V). Dropout Voltage vs. Load FIGURE 2-11: Wake-Up Response Time. 2.6330 2.6325 2.6320 2.6315 2.6310 2.6305 2.6300 2.6295 2.6290 2.6285 2.6280 2.6275 -40 -25 -10 5 20 35 50 65 80 95 110 125 Load Regulation (1 mA to 300 mA) % FIGURE 2-8: Reset Voltage Threshold vs. Junction Temperature. 0.90 VIN = VOUT + 1V 0.80 VOUT = 3.0V 0.70 0.60 0.50 VOUT = 2.5V 0.40 VOUT = 5.0V 0.30 0.20 -40 -25 -10 5 20 35 50 65 80 95 110 125 VDET to RESET Delay Time (µS) Junction Temperature (°C) 300 250 10 mV Overdrive 200 100 mV Overdrive 150 100 50 0 -40 -25 -10 FIGURE 2-9: Temperature. DS21385D-page 6 Load Regulation vs. 5 20 35 50 65 80 95 110 125 Junction Temperature (°C) Junction Temperature (°C) FIGURE 2-12: Temperature. VDET to Reset Delay vs. 2001-2012 Microchip Technology Inc. TC1300 2.0 TYPICAL CHARACTERISTICS (CON’T) Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambient temperature is not significant. FIGURE 2-13: Load Transient Response 1 µF Output Capacitor. FIGURE 2-16: Line Transient Response 10 µF Output Capacitor. 0.30 VDET = VTH - 20 mV RESET VOL (V) 0.25 ISINK = 3.2 mA 0.20 0.15 ISINK = 1.2 mA 0.10 0.05 0.00 -40 -25 -10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C) FIGURE 2-14: Line Transient Response 1 µF Output Capacitor. FIGURE 2-17: RESET Output Voltage Low vs. Junction Temperature. 3.960 RESET VOH (V) 3.950 ISOURCE = 500 µA 3.940 3.930 3.920 ISOURCE = 800 µA 3.910 3.900 VDET = 4.0V 3.890 -40 -25 -10 5 20 35 50 65 80 95 110 125 Junction Temperature (°C) FIGURE 2-15: Load Transient Response 10 µF Output Capacitor. 2001-2012 Microchip Technology Inc. FIGURE 2-18: RESET Output Voltage High vs. Junction Temperature. DS21385D-page 7 TC1300 3.0 DETAILED DESCRIPTION The TC1300 is a combination of a fixed output, low dropout regulator and a microcontroller monitor/RESET. Unlike bipolar regulators, the TC1300 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire specified operating load range (0 mA to 300 mA) and operating input voltage range (2.7V to 6.0V). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is above VIH. The regulator is shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate or an I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 30 µA (typical), VOUT falls to zero and RESET remains valid. 3.1 RESET Output The RESET output is driven active-low within 160 µsec of VDET falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 msec after VDET rises above the reset threshold. The TC1300 has an active-low RESET output. The output of the TC1300 is valid down to VDET = 1V and is optimized to reject fast transient glitches on the VDET line. Microcontroller RESET C1 1 µF RESET VDET 2 V OUT VIN 7 TC1300 3 4 GND NC VDET C2 1 µF 6 Battery Bypass SHDN 5 CBYPASS 470 pF (Optional) FIGURE 3-1: 8 + VOUT 1 TC1300, the selected output capacitor equivalent series resistance (ESR) range is 0.1 ohms to 5 ohms when using 1 µF of output capacitance, and 0.01 ohms to 5 ohms when using 10 µF of output capacitance. Because of the ESR requirement, tantalum and aluminum electrolytic capacitors are recommended. Aluminum electrolytic capacitors are not recommended for operation at temperatures below -25°C. When operating from sources other than batteries, rejection and transient responses can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3.3 Bypass Input (Optional) An optional 470 pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise and improves PSRR performance. This input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. 3.4 Turn On Response The turn-on response is defined as two separate response categories, Wake-Up Time (tWK) and Settling Time (tS). The TC1300 has a fast Wake-Up Time (10 µsec typical) when released from shutdown. See Figure 3-2 for the Wake-Up Time designated as tWK. The Wake-Up Time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. The total turn-on response is defined as the Settling Time (tS) (see Figure 3-2). Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (50 µsec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). Shutdown Control (from Power Control Logic) Typical Application Circuit. VIH SHDN VIL tS 98% 3.2 Output Capacitor A 1 µF (min) capacitor from VOUT to ground is required. A 1 µF capacitor should also be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. As with all low dropout regulators, a minimum output capacitance is required to stabilize the output voltage. For the TC1300, a minimum of 1 µF of output capacitance is enough to stabilize the device over the entire operating load and line range. The selected output capacitor plays an important role is compensating the LDO regulator. For the DS21385D-page 8 VOUT 2% tWK FIGURE 3-2: Wake-Up Response Time. 2001-2012 Microchip Technology Inc. TC1300 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 The worst case actual power dissipation equation can be used in conjunction with the LDO maximum allowable power dissipation equation to ensure regulator thermal operation is within limits. For example: Given: Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION VINMAX = 4.1V VOUTMIN = 3.0V -2.5% ILOADMAX = 200 mA TJMAX = 125°C TAMAX = 55°C JA = 200°C/W Find: EQUATION: PD V INMAX – VOUTMIN I LOADMAX ACTUAL POWER DISSIPATION PD V INMAX – VOUTMIN ILOADMAX Where: PD = worst case actual power dissipation VINMAX = maximum voltage on VIN VOUTMIN = minimum regulator output voltage ILOADMAX = maximum output (load) current = 4.1 – 3.0 .975 200 10 = 220 mW EQUATION: The maximum allowable power dissipation, PDMAX, is a function of the maximum ambient temperature (TAMAX), the maximum recommended die temperature (125°C) and the thermal resistance from junction-to-air (JA). The MSOP-8 package has a JA of approximately 200°C/Watt when mounted on a FR4 dielectric copper clad PC board. EQUATION T JMAX – T AMAX PDMAX = ------------------------------------------ JA –3 MAXIMUM ALLOWABLE POWER DISSIPATION T JMAX – T AMAX PDMAX = ------------------------------------------ JA 125 – 55 = ------------------------200 = 350 mW In this example, the TC1300 dissipates a maximum of only 220 mW; below the allowable limit of 350 mW. In a similar manner, the maximum actual power dissipation equation and the maximum allowable power dissipation equation can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350 mW into the actual power dissipation equation, from which VINMAX = 4.97V. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. 2001-2012 Microchip Technology Inc. DS21385D-page 9 TC1300 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Example: 8-Lead MSOP XXXXXX 1300RA YWWNNN YWWNNN Part Number Legend: XX...X Y YY WW NNN e3 * Note: DS21385D-page 10 Marking Code (XXXXXX) TC1300R - 2.5VUA 1300RA TC1300Y - 2.7VUA 1300YF TC1300R - 2.8VUA 1300RB TC1300R - 2.85VUA 1300RC TC1300R - 3.0VUA 1300RD TC1300R - 3.3VUA 1300RE Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2001-2012 Microchip Technology Inc. TC1300 5.2 Package Dimensions Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size: Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in. 2001-2012 Microchip Technology Inc. DS21385D-page 11 TC1300 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E p E1 D 2 B n 1 A2 A A1 c (F) L INCHES Units Number of Pins Pitch Dimension Limits n p Overall Height MILLIMETERS* NOM MIN MAX NOM MIN .026 0.65 1.18 .044 A 0.86 0.97 4.67 4.90 .5.08 .122 2.90 3.00 3.10 .122 2.90 3.00 3.10 .022 .028 0.40 0.55 0.70 .037 .039 0.90 0.95 1.00 6 0 .004 .006 .008 0.10 0.15 0.20 .010 .012 .016 0.25 0.30 0.40 .038 0.76 .006 0.05 .193 .200 .114 .118 .114 .118 L .016 .035 Foot Angle F Lead Thickness c Lead Width Mold Draft Angle Top B Mold Draft Angle Bottom Molded Package Thickness A2 .030 Standoff A1 .002 E .184 Molded Package Width E1 Overall Length D Foot Length Footprint (Reference) § Overall Width MAX 8 8 .034 0 0.15 6 7 7 7 7 *Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-111 DS21385D-page 12 2001-2012 Microchip Technology Inc. TC1300 6.0 REVISION HISTORY Revision D (November 2010) Added a note to each package outline drawing. 2001-2012 Microchip Technology Inc. DS21385D-page 13 TC1300 NOTES: DS21385D-page 14 2001-2012 Microchip Technology Inc. TC1300 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X.X X /XX Device Output Voltages Temperature Range Package Device: TC1300X-X.XXXX: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset TC1300X-X.XXXXTR: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset (Tape and Reel) Examples: a) b) c) d) Output Voltages: RESET Threshold Voltages: - 2.4V = Y - 2.63V = R 2.5V 2.7V 2.8V 2.85V 3.0V 3.3V = = = = = = 2.5 2.7 2.8 2.85 3.0 3.3 Temperature Range: V Package: UA = Micro Small Outline Package (MSOP), 8-lead = -40°C to +125°C e) f) g) TC1300R-2.5VUA: 300mA CMOS LDO w/ Shutdown, Bypass & Independent Delayed Reset, 2.5V output voltage, 2.63V RESET Threshold. TC1300R-2.8VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset, 2.8V output voltage, 2.63V RESET Threshold. TC1300R-2.85VUA: 300mA CMOS LDO w/ Shutdown, Bypass & Independent Delayed Reset, 2.85V output voltage, 2.63V RESET Threshold. TC1300R-3.0VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset, 3.0V output voltage, 2.63V RESET Threshold. TC1300R-3.3VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset, 3.3V output voltage, 2.63V RESET Threshold. TC1300R-2.85VUATR: 300mA CMOS LDO w/ Shutdown, Bypass & Independent Delayed Reset, 2.85V output voltage, 2.63V RESET Threshold, tape and reel. TC1300Y-2.7VUA: 300mA CMOS LDO w/ Shutdown, Bypass & independant Delayed Reset, 2.7V output voltage, 2.4V RESET Threshold. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2001-2012 Microchip Technology Inc. DS21385D-page15 TC1300 NOTES: DS21385D-page 16 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767832 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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