NIV1161, NIS1161 ESD Protection with Automotive Short-toBattery Blocking Low Capacitance ESD Protection with short−to−battery blocking for Automotive High Speed Data Lines www.onsemi.com MARKING DIAGRAM The NIS/NIV1161 is designed to protect high speed data lines from ESD as well as short to vehicle battery situations. The ultra−low capacitance and low ESD clamping voltage make this device an ideal solution for protecting voltage sensitive high speed data lines while the low RDS(on) FET limits distortion on the signal lines. The flow−through style package allows for easy PCB layout and matched trace lengths necessary to maintain consistent impedance between high speed differential lines such as USB and LVDS protocols. WDFN6 CASE 511CB V6 M Features • = Specific Device Code = Date Code PIN CONFIGURATION AND SCHEMATICS • Low Capacitance (0.65 pF Typical, I/O to GND) • Protection for the Following Standards: • • V6 M 1 1 IEC 61000−4−2 (Level 4) & ISO 10605 Integrated MOSFETs for Short−to−Battery Blocking NIV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 6 6 2 5 4 3 4 (Top View) Pin 2 − 5 V Typical Applications • • • • Automotive High Speed Signal Pairs USB 2.0/3.0 LVDS APIX 2/3 Pin 1 D+ HOST Pin 6 D+ Pin 3 D− HOST Pin 4 D− ABSOLUTE MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Pin 5 − GND Pin 2 − 5 V Rating Symbol Value Unit Operating Junction Temperature Range TJ(max) −55 to +150 °C Storage Temperature Range TSTG −55 to +150 °C Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±10 V Device Package Shipping† Lead Temperature Soldering TSLD 260 °C NIV1161MTTAG ESD ESD ±8 ±15 kV kV WDFN−6 (Pb−Free) 3000 / Tape & Reel IEC 61000−4−2 Contact (ESD) IEC 61000−4−2 Air (ESD) NIS1161MTTAG WDFN−6 (Pb−Free) 3000 / Tape & Reel Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2016 March, 2016 − Rev. 1 1 ORDERING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NIV1161/D NIV1161, NIS1161 ELECTRICAL CHARACTERISTICS (TA = 25_C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min I/O Pin to GND IT = 1 mA, I/O Pin to GND Typ Max Unit 5 16 V 16.5 V 1.0 mA 26 V Reverse Leakage Current IR VRWM = 5 V, I/O Pin to GND Clamping Voltage VC IPP = 1 A, I/O Pin to GND (8/20 ms pulse) Clamping Voltage (Note 1) VC IEC61000−4−2, ±8 KV Contact Clamping Voltage TLP (Note 2) See Figures 5 & 6 VC IPP = 8 A IPP = 16 A IPP = −8 A IPP = −16 A 34 55 −5.2 −10 V V V V D CJ VR = 0 V, f = 1 MHz between I/O 1 to GND and I/O 2 to GND 1.0 % CJ VR = 0 V, f = 1 MHz between I/O Pins and GND (Pin 4 to GND, Pin 6 to GND) 0.65 pF Junction Capacitance Match Junction Capacitance Drain−to−Source Breakdown Voltage VBR(DSS) VGS = 0 V, ID = 100 mA Drain−to−Source Breakdown Voltage Temperature Coefficient VBR(DSS)/ TJ Reference to 25_C, ID = 100 mA See Figures 1 & 2 30 V 27 mV/_C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 30 V 1.0 mA Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = ±5 V ±1.0 mA VGS(TH) VDS = VGS, ID = 100 mA 1.5 V Gate Threshold Voltage (Note 3) Gate Threshold Voltage Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance VGS(TH)/TJ RDS(on) 0.1 1.0 Reference to 25_C, ID = 100 mA −2.5 VGS = 4.5 V, ID = 125 mA 1.4 7.0 VGS = 2.5 V, ID = 125 mA 2.3 7.5 mV/_C W gFS VDS = 3.0 V, ID = 125 mA 80 mS Switching Turn−On Delay Time (Note 4) td(ON) 9 nS Switching Turn−On Rise Time (Note 4) tr VGS = 4.5 V, VDS = 24 V ID = 125 mA, RG = 10 VW 41 nS Switching Turn−Off Delay Time (Note 4) td(OFF) 96 nS tf 72 nS Switching Turn−Off Fall Time (Note 4) Drain−to−Source Forward Diode Voltage VSD VGS = 0 V, Is = 125 mA 3 dB Bandwidth fBW RL = 50 W 0.79 5 0.9 V GHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. For test procedure see Figures 3 and 4 and application note AND8307/D. 2. ANSI/ESD STM5.5.1 * Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. 3. Pulse test: pulse width ≤ 300 mS, duty cycle ≤ 2% 4. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2 NIV1161, NIS1161 Figure 1. IEC61000−4−2 +8kV Contact ESD Clamping Voltage Figure 2. IEC61000−4−2 −8kV Contact ESD Clamping Voltage IEC61000−4−2 Waveform IEC61000−4−2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 3. IEC61000−4−2 Spec ESD Gun Oscilloscope TVS 50 W Cable 50 W Figure 4. Diagram of ESD Clamping Voltage Test Setup The following is taken from Application Note AND8307/D − Characterization of ESD Clamping Performance. systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D. ESD Voltage Clamping For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000−4−2 waveform. Since the IEC61000−4−2 was written as a pass/fail spec for larger www.onsemi.com 3 NIV1161, NIS1161 16 8 14 8 4 6 4 2 2 6 -12 -10 4 -8 -6 2 -4 Equivalent VIEC [kV] 10 TLP Current [A] TLP Current [A] 6 Equivalent V IEC [kV] -14 12 0 8 -16 -2 0 10 20 30 40 Vc [V] 50 60 70 0 0 0 Figure 5. Positive TLP I−V Curve NOTE: 10 20 30 40 50 Vc [V] 60 70 0 Figure 6. Negative TLP I−V Curve TLP parameter: Z0 = 50 W, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns. VIEC is the equivalent voltage stress level calculated at the secondary peak of the IEC 61000−4−2 waveform at t = 30 ns with 2 A/kV. See TLP description below for more information. Transmission Line Pulse (TLP) Measurement L Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 7. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 8 where an 8 kV IEC 61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP I−V curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. For more information on TLP measurements and how to interpret them please refer to AND9007/D. S Attenuator ÷ 50 W Coax Cable 10 MW IM 50 W Coax Cable VM DUT VC Oscilloscope Figure 7. Simplified Schematic of a Typical TLP System Figure 8. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms www.onsemi.com 4 NIV1161, NIS1161 TYPICAL MOSFET PERFORMANCE CURVES 4.5 V ID, DRAIN CURRENT (A) 4.0 V 1.0 0.9 3.5 V 0.8 0.7 3.0 V 2.8 V 2.6 V 2.4 V 2.2 V 2.0 V 1.8 V 0.6 0.5 0.4 0.3 0.2 0.1 0 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 5.0 V VGS = 10 V 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VDS = 5 V TJ = 25°C TJ = 150°C 0.7 0.6 TJ = −55°C 0.5 0.4 0.3 0.2 5.0 0 1.0 2.0 2.5 3.0 3.5 Figure 9. On−Region Characteristics Figure 10. Transfer Characteristics TJ = 25°C ID = 125 mA 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 2.0 3.0 2.5 3.5 4.0 4.5 4.0 4.5 10 TJ = −55°C TJ = 125°C 9.0 8.0 VGS = 2.5 V VGS = 4.5 V TJ = 25°C 7.0 6.0 5.0 TJ = 125°C 4.0 3.0 TJ = 25°C 2.0 1.0 0 TJ = −55°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 VGS, GATE VOLTAGE (V) ID, DRAIN CURRENT (A) Figure 12. On−Resistance vs. Drain Current and Gate Voltage Figure 11. On−Resistance vs. Gate−to−Source Voltage 1000 ID = 125 mA VGS = 4.5 V IDSS, LEAKAGE (nA) 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 −50 1.5 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 9.0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 0.5 VGS, GATE−TO−SOURCE VOLTAGE (V) 10 1.5 1.2 1.1 1.0 0.9 0.8 0.1 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) ID, DRAIN CURRENT (A) 1.2 1.1 TJ = 150°C 100 TJ = 125°C 10 TJ = 85°C 1 0.1 −25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 13. On−Resistance Variation with Temperature Figure 14. Drain−to−Source Leakage Current vs. Voltage www.onsemi.com 5 NIV1161, NIS1161 APPLICATION INFORMATION • Make sure to use differential design methodology and Today’s connected cars are using multiple high speed signal pair interfaces for various applications such as infotainment, connectivity and ADAS. The electrical hazards likely to be encountered in these automotive high speed signal interfaces include damaging ESD and transient events which occur during manufacturing and assembly, by vehicle occupants or other electrical circuits in the vehicle. The major documents discussing ESD and transient events as far as road vehicles are concerned are ISO 10605 (Road vehicles − Test methods for electrical disturbances from electrostatic discharge) which describes ESD test methods and ISO 7637 (Road vehicles − Electrical disturbances from conduction and coupling) for effects caused by other electronics in the vehicle. IS0 10605 is based on IEC 61000−4−2 Industry Standard, which specifies the various levels of ESD signal characteristics, but also includes additional vehicle−specific requirements. Further, OEM specific test requirements are usually also imposed. In addition, these high speed signal pairs require protection from short−to−battery (which goes up to 16 VDC) and short−to−ground faults. A suitable protection solution must satisfy well known constraints, such as low capacitive loading of the signal lines to minimize signal attenuation, and also respond quickly to surges and transients with low clamping voltage. In addition, small package sizes help to minimize demand for board−space while providing the ability to route the trace signals with minimal bending to maintain signal integrity. impedance matching of all high speed signal traces. ♦ Use curved traces when possible to avoid unwanted reflections. ♦ Keep the trace lengths equal between the positive and negative lines of the differential data lanes to avoid common mode noise generation and impedance mismatch. ♦ Place grounds between high speed pairs and keep as much distance between pairs as possible to reduce crosstalk. Modes of Operation There are two distinct modes of operation of the NIV1161: normal (steady state) and short−to−battery event. The below describes each of these in more detail. Normal Operation (Steady State) In normal operation, the MOSFETs operate in linear mode, with all source and drain voltages nearly equal, passing the signal levels effectively from the USB transceiver. To ensure successful link communication, the applied gate voltage must be greater than the maximum signal level from the data line plus the maximum threshold voltage of the MOSFET device. Due to the NIV1161’s low of 1.5 V, both 3.3 and 5 V gate drives are suitable to provide headroom for most communication protocols. The net effect of the 1 kW pull−up resistor on the MOSFET gate to the source effectively level−shifts the common mode voltage on the individual data lines up to the gate voltage. This action is cancelled out when an appropriate NIV1161 is used on the opposite side of the data line to level−shift the common−mode voltage back down to levels appropriate for the reader. If a NIV1161 is not used on the opposite side of the data line, the pull−up resistor may either not be populated or populated with high value resistor (15 kW+); differential data signal integrity is maintained. Short−to−Battery (STB) Event While the NIV1161 and data channel are off, one pair of MOSFET body diodes passively protects the USB transceiver ’s ports. While the data channel is on during an event, the NIV1161 actively uses the internal MOSFETs to clamp in a manner akin to level−shifting as the MOSFET operates in the saturation region. The source node will increase to a threshold voltage minus a working below the gate voltage thus allowing current to flow into the data port impedance until the gate−source voltage comes to rest just above the threshold voltage. In this way, the NIV1161 protects the data port by limiting the termination current as well as voltage clamping the data port itself. PCB Layout Guidelines It is optional to route both pins 4 & 6 to their respective belly pads with a top metal trace as both pins are internally connected respectively. Also, steps must be taken for proper placement and signal trace routing of the ESD protection device in order to ensure the maximum ESD survivability and signal integrity for the application. Such steps are listed below. • Place the ESD protection device as close as possible to the I/O connector to reduce the ESD path to ground and improve the protection performance. www.onsemi.com 6 NIV1161, NIS1161 PACKAGE DIMENSIONS WDFN6 2x2, 0.65P CASE 511CB ISSUE O D PIN ONE REFERENCE 0.10 C 0.10 C ÉÉÉ ÉÉ ÇÇÇ ÇÇÇ ÉÉ ÉÉÉ ÇÇÇÇÇ EXPOSED Cu A B ÍÍ ÍÍ ÍÍ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD DETAIL B E ALTERNATE TERMINAL CONSTRUCTIONS L DIM A A1 A3 b b2 D D2 E E2 e F G L L1 L2 L TOP VIEW L1 DETAIL A A3 DETAIL B 0.10 C ALTERNATE CONSTRUCTIONS A 6X 0.08 C A1 NOTE 4 C SIDE VIEW 2X DETAIL A e F SEATING PLANE RECOMMENDED MOUNTING FOOTPRINT 0.10 C A B 2X 1 D2 1.72 3 2X 0.65 PITCH E2 0.48 L2 6 PACKAGE OUTLINE 0.10 C A B L G MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 0.35 0.45 2.00 BSC 0.55 0.65 2.00 BSC 0.55 0.65 0.65 BSC 0.52 BSC 0.20 BSC 0.20 0.30 --0.15 0.55 0.65 0.80 4 b2 5X BOTTOM VIEW 2.30 5X b 0.10 M C A 0.05 M C 0.44 B 2X 0.67 0.54 5X 1 0.35 2X 0.67 DIMENSIONS: MILLIMETERS ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NIV1161/D