SC668 Datasheet

SC668
8 LED Light Management Unit
Automatic Dropout Prevention , Ambient Light
Sense Input, PWM Dimming, and 4 LDOs
POWER MANAGEMENT
Features

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Description
Eight LED backlight sinks with 32 current settings
from — 0mA to 25mA
Up to four LED backlight banks
Lighting effects — fade-in/fade-out, breathe, blink,
auto-dim full, and auto-dim partial functions
ADP (Automatic Dropout Protection) for backlights
ALS (Ambient Light Sense) option sets the backlight
brightness according to ambient lighting conditions
I2C Bus fast mode and standard mode
Backlight current accuracy — ± 1.5% typical
Backlight current matching — ± 0.5% typical
Four programmable 200mA low-noise LDO regulators
PWM interface (200Hz to 50kHz) with internal digital
low-pass filter
Automatic sleep mode with all LEDs off
Shutdown current — 0.1µA typical
Ultra-thin package — 3 x 3 x 0.6 (mm)
Lead-free and halogen-free
WEEE and RoHS compliant
Applications





Cellular phones, smart phones, and PDAs
LCD modules
Portable media players and digital cameras
Personal navigation devices
Display/keypad backlighting and LED indicators
VIN
IN
CIN
ADP limits the maximum LED current to a level that ensures
the LEDs maintain matched currents when the supply
voltage approaches dropout. This feature produces acceptable light output at low supply voltage levels without
requiring a boost converter or charge pump.
Two interfaces are provided for design flexibility. The I2C
interface controls the LED on/off functions, assigns the
LEDs to backlight banks, programs the LED currents, programs the lighting effects, enables the LDOs, and sets the
LDO output voltages. The PWM interface reduces the
current setting for LED bank #1 by a factor equal to the duty
cycle of the applied PWM signal. A filter at the PWM input
converts the pulsed signal to a DC current level, resulting in
less switching noise compared to pulsed current methods.
The ADI input translates the voltage from an external ALS
(Ambient Light Sensor) into a digitized code using a sigmadelta ADC. This block includes level detection to adjust the
current setting of bank #1 with two different programmable
levels based on the ambient light level. An interrupt output
transitions low to notify the host processor that a level
adjustment has been made.
Typical Application Circuit
2.9 to 5.5V
The SC668 is a highly integrated light management unit
that provides programmable current for up to eight LED
current sinks. Four LED banks are provided to allow settings for various LED zones or indicators. Four low-noise
LDOs with programmable outputs ranging from 1.2V to 3.3V
and 200mA maximum output current are also included.
SC668
VIN
BL1
BL2
GND
BL3
BL4
I2C Data
SDA
BL5
I2C Clock
SCL
BL6
PWM
Backlight PWM
EN
Device Enable
VLDO4
ADI
BYP
CBYP
BL7
BL8
LDO1
LDO2
LDO3
LDO4
LDO1
LDO2
LDO3
LDO4
C1
C2
C3
C4
Ambient Light Sensor
December 2, 2010
© 2010 Semtech Corporation
SC668
20
LDO1
19
18
17
EN
BYP
Ordering Information
LDO4
LDO3
LDO2
Pin Configuration
16
1
TOP VIEW
15
PWM
VIN
2
14
SDA
GND
3
13
SCL
BL8
4
12
ADI
11
BL1
6
7
8
9
10
BL5
BL4
BL3
BL2
5
BL6
BL7
T
Device
Package
SC668ULTRT(1)(2)
MLPQ-UT-20 3×3
SC668EVB
Evaluation Board
Notes:
(1) Available in tape and reel only. A reel contains 3,000 devices.
(2) Lead-free package only. Device is WEEE and RoHS compliant and
halogen-free.
MLPQ-UT-20; 3x3, 20 LEAD
θJA = 35°C/W
Marking Information
668
yyww
xxxx
yyww = Date Code
xxxx = Semtech Lot Number
SC668
Absolute Maximum Ratings
Recommended Operating Conditions
Pin Voltage — IN (V) . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0
Ambient Temperature Range (°C). . . . . . . . . . -40 ≤ TA ≤ +85
Pin Voltage — All Other Pins (V). . . . . . . . . -0.3 to (VIN + 0.3)
Input Voltage (V) . . . . . . . . . . . . . . . . . . . . . . . . . 2.9 ≤ VIN ≤ 5.5
LDOn Short Circuit Duration . . . . . . . . . . . . . . . Continuous
Backlight Sink Voltage (V) . . . . . . . . . . . . . . . . 0.05 ≤ VIN ≤ 4.2
ESD Protection Level (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5
Thermal Information
(1)
(2)
Thermal Resistance, Junction to Ambient(3) (°C/W) . . . . 35
Storage Temperature Range (°C). . . . . . . . . . . . . -65 to +150
Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . . +260
Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters
specified in the Electrical Characteristics section is not recommended.
NOTES:
(1) Subscripting for all LDOs (LDOn), n = 1, 2, 3, 4.
(2) Tested according to JEDEC standard JESD22-A114-B.
(3) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards.
Electrical Characteristics
Unless otherwise noted, TA = +25°C for Typ, -40ºC to +85°C for Min and Max, TJ(MAX) = 125ºC, VIN = 3.7V, CIN = CLDO1 = CLDO2 = CLDO3 = CLDO4 = 1.0µF,
CBYP = 22nF, (ESR = 0.03Ω)(1)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
5.5
V
µA
Supply Specifications
Input Supply Voltage
Shutdown Current
Total Quiescent Current
VIN
IQ(OFF)
IQ
2.9
Shutdown, VIN = 4.2V
0.1
2.0
Sleep (all LDOs off ), EN = VIN(2)
90
135
Sleep (all LDOs on), EN = VIN (2)
300
450
8 LEDs on
1.5
200
µA
LED Sink Electrical Specifications
Maximum Total Backlight Current
IOUT(MAX)
Sum of all active LED currents, VIN above dropout level
Backlight Current Setting Range
IBL
Nominal setting for BL1 – BL8
Backlight Current Accuracy
IBL_ACC
IBLn(3) = 12mA
Backlight Current Matching(4)
IBL-BL
IBLn(3) = 12mA
Dropout Voltage(5)
VDO
One bank of 6 backlights set equal to 20mA
59
IBL/FL(OFF)
VIN = VBLn(3) = 4.2V
0.1
Current Sink Off-State Leakage Current
0
mA
25
±1.5
-3.5
±0.5
mA
%
+3.5
%
mV
1
µA
SC668
Electrical Characteristics (continued)
Parameter
Symbol
Conditions
Min
VLDOm (6)
Range of nominal settings
LDO2 Voltage Setting Range
VLDO2
Output Voltage Accuracy
∆VLDO
Typ
Max
Units
1.5
3.3
V
Range of nominal settings
1.2
1.8
V
ILDOn (6) = 1mA, TA = 25°C, 2.9V ≤ VIN ≤ 4.2V
-3
+3
%
ILDOn (6) = 1mA to 100mA, 2.9V ≤ VIN ≤ 4.2V
-3.5
+3.5
%
LDO Electrical Specifications
LDO1, LDO3, and LDO4
Voltage Setting Range
Dropout Voltage
Current Limit
Line Regulation
Load Regulation
VDm (6)
ILDOm (6) = 150mA, VIN = VLDOm + VDm
150
200
VD2
ILDO2 = 100mA, VIN = VLDO2 + VD2
100
150
ILIM
mV
200
mA
ILDOm (6) = 1mA, VIN = 2.9V to 4.2V, VLDOm = 2.8V
2.1
7.2
ILDO2 = 1mA, VIN = 2.9V to 4.2V, VLDO2 = 1.8V
1.3
4.8
VLDOm (6) = 3.3V, ILDOm = 1mA to 100mA
10
25
VLDO2 = 1.8V, ILDO2 = 1mA to 100mA
8
20
PSRRm (6)
1.5V < VLDOm < 3.0V, f < 10kHz, CBYP = 22nF,
ILDOm = 50mA, with 0.5VP-P supply ripple
53
PSRR2
1.2V < VLDO2 < 1.8V, f < 10kHz, CBYP = 22nF,
ILDO2 = 50mA, with 0.5VP-P supply ripple
61
en-LDOm (6)
10Hz < f < 100kHz, CBYP = 22nF,
CLDOm = 1µF, ILDOm = 50 mA, 1.5V < VLDOm < 3.0V
67
en-LDO2
10Hz < f < 100kHz, CBYP = 22nF,
CLDO2 = 1µF, ILDO2 = 50 mA, 1.2V < VLDO2 < 1.8V
47
CLDO(MIN)
Nominal value for CLDOn (6)
DVLINE
DVLOAD
Power Supply Rejection Ratio
Output Voltage Noise
Minimum LDO Capacitor (1)
±1.0
mV
mV
dB
µVRMS
1
µF
ADC Specifications
Resolution
Offset
Gain Error
Integral Non-Linearity
ADRES
8
bits
ADOFFSET
VLDO4 = 3.3V
1
LSB
ADGAIN_ERR
VLDO4 = 3.3V
0.1
%
INL
VLDO4 = 3.3V
1
LSB
SC668
Electrical Characteristics (continued)
Parameter
Symbol
Conditions
Min
1.6
Typ
Max
Units
Digital Input Electrical Specifications (PWM, EN, SDA, SCL)
Input High Threshold (7) (8)
VIH
VIN = 5.5V
Input Low Threshold (7) (8)
VIL
VIN = 2.9V
Input High Current
IIH
VIN = 5.5V
Input Low Current
IIL
VIN = 5.5V
V
0.4
V
-1
+1
µA
-1
+1
µA
0.2
50
kHz
0.4
V
PWM Input Specification (PWM)
PWM Input Frequency
fPWM
I2C Interface
Interface complies with slave mode I2C interface as described by Philips I2C specification version 2.1 dated January, 2000.
Digital Input Voltage (7)
VB-IL
VB-IH
SDA Output Low Level
1.6
V
IDIN (SDA) ≤ 3mA
-0.2
0.4
V
0.2
µA
Digital Input Current
IB-IN
Hysteresis of Schmitt Trigger Inputs
VHYS
0.1
V
Maximum Glitch Pulse Rejection
tSP
50
ns
I/O Pin Capacitance
CIN
10
pF
Clock Frequency (7)
fSCL
400
SCL Low Period (7) (8)
tLOW
1.3
µs
SCL High Period
tHIGH
0.6
µs
Data Hold Time (7) (8)
tHD_DAT
0
µs
Data Setup Time
tSU_DAT
100
ns
Setup Time for Repeated
START Condition (7) (8)
tSU_STA
0.6
µs
Hold Time for Repeated
START Condition (7) (8)
tHD_STA
0.6
µs
Setup Time for STOP Condition (7) (8)
tSU_STO
0.6
µs
Bus-Free Time Between
STOP and START (7) (8)
tBUF
1.3
µs
Interface Start-up Time (7) (8)
tEN
I2C Timing
(7) (8)
(7) (8)
Bus start-up time after EN pin is pulled high
440
900
kHz
µs
SC668
Electrical Characteristics (continued)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
TOTP
Rising threshold
165
°C
THYS
Hysteresis
30
°C
VUVLO
Increasing VIN
2.4
V
500
mV
Fault Protection
Over-Temperature
Under Voltage Lockout
VUVLO-HYS
Notes:
(1) Capacitors are MLCC of X5R type.
(2) EN is high for more than 10ms.
(3) Subscript for all backlights (BLn), n = 1, 2, 3, 4 , 5, 6, 7, and 8.
(4) Current matching is defined as ± [IBL(MAX) - IBL(MIN)] / [IBL(MAX) + IBL(MIN)].
(5) VDO is defined as the voltage at the BLn pin when current has dropped from the target value by 10%.
(6) Subscript m = 1, 3, and 4 and applies only to LDO1, LDO3, and LDO4. Subscripting for all LDOs (LDOn), n = 1, 2, 3, 4.
(7) The host processor must meet these limits.
(8) Guaranteed by design.
SC668
Typical Characteristics — Backlights
IIN Supply Current (8 LEDs)
Backlight Efficiency (8 LEDs)
100
η = ( ∑PLED1-8)/(VIN × IIN + VA × IA), IOUT = 8 × IBL, VA = VIN, TA = 25°C
1.5
VF = 3.24V
VF = 3.10V
IBL = 25 mA, VF = 3.24V
90 I BL = 25mA
1.4
IBL = 12 mA, VF = 3.10V
VF = 2.97V
80
IBL = 5 mA, VF = 2.97V
IBL = 1 mA, VF = 2.80V
1.3
IIN (mA)
Efficiency (%)
I BL = 12mA
VF = 2.80V
IBL = 5mA
70
I OUT = 8 × IBL, VA = VIN , TA = 25°C
IBL = 0.5 mA, VF = 2.74V
1.2
VF = 2.74V
IBL = 1mA
1.1
60
IBL = 0.5mA
50
4.2
3.9
3.6
VIN (V)
3.3
3.0
2.7
1.0
4.2
3.9
VIN (V)
3.6
3.3
3.0
2.7
Dropout Voltage VDO vs IBL (6 LEDs)
80
VDO = VBLn when IBLn has dropped 10% from the target value
TA=25°C
70
TA=85°C
VDO (mV)
60
50
TA=-40°C
40
30
20
10
0
5
10
15
IBLSetting (mA)
20
25
SC668
Typical Characteristics — Backlights (continued)
Group #1 Blink Function (25mA)
Group #1 Breathe Function (20mA to 0.5mA)
Start time = 32ms, target time = 3072ms
Breathe rate = 24ms, start time = 32ms, target time = 1024ms
— 25mA
— 20mA
0mA
IBL (10mA/div)
IBL (10mA/div)
— 0.5mA
Time (400m������
s�����
/div)
Time (1000m������
s�����
/div)
Bank #1 with ADP (rate = 256µs)
Backlight with ADP (rate = 4ms)
Battery transient condition: 100Hz, 12.5% duty cycle
15mA
IBL (10mA/div)
Battery transient condition: 50Hz, 30% duty cycle
IBL (10mA/div)
11mA
15mA 14
13
12
11
10
15mA
9
8mA
0mA
3.40V
3.32V
VIN (500mV/div)
VIN (500mV/div)
3.05V
2.98V
Time (10m������
s�����
/div)
Time (20m������
s�����
/div)
Backlight Dimming with ALS and Fade
VIN = 3.7V, VLDO4 = 2.8V, ADRISE = B0h, ADFALL = 80h, 4ms fade rate
10mA
IBL (10mA/div)
0mA —
2.8V —
0.5mA
0.5mA
ADC reference
brighter
VADI (1V/div)
0V —
ambient
lighting
dimmer
Time (1000m������
s�����
/div)
SC668
Typical Characteristics — LDOs
Load Regulation (LDO2)
Load Regulation (LDOm)
VIN = 3.7V, TA = 25°C
0
0
VIN = 3.7V, m = 1, 3, or 4, TA = 25°C
1.5V
Output Voltage Variation (mV)
Output Voltage Variation (mV)
1.2V
-5
1.5V
-10
1.8V
-15
-20
-25
0
80
40
ILDO (mA)
120
160
200
-5
1.8V
2.5V
-10
2.8V
-15
3.3V
-20
-25
0
40
Line Regulation (LDO2)
3
Output Voltage Variation (mV)
Output Voltage Variation (mV)
0.75
0.5
0.25
1.2V
0
1.8V
-0.25
-0.5
4.20
100
3.90
3.60
VIN (V)
3.30
3.00
200
2
1
0
3.3V
1.5V
1.8V
2.8V
-1
-3
2.70
4.20
3.90
3.60
VIN (V)
3.30
3.00
2.70
LDO Noise vs. Load Current (2.8V)
VLDO = 1.8V, VIN = 3.7V, 10Hz < f < 100kHz, TA = 25°C
100
VLDO = 2.8V, VIN = 3.7V, 10Hz < f < 100kHz, TA = 25°C
80
Noise (μVRMS )
80
Noise (μVRMS)
160
ILDOm = 1mA, VLDOm = 1.5V to 3.3V, m = (1,3, or 4), TA = 25°C
LDO Noise vs. Load Current (1.8V)
60
40
60
40
20
20
0
120
-2
-0.75
-1
ILDO (mA)
Line Regulation (LDOm)
ILDO2 = 1mA, VLDO2 = 1.2V to 1.8V, TA = 25°C
1
80
0
40
80
IOUT (mA)
120
160
200
0
0
40
80
IOUT (mA)
120
160
200
SC668
Typical Characteristics — LDOs (continued)
PSRR vs. Frequency (1.8V)
VIN = 3.7V, VLDOn = 1.8V, ILDOn = 50mA
0
-10
-10
-20
-20
PSRR (dB)
PSRR (dB)
0
PSRR vs. Frequency (2.8V)
-30
-40
-30
-40
-50
-50
-60
-60
-70
10
100
Frequency (Hz)
1000
10000
VIN = 3.7V, VLDOn = 2.8V, ILDOn = 50mA
-70
10
100
Load Transient Response (1.2V)
1000
10000
Load Transient Response (1.8V)
VIN = 3.7V, VLDO = 1.8V, ILDO = 1mA to 200mA, TA = 25°C
VIN = 3.7V, VLDO = 1.2V, ILDO = 1mA to 200mA, TA = 25°C
VLDO (50mV/div)
VLDO (50mV/div)
200mA
200mA
ILDO (100mA/div)
Frequency (Hz)
0mA
ILDO (100mA/div) 0mA
Time (20�����
s�����
/div)
Time (20�����
s�����
/div)
Load Transient Response (3.3V)
VIN = 3.7V, VLDO = 3.3V, ILDO = 1mA to 200mA, TA = 25°C
VLDO (50mV/div)
200mA
ILDO (100mA/div) 0mA
Time (20�����
s�����
/div)
10
SC668
Pin Descriptions
Pin #
Pin Name
Pin Function
1
LDO1
2
VIN
Battery voltage input
3
GND
Ground pin
4
BL8
Current sink output for backlight LED 8 — leave this pin open or grounded if unused
5
BL7
Current sink output for backlight LED 7 — leave this pin open or grounded if unused
6
BL6
Current sink output for backlight LED 6 — leave this pin open or grounded if unused
7
BL5
Current sink output for backlight LED 5 — leave this pin open or grounded if unused
8
BL4
Current sink output for backlight LED 4 — leave this pin open or grounded if unused
9
BL3
Current sink output for backlight LED 3 — leave this pin open or grounded if unused
10
BL2
Current sink output for backlight LED 2 — leave this pin open or grounded if unused
11
BL1
Current sink output for backlight LED 1 — leave this pin open or grounded if unused
12
ADI
ADC input — connect this pin to ground if unused
13
SCL
I2C clock input — I2C buss pull-up resistor is required.
14
SDA
I2C data — bi-directional line used for read and write operations for all internal registers (refer to
Register Map and I2C Interface sections) — I2C buss pull-up resistor is required.
15
PWM
Backlight PWM control signal input
16
EN
Chip enable — active high
17
BYP
Bypass pin for LDO reference — connect a 22nF ceramic capacitor to GND
18
LDO4
LDO4 output
19
LDO3
LDO3 output
20
LDO2
LDO2 output
T
THERMAL PAD
LDO1 output
Thermal pad for heatsinking purposes — connect to ground plane using multiple vias — not connected internally
11
SC668
Block Diagram
VIN
IN
2
4
BL8
GND
3
5
BL7
PWM
15
6
BL6
7
BL5
8
BL4
9
BL3
10
BL2
11
BL1
17
BYP
1
LDO1
20
LDO2
19
LDO3
18
LDO4
Digital
LP Filter
Current sink
control block
EN
16
VIN
VLDO_REF
VIN
Register
Space
SDA
SCL
14
2
IC
Interface
13
Reg (00h)
to
Reg (16h)
ADRISE
ADFALL
ADOUT
VLDO4
ADI
12
ADC
Digital
Interface
LDO1
Logical
Control
VIN
LDO
DAC
LDO2
Backlight
DAC
VIN
LDO3
VIN
LDO4
12
SC668
Applications Information
General Description
The SC668 is optimized for handheld applications supplied from a single cell Li-Ion and includes the following
key features:
•
•
•
•
•
Eight matched current sinks — BL1, BL2, BL3,
BL4, BL5, BL6, BL7, and BL8 regulate LED backlighting current, with 0mA to 25mA per LED.
Four adjustable LDOs — LDO1, LDO3, and LDO4
are adjustable with 15 settings from 1.5V to 3.3V.
LDO2 is adjustable with 7 settings from 1.2V to
1.8V.
ALS with a sigma-delta ADC that can also be used
for general purpose ADC functions.
PWM with an internal digital low-pass filter
I2C Bus fast mode and standard mode
LED Backlight Current Settings
The backlight current is set via the I2C interface. The current
is regulated to one of 32 values between 0mA and 25mA.
The step size varies depending upon the current setting.
The first three steps are 50µA, 100µA, and 200µA. Between
0.5mA and 5mA, the step size is 0.5mA. The step size
increases to 1mA for settings between 5mA and 21mA.
Steps are 2mA between 21mA and 25mA. The variation in
step size allows finer adjustment for dimming functions in
the low current range and coarse adjustment at higher
current settings where larger changes are not visible. The
settings are psuedo-logarithmic. A zero setting also disables
the current sink, providing an alternative to the enable bit.
LED Backlight Current Sinks
Backlight current is independent of forward voltage mismatch (∆VF) between LEDs. When two or more backlight
sinks are set to the same target current, their currents will
match, even if the LED voltages are different. The backlight
current sinks are designed with a low dropout voltage (typically 59mV for a bank of 6 LEDs at 20mA) to optimize run-time
when the LED anode voltage is provided by a battery.
LED Anode Supply
In the typical application circuit, the battery voltage supplies the LEDs. An alternative to this configuration is to
connect the LED anodes to a second DC supply as shown
in Figure 1. Such a connection is especially useful when
an alternate voltage that is slightly higher than the
forward voltage of the LEDs is available. The resulting
efficiency in this scenario would be optimal. To achieve
best accuracy, the current sink amplifier requires the
LED sink pin (BLn) to be within the operational range of
VDO ≤ VBLn ≤ 4.2V. When the sink is off, VBLn may float as
high as 5.5V.
VIN
IN
SC668
BL1
BL2
CIN
BL3
BL4
BL5
BL6
BL7
GND
BL8
VBL1
VA
VBL2
VBL3
VBL4
VBL5
VBL6
VBL7
VBL8
Figure 1 — Anode Supply
Unused Backlight Current Sinks
The backlight LEDs default to the off state upon powerup. For backlight applications using fewer than 8 LEDs,
any unused output must be left open or grounded and
the unused LED must remain disabled. When writing to
the backlight enable register, a zero (0) must be written
to the corresponding enable bit of any unused output.
Backlight Quiescent Current
The quiescent current required to operate the backlights
is reduced when backlight current is less than 8.0mA. This
feature results in higher efficiency under light-load conditions. Further quiescent current reduction will result
from using fewer LEDs.
Backlight Configuration into Banks
The eight LED backlight drivers can be assigned to a single
bank or divided among up to four independent banks —
refer to the Register Map section for more details. The
independent banks can each be configured with different
settings for backlight current and fade operation.
Bank Configuration into Groups
The four backlight banks can be assigned to two groups
(group #1 and group #2). Each group provides independent settings for the fade and breathe effect rate options.
Each group also provides independent settings for target
time and start time, which are used to customize the
13
SC668
Applications Information (continued)
blink and breathe lighting effects. Details of the fade,
breathe, and blink effects are introduced later in this
Applications Information section.
Target Backlight Settings for Lighting Effects
The target backlight setting is the current which will result
at the end of a blink or breathe lighting effect cycle. The
Register Map contains four control registers which set the
target backlight currents for each bank. Registers 06h,
07h, 08h, and 09h contain the target current values for:
bank #1, bank #2, bank #3, and bank #4, respectively.
Bank #1 also uses the target value of register 06h in association with the ALS function. Bank #1 can be set to
automatically change to the target value of register 06h
when the ADC exceeds a programmable rising threshold.
ALS is defined in more detail under Ambient Light Sense,
and in the Register Map section under ADC Function
Register 12h.
Breathe Lighting Effect
The breathe lighting effect may be applied independently
to each group. When this feature is enabled, the bank’s
backlight current will increase and decrease periodically
at a rate that mimics calm and smooth breathing. Once
initialized via the I2C interface, this function will run continuously, independent of the host processor, saving
instruction cycles and simplifying timing requirements.
Three timing parameters must be set to define the
breathe effect timing: effect rate, start time, and target
time. Group #1 and group #2 have independent timing
parameters to support a variety of options. When a bank
is assigned to a group, it adopts the timing parameters of
the respective group.
When enabled, the breathe function causes the backlights to change brightness by stepping the current
incrementally, using the effect rate parameter, until the
final backlight current is reached. The current will remain
at the target value for a time set by the target time parameter. When the target time has ended, the brightness will
again change, this time in reverse order, stepping the
current incrementally, using the effect rate parameter,
until the current returns to the start value. The current
will remain at the start value for the time set by the start
time parameter. When the start time has ended, the
breathe cycle begins again.
The breathe effect rate is programmable for group #1 and
group #2 and can be independently set to 4, 8, 16, 24, 32,
48, or 64ms for each group. Also, the start time and target
time parameters for group #1 and group #2 can be independently set to 32, 64, 256, 512, 1024, 2048, 3072, or
4096ms.
In addition to the group’s timing parameters, start current
and target current values and BxBEN (blink/breathe enable)
and BxFEN (fade enable) bits are set for each bank to define
that bank’s min and max current during a breathe cycle
and enable the breathe function.
The five parameters that define the breathe effect are:
1. Effect rate — write value to register 0Fh
2. Start current — write value to register 02h, 03h, 04h,
or 05h (bank dependent)
3. Target current — write value to registers 06, 07h, 08h,
or 09h (bank dependent)
4. Start time — write value to register 10h or 11h (group
dependent)
5. Target time — write to register 10h or 11h (group
dependent
Figure 3 illustrates the breathe effect with respect to time.
For an example of the breathe effect, with bank #1
assigned to group #1, the terms used in the illustration
are as follows:
•
•
•
•
•
IBL_START = contents of register 02h (B1FEN must
equal 1)
IBL_TARGET = contents of register 06h (B1BEN must
equal 1)
tSTART = contents of bits ST1_[2:0] in register 10h
tTARGET = contents of bits TT1_[2:0] in register 10h
tBREATHE = breathe time. Equal to the breathe rate
times the number of steps between IBL_START and
IBL_TARGET. Breathe time is set with the bits ER1_
[2:0] in register 0Fh.
Blink Lighting Effect
The blink lighting effect provides an automatic LED blinking function that can be applied to a single LED driver or
14
SC668
Applications Information (continued)
an LED driver bank without any host processor interaction.
Blinking can be initialized via the I2C interface at power up
and the settings maintained in the SC668 registers with
no need for additional software interaction.
Two timing parameters must be set to define the blink
effect timing: start time and target time. Start and target
times can be independently set to 32, 64, 256, 512, 1024,
2048, 3072, 4096ms. The total blink cycle time is equal to
the sum of the start and target times.
In addition to timing parameters, start current and target
current values are used to set the bank’s min and max current,
and a combination of bits BxBEN (blink/breathe enable) and
BxFEN (fade enable) are used to enable the blink function.
The four parameters are:
1. Start current — write value to register 02h, 03h, 04h,
or 05h (bank dependent)
2. Target current — write value to register 06, 07h, 08h,
or 09h (bank dependent)
3. Start time — write value to register 10h or 11h (group
dependent)
4. Target time — write to register 10h or 11h (group
dependent)
Figure 4 illustrates the blink effect with respect to time.
For an example of the blink effect, with bank #2 assigned
to group #2, the terms used in the illustration are as
follows:
•
•
•
•
IBL_START = contents of register 03h (B2FEN must
equal 0)
IBL_TARGET = contents of register 07h (B2BEN must
equal 1)
tSTART = contents of bits ST2_[2:0] in register 11h
tTARGET = contents of bits TT2_[2:0] in register 11h
Backlight Fade-In and Fade-Out Lighting Effects
When enabled, the fade function causes the backlights to
change brightness by stepping the current incrementally
until the final backlight current is reached. The backlight
fade-in and fade-out may be applied to selected banks.
When enabled, the bank current will gradually increase
during fade-in and gradually decrease during fade-out.
The rate of increase or decrease is programmable for
group #1 and group #2 and can be independently set to
1, 2, 4, 6, 8, 12, or 16ms for each group. The fade function
causes the bank to begin stepping from its current state
to the next programmed state as soon as the new state
is stored in its register. For example, if the bank is set to
25mA, fade is enabled, and the bank is changed to 0mA,
the bank will step from 25mA down to 0mA using all settings between 25mA and 0mA.
In addition to the 32 programmable backlight current
values, there are also 75 non-programmable current steps.
The non-programmable steps are active only during a fade
or breathe operation to provide for a very smooth change
in backlight brightness. Backlight current steps proceed at
a programmable fade rate of 1, 2, 4, 6, 8, 12, or 16ms. The
exact length of time used to fade between any two backlight values is determined by multiplying the fade rate by
the number of steps between the old and new backlight
values. The fade time can be calculated from the data provided in Table 1 on page 19.
Two parameters must be programmed to enable the fade
effects: effect rate and start current. The fade function will
begin when a new start current is set along with the FEN
bit in the associated register.
The fade effect rate parameter must be set to define the
fade timing. Group #1 and group #2 have independent
sets of timing parameters to support a variety of fade
timing options. When a bank is assigned to a group, it
adopts the timing parameters of the respective group.
Registers associated with fade are described below:
1. Effect Rate — write a value to register 0Fh (group
dependent)
2. Start Current — write value to register 02h, 03h, 04h,
or 05h (bank dependent)
Figure 5 illustrates the fade-in and fade-out effects with
respect to time. For an example of the fade effects assigned
to bank 3 with effect rate 2, the terms in the illustration are
as follows:
•
IBL_INITIAL = contents of register 04h (B3FEN must
equal 1)
15
SC668
Applications Information (continued)
•
•
•
IBL_FINAL = new value written to register 04h (register
07h bit B3BEN must equal 0), however, the “Target”
value of register 07h has no effect on fade.
tFADE_IN = contents of bits ER2_[2:0] in register 0Fh
tFADE_OUT = tFADE_IN
Auto-Dim Lighting Effect
Two auto-dim settings are provided — auto-dim full and
auto-dim partial. These settings provide automatic
dimming of bank #1. The auto-dim delay times are set using
the group #1 target and start time register (10h). Delay
times are 8 times the group #1 target and start times.
Auto-dim full provides a time-out and dimming function
followed by a time-out and turn-off function. Auto-dim
full begins when the bank is enabled (or re-enabled), the
bank will first go to the target current and wait for a count
of 8 times the group #1 target time. The bank will then
dim to the “start” current and wait for a count of 8 times
the group #1 start time. The bank will then turn off.
occur immediately. When changing brightness without
effects, registers 02h through 05h are used for this function. The target values of registers 06h through 09h are
not involved.
Figure 8 illustrates the brightness change with respect to
time. An example of brightness change to bank #4 with
no lighting effect, is as follows:
•
•
IBL_INITIAL = previous value written to register 05h
IBL_FINAL = new value written to register 05h
The register 05h bit B4FEN must equal 0, and register 09h
bit B4BEN must equal 0, however, the “Target” value of
register 09h has no effect on the final current.
Fade State Diagram
The state diagram in Figure 2 describes the fade operation. If the backlight enable bits are disabled during an
Immediate
change to new
bright level
No change
Auto dim partial provides the time-out and dimming function, but does not turn off backlights. Auto-dim partial
begins when the bank is enabled (or re-enabled), the bank
will first go to the target current and wait for a count of 8
times the group #1 target time. The bank will then dim to
the “start” current. The bank will not turn off automatically.
Auto-dim is available only for group #1. After selecting an
auto-dim option, the bank’s blink effect must be enabled to
enable auto-dim. The bank must then be enabled or reenabled to begin the auto-dim. Auto-dim partial is illustrated
in Figure 6, and auto-dim full is illustrated in Figure 7.
Brightness Change without Effects
There are two ways to change brightness while using no
lighting effect. One way is to set the effect rate option to
the zero value “snap to target” (a function of register 0Fh).
This method will block all lighting effects on all banks
within a group. Another way to change brightness, with
no lighting effect, is to set the BxFEN and BxBEN both
equal to zero. This second method will block all lighting
effects on a single bank, and with no influence over other
banks within the group.
Writing a new value to the backlight current register, while
effects are disabled, will cause the change in brightness to
Write
BxFEN=0
BxFEN=0
Write new
bright level
Write
BxFEN=1
Immediate
change to
new bright
level
Write
BxFEN=0
No change
BxFEN=1
Write
BxFEN=0
or
Write {0,0,0}
to effect rate
bits register
0Fh
No
change
Write
BxFEN=1
Write
BxFEN=1
Write new
bright
level
Fade
ends
Fade begins
at 0mA
Fade
begins
Fade
processing
Fade is
redirected toward
the new value
from current
state
Write new
bright level
Continue
fade using
new rate
Write
new fade
rate
Write
BLxEN = 1
Backlights
disabled
Bank
turns off
immediately
Write entire
bank’s enable bits
BLxEN = 0
Figure 2 — State Diagram for Fade Function
16
SC668
Applications Information (continued)
tTARGET
tTARGET
tBREATE
IBL_TARGET
IBL_START
tSTART
0mA
t1
t2
Figure 3 — Breathe Timing Diagram
tTARGET
IBL_TARGET
IBL_START
tSTART
t1
0mA
t2
Figure 4 — Blink Timing Diagram
tFADE_IN
IBL_FINAL
IBL_INITIAL
0mA
tFADE_OUT
IBL_INITIAL
IBL_FINAL
t1
t2
Figure 5 — Fade-in and Fade-out Timing Diagram
tTARGET
Bank
enabled/
re-enabled
IBL_TARGET
Bank does not turn off automatically
IBL_START
0mA
Figure 6 — Auto-Dim Partial Timing Diagram
tTARGET
Bank
enabled/
re-enabled
IBL_TARGET
IBL_START
0mA
IBL_INITIAL
0mA
IBL_FINAL
tSTART
Figure 7 — Auto-Dim Full Timing Diagram
IBL_INITIAL
Note: See next
page for figure
notes.
IBL_FINAL
Figure 8 — Brightness Increase and Decrease Without Fade Timing Diagram
17
SC668
Applications Information (continued)
Notes for figures on previous page
t1 = start of cycle
t2 = end of cycle
tSTART = The time that the bank’s current remains at the start value.
tTARGET = The time that the bank’s current remains at the target value.
tBREATHE = The time that the bank’s current will continue to increase or
decrease during a breathe cycle. Breathe time is determined by multiplying the breathe rate by the number of steps (from Table1). Breathe
rate is a group dependent value of the effect rate register 0Fh.
tFADE_IN = The fade time of increasing bank current, determined by
multiplying the fade rate by the number of steps (from Table 1). Fade
rate is a group dependent value of the effect rate register 0Fh.
tFADE_OUT = The fade time of decreasing bank current, determined by
multiplying the fade rate by the number of steps (from Table 1). Fade
rate is a group dependent value of the effect rate register 0Fh. tFADE_IN
is always equal to tFADE_OUT.
IBL_START = The bank current at the start of the cycle. This is the bank
dependent value of register 02h, 03h, 04h, or 05h.
IBL_TARGET = The bank current at the end of the cycle. This is the bank
dependent value of register 06h, 07h, 08h, or 09h.
IBL_INITIAL = The bank dependent value of register 02h, 03h, 04h, or 05h.
IBL_FINAL = The bank dependent value of register 02h, 03h, 04h, or 05h.
NOTE: “START” and “TARGET” subscripts apply only to blink and
breathe effects which require a target value to complete a cycle.
“INITIAL” and “FINAL” subscripts apply when changing a bank’s current
without use of the target registers.
18
SC668
Applications Information (continued)
Starting Value (mA)
Table 1 — Number of Backlight Fade / Breathe Steps between Values (See Note)
25.0 106 105 104 102 96
90
88
84
80
76
72
68
64
60
52
47
42
38
34
30
26
24
22
20
18
16
14
12
10
8
4
0
23.0 102 101 100 98
92
86
84
80
76
72
68
64
60
56
48
43
38
34
30
26
22
20
18
16
14
12
10
8
6
4
0
4
21.0 98
97
96
94
88
82
80
76
72
68
64
60
56
52
44
39
34
30
26
22
18
16
14
12
10
8
6
4
2
0
4
8
20.0 96
95
94
92
86
80
78
74
70
66
62
58
54
50
42
37
32
28
24
20
16
14
12
10
8
6
4
2
0
2
6
10
19.0 94
93
92
90
84
78
76
72
68
64
60
56
52
48
40
35
30
26
22
18
14
12
10
8
6
4
2
0
2
4
8
12
18.0 92
91
90
88
82
76
74
70
66
62
58
54
50
46
38
33
28
24
20
16
12
10
8
6
4
2
0
2
4
6
10
14
17.0 90
89
88
86
80
74
72
68
36 31
26
22
18
14
10
8
6
4
2
0
2
4
6
8
12
16
16.0 88
87
86
84
78
72
70
66
62
58
54
50
46
42
34
29
24
20
16
12
8
6
4
2
0
2
4
6
8
10
14
18
15.0 86
85
84
82
76
70
68
64
60
56
52
48
44
40
32
27
22
18
14
10
6
4
2
0
2
4
6
8
10
12
16
20
14.0 84
83
82
80
74
68
66
62
58
54
50
46
42
38
30
25
20
16
12
8
4
2
0
2
4
6
8
10
12
14
18
22
13.0 82
81
80
78
72
66
64
60
56
52
48
44
40
36
28
23
18
14
10
6
2
0
2
4
6
8
10
12
14
16
20
24
12.0 80
79
78
76
70
64
62
58
54
50
46
42
38
34
26
21
16
12
8
4
0
2
4
6
8
10
12
14
16
18
22
26
11.0 76
75
74
72
66
62
58
54
50
46
42
38
34
30
22
17
12
8
4
0
4
6
8
10
12
14
16
18
20
22
26
30
10.0 72
71
70
68
62
58
54
50
46
42
38
34
30
26
18
13
8
4
0
4
8
10
12
14
16
18
20
22
24
26
30
34
9.0
68
67
66
64
58
54
50
46
42
38
34
30
26
22
14
9
4
0
4
8
12
14
16
18
20
22
24
26
28
30
34
38
8.0
64
63
62
60
54
50
46
42
38
34
30
26
22
18
10
5
0
4
8
12
16
18
20
22
24
26
28
30
32
34
38
42
7.0
59
58
57
55
49
45
41
37
33
29
25
21
17
13
5
0
5
9
13
17
21
23
25
27
29
31
33
35
37
39
43
47
6.0
54
53
52
50
44
40
36
32
28
24
20
16
12
8
0
5
10
14
18
22
26
28
30
32
34
36
38
40
42
44
48
52
5.0
46
45
44
42
36
32
28
24
20
16
12
8
4
0
8
13
18
22
26
30
34
36
38
40
42
44
46
48
50
52
56
60
4.5
42
41
40
38
32
28
24
20
16
12
8
4
0
4
12
17
22
26
30
34
38
40
42
44
46
48
50
52
54
56
60
64
4.0
38
37
36
34
28
24
20
16
12
8
4
0
4
8
16
21
26
30
34
38
42
44
46
48
50
52
54
56
58
60
64
68
3.5
34
33
32
30
24
20
16
12
8
4
0
4
8
12
20
25
30
34
38
42
46
48
50
52
54
56
58
60
62
64
68
72
3.0
30
29
28
26
20
16
12
8
4
0
4
8
12
16
24
29
34
38
42
46
50
52
54
56
58
60
62
64
66
68
72
76
2.5
26
25
24
22
16
12
8
4
0
4
8
12
16
20
28
33
38
42
46
50
54
56
58
60
62
64
66
68
70
72
76
80
2.0
22
21
20
18
12
8
4
0
4
8
12
16
20
24
32
37
42
46
50
54
58
60
62
64
66
68
70
72
74
76
80
84
1.5
18
17
16
14
8
4
0
4
8
12
16
20
24
28
36
41
46
50
54
58
62
64
66
68
70
72
74
76
78
80
84
88
1.0
14
13
12
10
4
0
4
8
12
16
20
24
28
32
40
45
50
54
58
62
64
66
68
70
72
74
76
78
80
82
86
90
0.5
10
9
8
6
0
4
8
12
16
20
24
28
32
36
44
49
54
58
62
66
70
72
74
76
78
80
82
84
86
88
92
96
0.2
4
3
2
0
6
10
14
18
22
26
30
34
38
42
50
55
60
64
68
72
76
78
80
82
84
86
88
90
92
94
98 102
0.1
2
1
0
2
8
12
16
20
24
28
32
36
40
44
52
57
62
66
70
74
78
80
82
84
86
88
90
92
94
96 100 104
0.05
1
0
1
3
9
13
17
21
25
29
33
37
41
45
53
58
63
67
71
75
79
81
83
85
87
89
91
93
95
97 101 105
0.0
0
1
2
4
10
14
18
22
26
30
34
38
42
46
54
59
64
68
72
76
80
82
84
86
88
90
92
94
96
98 102 106
64
60
56
52
48
44
0.0 0.05 0.1 0.2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 23.0 25.0
Ending Value (mA)
NOTE
The fade time is determined by multiplying the number of steps by the fade rate (fade steps × fade rate = fade time).
The breathe time is determined by multiplying the number of steps by the breathe rate (breathe steps × breathe rate = breathe time).
19
SC668
Applications Information (continued)
Non-Programmable Backlight Steps
In addition to the 32 programmable backlight steps, there
are 75 non-programmable steps which are used only
during a fade or breathe operation. Table 1 provides the
total number of steps between the starting and ending
value of any fade or breathe operation. The value from
Table 1 is multiplied by the fade rate to determine the
total fade time. The maximum possible fade-in duration,
from 0mA to 25mA, or fade-out duration, from 25mA to
0mA, is equal to 106 x 16ms = 1696ms.
Figures 10 through 14 provide additional information
about the non-programmable steps. Each figure represents one linear segment of the overall fade range shown
in Figure 15. The overall fade range is a piece-wise linear
approximation of a logarithmic function which provides
for a very smooth visual fading or breathing effect.
The fade rate may be changed dynamically when a fade
operation is active by writing new values to the fade register. When a new backlight level is written during an
ongoing fade operation, the fade will be redirected to the
new value from the present state. An ongoing fade operation may be cancelled by disabling fade, which will result
in the backlight current changing immediately to the final
value. If fade is disabled, the current level will change
immediately to the final value without the fade delay.
PWM Operation on Bank #1
A PWM signal on the PWM pin can be used to adjust the
DC current through the LEDs in bank #1. When the duty
cycle is 100%, the backlight current through each LED (IBL)
equals the full scale current value set for bank #1. The
PWM input samples voltage at the PWM pin and converts
the duty cycle to a DC current level. A DC current is passed
through the LEDs, providing lower noise compared to the
more conventional pulsed current PWM method.
PWM Sampling
The sampling system that translates the PWM signal to a
DC current requires the PWM pin to have a minimum high
time tHIGH_MIN to set the DC level. High time less than tHIGH_MIN
impacts the accuracy of the target IBL. The minimum duty
cycle needed to support the minimum high time specification varies with the applied PWM frequency (see Figure
9). Note that use of a lower PWM frequency, from 200Hz
to 10kHz, will support a lower minimum duty cycle and an
extended backlight dimming range.
5
tHIGH_MIN = 1µs
4
Minimum Duty Cycle (%)
ongoing fade, the bank will turn off immediately. When
the backlight bits are re-enabled and BxFEN = 1, the backlight currents will begin at 0mA and fade to the value
determined by the backlight current register bits IBx[4:0].
If the backlight enable bits are re-enabled and BxFEN = 0,
the main backlights will proceed immediately to the value
of IBx[4:0]. Note that the words “target value” are not used
to describe the final value after a fade operation. “Target
value” is reserved for describing the backlight settings at
the end of the blink or breathe effect cycles.
3
2
1
0
0.2
10
20
30
40
50
PWM Frequency (kHz)
Figure 9 — Minimum Duty Cycle
Ambient Light Sense
The SC668 includes a general purpose sigma-delta ADC
that is designed to interface with an ambient light sensor.
The ADC input accepts the output of an external ambient
light sensor circuit. When the ADC is enabled via the I2C
bus, the analog signal produced by the ambient light
sensor is compared with two user programmable threshold levels. The result of the comparison is then used to
automatically change the brightness of the LEDs in bank
#1 to a user defined value. This function is used to compensate for ambient lighting conditions — increasing
brightness where brighter ambient conditions exist and
decreasing brightness in lower lighting conditions.
20
SC668
Applications Information (continued)
NOTES:
· = Programmable backlight steps, о = Non-programmable fade/breathe steps
0.5
12
0.4
11
IBL (mA)
IBL (mA)
0.3
10
0.2
9
0.1
0.0
0
2
4
Step Count
6
8
8
10
Figure 10 — Backlight Steps (0.0mA to 0.5mA)
64
68
72
Step Count
76
80
Figure 13 — Backlight Steps (8.0mA to 12.0mA)
6.0
27
5.0
24
IBL (mA)
IBL (mA)
4.0
3.0
21
18
2.0
15
1.0
0.0
10
20
30
40
Step Count
50
60
12
80
Figure 11 — Backlight Steps (0.5mA to 6.0mA)
85
90
95
Step Count
100
105
110
Figure 14 — Backlight Steps (12.0mA to 25.0mA)
25
8.0
20
7.5
IBL (mA)
IBL (mA)
15
7.0
10
6.5
5
6.0
54
56
58
60
Step Count
62
Figure 12 — Backlight Steps (6.0mA to 8.0mA)
64
0
0
20
40
60
Step Count
80
100
120
Figure 15 — Backlight Steps (0.0mA to 25.0mA)
21
SC668
Applications Information (continued)
General Purpose ADC
The ADI pin may also be used for general purpose ADC
functions. For example, a linear temperature sensor may
be added to the application circuit, and the SC668 may
provide temperature data or an over-temperature warning
flag. In this case, registers 13h, 14h, and 15h can be used
to store the ADC reading and set thresholds that will
trigger and interrupt output if the reading does not remain
between them.
Programmable LDO Outputs
Four LDO (low dropout) regulators are included to supply
power to peripheral circuits. Each LDO output voltage
setting has ±3.5% accuracy over the line, load, and operating temperature ranges. Output current greater than
specification is possible at somewhat reduced accuracy
(refer to the typical characteristic section of this datasheet
for load regulation examples). LDO1, LDO3, and LDO4
have identical specifications, with a programmable output
ranging from 1.5V to 3.3V. LDO2 is specified to operate
with programmable output ranging from 1.2V to 1.8V. All
of the LDOs are low noise and can be used with noise sensitive circuits.
LDO4 is internally connected to the ADC (Analog to Digital
Converter) to provide the reference voltage for the ADC.
LDO4 must be enabled for the ADC to function. When the
ALS function is used, LDO4 may also be used to provide
power to the external ALS circuit.
Protection Features
The SC668 provides OT (Over-temperature) protection
and LDO current limiting to safeguard the device from
catastrophic failures.
Over-Temperature Protection
The OT protection circuit prevents the device from overheating and experiencing a catastrophic failure. When the
junction temperature exceeds 165­°C, the device goes into
thermal shutdown with all outputs disabled until the junction temperature is reduced. All register information is
retained during thermal shutdown. Hysteresis of 30­­°C is
provided to ensure that the device cools sufficiently before
re-enabling.
LDO Current Limit
The device limits current at each LDO output pin. The
typical limit is 400mA, with a minimum limit rating of
200mA. The LDOs may be used for up to 200mA without
tripping the current limit.
Thermal Management
A junction temperature calculation should be performed
for each new application design to ensure the device will
not exceed 125°C during normal operation. The first step
is to determine how much power can be dissipated by the
SC668 in the application. The following formula approximates the maximum dissipation. This formula can be used
to sum the maximum internal power dissipation required
of each LDO and each backlight sink.
Shutdown Mode
The device is disabled when the EN pin is held low for the
shutdown time specified in the electrical characteristics
section. All registers are reset to default conditions at shutdown. Typical current consumption in this mode is 0.1µA.
Sleep Mode
Sleep mode is activated when all backlights are off. This is
a reduced current mode that helps minimize overall
current consumption. In sleep mode, the I2C interface
continues to monitor its input for commands from the
host processor. All registers retain their settings in sleep
mode. Typical current consumption in this mode is 90µA.
PD
4
7
n 1
m 1
¦ ( VIN VLDOn ) u ILDOn ¦ VBLm u IBLm
The resulting power dissipation can then be used in the
calculation for maximum junction temperature.
TJ
TA 4JA u PD
where,
TA = Maximum ambient temperature rating in °C.
QJA= Thermal resistance, from junction to ambient, equal
to 35°C/W for a optimum circuit board layout.
22
SC668
Applications Information (continued)
PCB Layout Considerations
The layout diagram in Figure 16 illustrates a two-layer
PCB layout for the SC668 and supporting components.
Following fundamental layout rules is
critical for achieving the performance specified in the
Electrical Characteristics table. The following guidelines
are recommended when developing a PCB layout:
Figure 17 — Layer 1
Ground
Plane
CLDO2
CLDO3
CLDO4
CBYP
LDO1
VIN
EN
BYP
PWM
GND
SDA
VIN
SC668
GND
SCL
BL7
BL1
BL2
ADI
BL3
BL8
BL4
CIN
GND
LDO4
CLDO1
LDO3
•
BL5
•
LDO2
•
•
Figure 17 shows the component copper layer.
Make all ground connections to a solid ground
plane as shown in Figure 18.
All LDO output traces should be made as wide
as possible to minimize resistive losses.
Place all bypass and decoupling capacitors —
CIN, CLDO1, CLDO2, CLDO3, CLDO4, and CBYP as close to
the device as possible.
Ensure that all connections to pins IN and OUT
make use of wide traces so that the resistive
drop on each connection is minimized.
The thermal pad should be connected to the
ground plane using multiple vias to ensure
proper thermal connection for optimal heat
transfer.
The following capacitors — CLDO1, CLDO2, CLDO3,
CLDO4, and CBYP should be grounded together.
Connect these capacitors to the ground plane at
one point near the SC668 as shown in Figure 16.
BL6
•
•
Figure 16 — Recommended PCB Layout
Figure 18 — Layer 2
23
SC668
Serial Interface
The I2C General Specification
The SC668 is a read-write slave-mode I C device and complies with the Philips I2C standard Version 2.1, dated
January 2000. The SC668 has twenty-three user-accessible
internal 8-bit registers. The I2C interface has been designed
for program flexibility, supporting direct format for write
operation. Read operations are supported on both combined format and stop separated format. While there is no
auto increment/decrement capability in the SC668 I2C
logic, a tight software loop can be designed to randomly
access the next register independent of which register
you begin accessing. The start and stop commands frame
the data-packet and the repeat start condition is allowed
if necessary.
2
SC668 Limitations to the I2C Specifications
The SC668 only recognizes seven bit addressing. This
means that ten bit addressing and CBUS communication
are not compatible. The device can operate in either standard mode (100kbit/s) or fast mode (400kbit/s).
Slave Address Assignment
The seven bit slave address is 1110 000x. The eighth bit is
the data direction bit. E0h is used for a write operation,
and E1h is used for a read operation.
Supported Formats
The supported formats are described in the following
subsections.
Direct Format — Write
The simplest format for an I2C write is direct format. After
the start condition [S], the slave address is sent, followed
by an eighth bit indicating a write. The SC668 I2C then
acknowledges that it is being addressed, and the master
responds with an 8 bit data byte consisting of the register
address. The slave acknowledges and the master sends
the appropriate 8 bit data byte. Once again, the slave
acknowledges and the master terminates the transfer with
the stop condition [P].
Combined Format — Read
After the start condition [S], the slave address is sent, followed by an eighth bit indicating a write. The SC668 I2C
then acknowledges that it is being addressed, and the
master responds with an 8 bit data byte consisting of the
register address. The slave acknowledges and the master
sends the repeated start condition [Sr]. Once again, the
slave address is sent, followed by an eighth bit indicating
a read. The slave responds with an acknowledge and the
8 bit data from the previously addressed register; the
master then sends a non-acknowledge (NACK). Finally, the
master terminates the transfer with the stop condition [P].
Stop Separated Reads
Stop-separated reads can also be used. This format allows
a master to set up the register address pointer for a read
and return to that slave at a later time to read the data. In
this format the slave address followed by a write command
are sent after a start [S] condition. The SC668 then
acknowledges it is being addressed, and the master
responds with the 8-bit register address. The master sends
a stop or restart condition and may then address another
slave. After performing other tasks, the master can send a
start or restart condition to the SC668 with a read
command. The device acknowledges this request and
returns the data from the register location that had previously been set up.
24
SC668
Serial Interface (continued)
I2C Direct Format Write
S
Slave Address
W
A
Register Address
S – Start Condition
W – Write = ‘0’
A – Acknowledge (sent by slave)
P – Stop condition
A
Data
A
P
Slave Address – 7-bit
Register address – 8-bit
Data – 8-bit
I2C Stop Separated Format Read
Master Addresses
other Slaves
Register Address Setup Access
S Slave Address W A Register Address A P S
S – Start Condition
W – Write = ‘0’
R – Read = ‘1’
A – Acknowledge (sent by slave)
NAK – Non-Acknowledge (sent by master)
Sr – Repeated Start condition
P – Stop condition
Slave Address B
Register Read Access
S/Sr
Slave Address
R A
Data
NACK P
Data
NACK P
Slave Address – 7-bit
Register address – 8-bit
Data – 8-bit
I2C Combined Format Read
S
Slave Address
W A
Register Address
S – Start Condition
W – Write = ‘0’
R – Read = ‘1’
A – Acknowledge (sent by slave)
NAK – Non-Acknowledge (sent by master)
Sr – Repeated Start condition
P – Stop condition
A Sr
Slave Address
R
A
Slave Address – 7-bit
Register address – 8-bit
Data – 8-bit
25
SC668
Register Map(1)
Register
Address
D7
D6
D5
D4
D3
D2
D1
00h
0(2)
0(2)
BL6EN
BL5EN
BL4EN
BL3EN
BL2EN
01h
0(2)
0(2)
DIS
EN
02h
0(2)
0(2)
B1FEN
IB1_4
IB1_3
IB1_2
IB1_1
IB1_0
Fade enable and bank #1 backlight current(4)
03h
0(2)
0(2)
B2FEN
IB2_4
IB2_3
IB2_2
IB2_1
IB2_0
Fade enable and bank #2 backlight current(4)
04h
0(2)
0(2)
B3FEN
IB3_4
IB3_3
IB3_2
IB3_1
IB3_0
Fade enable and bank #3 backlight current(4)
05h
0(2)
0(2)
B4FEN
IB4_4
IB4_3
IB4_2
IB4_1
IB4_0
Fade enable and bank #4 backlight current(4)
06h
0(2)
0(2)
B1BEN
IBT1_4
IBT1_3
IBT1_2
IBT1_1
IBT1_0 Blink/breathe bank #1 target backlight settings
07h
0(2)
0(2)
B2BEN
IBT2_4
IBT2_3
IBT2_2
IBT2_1
IBT2_0 Blink/breathe bank #2 target backlight settings
08h
0(2)
0(2)
B3BEN
IBT3_4
IBT3_3
IBT3_2
IBT3_1
IBT3_0 Blink/breathe bank #3 target backlight settings
09h
0(2)
0(2)
B4BEN
IBT4_4
IBT4_3
IBT4_2
IBT4_1
IBT4_0 Blink/breathe bank #4 target backlight settings
0Ah
0(2)
0(2)
0(2)
0(2)
LDO1V3
LDO1V2
LDO1V1
LDO1V0 LDO 1 voltage settings
0Bh
0(2)
0(2)
0(2)
0(2)
0(2)
LDO2V2
LDO2V1
LDO2V0 LDO 2 voltage settings
0Ch
0(2)
0(2)
0(2)
0(2)
LDO3V3
LDO3V2
LDO3V1
LDO3V0 LDO 3 voltage settings
0Dh
0(2)
0(2)
0(2)
0(2)
LDO4V3
LDO4V2
LDO4V1
LDO4V0 LDO 4 voltage settings
0Eh
0(2)
0(2)
0(2)
GRP1
GRP0
BANK2
BANK1
BANK0 Lighting effects assignments, banks & groups
0Fh
0(2)
0(2)
ER2_2
ER2_1
ER2_0
ER1_2
ER1_1
ER1_0
Effect rates for group #1 and group #2
10h
0(2)
0(2)
TT1_2
TT1_1
TT1_0
ST1_2
ST1_1
ST1_0
Target time and start time for group #1
11h
0(2)
0(2)
TT2_2
TT2_1
TT2_0
ST2_2
ST2_1
ST2_0
Target time and start time for group #2
AD_CMP AD_INT AD_SATEN AD_OF
AD_UF
CLR_INT AD_AUTO AD_EN ALS function
12h
D0
Description
BL1EN Backlight enable for BL1 — BL6
X(3) /
X(3) /
BL8EN / BL7EN / Bank enable, plus backlight enable for
BANK4EN BANK3EN BANK2EN BANK1EN BL7 — BL8
13h
AD_O7
AD_O6
AD_O5
AD_O4
AD_O3
AD_O2
AD_O1
AD_O0 ADC output ADOUT
14h
AD_R7
AD_R6
AD_R5
AD_R4
AD_R3
AD_R2
AD_R1
AD_R0 ADC rising threshold ADRISE
15h
AD_F7
AD_F6
AD_F5
AD_F4
AD_F3
AD_F2
AD_F1
AD_F0 ADC falling threshold ADFALL
16h
0(2)
ADP_ACT ADP_RATE ADP_EN OLE_EN2 OLE_EN1 OLE_EN0 PWM_BYP
Other lighting effects — auto-dim full or partial, auto-dim enable
Notes:
(1) Reset value for all registers = 00h
(2) 0 = always write a 0 to these bits
(3) X = no function — see register 01h description for more details.
(4) Registers 02h, 03h, 04h, and 05h serve as the “start” setting for blink/breathe lighting effects.
26
SC668
Register Map (continued)
Definition of Registers and Bits
Backlight Enable Register (00h)
The bits of register 00h are used to enable individual backlight current sinks BL1 through BL6.
BL6EN through BL1EN [D5:D0]
These bits are used to enable current sinks which control
backlight current. When enabled, the current sinks will
regulate the backlight current set by the corresponding
backlight current register.
Bank Enable Register (01h)
The bits of register 01h are multi-function bits. The function of bits D3 through D0 depend upon the state of bits
D5 and D4. Bits D3 through D0 may be used to turn individual banks on and off. An alternate function of bits D1
and D0 is to enable and disable backlights BL7 and BL8.
Figure 19 shows how the function of bits D3 through D0
change according to the state of the DIS bit D5 and the EN
bit D4.
DIS [Bit D5]
When writing to register 01h, if DIS bit D5 = 1 and EN bit
D4 = 0, then bits D3 through D0 can each disable one of
four banks. When disabling a bank, all associated BLxEN
bits are automatically overwritten with a zero.
EN [Bit D4]
When writing to register 01h, if EN bit D4 = 1 and DIS bit
D5 = 0, then bits D3 through D0 can each enable one of
four banks. When enabling a bank, all associated BLxEN
bits are automatically overwritten with a one.
BANK4EN through BANK1EN [Bits D3:D0]
The following bits — BANK4EN, BANK3EN, BANK2EN, and
BANK1EN are used to enable or disable individual backlight banks dependent upon the state of the DIS and EN
bits, D5 and D4. These bits provide no function when both
DIS and EN are equal to one.
BL8EN and BL7EN [Alternate Function for Bits D1:D0]
These bits are used to enable current sinks which control
backlight current for backlights BL7 and BL8. When
enabled, the current sinks will regulate the backlight
current set by the corresponding backlight current
register.
DIS = 0
EN = 1
D3=1 enables bank #4
D2=1 enables bank #3
D1=1 enables bank #2
D0=1 enables bank #1
DIS = 1
EN = 0
D3=1 disables bank #4
D2=1 disables bank #3
D1=1 disables bank #2
D0=1 disables bank #1
Register 01h
Bits [D3:D0] (1)
(1) Bit functions are
active high only, a
zero has no function
D3=1 does nothing
D2=1 does nothing
D1=1 enables BL8
D0=1 enables BL7
DIS = 0
EN = 0
D3=1 does nothing
D2=1 does nothing
D1=1 does nothing
D0=1 does nothing
DIS = 1
EN = 1
Figure 19 — Multi-function Bits of Register (01h)
27
SC668
Register Map (continued)
Bank #1 Backlight Register (02h)
This register is used to set the current for the backlight
LEDs in bank #1 and to enable the lighting effect feature
for bank #1. These backlights can be turned off using the
backlight enable bits of registers 00h and 01h. Writing the
0mA value into this register will also turn off the backlights, but only if the blink and breathe effects are
disabled.
B1FEN Bit D5
This bit works in conjunction with the B1BEN bit of register
06h to set a lighting effect for bank #1. Figure 20 shows
the lighting effects which are enabled by the combination
of B1FEN and B1BEN. When fade is enabled, fading will
occur in bank #1 each time the bank #1 current is changed,
enabled, or disabled. Blink and breathe functions run in a
continuous loop when they are enabled.
B1BEN = 0
B1FEN = 1
Fade
B1BEN = 1
B1FEN = 0
Blink
Bank #1
No Light Effect
Breathe
B1BEN = 1
B1FEN = 1
Figure 20 — Bank #1 Lighting Effect
B1BEN = 0
B1FEN = 0
IB1_4 through IB1_0 [Bits D4:D0]
These bits are used to set the current for the backlight
LEDs in bank #1. All bank #1 enabled current sinks will sink
the same current as shown in Table 2.
Table 2 — Bank #1 Backlight Current
IB1_4
IB1_3 IB1_2
IB1_1
IB1_0
Backlight
Current (mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
28
SC668
Register Map (continued)
Bank #2 Backlight Register (03h)
This register is used to set the current for the backlight
LEDs in bank #2 and to enable the lighting effect feature
for bank #2. These backlights can be turned off using the
backlight enable bits of registers 00h and 01h. Writing the
0mA value into this register will also turn off the backlights, but only if the blink and breathe effects are
disabled.
B2FEN Bit D5
This bit works in conjunction with the B1BEN bit of register
07h to set a lighting effect for bank #2. Figure 21 shows
the lighting effects which are enabled by the combination
of B2FEN and B2BEN. When fade is enabled, fading will
occur in bank #2 each time the bank #2 current is changed,
enabled, or disabled. Blink and breathe functions run in a
continuous loop when they are enabled.
B2BEN = 0
B2FEN = 1
Fade
B2BEN = 1
B2FEN = 0
Blink
Bank #2
No Light Effect
Breathe
B2BEN = 1
B2FEN = 1
Figure 21 — Bank #2 Lighting Effect
B2BEN = 0
B2FEN = 0
IB2_4 through IB2_0 [Bits D4:D0]
These bits are used to set the current for the backlight
LEDs in bank #2. All bank #2 enabled current sinks will sink
the same current as shown in Table 3.
Table 3 — Bank #2 Backlight Current
IB2_4
IB2_3 IB2_2
IB2_1
IB2_0
Backlight
Current (mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
29
SC668
Register Map (continued)
Bank #3 Backlight Register (04h)
This register is used to set the current for the backlight
LEDs in bank #3 and to enable the lighting effect feature
for bank #3. These backlights can be turned off using the
backlight enable bits of registers 00h and 01h. Writing the
0mA value into this register will also turn off the backlights, but only if the blink and breathe effects are
disabled.
B3FEN Bit D5
This bit works in conjunction with the B1BEN bit of register
08h to set a lighting effect for bank #3. Figure 22 shows
the lighting effects which are enabled by the combination
of B3FEN and B3BEN. When fade is enabled, fading will
occur in bank #3 each time the bank #3 current is changed,
enabled, or disabled. Blink and breathe functions run in a
continuous loop when they are enabled.
B3BEN = 0
B3FEN = 1
Fade
B3BEN = 1
B3FEN = 0
Blink
Bank #3
No Light Effect
Breathe
B3BEN = 1
B3FEN = 1
Figure 22 — Bank #3 Lighting Effect
B3BEN = 0
B3FEN = 0
IB3_4 through IB3_0 [Bits D4:D0]
These bits are used to set the current for the backlight
LEDs in bank #3. All bank #3 enabled current sinks will
sink the same current as shown in Table 4.
Table 4 — Bank #3 Backlight Current
IB3_4
IB3_3 IB3_2
IB3_1
IB3_0
Backlight
Current (mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
30
SC668
Register Map (continued)
Bank #4 Backlight Register (05h)
This register is used to set the current for the backlight
LEDs in bank #4 and to enable the lighting effect feature
for bank #4. These backlights can be turned off using the
backlight enable bits of registers 00h and 01h. Writing the
0mA value into this register will also turn off the backlights, but only if the blink and breathe effects are
disabled.
B4FEN Bit D5
This bit works in conjunction with the B4BEN bit of register
09h to set a lighting effect for bank #4. Figure 23 shows
the lighting effects which are enabled by the combination
of B4FEN and B4BEN. When fade is enabled, fading will
occur in bank #4 each time the bank #4 current is changed,
enabled, or disabled. Blink and breathe functions run in a
continuous loop when they are enabled.
B4BEN = 0
B4FEN = 1
Fade
B4BEN = 1
B4FEN = 0
Blink
Bank #4
No Light Effect
Breathe
B4BEN = 1
B4FEN = 1
Figure 23 — Bank #4 Lighting Effect
B4BEN = 0
B4FEN = 0
IB4_4 through IB4_0 [Bits D4:D0]
These bits are used to set the current for the backlight
LEDs in bank #4. All bank #4 enabled current sinks will sink
the same current as shown in Table 5.
Table 5 — Bank #4 Backlight Current
IB4_4
IB4_3 IB4_2
IB4_1
IB4_0
Backlight
Current (mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
31
SC668
Register Map (continued)
Blink/Breathe Bank #1 Target Register (06h)
This register is used to enable the LED blink and breathe
lighting effects for bank #1 and set the target backlight
current.
B1BEN Bit [D5]
This bit works in conjunction with the B1FEN bit of register
02h to set a lighting effect for bank #1. Figure 24 shows
the lighting effects which are enabled by the combination
of B1FEN and B1BEN.
B1BEN = 0
B1FEN = 1
Fade
B1BEN = 1
B1FEN = 0
Blink
Bank #1
No Light Effect
Breathe
B1BEN = 1
B1FEN = 1
Figure 24 — Bank #1 Lighting Effect
B1BEN = 0
B1FEN = 0
IBT1_4 through IBT1_0 [D4:D0]
When lighting effects are enabled, these bits set the target
backlight current for bank #1. Target values are shown in
Table 6.
Table 6 — Bank #1 Target Backlight Current
IBT1_4 IBT1_3 IBT1_2 IBT1_1 IBT1_0
Bank #1
Target
Current
(mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
32
SC668
Register Map (continued)
Blink/Breathe Bank #2 Target Register (07h)
This register is used to enable the LED blink and breathe
lighting effects for bank #2 and set the target backlight
current.
B2BEN Bit [D5]
This bit, in conjunction with the B2FEN bit, enables blink/
breathe functions for bank #2 as shown in Figure 25.
B2BEN = 0
B2FEN = 1
Fade
B2BEN = 1
B2FEN = 0
Blink
Bank #2
No Light Effect
Breathe
B2BEN = 1
B2FEN = 1
Figure 25 — Bank #2 Lighting Effect
B2BEN = 0
B2FEN = 0
IBT2_4 through IBT2_0 [D4:D0]
When lighting effects are enabled, these bits set the target
backlight current for bank #2. Target values are shown in
Table 7.
Table 7 — Bank #2 Target Backlight Current
IBT2_4 IBT2_3 IBT2_2 IBT2_1 IBT2_0
Bank #2
Target
Current
(mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
33
SC668
Register Map (continued)
Blink/Breathe Bank #3 Target Register (08h)
This register is used to enable the LED blink and breathe
lighting effects for bank #3 and set the target backlight
current.
B3BEN Bit [D5]
This bit, in conjunction with the B3FEN bit, enables blink/
breathe functions for bank #3 as shown in Figure 26.
B3BEN = 0
B3FEN = 1
Fade
B3BEN = 1
B3FEN = 0
Blink
Bank #3
No Light Effect
Breathe
B3BEN = 1
B3FEN = 1
Figure 26 — Bank #3 Lighting Effect
B3BEN = 0
B3FEN = 0
IBT3_4 through IBT3_0 [D4:D0]
When lighting effects are enabled, these bits set the target
backlight current for bank #3. Target values are shown in
Table 8.
Table 8 — Bank #3 Target Backlight Current
IBT3_4 IBT3_3 IBT3_2 IBT3_1 IBT3_0
Bank #3
Target
Current
(mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
34
SC668
Register Map (continued)
Blink/Breathe Bank #4 Target Register (09h)
This register is used to enable the LED blink and breathe
lighting effects for bank #4 and set the target backlight
current.
B4BEN Bit [D5]
This bit, in conjunction with the B4FEN bit, enables blink/
breathe functions for bank #4 as shown in Figure 27.
B4BEN = 0
B4FEN = 1
Fade
B4BEN = 1
B4FEN = 0
Blink
Bank #4
No Light Effect
Breathe
B4BEN = 1
B4FEN = 1
Figure 27 — Bank #4 Lighting Effect
B4BEN = 0
B4FEN = 0
IBT4_4 through IBT4_0 [D4:D0]
When lighting effects are enabled, these bits set the target
backlight current for bank #4. Target values are shown in
Table 9.
Table 9 — Bank #4 Target Backlight Current
IBT4_4 IBT4_3 IBT4_2 IBT4_1 IBT4_0
Bank #4
Target
Current
(mA)
0
0
0
0
0
0
0
0
0
0
1
0.05
0
0
0
1
0
0.1
0
0
0
1
1
0.2
0
0
1
0
0
0.5
0
0
1
0
1
1
0
0
1
1
0
1.5
0
0
1
1
1
2
0
1
0
0
0
2.5
0
1
0
0
1
3
0
1
0
1
0
3.5
0
1
0
1
1
4
0
1
1
0
0
4.5
0
1
1
0
1
5
0
1
1
1
0
6
0
1
1
1
1
7
1
0
0
0
0
8
1
0
0
0
1
9
1
0
0
1
0
10
1
0
0
1
1
11
1
0
1
0
0
12
1
0
1
0
1
13
1
0
1
1
0
14
1
0
1
1
1
15
1
1
0
0
0
16
1
1
0
0
1
17
1
1
0
1
0
18
1
1
0
1
1
19
1
1
1
0
0
20
1
1
1
0
1
21
1
1
1
1
0
23
1
1
1
1
1
25
35
SC668
Register Map (continued)
LDO1 Control Register (0Ah)
LDO2 Control Register (0Bh)
This register is used to enable LDO1 and set its output
voltage level.
This register is used to enable LDO2 and set its output
voltage level.
Bits [D5:D4]
These bits are unused and are always zeroes.
Bits [D5:D3]
These bits are unused and are always zeroes.
LDO1V3 through LDO1V0 [D3:D0]
These bits set the output voltage of LDO1 as shown in
Table 10.
LDO2V2 through LDO2V0 [D2:D0]
These bits are used to set the output voltage of LDO2 in
accordance with Table 11.
Table 10 — LDO1 Control Codes
Table 11 — LDO2 Control Codes
LDO1V3
LDO1V2
LDO1V1
LDO1V0
VLDO1
LDO2V2
LDO2V1
LDO2V0
VLDO2
0
0
0
0
OFF
0
0
0
OFF
0
0
0
1
3.3V
0
0
1
1.8V
0
0
1
0
3.2V
0
1
0
1.7V
0
0
1
1
3.1V
0
1
1
1.6V
0
1
0
0
3.0V
1
0
0
1.5V
0
1
0
1
2.9V
1
0
1
1.4V
0
1
1
0
2.8V
1
1
0
1.3V
0
1
1
1
2.7V
1
1
1
1.2V
1
0
0
0
2.6V
1
0
0
1
2.5V
1
0
1
0
2.4V
1
0
1
1
2.2V
1
1
0
0
1.8V
1
1
0
1
1.7V
1
1
1
0
1.6V
1
1
1
1
1.5V
36
SC668
Register Map (continued)
LDO3 Control Register (0Ch)
LDO4 Control Register (0Dh)
This register is used to enable LDO3 and set its output
voltage level.
This register is used to enable LDO4, set its output voltage
level, and provide power for the internal ADC. The ADC
will not function without first turning on LDO4.
Bits [D5:D4]
These bits are unused and are always zeroes.
LDO3V3 through LDO3V0 [D3:D0]
These bits are used to set the output voltage of LDO3 as
shown in Table 12.
Table 12 — LDO3 Control Codes
The output of LDO4 is used internally to provide the fullscale reference voltage for the ADC. When the ADC is
active, LDO4 also provides a convenient source of power
for devices such as ambient light sensors, and temperature sensors.
Bits [D5:D4]
These bits are unused and are always zeroes.
LDO3V3
LDO3V2
LDO3V1
LDO3V0
VLDO3
0
0
0
0
OFF
0
0
0
1
3.3V
0
0
1
0
3.2V
0
0
1
1
3.1V
0
1
0
0
3.0V
0
1
0
1
2.9V
LDO4V3
LDO4V2
LDO4V1
LDO4V0
VLDO4
0
1
1
0
2.8V
0
0
0
0
OFF
0
1
1
1
2.7V
0
0
0
1
3.3V
1
0
0
0
2.6V
0
0
1
0
3.2V
1
0
0
1
2.5V
0
0
1
1
3.1V
1
0
1
0
2.4V
0
1
0
0
3.0V
1
0
1
1
2.2v
0
1
0
1
2.9V
1
1
0
0
1.8V
0
1
1
0
2.8V
1
1
0
1
1.7V
0
1
1
1
2.7V
1
1
1
0
1.6V
1
0
0
0
2.6V
1
1
1
1
1.5V
1
0
0
1
2.5V
1
0
1
0
2.4V
1
0
1
1
2.2V
1
1
0
0
1.8V
1
1
0
1
1.7V
1
1
1
0
1.6V
1
1
1
1
1.5V
LDO4V3 through LDO4V0 [D3:D0]
These bits are used to set the output voltage of LDO4 as
shown in Table 13.
Table 13 — LDO4 Control Codes
37
SC668
Register Map (continued)
Lighting Effects Assignment Register (0Eh)
Effect Rate Options (0Fh)
This register is used to assign the backlight LEDs to four
banks, bank #1, bank #2, bank #3, and bank #4. This register is also used to assign the banks to two groups, group
#1 and group #2. Group #1 and group #2 are assigned
independently to a lighting effect and an effect rate, as
described in the next section, Effect Rate Options.
This register is used to set the effects rate for the fade and
breathe effects. Different effect rates may be applied to
group #1 and group #2.
GRP1 and GRP0 [D4:D3]
These bits are used to assign banks into two groups of
independent lighting effects and effect rates. The group
assignments are shown in Table 14.
Table 14 — Lighting Effect Assignments
GRP1
GRP0
Bank(s) Assigned
Group #1
Bank(s) Assigned
to Group #2
0
0
#1
#2, #3, and #4
0
1
#1 and #2
#3 and #4
1
0
#1, #2, and #3
#4
1
1
#1,# 2, #3, and #4
no banks assigned
BANK2, BANK1, and BANK0 [D2:D0]
These bits provide bank assignments for all backlight
LEDs. Backlight bank assignments are shown in Table 15.
The table shows the backlight pins assigned to each of the
four banks, as assigned by the data bits BANK2, BANK1,
and BANK0.
Table 16 — Effect Rates for Group #2
ER2_2
ER2_1
ER2_0
Breathe Rate
(ms/step)
Fade Rate
(ms/step)
0
0
0
snap to target
snap to target
0
0
1
4
1
0
1
0
8
2
0
1
1
16
4
1
0
0
24
6
1
0
1
32
8
1
1
0
48
12
1
1
1
64
16
ER1_2, ER1_1, and ER1_0 [D2:D0]
Banks assigned to group #1 will step through settings at
the rate shown in table 17.
Table 17 — Effect Rates for Group #1
ER1_0
Breathe Rate
(ms/step)
Fade Rate
(ms/step)
0
0
0
snap to target
snap to target
0
0
1
4
1
BANK0
ER1_1
BANK1
ER1_2
BANK2
Table 15 — Backlight Bank Assignments
ER2_2, ER2_1, and ER2_0 [D5:D3]
Banks assigned to group #2 will step through settings at
the rate shown in Table 16.
Bank
#4
0
1
0
8
2
0
0
0
-
-
-
BL1 - BL8
0
1
1
16
4
0
0
1
-
-
BL1
BL2 - BL8
1
0
0
24
6
0
1
0
-
-
BL1 - BL2
BL3 - BL8
1
0
1
32
8
0
1
1
-
BL1
BL2
BL3 - BL8
1
1
0
48
12
1
0
0
-
-
BL1 - BL3
BL4 - BL8
1
1
1
64
16
1
0
1
BL1
BL2
BL3
BL4 - BL8
1
1
0
BL1
BL2
BL3 - BL4
BL5 - BL8
1
1
1
BL1
BL2
BL3 - BL5
BL6 - BL8
Bank
#3
Bank
#2
Bank
#1
38
SC668
Register Map (continued)
Group #1 Target and Start Times Register (10h)
Group #2 Target and Start Times Register (11h)
This register is used to set the duration that the backlights
will stay at the start value and at the target value. This
feature provides additional customization of the breathe
and blink lighting effects. Register 10h will only effect
banks that are assigned to group #1.
This register is used to set the duration that the backlights
will stay at the start value and at the target value. This
feature provides additional customization of the breathe
and blink lighting effects. Register 11h will only effect
banks that are assigned to group #2.
TT1_2, TT1_1, and TT1_0 [D5:D3]
These bits set the duration that backlights will stay at the
target value. These bits effect only banks assigned to
group #1. Target times are given in Table 18.
TT2_2, TT2_1, and TT2_0 [D5:D3]
These bits set the duration that backlights will stay at the
target value. These bits effect only banks assigned to
group #2. Target times are given in Table 20.
Table 18 — Target Time (Group #1)
Table 20 — Target Time (Group #2)
TT1_2
TT1_1
TT1_0
Target Time (ms/step)
TT2_2
TT2_1
TT2_0
Target Time (ms/step)
0
0
0
32
0
0
0
32
0
0
1
64
0
0
1
64
0
1
0
256
0
1
0
256
0
1
1
512
0
1
1
512
1
0
0
1024
1
0
0
1024
1
0
1
2048
1
0
1
2048
1
1
0
3072
1
1
0
3072
1
1
1
4096
1
1
1
4096
ST1_2, ST1_1, and ST1_0 [D2:D0]
These bits set the duration of time that backlights will stay
at the starting value. These bits effect only banks assigned
to group #1. Start times are given in Table 19.
ST2_2, ST2_1, and ST2_0 [D2:D0]
These bits set the duration that backlights will stay at the
starting value. These bits effect only banks assigned to
group #2. Start times are given in Table 21.
Table 19 — Start Time (Group #1)
Table 21 — Start Time (Group #2)
ST1_2
ST1_1
ST1_0
Start Time (ms/step)
ST2_2
ST2_1
ST2_0
Start Time (ms/step)
0
0
0
32
0
0
0
32
0
0
1
64
0
0
1
64
0
1
0
256
0
1
0
256
0
1
1
512
0
1
1
512
1
0
0
1024
1
0
0
1024
1
0
1
2048
1
0
1
2048
1
1
0
3072
1
1
0
3072
1
1
1
4096
1
1
1
4096
39
SC668
Register Map (continued)
ADC Function Register (12h)
This register is used to enable the functions of the ADC
and store related status bits. The ADC converts the analog
output voltage signal of an ALS (Ambient Light Sense)
circuit and stores the digital conversion in the ADC output
ADOUT (register 13h). The data may be used to automatically adjust the brightness of bank #1 backlights in
response to changes in ambient lighting conditions.
AD_CMP [D7]
This bit indicates the comparison of ADOUT (register 13h) to
both ADRISE (register 14h) and ADFALL(register 15h). When
ADOUT exceeds ADRISE, AD_CMP = 1. When ADOUT falls below
ADFALL , AD_CMP = 0.
AD_INT [D6]
This bit is set when the AD_CMP bit [D7] changes state. If
the AD_SATEN [D5] bit is set, AD_INT bit [D6] may also be
used to indicate an overflow or underflow in ADOUT (register
13h). This bit is cleared when ADC function register (12h) is
read, or when writing INT_CLR bit [D2] equal to one.
The AD_INT bit provides a flag indicating that the ADI
input has exceeded a threshold level, or indicates that an
overflow or underflow condition exists. Figure 28 shows
the AD_INT flag interrupt states.
AD_INT ⇒ 1
AD_OF = 1
or
AD_UF = 1
and
AD_SAT
0⇒1
AD_SAT = 1
and
AD_OF
0⇒1
or
AD_UF
0⇒1
AD_OF [D4]
This bit indicates an overflow condition in register 13h. This
bit is set to one whenever ADOUT becomes ADOUT > F8h.
AD_UF [D3]
This bit indicates an underflow condition in register 13h. This
bit is set to one whenever ADOUT becomes ADOUT < 08h.
INT_CLR [D2]
Writing a one to this bit automatically resets bit AD_INT to
zero. INT_CLR resets itself and will always read as zero.
AD_AUTO [D1]
When the AD_AUTO bit is high, the contents of the ADOUT,
ADRISE, and ADFALL registers are compared and used to control
the brightness of backlight bank #1. ADOUT is compared with
two threshold values contained in registers AD RISE and
ADFALL. If ADOUT becomes greater than ADRISE, bank #1 will
change to the bank #1 target backlight setting of register
06h. If ADOUT becomes less than ADFALL, bank #1 will change
to the bank #1 backlight setting from register 02h.
When the AD_AUTO bit is low, the comparison of ADOUT to
ADRISE and ADFALL is disabled so that bank #1 does not react
to changes in the value of ADOUT, ADRISE, or ADFALL.
Interrupt is set
Bit
AD_CMP
changes
state
AD_SATEN [D5]
This bit, when set, allows an underflow or overflow to generate an interrupt which sets the AD_INT bit [D6]. When
AD_SATEN = 1, an overflow or underflow condition in register 13h will set the AD_INT bit.
Read
register 12h
or
Write
CLR_INT = 1
AD_EN [D0]
When the AD_EN bit is high, the ADC is activated and the
results of each conversion are stored in ADOUT (register 13h).
The functions of the AD_AUTO and AD_EN bits are shown
in Table 22.
AD_SAT = 0
Interrupt is reset
AD_INT ⇒ 0
Figure 28 — ADC Interrupt State Diagram
40
SC668
Register Map (continued)
Table 22 — ALS Function Enable Bits
AD_AUTO AD_EN
Comments
0
0
ADC is disabled. Bank #1 will not change
brightness with ambient conditions.
0
1
ADC is enabled. ADC output is stored in the
ADOUT register. Bank #1 does not respond
to the ADOUT value.
1
0
ADC is disabled. Bank #1 current is set to
the start or target current. ADOUT is compared to ADRISE and ADFALL registers. A new
value may be written to ADOUT via the I2C
interface.
1
1
ADC is enabled. Bank #1 current is set to
the start or target current. ADOUT is compared to ADRISE and ADFALL registers.
The ALS comparator functions are shown in Table 23.
Table 23 — ALS Comparator Function(1)
Conditions
ADOUT Effect on Bank #1
ADOUT > ADRISE
Brightness changes to target value
ADOUT < ADFALL
Brightness changes to start value
ADFALL ≤ ADOUT ≤ ADRISE
ADFALL ≥ ADRISE
Brightness does not change
Hysteresis between the rising and falling
thresholds is disabled, and . . .
ADFALL → has no effect on brightness
ADO > ADRISE → brightness changes to
target value
ADO < ADRISE → brightness changes to
start value
ADO = ADRISE → brightness does not
change
Notes:
1) When AD_AUTO bit is high.
The state diagram of Figure 29 shows how the ADC is used
to change the brightness of backlight bank #1. No automatic change in brightness occurs when AD_AUTO = 0.
ADOUT < ADRISE
AD_AUTO = 1 or 0
Bank #1 Brightness
= Value of Register 02h
AD_AUTO = 1
ADOUT < ADFALL
AD_AUTO = 0
ADOUT > ADRISE
AD_AUTO = 1
ADOUT > ADRISE
AD_AUTO = 0
ADOUT < ADFALL
Bank #1 Brightness
= Value of Register 06h
ADOUT > ADFALL
AD_AUTO = 1 or 0
Figure 29 — ADC function at Bank #1 Brightness
ADC Output and Threshold Register (13h)
This register contains the value ADOUT which is compared
with ADRISE and ADFALL. The contents of ADOUT may originate
automatically from the ADC, when the AD_EN bit is a logic
one. Alternatively, ADOUT may be written to the register via
the I2C interface when the AD_EN bit is a logic zero.
When AD_EN = 1, the ADC receives its analog voltage
input signal from the external photo-detector circuit connected to the ADI pin. VADI is then converted into digital
and stored as the 8 bit word ADOUT. The reference voltage
for the ADC is provided internally by the output of LDO4
(VLDO4). When the voltage VADI is equal to VLDO4 , the ADC is
at full-scale value FFh, and ADOUT will equal FFh.
When using an external photo-detection circuit, the ADC
requires the LDO output voltage VLDO4 to remain constant.
VLDO4 can drop-out if the supply voltage becomes too low.
VLDO4 should be set to a value sufficiently low to guard
against drop-out.
41
SC668
Register Map (continued)
To prevent drop-out, the maximum LDO4 output setting
should be limited to:
VLDO4(MAX) = VIN(MIN) - [1.33 × ILDO4(MAX)],
ADC Falling Threshold (15h)
This register contains the value ADFALL. When ADOUT falls
below ADFALL and AD_AUTO = 1, backlight bank #1 changes
to the starting value in the bank #1 register (02h).
where VIN(MIN) is the minimum battery voltage and ILDO4(MAX)
is the maximum load current of LDO4. LDO4 load current
includes current to the external photo-detection circuit.
AD_F7 through AD_F0 [D7:D0]
These are the 8 bits of ADFALL. AD_F7 is the MSB, and AD_F0
is the LSB.
AD_O7 through AD_O0 [D7:D0]
These are the 8 bits of ADOUT. AD_O7 [D7] is the Most
Significant Bit (MSB), and AD_O0 [D0] is the Least
Significant Bit (LSB). Binary weights of these bits are
shown in Table 24.
ADP and OLE Functions (16h)
Table 24 — ADOUT Bits [D7:D0]
Name
Bit
Binary Weight
AD_O7
D7
1/2
AD_O6
D6
1/4
AD_O5
D5
1/8
AD_O4
D4
1/16
AD_O3
D3
1/32
AD_O2
D2
1/64
AD_O1
D1
1/128
AD_O0
D0
1/256
To calculate the voltage at the ADC input, the weights of
only the bits set to one are summed together and multiplied by the voltage provided by LDO4. The result is equal
to the analog voltage applied to the ADI pin. For example,
if the value of register 13h reads AD OUT = 01111111,
and VLDO4 = 2.8V, the ADC input is at:
2.8 x (4-1 + 8-1 + 16-1 + 32-1 + 64-1 + 128-1 + 256-1) = 1.38V.
ADC Rising Threshold (14h)
This register contains the value ADRISE. When ADOUT rises
above ADRISE and AD_AUTO = 1, backlight bank #1 changes
to the target value in the bank #1 target register (06h).
AD_R7 through AD_R0 [D7:D0]
These are the 8 bits of ADRISE. AD_R7 is the MSB, and AD_R0
is the LSB.
ADP (Automatic Drop-out Protection) and OLE (Other
Lighting Effects) are controlled with this register. ADP
applies to bank #1 only.
ADP ensures current matching in the LEDs by responding
to a low battery voltage. ADP limits the maximum backlight current to a level which ensures that backlight LEDs
maintain matched currents. The ADP feature also prevents
the ripple on a low battery from inducing flicker in the
LEDs. As the battery voltage gradually proceeds lower,
ADP gradually dims the backlights. The normal backlight
brightness is restored after the battery is recharged by
writing a logic zero to the ADP_EN bit.
Bank #1 will try to resume the original backlight current
setting whenever ADP_EN = 0. Also, if any bank #1 current
sink is floating, the ADP_EN bit is cleared automatically.
Any write operations to change the following bit combinations in register 01h will also cause bank #1 to resume
the original setting:
•
•
•
DIS = 1, EN = 0, BANK1EN = 1
DIS = 0, EN = 1, BANK1EN = 1
DIS = 1, EN = 1, BANK1EN = 1
ADP_ACT Bit D6
This bit is a flag. A logic one indicates that ADP has been
activated. Once activated, the ADP is limiting the backlight
current. This flag bit is reset when ADP_EN = 0, or when
any bank#1 current sink is floating, or by writing any of
the following bit combinations in register 01h:
•
•
•
DIS = 1, EN = 0, BANK1EN = 1
DIS = 0, EN = 1, BANK1EN = 1
DIS = 1, EN = 1, BANK1EN = 1
42
SC668
Register Map (continued)
ADP_RATE Bit D5
This bit sets the time that elapses before backlight current
reduces after ADP activates. A logic one delays reduction
of current for 4ms. A logic zero delays reduction of current
for 256µs.
OLE_EN2 through OLE_EN0 Bits [D3:D1]
These bits enable Other Lighting Effects (OLE), including
the auto-dim full and auto-dim partial, as shown in Table
25. Auto-dim functions are described in detail in the
Applications Information section.
When a reduction in bank #1 backlight current becomes
necessary, the first step change is delayed for 4ms (logic
one) or 256µs (logic zero). If bank #1 continues to need a
current reduction after the delay time has elapsed, the
brightness setting is lowered by one step. If further reductions in current are needed, the second and all subsequent
reductions occur at a faster rate equal to1/4 of the initial
delay time. Further reductions in current will stop when
the backlight accuracy and matching have normalized.
Table 25 — OLE Bits
When 4ms is selected, the 1st delay = 4ms, and the 2nd and all
subsequent delays = 1ms. When 256μs is selected, the 1st
delay = 256μs, and the 2nd and all subsequent delays = 64μs.
ADP_EN Bit D4
This bit enables the ADP function. ADP is enabled when
this bit is a logic one. ADP is disabled when this bit is a
logic zero.
OLE_EN2 OLE_EN1 OLE_EN0
Lighting Effect
0
0
0
Reserved (no effects)
0
0
1
Auto-dim full (group #1)
0
1
0
Auto-dim partial (group #1)
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Reserved (no effects)
PWM_BYP Bit D0
When this bit is a logic zero, the PWM pin functions normally. When this bit is a logic one, the PWM pin is disabled,
so that a high or low on the PWM pin has no effect.
43
SC668
Outline Drawing — MLPQ-UT-20 3x3
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A2
A
aaa C
C
A1
SEATING
PLANE
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020
.024 0.50
0.60
.000
.002 0.00 0.05
(.006)
(0.152)
.006 .008 .010 0.15 0.20 0.25
.114 .118 .122 2.90 3.00 3.10
.061 .067 .071 1.55 1.70 1.80
.114 .118 .122 2.90 3.00 3.10
.061 .067 .071 1.55 1.70 1.80
.016 BSC
0.40 BSC
.012 .016 .020 0.30 0.40 0.50
20
20
.003
0.08
.004
0.10
D1
e
LxN
E/2
E1
2
1
N
D/2
bxN
bbb
C A B
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2.
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
3.
DAP IS 1.90 x 1.90mm.
44
SC668
Land Pattern — MLPQ-UT-20 3x3
K
DIMENSIONS
R
(C)
H
G
Y
X
P
Z
DIM
INCHES
MILLIMETERS
C
G
H
K
P
R
X
Y
Z
(.114)
(2.90)
.083
.067
.067
.016
.004
.008
.031
.146
2.10
1.70
1.70
0.40
0.10
0.20
0.80
3.70
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
45
SC668
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46