TC74 PRODUCT QUALIFICATION REPORT Document Control # C-0909218 August 27, 2009 Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, Arizona, USA – 85224 Ph: 480.792.7200, Fax: 480.899.9210 http://www.microchip.com GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A SUMMARY QUALIFICATION REPORT Document Control #: C-0909218 Document Revision: A Purpose: Device(s): Product: Mask Identification #: Process: Product Design Qualification TC74 Serial Digital Thermal Sensor GBBW1 8” 130K ANALOG 0.6um POLY GATE MSL: 887 Date: August 27, 2009 Name Title Date C. Desai Reliability Engineer August 27, 2009 Approved by C.K. Barlingay Reliability Manager September 3, 2009 Approved by R. Francisco Product Engineer September 1, 2009 Author Microchip Technology Inc. 2 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A TABLE OF CONTENTS DEVICE DESCRIPTION .................................................................... 4 OVERVIEW ........................................................................................ 5 QUALIFICATION PLAN AND DESCRIPTIONS ..............................................................5 TEST CONDITIONS ...............................................................................................6 RELIABILITY RESULTS ................................................................... 7 QUALIFICATION MATERIAL ....................................................................................7 DIE LEVEL RESULTS.............................................................................................8 PACKAGE RELIABILITY ..........................................................................................9 CONCLUSION ................................................................................... 9 APPENDIX A – DYNAMIC LIFE BURN-IN SCHEMATIC ............... 10 Microchip Technology Inc. 3 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Device Description TC74 is a serially accessible digital temperature sensor particularly suited for low cost and small form-factor applications. Temperature data is converted from the on-board thermal sensing element and made available as an 8-bit digital word. Communication with the TC74 is accomplished via a simple 2-wire SMBus/I2C™-compatible serial port. This bus also can be used to implement multi-drop/multi-zone monitoring. The SHDN bit in the CONFIG register can be used to activate the low-power Standby mode. Temperature resolution is 1°C. Conversion rate is a nominal 8 samples/sec. Power consumption in only 200 µA (5 µA Standby). Small size, low installed cost and ease of use make the TC74 an ideal choice for implementing thermal management in a variety of systems. Microchip Technology Inc. 4 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Overview The purpose of this report is to verify that qualification testing was performed in accordance with the documented qualification plan required by Microchip specification QCI-39000, “Worldwide Quality Conformance Requirements.” Qualification Plan and Descriptions In keeping with guidelines established in QCI-39000, a minimum of one production lot was used for qualification testing of the TC74. This qualification will release the TC74 to production. A detailed qualification plan is listed below along with descriptions of each test. High Temperature Operating Life (HTOL) / Dynamic Life Testing (DLT) This test is designed to accelerate random failure modes which may occur during normal operation. Devices are programmed with a burn-in program and exercised at a high ambient temperature to simulate field life. One lot of the TC74 was subjected to 408 hours of dynamic life burn-in at 150oC. Conditions: • • • 6.0V Supply Voltage: 9.0 years @ 55oC Reachout Î See attached schematic in Appendix A Electrostatic Discharge (ESD) Test Using Human Body Model (HBM) and Machine Model (MM) This test is conducted to determine the sensitivity of the input protection circuitry to electrostatic discharge. Human Body Model tests are conducted according to EIA/JESD22-A114 and Machine Model tests are performed in accordance with EIA/JESD22-A115 (Microchip Specification QCI-30510). One lot of TC74 was tested to determine susceptibility to ESD. Latch-Up (LU) Over Current Testing This test is employed to determine the sensitivity of a device to overshoots in input and output signals (also called transients) with respect to Vdd and Ground. The current injection method is used per Microchip standard QCI30521. This test is performed at 25oC and 125oC. One lot of TC74 was tested to determine latch up susceptibility. Microchip Technology Inc. 5 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Test Conditions Tests are performed in accordance with QCI-39000, “Worldwide Quality Conformance Requirements.” The various conditions are listed below. TEST METHOD CONDITION High Temperature Operating Life / Dynamic Life Test MIL-STD 883 Method 1005 150oC, 408 Hrs Electrical Test at -40oC, +25oC and +125oC. ESD Human Body Model EIA/JESD22A114 ESD Machine Model EIA/JESD22A115 Latch-up Testing QCI-30521 1.5K Ohm, 100 pF Electrical Test at +25oC and +125oC. 0 Ohm, 200 pF Electrical Test at +25oC and +125oC. Trigger Voltage Limit = 1.5*VMAX (not to exceed Vabs) Pulse Width = 5 ms Rise/Fall Time = 100 us Test at +25oC and +125oC Microchip Technology Inc. 6 SAMPLE SIZE RUN 0/638 ACCEPTANCE CRITIREA 0/600 1 Lot 12 2000V 1 Lot 12 200V 1 Lot 1 Lot 6 6 100mA (0/6) 100mA (0/6) Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Reliability Results The results of the tests performed are presented below. Qualification Material Information regarding the devices that were used in this qualification are shown in the table below. LOT LOT 1 DEVICE TC74 MASK, REV GBBW1, A1 WAFER FAB MICROCHIP TEMPE WAFER PROCESS 8” 130K Analog 0.6um Poly Gate WAFER LOT TMPE209486782.110 ASSEMBLY LOT MTAI100701255.000 PACKAGE 5L SOT-23 ASSEMBLY SITE MICROCHIP FINAL TEST MICROCHIP THAILAND THAILAND QUAL # MTHAI # – R09100 CHANDLER # – N0936 Microchip Technology Inc. CN # C123233 QUAL TESTS HTOL/ ESD/ LATCH-UP 7 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Die Level Results The results of die level testing are shown below. DYNAMIC LIFE TESTING AT 150°C ( HTOL/DLT) 96 Hours 0/700a Lot 1 a b 408 Hours 0/638b Twenty four devices were lost during post testing and 19 devices were removed due to visual/mechanical damage Nineteen devices were lost during post testing. Activation Energy Derated Temperature Device Hours Fit Rate - 50% Confidence 0.7 eV 55oC Infant Mortality Total Life MTBF (Years) 63,072 262,128 N/A 42 10 11,184 13 34 8,459 3,367 Fit Rate - 60% Confidence 56 Fit Rate - 90% Confidence 141 Note: One FIT is one fail in 109 device hours Infant Mortality Total Life Best Estimated Failure Rate (%\KHR) 0.0042 0.0010 ELECTROSTATIC DISCHARGE TESTS Lot 1 Human Body Model Machine Model Pass up to 1000V Pass up to 400V LATCH-UP TESTS @ 25OC Lot 1 Passed 100mA Note: All pins meet or exceed QCI-39000 guidelines. Microchip Technology Inc. 8 @ 125OC Passed 100mA Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Package Reliability Visit the Microchip Technology Inc. website at www.microchip.com for the latest package reliability data. Conclusion Based on the results, the TC74 complies with the reliability guidelines specified in QCI-39000 except the ESD Human body model. GBBW1 device has identical design and process specification when compared to Y4001 and is streamed out using same design files. An ESD correlation between the GBBW1 and Y4001 was done under Microchip’s testing conditions and the two masks were found to perform similarly. Based on these results GBBW1 is considered qualified by grand fathered clause. Therefore, the TC74 devices are released to production. Microchip Technology Inc. 9 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A Appendix A – Dynamic Life Burn-In Schematic TC74 HIGH TEMPERATURE DYNAMIC LIFE TEST BURN-IN SCHEMATIC 5.5V R1 1.5K o C2 1uF C1 0.1uF 1 NC 2 GND 3 VDD SDATA 5 SCLK 4 TC74 GND Microchip Technology Inc. 10 Chandler, Arizona, U. S. A. GBBW1, TC74 Rev A1 Product Qualification Report #C-0909218 Rev. A NOTES: Microchip Technology Inc. 11 Chandler, Arizona, U. S. A.