Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 48‐Lead, 7.0 x 7.0 mm Body, 5.8 mm Exposed Pad, 0.50 mm Pitch, Very‐Thin Quad Flat No Lead Package (VQFN) 6.543‐5089.03‐4 GPC ZEQ Yes Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant TSPIC REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin 1,4‐Bis(2,3‐epoxypropoxy)butane Dapsone 7440‐22‐4 9003‐36‐5 2425‐79‐8 80‐08‐0 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Fused Epoxy Resin A Epoxy Resin B Phenol Resin A Phenol Resin B Metal Hydroxide Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 64.580 2.014 0.403 0.134 67.131 3.151 3.151 0.179 0.036 0.018 0.007 0.240 1.522 1.522 0.618 0.618 59.803 2.163 2.163 2.163 2.163 1.117 0.209 69.781 3.175 3.175 145.620 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 74.6 746000 14.9 149000 7.5 75000 3.0 30000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.7 857000 3.1 31000 3.1 31000 3.1 31000 3.1 31000 1.6 16000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 44.35 443483 1.38 13830 0.28 2766 0.09 922 46.10 461001 2.16 21639 2.16 21639 0.12 1232 0.02 246 0.01 124 0.00 50 0.17 1651 1.05 10455 1.05 10455 0.42 4244 0.42 4244 41.07 410678 1.49 14855 1.49 14855 1.49 14855 1.49 14855 0.77 7667 0.14 1438 47.92 479204 2.18 21806 2.18 21806 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: August 26, 2015 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.