MX23L1613 16M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2M x 8 (byte mode) - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm) • Temperature - -40 ~ 85°C Symbol Pin Function A0~A19 Address Inputs D0~D14 Data Outputs D15/A-1 D15 (Word Mode)/ LSB Address (Byte Mode) CE# Chip Enable Input OE# Output Enable Input Byte# Word/ Byte Mode Selection VCC Power Supply Pin VSS Ground Pin NC No Connection PIN CONFIGURATION 48 TSOP (Top View) A15 A14 A13 A12 A11 A10 A9 A8 A19 NC NC NC NC NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX23L1613 (Normal Type) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC D11 D3 D10 D2 D9 D1 D8 D0 OE# VSS CE# A0 ORDER INFORMATION Part No. Speed MX23L1613TC-70 70ns MX23L1613TC-90 90ns MX23L1613TC-70G 70ns MX23L1613TC-90G 90ns MX23L1613TI-70 70ns MX23L1613TI-90 90ns MX23L1613TI-70G 70ns MX23L1613TI-90G 90ns Note: Industrial grade temperature: -40 ~ 85°C Commercial grade temperature: 0 ~ 70°C Package 48 pin TSOP 48 pin TSOP 48 pin TSOP (Pb-free, RoHS Compliant) 48 pin TSOP (Pb-free, RoHS Compliant) 48 pin TSOP 48 pin TSOP 48 pin TSOP (Pb-free, RoHS Compliant) 48 pin TSOP (Pb-free, RoHS Compliant) Grade Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial REV. 1.9 , NOV. 07, 2006 P/N:PM0620 1 MX23L1613 MODE SELECTION CE# H L L L OE# X H L L Byte# X X H L D15/A-1 X X Output Input D0~D7 High Z High Z D0~D7 D0~D7 D8~D15 High Z High Z D8~D15 High Z Mode Word Byte Power Stand-by Active Active Active ABSOLUTE MAXIMUM RATINGS Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg Ratings -0.3V to 3.9V -40°C to 85°C -65°C to 125°C DC CHARACTERISTICS (Ta = -40°C ~ 85°C, VCC = 2.7V~3.6V) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Symbol VOH VOL VIH VIL ILI ILO ICC MIN. 2.4V 2.2V -0.3V - MAX. 0.4V VCC+0.3V 0.8V 5uA 5uA 25mA Standby Current (CMOS) Input Capacitance Output Capacitance ISTB CIN COUT - 5uA 10pF 10pF Conditions IOH = -400uA IOL = 1.6mA 0V, VCC 0V, VCC f=5MHz, CE#=VIL, OE#=VIH all output open CE#>VCC-0.2V Ta = 25°C, f = 1MHZ Ta = 25°C, f = 1MHZ AC CHARACTERISTICS (Ta = -40°C ~ 85°C, VCC = 2.7V~3.6V) Item Symbol Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Time Output Hold After Address Output High Z Delay tRC tAA tACE tOE tOH tHZ 23L1613-70 MIN. MAX. 70ns 70ns 70ns 30ns 0ns 20ns 23L1613-90 MIN. MAX. 90ns 90ns 90ns 40ns 0ns 20ns Note:Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. P/N:PM0620 REV. 1.9, NOV. 07, 2006 2 MX23L1613 AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load Note: 0V~ 3.0V 5ns 1.5V 1.5V See Figure IOH (load)=-0.4mA DOUT IOL (load)=1.6mA C<30pF 30pF output load capacitance for 70 and 90ns speed grade Note:No output loading is present in tester load board. Active loading is used and under software programming control. Output loading capacitance includes load board's and all stray capacitance. TIMING DIAGRAM RANDOM READ ADD ADD ADD ADD tRC tACE CE# tOE OE# tOH tAA DATA VALID VALID P/N:PM0620 tHZ VALID REV. 1.9, NOV. 07, 2006 3 MX23L1613 PACKAGE INFORMATION P/N:PM0620 REV. 1.9, NOV. 07, 2006 4 MX23L1613 Revision History Revision No. Description 1.2 Modify Package 48-ball mini BGA 8mm x 13mm-->8mm x 9mm 1.3 Modify Fast access time:100ns-->70ns Add AC Characteristics--23L1613-70&90 1.4 1.Modify Pin Configuration--48 mini BGA 2.Added 48-Ball mini BGA--Package Information 1.5 Added Order Information Add Tempetature:-40~85°C 1.6 Add CE#=VIL, OE#=VIH in DC Characteristics's ICC Add MX23L1613TC-70 in Order Information 1.7 Modify Package Information 1.8 1. Removed 48-ball BGA package 2. Removed 100ns & 120ns speed 1.9 1. Added statement P/N:PM0620 Page P1 P1 P3 P1,2 P6 P2 P1 P3 P2 P5~6 All P1,2 P6 Date APR/27/2000 JAN/18/2001 JUN/28/2001 JUL/16/2001 OCT/02/2001 NOV/22/2002 NOV/28/2005 NOV/07/2006 REV. 1.9, NOV. 07, 2006 5 MX23L1613 Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications. MACRONIX INTERNATIONAL CO., LTD. Headquarters Macronix, Int'l Co., Ltd. Taipei Office Macronix, Int'l Co., Ltd. 16, Li-Hsin Road, Science Park, Hsinchu, Taiwan, R.O.C. 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