CM1485 Dual Channel EMI Filter with ESD Protection Product Description The CM1485 is a 2 channel pi-style EMI filter array with ESD protection, housed in a 6−lead SOT−563 package. The CM1485 has component values of 12 pF − 100 W − 12 pF per channel. The CM1485 has a cut−off frequency of 125 MHz and can be used in applications with data rates up to 48 Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15 kV, well beyond the maximum requirement of the IEC61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1485 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1485 is housed in a small, 6−lead SOT−563 package and is available with lead−free finishing. Features http://onsemi.com SOT−563 SE SUFFIX CASE 463A ELECTRICAL SCHEMATIC 100 W Filter + ESDn* C R 12 pF GND Filter + ESDn* C 12 pF 1 of 2 EMI/RFI + ESD Channels * See Package/Pinout Diagrams for expanded pin information. • Two Channels of EMI Filtering with Integrated ESD Protection • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) MARKING DIAGRAM Network • ±15 kV ESD Protection on Each Channel • • • • N85 M G (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Greater than 30 dB Attenuation (Typical) at 1 GHz 6−lead SOT−563 Package These Devices are Pb−Free and are RoHS Compliant 1 N85 = CM1485−02SE M = Month Code G = Pb−Free Package ORDERING INFORMATION Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers • Wireless Handsets • Handheld PCs/PDAs • LCD and Camera Modules © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 3 1 Device Package Shipping† CM1485−02SE SOT−563 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: CM1485/D CM1485 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 6−Lead SOT−563 Package Pin Name 1 FILTER1 2 GND 3 FILTER1 Filter + ESD Channel 1 4 FILTER2 Filter + ESD Channel 2 GND 6 FILTER2 CH1 1 GND 2 CH1 3 5 CH2 5 GND 4 CH2 Filter + ESD Channel 1 Ground (Note 1) Ground (Note 1) N85 5 Top View Description 6−Lead SOT−563 Filter + ESD Channel 2 1. Pin 2 and Pin 5 must be well grounded at the same time. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 0.15 W Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol R CTOTAL Parameter Conditions Resistance Total Channel Capacitance At 2.5 V DC Reverse Bias, 1 MHz, 30 mV AC ILEAK Diode Leakage Current (Reverse Bias) VDIODE = +3.0 V VBR Breakdown Voltage Positive Clamp ILOAD = 1 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 RDYN fC A1GHz A800MHz − 6GHz (Note 2) Min Typ Max Units 90 100 110 W 19.2 24.0 28.8 pF 1.0 mA 6.0 7.0 V kV ±30 ±15 Dynamic Resistance Positive Negative 2.3 0.9 Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W 125 W MHz Absolute Attenuation @ 1 GHz from 0 dB Level ZSOURCE = 50 W, ZLOAD = 50 W, DC Bias = 0 V (Notes 1 and 3) 35 dB Absolute Attenuation @ 800 MHz to 1 GHz from 0 dB Level ZSOURCE = 50 W, ZLOAD = 50 W, DC Bias = 0 V (Notes 1 and 3) 30 dB 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Attenuation / RF curves characterized by a network analyzer using microprobes. http://onsemi.com 2 CM1485 PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) http://onsemi.com 3 CM1485 PERFORMANCE INFORMATION (Cont’d) Figure 3. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5 V DC and 255C) http://onsemi.com 4 CM1485 PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A−01 ISSUE F D −X− 5 6 1 2 A 4 b e L E −Y− 3 DIM A b C D E e L HE HE C 5 PL 6 0.08 (0.003) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. X Y M SOLDERING FOOTPRINT* INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 STYLE 1: PIN 1. EMITTER 1 2. BASE 1 3. COLLECTOR 2 4. EMITTER 2 5. BASE 2 6. COLLECTOR 1 0.3 0.0118 0.45 0.0177 1.35 0.0531 MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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