Features • High Performance, Low Power 32-bit AVR® Microcontroller – – – – • • • • • • • • • • • • Compact Single-cycle RISC Instruction Set Including DSP Instruction Set Built-in Floating-Point Processing Unit (FPU) Read-Modify-Write Instructions and Atomic Bit Manipulation Performing 1.49 DMIPS / MHz • Up to 68 DMIPS Running at 50 MHz from Flash (1 Wait-State) • Up to 37 DMIPS Running at 25 MHz from Flash (0 Wait-State) – Memory Protection Unit Multi-hierarchy Bus System – High-Performance Data Transfers on Separate Buses for Increased Performance – 16 Peripheral DMA Channels Improves Speed for Peripheral Communication Internal High-Speed Flash – 512 Kbytes, 256 Kbytes, 128 Kbytes Versions – Single Cycle Access up to 25 MHz – FlashVault™ Technology Allows Pre-programmed Secure Library Support for End User Applications – Prefetch Buffer Optimizing Instruction Execution at Maximum Speed – 10,000 Write Cycles, 15-year Data Retention Capability – Flash Security Locks and User Defined Configuration Area Internal High-Speed SRAM, Single-Cycle Access at Full Speed – 64 Kbytes (512 KB and 256 KB Flash), 32 Kbytes (128 KB Flash) – 4 Kbytes on the Multi-Layer Bus System (HSB RAM) External Memory Interface on AT32UC3C0 Derivatives – SDRAM / SRAM Compatible Memory Bus (16-bit Data and 24-bit Address Buses) Interrupt Controller – Autovectored Low Latency Interrupt Service with Programmable Priority System Functions – Power and Clock Manager – Internal 115KHz (RCSYS) and 8MHz/1MHz (RC8M) RC Oscillators – One 32 KHz and Two Multipurpose Oscillators – Clock Failure detection – Two Phase-Lock-Loop (PLL) allowing Independent CPU Frequency from USB or CAN Frequency Windowed Watchdog Timer (WDT) Asynchronous Timer (AST) with Real-Time Clock Capability – Counter or Calendar Mode Supported Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency Ethernet MAC 10/100 Mbps interface – 802.3 Ethernet Media Access Controller – Supports Media Independent Interface (MII) and Reduced MII (RMII) Universal Serial Bus (USB) – Device 2.0 and Embedded Host Low Speed and Full Speed – Flexible End-Point Configuration and Management with Dedicated DMA Channels – On-chip Transceivers Including Pull-Ups One 2-channel Controller Area Network (CAN) – CAN2A and CAN2B protocol compliant, with high-level mailbox system – Two independent channels, 16 Message Objects per Channel 32-bit AVR® Microcontroller AT32UC3C0512C AT32UC3C1512C AT32UC3C1256C AT32UC3C2512C AT32UC3C2256C AT32UC3C2128C Automotive Summary NOTE: This is a summary document. The complete document is available on the Atmel website at www.atmel.com. 9166DS–AVR–01/12 AT32UC3C • One 4-Channel 20-bit Pulse Width Modulation Controller (PWM) • • • • • • • • • • • • • • – Complementary outputs, with Dead Time Insertion – Output Override and Fault Protection Two Quadrature Decoders One 16-channel 12-bit Pipelined Analog-To-Digital Converter (ADC) – Dual Sample and Hold Capability Allowing 2 Synchronous Conversions – Single-Ended and Differential Channels, Window Function Two 12-bit Digital-To-Analog Converters (DAC), with Dual Output Sample System Four Analog Comparators Six 16-bit Timer/Counter (TC) Channels – External Clock Inputs, PWM, Capture and Various Counting Capabilities One Peripheral Event Controller – Trigger Actions in Peripherals Depending on Events Generated from Peripherals or from Input Pins – Deterministic Trigger – 34 Events and 22 Event Actions Five Universal Synchronous/Asynchronous Receiver/Transmitters (USART) – Independent Baudrate Generator, Support for SPI, LIN, IrDA and ISO7816 interfaces – Support for Hardware Handshaking, RS485 Interfaces and Modem Line Two Master/Slave Serial Peripheral Interfaces (SPI) with Chip Select Signals One Inter-IC Sound (I2S) Controller – Compliant with I2S Bus Specification – Time Division Multiplexed mode Three Master and Three Slave Two-Wire Interfaces (TWI), 400kbit/s I2C-compatible QTouch® Library Support – Capacitive Touch Buttons, Sliders, and Wheels – QTouch® and QMatrix® Acquisition On-Chip Non-intrusive Debug System – Nexus Class 2+, Runtime Control, Non-Intrusive Data and Program Trace – aWire™ single-pin programming trace and debug interface muxed with reset pin – NanoTrace™ provides trace capabilities through JTAG or aWire interface 3 package options – 64-pin QFN/TQFP (45 GPIO pins) – 100-pin TQFP (81 GPIO pins) – 144-pin LQFP (123 GPIO pins) Two operating voltage ranges: – Single 5V Power Supply – Single 3.3V Power Supply 2 9166DS–AVR-01/12 AT32UC3C 1. Description The AT32UC3C is a complete System-On-Chip microcontroller based on the AVR32UC RISC processor running at frequencies up to 50 MHz. AVR32UC is a high-performance 32-bit RISC microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density and high performance. The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern operating systems and real-time operating systems. Using the Secure Access Unit (SAU) together with the MPU provides the required security and integrity. Higher computation capabilities are achievable either using a rich set of DSP instructions or using the floating-point instructions. The AT32UC3C incorporates on-chip Flash and SRAM memories for secure and fast access. For applications requiring additional memory, an external memory interface is provided on AT32UC3C0 derivatives. The Memory Direct Memory Access controller (MDMA) enables transfers of block of data from memories to memories without processor involvement. The Peripheral Direct Memory Access (PDCA) controller enables data transfers between peripherals and memories without processor involvement. The PDCA drastically reduces processing overhead when transferring continuous and large data streams. The AT32UC3C incorporates on-chip Flash and SRAM memories for secure and fast access. The FlashVault technology allows secure libraries to be programmed into the device. The secure libraries can be executed while the CPU is in Secure State, but not read by non-secure software in the device. The device can thus be shipped to end custumers, who are able to program their own code into the device, accessing the secure libraries, without any risk of compromising the proprietary secure code. The Power Manager improves design flexibility and security. Power monitoring is supported by on-chip Power-On Reset (POR), Brown-Out Detectors (BOD18, BOD33, BOD50). The CPU runs from the on-chip RC oscillators, the PLLs, or the Multipurpose Oscillators. The Asynchronous Timer (AST) combined with the 32 KHz oscillator keeps track of the time. The AST can operate in counter or calendar mode. The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation. The PWM module provides four channels with many configuration options including polarity, edge alignment and waveform non overlap control. The PWM channels can operate independently, with duty cycles set independently from each other, or in interlinked mode, with multiple channels updated at the same time. It also includes safety feature with fault inputs and the ability to lock the PWM configuration registers and the PWM pin assignment. The AT32UC3C also features many communication interfaces for communication intensive applications. In addition to standard serial interfaces like UART, SPI or TWI, other interfaces like flexible CAN, USB and Ethernet MAC are available. The USART supports different communication modes, like SPI mode and LIN mode. The Inter-IC Sound Controller (I2SC) provides a 5-bit wide, bidirectional, synchronous, digital audio link with off-chip audio devices. The controller is compliant with the I2S bus specification. 3 9166DS–AVR-01/12 AT32UC3C The Full-Speed USB 2.0 Device interface supports several USB Classes at the same time thanks to the rich End-Point configuration. The On-The-GO (OTG) Host interface allows device like a USB Flash disk or a USB printer to be directly connected to the processor. The media-independent interface (MII) and reduced MII (RMII) 10/100 Ethernet MAC module provides on-chip solutions for network-connected devices. The Peripheral Event Controller (PEVC) allows to redirect events from one peripheral or from input pins to another peripheral. It can then trigger, in a deterministic time, an action inside a peripheral without the need of CPU. For instance a PWM waveform can directly trigger an ADC capture, hence avoiding delays due to software interrupt processing. The AT32UC3C features analog functions like ADC, DAC, Analog comparators. The ADC interface is built around a 12-bit pipelined ADC core and is able to control two independent 8-channel or one 16-channel. The ADC block is able to measure two different voltages sampled at the same time. The analog comparators can be paired to detect when the sensing voltage is within or outside the defined reference window. Atmel offers the QTouch library for embedding capacitive touch buttons, sliders, and wheels functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and included fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications. AT32UC3C integrates a class 2+ Nexus 2.0 On-Chip Debug (OCD) System, with non-intrusive real-time trace, full-speed read/write memory access in addition to basic runtime control. The Nanotrace interface enables trace feature for aWire- or JTAG-based debuggers. The single-pin aWire interface allows all features available through the JTAG interface to be accessed through the RESET pin, allowing the JTAG pins to be used for GPIO or peripherals. 1.1 Disclaimer Typical values contained in this data sheet are based on simulations and characterization of other 32-bit AVR Microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. 1.2 Automotive Quality Grade The AT32UC3C have been developed and manufactured according to the most stringent requirements of the international standard ISO-TS 16949. This data sheet contains limit values extracted from the results of extensive characterization (Temperature and Voltage). The quality and reliability of the AT32UC3C have been verified during regular product qualification as per AEC-Q100 grade 1. As indicated in the ordering information paragraph, the product is available in only one temperature grade, Table 1-1. Table 1-1. Temperature Grade Identification for Automotive Products Temperature(°C) Temperature Identifier Comments -40;+125 Z Full Automotive Temperature Range 4 9166DS–AVR-01/12 AT32UC3C 2. Overview Block diagram Block diagram TDO TCK TDI TMS AVR32UC CPU JTAG INTERFACE NEXUS CLASS 2+ OCD MCKO MDO[5..0] MSEO[1..0] EVTI_N EVTO_N VBUS D+ DID VBOF USB INTERFACE M Flash Controller 512/ 256/ 128/64 KB Flash M S S M W M R M S M M PBB HSB PB S CONFIGURATION PERIPHERAL DMA CONTROLLER S REGISTERS HSB Memory DMA COL, CRS, RXD[3..0], RX_CLK, RX_DV, RX_ER, TX_CLK DMA BUS HSB PB HSB-PB BRIDGE B HSB-PB BRIDGE A DATA[15..0] ADDR[23..0] NCS[3..0] NRD NWAIT NWE0 NWE1 RAS CAS SDA10 SDCK SDCKE SDWE ETHERNET MAC PB MDC, TXD[3..0], TX_EN, TX_ER, SPEED DMA ANALOG TO DIGITAL CONVERTER 0/1 DMA SERIAL PERIPHERAL INTERFACE 1 SERIAL PERIPHERAL INTERFACE 0 DMA I2S INTERFACE TWO-WIRE INTERFACE 0/1 DMA USART0 USART2 USART3 DMA USART4 DMA RTS, CTS CLK TXD RXD PERIPHERAL EVENT CONTROLLER DMA USART1 PBA MDIO DSR, DTR, DCD, RI RTS, CTS CLK TXD RXD DMA PAD_EVT RXD TXD CLK RTS, CTS MISO, MOSI BCLK IWS ISDI ISDO MCLK supplied by VDDANA ADCREF0/1 ADCIN[15..0] ADCVREFP/N SCK MISO, MOSI NPCS[3..0] SCK NPCS[3..0] CLK[2..0] B[2..0] DMA TWO-WIRE INTERFACE 2 TWCK TWD PULSE WIDTH MODULATION CONTROLLER DMA TIMER/COUNTER 0 A[2..0] External Interrupt Controller EXTINT[8:1] NMI CLOCK CONTROLLER RESET CONTROLLER GCLK[1..0] TWD PWMH[3..0] PWML[3..0] EXT_FAULTS[1:0] PA PB PC PD supplied by VDDANA DMA POWER MANAGER SLEEP CONTROLLER TWCK TWALM GENERAL PURPOSE IOs GENERAL PURPOSE IOs M M 64/32/16 KB SRAM S HSB-PB BRIDGE C PA PB PC PD DATA INTERFACE HIGH SPEED BUS MATRIX CANIF RXLINE[1] TXCAN[1] INSTR INTERFACE LOCAL BUS S 4 KB HSB RAM RXLINE[0] TXLINE[0] MEMORY PROTECTION UNIT LOCAL BUS INTERFACE EXTERNAL BUS INTERFACE (SDRAM & STATIC MEMORY CONTROLLER) aWire RESET_N MEMORY INTERFACE Figure 2-1. PBC 2.1 DIGITAL TO ANALOG CONVERTER 0/1 DAC0A/B DAC1A/B DACREF ANALOG COMPARATOR 0A/0B/1A/1B AC0AP/N AC0BP/N AC1AP/N AC1BP/N AC0AOUT/AC0BOUT AC1AOUT/AC1BOUT TIMER/COUNTER 1 B[2..0] RCSYS A[2..0] RC8M CLK[2..0] RC120M XIN[1:0] XOUT[1:0] OSC0 / OSC1 SYSTEM CONTROL INTERFACE PLL0 / PLL1 XIN32 XOUT32 32 KHz OSC QUADRATURE DECODER 0/1 QEPA QEPB QEPI ASYNCHRONOUS TIMER BODs (1.8V, 3.3V, 5V) WATCHDOG TIMER FREQUENCY METER 5 9166DS–AVR-01/12 AT32UC3C 2.2 Configuration Summary Table 2-1. Configuration Summary Feature AT32UC3C0512C AT32UC3C1512C AT32UC3C2512C Flash 512 KB 512 KB 512 KB SRAM 64KB 64KB 64KB HSB RAM EBI 4 KB 1 0 0 123 81 45 External Interrupts 8 8 8 TWI 3 3 2 USART 5 5 4 Peripheral DMA Channels 16 16 16 Peripheral Event System 1 1 1 SPI 2 2 1 CAN channels 2 2 2 USB 1 1 1 1 RMII/MII 1 RMII/MII 1 RMII only I2S 1 1 1 Asynchronous Timers 1 1 1 Timer/Counter Channels 6 6 3 GPIO Ethernet MAC 10/100 PWM channels QDEC 4x2 2 2 Frequency Meter 1 Watchdog Timer 1 Power Manager 1 1 PLL 80-240 MHz (PLL0/PLL1) Crystal Oscillator 0.4-20 MHz (OSC0) Crystal Oscillator 32 KHz (OSC32K) RC Oscillator 115 kHz (RCSYS) RC Oscillator 8 MHz (RC8M) RC Oscillator 120 MHz (RC120M) Oscillators 0.4-20 MHz (OSC1) - 12-bit ADC number of channels 1 16 1 16 1 11 12-bit DAC number of channels 1 4 1 4 1 2 Analog Comparators 4 4 2 JTAG 1 6 9166DS–AVR-01/12 AT32UC3C Table 2-1. Configuration Summary Feature AT32UC3C0512C aWire AT32UC3C2512C 1 Max Frequency Package AT32UC3C1512C 50 MHz LQFP144 TQFP100 TQFP64/QFN64 7 9166DS–AVR-01/12 AT32UC3C 3. Package and Pinout 3.1 Package The device pins are multiplexed with peripheral functions as described in Table 3-1 on page 11. QFN64/TQFP64 Pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PD01 PD00 PC22 PC21 PC20 PC19 PC18 PC17 PC16 PC15 PC05 PC04 GNDIO2 VDDIO2 PC03 PC02 Figure 3-1. PD02 PD03 VDDIO3 GNDIO3 PD11 PD12 PD13 PD14 PD21 PD27 PD28 PD29 PD30 PB00 PB01 RESET_N 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 PB31 PB30 GNDCORE VDDCORE VDDIN_33 VDDIN_5 GNDPLL DP DM VBUS PA23 PA22 PA21 PA20 VDDANA GNDANA 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA19 ADCVREFN ADCVREFP PA16 PA09 PA08 PA07 PA06 PA05 PA04 GNDIO1 VDDIO1 PA03 PA02 PA01 PA00 Note: on QFN packages, the exposed pad is unconnected. 8 9166DS–AVR-01/12 AT32UC3C TQFP100 Pinout 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PD01 PD00 PC31 PC24 PC23 PC22 PC21 PC20 PC19 PC18 PC17 PC16 PC15 PC14 PC13 PC12 PC11 PC07 PC06 PC05 PC04 GNDIO2 VDDIO2 PC03 PC02 Figure 3-2. PD02 PD03 PD07 PD08 PD09 PD10 VDDIO3 GNDIO3 PD11 PD12 PD13 PD14 PD21 PD22 PD23 PD24 PD27 PD28 PD29 PD30 PB00 PB01 RESET_N PB02 PB03 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 PC01 PC00 PB31 PB30 PB23 PB22 PB21 PB20 PB19 GNDCORE VDDCORE VDDIN_33 VDDIN_5 GNDPLL DP DM VBUS PA25 PA24 PA23 PA22 PA21 PA20 VDDANA GNDANA 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA19 ADCVREFN ADCVREFP PA16 PA15 PA14 PA13 PA12 PA11 PA10 PA09 PA08 PA07 PA06 PA05 PA04 PB06 PB05 PB04 GNDIO1 VDDIO1 PA03 PA02 PA01 PA00 9 9166DS–AVR-01/12 AT32UC3C LQFP144 Pinout 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 PD01 PD00 PC31 PC30 GNDIO3 VDDIO3 PC29 PC28 PC27 PC26 PC25 PC24 PC23 PC22 PC21 PC20 PC19 PC18 PC17 PC16 PC15 PC14 PC13 PC12 PC11 PC10 PC09 PC08 PC07 PC06 PC05 PC04 GNDIO2 VDDIO2 PC03 PC02 Figure 3-3. PD02 PD03 PD04 PD05 PD06 PD07 PD08 PD09 PD10 VDDIO3 GNDIO3 PD11 PD12 PD13 PD14 PD15 PD16 PD17 PD18 PD19 PD20 PD21 PD22 PD23 PD24 PD25 PD26 PD27 PD28 PD29 PD30 PB00 PB01 RESET_N PB02 PB03 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 PC01 PC00 PB31 PB30 PB29 PB28 PB27 PB26 PB25 PB24 PB23 PB22 PB21 PB20 PB19 PB18 GNDCORE VDDCORE VDDIN_33 VDDIN_5 GNDPLL DP DM VBUS PA29 PA28 PA27 PA26 PA25 PA24 PA23 PA22 PA21 PA20 VDDANA GNDANA 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA19 ADCVREFN ADCVREFP PA16 PA15 PA14 PA13 PA12 PA11 PA10 PA09 PA08 PA07 PA06 PA05 PA04 PB17 PB16 PB15 PB14 PB13 PB12 PB11 PB10 PB09 PB08 PB07 PB06 PB05 PB04 GNDIO1 VDDIO1 PA03 PA02 PA01 PA00 10 9166DS–AVR-01/12 AT32UC3C 3.2 Peripheral Multiplexing on I/O lines 3.2.1 Multiplexed Signals Each GPIO line can be assigned to one of the peripheral functions. The following table describes the peripheral signals multiplexed to the GPIO lines. Table 3-1. GPIO Controller Function Multiplexing TQFP P QFN TQFP LQFP 64 100 144 1 1 1 GPIO function G / Pin Type PIN I O Supply (1) PA00 0 VDDIO1 x1/x2 CANIF TXLINE[1] x1/x2 CANIF RXLINE[1] A VDDIO1 2 2 2 PA01 1 VDDIO1 3 3 3 PA02 2 4 4 4 PA03 3 7 10 21 PA04 4 8 11 22 PA05 5 12 23 PA06 6 C x1/x2 SCIF GCLK[1] EIC EXTINT[1] VDDANA x1/x2 ADCIN0 USBC - ID ACIFA0 ACAOUT VDDANA x1/x2 ADCIN1 USBC VBOF ACIFA0 ACBOUT AC1AP1 PEVC PAD_EVT [2] x1/x2 ADCIN2 10 13 24 PA07 7 VDDANA x1/x2 ADCIN3 AC1AN1 PEVC PAD_EVT [3] 11 14 25 PA08 8 VDDANA x1/x2 ADCIN4 AC1BP1 EIC EXTINT[2] 12 15 26 PA09 9 VDDANA x1/x2 ADCIN5 AC1BN1 ADCIN6 EIC EXTINT[4] PEVC PAD_EVT [13] 16 27 PA10 10 VDDANA x1/x2 E F PEVC PAD_EVT [1] x1/x2 VDDANA D PEVC PAD_EVT [0] SCIF GCLK[0] VDDIO1 9 B 17 28 PA11 11 VDDANA x1/x2 ADCIN7 ADCREF1 PEVC PAD_EVT [14] 18 29 PA12 12 VDDANA x1/x2 AC1AP0 SPI0 NPCS[0] AC1AP0 or DAC1A 19 30 PA13 13 VDDANA x1/x2 AC1AN0 SPI0 NPCS[1] ADCIN15 20 31 PA14 14 VDDANA x1/x2 AC1BP0 SPI1 NPCS[0] 21 32 PA15 15 VDDANA x1/x2 AC1BN0 SPI1 NPCS[1] 13 22 33 PA16 16 VDDANA x1/x2 ADCREF0 14 23 34 ADC REFP 15 24 35 ADC REFN AC1BN0 or DAC1B DACREF 11 9166DS–AVR-01/12 AT32UC3C Table 3-1. GPIO Controller Function Multiplexing TQFP P QFN TQFP LQFP 64 100 144 16 25 19 20 21 22 62 63 GPIO function G / Pin Type PIN I O Supply (1) A B 36 PA19 19 VDDANA x1/x2 ADCIN8 EIC EXTINT[1] 28 39 PA20 20 VDDANA x1/x2 ADCIN9 AC0AP0 AC0AP0 or DAC0A 29 40 PA21 21 VDDANA x1/x2 ADCIN10 AC0BN0 AC0BN0 or DAC0B AC0AN0 PEVC PAD_EVT [4] MACB SPEED PEVC PAD_EVT [5] MACB WOL 30 41 PA22 22 VDDANA x1/x2 ADCIN11 31 42 PA23 23 VDDANA x1/x2 ADCIN12 AC0BP0 32 43 PA24 24 VDDANA x1/x2 ADCIN13 SPI1 NPCS[2] 33 44 PA25 25 VDDANA x1/x2 ADCIN14 SPI1 NPCS[3] 45 PA26 26 VDDANA x1/x2 AC0AP1 EIC EXTINT[1] 46 PA27 27 VDDANA x1/x2 AC0AN1 EIC EXTINT[2] 47 PA28 28 VDDANA x1/x2 AC0BP1 EIC EXTINT[3] 48 PA29 29 VDDANA x1/x2 AC0BN1 EIC EXTINT[0] x1 USART0 CLK CANIF RXLINE[1] 96 97 99 140 141 143 PB00 PB01 PB02 32 33 34 VDDIO1 VDDIO1 VDDIO1 C E EIC EXTINT[8] PEVC PAD_EVT [10] PEVC PAD_EVT [11] x1 USBC - ID PEVC PAD_EVT [6] USBC VBOF PEVC PAD_EVT [7] TC1 - A1 100 144 PB03 35 VDDIO1 x1 7 7 PB04 36 VDDIO1 x1/x2 SPI1 MOSI CANIF RXLINE[0] QDEC1 QEPI CANIF TXLINE[0] PEVC PAD_EVT [12] USART3 CLK MACB TXD[3] QDEC1 QEPA USART1 CLK MACB TX_ER MACB TXD[2] 8 8 PB05 37 VDDIO1 x1/x2 SPI1 MISO 9 9 PB06 38 VDDIO1 x2/x4 SPI1 SCK 10 PB07 39 VDDIO1 x1/x2 SPI1 NPCS[0] EIC EXTINT[2] QDEC1 QEPB MACB RX_DV PEVC PAD_EVT [1] PWM PWML[0] MACB RXD[0] PWM PWMH[0] MACB RXD[1] 11 PB08 40 VDDIO1 x1/x2 SPI1 NPCS[1] 12 PB09 41 VDDIO1 x1/x2 SPI1 NPCS[2] 13 PB10 42 VDDIO1 x1/x2 USART1 DTR SPI0 MOSI F EIC EXTINT[0] CANIF TXLINE[1] x1 D PWM PWML[1] 12 9166DS–AVR-01/12 AT32UC3C Table 3-1. GPIO Controller Function Multiplexing TQFP GPIO function G / P QFN TQFP LQFP 64 100 144 Pin Type PIN I O Supply (1) 14 PB11 43 VDDIO1 15 PB12 44 16 PB13 17 18 19 A B C x1/x2 USART1 DSR SPI0 MISO PWM PWMH[1] VDDIO1 x1/x2 USART1 DCD SPI0 SCK PWM PWML[2] 45 VDDIO1 x1/x2 USART1 RI SPI0 NPCS[0] PWM PWMH[2] MACB RX_ER PB14 46 VDDIO1 x1/x2 USART1 RTS SPI0 NPCS[1] PWM PWML[3] MACB MDC PB15 47 VDDIO1 x1/x2 USART1 CTS USART1 CLK PWM PWMH[3] MACB MDIO x1/x2 USART1 RXD SPI0 NPCS[2] PWM EXT_ FAULTS[0] CANIF RXLINE[0] SPI0 NPCS[3] PWM EXT_ FAULTS[1] CANIF TXLINE[0] PB16 48 VDDIO1 D E 20 PB17 49 VDDIO1 x1/x2 USART1 TXD 57 PB18 50 VDDIO2 x1/x2 TC0 CLK2 42 58 PB19 51 VDDIO2 x1/x2 TC0 - A0 SPI1 MOSI IISC ISDO 43 59 PB20 52 VDDIO2 x1/x2 TC0 - B0 SPI1 MISO IISC - ISDI ACIFA1 ACAOUT MACB COL 44 60 PB21 53 VDDIO2 x2/x4 TC0 CLK1 SPI1 SCK IISC IMCK ACIFA1 ACBOUT MACB RXD[2] 45 61 PB22 54 VDDIO2 x1/x2 TC0 - A1 SPI1 NPCS[3] IISC ISCK SCIF GCLK[0] MACB RXD[3] 46 62 PB23 55 VDDIO2 x1/x2 TC0 - B1 SPI1 NPCS[2] IISC - IWS SCIF GCLK[1] MACB RX_CLK 63 PB24 56 VDDIO2 x1/x2 TC0 CLK0 SPI1 NPCS[1] TC0 - A2 SPI1 NPCS[0] PEVC PAD_EVT [8] x2/x4 TC0 - B2 SPI1 SCK PEVC PAD_EVT [9] x1/x2 QDEC0 QEPA SPI1 MISO PEVC PAD_EVT [10] TC1 CLK0 MACB TXD[0] x1/x2 QDEC0 QEPB SPI1 MOSI PEVC PAD_EVT [11] TC1 - B0 MACB TXD[1] QDEC0 QEPI SPI0 NPCS[0] PEVC PAD_EVT [12] TC1 - A0 64 65 66 67 PB25 PB26 PB27 PB28 57 58 59 60 VDDIO2 VDDIO2 VDDIO2 VDDIO2 x1/x2 68 PB29 61 VDDIO2 x1/x2 F EIC EXTINT[4] MACB CRS MACB TX_EN 31 47 69 PB30 62 VDDIO2 x1 32 48 70 PB31 63 VDDIO2 x1 49 71 PC00 64 VDDIO2 x1/x2 USBC - ID SPI0 NPCS[1] USART2 CTS TC1 - B2 CANIF TXLINE[1] 50 72 PC01 65 VDDIO2 x1/x2 USBC VBOF SPI0 NPCS[2] USART2 RTS TC1 - A2 CANIF RXLINE[1] 13 9166DS–AVR-01/12 AT32UC3C Table 3-1. GPIO Controller Function Multiplexing TQFP P QFN TQFP LQFP 64 100 144 33 51 34 37 38 GPIO function G / Pin Type PIN I O Supply (1) 73 PC02 66 VDDIO2 52 74 PC03 67 55 77 PC04 68 56 57 58 78 79 80 81 82 PC05 PC06 PC07 PC08 PC09 69 70 71 72 73 A B C D E x1 TWIMS0 TWD SPI0 NPCS[3] USART2 RXD TC1 CLK1 MACB MDC VDDIO2 x1 TWIMS0 TWCK EIC EXTINT[1] USART2 TXD TC1 - B1 MACB MDIO VDDIO2 x1 TWIMS1 TWD EIC EXTINT[3] USART2 TXD TC0 - B1 x1 TWIMS1 TWCK EIC EXTINT[4] USART2 RXD TC0 - A2 x1 PEVC PAD_EVT [15] USART2 CLK USART2 CTS TC0 CLK2 TWIMS2 TWD TWIMS0 TWALM x1 PEVC PAD_EVT [2] EBI NCS[3] USART2 RTS TC0 - B2 TWIMS2 TWCK TWIMS1 TWALM x1/x2 PEVC PAD_EVT [13] SPI1 NPCS[1] EBI NCS[0] USART4 TXD x1/x2 PEVC PAD_EVT [14] SPI1 NPCS[2] EBI ADDR[23] USART4 RXD SPI1 NPCS[3] EBI ADDR[22] VDDIO2 VDDIO2 VDDIO2 VDDIO2 VDDIO2 F 83 PC10 74 VDDIO2 x1/x2 PEVC PAD_EVT [15] 59 84 PC11 75 VDDIO2 x1/x2 PWM PWMH[3] CANIF RXLINE[1] EBI ADDR[21] TC0 CLK0 60 85 PC12 76 VDDIO2 x1/x2 PWM PWML[3] CANIF TXLINE[1] EBI ADDR[20] USART2 CLK 61 86 PC13 77 VDDIO2 x1/x2 PWM PWMH[2] EIC EXTINT[7] 62 87 PC14 78 VDDIO2 x1/x2 PWM PWML[2] USART0 CLK EBI SDCKE USART0 CTS 39 63 88 PC15 79 VDDIO2 x1/x2 PWM PWMH[1] SPI0 NPCS[0] EBI SDWE USART0 RXD CANIF RXLINE[1] 40 64 89 PC16 80 VDDIO2 x1/x2 PWM PWML[1] SPI0 NPCS[1] EBI - CAS USART0 TXD CANIF TXLINE[1] 41 65 90 PC17 81 VDDIO2 x1/x2 PWM PWMH[0] SPI0 NPCS[2] EBI - RAS IISC ISDO USART3 TXD 42 66 91 PC18 82 VDDIO2 x1/x2 PWM PWML[0] EIC EXTINT[5] EBI SDA10 IISC ISDI USART3 RXD 43 67 92 PC19 83 VDDIO3 x1/x2 PWM PWML[2] SCIF GCLK[0] EBI DATA[0] IISC IMCK USART3 CTS 44 68 93 PC20 84 VDDIO3 x1/x2 PWM PWMH[2] SCIF GCLK[1] EBI DATA[1] IISC ISCK USART3 RTS x1/x2 PWM EXT_ FAULTS[0] CANIF RXLINE[0] EBI DATA[2] IISC - IWS x1/x2 PWM EXT_ FAULTS[1] CANIF TXLINE[0] EBI DATA[3] x1/x2 QDEC1 QEPB CANIF RXLINE[1] EBI DATA[4] 45 46 69 70 71 94 95 96 PC21 PC22 PC23 85 86 87 VDDIO3 VDDIO3 VDDIO3 USART0 RTS USART3 CLK PEVC PAD_EVT [3] 14 9166DS–AVR-01/12 AT32UC3C Table 3-1. GPIO Controller Function Multiplexing TQFP GPIO function G / P QFN TQFP LQFP 64 100 144 72 PIN I O Pin Type Supply (1) A B C D E QDEC1 QEPA CANIF TXLINE[1] EBI DATA[5] PEVC PAD_EVT [4] TC1 CLK2 EBI DATA[6] SCIF GCLK[0] USART4 TXD TC1 - B2 EBI DATA[7] SCIF GCLK[1] USART4 RXD TC1 - A2 EBI DATA[8] EIC EXTINT[0] USART4 CTS 97 PC24 88 VDDIO3 x1/x2 98 PC25 89 VDDIO3 x1/x2 99 PC26 90 VDDIO3 x1/x2 100 PC27 91 VDDIO3 x1/x2 101 PC28 92 VDDIO3 x1/x2 SPI1 NPCS[3] TC1 CLK1 EBI DATA[9] 102 PC29 93 VDDIO3 x1/x2 SPI0 NPCS[1] TC1 - B1 EBI DATA[10] 105 PC30 94 VDDIO3 x1/x2 SPI0 NPCS[2] TC1 - A1 EBI DATA[11] TC1 - B0 EBI DATA[12] PEVC PAD_EVT [5] USART4 CLK QDEC1 QEPI USART4 RTS 73 106 PC31 95 VDDIO3 x1/x2 SPI0 NPCS[3] 47 74 107 PD00 96 VDDIO3 x1/x2 SPI0 MOSI TC1 CLK0 EBI DATA[13] QDEC0 QEPI USART0 TXD 48 75 108 PD01 97 VDDIO3 x1/x2 SPI0 MISO TC1 - A0 EBI DATA[14] TC0 CLK1 USART0 RXD 49 76 109 PD02 98 VDDIO3 x2/x4 SPI0 SCK TC0 CLK2 EBI DATA[15] QDEC0 QEPA 50 77 110 PD03 99 VDDIO3 x1/x2 SPI0 NPCS[0] TC0 - B2 EBI ADDR[0] QDEC0 QEPB 111 PD04 100 VDDIO3 x1/x2 SPI0 MOSI EBI ADDR[1] 112 PD05 101 VDDIO3 x1/x2 SPI0 MISO EBI ADDR[2] 113 PD06 102 VDDIO3 x2/x4 SPI0 SCK EBI ADDR[3] 78 114 PD07 103 VDDIO3 x1/x2 USART1 DTR EIC EXTINT[5] EBI ADDR[4] QDEC0 QEPI USART4 TXD 79 115 PD08 104 VDDIO3 x1/x2 USART1 DSR EIC EXTINT[6] EBI ADDR[5] TC1 CLK2 USART4 RXD 80 116 PD09 105 VDDIO3 x1/x2 USART1 DCD CANIF RXLINE[0] EBI ADDR[6] QDEC0 QEPA USART4 CTS 81 117 PD10 106 VDDIO3 x1/x2 USART1 RI CANIF TXLINE[0] EBI ADDR[7] QDEC0 QEPB USART4 RTS x1/x2 USART1 TXD USBC - ID EBI ADDR[8] PEVC PAD_EVT [6] MACB TXD[0] x1/x2 USART1 RXD USBC VBOF EBI ADDR[9] PEVC PAD_EVT [7] MACB TXD[1] x2/x4 USART1 CTS USART1 CLK EBI SDCK PEVC PAD_EVT [8] MACB RXD[0] x1/x2 USART1 RTS EIC EXTINT[7] EBI ADDR[10] PEVC PAD_EVT [9] MACB RXD[1] 53 54 55 56 84 85 86 87 120 121 122 123 PD11 PD12 PD13 PD14 107 108 109 110 VDDIO3 VDDIO3 VDDIO3 VDDIO3 F 15 9166DS–AVR-01/12 AT32UC3C Table 3-1. GPIO Controller Function Multiplexing TQFP P QFN TQFP LQFP 64 100 144 57 GPIO function G / Pin Type PIN I O Supply (1) A B C 124 PD15 111 VDDIO3 x1/x2 TC0 - A0 USART3 TXD EBI ADDR[11] 125 PD16 112 VDDIO3 x1/x2 TC0 - B0 USART3 RXD EBI ADDR[12] 126 PD17 113 VDDIO3 x1/x2 TC0 - A1 USART3 CTS EBI ADDR[13] 127 PD18 114 VDDIO3 x1/x2 TC0 - B1 USART3 RTS EBI ADDR[14] 128 PD19 115 VDDIO3 x1/x2 TC0 - A2 EBI ADDR[15] 129 PD20 116 VDDIO3 x1/x2 TC0 - B2 EBI ADDR[16] 88 130 PD21 117 VDDIO3 x1/x2 USART3 TXD EIC EXTINT[0] EBI ADDR[17] QDEC1 QEPI 89 131 PD22 118 VDDIO1 x1/x2 USART3 RXD TC0 - A2 EBI ADDR[18] SCIF GCLK[0] 90 132 PD23 119 VDDIO1 x1/x2 USART3 CTS USART3 CLK EBI ADDR[19] QDEC1 QEPA 91 133 PD24 120 VDDIO1 x1/x2 USART3 RTS EIC EXTINT[8] EBI NWE1 QDEC1 QEPB 134 PD25 121 VDDIO1 x1/x2 TC0 CLK0 USBC - ID EBI NWE0 135 PD26 122 VDDIO1 x1/x2 TC0 CLK1 USBC VBOF EBI - NRD D E USART3 CLK USART4 CLK 58 92 136 PD27 123 VDDIO1 x1/x2 USART0 TXD CANIF RXLINE[0] EBI NCS[1] TC0 - A0 MACB RX_ER 59 93 137 PD28 124 VDDIO1 x1/x2 USART0 RXD CANIF TXLINE[0] EBI NCS[2] TC0 - B0 MACB RX_DV 60 94 138 PD29 125 VDDIO1 x1/x2 USART0 CTS EIC EXTINT[6] USART0 CLK TC0 CLK0 MACB TX_CLK 61 95 139 PD30 126 VDDIO1 x1/x2 USART0 RTS EIC EXTINT[3] EBI NWAIT TC0 - A1 MACB TX_EN Note: F 1. Pin type x1 is pin with drive strength of x1. Pin type x1/x2 is pin with programmable drive strength of x1 or x2. Pin type x2/x4 is pin with programmable drive strength of x2 or x4. The drive strength is programmable through ODCR0, ODCR0S, ODCR0C, ODCR0T registers of GPIO. Refer to ”Electrical Characteristics” on page 49 for a description of the electrical properties of the pin types used. See Section 3.3 for a description of the various peripheral signals. 16 9166DS–AVR-01/12 AT32UC3C 3.2.2 Peripheral Functions Each GPIO line can be assigned to one of several peripheral functions. The following table describes how the various peripheral functions are selected. The last listed function has priority in case multiple functions are enabled on the same pin. Table 3-2. 3.2.3 Peripheral Functions Function Description GPIO Controller Function multiplexing GPIO and GPIO peripheral selection A to F Nexus OCD AUX port connections OCD trace system aWire DATAOUT aWire output in two-pin mode JTAG port connections JTAG debug port Oscillators OSC0, OSC32 Oscillator Pinout The oscillators are not mapped to the normal GPIO functions and their muxings are controlled by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more information about this. Table 3-3. Oscillator pinout QFN64/ TQFP64 pin TQFP100 pin LQFP144 pin Pad Oscillator pin 31 47 69 PB30 xin0 99 143 PB02 xin1 62 96 140 PB00 xin32 32 48 70 PB31 xout0 100 144 PB03 xout1 97 141 PB01 xout32 63 3.2.4 JTAG port connections If the JTAG is enabled, the JTAG will take control over a number of pins, irrespectively of the I/O Controller configuration. Table 3-4. 3.2.5 JTAG pinout QFN64/ TQFP64 pin TQFP100 pin LQFP144 pin Pin name JTAG pin 2 2 2 PA01 TDI 3 3 3 PA02 TDO 4 4 4 PA03 TMS 1 1 1 PA00 TCK Nexus OCD AUX port connections If the OCD trace system is enabled, the trace system will take control over a number of pins, irrespectively of the GPIO configuration. Three different OCD trace pin mappings are possible, 17 9166DS–AVR-01/12 AT32UC3C depending on the configuration of the OCD AXS register. For details, see the AVR32UC Technical Reference Manual. Table 3-5. 3.2.6 Pin AXS=0 AXS=1 AXS=2 EVTI_N PA08 PB19 PA10 MDO[5] PC05 PC31 PB06 MDO[4] PC04 PC12 PB15 MDO[3] PA23 PC11 PB14 MDO[2] PA22 PB23 PA27 MDO[1] PA19 PB22 PA26 MDO[0] PA09 PB20 PA19 EVTO_N PD29 PD29 PD29 MCKO PD13 PB21 PB26 MSEO[1] PD30 PD08 PB25 MSEO[0] PD14 PD07 PB18 Other Functions The functions listed in Table 3-6 are not mapped to the normal GPIO functions. The aWire DATA pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be active after the aWire is enabled and the 2_PIN_MODE command has been sent. Table 3-6. 3.3 Nexus OCD AUX port connections Other Functions QFN64/ TQFP64 pin TQFP100 pin LQFP144 pin Pad Oscillator pin 64 98 142 RESET_N aWire DATA 3 3 3 PA02 aWire DATAOUT Signals Description The following table give details on the signal name classified by peripherals. Table 3-7. Signal Name Signal Description List Function Type Active Level Comments Power VDDIO1 VDDIO2 VDDIO3 I/O Power Supply Power Input 4.5V to 5.5V or 3.0V to 3.6 V VDDANA Analog Power Supply Power Input 4.5V to 5.5V or 3.0V to 3.6 V 18 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Active Level Function Type 1.8V Voltage Regulator Input Power Input Power Supply: 4.5V to 5.5V or 3.0V to 3.6 V VDDIN_33 USB I/O power supply Power Output/ Input Capacitor Connection for the 3.3V voltage regulator or power supply: 3.0V to 3.6 V VDDCORE 1.8V Voltage Regulator Output Power output Capacitor Connection for the 1.8V voltage regulator GNDIO1 GNDIO2 GNDIO3 I/O Ground Ground GNDANA Analog Ground Ground GNDCORE Ground of the core Ground GNDPLL Ground of the PLLs Ground VDDIN_5 Comments Analog Comparator Interface - ACIFA0/1 AC0AN1/AC0AN0 Negative inputs for comparator AC0A Analog AC0AP1/AC0AP0 Positive inputs for comparator AC0A Analog AC0BN1/AC0BN0 Negative inputs for comparator AC0B Analog AC0BP1/AC0BP0 Positive inputs for comparator AC0B Analog AC1AN1/AC1AN0 Negative inputs for comparator AC1A Analog AC1AP1/AC1AP0 Positive inputs for comparator AC1A Analog AC1BN1/AC1BN0 Negative inputs for comparator AC1B Analog AC1BP1/AC1BP0 Positive inputs for comparator AC1B Analog ACAOUT/ACBOUT analog comparator outputs output ADC Interface - ADCIFA ADCIN[15:0] ADC input pins Analog ADCREF0 Analog positive reference 0 voltage input Analog ADCREF1 Analog positive reference 1 voltage input Analog ADCVREFP Analog positive reference connected to external capacitor Analog 19 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Function Type ADCVREFN Analog negative reference connected to external capacitor Active Level Comments Analog Auxiliary Port - AUX MCKO Trace Data Output Clock Output MDO[5:0] Trace Data Output Output MSEO[1:0] Trace Frame Control Output EVTI_N Event In Output Low EVTO_N Event Out Output Low aWire - AW DATA aWire data I/O DATAOUT aWire data output for 2-pin mode I/O Controller Area Network Interface - CANIF RXLINE[1:0] CAN channel rxline I/O TXLINE[1:0] CAN channel txline I/O DAC Interface - DACIFB0/1 DAC0A, DAC0B DAC0 output pins of S/H A Analog DAC1A, DAC1B DAC output pins of S/H B Analog DACREF Analog reference voltage input Analog External Bus Interface - EBI ADDR[23:0] Address Bus Output CAS Column Signal Output DATA[15:0] Data Bus NCS[3:0] Chip Select Output Low NRD Read Signal Output Low NWAIT External Wait Signal Input Low NWE0 Write Enable 0 Output Low NWE1 Write Enable 1 Output Low RAS Row Signal Output Low SDA10 SDRAM Address 10 Line Output Low I/O 20 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Function Type SDCK SDRAM Clock Output SDCKE SDRAM Clock Enable Output SDWE SDRAM Write Enable Output Active Level Comments Low External Interrupt Controller - EIC EXTINT[8:1] External Interrupt Pins Input NMI_N = EXTINT[0] Non-Maskable Interrupt Pin Input Low General Purpose Input/Output - GPIOA, GPIOB, GPIOC, GPIOD PA[29:19] - PA[16:0] Parallel I/O Controller GPIOA I/O PB[31:0] Parallel I/O Controller GPIOB I/O PC[31:0] Parallel I/O Controller GPIOC I/O PD[30:0] Parallel I/O Controller GPIOD I/O Inter-IC Sound (I2S) Controller - IISC IMCK I2S Master Clock Output ISCK I2S Serial Clock I/O ISDI I2S Serial Data In ISDO I2S Serial Data Out IWS I2S Word Select Input Output I/O JTAG TCK Test Clock Input TDI Test Data In Input TDO Test Data Out TMS Test Mode Select Output Input Ethernet MAC - MACB COL Collision Detect Input CRS Carrier Sense and Data Valid Input MDC Management Data Clock MDIO Management Data Input/Output RXD[3:0] Receive Data Output I/O Input 21 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Function Type RX_CLK Receive Clock Input RX_DV Receive Data Valid Input RX_ER Receive Coding Error Input SPEED Speed Output TXD[3:0] Transmit Data Output TX_CLK Transmit Clock or Reference Clock TX_EN Transmit Enable Output TX_ER Transmit Coding Error Output WOL Wake-On-LAN Output Active Level Comments Input Peripheral Event Controller - PEVC PAD_EVT[15:0] Event Input Pins Input Power Manager - PM RESET_N Reset Pin Input Low Pulse Width Modulator - PWM PWMH[3:0] PWML[3:0] PWM Output Pins EXT_FAULT[1:0] PWM Fault Input Pins Output Input Quadrature Decoder- QDEC0/QDEC1 QEPA QEPA quadrature input Input QEPB QEPB quadrature input Input QEPI Index input Input System Controller Interface- SCIF XIN0, XIN1, XIN32 Crystal 0, 1, 32K Inputs Analog XOUT0, XOUT1, XOUT32 Crystal 0, 1, 32K Output Analog GCLK0 - GCLK1 Generic Clock Pins Output Serial Peripheral Interface - SPI0, SPI1 MISO Master In Slave Out I/O MOSI Master Out Slave In I/O 22 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Function NPCS[3:0] SPI Peripheral Chip Select SCK Clock Type Active Level I/O Low Comments Output Timer/Counter - TC0, TC1 A0 Channel 0 Line A I/O A1 Channel 1 Line A I/O A2 Channel 2 Line A I/O B0 Channel 0 Line B I/O B1 Channel 1 Line B I/O B2 Channel 2 Line B I/O CLK0 Channel 0 External Clock Input Input CLK1 Channel 1 External Clock Input Input CLK2 Channel 2 External Clock Input Input Two-wire Interface - TWIMS0, TWIMS1, TWIMS2 TWALM SMBus SMBALERT I/O TWCK Serial Clock I/O TWD Serial Data I/O Low Only on TWIMS0, TWIMS1 Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3, USART4 CLK Clock I/O CTS Clear To Send Input Low DCD Data Carrier Detect Input Low Only USART1 DSR Data Set Ready Input Low Only USART1 DTR Data Terminal Ready Output Low Only USART1 RI Ring Indicator Input Low Only USART1 RTS Request To Send Output Low RXD Receive Data Input TXD Transmit Data Output Universal Serial Bus Device - USB DM USB Device Port Data - Analog 23 9166DS–AVR-01/12 AT32UC3C Table 3-7. Signal Description List Signal Name Function DP USB Device Port Data + Analog VBUS USB VBUS Monitor and OTG Negociation Analog Input ID ID Pin of the USB Bus Input VBOF USB VBUS On/off: bus power control port output 3.4 3.4.1 Type Active Level Comments I/O Line Considerations JTAG pins The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI pins have pull-up resistors when JTAG is enabled. The TCK pin always have pull-up enabled during reset. The TDO pin is an output, driven at VDDIO1, and has no pull-up resistor. The JTAG pins can be used as GPIO pins and muxed with peripherals when the JTAG is disabled. Please refer to Section 3.2.4 for the JTAG port connections. 3.4.2 RESET_N pin The RESET_N pin integrates a pull-up resistor to VDDIO1. As the product integrates a power-on reset cell, the RESET_N pin can be left unconnected in case no reset from the system needs to be applied to the product. The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debugging, it must not be driven by external circuitry. 3.4.3 TWI pins When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and inputs with inputs with spike-filtering. When used as GPIO-pins or used for other peripherals, the pins have the same characteristics as GPIO pins. 3.4.4 GPIO pins All I/O lines integrate programmable pull-up and pull-down resistors. Most I/O lines integrate drive strength control, see Table 3-1. Programming of this pull-up and pull-down resistor or this drive strength is performed independently for each I/O line through the GPIO Controllers. After reset, I/O lines default as inputs with pull-up/pull-down resistors disabled. After reset, output drive strength is configured to the lowest value to reduce global EMI of the device. When the I/O line is configured as analog function (ADC I/O, AC inputs, DAC I/O), the pull-up and pull-down resistors are automatically disabled. 24 9166DS–AVR-01/12 AT32UC3C 4. Processor and Architecture Rev: 2.1.2.0 This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the AVR32 architecture. A summary of the programming model, instruction set, and MPU is presented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical Reference Manual. 4.1 Features • 32-bit load/store AVR32A RISC architecture – – – – – • • • • 4.2 15 general-purpose 32-bit registers 32-bit Stack Pointer, Program Counter and Link Register reside in register file Fully orthogonal instruction set Privileged and unprivileged modes enabling efficient and secure operating systems Innovative instruction set together with variable instruction length ensuring industry leading code density – DSP extension with saturating arithmetic, and a wide variety of multiply instructions 3-stage pipeline allowing one instruction per clock cycle for most instructions – Byte, halfword, word, and double word memory access – Multiple interrupt priority levels MPU allows for operating systems with memory protection FPU enables hardware accelerated floating point calculations Secure State for supporting FlashVault technology AVR32 Architecture AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for costsensitive embedded applications, with particular emphasis on low power consumption and high code density. In addition, the instruction set architecture has been tuned to allow a variety of microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications. Through a quantitative approach, a large set of industry recognized benchmarks has been compiled and analyzed to achieve the best code density in its class. In addition to lowering the memory requirements, a compact code size also contributes to the core’s low power characteristics. The processor supports byte and halfword data types without penalty in code size and performance. Memory load and store operations are provided for byte, halfword, word, and double word data with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely linked to the architecture and is able to exploit code optimization features, both for size and speed. In order to reduce code size to a minimum, some instructions have multiple addressing modes. As an example, instructions with immediates often have a compact format with a smaller immediate, and an extended format with a larger immediate. In this way, the compiler is able to use the format giving the smallest code size. Another feature of the instruction set is that frequently used instructions, like add, have a compact format with two operands as well as an extended format with three operands. The larger format increases performance, allowing an addition and a data move in the same instruction in a 25 9166DS–AVR-01/12 AT32UC3C single cycle. Load and store instructions have several different formats in order to reduce code size and speed up execution. The register file is organized as sixteen 32-bit registers and includes the Program Counter, the Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values from function calls and is used implicitly by some instructions. 4.3 The AVR32UC CPU The AVR32UC CPU targets low- and medium-performance applications, and provides an advanced On-Chip Debug (OCD) system, no caches, and a Memory Protection Unit (MPU). A hardware Floating Point Unit (FPU) is also provided through the coprocessor instruction space. Java acceleration hardware is not implemented. AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch, one High Speed Bus master for data access, and one High Speed Bus slave interface allowing other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing. Also, power consumption is reduced by not needing a full High Speed Bus access for memory accesses. A dedicated data RAM interface is provided for communicating with the internal data RAMs. A local bus interface is provided for connecting the CPU to device-specific high-speed systems, such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated memory range allocated to it, and data transfers are performed using regular load and store instructions. Details on which devices that are mapped into the local bus space is given in the CPU Local Bus section in the Memories chapter. Figure 4-1 on page 27 displays the contents of AVR32UC. 26 9166DS–AVR-01/12 AT32UC3C OCD interface Reset interface Overview of the AVR32UC CPU Interrupt controller interface Figure 4-1. OCD system Power/ Reset control AVR32UC CPU pipeline MPU 4.3.1 High Speed Bus slave CPU Local Bus master CPU Local Bus High Speed Bus master High Speed Bus High Speed Bus High Speed Bus master High Speed Bus Data memory controller Instruction memory controller CPU RAM Pipeline Overview AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruction Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic (ALU) section, one multiply (MUL) section, and one load/store (LS) section. Instructions are issued and complete in order. Certain operations require several clock cycles to complete, and in this case, the instruction resides in the ID and EX stages for the required number of clock cycles. Since there is only three pipeline stages, no internal data forwarding is required, and no data dependencies can arise in the pipeline. Figure 4-2 on page 28 shows an overview of the AVR32UC pipeline stages. 27 9166DS–AVR-01/12 AT32UC3C Figure 4-2. The AVR32UC Pipeline MUL IF ID Prefetch unit Decode unit Regfile Read ALU LS 4.3.2 4.3.2.1 Multiply unit Regfile write ALU unit Load-store unit AVR32A Microarchitecture Compliance AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is targeted at cost-sensitive, lower-end applications like smaller microcontrollers. This microarchitecture does not provide dedicated hardware registers for shadowing of register file registers in interrupt contexts. Additionally, it does not provide hardware registers for the return address registers and return status registers. Instead, all this information is stored on the system stack. This saves chip area at the expense of slower interrupt handling. Interrupt Handling Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These registers are pushed regardless of the priority level of the pending interrupt. The return address and status register are also automatically pushed to stack. The interrupt handler can therefore use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are restored, and execution continues at the return address stored popped from stack. The stack is also used to store the status register and return address for exceptions and scall. Executing the rete or rets instruction at the completion of an exception or system call will pop this status register and continue execution at the popped return address. 4.3.2.2 Java Support AVR32UC does not provide Java hardware acceleration. 4.3.2.3 Floating Point Support A fused multiply-accumulate Floating Point Unit (FPU), performaing a multiply and accumulate as a single operation with no intermediate rounding, therby increasing precision is provided. The floating point hardware conforms to the requirements of the C standard, which is based on the IEEE 754 floating point standard. 4.3.2.4 Memory Protection The MPU allows the user to check all memory accesses for privilege violations. If an access is attempted to an illegal memory address, the access is aborted and an exception is taken. The MPU in AVR32UC is specified in the AVR32UC Technical Reference manual. 28 9166DS–AVR-01/12 AT32UC3C 4.3.2.5 Unaligned Reference Handling AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an address exception. Doubleword-sized accesses with word-aligned pointers will automatically be performed as two word-sized accesses. The following table shows the instructions with support for unaligned addresses. All other instructions require aligned addresses. Table 4-1. 4.3.2.6 Instructions with Unaligned Reference Support Instruction Supported Alignment ld.d Word st.d Word Unimplemented Instructions The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented Instruction Exception if executed: • All SIMD instructions • All coprocessor instructions if no coprocessors are present • retj, incjosp, popjc, pushjc • tlbr, tlbs, tlbw • cache 4.3.2.7 CPU and Architecture Revision Three major revisions of the AVR32UC CPU currently exist. The device described in this datasheet uses CPU revision 3. The Architecture Revision field in the CONFIG0 system register identifies which architecture revision is implemented in a specific device. AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled for revision 1 or 2 is binary-compatible with revision 3 CPUs. 29 9166DS–AVR-01/12 AT32UC3C 4.4 4.4.1 Programming Model Register File Configuration The AVR32UC register file is shown below. Figure 4-3. The AVR32UC Register File Application Supervisor INT0 Bit 31 Bit 31 Bit 31 Bit 0 Bit 0 INT1 Bit 0 INT2 Bit 31 Bit 0 INT3 Bit 31 Bit 0 Bit 31 Bit 0 Exception NMI Bit 31 Bit 31 Bit 0 Secure Bit 0 Bit 31 Bit 0 PC LR SP_APP R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SEC R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR SR SR SR SR SR SR SR SR SS_STATUS SS_ADRF SS_ADRR SS_ADR0 SS_ADR1 SS_SP_SYS SS_SP_APP SS_RAR SS_RSR 4.4.2 Status Register Configuration The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 4-4 and Figure 4-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T, and L bits, while the upper halfword contains information about the mode and state the processor executes in. Refer to the AVR32 Architecture Manual for details. Figure 4-4. The Status Register High Halfword B it 31 Bit 16 SS LC 1 - - DM D - M2 M1 M0 EM I3M I2M FE I1M I0M GM 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 Bit nam e Initial value G lobal Interrupt M ask Interrupt Level 0 M ask Interrupt Level 1 M ask Interrupt Level 2 M ask Interrupt Level 3 M ask Exception M ask M ode Bit 0 M ode Bit 1 M ode Bit 2 R eserved D ebug State D ebug State M ask R eserved Secure State 30 9166DS–AVR-01/12 AT32UC3C Figure 4-5. The Status Register Low Halfword Bit 15 Bit 0 - T - - - - - - - - L Q V N Z C Bit name 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Initial value Carry Zero Sign Overflow Saturation Lock Reserved Scratch Reserved 4.4.3 4.4.3.1 Processor States Normal RISC State The AVR32 processor supports several different execution contexts as shown in Table 4-2. Table 4-2. Overview of Execution Modes, their Priorities and Privilege Levels. Priority Mode Security Description 1 Non Maskable Interrupt Privileged Non Maskable high priority interrupt mode 2 Exception Privileged Execute exceptions 3 Interrupt 3 Privileged General purpose interrupt mode 4 Interrupt 2 Privileged General purpose interrupt mode 5 Interrupt 1 Privileged General purpose interrupt mode 6 Interrupt 0 Privileged General purpose interrupt mode N/A Supervisor Privileged Runs supervisor calls N/A Application Unprivileged Normal program execution mode Mode changes can be made under software control, or can be caused by external interrupts or exception processing. A mode can be interrupted by a higher priority mode, but never by one with lower priority. Nested exceptions can be supported with a minimal software overhead. When running an operating system on the AVR32, user processes will typically execute in the application mode. The programs executed in this mode are restricted from executing certain instructions. Furthermore, most system registers together with the upper halfword of the status register cannot be accessed. Protected memory areas are also not available. All other operating modes are privileged and are collectively called System Modes. They have full access to all privileged and unprivileged resources. After a reset, the processor will be in supervisor mode. 4.4.3.2 Debug State The AVR32 can be set in a debug state, which allows implementation of software monitor routines that can read out and alter system information for use during application development. This implies that all system and application registers, including the status registers and program counters, are accessible in debug state. The privileged instructions are also available. All interrupt levels are by default disabled when debug state is entered, but they can individually be switched on by the monitor routine by clearing the respective mask bit in the status register. 31 9166DS–AVR-01/12 AT32UC3C Debug state can be entered as described in the AVR32UC Technical Reference Manual. Debug state is exited by the retd instruction. 4.4.3.3 4.4.4 Secure State The AVR32 can be set in a secure state, that allows a part of the code to execute in a state with higher security levels. The rest of the code can not access resources reserved for this secure code. Secure State is used to implement FlashVault technology. Refer to the AVR32UC Technical Reference Manual for details. System Registers The system registers are placed outside of the virtual memory space, and are only accessible using the privileged mfsr and mtsr instructions. The table below lists the system registers specified in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is responsible for maintaining correct sequencing of any instructions following a mtsr instruction. For detail on the system registers, refer to the AVR32UC Technical Reference Manual. Table 4-3. System Registers Reg # Address Name Function 0 0 SR Status Register 1 4 EVBA Exception Vector Base Address 2 8 ACBA Application Call Base Address 3 12 CPUCR CPU Control Register 4 16 ECR Exception Cause Register 5 20 RSR_SUP Unused in AVR32UC 6 24 RSR_INT0 Unused in AVR32UC 7 28 RSR_INT1 Unused in AVR32UC 8 32 RSR_INT2 Unused in AVR32UC 9 36 RSR_INT3 Unused in AVR32UC 10 40 RSR_EX Unused in AVR32UC 11 44 RSR_NMI Unused in AVR32UC 12 48 RSR_DBG Return Status Register for Debug mode 13 52 RAR_SUP Unused in AVR32UC 14 56 RAR_INT0 Unused in AVR32UC 15 60 RAR_INT1 Unused in AVR32UC 16 64 RAR_INT2 Unused in AVR32UC 17 68 RAR_INT3 Unused in AVR32UC 18 72 RAR_EX Unused in AVR32UC 19 76 RAR_NMI Unused in AVR32UC 20 80 RAR_DBG Return Address Register for Debug mode 21 84 JECR Unused in AVR32UC 22 88 JOSP Unused in AVR32UC 23 92 JAVA_LV0 Unused in AVR32UC 32 9166DS–AVR-01/12 AT32UC3C Table 4-3. System Registers (Continued) Reg # Address Name Function 24 96 JAVA_LV1 Unused in AVR32UC 25 100 JAVA_LV2 Unused in AVR32UC 26 104 JAVA_LV3 Unused in AVR32UC 27 108 JAVA_LV4 Unused in AVR32UC 28 112 JAVA_LV5 Unused in AVR32UC 29 116 JAVA_LV6 Unused in AVR32UC 30 120 JAVA_LV7 Unused in AVR32UC 31 124 JTBA Unused in AVR32UC 32 128 JBCR Unused in AVR32UC 33-63 132-252 Reserved Reserved for future use 64 256 CONFIG0 Configuration register 0 65 260 CONFIG1 Configuration register 1 66 264 COUNT Cycle Counter register 67 268 COMPARE Compare register 68 272 TLBEHI Unused in AVR32UC 69 276 TLBELO Unused in AVR32UC 70 280 PTBR Unused in AVR32UC 71 284 TLBEAR Unused in AVR32UC 72 288 MMUCR Unused in AVR32UC 73 292 TLBARLO Unused in AVR32UC 74 296 TLBARHI Unused in AVR32UC 75 300 PCCNT Unused in AVR32UC 76 304 PCNT0 Unused in AVR32UC 77 308 PCNT1 Unused in AVR32UC 78 312 PCCR Unused in AVR32UC 79 316 BEAR Bus Error Address Register 80 320 MPUAR0 MPU Address Register region 0 81 324 MPUAR1 MPU Address Register region 1 82 328 MPUAR2 MPU Address Register region 2 83 332 MPUAR3 MPU Address Register region 3 84 336 MPUAR4 MPU Address Register region 4 85 340 MPUAR5 MPU Address Register region 5 86 344 MPUAR6 MPU Address Register region 6 87 348 MPUAR7 MPU Address Register region 7 88 352 MPUPSR0 MPU Privilege Select Register region 0 89 356 MPUPSR1 MPU Privilege Select Register region 1 33 9166DS–AVR-01/12 AT32UC3C Table 4-3. 4.5 System Registers (Continued) Reg # Address Name Function 90 360 MPUPSR2 MPU Privilege Select Register region 2 91 364 MPUPSR3 MPU Privilege Select Register region 3 92 368 MPUPSR4 MPU Privilege Select Register region 4 93 372 MPUPSR5 MPU Privilege Select Register region 5 94 376 MPUPSR6 MPU Privilege Select Register region 6 95 380 MPUPSR7 MPU Privilege Select Register region 7 96 384 MPUCRA Unused in this version of AVR32UC 97 388 MPUCRB Unused in this version of AVR32UC 98 392 MPUBRA Unused in this version of AVR32UC 99 396 MPUBRB Unused in this version of AVR32UC 100 400 MPUAPRA MPU Access Permission Register A 101 404 MPUAPRB MPU Access Permission Register B 102 408 MPUCR MPU Control Register 103 412 SS_STATUS Secure State Status Register 104 416 SS_ADRF Secure State Address Flash Register 105 420 SS_ADRR Secure State Address RAM Register 106 424 SS_ADR0 Secure State Address 0 Register 107 428 SS_ADR1 Secure State Address 1 Register 108 432 SS_SP_SYS Secure State Stack Pointer System Register 109 436 SS_SP_APP Secure State Stack Pointer Application Register 110 440 SS_RAR Secure State Return Address Register 111 444 SS_RSR Secure State Return Status Register 112-191 448-764 Reserved Reserved for future use 192-255 768-1020 IMPL IMPLEMENTATION DEFINED Exceptions and Interrupts In the AVR32 architecture, events are used as a common term for exceptions and interrupts. AVR32UC incorporates a powerful event handling scheme. The different event sources, like Illegal Op-code and interrupt requests, have different priority levels, ensuring a well-defined behavior when multiple events are received simultaneously. Additionally, pending events of a higher priority class may preempt handling of ongoing events of a lower priority class. When an event occurs, the execution of the instruction stream is halted, and execution is passed to an event handler at an address specified in Table 4-4 on page 38. Most of the handlers are placed sequentially in the code space starting at the address specified by EVBA, with four bytes between each handler. This gives ample space for a jump instruction to be placed there, jumping to the event routine itself. A few critical handlers have larger spacing between them, allowing the entire event routine to be placed directly at the address specified by the EVBA-relative offset generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR) addresses. This allows the interrupt controller to directly specify the ISR address as an address 34 9166DS–AVR-01/12 AT32UC3C relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset), not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up appropriately. The same mechanisms are used to service all different types of events, including interrupt requests, yielding a uniform event handling scheme. An interrupt controller does the priority handling of the interrupts and provides the autovector offset to the CPU. 4.5.1 System Stack Issues Event handling in AVR32UC uses the system stack pointed to by the system stack pointer, SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section, since the timing of accesses to this memory section is both fast and deterministic. The user must also make sure that the system stack is large enough so that any event is able to push the required registers to stack. If the system stack is full, and an event occurs, the system will enter an UNDEFINED state. 4.5.2 Exceptions and Interrupt Requests When an event other than scall or debug request is received by the core, the following actions are performed atomically: 1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and GM bits in the Status Register are used to mask different events. Not all events can be masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and Bus Error) can not be masked. When an event is accepted, hardware automatically sets the mask bits corresponding to all sources with equal or lower priority. This inhibits acceptance of other events of the same or lower priority, except for the critical events listed above. Software may choose to clear some or all of these bits after saving the necessary state if other priority schemes are desired. It is the event source’s responsability to ensure that their events are left pending until accepted by the CPU. 2. When a request is accepted, the Status Register and Program Counter of the current context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also automatically stored to stack. Storing the Status Register ensures that the core is returned to the previous execution mode when the current event handling is completed. When exceptions occur, both the EM and GM bits are set, and the application may manually enable nested exceptions if desired by clearing the appropriate bit. Each exception handler has a dedicated handler address, and this address uniquely identifies the exception source. 3. The Mode bits are set to reflect the priority of the accepted event, and the correct register file bank is selected. The address of the event handler, as shown in Table 4-4 on page 38, is loaded into the Program Counter. The execution of the event handler routine then continues from the effective address calculated. The rete instruction signals the end of the event. When encountered, the Return Status Register and Return Address Register are popped from the system stack and restored to the Status Register and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also popped from the system stack. The restored Status Register contains information allowing the core to resume operation in the previous execution mode. This concludes the event handling. 35 9166DS–AVR-01/12 AT32UC3C 4.5.3 Supervisor Calls The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is designed so that privileged routines can be called from any context. This facilitates sharing of code between different execution modes. The scall mechanism is designed so that a minimal execution cycle overhead is experienced when performing supervisor routine calls from timecritical event handlers. The scall instruction behaves differently depending on which mode it is called from. The behaviour is detailed in the instruction set reference. In order to allow the scall routine to return to the correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC CPU, scall and rets uses the system stack to store the return address and the status register. 4.5.4 Debug Requests The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the Debug Exception handler. By default, Debug mode executes in the exception context, but with dedicated Return Address Register and Return Status Register. These dedicated registers remove the need for storing this data to the system stack, thereby improving debuggability. The Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers in all contexts, while retaining full privileges. Debug mode is exited by executing the retd instruction. This returns to the previous context. 4.5.5 Entry Points for Events Several different event handler entry points exist. In AVR32UC, the reset address is 0x80000000. This places the reset address in the boot flash memory area. TLB miss exceptions and scall have a dedicated space relative to EVBA where their event handler can be placed. This speeds up execution by removing the need for a jump instruction placed at the program address jumped to by the event hardware. All other exceptions have a dedicated event routine entry point located relative to EVBA. The handler routine address identifies the exception source directly. AVR32UC uses the ITLB and DTLB protection exceptions to signal a MPU protection violation. ITLB and DTLB miss exceptions are used to signal that an access address did not map to any of the entries in the MPU. TLB multiple hit exception indicates that an access address did map to multiple TLB entries, signalling an error. All interrupt requests have entry points located at an offset relative to EVBA. This autovector offset is specified by an interrupt controller. The programmer must make sure that none of the autovector offsets interfere with the placement of other code. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. Special considerations should be made when loading EVBA with a pointer. Due to security considerations, the event handlers should be located in non-writeable flash memory, or optionally in a privileged memory protection region if an MPU is present. If several events occur on the same instruction, they are handled in a prioritized way. The priority ordering is presented in Table 4-4 on page 38. If events occur on several instructions at different locations in the pipeline, the events on the oldest instruction are always handled before any events on any younger instruction, even if the younger instruction has events of higher priority 36 9166DS–AVR-01/12 AT32UC3C than the oldest instruction. An instruction B is younger than an instruction A if it was sent down the pipeline later than A. The addresses and priority of simultaneous events are shown in Table 4-4 on page 38. Some of the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floatingpoint unit. 37 9166DS–AVR-01/12 AT32UC3C Table 4-4. Priority and Handler Addresses for Events Priority Handler Address Name Event source Stored Return Address 1 0x80000000 Reset External input Undefined 2 Provided by OCD system OCD Stop CPU OCD system First non-completed instruction 3 EVBA+0x00 Unrecoverable exception Internal PC of offending instruction 4 EVBA+0x04 TLB multiple hit MPU PC of offending instruction 5 EVBA+0x08 Bus error data fetch Data bus First non-completed instruction 6 EVBA+0x0C Bus error instruction fetch Data bus First non-completed instruction 7 EVBA+0x10 NMI External input First non-completed instruction 8 Autovectored Interrupt 3 request External input First non-completed instruction 9 Autovectored Interrupt 2 request External input First non-completed instruction 10 Autovectored Interrupt 1 request External input First non-completed instruction 11 Autovectored Interrupt 0 request External input First non-completed instruction 12 EVBA+0x14 Instruction Address CPU PC of offending instruction 13 EVBA+0x50 ITLB Miss MPU PC of offending instruction 14 EVBA+0x18 ITLB Protection MPU PC of offending instruction 15 EVBA+0x1C Breakpoint OCD system First non-completed instruction 16 EVBA+0x20 Illegal Opcode Instruction PC of offending instruction 17 EVBA+0x24 Unimplemented instruction Instruction PC of offending instruction 18 EVBA+0x28 Privilege violation Instruction PC of offending instruction 19 EVBA+0x2C Floating-point UNUSED 20 EVBA+0x30 Coprocessor absent Instruction PC of offending instruction 21 EVBA+0x100 Supervisor call Instruction PC(Supervisor Call) +2 22 EVBA+0x34 Data Address (Read) CPU PC of offending instruction 23 EVBA+0x38 Data Address (Write) CPU PC of offending instruction 24 EVBA+0x60 DTLB Miss (Read) MPU PC of offending instruction 25 EVBA+0x70 DTLB Miss (Write) MPU PC of offending instruction 26 EVBA+0x3C DTLB Protection (Read) MPU PC of offending instruction 27 EVBA+0x40 DTLB Protection (Write) MPU PC of offending instruction 28 EVBA+0x44 DTLB Modified UNUSED 38 9166DS–AVR-01/12 AT32UC3C 5. Memories 5.1 Embedded Memories • Internal High-Speed Flash (See Table 5-1 on page 40) – 512 Kbytes – 256 Kbytes – 128 Kbytes • 0 Wait State Access at up to 25 MHz in Worst Case Conditions • 1 Wait State Access at up to 50 MHz in Worst Case Conditions • Pipelined Flash Architecture, allowing burst reads from sequential Flash locations, hiding penalty of 1 wait state access • Pipelined Flash Architecture typically reduces the cycle penalty of 1 wait state operation to only 15% compared to 0 wait state operation • 10 000 Write Cycles, 15-year Data Retention Capability • Sector Lock Capabilities, Bootloader Protection, Security Bit • 32 Fuses, Erased During Chip Erase • User Page For Data To Be Preserved During Chip Erase • Internal High-Speed SRAM, Single-cycle access at full speed (See Table 5-1 on page 40) – 64 Kbytes – 32 Kbytes • Supplementary Internal High-Speed System SRAM (HSB RAM), Single-cycle access at full speed – Memory space available on System Bus for peripherals data. – 4 Kbytes 39 9166DS–AVR-01/12 AT32UC3C 5.2 Physical Memory Map The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they are never remapped in any way, not even in boot. Note that AVR32UC CPU uses unsegmented translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space is mapped as follows: Table 5-1. AT32UC3C Physical Memory Map AT32UC3 Derivatives Device Start Address C0512C C1512C C2512C C1256C C2256C C2128C Embedded SRAM 0x0000_0000 64 KB 64 KB 64 KB 32 KB Embedded Flash 0x8000_0000 512 KB 512 KB 256 KB 128 KB SAU 0x9000_0000 1 KB 1 KB 1 KB 1 KB HSB SRAM 0xA000_0000 4 KB 4 KB 4 KB 4 KB EBI SRAM CS0 0xC000_0000 16 MB - - - EBI SRAM CS2 0xC800_0000 16 MB - - - EBI SRAM CS3 0xCC00_0000 16 MB - - - EBI SRAM CS1 /SDRAM CS0 0xD000_0000 128 MB - - - HSB-PB Bridge C 0xFFFD_0000 64 KB 64 KB 64 KB 64 KB HSB-PB Bridge B 0xFFFE_0000 64 KB 64 KB 64 KB 64 KB HSB-PB Bridge A 0xFFFF_0000 64 KB 64 KB 64 KB 64 KB Table 5-2. 5.3 Flash Memory Parameters Part Number Flash Size (FLASH_PW) Number of pages (FLASH_P) Page size (FLASH_W) AT32UC3C0512C AT32UC3C1512C AT32UC3C2512C 512 Kbytes 1024 128 words AT32UC3C1256C AT32UC3C2256C 256 Kbytes 512 128 words AT32UC3C2128C 128 Kbytes 256 128 words Peripheral Address Map Table 5-3. Peripheral Address Mapping Address Peripheral Name 0xFFFD0000 PDCA Peripheral DMA Controller - PDCA 40 9166DS–AVR-01/12 AT32UC3C Table 5-3. Peripheral Address Mapping 0xFFFD1000 MDMA 0xFFFD1400 USART1 Memory DMA - MDMA Universal Synchronous/Asynchronous Receiver/Transmitter - USART1 0xFFFD1800 SPI0 Serial Peripheral Interface - SPI0 0xFFFD1C00 CANIF Control Area Network interface - CANIF 0xFFFD2000 TC0 0xFFFD2400 Timer/Counter - TC0 ADCIFA ADC controller interface with Touch Screen functionality - ADCIFA USART4 Universal Synchronous/Asynchronous Receiver/Transmitter - USART4 0xFFFD2800 0xFFFD2C00 TWIM2 Two-wire Master Interface - TWIM2 TWIS2 Two-wire Slave Interface - TWIS2 0xFFFD3000 0xFFFE0000 HFLASHC Flash Controller - HFLASHC 0xFFFE1000 USBC USB 2.0 OTG Interface - USBC 0xFFFE2000 HMATRIX HSB Matrix - HMATRIX 0xFFFE2400 SAU Secure Access Unit - SAU SMC Static Memory Controller - SMC 0xFFFE2800 0xFFFE2C00 SDRAMC SDRAM Controller - SDRAMC 0xFFFE3000 MACB Ethernet MAC - MACB INTC Interrupt controller - INTC 0xFFFF0000 0xFFFF0400 PM Power Manager - PM 0xFFFF0800 SCIF System Control Interface - SCIF 41 9166DS–AVR-01/12 AT32UC3C Table 5-3. Peripheral Address Mapping 0xFFFF0C00 AST Asynchronous Timer - AST WDT Watchdog Timer - WDT EIC External Interrupt Controller - EIC 0xFFFF1000 0xFFFF1400 0xFFFF1800 FREQM Frequency Meter - FREQM 0xFFFF2000 GPIO 0xFFFF2800 General Purpose Input/Output Controller - GPIO USART0 Universal Synchronous/Asynchronous Receiver/Transmitter - USART0 USART2 Universal Synchronous/Asynchronous Receiver/Transmitter - USART2 USART3 Universal Synchronous/Asynchronous Receiver/Transmitter - USART3 0xFFFF2C00 0xFFFF3000 0xFFFF3400 SPI1 Serial Peripheral Interface - SPI1 0xFFFF3800 TWIM0 Two-wire Master Interface - TWIM0 TWIM1 Two-wire Master Interface - TWIM1 TWIS0 Two-wire Slave Interface - TWIS0 TWIS1 Two-wire Slave Interface - TWIS1 0xFFFF3C00 0xFFFF4000 0xFFFF4400 0xFFFF4800 IISC Inter-IC Sound (I2S) Controller - IISC PWM Pulse Width Modulation Controller - PWM 0xFFFF4C00 0xFFFF5000 QDEC0 Quadrature Decoder - QDEC0 QDEC1 Quadrature Decoder - QDEC1 0xFFFF5400 0xFFFF5800 TC1 Timer/Counter - TC1 0xFFFF5C00 PEVC Peripheral Event Controller - PEVC 42 9166DS–AVR-01/12 AT32UC3C Table 5-3. Peripheral Address Mapping 0xFFFF6000 ACIFA0 Analog Comparators Interface - ACIFA0 ACIFA1 Analog Comparators Interface - ACIFA1 0xFFFF6400 0xFFFF6800 DACIFB0 DAC interface - DACIFB0 DACIFB1 DAC interface - DACIFB1 0xFFFF6C00 0xFFFF7000 AW 5.4 aWire - AW CPU Local Bus Mapping Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to being mapped on the Peripheral Bus. These registers can therefore be reached both by accesses on the Peripheral Bus, and by accesses on the local bus. Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers. The following GPIO registers are mapped on the local bus: Table 5-4. Local bus mapped GPIO registers Port Register Mode Local Bus Address Access A Output Driver Enable Register (ODER) WRITE 0x40000040 Write-only SET 0x40000044 Write-only CLEAR 0x40000048 Write-only TOGGLE 0x4000004C Write-only WRITE 0x40000050 Write-only SET 0x40000054 Write-only CLEAR 0x40000058 Write-only TOGGLE 0x4000005C Write-only - 0x40000060 Read-only Output Value Register (OVR) Pin Value Register (PVR) 43 9166DS–AVR-01/12 AT32UC3C Table 5-4. Local bus mapped GPIO registers Port Register Mode Local Bus Address Access B Output Driver Enable Register (ODER) WRITE 0x40000140 Write-only SET 0x40000144 Write-only CLEAR 0x40000148 Write-only TOGGLE 0x4000014C Write-only WRITE 0x40000150 Write-only SET 0x40000154 Write-only CLEAR 0x40000158 Write-only TOGGLE 0x4000015C Write-only Pin Value Register (PVR) - 0x40000160 Read-only Output Driver Enable Register (ODER) WRITE 0x40000240 Write-only SET 0x40000244 Write-only CLEAR 0x40000248 Write-only TOGGLE 0x4000024C Write-only WRITE 0x40000250 Write-only SET 0x40000254 Write-only CLEAR 0x40000258 Write-only TOGGLE 0x4000025C Write-only Pin Value Register (PVR) - 0x40000260 Read-only Output Driver Enable Register (ODER) WRITE 0x40000340 Write-only SET 0x40000344 Write-only CLEAR 0x40000348 Write-only TOGGLE 0x4000034C Write-only WRITE 0x40000350 Write-only SET 0x40000354 Write-only CLEAR 0x40000358 Write-only TOGGLE 0x4000035C Write-only - 0x40000360 Read-only Output Value Register (OVR) C Output Value Register (OVR) D Output Value Register (OVR) Pin Value Register (PVR) 44 9166DS–AVR-01/12 AT32UC3C 6. Supply and Startup Considerations 6.1 6.1.1 Supply Considerations Power Supplies The AT32UC3C has several types of power supply pins: • VDDIO pins (VDDIO1, VDDIO2, VDDIO3): Power I/O lines. Two voltage ranges are available: 5V or 3.3V nominal. The VDDIO pins should be connected together. • VDDANA: Powers the Analog part of the device (Analog I/Os, ADC, ACs, DACs). 2 voltage ranges • • • • • • • available: 5V or 3.3V nominal. VDDIN_5: Input voltage for the 1.8V and 3.3V regulators. Two Voltage ranges are available: 5V or 3.3V nominal. VDDIN_33: – USB I/O power supply – if the device is 3.3V powered: Input voltage, voltage is 3.3V nominal. – if the device is 5V powered: stabilization for the 3.3V voltage regulator, requires external capacitors VDDCORE: Stabilization for the 1.8V voltage regulator, requires external capacitors. GNDCORE: Ground pins for the voltage regulators and the core. GNDANA: Ground pin for Analog part of the design GNDPLL: Ground pin for the PLLs GNDIO pins (GNDIO1, GNDIO2, GNDIO3): Ground pins for the I/O lines. The GNDIO pins should be connected together. See ”Electrical Characteristics” on page 49 for power consumption on the various supply pins. For decoupling recommendations for the different power supplies, please refer to the schematic checklist. 6.1.2 Voltage Regulators The AT32UC3C embeds two voltage regulators: • One 1.8V internal regulator that converts from VDDIN_5 to 1.8V. The regulator supplies the output voltage on VDDCORE. • One 3.3V internal regulator that converts from VDDIN_5 to 3.3V. The regulator supplies the USB pads on VDDIN_33. If the USB is not used or if VDDIN_5 is within the 3V range, the 3.3V regulator can be disabled through the VREG33CTL field of the VREGCTRL SCIF register. 6.1.3 Regulators Connection The AT32UC3C supports two power supply configurations. • 5V single supply mode • 3.3V single supply mode 6.1.3.1 5V Single Supply Mode In 5V single supply mode, the 1.8V internal regulator is connected to the 5V source (VDDIN_5 pin) and its output feeds VDDCORE. 45 9166DS–AVR-01/12 AT32UC3C The 3.3V regulator is connected to the 5V source (VDDIN_5 pin) and its output feeds the USB pads. If the USB is not used, the 3.3V regulator can be disabled through the VREG33CTL field of the VREGCTRL SCIF register. Figure 6-1 on page 46 shows the power schematics to be used for 5V single supply mode. All I/O lines and analog blocks will be powered by the same power (VDDIN_5 = VDDIO1 = VDDIO2 = VDDIO3 = VDDANA). Figure 6-1. 5V Single Power Supply mode + 4.55.5V - CIN2 VDDIO1 VDDIO2 VDDIO3 VDDIN_5 VDDANA GNDANA CIN1 BOD33 Analog: ADC, AC, DAC, ... BOD50 VDDIN_33 COUT2 3.3V Reg COUT1 VDDCORE COUT2 CPU Peripherals Memories GNDIO1 GNDIO2 GNDIO3 1.8V Reg COUT1 SCIF, BOD, RCSYS GNDPLL PLL BOD18 GNDCORE POR 6.1.3.2 3.3V Single Supply Mode In 3.3V single supply mode, the VDDIN_5 and VDDIN_33 pins should be connected together externally. The 1.8V internal regulator is connected to the 3.3 V source (VDDIN_5 pin) and its output feeds VDDCORE. The 3.3V regulator should be disabled once the circuit is running through the VREG33CTL field of the VREGCTRL SCIF register. Figure 6-2 on page 47 shows the power schematics to be used for 3.3V single supply mode. All I/O lines and analog blocks will be powered by the same power (VDDIN_5 = VDDIN_33 = VDDIO1 = VDDIO2 = VDDIO3 = VDDANA). 46 9166DS–AVR-01/12 AT32UC3C Figure 6-2. 3 Single Power Supply Mode + 3.03.6V CIN2 VDDIO1 VDDIO2 VDDIO3 VDDIN_5 VDDANA GNDANA CIN1 BOD33 Analog: ADC, AC, DAC, ... BOD50 3.3V Reg VDDIN_33 VDDCORE COUT2 1.8V Reg COUT1 CPU Peripherals Memories GNDIO1 GNDIO2 GNDIO3 SCIF, BOD, RCSYS GNDPLL PLL BOD18 GNDCORE POR 6.1.4 6.1.4.1 Power-up Sequence Maximum Rise Rate To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values described in Table 7-2 on page 50. Recommended order for power supplies is also described in this table. 6.1.4.2 Minimum Rise Rate The integrated Power-Reset circuitry monitoring the powering supply requires a minimum rise rate for the VDDIN_5 power supply. See Table 7-2 on page 50 for the minimum rise rate value. If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, the following configuration can be used: • A logic “0” value is applied during power-up on pin RESET_N until: – VDDIN_5 rises above 4.5V in 5V single supply mode. – VDDIN_33 rises above 3V in 3.3V single supply mode. 47 9166DS–AVR-01/12 AT32UC3C 6.2 Startup Considerations This chapter summarizes the boot sequence of the AT32UC3C. The behavior after power-up is controlled by the Power Manager. For specific details, refer to the Power Manager chapter. 6.2.1 Starting of clocks At power-up, the BOD33 and the BOD18 are enabled. The device will be held in a reset state by the power-up circuitry, until the VDDIN_33 (resp. VDDCORE) has reached the reset threshold of the BOD33 (resp BOD18). Refer to the Electrical Characteristics for the BOD thresholds. Once the power has stabilized, the device will use the System RC Oscillator (RCSYS, 115KHz typical frequency) as clock source. The BOD18 and BOD33 are kept enabled or are disabled according to the fuse settings (See the Fuse Setting section in the Flash Controller chapter). On system start-up, the PLLs are disabled. All clocks to all modules are running. No clocks have a divided frequency, all parts of the system receive a clock with the same frequency as the internal RC Oscillator. 6.2.2 Fetching of initial instructions After reset has been released, the AVR32UC CPU starts fetching instructions from the reset address, which is 0x8000_0000. This address points to the first address in the internal Flash. The internal Flash uses VDDIO voltage during read and write operations. It is recommended to use the BOD33 to monitor this voltage and make sure the VDDIO is above the minimum level (3.0V). The code read from the internal Flash is free to configure the system to use for example the PLLs, to divide the frequency of the clock routed to some of the peripherals, and to gate the clocks to unused peripherals. 48 9166DS–AVR-01/12 AT32UC3C 7. Electrical Characteristics 7.1 Absolute Maximum Ratings* Operating temperature................................... -40°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage temperature...................................... -60°C to +150°C Voltage on any pin except DM/DP/VBUS with respect to ground ............................ -0.3V to VVDD(1)+0.3V Voltage on DM/DP with respect to ground.........-0.3V to +3.6V Voltage on VBUS with respect to ground...........-0.3V to +5.5V Maximum operating voltage (VDDIN_5) ........................... 5.5V Maximum operating voltage (VDDIO1, VDDIO2, VDDIO3, VDDANA).......................................................................... 5.5V Maximum operating voltage (VDDIN_33) ......................... 3.6V Total DC output current on all I/O pins- VDDIO1 ........... 40 mA Total DC output current on all I/O pins- VDDIO2 ........... 40 mA Total DC output current on all I/O pins- VDDIO3 ........... 40 mA Total DC output current on all I/O pins- VDDANA.......... 40 mA Notes: 1. VVDD corresponds to either VVDDIO1, VVDDIO2, VVDDIO3, or VVDDANA, depending on the supply for the pin. Refer to Section 3-1 on page 11 for details. 7.2 Supply Characteristics The following characteristics are applicable to the operating temperature range: TA = -40°C to 125°C, unless otherwise specified and are valid for a junction temperature up to TJ = 145°C. Please refer to Section 6. ”Supply and Startup Considerations” on page 45. Table 7-1. Supply Characteristics Voltage Symbol Parameter VVDDIN_5 DC supply internal regulators VVDDIN_33 VVDDANA VVDDIO1 VVDDIO2 VVDDIO2 Condition Min Max 3V range 3.0 3.6 5V range 4.5 5.5 DC supply USB I/O only in 3V range 3.0 3.6 DC supply peripheral I/O and analog part 3V range 3.0 3.6 5V range 4.5 5.5 3V range 3.0 3.6 5V range 4.5 5.5 Unit V V V DC supply peripheral I/O V 49 9166DS–AVR-01/12 AT32UC3C Table 7-2. Supply Rise Rates and Order Rise Rate Symbol Parameter Min Max VVDDIN_5 DC supply internal 3.3V regulator 0.01 V/ms 1.25 V/us VVDDIN_33 DC supply internal 1.8V regulator 0.01 V/ms 1.25 V/us VVDDIO1 VVDDIO2 VVDDIO3 DC supply peripheral I/O 0.01 V/ms 1.25 V/us Rise after or at the same time as VDDIN_5, VDDIN_33 VVDDANA DC supply peripheral I/O and analog part 0.01 V/ms 1.25 V/us Rise after or at the same time as VDDIN_5, VDDIN_33 7.3 Comment Maximum Clock Frequencies These parameters are given in the following conditions: • VVDDCORE > 1.85V • Temperature = -40°C to 125°C Table 7-3. Clock Frequencies Symbol Parameter fCPU Conditions Min Max Units CPU clock frequency 50 MHz fPBA PBA clock frequency 50 MHz fPBB PBB clock frequency 50 MHz fPBC PBC clock frequency 50 MHz (1) fGCLK0 GCLK0 clock frequency Generic clock for USBC 50 MHz fGCLK1 GCLK1 clock frequency Generic clock for CANIF 66(1) MHz fGCLK2 GCLK2 clock frequency Generic clock for AST 80(1) MHz GCLK4 clock frequency fGCLK4 GCLK11 clock frequency fGCLK11 Generic clock for PWM Generic clock for IISC (1) 120 (1) 50 MHz MHz Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.4 Power Consumption The values in Table 7-4 are measured values of power consumption under the following conditions, except where noted: • Operating conditions core supply (Figure 7-1) – VVDDIN_5 = VVDDIN_33 = 3.3V – VVDDCORE = 1.85V, supplied by the internal regulator – VVDDIO1 = VVDDIO2 = VVDDIO3 = 3.3V – VVDDANA = 3.3V 50 9166DS–AVR-01/12 AT32UC3C – Internal 3.3V regulator is off • TA = 25°C • I/Os are configured as inputs, with internal pull-up enabled. • Oscillators – OSC0/1 (crystal oscillator) stopped – OSC32K (32KHz crystal oscillator) stopped – PLL0 running – PLL1 stopped • Clocks – External clock on XIN0 as main clock source (10MHz) – CPU, HSB, and PBB clocks undivided – PBA, PBC clock divided by 4 – All peripheral clocks running Table 7-4. Mode Power Consumption for Different Operating Modes Conditions (1) Active Measured on CPU running a recursive Fibonacci algorithm Consumption Typ Unit 512 Idle(1) 258 µA/MHz (1) 106 Frozen Standby(1) 48 Amp Stop 73 DeepStop 43 µA OSC32K and AST running 32 AST and OSC32K stopped 31 Static Note: 1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies. 51 9166DS–AVR-01/12 AT32UC3C Figure 7-1. Measurement Schematic VDDANA VDDIO Amp VDDIN_5 VDDIN_33 VDDCORE GNDCORE GNDPLL 7.4.1 Peripheral Power Consumption The values in Table 7-5 are measured values of power consumption under the following conditions. • Operating conditions core supply (Figure 7-1) – VVDDIN_5 = VDDIN_33 = 3.3V – VVDDCORE = 1.85V , supplied by the internal regulator – VVDDIO1 = VVDDIO2 = VVDDIO3 = 3.3V – VVDDANA = 3.3V – Internal 3.3V regulator is off. • TA = 25°C • I/Os are configured as inputs, with internal pull-up enabled. • Oscillators – OSC0/1 (crystal oscillator) stopped – OSC32K (32KHz crystal oscillator) stopped – PLL0 running 52 9166DS–AVR-01/12 AT32UC3C – PLL1 stopped • Clocks – External clock on XIN0 as main clock source. – CPU, HSB, and PB clocks undivided Consumption active is the added current consumption when the module clock is turned on and when the module is doing a typical set of operations. Table 7-5. Peripheral Typical Current Consumption by Peripheral(2) Typ Consumption Active (1) ACIFA (1) 3 ADCIFA 7 AST 3 CANIF 25 DACIFB(1) 3 EBI 23 EIC 0.5 FREQM 0.5 GPIO 37 INTC 3 MDMA 4 PDCA 24 PEVC 15 PWM 40 QDEC 3 SAU 3 SDRAMC 2 SMC 9 SPI 5 TC 8 TWIM 2 TWIS 2 USART 10 USBC 5 WDT 2 Notes: Unit µA/MHz 1. Includes the current consumption on VDDANA. 2. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies. 53 9166DS–AVR-01/12 AT32UC3C 7.5 I/O Pin Characteristics Normal I/O Pin Characteristics(1) Table 7-6. Symbol Parameter RPULLUP Pull-up resistance RPULLDOWN Pull-down resistance VIL Input low-level voltage VIH Input high-level voltage Condition Min VVDD = 3V VVDD = 5V Typ Max Units 5 26 kOhm 5 16 kOhm 2 16 kOhm VVDD = 3V 0.3*VVDDIO VVDD = 4.5V 0.3*VVDDIO VVDD = 3.6V 0.7*VVDDIO VVDD = 5.5V 0.7*VVDDIO V V IOL = -3.5mA, pin drive x1(2) VOL Output low-level voltage IOL = -7mA, pin drive x2(2) 0.5 V IOL = -14mA, pin drive x4(2) IOH = 3.5mA, pin drive x1(2) VOH Output high-level voltage IOH = 7mA, pin drive x2(2) VVDD - 0.8 V (2) IOH = 14mA, pin drive x4 VVDD = 3.0V fMAX load = 10pF, pin drive x1(2) 30 load = 10pF, pin drive x2(2) 50 load = 10pF, pin drive x4 (2) 60 load = 30pF, pin drive x1 (2) 15 load = 30pF, pin drive x2(2) 25 (2) 40 (2) 45 load = 10pF, pin drive x2(2) 65 load = 10pF, pin drive x4(2) 85 load = 30pF, pin drive x1(2) 20 load = 30pF, pin drive x4 Output frequency(3) load = 10pF, pin drive x1 VVDD =4.5V MHz load = 30pF, pin drive x2 (2) 40 load = 30pF, pin drive x4 (2) 60 54 9166DS–AVR-01/12 AT32UC3C Normal I/O Pin Characteristics(1) Table 7-6. Symbol Parameter Condition VVDD = 3.0V tRISE Rise time(3) VVDD = 4.5V VVDD = 3.0V tFALL Fall time(3) VVDD = 4.5V ILEAK CIN Min Max load = 10pF, pin drive x1 8.4 load = 10pF, pin drive x2 (2) 3.8 load = 10pF, pin drive x4 (2) 2.1 load = 30pF, pin drive x1(2) 17.5 load = 30pF, pin drive x2(2) 8.2 load = 30pF, pin drive x4 (2) 4.2 load = 10pF, pin drive x1 (2) 5.9 load = 10pF, pin drive x2(2) 2.6 load = 10pF, pin drive x4 (2) 1.5 load = 30pF, pin drive x1 (2) 12.2 load = 30pF, pin drive x2 (2) 5.7 load = 30pF, pin drive x4(2) 3.0 load = 10pF, pin drive x1 (2) 8.5 load = 10pF, pin drive x2 (2) 3.9 load = 10pF, pin drive x4 (2) 2.1 17.6 load = 30pF, pin drive x2(2) 8.1 load = 30pF, pin drive x4 (2) 4.3 load = 10pF, pin drive x1 (2) 5.9 load = 10pF, pin drive x2(2) 2.7 load = 10pF, pin drive x4 (2) 1.5 load = 30pF, pin drive x1 (2) 12.2 load = 30pF, pin drive x2 (2) 5.7 load = 30pF, pin drive x4(2) 3.0 Input leakage current Pull-up resistors disabled Input capacitance PA00-PA29, PB00-PB31, PC00-PC01, PC08-PC31, PD00-PD30 Units ns load = 30pF, pin drive x1(2) PC02, PC03, PC04, PC05, PC06, PC07 Note: Typ (2) ns 2.0 µA 7.5 pF 2 1. VVDD corresponds to either VVDDIO1, VVDDIO2, VVDDIO3, or VVDDANA, depending on the supply for the pin. Refer to Section 3-1 on page 11 for details. 2. drive x1 capability pins are: PB00, PB01, PB02, PB03, PB30, PB31, PC02, PC03, PC04, PC05, PC06, PC07 - drive x2 /x4 capability pins are: PB06, PB21, PB26, PD02, PD06, PD13 - drive x1/x2 capability pins are the remaining PA, PB, PC, PD pins. The drive strength is programmable through ODCR0, ODCR0S, ODCR0C, ODCR0T registers of GPIO. 3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 55 9166DS–AVR-01/12 AT32UC3C 7.6 Oscillator Characteristics 7.6.1 7.6.1.1 Oscillator (OSC0 and OSC1) Characteristics Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN0 or XIN1. Table 7-7. Digital Clock Characteristics Symbol Parameter fCPXIN XIN clock frequency tCPXIN XIN clock period tCHXIN XIN clock high half-priod 0.4 x tCPXIN 0.6 x tCPXIN ns tCLXIN XIN clock low half-priod 0.4 x tCPXIN 0.6 x tCPXIN ns CIN XIN input capacitance 7.6.1.2 Conditions Min Typ Max Units 50 MHz 20 ns 2 pF Crystal Oscillator Characteristics The following table describes the characteristics for the oscillator when a crystal is connected between XIN and XOUT as shown in Figure 7-2. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can then be computed as follows: C LEXT = 2 ( C L – C i ) – C PCB where CPCB is the capacitance of the PCB and Ci is the internal equivalent load capacitance. Figure 7-2. Oscillator Connection UC3C CLEXT XOUT Ci CL XIN CLEXT 56 9166DS–AVR-01/12 AT32UC3C Table 7-8. Crystal Oscillator Characteristics Symbol Parameter fOUT Crystal oscillator frequency Ci Internal equivalent load capacitance tSTARTUP Notes: Conditions Min Typ 0.4 Max Unit 20 MHz 1.7 pF fOUT = 8MHz SCIF.OSCCTRL.GAIN = 1(1) 975 us fOUT = 16MHz SCIF.OSCCTRL.GAIN = 2(1) 1100 us Startup time 1. Please refer to the SCIF chapter for details. 7.6.2 32KHz Crystal Oscillator (OSC32K) Characteristics 7.6.2.1 Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN32. Table 7-9. Digital 32KHz Clock Characteristics Symbol Parameter fCPXIN XIN32 clock frequency tCPXIN XIN32 clock period tCHXIN XIN32 clock high half-priod 0.4 x tCPXIN 0.6 x tCPXIN ns tCLXIN XIN32 clock low half-priod 0.4 x tCPXIN 0.6 x tCPXIN ns CIN XIN32 input capacitance 7.6.2.2 Conditions Min Typ Max Units 32.768 5000 KHz 200 ns 2 pF Crystal Oscillator Characteristics Figure 7-2 and the equation above also applies to the 32 KHz oscillator connection. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can then be found in the crystal datasheet.. Table 7-10. 32 KHz Crystal Oscillator Characteristics Symbol Parameter fOUT Crystal oscillator frequency tSTARTUP Startup time CL Crystal load capacitance Ci Internal equivalent load capacitance Conditions Min RS = 50 kOhm, CL = 12.5pF Typ Max Unit 32 768 Hz 2 s 6 15 1.4 pF pF 57 9166DS–AVR-01/12 AT32UC3C 7.6.3 Phase Lock Loop (PLL0 and PLL1) Characteristics Table 7-11. PLL Characteristics Symbol Parameter fVCO Output frequency fIN Input frequency IPLL Current consumption tSTARTUP Startup time, from enabling the PLL until the PLL is locked 7.6.4 Typ Max Unit 80 240 MHz 4 16 MHz Active mode, fVCO = 80MHz 250 Active mode, fVCO = 240MHz 600 Wide Bandwidth mode disabled 15 Wide Bandwidth mode enabled 45 µA µs Internal 120MHz RC Oscillator Characteristics Symbol Parameter fOUT Output frequency(1) IRC120M Current consumption tSTARTUP Startup time Conditions Min Typ Max Unit 88 120 152 MHz 1.85 mA 3 µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.6.5 System RC Oscillator (RCSYS) Characteristics Table 7-13. Symbol System RC Oscillator Characteristics Parameter Output frequency fOUT 7.6.6 Conditions Min Typ Max Calibrated at TA = 125°C 110 115.2 120 TA = 25°C 105 109 115 TA = -40°C 100 104 108 Unit kHz 8MHz/1MHz RC Oscillator (RC8M) Characteristics Table 7-14. Symbol 8MHz/1MHz RC Oscillator Characteristics Parameter fOUT Output frequency tSTARTUP Startup time Notes: Min 120MHz RC Oscillator (RC120M) Characteristics Table 7-12. Note: Conditions Conditions Min Typ Max SCIF.RCCR8.FREQMODE = 0 (1) 7.5 8 8.5 SCIF.RCCR8.FREQMODE = 1 (1) 0.925 1 1.075 Unit MHz 20 µs 1. Please refer to the SCIF chapter for details. 58 9166DS–AVR-01/12 AT32UC3C 7.7 Flash Characteristics Table 7-15 gives the device maximum operating frequency depending on the number of flash wait states. The FSW bit in the FLASHC FSR register controls the number of wait states used when accessing the flash memory. Table 7-15. Maximum Operating Frequency Flash Wait States Read Mode Maximum Operating Frequency 0 1 cycle 25MHz 1 2 cycles 50MHz Table 7-16. Flash Characteristics Symbol Parameter tFPP Page programming time tFPE Page erase time tFFP Fuse programming time tFEA Full chip erase time (EA) tFCE JTAG chip erase time (CHIP_ERASE) Table 7-17. Conditions Min Typ Max Unit 17 17 fCLK_HSB = 50MHz 1.3 ms 18.3 fCLK_HSB = 115kHz 640 Flash Endurance and Data Retention Symbol Parameter Conditions Min Typ Max Unit NFARRAY Array endurance (write/page) 10k cycles NFFUSE General Purpose fuses endurance (write/bit) 500 cycles tRET Data retention 15 years 59 9166DS–AVR-01/12 AT32UC3C 7.8 Analog Characteristics 7.8.1 1.8V Voltage Regulator Characteristics Table 7-18. 1.8V Voltage Regulator Electrical Characteristics Symbol Parameter VVDDIN_5 Input voltage range VVDDCORE Output voltage, calibrated value IOUT DC output current Table 7-19. Condition Min Typ Max 5V range 4.5 5.5 3V range 3.0 3.6 Units V 1.85 V 80 mA Decoupling Requirements Symbol Parameter CIN1 Typ Techno. Units Input regulator capacitor 1 1 NPO nF CIN2 Input regulator capacitor 2 4.7 X7R uF COUT1 Output regulator capacitor 1 470 NPO pf COUT2 Output regulator capacitor 2 2.2 X7R uF 7.8.2 Condition 3.3V Voltage Regulator Characteristics Table 7-20. 3.3V Voltage Regulator Electrical Characteristics Symbol Parameter VVDDIN_5 Input voltage range VVDDIN_33 Output voltage, calibrated value IOUT DC output current IVREG Static current of regulator 7.8.3 Condition Min Typ 4.5 Max Units 5.5 V 3.4 V 35 Low power mode mA 10 µA 1.8V Brown Out Detector (BOD18) Characteristics The values in Table 7-21 describe the values of the BOD.LEVEL in the SCIF module. Table 7-21. BODLEVEL Values BODLEVEL Value Parameter Min Max 0 1.34 1.52 20 1.39 1.60 1.46 1.67 28 1.48 1.70 32 1.52 1.74 36 1.56 1.79 40 1.61 1.85 26 threshold at power-up sequence Units V 60 9166DS–AVR-01/12 AT32UC3C 7.8.4 3.3V Brown Out Detector (BOD33) Characteristics The values in Table 7-23 describe the values of the BOD33.LEVEL field in the SCIF module. Table 7-23. BOD33.LEVEL Values BOD33.LEVEL Value Parameter Min Max 17 2.27 2.52 22 2.36 2.61 27 2.45 2.71 2.52 2.79 33 2.56 2.83 39 2.67 2.95 44 2.76 3.05 49 2.85 3.15 53 2.91 3.23 60 3.05 3.37 31 threshold at power-up sequence Units V 7.8.5 5V Brown Out Detector (BOD50) Characteristics The values in Table 7-25 describe the values of the BOD50.LEVEL field in the SCIF module. Table 7-25. BOD50.LEVEL Values BOD50.LEVEL Value Parameter Min Max 16 3.28 3.61 25 3.52 3.87 35 3.78 4.17 44 4.02 4.43 53 4.25 4.69 61 4.47 4.92 Units V 61 9166DS–AVR-01/12 AT32UC3C 7.8.6 Analog to Digital Converter (ADC) and sample and hold (S/H) Characteristics Table 7-27. Symbol fADC ADC and S/H characteristics Parameter ADC clock frequency Conditions Min Typ 12-bit resolution mode, VVDDANA = 3V 1.2 10-bit resolution mode, VVDDANA = 3V 1.6 8-bit resolution mode, VVDDANA = 3V 2.2 12-bit resolution mode, VVDDANA = 4.5V 1.5 10-bit resolution mode, VVDDANA = 4.5V 2 8-bit resolution mode, VVDDANA = 4.5V 2.4 ADC cold start-up tSTARTUP Startup time tCONV Conversion time (latency) Throughput rate ADC hot start-up ms 24 8 (ADCIFA.SEQCFGn.SRES)/2 + 3, ADCIFA.CFG.SHD = 0 7 9 12-bit resolution, ADC clock = 1.2 MHz, VVDDANA = 3V 1.2 10-bit resolution, ADC clock = 1.6 MHz, VVDDANA = 3V 1.6 12-bit resolution, ADC clock = 1.5 MHz, VVDDANA = 4.5V 1.5 ADC clock cycles MSPS 2 ADC Reference Voltage Parameter VADCREF0 ADCREF0 input voltage range VADCREF1 ADCREF1 input voltage range VADCREFN MHz ADC clock cycles 6 Symbol VADCREFP Units 1 (ADCIFA.SEQCFGn.SRES)/2 + 2, ADCIFA.CFG.SHD = 1 10-bit resolution, ADC clock = 2 MHz, VVDDANA = 4.5V Table 7-28. Max ADCREFP input voltage ADCREFN input voltage Internal 1V reference Internal 0.6*VDDANA reference Conditions Min Typ Max 5V Range 1 3.5 3V Range 1 VVDDANA-0.7 5V Range 1 3.5 3V Range 1 VVDDANA-0.7 5V Range - Voltage reference applied on ADCREFP 1 3.5 3V Range - Voltage reference applied on ADCREFP 1 VVDDANA-0.7 Voltage reference applied on ADCREFN Unit s V V V GNDANA V 1.0 V 0.6*VVDDANA V 62 9166DS–AVR-01/12 AT32UC3C Table 7-29. ADC Decoupling requirements Symbol Parameter Conditions CADCREFPN ADCREFP/ADCREFN capacitance No voltage reference appplied on ADCREFP/ADCREFN Table 7-30. Min Typ Max 100 Units nF ADC Inputs Symbol Parameter VADCINn ADC input voltage range Conditions CONCHIP Internal Capacitance RONCHIP Switch resistance Figure 7-3. Min Typ 0 Max Units VVDDANA V ADC used without S/H 5 ADC used with S/H 4 ADC used without S/H 5.1 ADC used with S/H 4.6 pF kΩ ADC input UC3C RSOURCE VIN Table 7-31. ADCIN RONCHIP CSOURCE CONCHIP ADC Transfer Characteristics 12-bit Resolution Mode(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 0 (Fadc = 1.2MHz) Offset error Gain error Min Typ Max Units 12 Bit 6 LSB 5 LSB -10 10 mV -30 30 mV 63 9166DS–AVR-01/12 AT32UC3C Table 7-31. Symbol ADC Transfer Characteristics (Continued)12-bit Resolution Mode(1) Parameter Conditions Differential mode, VVDDANA = 5V, VADCREF0 = 3V, ADCFIA.SEQCFGn.SRES = 0 (Fadc = 1.5MHz) RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Note: Max Units 12 Bit 5 LSB 4 LSB -20 20 mV -30 30 mV Max Units 10 Bit 1.25 LSB ADC Transfer Characteristics 10-bit Resolution Mode(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 1 (Fadc = 1.5MHz) DNL Differential Non-Linearity Offset error Gain error RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Differential mode, VVDDANA = 5V, VADCREF0= 3V, ADCFIA.SEQCFGn.SRES = 1 (Fadc = 1.5MHz) Min Typ 1.25 LSB -10 10 mV -20 20 mV 10 Bit 1.25 LSB 1.25 LSB -20 20 mV -25 25 mV Max Units 8 Bit 0.3 LSB 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. Table 7-33. ADC Transfer Characteristics 8-bit Resolution Mode(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 2 (Fadc =1.5MHz) DNL Differential Non-Linearity Offset error Gain error RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Note: Typ 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. Table 7-32. Note: Min Differential mode, VVDDANA = 5V, VADCREF0 = 3V, ADCFIA.SEQCFGn.SRES = 2 (Fadc = 1.5MHz) Min Typ 0.3 LSB -10 10 mV -20 20 mV 8 Bit 0.3 LSB 0.25 LSB -25 25 mV -25 25 mV 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. 64 9166DS–AVR-01/12 AT32UC3C Table 7-34. ADC and S/H Transfer Characteristics 12-bit Resolution Mode and S/H gain = 1(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 0, S/H gain = 1 (Fadc = 1.2MHz) DNL Differential Non-Linearity Offset error Gain error RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Note: Differential mode, VVDDANA = 5V, VADCREF0 = 3V, ADCFIA.SEQCFGn.SRES = 0, S/H gain = 1 (Fadc = 1.5MHz) Typ Max Units 12 Bit 6 LSB 5 LSB -10 10 mV -30 30 mV 12 Bit 6 LSB 4 LSB -15 15 mV -30 30 mV Max Units 12 Bit 30 LSB 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. Table 7-35. ADC and S/H Transfer Characteristics 12-bit Resolution Mode and S/H gain from 1 to 8(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 0, S/H gain from 1 to 8 (Fadc = 1.2MHz) DNL Differential Non-Linearity Offset error Gain error RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Note: Min Differential mode, VVDDANA = 5V, VADCREF0 = 3V, ADCFIA.SEQCFGn.SRES = 0, S/H gain from 1 to 8 (Fadc = 1.5MHz) Min Typ 30 LSB -10 10 mV -25 25 mV 12 Bit 10 LSB 15 LSB -20 20 mV -30 30 mV Max Units 10 Bit 4 LSB 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain Table 7-36. ADC and S/H Transfer Characteristics 10-bit Resolution Mode and S/H gain from 1 to 16(1) Symbol Parameter Conditions RES Resolution INL Integral Non-Linearity Differential mode, VVDDANA = 3V, VADCREF0 = 1V, ADCFIA.SEQCFGn.SRES = 1, S/H gain from 1 to 16 (Fadc = 1.5MHz) DNL Differential Non-Linearity Offset error Gain error Min Typ 4 LSB -15 15 mV -25 25 mV 65 9166DS–AVR-01/12 AT32UC3C Table 7-36. ADC and S/H Transfer Characteristics (Continued)10-bit Resolution Mode and S/H gain from 1 to 16(1) Symbol Parameter Conditions Differential mode, VVDDANA = 5V, VADCREF0 = 3V, ADCFIA.SEQCFGn.SRES = 1, S/H gain from 1 to 16 (Fadc = 1.5MHz) RES Resolution INL Integral Non-Linearity DNL Differential Non-Linearity Offset error Gain error Note: Min Typ Max Units 10 Bit 2 LSB 2 LSB -30 30 mV -30 30 mV Max Units 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. 7.8.7 Digital to Analog Converter (DAC) Characteristics Table 7-37. Channel Conversion Time and DAC Clock Symbol Parameter Conditions Min Typ fDAC DAC clock frequency 1 MHz tSTARTUP Startup time 3 µs 1 µs 1.5 µs No S/H enabled, internal DAC tCONV Conversion time (latency) One S/H Two S/H Throughput rate Table 7-38. Parameter VDACREF DACREF input voltage range Symbol µs MSPS External Voltage Reference Input Symbol Table 7-39. 2 1/tCONV Conditions Min Typ 1.2 Max Units VVDDANA-0.7 V DAC Outputs Parameter Output range Conditions Min with external DAC reference 0.2 VDACREF with internal DAC reference 0.2 VVDDANA-0.7 100 CLOAD Output capacitance 0 RLOAD Output resitance 2 Typ Max Units V pF kΩ 66 9166DS–AVR-01/12 AT32UC3C Figure 7-4. DAC output UC3C DAC0A S/H CLOAD DAC RLOAD Transfer Characteristics(1) Table 7-40. Symbol Parameter RES Resolution INL Integral Non-Linearity DNL Differential Non-linearity Offset error Conditions Min VVDDANA = 3V, VDACREF = 2V, One S/H Typ Max Units 12 Bit 20 LSB 20 LSB 80 mV Gain error 100 mV RES Resolution 12 Bit INL Integral Non-Linearity 20 LSB DNL Differential Non-linearity Offset error VVDDANA = 5V, VDACREF = 3V, One S/H Gain error Note: 20 LSB 120 mV 100 mV 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. 67 9166DS–AVR-01/12 AT32UC3C 7.8.8 Analog Comparator Characteristics Analog Comparator Characteristics(1) Table 7-41. Symbol Parameter VOFFSET Conditions Max Units 0 VVDDANA V Negative input voltage range 0 VVDDANA V Hysteresis tDELAY Propagation delay tSTARTUP Start-up time Note: Typ Positive input voltage range Offset VHYST Min No hysteresis, Low Power mode -36 36 mV No hysteresis, High Speed mode -21 21 mV Low hysteresis, Low Power mode 7 49 Low hysteresis, High Speed mode 5 39 High hysteresis, Low Power mode 16 113 High hysteresis, High Speed mode 12 76 Low Power mode 3.3 High Speed mode 0.102 mV mV us 20 µs 1. The measures are done without any I/O activity on VDDANA/GNDANA power domain. Table 7-42. VDDANA scaled reference Symbol Parameter Min SCF ACIFA.SCFi.SCF range VVDDANA scaled Typ Max 0 32 (64 - SCF) * VVDDANA / 65 VVDDANA voltage accuracy 7.8.9 Units V 4.1 % USB Transceiver Characteristics 7.8.9.1 Electrical Characteristics Table 7-43. Electrical Parameters Symbol Parameter Conditions REXT Recommended external USB series resistor In series with each USB pin with ±5% Min. Typ. 39 Max. Unit Ω The USB on-chip buffers comply with the Universal Serial Bus (USB) v2.0 standard. All AC parameters related to these buffers can be found within the USB 2.0 electrical specifications. 68 9166DS–AVR-01/12 AT32UC3C 7.9 Timing Characteristics 7.9.1 Startup, Reset, and Wake-up Timing The startup, reset, and wake-up timings are calculated using the following formula: t = t CONST + N CPU × t CPU Where t CONST and N CPU are found in Table 7-44. t CONST is the delay relative to RCSYS, t CPU is the period of the CPU clock. If another clock source than RCSYS is selected as CPU clock the startup time of the oscillator, t OSCSTART , must be added to the wake-up time in the stop, deepstop, and static sleep modes. Please refer to the source for the CPU clock in the ”Oscillator Characteristics” on page 56 for more details about oscillator startup times. Table 7-44. Maximum Reset and Wake-up Timing Max t CONST (in µs) Max N CPU Parameter Measuring Startup time from power-up, using regulator VDDIN_5 rising (10 mV/ms) Time from VVDDIN_5=0 to the first instruction entering the decode stage of CPU. VDDCORE is supplied by the internal regulator. 2600 0 Startup time from reset release Time from releasing a reset source (except POR, BOD18, and BOD33) to the first instruction entering the decode stage of CPU. 1240 0 0 19 268 209 268 209 268+ t OSCSTART 212 Deepstop 268+ t OSCSTART 212 Static 268+ t OSCSTART 212 Idle Frozen Standby Wake-up Stop From wake-up event to the first instruction entering the decode stage of the CPU. 69 9166DS–AVR-01/12 AT32UC3C Figure 7-5. Startup and Reset Time Voltage VDDIN_5, VDDIN_33 BOD33 threshold at power-up VDDCORE BOD18 threshold at power-up Time Internal Reset 7.9.2 Reset Time Startup Time from reset Release Decoding Stage RESET_N characteristics Table 7-45. RESET_N Clock Waveform Parameters Symbol Parameter tRESET RESET_N minimum pulse length Condition Min. 2 * TRCSYS Typ. Max. Units clock cycles 70 9166DS–AVR-01/12 AT32UC3C 7.9.3 USART in SPI Mode Timing 7.9.3.1 Master mode Figure 7-6. USART in SPI Master Mode With (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI0 USPI1 MOSI USPI2 Figure 7-7. USART in SPI Master Mode With (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI3 USPI4 MOSI USPI5 Table 7-46. Symbol USART in SPI Mode Timing, Master Mode(1) Parameter USPI0 MISO setup time before SPCK rises USPI1 MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay Note: Conditions Min 27.5+ Max tSAMPLE(2) ns 0 external capacitor = 40pF Units ns 12 ns 27.5+ tSAMPLE(2) ns 0 ns 12.5 ns 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. t SPCK 1⎞ --- × t CLKUSART 2. Where: t SAMPLE = t SPCK – ⎛ -----------------------------------⎝ 2×t 2⎠ CLKUSART 71 9166DS–AVR-01/12 AT32UC3C Maximum SPI Frequency, Master Output The maximum SPI master output frequency is given by the following formula: 1 f CLKSPI × 2 f SPCKMAX = MIN (f PINMAX,------------, -----------------------------) SPIn 9 Where SPIn is the MOSI delay, USPI2 or USPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (------------------------------------,----------------------------) SPIn + t VALID 9 Where SPIn is the MISO setup and hold time, USPI0 + USPI1 or USPI3 + USPI4 depending on CPOL and NCPHA. T VALID is the SPI slave response time. Please refer to the SPI slave datasheet for T VALID . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. 7.9.3.2 Slave mode Figure 7-8. USART in SPI Slave Mode With (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI6 MOSI USPI7 USPI8 72 9166DS–AVR-01/12 AT32UC3C Figure 7-9. USART in SPI Slave Mode With (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI9 MOSI USPI10 USPI11 Figure 7-10. USART in SPI Slave Mode NPCS Timing USPI12 USPI13 USPI14 USPI15 SPCK, CPOL=0 SPCK, CPOL=1 NSS Table 7-47. USART in SPI mode Timing, Slave Mode(1) Symbol Parameter USPI6 SPCK falling to MISO delay USPI7 MOSI setup time before SPCK rises USPI8 MOSI hold time after SPCK rises USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 Conditions Min tSAMPLE(2) Max Units 28.5 ns + tCLK_USART ns 0 ns 30 external capacitor = 40pF ns tSAMPLE(2) + tCLK_USART ns 0 ns NSS setup time before SPCK rises 35 ns USPI13 NSS hold time after SPCK falls 0 ns USPI14 NSS setup time before SPCK falls 35 ns USPI15 NSS hold time after SPCK rises 0 ns Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. t SPCK +1 ---⎞ × t CLKUSART 2. Where: t SAMPLE = t SPCK – ⎛ -----------------------------------⎝ 2×t 2⎠ CLKUSART 73 9166DS–AVR-01/12 AT32UC3C Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (----------------------------,------------) 9 SPIn Where SPIn is the MOSI setup and hold time, USPI7 + USPI8 or USPI10 + USPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (-----------------------------, f PINMAX,------------------------------------) 9 SPIn + t SETUP Where SPIn is the MISO delay, USPI6 or USPI9 depending on CPOL and NCPHA. T SETUP is the SPI master setup time. Please refer to the SPI masterdatasheet for T SETUP . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 7.9.4 7.9.4.1 SPI Timing Master mode Figure 7-11. SPI Master Mode With (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI0 SPI1 MOSI SPI2 74 9166DS–AVR-01/12 AT32UC3C Figure 7-12. SPI Master Mode With (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI3 SPI4 MOSI SPI5 Table 7-48. SPI Timing, Master Mode(1) Symbol Parameter SPI0 MISO setup time before SPCK rises SPI1 MISO hold time after SPCK rises SPI2 SPCK rising to MOSI delay SPI3 MISO setup time before SPCK falls SPI4 MISO hold time after SPCK falls SPI5 SPCK falling to MOSI delay Note: Conditions external capacitor = 40pF Min Max Units 30.5+ (tCLK_SPI)/2 ns 0 ns 11.5 ns 30.5 + (tCLK_SPI)/2 ns 0 ns 11.5 ns 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Maximum SPI Frequency, Master Output The maximum SPI master output frequency is given by the following formula: 1 -) f SPCKMAX = MIN (f PINMAX,----------SPIn Where SPIn is the MOSI delay, SPI2 or SPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: 1 f SPCKMAX = ----------------------------------SPIn + t VALID Where SPIn is the MISO setup and hold time, SPI0 + SPI1 or SPI3 + SPI4 depending on CPOL and NCPHA. t VALID is the SPI slave response time. Please refer to the SPI slave datasheet for t VALID . 75 9166DS–AVR-01/12 AT32UC3C 7.9.4.2 Slave mode Figure 7-13. SPI Slave Mode With (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI6 MOSI SPI7 SPI8 Figure 7-14. SPI Slave Mode With (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI9 MOSI SPI10 Figure 7-15. SPI11 SPI Slave Mode NPCS Timing SPI12 SPI13 SPI14 SPI15 SPCK, CPOL=0 SPCK, CPOL=1 NPCS 76 9166DS–AVR-01/12 AT32UC3C Table 7-49. SPI Timing, Slave Mode(1) Symbol Parameter Conditions Min Max Units SPI6 SPCK falling to MISO delay 31 ns SPI7 MOSI setup time before SPCK rises 0 ns SPI8 MOSI hold time after SPCK rises 7 ns SPI9 SPCK rising to MISO delay SPI10 MOSI setup time before SPCK falls SPI11 MOSI hold time after SPCK falls SPI12 NPCS setup time before SPCK rises SPI13 32 external capacitor = 40pF ns 1.5 ns 5 ns 4 ns NPCS hold time after SPCK falls 2.5 ns SPI14 NPCS setup time before SPCK falls 3.5 ns SPI15 NPCS hold time after SPCK rises 2.5 ns Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: 1 f SPCKMAX = MIN (f CLKSPI,------------) SPIn Where SPIn is the MOSI setup and hold time, SPI7 + SPI8 or SPI10 + SPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: 1 f SPCKMAX = MIN (f PINMAX,-----------------------------------) SPIn + t SETUP Where SPIn is the MISO delay, SPI6 or SPI9 depending on CPOL and NCPHA. t SETUP is the SPI master setup time. Please refer to the SPI masterdatasheet for t SETUP . f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 7.9.5 TWIM/TWIS Timing Figure 7-50 shows the TWI-bus timing requirements and the compliance of the device with them. Some of these requirements (tr and tf) are met by the device without requiring user intervention. Compliance with the other requirements (tHD-STA, tSU-STA, tSU-STO, tHD-DAT, tSU-DAT-I2C, tLOWI2C, tHIGH, and fTWCK) requires user intervention through appropriate programming of the relevant 77 9166DS–AVR-01/12 AT32UC3C TWIM and TWIS user interface registers. Please refer to the TWIM and TWIS sections for more information. Table 7-50. TWI-Bus Timing Requirements Minimum Symbol Parameter Mode Requirement Standard(1) tr TWCK and TWD rise time tf TWCK and TWD fall time tHD-STA (Repeated) START hold time tSU-STA (Repeated) START set-up time tSU-STO STOP set-up time tHD-DAT Data hold time tLOW-I2C Standard(1) 4.0 Fast(1) 0.6 Standard(1) 4.7 Fast(1) 0.6 Standard(1) 4.0 Fast(1) 0.6 Fast(1) 250 Fast(1) 100 - tLOW 4.7 (1) 1.3 TWCK HIGH period fTWCK TWCK frequency 20 + 0.1 Cb 300 - 300 20 + 0.1 Cb 300 Standard 4.0 Fast(1) 0.6 Notes: Fast - μs tclkpb - μs 4tclkpb - μs 3.45 Standard(1) (1) Unit tclkpb 2tclkpb (1) tHIGH 1000 - Standard(1) Fast Device - 0.3(2) Standard(1) TWCK LOW period Requirement ns Fast(1) Standard(1) tSU-DAT Device ns Fast(1) Standard(1) tSU-DAT-I2C Data set-up time Maximum ?? μs 0.9 2tclkpb - ns tclkpb - - 4tclkpb - μs tclkpb - - 8tclkpb - μs 100 400 1 -----------------------12t clkpb kHz 1. Standard mode: f TWCK ≤ 100 kHz ; fast mode: f TWCK > 100 kHz . 2. A device must internally provide a hold time of at least 300 ns for TWD with reference to the falling edge of TWCK. Notations: Cb = total capacitance of one bus line in pF tclkpb = period of TWI peripheral bus clock tprescaled = period of TWI internal prescaled clock (see chapters on TWIM and TWIS) The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW-I2C) of TWCK. 78 9166DS–AVR-01/12 AT32UC3C 7.9.6 JTAG Timing Figure 7-16. JTAG Interface Signals JTAG2 TCK JTAG0 JTAG1 TMS/TDI JTAG3 JTAG4 JTAG7 JTAG8 TDO JTAG5 JTAG6 Boundary Scan Inputs Boundary Scan Outputs JTAG9 JTAG10 Table 7-51. JTAG Timings(1) Symbol Parameter JTAG0 TCK Low Half-period 23 ns JTAG1 TCK High Half-period 9 ns JTAG2 TCK Period 31 ns JTAG3 TDI, TMS Setup before TCK High 7 ns JTAG4 TDI, TMS Hold after TCK High 0 ns JTAG5 TDO Hold Time 13.5 ns JTAG6 TCK Low to TDO Valid JTAG7 Boundary Scan Inputs Setup Time 0 ns JTAG8 Boundary Scan Inputs Hold Time 4.5 ns JTAG9 Boundary Scan Outputs Hold Time 12 ns JTAG10 TCK to Boundary Scan Outputs Valid Note: Conditions external capacitor = 40pF Min Max 23 19 Units ns ns 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 79 9166DS–AVR-01/12 AT32UC3C 7.9.7 EBI Timings See EBI I/O lines description for more details. Table 7-52. SMC Clock Signal. Symbol Parameter 1/(tCPSMC) SMC Controller clock frequency Note: Max(1) Units fcpu MHz 1. The maximum frequency of the SMC interface is the same as the max frequency for the HSB. SMC Read Signals with Hold Settings(1) Table 7-53. Symbol Parameter Conditions Min Units NRD Controlled (READ_MODE = 1) SMC1 Data setup before NRD high SMC2 Data hold after NRD high SMC3 NRD high to NBS0/A0 change(2) SMC4 NRD high to NBS1 change 34.4 0 (2) (2) SMC5 NRD high to NBS2/A1 change SMC7 NRD high to A2 - A25 change(2) SMC8 NRD high to NCS inactive(2) SMC9 NRD pulse width VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF nrd hold length * tCPSMC - 1.5 nrd hold length * tCPSMC - 0 nrd hold length * tCPSMC - 0 ns nrd hold length * tCPSMC - 5.9 (nrd hold length - ncs rd hold length) * tCPSMC - 1.3 nrd pulse length * tCPSMC - 0.9 NRD Controlled (READ_MODE = 0) SMC10 Data setup before NCS high SMC11 Data hold after NCS high SMC12 NCS high to NBS0/A0 change(2) SMC13 NCS high to NBS0/A0 change(2) SMC14 (2) NCS high to NBS2/A1 change SMC16 NCS high to A2 - A25 change(2) SMC17 NCS high to NRD inactive(2) SMC18 NCS pulse width Note: 36.1 0 VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF ncs rd hold length * tCPSMC - 3.2 ncs rd hold length * tCPSMC - 2.2 ncs rd hold length * tCPSMC - 1.2 ns ncs rd hold length * tCPSMC - 7.6 (ncs rd hold length - nrd hold length) * tCPSMC - 2.4 ncs rd pulse length * tCPSMC - 3.3 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 2. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs rd hold length” or “nrd hold length”. 80 9166DS–AVR-01/12 AT32UC3C SMC Read Signals with no Hold Settings(1) Table 7-54. Symbol Parameter Conditions Min Units NRD Controlled (READ_MODE = 1) SMC19 Data setup before NRD high SMC20 Data hold after NRD high VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF 34.4 ns 0 NRD Controlled (READ_MODE = 0) SMC21 Data setup before NCS high SMC22 Data hold after NCS high Note: VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF 30.2 ns 0 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. SMC Write Signals with Hold Settings(1) Table 7-55. Symbol Parameter Conditions Min Units NRD Controlled (READ_MODE = 1) SMC23 Data Out valid before NWE high (nwe pulse length - 1) * tCPSMC - 1.7 SMC24 Data Out valid after NWE high(2) nwe pulse length * tCPSMC - 5.1 SMC25 NWE high to NBS0/A0 change(2) SMC29 (2) NWE high to NBS2/A1 change (2) SMC31 NWE high to A2 - A25 change SMC32 NWE high to NCS inactive(2) SMC33 NWE pulse width nwe pulse length * tCPSMC - 2.8 VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF nwe pulse length * tCPSMC - 0.8 ns nwe pulse length * tCPSMC - 7.2 (nwe hold pulse - ncs wr hold length) * tCPSMC - 2.6 nwe pulse length * tCPSMC - 0.4 NRD Controlled (READ_MODE = 0) SMC34 Data Out valid before NCS high SMC35 (2) SMC36 Note: Data Out valid after NCS high NCS high to NWE inactive (2) VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF (ncs wr pulse length - 1) * tCPSMC - 2.5 ncs wr hold length * tCPSMC - 5.5 ns (ncs wr hold length - nwe hold length) * tCPSMC - 2.2 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 2. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs wr hold length” or “nwe hold length” 81 9166DS–AVR-01/12 AT32UC3C SMC Write Signals with No Hold Settings (NWE Controlled only)(1) Table 7-56. Symbol Parameter SMC37 NWE rising to A2-A25 valid 9.1 SMC38 NWE rising to NBS0/A0 valid 7.9 SMC40 NWE rising to A1/NBS2 change SMC42 NWE rising to NCS rising SMC43 Data Out valid before NWE rising SMC44 Data Out valid after NWE rising SMC45 NWE pulse width Note: Conditions Min VVDD = 3.0V, drive strength of the pads set to the lowest, external capacitor = 40pF Units 9.1 8.7 ns (nwe pulse length - 1) * tCPSMC - 1.5 8.7 nwe pulse length * tCPSMC - 0.1 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Figure 7-17. SMC Signals for NCS Controlled Accesses SMC16 SMC16 SMC16 SMC12 SMC13 SMC14 SMC15 SMC12 SMC13 SMC14 SMC15 A2-A25 SMC12 SMC13 SMC14 SMC15 A0/A1/NBS[3:0] NRD SMC17 SMC17 NCS SMC18 SMC21 SMC18 SMC18 SMC22 SMC10 SMC11 SMC34 SMC35 D0 - D15 SMC36 NWE 82 9166DS–AVR-01/12 AT32UC3C Figure 7-18. SMC Signals for NRD and NRW Controlled Accesses(1) SMC37 SMC7 SMC7 SMC31 A2-A25 SMC25 SMC26 SMC29 SMC30 SMC3 SMC4 SMC5 SMC6 SMC38 SMC39 SMC40 SMC41 SMC3 SMC4 SMC5 SMC6 A0/A1/NBS[3:0] SMC42 SMC32 SMC8 NCS SMC8 SMC9 SMC9 NRD SMC19 SMC20 SMC43 SMC44 SMC1 SMC23 SMC2 SMC24 D0 - D15 SMC45 SMC33 NWE Note: 7.9.8 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. SDRAM Signals Table 7-57. SDRAM Clock Signal Symbol Parameter 1/(tCPSDCK) SDRAM Controller clock frequency Note: Max(1) Units fcpu MHz 1. The maximum frequency of the SDRAMC interface is the same as the max frequency for the HSB. 83 9166DS–AVR-01/12 AT32UC3C Table 7-58. SDRAM Signal(1) Symbol Parameter Conditions Min SDRAMC1 SDCKE high before SDCK rising edge 7.7 SDRAMC2 SDCKE low after SDCK rising edge 10 SDRAMC3 SDCKE low before SDCK rising edge 8.8 SDRAMC4 SDCKE high after SDCK rising edge 10.9 SDRAMC5 SDCS low before SDCK rising edge 8.1 SDRAMC6 SDCS high after SDCK rising edge 11 SDRAMC7 RAS low before SDCK rising edge 9.1 SDRAMC8 RAS high after SDCK rising edge 10.3 SDRAMC9 SDA10 change before SDCK rising edge 8.6 SDRAMC10 SDA10 change after SDCK rising edge 9.8 VVDD = 3.0V, drive strength of the pads set to the highest, external capacitor = 40pF on SDRAM pins except 8 pF on SDCK pins SDRAMC11 Address change before SDCK rising edge SDRAMC12 Address change after SDCK rising edge SDRAMC13 Bank change before SDCK rising edge SDRAMC14 Bank change after SDCK rising edge SDRAMC15 CAS low before SDCK rising edge 8.7 SDRAMC16 CAS high after SDCK rising edge 10.4 SDRAMC17 DQM change before SDCK rising edge 8.1 SDRAMC18 DQM change after SDCK rising edge 9.3 SDRAMC19 D0-D15 in setup before SDCK rising edge 7.0 SDRAMC20 D0-D15 in hold after SDCK rising edge SDRAMC23 SDWE low before SDCK rising edge 9.1 SDRAMC24 SDWE high after SDCK rising edge 10 SDRAMC25 D0-D15 Out valid before SDCK rising edge 7.3 SDRAMC26 D0-D15 Out valid after SDCK rising edge 5.7 Note: Units 6.7 6.8 ns 8.4 9.5 0 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 84 9166DS–AVR-01/12 AT32UC3C Figure 7-19. SDRAMC Signals relative to SDCK. SDCK SDRAMC1 SDRAMC2 SDRAMC3 SDRAMC4 SDCKE SDRAMC5 SDRAMC6 SDRAMC7 SDRAMC8 SDRAMC5 SDRAMC6 SDRAMC5 SDRAMC6 SDCS RAS SDRAMC15 SDRAMC16 SDRAMC15 SDRAMC16 CAS SDRAMC23 SDRAMC24 SDWE SDRAMC9 SDRAMC10 SDRAMC9 SDRAMC10 SDRAMC9 SDRAMC10 SDRAMC11 SDRAMC12 SDRAMC11 SDRAMC12 SDRAMC11 SDRAMC12 SDRAMC13 SDRAMC14 SDRAMC13 SDRAMC14 SDRAMC13 SDRAMC14 SDRAMC17 SDRAMC18 SDRAMC17 SDRAMC18 SDA10 A0 - A9, A11 - A13 BA0/BA1 DQM0 DQM3 SDRAMC19 SDRAMC20 D0 - D15 Read SDRAMC25 SDRAMC26 D0 - D15 to Write 85 9166DS–AVR-01/12 AT32UC3C 7.9.9 MACB Characteristics Table 7-59. Symbol Ethernet MAC Signals(1) Parameter MAC1 Setup for MDIO from MDC rising MAC2 Hold for MDIO from MDC rising MAC3 MDIO toggling from MDC falling Note: Conditions Min. Max. Unit VVDD = 3.0V, drive strength of the pads set to the highest, external capacitor = 10pF on MACB pins 0 2.6 ns 0 0.7 ns 0 1.1 ns 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Table 7-60. Symbol Ethernet MAC MII Specific Signals(1) Parameter Conditions Min. Max. Unit MAC4 Setup for COL from TX_CLK rising 0 ns MAC5 Hold for COL from TX_CLK rising 0 ns MAC6 Setup for CRS from TX_CLK rising 0.5 ns MAC7 Hold for CRS from TX_CLK rising 0.6 ns MAC8 TX_ER toggling from TX_CLK rising MAC9 TX_EN toggling from TX_CLK rising MAC10 TXD toggling from TX_CLK rising MAC11 Setup for RXD from RX_CLK MAC12 Hold for RXD from RX_CLK MAC13 VVDD = 3.0V, drive strength of the pads set to the highest, external capacitor = 10pF on MACB pins 17.3 19.6 ns 15.5 16.2 ns 14.9 19.2 ns 1.3 ns 2 ns Setup for RX_ER from RX_CLK 3.6 ns MAC14 Hold for RX_ER from RX_CLK 0 ns MAC15 Setup for RX_DV from RX_CLK 0.7 ns MAC16 Hold for RX_DV from RX_CLK 1.4 ns Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 86 9166DS–AVR-01/12 AT32UC3C Figure 7-20. Ethernet MAC MII Mode MDC MAC1 MAC2 MAC3 MDIO MAC4 MAC5 COL MAC6 MAC7 CRS TX_CLK MAC8 TX_ER MAC9 TX_EN MAC10 TXD[3:0] RX_CLK MAC11 MAC12 MAC13 MAC14 MAC15 MAC16 RXD[3:0] RX_ER RX_DV 87 9166DS–AVR-01/12 AT32UC3C Table 7-61. Symbol Ethernet MAC RMII Specific Signals(1) Parameter Conditions Min. Max. Unit MAC21 TX_EN toggling from TX_CLK rising 12.5 13.4 ns MAC22 TXD toggling from TX_CLK rising 12.5 13.4 ns MAC23 Setup for RXD from TX_CLK MAC24 Hold for RXD from TX_CLK MAC25 Setup for RX_ER from TX_CLK MAC26 Hold for RX_ER from TX_CLK MAC27 MAC28 Note: 4.7 ns 0 ns 3.6 ns 0 ns Setup for RX_DV from TX_CLK 4.6 ns Hold for RX_DV from TX_CLK 0 ns VVDD = 3.0V, drive strength of the pads set to the highest, external capacitor = 10pF on MACB pins 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Figure 7-21. Ethernet MAC RMII Mode TX_CLK MAC21 TX_EN MAC22 TXD[1:0] MAC23 MAC24 MAC25 MAC26 MAC27 MAC28 RXD[3:0] RX_ER RX_DV 88 9166DS–AVR-01/12 AT32UC3C 8. Mechanical Characteristics 8.1 8.1.1 Thermal Considerations Thermal Data Table 8-1 summarizes the thermal resistance data depending on the package. Table 8-1. 8.1.2 Thermal Resistance Data Symbol Parameter Condition Package Typ θJA Junction-to-ambient thermal resistance No air flow QFN64 20.0 θJC Junction-to-case thermal resistance QFN64 0.8 θJA Junction-to-ambient thermal resistance TQFP64 40.5 θJC Junction-to-case thermal resistance TQFP64 8.7 θJA Junction-to-ambient thermal resistance TQFP100 39.3 θJC Junction-to-case thermal resistance TQFP100 8.5 θJA Junction-to-ambient thermal resistance LQFP144 38.1 θJC Junction-to-case thermal resistance LQFP144 8.4 Unit °C/W No air flow °C/W No air flow °C/W No air flow °C/W Junction Temperature The average chip-junction temperature, TJ, in °C can be obtained from the following: 1. T J = T A + ( P D × θ JA ) 2. T J = T A + ( P D × ( θ HEATSINK + θ JC ) ) where: • θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1 on page 89. • θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 8-1 on page 89. • θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet. • PD = device power consumption (W) estimated from data provided in the section ”Power Consumption” on page 50. • TA = ambient temperature (°C). From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in °C. 89 9166DS–AVR-01/12 AT32UC3C 8.2 Package Drawings Figure 8-1. Note: QFN-64 package drawing The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Table 8-2. Device and Package Maximum Weight 200 Table 8-3. mg Package Characteristics Moisture Sensitivity Level Table 8-4. Jdec J-STD0-20D - MSL 3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 90 9166DS–AVR-01/12 AT32UC3C Figure 8-2. TQFP-64 package drawing Table 8-5. Device and Package Maximum Weight 300 Table 8-6. mg Package Characteristics Moisture Sensitivity Level Table 8-7. Jdec J-STD0-20D - MSL 3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 91 9166DS–AVR-01/12 AT32UC3C Figure 8-3. TQFP-100 package drawing Table 8-8. Device and Package Maximum Weight 500 Table 8-9. mg Package Characteristics Moisture Sensitivity Level Table 8-10. Jdec J-STD0-20D - MSL 3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 92 9166DS–AVR-01/12 AT32UC3C Figure 8-4. LQFP-144 package drawing Table 8-11. Device and Package Maximum Weight 1300 Table 8-12. mg Package Characteristics Moisture Sensitivity Level Table 8-13. Jdec J-STD0-20D - MSL 3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 93 9166DS–AVR-01/12 AT32UC3C 8.3 Soldering Profile Table 8-14 gives the recommended soldering profile from J-STD-20. Table 8-14. Soldering Profile Profile Feature Green Package Average Ramp-up Rate (217°C to Peak) 3°C/sec Preheat Temperature 175°C ±25°C Min. 150 °C, Max. 200 °C Temperature Maintained Above 217°C 60-150 sec Time within 5⋅C of Actual Peak Temperature 30 sec Peak Temperature Range 260 °C Ramp-down Rate 6 °C/sec Time 25⋅C to Peak Temperature Max. 8 minutes Note: It is recommended to apply a soldering temperature higher than 250°C. A maximum of three reflow passes is allowed per component. 94 9166DS–AVR-01/12 AT32UC3C 9. Ordering Information Table 9-1. Device AT32UC3C0512C AT32UC3C1512C AT32UC3C1256C AT32UC3C2512C AT32UC3C2512C AT32UC3C2256C AT32UC3C2256C AT32UC3C2128C AT32UC3C2128C Ordering Information Ordering Code Carrier Type AT32UC3C0512C-ALZT Tray AT32UC3C0512C-ALZR Tape & Reel AT32UC3C1512C-AZT Tray AT32UC3C1512C-AZR Tape & Reel AT32UC3C1256C-AZT Tray AT32UC3C1256C-AZR Tape & Reel AT32UC3C2512C-A2ZT Tray AT32UC3C2512C-A2ZR Tape & Reel AT32UC3C2512C-Z2ZT Tray AT32UC3C2512C-Z2ZR Tape & Reel AT32UC3C2256C-A2ZT Tray AT32UC3C2256C-A2ZR Tape & Reel AT32UC3C2256C-Z2ZT Tray AT32UC3C2256C-Z2ZR Tape & Reel AT32UC3C2128C-A2ZT Tray AT32UC3C2128C-A2ZR Tape & Reel AT32UC3C2128C-Z2ZT Tray AT32UC3C2128C-Z2ZR Tape & Reel Package Temperature Operating Range LQFP 144 TQFP 100 TQFP 100 TQFP 64 QFN 64 Automotive (-40°C to 125°C) TQFP 64 QFN 64 TQFP 64 QFN 64 95 9166DS–AVR-01/12 AT32UC3C 10. Errata 10.1 10.1.1 10.1.2 10.1.3 rev E ADCIFA 1 ADCREFP/ADCREFN can not be selected as an external ADC reference by setting the ADCIFA.CFG.EXREF bit to one Fix/Workaround A voltage reference can be applied on ADCREFP/ADCREFN pins if the ADCIFA.CFG.EXREF bit is set to zero, the ADCIFA.CFG.RS bit is set to zero and the voltage reference applied on ADCREFP/ADCREFN pins is higher than the internal 1V reference. 1 AST wake signal is released one AST clock cycle after the BUSY bit is cleared After writing to the Status Clear Register (SCR) the wake signal is released one AST clock cycle after the BUSY bit in the Status Register (SR.BUSY) is cleared. If entering sleep mode directly after the BUSY bit is cleared the part will wake up immediately. Fix/Workaround Read the Wake Enable Register (WER) and write this value back to the same register. Wait for BUSY to clear before entering sleep mode. 1 aWire MEMORY_SPEED_REQUEST command does not return correct CV The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to the formula in the aWire Debug Interface chapter. Fix/Workaround Issue a dummy read to address 0x100000000 before issuing the MEMORY_SPEED_REQUEST command and use this formula instead: AST aWire 7f aw f sab = ---------------CV – 3 10.1.4 Power Manager 1 TWIS may not wake the device from sleep mode If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed. Fix/Workaround When using the TWI address match to wake the device from sleep, do not switch to sleep modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus events. 96 9166DS–AVR-01/12 AT32UC3C 10.1.5 10.1.6 SCIF 1 PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 2 PLL lock might not clear after disable Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator may not go back to zero after the PLL oscillator has been disabled. This can cause the propagation of clock signals with the wrong frequency to parts of the system that use the PLL clock. Fix/Workaround PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL has been turned off, a delay of 30us must be observed after the PLL has been enabled again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is locked. 3 BOD33 reset locks the device If BOD33 is enabled as a reset source (SCIF.BOD33.CTRL=0x1) and when VDDIN_33 power supply voltage falls below the BOD33 voltage (SCIF.BOD33.LEVEL), the device is locked permanently under reset even if the power supply goes back above BOD33 reset level. In order to unlock the device, an external reset event should be applied on RESET_N. Fix/Workaround Use an external BOD on VDDIN_33 or an external reset source. 1 SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 2 Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 3 SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). SPI 97 9166DS–AVR-01/12 AT32UC3C 10.1.7 10.1.8 4 SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 1 Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 1 SMBALERT bit may be set after reset For TWIM0 and TWIM1 modules, the SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after system reset. Fix/Workaround After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer. TC TWIM For TWIM2 module, the SMBus Alert (SMBALERT) is not implemented but the bit in the Status Register (SR) is erroneously set once TWIM2 is enabled. Fix/Workaround None. 10.1.9 10.1.10 TWIS 1 Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 1 UPINRQx.INRQ field is limited to 8-bits In Host mode, when using the UPINRQx.INRQ feature together with the multi-packet mode to launch a finite number of packet among multi-packet, the multi-packet size (located in the descriptor table) is limited to the UPINRQx.INRQ value multiply by the pipe size. Fix/Workaround UPINRQx.INRQ value shall be less than the number of configured multi-packet. 2 In USB host mode, downstream resume feature does not work (UHCON.RESUME=1). USBC 98 9166DS–AVR-01/12 AT32UC3C Fix/Workaround None. 10.1.11 3 In host mode, the disconnection during OUT transition is not supported In USB host mode, a pipe can not work if the previous USB device disconnection has occurred during a USB transfer. Fix/Workaround Reset the USBC (USBCON.USB=0 and =1) after a device disconnection (UHINT.DDISCI). 4 In USB host mode, entering suspend mode can fail In USB host mode, entering suspend mode can fail when UHCON.SOFE=0 is done just after a SOF reception (UHINT.HSOFI). Fix/Workaround Check that UHNUM.FLENHIGH is below 185 in Full speed and below 21 in Low speed before clearing UHCON.SOFE. 5 In USB host mode, entering suspend mode for low speed device can fail when the USB freeze (USBCON.FRZCLK=1) is done just after UHCON.SOFE=0. Fix/Workaround When entering suspend mode (UHCON.SOFE is cleared), check that USBFSM.DRDSTATE is not equal to three before freezing the clock (USBCON.FRZCLK=1). 1 WDT Control Register does not have synchronization feedback When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN), Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization takes a finite amount of time, but only the status of the synchronization of the EN bit is reflected back to the user. Writing to the synchronized fields during synchronization can lead to undefined behavior. Fix/Workaround -When writing to the affected fields, the user must ensure a wait corresponding to 2 clock cycles of both the WDT peripheral bus clock and the selected WDT clock source. -When doing writes that changes the EN bit, the EN bit can be read back until it reflects the written value. WDT 99 9166DS–AVR-01/12 AT32UC3C 10.2 10.2.1 10.2.2 10.2.3 rev D ADCIFA 1 ADCREFP/ADCREFN can not be selected as an external ADC reference by setting the ADCIFA.CFG.EXREF bit to one Fix/Workaround A voltage reference can be applied on ADCREFP/ADCREFN pins if the ADCIFA.CFG.EXREF bit is set to zero, the ADCIFA.CFG.RS bit is set to zero and the voltage reference applied on ADCREFP/ADCREFN pins is higher than the internal 1V reference. 1 AST wake signal is released one AST clock cycle after the BUSY bit is cleared After writing to the Status Clear Register (SCR) the wake signal is released one AST clock cycle after the BUSY bit in the Status Register (SR.BUSY) is cleared. If entering sleep mode directly after the BUSY bit is cleared the part will wake up immediately. Fix/Workaround Read the Wake Enable Register (WER) and write this value back to the same register. Wait for BUSY to clear before entering sleep mode. 1 aWire MEMORY_SPEED_REQUEST command does not return correct CV The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to the formula in the aWire Debug Interface chapter. Fix/Workaround Issue a dummy read to address 0x100000000 before issuing the MEMORY_SPEED_REQUEST command and use this formula instead: AST aWire 7f aw f sab = ---------------CV – 3 10.2.4 GPIO 1 10.2.5 Clearing Interrupt flags can mask other interrupts When clearing interrupt flags in a GPIO port, interrupts on other pins of that port, happening in the same clock cycle will not be registered. Fix/Workaround Read the PVR register of the port before and after clearing the interrupt to see if any pin change has happened while clearing the interrupt. If any change occurred in the PVR between the reads, they must be treated as an interrupt. Power Manager 1 Clock Failure Detector (CFD) can be issued while turning off the CFD While turning off the CFD, the CFD bit in the Status Register (SR) can be set. This will change the main clock source to RCSYS. Fix/Workaround Solution 1: Enable CFD interrupt. If CFD interrupt is issues after turning off the CFD, switch back to original main clock source. Solution 2: Only turn off the CFD while running the main clock on RCSYS. 100 9166DS–AVR-01/12 AT32UC3C 10.2.6 10.2.7 2 Requesting clocks in idle sleep modes will mask all other PB clocks than the requested In idle or frozen sleep mode, all the PB clocks will be frozen if the TWIS or the AST need to wake the cpu up. Fix/Workaround Disable the TWIS or the AST before entering idle or frozen sleep mode. 3 TWIS may not wake the device from sleep mode If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed. Fix/Workaround When using the TWI address match to wake the device from sleep, do not switch to sleep modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus events. 1 PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 2 PLL lock might not clear after disable Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator may not go back to zero after the PLL oscillator has been disabled. This can cause the propagation of clock signals with the wrong frequency to parts of the system that use the PLL clock. Fix/Workaround PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL has been turned off, a delay of 30us must be observed after the PLL has been enabled again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is locked. 3 BOD33 reset locks the device If BOD33 is enabled as a reset source (SCIF.BOD33.CTRL=0x1) and when VDDIN_33 power supply voltage falls below the BOD33 voltage (SCIF.BOD33.LEVEL), the device is locked permanently under reset even if the power supply goes back above BOD33 reset level. In order to unlock the device, an external reset event should be applied on RESET_N. Fix/Workaround Use an external BOD on VDDIN_33 or an external reset source. 1 SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. SCIF SPI 101 9166DS–AVR-01/12 AT32UC3C 10.2.8 10.2.9 2 Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 3 SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 4 SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 1 Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 1 SMBALERT bit may be set after reset For TWIM0 and TWIM1 modules, the SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after system reset. Fix/Workaround After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer. TC TWIM For TWIM2 module, the SMBus Alert (SMBALERT) is not implemented but the bit in the Status Register (SR) is erroneously set once TWIM2 is enabled. Fix/Workaround None. 2 TWIM TWALM polarity is wrong The TWALM signal in the TWIM is active high instead of active low. Fix/Workaround Use an external inverter to invert the signal going into the TWIM. When using both TWIM and TWIS on the same pins, the TWALM cannot be used. 102 9166DS–AVR-01/12 AT32UC3C 10.2.10 10.2.11 TWIS 1 Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 2 TWIS stretch on Address match error When the TWIS stretches TWCK due to a slave address match, it also holds TWD low for the same duration if it is to be receiving data. When TWIS releases TWCK, it releases TWD at the same time. This can cause a TWI timing violation. Fix/Workaround None. 3 TWALM forced to GND The TWALM pin is forced to GND when the alternate function is selected and the TWIS module is enabled. Fix/Workaround None. 1 UPINRQx.INRQ field is limited to 8-bits In Host mode, when using the UPINRQx.INRQ feature together with the multi-packet mode to launch a finite number of packet among multi-packet, the multi-packet size (located in the descriptor table) is limited to the UPINRQx.INRQ value multiply by the pipe size. Fix/Workaround UPINRQx.INRQ value shall be less than the number of configured multi-packet. 2 In USB host mode, downstream resume feature does not work (UHCON.RESUME=1). Fix/Workaround None. 3 In host mode, the disconnection during OUT transition is not supported In USB host mode, a pipe can not work if the previous USB device disconnection has occurred during a USB transfer. Fix/Workaround Reset the USBC (USBCON.USB=0 and =1) after a device disconnection (UHINT.DDISCI). 4 In USB host mode, entering suspend mode can fail In USB host mode, entering suspend mode can fail when UHCON.SOFE=0 is done just after a SOF reception (UHINT.HSOFI). Fix/Workaround Check that UHNUM.FLENHIGH is below 185 in Full speed and below 21 in Low speed before clearing UHCON.SOFE. 5 In USB host mode, entering suspend mode for low speed device can fail when the USB freeze (USBCON.FRZCLK=1) is done just after UHCON.SOFE=0. Fix/Workaround When entering suspend mode (UHCON.SOFE is cleared), check that USBFSM.DRDSTATE is not equal to three before freezing the clock (USBCON.FRZCLK=1). USBC 103 9166DS–AVR-01/12 AT32UC3C 10.2.12 WDT 1 Clearing the Watchdog Timer (WDT) counter in second half of timeout period will issue a Watchdog reset If the WDT counter is cleared in the second half of the timeout period, the WDT will immediately issue a Watchdog reset. Fix/Workaround Use twice as long timeout period as needed and clear the WDT counter within the first half of the timeout period. If the WDT counter is cleared after the first half of the timeout period, you will get a Watchdog reset immediately. If the WDT counter is not cleared at all, the time before the reset will be twice as long as needed. 2 WDT Control Register does not have synchronization feedback When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN), Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization takes a finite amount of time, but only the status of the synchronization of the EN bit is reflected back to the user. Writing to the synchronized fields during synchronization can lead to undefined behavior. Fix/Workaround -When writing to the affected fields, the user must ensure a wait corresponding to 2 clock cycles of both the WDT peripheral bus clock and the selected WDT clock source. -When doing writes that changes the EN bit, the EN bit can be read back until it reflects the written value. 104 9166DS–AVR-01/12 AT32UC3C 11. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 11.1 11.2 11.3 Rev. D – 01/12 1 Errata: Updated 2 PM: Clock Mask Table Updated 3 Fixed PLLOPT field description in SCIF chapter 4 MDMA: Swapped bit descriptions for IER and IDR 5 MACB: USRIO register description and bit descriptions for IMR/IDR/IER Updated 6 USBC: UPCON.PFREEZE and UPINRQn description Updated 7 ACIFA: Updated 8 ADCIFA: CFG.MUXSET, SSMQ description and conversion results section Updated 9 DACIFB: Calibration section Updated 10 Electrical Characteristics: ADCREFP/ADCREFN added 11 Add devices: C1256C, C2256C, C2128C 1 Electrical Characteristics Updated: - I/O Pins characteristics - 8MHz/1MHz RC Oscillator (RC8M) characteristics - 1.8V Voltage Regulator characteristics - 3.3V Voltage Regulator characteristics - 1.8VBrown Out Detector (BOD18) characteristics - 3.3VBrown Out Detector (BOD33) characteristics - 5VBrown Out Detector (BOD50) characteristics - Analog to Digital Converter (ADC) and sample and hold (S/DH) Characteristics - Analog Comparator characteristics 2 Errata: Updated 3 TWIS: Updated 1 Package and pinout: Added supply column. Updated peripheral functions 2 Supply and Startup Considerations: Updated I/O lines power 3 PM: Added AWEN description Rev. C – 08/11 Rev. B – 02/11 105 9166DS–AVR-01/12 AT32UC3C 11.4 4 SCIF: Added VREGCR register 5 AST: Updated digital tuner formula 6 SDRAMC: cleaned-up SDCS/NCS names. Added VERSION register 7 SAU: Updated SR.IDLE 8 USART: Updated 9 CANIF: Updated address map figure 10 USBC: Updated 11 DACIFB: Updated 12 Programming and Debugging: Added JTAG Data Registers section 13 Electrical Characteristics: Updated 14 Ordering Information: Updated 15 Errata: Updated 1 Initial revision Rev. A – 10/10 106 9166DS–AVR-01/12 AT32UC3C Table of Contents 1 2 3 4 5 6 7 Description ............................................................................................... 3 1.1 Disclaimer ..........................................................................................................4 1.2 Automotive Quality Grade .................................................................................4 Overview ................................................................................................... 5 2.1 Block diagram ....................................................................................................5 2.2 Configuration Summary .....................................................................................6 Package and Pinout ................................................................................. 8 3.1 Package .............................................................................................................8 3.2 Peripheral Multiplexing on I/O lines .................................................................11 3.3 Signals Description ..........................................................................................18 3.4 I/O Line Considerations ...................................................................................24 Processor and Architecture .................................................................. 25 4.1 Features ..........................................................................................................25 4.2 AVR32 Architecture .........................................................................................25 4.3 The AVR32UC CPU ........................................................................................26 4.4 Programming Model ........................................................................................30 4.5 Exceptions and Interrupts ................................................................................34 Memories ................................................................................................ 39 5.1 Embedded Memories ......................................................................................39 5.2 Physical Memory Map .....................................................................................40 5.3 Peripheral Address Map ..................................................................................40 5.4 CPU Local Bus Mapping .................................................................................43 Supply and Startup Considerations ..................................................... 45 6.1 Supply Considerations .....................................................................................45 6.2 Startup Considerations ....................................................................................48 Electrical Characteristics ...................................................................... 49 7.1 Absolute Maximum Ratings* ...........................................................................49 7.2 Supply Characteristics .....................................................................................49 7.3 Maximum Clock Frequencies ..........................................................................50 7.4 Power Consumption ........................................................................................50 7.5 I/O Pin Characteristics .....................................................................................54 7.6 Oscillator Characteristics .................................................................................56 107 9166DS–AVR-01/12 AT32UC3C 8 9 7.7 Flash Characteristics .......................................................................................59 7.8 Analog Characteristics .....................................................................................60 7.9 Timing Characteristics .....................................................................................69 Mechanical Characteristics ................................................................... 89 8.1 Thermal Considerations ..................................................................................89 8.2 Package Drawings ...........................................................................................90 8.3 Soldering Profile ..............................................................................................94 Ordering Information ............................................................................. 95 10 Errata ....................................................................................................... 96 10.1 rev E ................................................................................................................96 10.2 rev D ..............................................................................................................100 11 Datasheet Revision History ................................................................ 105 11.1 Rev. D – 01/12 ...............................................................................................105 11.2 Rev. C – 08/11 ...............................................................................................105 11.3 Rev. B – 02/11 ...............................................................................................105 11.4 Rev. A – 10/10 ...............................................................................................106 108 9166DS–AVR-01/12 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature 107486 Disclaimer: The information in this document is provided in connection with Atmel products. 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