QFN40 7*7*0.9 0.5 P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN40 7*7*0.9 0.5 P
CASE 488AG−01
ISSUE O
DATE 26 APR 2004
1
40
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
SCALE 2:1
A
B
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
D
PIN ONE
LOCATION
0.15 C
2X
2X
DIM
A
A1
A3
b
D
D2
E
E2
e
L
k
E
TOP VIEW
0.15 C
GENERIC
MARKING DIAGRAM*
(A3)
0.10 C
A
40 X
0.08 C
SIDE VIEW
1
A1
SEATING PLANE
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
C
EXPOSED PAD
D2
L
40 X
11
k
20
40 X
21
10
E2
1
30
40
40 X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
7.00 BSC
5.50
5.70
7.00 BSC
5.50
5.70
0.50 BSC
0.30
0.50
0.20
−−−
31
b
0.10 C A B
e
XXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
0.05 C
BOTTOM VIEW
DOCUMENT NUMBER:
98AON15253D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
 Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN40, 7*7*0.9 0.5 P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON15253D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. E. MULANAPHY
DATE
26 APR 04
ON Semiconductor and
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 Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 01O
Case Outline Number:
488AG