LVDS & LVPECL FPGA Terminator Technical Data Sheet RoHS Compliant Parts Available Description Features These LVPECL and LVDS termination networks are designed for high performance termination of differential Input/Output signals on some of the most popular Field Programmable Gate Arrays (FPGAs). • • Both input (RX) and output (TX) termination is provided. • • • Style C Designed for termination of Xilinx® and Altera® FPGAs. 8 or 16 differential channels of termination provided in a single integrated package Excellent high frequency performance High density ceramic BGA package RoHS Compliant Designs Available • Compatible with both lead and lead-free manufacturing processes Style I 4 4 R1 R1 R1 R1 R2 R1 R1 R1 R1 R2 R1 R1 R1 R2 R2 R1 R2 R1 R1 R1 R1 R2 R1 R1 R1 R2 R2 R1 R1 R1 R1 R1 3 3 2 2 R1 R1 R1 R2 R1 R1 R1 R1 R1 R2 R1 R2 R1 R1 R1 R1 R2 R1 R1 R2 R1 R2 R1 R2 R1 R1 R1 R1 R2 R1 R1 R1 1 1 A B C D E F G A H B C ± 1.0% ±200ppm/°C -55°C to +125°C 0.068 Watts at 70°C 1.0 Watts at 70°C Resistor Tolerance: TCR Operating Temperature Range Maximum Resistor Power: Maximum Package Power: Process Requirements: Maximum Re-flow Temperature F G H J K L Tx Termination M N P R T Rx Termination R1 Tx R2 Z = 50 ohms R1 Rx R1 Per IPC/JEDEC J-STD-020C Ordering Information 1.00mm Pitch Standard Part No. RT1710B7 RT1720B7 RT1721B7 RT1722B7 RT1723B7 RT1724B7 RT1725B7 RT1726B7 RT1727B7 RT1728B7 RT1729B7 E Typical Application Electrical Specifications 1.27mm Pitch Standard Part No. RT1710B6 RT1721B6 RT1723B6 RT1725B6 RT1727B6 RT1729B6 D Style R1 Ω R2 Ω Array Size C I I I I I I I I I I 100 187 187 140 140 140 140 70 70 70 70 100 100 165 165 135 135 187 187 240 240 4x8 4 x 16 4x8 4 x 16 4x8 4 x 16 4x8 4 x 16 4x8 4 x 16 4x8 1.27mm Pitch 1.00mm Pitch RoHS Part No. RoHS Part No. RT2710B6 RT2721B6 RT2723B6 RT2725B6 RT2727B6 RT2729B6 RT2710B7 RT2720B7 RT2721B7 RT2722B7 RT2723B7 RT2724B7 RT2725B7 RT2726B7 RT2727B7 RT2728B7 RT2729B7 Part Number Coding 7 inch reel, Add TR7 to part number, example RT2400B6TR7 13 inch reel, Add TR13 to part number, example RT2400B6TR13 (Bulk packaging is not available) Direction of Feed Packaging Information Suffix Tape Width Carrier Pitch Reel Diameter Parts/Reel TR7 TR13 24 mm 8 mm 7 inch 1,000 24mm 8 mm 13 inch 4,000 CTS Electronic Components www.ctscorp.com © 2006 CTS Corporation. All rights reserved. Information subject to change. Page 1 LVDS & LVPECL FPGA Terminator October 07 Recommended Land Pattern Outline of Substrate Solder Mask Dia = Pad Diameter +.15mm (.006 inch) PCB Pad Diameter 1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum) For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Mechanical Diagram L W H RT_7__B_ CTS YRWK P (Pitch) A1 Identifier K 1.27mm Pitch RT1710B6 RT2710B6 RT1721B6 RT2721B6 RT1723B6 RT2723B6 RT1725B6 RT2725B6 RT1727B6 RT2727B6 RT1729B6 RT2729B6 1.0mm Pitch RT1710B7 RT2710B7 RT1721B7 RT2721B7 RT1723B7 RT2723B7 RT1725B7 RT2725B7 RT1727B7 RT1727B7 RT1729B7 RT1729B7 RT1720B7 RT2720B7 RT1722B7 RT2722B7 RT1724B7 RT2724B7 RT1726B7 RT2726B7 RT1728B7 RT2728B7 P (Pitch) D L W H P D K mm 10.16±0.15 5.08±0.15 1.32±0.15 1.27±0.25 0.76±0.05 0.64±0.25 inch .400±.006 .200±.006 .052±.006 .050±.010 .030±.002 .025±.010 L W H P D K mm 8.00±0.15 4.00±0.15 1.19±0.15 1.00±0.25 0.64±0.05 0.50±0.25 inch .315±.006 .157±.006 .047±.006 .039±.010 .025±.002 .020±.010 mm 16.00±0.15 4.00±0.15 1.19±0.15 1.00±0.25 0.64±0.05 0.50±0.25 inch .630±.006 .157±.006 .047±.006 .039±.010 .025±.002 .020±.010 Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp FPGA Application notes: http://www.ctscorp.com/components/Datasheets/ClearOneANC1FPGALVPECLA.pdf http://www.ctscorp.com/components/Datasheets/ClearOneANC1FPGALVDSA.pdf CTS Electronic Components www.ctscorp.com © 2006 CTS Corporation. All rights reserved. Information subject to change. Page 2 LVDS & LVPECL FPGA Terminator October 07