MMA8210KEGR2.pdf

Freescale Semiconductor Inc
PART INFORMATION
Mfg Item Number
Mfg Item Name
MMA8210KEGR2
SENSOR 16SOICW ACCEL
SUPPLIER
Company Name
Company Unique ID
Response Date
Response Document ID
Contact Name
Contact Title
Contact Phone
Contact Email
Authorized Representative
Representative Title
Representative Phone
Representative Email
URL for Additional Information
Freescale Semiconductor Inc
14-141-7928
2016-06-10
0226K11282D005A1.14
Freescale Semiconductor Inc
Product Technical Support
1-800-521-6274
[email protected]
Daniel Binyon
EPP Customer Response
512-895-3406
[email protected]
www.freescale.com
DECLARATION
EU RoHS
Pb Free
HalogenFree
Plating Indicator
EU RoHS Exemption(s)
Yes
No
No
e3
7c-I
MANUFACTURING
Mfg Item Number
Mfg Item Name
Version
Weight
UoM
Unit Volume
J-STD-020 MSL Rating
Peak Processing Temperature
Max Time at Peak Temperature
Number of Processing Cycles
MMA8210KEGR2
SENSOR 16SOICW ACCEL
ALL
0.609200
g
EACH
3
250 C
30 seconds
3
RoHS
RoHS Directive
RoHS Definition
RoHS Legal Definition
RoHS Declaration
Supplier Acceptance
Signature
Exemption List Version
Exemptions in this part
List of Freescale Accepted
Exemptions
2011/65/EU
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium
Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states)
of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS
restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess
of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the
declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy
and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company
will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company
acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such
information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have
provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company
and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or
remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding
information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of
Sale applicable to such part(s) shall apply.
4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions
Accepted
Daniel Binyon
2012/51/EU
7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound
6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6(c) : Copper alloy containing up to 4% lead by weight
7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for
telecommunications
7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound
7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
MATERIAL COMPOSITION
Homogeneous Material
Weight
SubstanceClass
Substance
CAS
Die Overcoat
0.0055
Die Overcoat
Solvents, additives, and other materials
Other organic Silicon Compounds
-
0.00051715
g
Die Overcoat
Plastics/polymers
Plastic: SI - Silicone Rubber
-
0.00359104
g
Die Overcoat
Glass
Silica, vitreous
60676-86-0
0.00139181
g
Bonding Wire
UoM SubPart
PPM
SubPart%
ARTICLEPPM
ARTICLE%
94028
9.4028
848
0.0848
652916
65.2916
5894
0.5894
253056
25.3056
2284
0.2284
1000000
100
2790
0.279
1000000
100
2790
0.279
g
g
Metals
Gold, metal
7440-57-5
0.0017
0.0017
Bonding Wire
Lead Frame Plating
SubstanceWeight
0.0017
Bonding Wire
Bonding Wire
Exemption
g
g
Metals
Gold, metal
7440-57-5
0.0017
0.0077
g
g
Lead Frame Plating
Lead/Lead Compounds
Lead
7439-92-1
0.00000154
g
200
0.02
2
0.0002
Lead Frame Plating
Metals
Tin, metal
7440-31-5
0.00769846
g
999800
99.98
12636
1.2636
Die Encapsulant
0.4113
g
Die Encapsulant
Antimony/Antimony Compounds
Antimony trioxide
1309-64-4
0.00913991
g
22222
2.2222
15003
1.5003
Die Encapsulant
Flame Retardants
Bromophenol, formaldehyde, epichlorohydrin polymer
68541-56-0
0.00913991
g
22222
2.2222
15003
1.5003
Die Encapsulant
Solvents, additives, and other materials
Carbon Black
1333-86-4
0.00456995
g
11111
1.1111
7501
0.7501
Die Encapsulant
Plastics/polymers
Phenol, polymer with formaldehyde
9003-35-4
0.02285018
g
55556
5.5556
37508
3.7508
Die Encapsulant
Glass
Silica, vitreous
60676-86-0
0.36560005
g
888889
88.8889
600153
60.0153
Epoxy Die Attach
0.0013
g
Epoxy Die Attach
Plastics/polymers
Phenolic Polymer Resin, Epikote 155
9003-36-5
0.00020968
g
161290
16.129
344
0.0344
Epoxy Die Attach
Solvents, additives, and other materials
1-cyanoguanidine
461-58-5
0.00001398
g
10753
1.0753
22
0.0022
Epoxy Die Attach
Plastics/polymers
Other phenolic resins
-
0.00002796
g
21505
2.1505
45
0.0045
Epoxy Die Attach
Metals
Silver, metal
7440-22-4
0.00104838
g
806452
80.6452
1720
0.172
Copper Lead Frame
0.1579
g
Copper Lead Frame
Metals
Copper, metal
7440-50-8
0.15220849
g
963955
96.3955
249849
24.9849
Copper Lead Frame
Solvents, additives, and other materials
Phosphorus, elemental (not containing red allotrope)
7723-14-0
0.00013027
g
825
0.0825
213
0.0213
Copper Lead Frame
Metals
Iron, metal
7439-89-6
0.00371065
g
23500
2.35
6091
0.6091
Copper Lead Frame
Lead/Lead Compounds
Lead
7439-92-1
0.00002684
g
170
0.017
44
0.0044
Copper Lead Frame
Metals
Silver, metal
7440-22-4
0.001579
g
10000
1
2591
0.2591
Copper Lead Frame
Metals
Tin, metal
7440-31-5
0.00004737
g
300
0.03
77
0.0077
Copper Lead Frame
Metals
Zinc, metal
7440-66-6
0.00019738
g
1250
0.125
323
0.0323
Non-Conductive Epoxy/Adhesive
0.0048
g
Non-Conductive Epoxy/Adhesive
Solvents, additives, and other materials
Siloxanes and Silicones, di-Me, Me vinyl, vinyl groupterminated
68083-18-1
0.000648
g
135000
13.5
1063
0.1063
Non-Conductive Epoxy/Adhesive
Solvents, additives, and other materials
Siloxanes and silicones, di-Me, vinyl group-terminated
68083-19-2
0.002256
g
470000
47
3703
0.3703
Non-Conductive Epoxy/Adhesive
Solvents, additives, and other materials
Other organic Silicon Compounds
-
0.000096
g
20000
2
157
0.0157
Non-Conductive Epoxy/Adhesive
Glass
D4 and HMDZ treated Silicon Dioxide
68937-51-9
0.00108
g
225000
22.5
1772
0.1772
Non-Conductive Epoxy/Adhesive
Glass
Silica, crystalline - quartz (SiO2)
14808-60-7
0.000528
g
110000
11
866
0.0866
Non-Conductive Epoxy/Adhesive
Solvents, additives, and other materials
Other miscellaneous substances (less than 5%).
-
0.00008645
g
18010
1.801
141
0.0141
Non-Conductive Epoxy/Adhesive
Solvents, additives, and other materials
Dimethyl,methyl hydrogen siloxane
68037-59-2
0.00010555
g
21990
2.199
173
0.0173
Pb Glass Frit Semiconductor Di
0.0088
7c-I
g
Pb Glass Frit Semiconductor Di
Lead/Lead Compounds
Lead (II) titanate
12060-00-3
0.00009135
g
10381
1.0381
149
0.0149
Pb Glass Frit Semiconductor Di
Glass
Fibrous-glass-wool
65997-17-3
0.0000875
g
9943
0.9943
143
0.0143
Pb Glass Frit Semiconductor Di
Solvents, additives, and other materials
2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate
25265-77-4
0.0000875
g
9943
0.9943
143
0.0143
Pb Glass Frit Semiconductor Di
Glass
Silicon, doped
-
0.00853365
g
969733
96.9733
14007
1.4007
Silicon Semiconductor Die
0.0085
g
Silicon Semiconductor Die
Solvents, additives, and other materials
Other miscellaneous substances (less than 5%).
-
0.00017
g
20000
2
279
0.0279
Silicon Semiconductor Die
Glass
Silicon, doped
-
0.00833
g
980000
98
13673
1.3673
LINKS
MCD LINK
NXP website
GENERAL ENVIRONMENTAL
COMPLIANCE LINKS
RoHS signed letter
China RoHS
REACH signed letter
ELV signed letter
Conflict Minerals statement
NXP ENVIRONMENTAL
INFORMATION
Environmental Compliance
website
FAQ
Technical Service Request
LINKS TO BLANK IPC1752
FORMS
Blank IPC1752 v1.1 Form
http://www.nxp.com
http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY
http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ
http://www.nxp.com/support/sales-and-support:SUPPORTHOME
http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf
IPC1752 XML LINKS
http://www.freescale.com/mcds/MMA8210KEGR2_IPC1752_v11.xml
http://www.freescale.com/mcds/MMA8210KEGR2_IPC1752A.xml